CN117795417A

CN117795417A - Laser projection device

Info

Publication number: CN117795417A
Application number: CN202280052555.3A
Authority: CN
Inventors: 张勇; 田有良
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2021-08-31
Filing date: 2022-08-12
Publication date: 2024-03-29
Also published as: WO2023029945A1

Abstract

A laser projection device (1000) relates to the technical field of display. The laser projection device (1000) includes: a light source component (1), an optical machine (20) and a lens (30). In the light source assembly (1), the packaging shell (12) is connected with the heat conducting substrate (11) and comprises a light outlet (121). The light outlet (121) is positioned at one side of the packaging shell (12) far away from the heat conducting substrate (11). The first light emitting chip (14) is located within the package housing (12) and connected with the thermally conductive substrate (11) and configured to emit a first laser beam. The fluorescent part (15) is positioned in the packaging shell (12) and is connected with the heat conducting substrate (11). The fluorescent part (15) is positioned on the light emitting side of the first light emitting chip (14) and is configured to emit a fluorescent light beam to the light emitting opening (121) under the excitation action of at least part of light rays in the first laser light beam. An optical path guiding assembly (13) is located within the package housing (12) and is configured to guide the first laser beam to the fluorescent portion (15). At least part of the light rays in the fluorescent light beam are emitted from the light outlet (121) along a direction away from the heat conducting substrate (11) so as to form at least part of the light rays in the illumination light beam.

Description

Laser projection device

The present application claims priority of chinese patent application No. 202111016358.X filed at 31 at 2021, priority of chinese patent application No. 202111013838.0 filed at 31 at 2021, and priority of chinese patent application No. 202111016185.1 filed at 31 at 2021; the entire contents of which are incorporated by reference into the present disclosure.

Technical Field

The disclosure relates to the technical field of projection display, and in particular relates to a laser projection device.

Background

Currently, a laser and a fluorescent wheel are included in a light source assembly of a laser projection device. The laser is configured to emit a laser beam, and the fluorescent wheel is configured to transmit the laser beam or emit a fluorescent beam having a color different from that of the laser beam under excitation of the laser beam, thereby enabling the light source assembly to provide light beams of different colors.

Disclosure of Invention

Some embodiments of the present disclosure provide a laser projection device. The laser projection apparatus includes: light source subassembly, optical engine and camera lens. The light source assembly is configured to provide an illumination beam; the light engine is configured to modulate the illumination beam with an image signal to obtain a projection beam; the lens is configured to project the projection beam into an image. The light source assembly includes: the LED package comprises a heat conducting substrate, a package shell, a first light emitting chip, a fluorescent part and an optical path guiding assembly. The packaging shell is connected with the heat conducting substrate and comprises a light outlet. The light outlet is positioned at one side of the packaging shell away from the heat conducting substrate. The first light emitting chip is located in the packaging shell, connected with the heat conducting substrate and configured to emit a first laser beam. The fluorescent part is positioned in the packaging shell and is connected with the heat conducting substrate. The fluorescent part is positioned on the light emitting side of the first light emitting chip and is configured to emit fluorescent light beams to the light emitting opening under the excitation action of at least part of light rays in the first laser beams. The optical path guiding assembly is located within the package housing and is configured to guide the first laser beam to the fluorescent portion. At least part of light rays in the fluorescent light beam are emitted from the light outlet along a direction away from the heat conducting substrate so as to form at least part of light rays in the illumination light beam.

Drawings

FIG. 1 is one of the block diagrams of a laser projection device according to some embodiments;

FIG. 2 is a timing diagram of a light source assembly in a laser projection device according to some embodiments;

FIG. 3 is an optical path diagram in a laser projection device according to some embodiments;

FIG. 4 is a block diagram of a digital micromirror device according to some embodiments;

FIG. 5 is a diagram showing the position of a micro mirror plate wobble in the digital micromirror device of FIG. 4;

FIG. 6 is a schematic diagram of the operation of a micro mirror plate according to some embodiments;

FIG. 7 is a second block diagram of a laser projection device according to some embodiments;

FIG. 8 is one of the block diagrams of the related art light source assembly;

FIG. 9 is a second block diagram of a related art light source module;

FIG. 10 is a block diagram of a fluorescent wheel in the related art;

FIG. 11 is one of the block diagrams of a light source assembly according to some embodiments;

FIG. 12 is a second block diagram of a light source assembly according to some embodiments;

FIG. 13 is a block diagram of a color filter assembly according to some embodiments;

fig. 14 is one of the block diagrams of a light emitting device according to some embodiments;

FIG. 15 is a block diagram of a fluorescent portion according to some embodiments;

FIG. 16 is a second block diagram of a light emitting device according to some embodiments;

FIG. 17 is a partial light path diagram of the light emitting device of FIG. 16;

FIG. 18 is a third block diagram of a light emitting device according to some embodiments;

FIG. 19 is a fourth block diagram of a light emitting device according to some embodiments;

FIG. 20 is a fifth block diagram of a light emitting device according to some embodiments;

fig. 21 is a structural view of a light combining part in the light emitting device of fig. 20;

FIG. 22 is a sixth block diagram of a light emitting device according to some embodiments;

FIG. 23 is a seventh block diagram of a light emitting device according to some embodiments;

FIG. 24 is a diagram of a light emitting device according to some embodiments;

fig. 25 is a ninth block diagram of a light emitting device according to some embodiments.

Reference numerals:

a laser projection device 1000;

a light source assembly 1; a laser 100; an integrated base 101; a light emitting device 10; a heat conductive substrate 11; pin 111; a package housing 12; a side plate 122; a package plate 123; a light outlet 121; an optical path guiding assembly 13; a first reflecting portion 131; a first reflecting surface 1311; a first bottom surface 1312; a second reflecting portion 132; a second reflective surface 1321; a second bottom surface 1322; a light combining section 133; a plane 1330; a light reflecting surface 1331; a third bottom surface 1332; a first antireflection film 1333; a second antireflection film 1334; a support base 134; a support surface 1341; a fourth bottom surface 1342; a converging lens 135; a fifth bottom surface 135a; a first curved surface 135b; a second curved surface 135c; an optical axis a of the first laser beam; a center point C of the first curved surface; a normal L; a support base side 1343; a first light emitting chip 14; a first laser beam S1; a second laser beam S2; a fluorescent section 15; a fluorescent layer 151; an optical antireflection film 152; a first chip pad 171; a second chip pad 172; an optical device 18; a second light emitting chip 19; an optical path shaping assembly 200; a color filter assembly 300; a green color filter 301; a blue color filter 302; a red color filter 303; a driving section 304; a collimator lens 400; a dodging component 500;

A light machine 20; a diffusion sheet 2; a first lens assembly 3; a compound spectacle group 4; a first fly-eye lens 41; a second fly-eye lens 42; a second lens assembly 5; a digital micromirror device 6; a minute reflection mirror 601; a light absorbing member 602; a prism assembly 7;

a lens 30.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, however, the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", "some examples", "and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, the expression "connected" and its derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

As used herein, "parallel", "perpendicular", "equal" includes the stated case as well as the case that approximates the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be deviations within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

Some embodiments of the present disclosure provide a laser projection device. As shown in fig. 1, the laser projection device 1000 includes a light source assembly 1, a light machine 20, and a lens 30. The light source assembly 1 is configured to provide an illumination beam. The light engine 20 is configured to modulate the illumination beam provided by the light source assembly 1 with an image signal to obtain a projection beam. The lens 30 is configured to project a projection beam onto a screen or wall for imaging.

The light source assembly 1, the light machine 20 and the lens 30 are connected in sequence along the light beam propagation direction. In some examples, one end of the light machine 20 is connected to the light source assembly 1, and the light source assembly 1 and the light machine 20 are disposed along an outgoing direction (refer to a direction M in fig. 1) of an illumination beam of the laser projection device 1000. The other end of the optical machine 20 is connected to the lens 30, and the optical machine 20 and the lens 30 are disposed along the emission direction (refer to the direction N in fig. 1) of the projection beam of the laser projection device 1000.

As shown in fig. 1, in some examples, the exit direction M of the illumination beam of the laser projection device 1000 is substantially perpendicular to the exit direction N of the projection beam of the laser projection device 1000. By such arrangement, the arrangement of the structure of the laser projection device 1000 can be reasonable, and the overlong light path of the laser projection device 1000 in a certain direction (for example, the direction M or the direction N) can be avoided.

In some embodiments, the light source assembly 1 may provide trichromatic light (other colors of light may be added on the basis of trichromatic light) in a time-sequential manner. In other embodiments, the light source assembly 1 may output three primary colors of light simultaneously to continuously emit white light. The light source assembly 1 comprises a light emitting device which emits light of at least one color, such as blue laser light.

In some examples, as shown in fig. 2, the light source assembly 1 may output the blue, red, and green illumination light beams sequentially during projection of one frame of the target image. Illustratively, the light source assembly 1 outputs blue laser light in the first period T1, red laser light in the second period T2, and green laser light in the third period T3. In this example, the time for which the light source module 1 completes one round of time-series output of each primary color light beam is one cycle of the output primary color light beam of the light source module 1. In the display period of one frame of the target image, the light source assembly 1 performs a time-series output of each primary color light beam, so that the display period of one frame of the target image is equal to one period of the primary color light beam output by the light source assembly 1, and is equal to the sum of the first time period T1, the second time period T2 and the third time period T3. In this example, the human eye color superimposes the blue, red, and green light beams that are output in time series due to the persistence of vision, and thus the human eye perceives mixed white light.

The illumination beam emitted by the light source assembly 1 enters the light engine 20. Referring to fig. 3, the optical machine 20 includes a digital micromirror device 6.

The digital micromirror device 6 is located at the light emitting side of the light source module 1, and is configured to modulate the illumination beam provided by the light source module 1 with an image signal, and reflect the modulated projection beam into the lens 30. The digital micro-mirror device 6 is also referred to as a light modulation device (or light valve) because the digital micro-mirror device 6 can control the projection beam to display different colors and brightness for different pixels of the image to be displayed to ultimately form an optical image. Further, the light engine 20 may be classified into a single-chip system, a two-chip system, or a three-chip system according to the number of the digital micromirror devices 6 used in the light engine 20. For example, only one piece of digital micromirror device 6 is used in the light engine 20 shown in fig. 3, and thus the light engine 20 may be referred to as a monolithic system. When three digital micromirror devices 6 are used in the light engine 20, the light engine 20 may be referred to as a three-chip system. For example, when the light machine 20 is a three-sheet system, the light source assembly 1 may simultaneously output three primary colors of light to continuously emit white light.

It should be noted that, depending on the projection architecture, the light modulation device may include a variety of devices, such as liquid crystal on silicon (Liquid Crystal On Silicon, LCOS), liquid crystal display (Liquid Crystal Display, LCD), or digital micromirror device (Digital Micromirror Device, DMD). Since in some embodiments of the present disclosure the light engine 20 shown in fig. 3 applies a digital light processing (Digital Light Processing, DLP) projection architecture, the light modulation device in some embodiments of the present disclosure is a DMD.

As shown in fig. 4, the digital micromirror device 6 includes thousands of tiny mirrors 601 that can be individually driven to rotate, and the tiny mirrors 601 are arranged in an array, each tiny mirror 601 corresponding to a pixel in an image to be displayed. As shown in fig. 5, in the DLP projection architecture, each micro mirror 601 corresponds to a digital switch, and can swing within a range of ±12° or ±17° under the action of an external force. Fig. 5 exemplifies that each minute reflection mirror 601 can swing within a range of ±12°.

As shown in fig. 6, light reversely emitted by the minute reflection mirror 601 at a negative deflection angle is called OFF light. OFF light is inactive light and is typically incident on the housing of the light engine 20 or absorbed by the light absorbing member 602. The light reflected by the minute reflection mirror 601 at a positive deflection angle is called ON light. The ON light is an effective light beam that is irradiated by the illumination light beam and is incident ON the lens 30 through a positive deflection angle, and is used for projection imaging, by the micro mirror 601 ON the surface of the digital micromirror device 6. The on state of the micro mirror plate 601 is a state in which the micro mirror plate 601 is in a state in which the micro mirror plate 601 can be held, that is, a state in which the micro mirror plate 601 is in a positive deflection angle, when the illumination light beam emitted from the light source module 1 is reflected by the micro mirror plate 601 and can enter the lens 30. The off state of the micro mirror plate 601 is a state in which the micro mirror plate 601 is in a state that the micro mirror plate 601 can be held, that is, a state in which the micro mirror plate 601 is in a negative deflection angle when the illumination light beam emitted from the light source assembly 1 is reflected by the micro mirror plate 601 and does not enter the lens 30.

For example, for a minute reflection mirror 601 having a deflection angle of ±12°, when the minute reflection mirror 601 is in the +12° state, it is in the on state, and when it is in the-12 ° state, it is in the off state. In the case of the minute reflection mirror 601 having a deflection angle of ±17°, the state in which the minute reflection mirror 601 is located at +17° is an on state, and the state in which it is located at-17 ° is an off state. The image signal is converted into digital codes of 0 and 1 after processing, and these digital codes can drive the micro mirror 601 to oscillate.

In the display period of one frame image, part or all of the micro mirror plates 601 are switched between the on state and the off state at least once, so that the gray scale of each pixel in one frame image is realized according to the time that the micro mirror plates 601 respectively last in the on state and the off state. For example, when the pixels have 256 gradations of 0 to 255, the minute reflection mirror 601 corresponding to the pixel having the gradation of 0 is in the off state for the entire display period of the one frame image, the minute reflection mirror 601 corresponding to the pixel having the gradation of 255 is in the on state for the entire display period of the one frame image, and the minute reflection mirror 601 corresponding to the pixel having the gradation of 127 is in the on state for half of the time and in the off state for the other half of the time in the display period of the one frame image. Therefore, by controlling the state of each micro mirror plate 601 in the digital micromirror device 6 in the display period of one frame image and the maintenance time of each state by the image signal, the brightness (gray scale) of the corresponding pixel of the micro mirror plate 601 can be controlled, thereby modulating the illumination light beam projected to the digital micromirror device 6.

In some embodiments, with continued reference to fig. 3, the light engine 20 further includes a diffuser 2, a first lens assembly 3, a complex eyeglass set 4, a second lens assembly 5, and a prism assembly 7. It should be noted that fewer or more components than are shown in fig. 3 may be included in the optical engine 20, which is not limiting in this disclosure.

In this embodiment, the diffusion sheet 2 is located on the light-emitting side of the light source assembly 1, and is configured to diffuse the illumination light beam from the light source assembly 1. The first lens assembly 3 is located at the light-emitting side of the diffusion sheet 2 and is configured to condense the illumination light beam diffused by the diffusion sheet 2. The complex eyeglass set 4 is located at the light-emitting side of the first lens assembly 3 and is configured to homogenize the illumination beam converged by the first lens assembly 3. The second lens assembly 5 is located on the light exit side of the complex eyeglass set 4 and is configured to transmit the illumination beam homogenized by the complex eyeglass set 4 to the prism assembly 7. The prism assembly 7 reflects the illumination beam to the dmd 6.

In some embodiments, as shown in fig. 3, the compound eyeglass set 4 comprises oppositely disposed first and second compound eye lenses 41, 42. The light incident surface of the first fly-eye lens 41 and the light emergent surface of the second fly-eye lens 42 include micro lenses arranged in an array. The illumination light beam condensed by the first lens assembly 3 passes through the first fly-eye lens 41, is condensed into a plurality of beamlets (i.e., light beams having smaller spots) by different micro lenses on the light incident surface of the first fly-eye lens 41, and is focused to the center of each micro lens of the second fly-eye lens 42. The plurality of micro lenses on the light exit surface of the second fly's eye lens 42 may diverge the plurality of beamlets to change the plurality of beamlets into a plurality of wide beams (i.e., beams having larger spots). Since the spots of the plurality of wide light beams overlap each other, uniformity and illumination brightness are improved after the illumination light beams pass through the first fly-eye lens 41 and the second fly-eye lens 42.

As shown in fig. 7, the lens 30 includes a plurality of lens combinations, and is generally divided into three sections of a front group, a middle group, and a rear group, or two sections of a front group and a rear group. The front group is a lens group near the light exit side of the laser projection device 1000 (i.e., the side of the lens 30 in the direction N away from the optical machine 20 in fig. 7), and the rear group is a lens group near the light exit side of the optical machine 20 (i.e., the side of the lens 30 in the direction N near the optical machine 20 in fig. 7). The lens 30 may be a zoom lens, or a fixed focus adjustable focus lens, or a fixed focus lens.

For ease of description, some embodiments of the present disclosure will be mainly described by taking a DLP projection architecture as an example of the laser projection apparatus 1000, and taking a light modulation device in the optical machine 20 as the digital micromirror device 6 as an example. However, this is not to be construed as limiting the present disclosure.

As shown in fig. 8, in some related art, a light source assembly of a laser projection apparatus includes multicolor laser devices, that is, a red laser device 0011, a green laser device 0012, and a blue laser device 0013. The red laser device 0011, the green laser device 0012, and the blue laser device 0013 can operate simultaneously, and at this time, the multicolor laser device outputs three primary colors of light simultaneously; the red laser 0011, the green laser 0012, and the blue laser 0013 may be operated in a time-sharing manner, and at this time, the multicolor laser outputs three primary colors of light in a time-sequential manner.

The light source assembly further includes a light path assembly 003, a color filter wheel 004, and a light condensing assembly 005. Wherein the condensing assembly 005 is configured to condense the three primary colors of light output by the multicolor laser device simultaneously or in a time-sharing manner. The optical path assembly 003 is configured to guide the trichromatic light condensed by the condensing assembly 005 to the color filter wheel 004. The color filter wheel 004 includes a red filter, a green filter, and a blue filter, and a color filter of one color can filter a light beam of the color. For example, when the light source assembly simultaneously outputs three primary colors of light and the three primary colors of light are transmitted to the red color filter of the color filter wheel 004, the green light and the blue light of the three primary colors of light cannot pass through the red color filter, and only the red light remains after the three primary colors of light are filtered.

However, the red laser device can bear low working temperature and is easy to damage, so that the reliability of the light source assembly is poor. In addition, the light source assembly is required to be provided with the laser devices with three colors at the same time, so that the manufacturing difficulty is high and the cost is high.

As shown in fig. 9, in other related art, a light source assembly of a laser projection apparatus includes a single color laser device (e.g., a plurality of blue laser devices 0013) or a double color laser device (e.g., a green laser device 0012 and a blue laser device 0013). At this time, the light source assembly may output one primary color light, or may output two primary colors light simultaneously or in a time-sharing manner.

Taking the example that the light source assembly comprises a monochromatic laser device and the monochromatic laser device is a blue laser device 0013, the light source assembly further comprises a fluorescent wheel 002, and the light path assembly 003 comprises a first light path assembly 0031 and a second light path assembly 0032. The first optical path assembly 0031 is configured to focus and collimate the blue laser light converged by the condensing assembly 005, and then guide the focused blue laser light to the fluorescent wheel 002. As shown in fig. 10, the phosphor wheel 002 includes a transmission region 0021, a red phosphor region 0022, a green phosphor region 0023, a phosphor wheel substrate 0024, and a phosphor wheel drive section 0025. Wherein, the red fluorescent region 0022 is provided with red fluorescent paint, which can generate red fluorescent light under the excitation of blue laser; the green fluorescent region 0023 is provided with green fluorescent paint, and green fluorescence can be generated under the excitation action of blue laser. The red fluorescent paint and the green fluorescent paint are adhered to the fluorescent wheel substrate 0024 by a colloid. The phosphor wheel driving section 0025 may rotate the phosphor wheel 002 so that the position where the blue laser light is irradiated onto the phosphor wheel 002 is changed. When the blue laser light is irradiated on the transmission region 0021, the fluorescent wheel 002 transmits the blue laser light, and the blue laser light is guided to the second optical path assembly 0032, and the blue laser light is guided to the color filter wheel 004 by the second optical path assembly 0032. When the blue laser light is irradiated on the red fluorescence region 0022 or the green fluorescence region 0023, the fluorescence wheel 002 generates red fluorescence or green fluorescence, and the red fluorescence or the green fluorescence is reflected to the first optical path component 0031, and the red fluorescence or the green fluorescence is guided to the color filter wheel 004 by the first optical path component 0031.

The above related art can avoid using a red laser device and reduce manufacturing difficulty, but still has the following technical problems: in order to rotate the fluorescent wheel 002, a fluorescent wheel driving circuit (not shown in fig. 9), a fluorescent wheel driving section 0025, and the like need to be provided in the light source unit. These components are bulky, and occupy more space in the light source assembly, which is detrimental to the compact design of the laser projection apparatus.

However, if the fluorescent wheel 002 is fixedly provided without providing a fluorescent wheel driving circuit, a fluorescent wheel driving unit 0025, or the like, the fluorescent wheel 002 is continuously subjected to high-energy laser irradiation from a plurality of laser devices. Thus, the operating temperature of the laser light irradiated region of the fluorescent wheel 002 increases sharply. When the operating temperature of the fluorescent wheel 002 is high (for example, 50 degrees celsius), the possibility that the excited electrons in the fluorescent paint return to the ground state through non-radiative decay (i.e., the possibility that the fluorescent paint is de-excited) may increase, thereby resulting in a decrease in the fluorescence excitation efficiency of the fluorescent wheel 002, and further, when the operating temperature of the fluorescent wheel 002 is too high (for example, 70 degrees celsius), the colloid between the fluorescent paint and the fluorescent wheel substrate 0024 may melt at a high temperature, causing the fluorescent paint to fall off, the fluorescent wheel 002 may not operate normally, and the reliability of the light source assembly may still be not high.

If the fan or other heat dissipation device is added to assist the fixed fluorescent wheel 002 to dissipate heat, the components in the light source assembly are increased, which is still unfavorable for the miniaturization design of the laser projection device.

In addition, the fluorescent wheel 002 is not damaged by the continuous irradiation of the laser light emitted from less laser devices (for example, one laser device). However, if the number of laser devices in the light source assembly is reduced to realize the fixed setting of the fluorescent wheel 002 and ensure that the fluorescent wheel 002 works normally, the brightness of the illumination beam provided by the light source assembly is reduced, so that the display effect of the projection image presented by the laser projection device is reduced.

In view of the above technical problems in the related art, the present inventors have studied to find: because the setting position of the fluorescent wheel 002 in the light source assembly is unreasonable, the fluorescent wheel 002 needs to bear the laser irradiation of a plurality of laser devices when fixedly arranged, thereby preventing the miniaturization design of the fluorescent wheel 002 in the light source assembly on the premise of considering the reliability and the display effect of the projection image.

Based on this, the presently disclosed embodiments provide a light source assembly 1 as shown in fig. 11, 12 and 13.

As shown in fig. 11, the light source assembly 1 may include: a laser 100, an optical path shaping assembly 200, and a color filter assembly 300. The laser 100 is configured to provide an illumination beam; the optical path shaping assembly 200 is configured to contract and homogenize an illumination beam provided by the laser 100 to make a spot of the illumination beam small and energy uniform; the color filter assembly 300 is configured to filter the illumination beam from the optical path shaping assembly 200 to output three primary colors (i.e., red, green, blue) of light in a time-sequential manner. Note that the structure of the laser 100 will be described below.

In some embodiments, as shown in fig. 13, the color filter assembly 300 may include a green color filter 301, a blue color filter 302, a red color filter 303, and a driving part 304. The driving section 304 is configured to drive the color filter assembly 300 to rotate so that the illumination light beam emitted from the laser 100 is filtered by color filters of different colors during a display period of one frame of the target image.

In some examples, when the light source assembly 1 outputs trichromatic light simultaneously (i.e., the laser 100 outputs trichromatic light simultaneously) and the color filter assembly 300 rotates to a position where the red color filter 303 covers the spot of the trichromatic light, the light beams of the trichromatic light of the color other than the red light beam are blocked, and the red light beam transmits the color filter assembly 300 through the red color filter 303.

In some embodiments, as shown in fig. 12, the light source assembly 1 further comprises a collimating lens 400. In some examples, the collimating lens 400 is located on the light exit side of the light path shaping assembly 200 and is configured to converge the illumination beam from the light path shaping assembly 200.

In some embodiments, as shown in fig. 12, the light source assembly 1 further comprises a light homogenizing assembly 500. In some examples, the light evening assembly 500 is located on the light exit side of the color filter assembly 300 and is configured to homogenize the illumination beam after being color filtered by the color filter assembly 300. The light homogenizing component 500 may be a fly eye lens or a light pipe.

For example, when the light homogenizing component 500 is a fly-eye lens, the structure of the light homogenizing component 500 can refer to the structure of the above-mentioned fly-eye lens set 4, and will not be described herein. Alternatively, when the light homogenizing module 500 is a light pipe, the light pipe may be a tubular device formed by splicing four planar reflective sheets, i.e., a hollow light pipe. The illumination beam is reflected for multiple times inside the light guide pipe so as to achieve the effect of uniform light. Of course, the light homogenizing module 500 may also employ a solid light pipe. For example, the light inlet and the light outlet of the light guide tube are rectangular with the same shape and area, the illumination light beam enters the light guide tube from the light inlet of the light guide tube and then exits from the light outlet of the light guide tube, and light beam homogenization and light spot optimization are completed in the process of passing through the light guide tube.

It should be noted that, when the light homogenizing module 500 is a light pipe, the light source module 1 includes the light pipe, and the light machine 20 may not be provided with the light pipe; when the light homogenizing module 500 is a component other than the light guide, the light machine 20 further includes the light guide for receiving the illumination beam from the light source module 1.

In some embodiments, as shown in fig. 11 and 12, the laser 100 includes: an integrated base 101 and a plurality of light emitting devices 10 arrayed on the integrated base 101. In some examples, the material of the integrated base 101 may be a metal simple substance, an alloy material, silicon carbide, aluminum nitride, or a thermally conductive material such as a thermally conductive ceramic. The integrated base 101 may provide structural support, heat dissipation, electrical connection, etc. for a plurality of light emitting devices 10.

It should be noted that fig. 11 and 12 are exemplary illustrations taking one laser 100 included in the light source assembly 1 as an example, and the present disclosure does not limit the number of lasers 100 included in the laser projection apparatus 1000. For example, the laser projection device 1000 may include two lasers 100 or three lasers 100. When a plurality of lasers 100 are included in the light source assembly 1, the brightness of the illumination light beam provided by the light source assembly 1 is increased, so that the display effect of the laser projection apparatus 1000 can be enhanced.

The structure of the light emitting device 10 will be exemplarily described with reference to fig. 14 and 15.

As shown in fig. 14, the light emitting device 10 includes: the light guide assembly includes a heat conductive substrate 11, a package case 12, a light path guide assembly 13, a first light emitting chip 14, and a fluorescent part 15.

The package housing 12 is connected to the heat conductive substrate 11, and a side of the package housing 12 away from the heat conductive substrate 11 includes a light outlet 121.

The first light emitting chip 14 is located in the package housing 12 and connected with the heat conductive substrate 11, and is configured to emit a first laser beam.

The fluorescent portion 15 is located in the package housing 12 and connected to the heat conductive substrate 11, and the fluorescent portion 15 is located on the light emitting side of the first light emitting chip 14 and configured to emit a fluorescent light beam to the light emitting opening 121 under the excitation effect of at least part of the light rays in the first laser beam.

The optical path guiding assembly 13 is located within the package housing 12 and is configured to guide the first laser beam to the fluorescent portion 15.

At least part of the light in the fluorescent light beam exits from the light outlet 121 in a direction away from the heat conducting substrate 11, so as to form at least part of the light in the illumination light beam, and the at least part of the light is emitted to the optical machine 20.

According to the laser projection device 1000 provided by the embodiment of the disclosure, the fluorescent wheel in the related art is split into the plurality of fluorescent parts 15 and then is arranged in the package shell 12 of the light-emitting device 10, so that the fluorescent parts 15 only need to bear the laser irradiation in one light-emitting device 10, the energy of the laser transmitted to the fluorescent parts 15 is reduced, the probability of damage of local burning, fire and the like of the fluorescent parts 15 is reduced, and the reliability of the light source assembly is improved. Thus, on the premise of ensuring reliability, the reduction of components (for example, a fluorescent wheel driving circuit, a fluorescent wheel driving part 0025 and the like) in the light source assembly 1 is realized, and the miniaturization design requirement of the laser projection device 1000 is satisfied. In addition, the fluorescent part 15 is arranged on the heat conducting substrate 11, so that heat generated by the first laser beam striking the fluorescent part 15 can be quickly transferred to the whole heat conducting substrate 11, the fluorescent part 15 can quickly dissipate heat, the working temperature of the fluorescent part 15 is low, the problem that the fluorescence excitation efficiency of the fluorescent part 15 is reduced due to the fact that the working temperature is too high is avoided, and the fluorescence excitation efficiency of the fluorescent part 15 is improved.

In some embodiments, the first light emitting chip 14 includes a semiconductor light emitting element. In some examples, the semiconductor light emitting element may emit a first laser beam of blue color. It should be noted that, the first light emitting chip 14 in the embodiments of the present disclosure may also emit the first laser beams with other colors, which is not limited herein.

In some examples, the energy of the first laser beam irradiated to the fluorescent portion 15 by the first light emitting chip 14 is less than or equal to 20W. In this way, the energy of the first laser beam received by the fluorescent part 15 is smaller, so that the problem that the working temperature of the fluorescent part 15 is too high can be avoided, and the probability of damage to the fluorescent part 15 is reduced.

In other examples, the energy of the first laser beam irradiated to the fluorescent part 15 by the first light emitting chip 14 may be higher than that of the related art. Since the heat dissipation of the fluorescent portion 15 in the embodiment of the present disclosure is faster, the fluorescent portion 15 can maintain a higher fluorescence excitation efficiency even if the energy of the first laser beam irradiated to the fluorescent portion 15 is higher.

In some embodiments, as shown in fig. 15, the fluorescent portion 15 includes a fluorescent layer 151, and the fluorescent layer 151 is connected to the heat conductive substrate 11. The fluorescent layer 151 may be excited to generate fluorescence under irradiation of the first laser beam.

In some examples, the fluorescent layer 151 may include fluorescent materials of different colors. For example, when the fluorescent layer 151 includes a yellow yttrium aluminum garnet fluorescent powder, the fluorescent layer 151 may be excited to generate yellow fluorescent light under irradiation of the first laser beam.

In some embodiments, the fluorescent layer 151 may be connected to the thermally conductive substrate 11 by mechanical fixing, bonding, soldering, or high temperature sintering. Illustratively, when the fluorescent layer 151 is connected to the heat conductive substrate 11 by soldering, a side of the fluorescent layer 151 adjacent to the heat conductive substrate 11 further includes a metal plating film for soldering.

In some embodiments, as shown in fig. 15, the fluorescent portion 15 further includes an optical anti-reflection film 152, where the optical anti-reflection film 152 is connected to the fluorescent layer 151 and is located on a side of the fluorescent layer 151 away from the heat conductive substrate 11. Thus, when the first laser beam emitted from the first light emitting chip 14 is irradiated to the fluorescent portion 15, the first laser beam is transmitted to the fluorescent layer 151 through the optical antireflection film 152. The optical antireflection film 152 can reduce the portion of the first laser beam reflected by the fluorescent portion 15 so that the first laser beam is more directed to the fluorescent layer 151.

In some embodiments, the illumination beam emitted from the light emitting device 10 to the light engine 20 may only include the fluorescent light beam emitted from the light outlet 121. At this time, the fluorescent portion 15 emits a fluorescent light beam by excitation of all the first laser light beams transmitted to the fluorescent portion 15. In this embodiment, a single-color light emitting device that emits only laser light may also be included in the light source module 1. In some examples, the fluorescent light beam emitted from the light outlet 121 is yellow fluorescent light, the laser light emitted from the monochromatic light emitting device is blue laser light, and the illumination light beam emitted from the light source assembly 1 to the light machine 20 is a mixed light beam of the yellow fluorescent light and the blue laser light, that is, a white light beam.

In other embodiments, the illumination beam emitted from the light emitting device 10 to the optical machine 20 includes at least a portion of the light in the first laser beam in addition to the fluorescent light beam emitted from the light outlet 121. At this time, the fluorescent portion 15 is configured to emit a fluorescent light beam under excitation of a part of light rays in the first laser light beam emitted from the first light emitting chip 14, and transmit another part of light rays in the first laser light beam. In this embodiment, as shown in fig. 14, the region of the thermally conductive substrate 11 in contact with the fluorescent part 15 includes a reflection region.

In some examples, after another portion of the first laser beam transmitted by the fluorescent portion 15 is emitted to the reflective region of the thermally conductive substrate 11, at least a portion of the other portion of the first laser beam is reflected toward the light outlet 121. In this way, at least some of the other light rays exit the light outlet 121 in a direction away from the thermally conductive substrate 11 to form an illumination beam together with at least some of the fluorescent light beams, and are directed toward the optical engine 20. For example, if the first laser beam emitted by the first light emitting chip 14 of one light emitting device 10 is blue laser light and the fluorescence emitted by the fluorescent portion 15 after being excited is yellow fluorescence, the beam at the light outlet 121 of the light emitting device 10 is a mixed beam of the yellow fluorescence emitted by the fluorescent portion 15 and the blue laser light reflected by the reflection region.

The fluorescence excitation ratio of the fluorescent portion 15 is related to the thickness of the fluorescent portion 15. In general, when the materials of the fluorescent portions 15 are the same, the thicker the fluorescent portions 15 are, the higher the proportion of fluorescence generated by the fluorescent portions 15 under the excitation of the first laser beam is; accordingly, the lower the proportion of the light rays transmitted through the fluorescent portion 15 in the first laser beam. By adjusting the thickness of the fluorescent portion 15, the ratio of the fluorescent light beam to the first laser light beam in the light beam at the light outlet 121 can be adjusted, thereby adjusting the color of the light beam at the light outlet 121.

In some examples, the reflective region of the thermally conductive substrate 11 may be a diffuse reflective material layer or a metallic reflective layer. When the reflective region is a diffuse reflective material layer, the reflective region may act to homogenize the light beam reflected by the reflective region. When the reflective region is a metal reflective layer, the reflective region has higher reflectivity for the light beam. Illustratively, the material of the metal reflective layer may be aluminum or silver, etc. Note that, when the heat conductive substrate 11 itself has a function of reflecting light, the entire heat conductive substrate 11 is a reflection area.

The structure of the light guide assembly 13 will be exemplarily described below with reference mainly to fig. 16 to 25.

In some embodiments, the light path guiding assembly 13 includes a first reflective portion 131 and a second reflective portion 132. At this time, the first laser beam emitted from the first light emitting chip 14 is reflected by the first reflecting portion 131 and the second reflecting portion 132 in order, and then reaches the fluorescent portion 15.

In some embodiments, as shown in fig. 14, the package housing 12 further includes: a side plate 122 and a package plate 123. The side plate 122 is connected to the heat conductive substrate 11 on a side close to the heat conductive substrate 11, and is connected to the package board 123 on a side far from the heat conductive substrate 11. The light outlet 121 is located on the package plate 123. The package case 12 is configured to protect various components located inside thereof, such as the above-described first light emitting chip 14 and fluorescent part 15.

In some embodiments, as shown in fig. 16, the first reflecting portion 131 is located in the package housing 12 and connected with the heat conductive substrate 11, and the first reflecting portion 131 is located between the first light emitting chip 14 and the fluorescent portion 15. The second reflecting portion 132 is located in the package housing 12 and is connected to the package housing 12. Illustratively, the second reflecting portion 132 is connected to a side of the package plate 123 of the package housing 12 near the thermally conductive substrate 11.

The first reflecting portion 131 is configured to guide the first laser light beam emitted from the first light emitting chip 14 to the second reflecting portion 132, and the second reflecting portion 132 is configured to guide the first laser light beam from the first reflecting portion 131 to the fluorescent portion 15. The fluorescent portion 15 is configured to emit a fluorescent light beam toward the light outlet 121 by excitation of at least part of the first laser light beam from the second reflecting portion 132.

In some examples, as shown in fig. 16, a side of the first reflecting portion 131 near the first light emitting chip 14 has a first reflecting surface 1311, and a side of the second reflecting portion 132 near the fluorescent portion 15 has a second reflecting surface 1321. The first reflecting surface 1311 and the second reflecting surface 1321 may be planar reflecting surfaces or curved reflecting surfaces.

Illustratively, as shown in fig. 16, at least one of the first reflecting surface 1311 of the first reflecting portion 131 and the second reflecting surface 1321 of the second reflecting portion 132 is a curved reflecting surface configured to converge the first laser beam emitted by the first light emitting chip 14 and change the transmission direction of the first laser beam emitted by the first light emitting chip 14, so as to reduce the diffusion degree of the first laser beam during the transmission process, so that the light spot of the first laser beam received by the fluorescent portion 15 is smaller and the energy is more concentrated, thereby ensuring that the fluorescent portion 15 has higher fluorescence excitation efficiency.

In some examples, as shown in fig. 17, the first reflective surface 1311 of the first reflective portion 131 and the second reflective surface 1321 of the second reflective portion 132 are parabolic reflective surfaces. Illustratively, when the first center point A1 of the light emitting surface of the first light emitting chip 14 coincides with the first focal point A2 of the first reflecting surface 1311, a plurality of divergent light beams in the first laser beam emitted by the first light emitting chip 14 become a plurality of light beams parallel to each other after being reflected by the first reflecting surface 1311. Illustratively, when the second focal point A3 of the second reflecting surface 1321 coincides with a point (for example, the second center point A4 in fig. 17) on the surface of the fluorescent portion 15, a plurality of mutually parallel light rays reflected by the first reflecting surface 1311 are reflected by the second reflecting surface 1321 and then converge on the surface of the fluorescent portion 15. In this way, the spot of the first laser beam received by the fluorescent portion 15 is smaller and the energy is more concentrated, so that the fluorescence excitation efficiency of the fluorescent portion 15 can be higher.

In some examples, as shown in fig. 16, the first reflecting portion 131 further has a first bottom surface 1312, and the first bottom surface 1312 is connected to the heat conductive substrate 11. Illustratively, the first bottom surface 1312 and the heat conductive substrate 11 may be welded by plating a metal film layer on the first bottom surface 1312. The second reflecting portion 132 further has a second bottom surface 1322, and the second bottom surface 1322 is connected to the package housing 12. Illustratively, the second bottom surface 1322 may be connected to the package housing 12 in the same manner as the first bottom surface 1312, which is not described herein.

In other examples, the first reflecting portion 131 includes a first curved mirror and a first fixing structure. The first curved mirror functions in the same manner as the first reflecting surface 1311 described above, and the first fixing structure is configured to connect the first curved mirror to the heat conductive substrate 11. The second reflecting portion 132 includes a second curved mirror and a second fixing structure. The second curved mirror functions as the second reflective surface 1321 described above, and the second fixing structure is configured to attach the second curved mirror to the package housing 12.

In other embodiments, as shown in fig. 18, the light emitting device 10 includes two first light emitting chips 14, two first reflecting portions 131 and two second reflecting portions 132, where the two first light emitting chips 14 are located at two sides of the fluorescent portion 15, the two first reflecting portions 131 are located at two sides of the fluorescent portion 15, and the two second reflecting portions 132 are located at two sides of the fluorescent portion 15. In this way, the intensity of the laser light irradiated onto the fluorescent portion 15 is higher, and the number of molecules excited by the laser light in the fluorescent portion 15 is larger, so that the intensity of the generated fluorescent light beam is higher, and the brightness of the light beam emitted from the light emitting device 10 is higher.

For example, the two first light emitting chips 14, the two first reflecting parts 131, and the two second reflecting parts 132 may be symmetrically arranged.

The optical path guiding assembly 13 in fig. 19 to 21 is different from the optical path guiding assembly 13 in fig. 16 to 18 in that the optical path guiding assembly 13 includes a light combining portion 133. At this time, the optical path guiding member 13 only needs to reflect the first laser beam emitted from the first light emitting chip 14 once, and can guide the first laser beam to the fluorescent portion 15.

In some embodiments, as shown in fig. 19, the light combining portion 133 is located in the package housing 12 and connected to the heat conductive substrate 11. The first light emitting chip 14 and the light combining portion 133 are respectively located at two opposite sides of the fluorescent portion 15, and a side of the light combining portion 133 close to the fluorescent portion 15 has a light reflecting surface 1331. The light reflecting surface 1331 is configured to guide the first laser light beam emitted from the first light emitting chip 14 to the fluorescent portion 15, and to guide at least part of the light rays of the fluorescent light beam emitted from the fluorescent portion 15 to the light emitting port 121. At this time, the light emitting device 10 emits only a fluorescent light beam.

In some embodiments, the light reflective surface 1331 is a dichroic film. The dichroic film is capable of reflecting light having a wavelength in a first wavelength range and transmitting light having a wavelength in a second wavelength range. Illustratively, the dichroic film may reflect the blue light beam and transmit the yellow light beam.

In other embodiments, as shown in fig. 20, the light emitting device 10 further includes a second light emitting chip 19. The second light emitting chip 19 is located in the package housing 12 and connected to the heat conductive substrate 11, and is located at a side of the light combining portion 133 away from the fluorescent portion 15. The second light emitting chip 19 is configured to emit a second laser beam, and the light combining portion 133 is further configured to reflect at least part of the light in the second laser beam toward the light outlet 121. At this time, at least part of the light in the second laser beam exits from the light outlet 121 along the direction away from the heat conducting substrate 11, so as to form at least part of the light in the illumination beam together with at least part of the light in the fluorescent beam, and the light is emitted to the optical engine 20. For example, if the fluorescence emitted after the fluorescent portion 15 is excited is yellow fluorescence and the second laser beam is blue laser, the light emitting device 10 may emit a white beam.

In addition, in this embodiment, the illumination beam of the light emitting device 10 may further include the first laser beam reflected by the reflection area of the heat conductive substrate 11 to the light outlet 121 after being transmitted by the fluorescent part 15, which is not limited in this disclosure.

It should be noted that, in the embodiment of the present disclosure, the first light emitting chip 14 and the second light emitting chip 19 may output the laser beams at the same time, or may output the laser beams in a time-sharing manner, which is not limited in this disclosure.

In some embodiments, as shown in fig. 21, in the light combining portion 133, a surface connected to the heat conducting substrate 11 is a third bottom surface 1332, a surface having a light reflecting surface 1331 is a plane 1330, and a first included angle α between the plane 1330 and the third bottom surface 1332 is an obtuse angle. Illustratively, the light combining portion 133 may be fixed on the thermally conductive substrate 11 through the third bottom surface 1332. Illustratively, a metal film layer may be plated on the third bottom surface 1332 of the light combining portion 133 for welding connection with the heat conducting substrate 11 to fix the light combining portion 133.

Note that, in the embodiment of the present disclosure, a surface of the light combining portion 133 on which the reflecting surface 1331 is disposed may be a curved surface, which is not limited in the present disclosure.

In some embodiments, as shown in fig. 20, the orthographic projection of the fluorescent portion 15 on the thermally conductive substrate 11 is located within the orthographic projection of the light reflecting surface 1331 on the thermally conductive substrate 11. Thus, the first laser beam emitted from the first light emitting chip 14 may be more directed to the fluorescent part 15 by the light reflecting surface 1331, and the fluorescent beam emitted from the fluorescent part 15 may be more directed to the light emitting port 121 by the light reflecting surface 1331.

In some embodiments, as shown in fig. 20, the optical axis of the first laser beam S1 emitted by the first light emitting chip 14 and the optical axis of the second laser beam S2 emitted by the second light emitting chip 19 are parallel to the third bottom surface 1332. In the case where the first angle α is 135 degrees, the angle between the optical axis of the first laser beam S1 and the optical axis of the second laser beam S2 and the plane 1330 is 45 degrees. In this way, the optical axes of the first laser beam S1 and the second laser beam S2 are perpendicular to the optical axis of the fluorescent light beam emitted by the fluorescent portion 15, so that the optical path of the light beam (for example, the fluorescent light beam) in the light emitting device 10 is shorter, and the structure of the light emitting device 10 is more compact, thereby facilitating the miniaturization design of the light emitting device 10.

Note that, the color of the light beam emitted by the light emitting device 10 in this embodiment may be achieved by adjusting the light intensity of the first laser beam S1 and the light intensity of the second laser beam S2. Illustratively, in the case where the light intensity of the first laser beam S1 is greater than that of the second laser beam S2, the light beam emitted from the light emitting device 10 contains relatively more fluorescent light beams and relatively less second laser beams S2; alternatively, in the case where the light intensity of the first laser beam S1 is less than or equal to the light intensity of the second laser beam S2, the light beam emitted from the light emitting device 10 contains relatively less fluorescent light beams and relatively more second laser beams S2.

In some embodiments, as shown in fig. 21, a side of the light combining portion 133 facing the second light emitting chip 19 has a first anti-reflection film 1333. Illustratively, the first antireflection film 1333 may reduce the portion of the second laser beam S2 reflected by the light combining portion 133, so that the second laser beam S2 is more directed to the light outlet 121.

In other embodiments, the light combining portion 133 has a plurality of diffusion microstructures on a side facing the second light emitting chip 19. The plurality of diffusion microstructures may be, for example, a plurality of micro-scale raised structures or a plurality of micro-scale recessed structures, which may homogenize the second laser beam S2.

In some embodiments, as shown in fig. 21, a side of the light combining portion 133 away from the heat conducting substrate 11 has a second anti-reflection film 1334. The second antireflection film 1334 can reduce the reflected portions of the fluorescent light beam and the second laser light beam S2 that enter the light combining portion 133.

The optical path guiding assembly 13 in fig. 22 to 25 is different from the optical path guiding assembly 13 in fig. 16 to 21 in that the optical path guiding assembly 13 includes a support base 134. At this time, the optical path guiding member 13 does not need to guide the first laser beam to the fluorescent part 15 by at least one reflection of the first laser beam, but by changing the emission angle of the first light emitting chip 14 so that the first laser beam can directly reach the fluorescent part 15.

In some embodiments, as shown in fig. 22, the support base 134 is located in the package housing 12 and is connected to the heat conductive substrate 11. The support base 134 has a support surface 1341 on a side near the fluorescent portion 15, and a fourth bottom surface 1342 on a side near the thermally conductive substrate 11, where a second angle β between the support surface 1341 and the fourth bottom surface 1342 of the support base 134 is an acute angle. The first light emitting chip 14 is located on the supporting surface 1341 of the supporting base 134.

In the above embodiment, as shown in fig. 22, the first laser beam emitted from the first light emitting chip 14 may directly reach the fluorescent portion 15. In some embodiments, as shown in fig. 23, the light emitting device 10 further includes a converging lens 135. At this time, the first laser beam emitted from the first light emitting chip 14 passes through the condensing lens 135 and reaches the fluorescent portion 15.

The converging lens 135 is located on the supporting surface 1341 and on the side of the first light emitting chip 14 near the fluorescent part 15. The condensing lens 135 is configured to condense the first laser beam emitted from the first light emitting chip 14 onto the fluorescent portion 15. The light passing through the condensing lens 135 can be condensed and collimated by the condensing lens 135, and thus, the condensing lens 135 can be provided to reduce the degree of diffusion of the first laser beam during transmission, thereby making the fluorescence excitation efficiency of the fluorescent portion 15 high.

It should be noted that the number of the converging lenses 135 is not limited in the embodiments of the present disclosure, for example, the light emitting device 10 includes one, two or three converging lenses 135.

In some examples, as shown in fig. 23, the light emitting device 10 includes a converging lens 135, the converging lens 135 including a fifth bottom surface 135a, the converging lens 135 being coupled to a support surface 1341 by the fifth bottom surface 135 a. Illustratively, at least one of an end face of the converging lens 135 near one end of the first light emitting chip 14 and an end face of one end far from the first light emitting chip 14 has a curved surface. The curved surface may be a spherical surface or an aspherical surface.

For example, as shown in fig. 23, the end face of the converging lens 135 near the end of the first light emitting chip 14 is a first plane, and the end face of the end far from the first light emitting chip 14 has a first curved face 135b. The first curved surface 135b protrudes toward the side close to the fluorescent portion 15. At this time, the converging lens 135 may be referred to as a single convex lens.

Alternatively, as shown in fig. 24, the end surface of the converging lens 135 near the end of the first light emitting chip 14 has a second curved surface 135c, and the end surface of the end far from the first light emitting chip 14 has the first curved surface 135b. The second curved surface 135c protrudes toward a side close to the first light emitting chip 14. At this time, the converging lens 135 may be referred to as a biconvex lens. When the condensing lens 135 is a biconvex lens, the spot formed by condensing the first laser beam on the fluorescent portion 15 is smaller and the condensing effect is better than that of the Shan Tu lens.

In some embodiments, as shown in fig. 23, the optical axis a of the first laser beam emitted by the first light emitting chip 14 is collinear with the normal L at the center point C of the first curved surface 135b of the converging lens 135. Thus, the first laser beam converged by the converging lens 135 has a smaller spot and a more concentrated energy, so that the fluorescent portion 15 is ensured to have a higher fluorescence excitation efficiency.

In some embodiments, as shown in fig. 25, the light-emitting device 10 includes two supporting bases 134 and two first light-emitting chips 14, the two supporting bases 134 are respectively located at two sides of the fluorescent portion 15, and the two first light-emitting chips 14 are respectively located on supporting surfaces 1341 of the two supporting bases 134. In this way, the intensity of the laser light irradiated onto the fluorescent portion 15 is higher, and the number of molecules excited by the laser light in the fluorescent portion 15 is larger, so that the intensity of the generated fluorescent light beam is higher, and the brightness of the light beam emitted from the light emitting device 10 is higher.

In some embodiments, the support 134 is made of a thermally conductive material (e.g., a metallic material or a ceramic material), and the support 134 also has a support side 1343, the support side 1343 being in contact with the package housing 12. In this way, the heat generated by the first light emitting chip 14 can be further conducted to the package housing 12 through the supporting base 134, so as to improve the heat dissipation efficiency of the first light emitting chip 14.

In some embodiments, as shown in fig. 16, the light emitting device 10 further includes a first chip pad 171. The first chip pad 171 is disposed on the heat conductive substrate 11, and a side of the first chip pad 171 away from the heat conductive substrate 11 is connected to the first light emitting chip 14. The chip pad 17 can increase the distance between the first light emitting chip 14 and the heat conductive substrate 11, avoiding the problem of local overheating of the heat conductive substrate 11 caused by direct contact of the light emitting chip 14 with the heat conductive substrate 11. In addition, heat generated from the light emitting chip 14 may be conducted to the heat conductive substrate 11 through the chip pad 17, thereby ensuring heat dissipation efficiency of the light emitting chip 14.

As shown in fig. 23, the first chip pad 171 is connected to the heat conductive substrate 11 through the support base 134.

As shown in fig. 20, the light emitting device 10 further includes a second chip pad 172. The second chip pad 172 is located on the supporting base 134, and a side of the second chip pad 172 away from the supporting base 134 is connected to the second light emitting chip 19. The function of the second chip pad 172 is similar to that of the first chip pad 171, and will not be described again.

For example, the connection manner between the converging lens 135 and the supporting surface 1341, and the connection manner between the first chip pad 171 or the second chip pad 172 and the heat conducting substrate 11 or the supporting base 134 may be glue bonding, mechanical fixing, sintering of sintered silver, welding or bonding, etc.

It should be noted that, in the embodiment of the disclosure, the thermally conductive substrate 11, the package case 12, the first chip pad 171, and the second chip pad 172 may be made of a thermally conductive material. For example, the material of the heat conductive substrate 11 may include a metal simple substance, an alloy material, silicon carbide, aluminum nitride, a ceramic material, a glass body, or the like. The material of the package housing 12 may include a metal material or a ceramic material. The material of the first and second die pads 171 and 172 may be silicon carbide, aluminum nitride, or silicon. In this way, the overall heat dissipation of the light emitting device 10 is facilitated.

In some embodiments, as shown in fig. 16, the light emitting device 10 further includes an optical device 18. The optical device 18 is connected to the package housing 12 and is located at the light outlet 121. The optical device 18 is configured to collimate, concentrate and/or homogenize the light beam at the light outlet 121. Illustratively, the optical device 18 includes at least one of a fly eye lens, an aspherical lens, a fresnel lens, a spherical mirror. For example, when the optical device 18 is a fly-eye lens, the optical device 18 is configured to homogenize the light beam at the light outlet 121.

In some embodiments, as shown in fig. 14, the light emitting device 10 further includes a driving circuit and pins 111. The drive circuit is configured to provide a drive current, which the pin 111 is configured to pass to the light emitting chip 14.

In summary, in the light emitting device 10 provided by the embodiment of the disclosure, the fluorescent portion 15 is disposed in the package housing 12, so that the fluorescent portion 15 only needs to bear the laser irradiation in one light emitting device 10, the energy of the laser transmitted to the fluorescent portion 15 is reduced, thereby reducing the probability of damage such as local burning, fire, etc. of the fluorescent portion 15, and improving the reliability of the light source assembly. Thus, on the premise of ensuring reliability, the reduction of components in the light source assembly 1 is realized, and the miniaturization design requirement of the laser projection device 1000 is met.

Claims

A laser projection device, comprising:

a light source assembly configured to provide an illumination beam;

an optical engine configured to modulate the illumination beam with an image signal to obtain a projection beam; and

a lens configured to project the projection beam into an image; wherein, the light source subassembly includes:

a thermally conductive substrate;

the packaging shell is connected with the heat conducting substrate and comprises a light outlet; the light outlet is positioned at one side of the packaging shell far away from the heat conducting substrate;

A first light emitting chip located in the package housing and connected with the heat conducting substrate and configured to emit a first laser beam;

the fluorescent part is positioned in the packaging shell and is connected with the heat conducting substrate; the fluorescent part is positioned at the light emitting side of the first light emitting chip and is configured to emit fluorescent light beams to the light emitting opening under the excitation action of at least part of light rays in the first laser beams; and

an optical path guiding assembly located within the package housing and configured to guide the first laser beam to the fluorescent portion;

at least part of light rays in the fluorescent light beam are emitted from the light outlet along a direction away from the heat conducting substrate so as to form at least part of light rays in the illumination light beam.
The laser projection device of claim 1, wherein a region of the thermally conductive substrate in contact with the phosphor portion is a reflective region;

the fluorescent part is configured to emit the fluorescent light beam under the excitation action of a part of light rays in the first laser light beam and transmit another part of light rays in the first laser light beam;

the reflection area is configured to reflect at least part of the other part of light rays towards the light outlet;

The at least part of the other part of light rays are emitted from the light outlet along the direction away from the heat conducting substrate so as to form the illumination light beam together with the at least part of light rays in the fluorescent light beam.
The laser projection device of claim 1 or 2, wherein the optical path guiding assembly comprises:

the first reflecting part is positioned in the packaging shell and is connected with the heat conducting substrate; the first reflecting portion is located between the first light emitting chip and the fluorescent portion, and is configured to guide the first laser beam to a second reflecting portion; and

the second reflecting portion is located in the packaging shell, connected with the packaging shell and configured to guide the first laser beam to the fluorescent portion.
A laser projection device as claimed in claim 3, wherein,

a first reflecting surface is arranged on one side, close to the first light emitting chip, of the first reflecting part, and the first reflecting surface is configured to reflect the first laser beam to the second reflecting part;

the second reflecting portion has a second reflecting surface on a side thereof adjacent to the fluorescent portion, and the second reflecting surface is configured to reflect the first laser beam toward the fluorescent portion.
The laser projection device of claim 4, wherein at least one of the first reflective surface and the second reflective surface is a curved reflective surface.
The laser projection device of claim 5, wherein the curved reflective surface is a parabolic reflective surface.
The laser projection device of claim 4, wherein,

the first reflecting part is also provided with a first bottom surface, and the first bottom surface is connected with the heat conducting substrate;

the second reflecting part is also provided with a second bottom surface, and the second bottom surface is connected with the packaging shell.
The laser projection device according to any one of claims 3 to 7, wherein the light source assembly includes two of the first light emitting chips, two of the first reflecting portions, and two of the second reflecting portions; the two first light emitting chips are respectively positioned at two sides of the fluorescent part, the two first reflecting parts are respectively positioned at two sides of the fluorescent part, and the two second reflecting parts are respectively positioned at two sides of the fluorescent part.
The laser projection device of claim 1 or 2, wherein the optical path guiding assembly comprises: the light combining part is positioned in the packaging shell and connected with the heat conducting substrate; the light combining part is positioned at one side of the fluorescent part far away from the first light emitting chip, and one side of the light combining part near the fluorescent part is provided with a reflecting surface; wherein,

The light reflecting surface is configured to reflect the first laser beam toward the fluorescent portion and to reflect at least part of light rays in the fluorescent beam toward the light outlet.
The laser projection device of claim 9, wherein a surface of the light combining portion connected to the thermally conductive substrate is a third bottom surface, a surface having the light reflecting surface is a plane, and a first angle between the third bottom surface and the plane is an obtuse angle.
The laser projection device of claim 9 or 10, wherein the orthographic projection of the fluorescent portion on the thermally conductive substrate is located within the orthographic projection of the light reflecting surface on the thermally conductive substrate.
The laser projection device of any of claims 9 to 11, wherein the light source assembly further comprises:

the second light-emitting chip is positioned in the packaging shell and connected with the heat conducting substrate; the second light emitting chip is positioned at one side of the light combining part far away from the fluorescent part and is configured to emit a second laser beam;

the light combining part is further configured to reflect at least part of light rays in the second laser beam to the light outlet;

the at least part of light rays in the second laser beam are emitted from the light outlet along the direction away from the heat conducting substrate so as to form at least part of light rays in the illumination beam together with at least part of light rays in the fluorescent beam.
The laser projection device of claim 12, wherein a side of the light combining portion adjacent to the second light emitting chip has a first anti-reflection film.
The laser projection device according to any one of claims 9 to 13, wherein a side of the light combining portion remote from the thermally conductive substrate has a second antireflection film.
The laser projection device of claim 1 or 2, wherein the optical path guiding assembly comprises: the supporting seat is positioned in the packaging shell and is connected with the heat conducting substrate; wherein,

the side, close to the fluorescent part, of the supporting seat is provided with a supporting surface, the side, close to the heat conducting substrate, is provided with a fourth bottom surface, and a second included angle between the supporting surface and the fourth bottom surface is an acute angle; the support surface is configured to connect to the first light emitting chip.
The laser projection device of claim 15, wherein the light source assembly further comprises:

a converging lens connected with the supporting surface and positioned between the first light-emitting chip and the fluorescent part; the converging lens is configured to converge the first laser beam onto the fluorescent portion.
The laser projection device of claim 16, wherein at least one of an end face of the converging lens near an end of the first light emitting chip and an end face of an end far from the first light emitting chip has a curved surface.
The laser projection device of claim 17, wherein the optical axis of the first laser beam is collinear with a normal at a center point of the curved surface.
The laser projection device of any of claims 15 to 18, wherein the light source assembly comprises two of the support bases and two of the first light emitting chips; the two supporting seats are respectively positioned at two sides of the fluorescent part, and the two first light-emitting chips are respectively positioned on the two supporting seats.
The laser projection device of any of claims 1 to 19, wherein the light source assembly further comprises:

the optical device is connected with the packaging shell and is positioned at the light outlet; the optical device is configured to at least one of collimate, converge, or homogenize the light beam at the light exit.