CN118435474A

CN118435474A - Laser projection device

Info

Publication number: CN118435474A
Application number: CN202280083106.5A
Authority: CN
Inventors: 周子楠; 田有良; 张昕; 卢瑶
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2021-12-28
Filing date: 2022-09-29
Publication date: 2024-08-02
Also published as: CN114336265A

Abstract

A laser projection device (1000) relates to the technical field of laser projection. The laser projection device (1000) comprises a light source assembly (1), an optical machine (2) and a lens (3). The light source assembly (1) is configured to provide an illumination beam; the light engine (2) is configured to modulate the illumination beam with an image signal to obtain a projection beam; the lens (3) is configured to project the projection beam into an image. The light source assembly (1) comprises a bottom plate (101), a frame body (102), a light combining component (104) and a plurality of light emitting chips (103). The frame body (102) is positioned on the bottom plate (101), and an accommodating space is defined between the bottom plate (101) and the frame body (102). The frame (102) is provided with a light outlet (K). A plurality of light emitting chips (103) are located in the accommodation space and configured to emit laser light in a plurality of directions. The light combining component (104) is positioned in the accommodating space and is configured to guide the laser light to the light outlet (K) so that the laser light is emitted out of the light outlet (K) along a direction parallel to the bottom plate (101) to form an illumination light beam.

Description

Laser projection device

The application claims the priority of the Chinese patent application with the application number 202111625797.0 which is submitted in the year 2021, 12 and 28, the priority of the Chinese patent application with the application number 202220518904.3 which is submitted in the year 2022, 03 and 09, and the priority of the Chinese patent application with the application number 202220508536.4 which is submitted in the year 2022, 03 and 09; the entire contents of which are incorporated by reference into the present disclosure.

Technical Field

The disclosure relates to the technical field of laser projection, in particular to laser projection equipment.

Background

The laser projection device comprises a light source assembly, an optical machine and a lens. The illumination light beam provided by the light source component is modulated by the optical machine to become a projection light beam, and the projection light beam is projected onto a screen or a wall by a lens to form a projection image. The laser of the light source assembly comprises a plurality of light emitting chips and a plurality of reflecting prisms corresponding to the light emitting chips. The plurality of light emitting chips are configured to emit laser light; the plurality of reflecting prisms are configured to reflect the laser light emitted from the corresponding light emitting chip to cause the laser light to emit the laser light, thereby constituting an illumination light beam.

Disclosure of Invention

In one aspect, some embodiments of the present disclosure provide a laser projection device. The laser projection device comprises a light source component, an optical machine and a lens. The light source assembly is configured to provide an illumination beam. The light engine is configured to modulate the illumination beam with an image signal to obtain a projection beam. The lens is configured to project the projection beam into an image.

The light source assembly comprises a bottom plate, a frame body, a light combining component and a plurality of light emitting chips. The frame body is located on the bottom plate, and an accommodating space is defined between the bottom plate and the frame body. The frame body is provided with a light outlet. The plurality of light emitting chips are located in the accommodation space and configured to emit laser light in a plurality of directions. The light combining component is positioned in the accommodating space and is configured to guide the laser to the light outlet so that the laser can be emitted out of the light outlet along a direction parallel to the bottom plate to form the illumination light beam.

In another aspect, other embodiments of the present disclosure provide a laser projection device. The laser projection device comprises a light source component, an optical machine and a lens. The light source assembly is configured to provide an illumination beam. The light engine is configured to modulate the illumination beam with an image signal to obtain a projection beam. The lens is configured to project the projection beam into an image.

The light source assembly comprises a bottom plate, a frame body, a converging part, a plurality of light emitting chips and a plurality of collimating lenses. The frame body is located on the bottom plate, and an accommodating space is defined between the bottom plate and the frame body. The frame body is provided with a light outlet. The plurality of light emitting chips are located in the accommodation space and configured to emit laser light. The laser emits the light outlet along the direction parallel to the bottom plate so as to form the illumination light beam. The plurality of collimating lenses correspond to the plurality of light emitting chips and are configured to collimate laser light emitted from the corresponding light emitting chips. The collimating lenses are respectively arranged on the light emitting sides of the corresponding light emitting chips. The converging component is arranged on one side of the light outlet far away from the accommodating space and is configured to converge the laser so as to reduce the size of a light spot of the laser. The front projection of the converging part on a plane perpendicular to the base plate covers the front projection of the plurality of collimating lenses on the plane.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that are required to be used in some embodiments of the present disclosure will be briefly described below, however, the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings for those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a block diagram of a laser projection device according to some embodiments;

FIG. 2 is a timing diagram of a light source assembly in a laser projection device according to some embodiments;

FIG. 3 is an optical path diagram in a laser projection device according to some embodiments;

FIG. 4 is a block diagram of a color filter assembly according to some embodiments;

FIG. 5 is a block diagram of a digital micromirror device according to some embodiments;

FIG. 6 is a diagram showing the position of a micro mirror plate wobble in the digital micromirror device of FIG. 5;

FIG. 7 is a schematic diagram of the operation of a micro-mirror plate according to some embodiments;

FIG. 8 is another block diagram of a laser projection device according to some embodiments;

fig. 9 is a structural diagram of a laser in the related art;

Fig. 10 is another structural diagram of a laser in the related art;

FIG. 11 is a block diagram of a laser according to some embodiments;

FIG. 12 is another block diagram of a laser according to some embodiments;

FIG. 13 is yet another block diagram of a laser according to some embodiments;

FIG. 14 is yet another block diagram of a laser according to some embodiments;

FIG. 15 is yet another block diagram of a laser according to some embodiments;

FIG. 16 is yet another block diagram of a laser according to some embodiments;

FIG. 17 is a cross-sectional view of the laser of FIG. 16 taken along line a-a';

FIG. 18 is another cross-sectional view of the laser of FIG. 16 taken along line a-a';

FIG. 19 is yet another block diagram of a laser according to some embodiments;

FIG. 20 is yet another block diagram of a laser according to some embodiments;

FIG. 21 is yet another block diagram of a laser according to some embodiments;

FIG. 22 is a cross-sectional view of a laser according to some embodiments;

FIG. 23 is yet another block diagram of a laser according to some embodiments;

FIG. 24 is a top view of a laser according to some embodiments;

fig. 25 is another top view of a laser according to some embodiments.

Reference numerals:

A laser projection device 1000;

A light source assembly 1; a laser 10; a bottom plate 101; a frame 102; a first sidewall 1021; a second sidewall 1022; a third sidewall 1023; a fourth side wall 1024; a light emitting chip 103; a first light emitting chip 1031; a second light emitting chip 1032; a first sub-light emitting chip 10321; a second sub-light emitting chip 10322; a light combining member 104; a first reflecting surface F1; a first transmission surface T1; a first combiner 1041; a first sub-reflecting surface F11; a first sub-transmission surface T11; a second light combining mirror 1042; a second sub-reflecting surface F21; a second sub-transmission surface T21; a first prism 1043; a second prism 1044; a collimator lens 105; a converging part 106; a polarization conversion section 107; a diffusion sheet 108; an upper cover assembly 109; a light-transmitting layer 110; a cover plate 111; conductive pins 112; a heat sink 113; an insulator 114; a combiner assembly 12; a light condensing unit 13; a color filter assembly 14; a green color filter 141; a blue color filter 142; a red color filter 143; a driving section 144;

a ray machine 2; a first shaping assembly 21; a second shaping assembly 22; a first transmission assembly 23; a digital micromirror device 24; a minute reflection plate 241; a light absorbing member 242; a second transmission assembly 25;

and a lens 3.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, however, the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments (some embodiments)", "exemplary embodiment (exemplary embodiments)", "example (example)", "specific example (some examples)", etc. are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, the expression "connected" and its derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

As used herein, "parallel", "perpendicular", "equal" includes the stated case as well as the case that approximates the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the range of acceptable deviations from approximately parallel may be, for example, deviations within 5 degrees; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be within 5 degrees of deviation, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

Some embodiments of the present disclosure provide a laser projection device. As shown in fig. 1, the laser projection device 1000 includes a light source assembly 1, a light machine 2, and a lens 3. The light source assembly 1 is configured to provide an illumination beam. The light engine 2 is configured to modulate an illumination beam provided by the light source assembly 1 with an image signal to obtain a projection beam. The lens 3 is configured to project a projection beam onto a screen or wall for imaging.

The light source assembly 1, the optical machine 2 and the lens 3 are sequentially connected along the light beam propagation direction. In some examples, one end of the light machine 2 is connected to the light source assembly 1, and the light source assembly 1 and the light machine 2 are disposed along an outgoing direction (refer to a direction M in fig. 1) of an illumination beam of the laser projection device 1000. The other end of the optical pickup 2 is connected to the lens 3, and the optical pickup 2 and the lens 3 are disposed along the emission direction (refer to the direction N in fig. 1) of the projection beam of the laser projection device 1000.

As shown in fig. 1, in some examples, the exit direction M of the illumination beam of the laser projection device 1000 is substantially perpendicular to the exit direction N of the projection beam of the laser projection device 1000. By such arrangement, the arrangement of the structure of the laser projection device 1000 can be reasonable, and the overlong light path of the laser projection device 1000 in a certain direction (for example, the direction M or the direction N) can be avoided.

In some embodiments, the light source assembly 1 may provide trichromatic light (i.e., red, green, and blue light) sequentially. In other embodiments, the light source assembly 1 may output three primary colors of light simultaneously to continuously emit white light. Of course, light other than the three primary colors of light, such as yellow light, may be included in the illumination light beam provided by the light source assembly 1. The light source assembly 1 comprises a laser which emits light of at least one color, such as blue laser light.

In some examples, as shown in fig. 2, the light source assembly 1 may output the blue, red, and green illumination light beams sequentially during projection of one frame of the target image. Illustratively, the light source assembly 1 outputs blue laser light in the first period t1, red laser light in the second period t2, and green laser light in the third period t 3. In this example, the time for which the light source module 1 completes one round of time-series output of each primary color light beam is one cycle of the output primary color light beam of the light source module 1. In the display period of one frame of target image, the light source assembly 1 performs a time sequence output of each primary color light beam, so that the display period of one frame of target image is equal to one period of the primary color light beam output by the light source assembly 1 and is equal to the sum of the first time period t1, the second time period t2 and the third time period t 3. In this example, the human eye color superimposes the sequentially output blue, red, and green light beams due to the persistence of vision, and thus perceived by the human eye as white light in which the three primary color light beams are mixed.

The following mainly refers to the accompanying drawings, and the structures of the light source assembly 1, the optical engine 2, and the lens 3 are described by way of example.

Referring to fig. 3, the light source assembly 1 includes: a laser 10, a light converging lens assembly 12, a light converging assembly 13, a color filter assembly 14 and a light homogenizing assembly 15. Wherein the laser 10 is configured to provide an illumination beam. The light converging lens assembly 12 is disposed on the light exit side of the laser 10 and is configured to reflect an illumination beam provided by the laser 10 to the light converging assembly 13. The condensing assembly 13 is disposed on the light-emitting side of the condensing lens assembly 12 and is configured to condense the illumination light beam from the condensing lens assembly 12. The color filter assembly 14 is disposed at the light emitting side of the light condensing assembly 13, and is configured to filter the illumination light beam condensed by the light condensing assembly 13 to sequentially output tri-primary color light. The light homogenizing component 15 is disposed on the light emitting side of the color filter component 14, and is configured to homogenize the illumination light beam filtered by the color filter component 14.

In some embodiments, the combiner assembly 12 may be a dichroic mirror. When the light source assembly 1 outputs the trichromatic light simultaneously or sequentially (i.e., the laser 10 outputs the trichromatic light simultaneously or sequentially), the light combining mirror assembly 12 can reflect the red laser light, the green laser light, and the blue laser light emitted from the laser 10 to the light condensing assembly 13.

In some embodiments, the condensing assembly 13 includes at least one plano-convex lens, and the convex surface of the at least one plano-convex lens faces the light-emitting direction of the light-converging lens assembly 12.

In some embodiments, as shown in fig. 4, the color filter assembly 14 may include a green color filter 141, a blue color filter 142, a red color filter 143, and a driving part 144. Wherein the driving part 144 is configured to drive the color filter assembly 14 to rotate, so that the illumination light beam emitted by the laser 10 is filtered by the color filters of different colors in the display period of one frame of the target image. In some examples, when laser 10 outputs trichromatic light simultaneously and color filter assembly 14 rotates to a position where red filter 143 covers the spot of the trichromatic light, the light beams of the trichromatic light other than the red light beam are blocked, and the red light beam transmits color filter assembly 14 through red filter 143.

In some embodiments, the light homogenizing component 15 may be a light pipe. The light guide can be a tubular device formed by splicing four plane reflecting sheets, namely, a hollow light guide. The illumination beam is reflected for multiple times inside the light guide pipe so as to achieve the effect of uniform light. Of course, the light homogenizing component 15 may also be a solid light pipe. For example, the light inlet and the light outlet of the light guide tube are rectangular with the same shape and area, the illumination light beam enters from the light inlet of the light guide tube and then is emitted from the light outlet of the light guide tube, and light beam homogenization and light spot optimization are completed in the process of passing through the light guide tube.

It should be noted that, when the light homogenizing component 15 is a light pipe, the light source component 1 includes the light pipe, and the light machine 2 may not be provided with the light pipe; when the light homogenizing element 15 is a component other than a light pipe, the light machine 2 further includes the light pipe for receiving the illumination beam from the light source element 1.

The illumination beam emitted by the light source assembly 1 enters the light machine 2. Referring to fig. 3, the optical machine 2 includes a digital micromirror device 24.

The digital micromirror device 24 is located at the light emitting side of the light source module 1, and is configured to modulate the illumination beam provided by the light source module 1 with an image signal to obtain a projection beam, and reflect the projection beam into the lens 3. The digital micro-mirror device 24 is also referred to as a light modulation device (or light valve) because the digital micro-mirror device 24 can control the projection beam to display different colors and brightness for different pixels of the image to be displayed to ultimately form the projected image. Furthermore, the light engine 2 may be classified as a single-chip system, a two-chip system, or a three-chip system depending on the number of digital micromirror devices 24 used in the light engine 2.

It should be noted that, since in some embodiments of the present disclosure, the optical engine 2 shown in fig. 3 applies a Digital Light Processing (DLP) projection architecture, the light modulation device in some embodiments of the present disclosure is a digital micromirror device (Digital Micromirror Device, DMD). However, the present disclosure does not limit the architecture, the type of the light modulation device, and the like to which the optical bench 2 is applied.

As shown in fig. 5, the digital micromirror device 24 includes thousands of tiny mirror plates 241 that can be individually driven to rotate, and the tiny mirror plates 241 are arranged in an array, each tiny mirror plate 241 corresponding to a pixel in an image to be displayed. As shown in fig. 6, in the DLP projection architecture, each micro mirror 241 corresponds to a digital switch, and can swing within a range of ±12 degrees or ±17 degrees under the action of an external force. Fig. 6 exemplifies that each minute reflection mirror 241 can swing within a range of ±12 degrees.

As shown in fig. 7, light reflected by the minute reflection mirror 241 at a negative deflection angle is called OFF light. The OFF light is inactive light. The light reflected by the minute reflection mirror 241 at a positive deflection angle is called ON light. The ON light is an effective light beam that the micro mirror 241 of the surface of the digital micromirror device 24 receives the illumination light beam and enters the lens 3 through a positive deflection angle for projection imaging. The on state of the micro mirror 241 is a state in which the micro mirror 241 is in a state in which the micro mirror 241 can be held, that is, a state in which the micro mirror 241 is at a positive deflection angle, when the illumination light beam emitted from the light source unit 1 is reflected by the micro mirror 241 and can enter the lens 3. The off state of the micro mirror 241 is a state in which the micro mirror 241 is maintained when the illumination beam emitted from the light source module 1 is reflected by the micro mirror 241 and does not enter the lens 3, that is, a state in which the micro mirror 241 is at a negative deflection angle.

In the display period of one frame image, part or all of the micro mirror plates 241 are switched between the on state and the off state at least once, so that gray scales of respective pixels in one frame image are realized according to the respective durations of the micro mirror plates 241 in the on state and the off state. Therefore, by controlling the state of each micro mirror 241 in the digital micromirror device 24 in the display period of one frame image and the maintenance time of each state by the image signal, the brightness (gray scale) of the corresponding pixel of the micro mirror 241 can be controlled, thereby modulating the illumination beam projected to the digital micromirror device 24.

In some embodiments, with continued reference to fig. 3, the optical bench 2 further comprises: a first shaping assembly 21, a second shaping assembly 22, a first transmission assembly 23 and a second transmission assembly 25. It should be noted that fewer or more components than are shown in fig. 3 may be included in the optical engine 2, which is not limited by the present disclosure.

In this embodiment, the first shaping assembly 21 is located at the light exit side of the light source assembly 1 and is configured to diffuse the illumination beam from the light source assembly 1. The second shaping element 22 is located at the light exit side of the first shaping element 21 and is configured to converge the illumination beam diffused through the first shaping element 21. The first transmission component 23 is located at the light emitting side of the second shaping component 22, and is configured to transmit the illumination beam converged by the second shaping component 22 to the second transmission component 25. The second transmission assembly 25 reflects the illumination beam to the dmd 24.

As shown in fig. 8, the lens 3 includes a plurality of lens combinations, and is generally divided into three sections of a front group, a middle group, and a rear group, or two sections of a front group and a rear group. The front group is a lens group near the light-emitting side of the laser projection device 1000 (i.e., the side of the lens 3 in the direction N away from the optical machine 2 in fig. 8), and the rear group is a lens group near the light-emitting side of the optical machine 2 (i.e., the side of the lens 3 in the direction N near the optical machine 2 in fig. 8).

In the related art, as shown in fig. 9 and 10, the laser 10 'includes a base plate 101', a frame 102', a plurality of light emitting chips 103', a plurality of reflecting prisms 104', a cover plate 105', a light transmitting layer 106', and a collimator lens group 107'. The frame 102' is disposed on the bottom plate 101', and a receiving space S ' is defined between the frame 102' and the bottom plate 101 '. A plurality of light emitting chips 103 'and a plurality of reflecting prisms 104' are located in the receiving space S 'and disposed on the base plate 101'. The cover plate 105' is located at a side of the frame body 102' away from the bottom plate 101', the light-transmitting layer 106' is located at a side of the cover plate 105' away from the accommodating space S ', and the collimating lens group 107' is located at a side of the light-transmitting layer 106' away from the accommodating space S '.

The plurality of reflection prisms 104' correspond to the plurality of light emitting chips 103', and are disposed on the light emitting side of the corresponding light emitting chips 103 '. The plurality of light emitting chips 103 'are configured to emit laser light in a direction parallel to the base plate 101', and the plurality of reflecting prisms 104 'are configured to reflect the laser light emitted from the corresponding light emitting chips 103' toward a direction away from the base plate 101 'so that the laser light is transmitted to the light transmitting layer 106'. The light-transmitting layer 106 'transmits the laser light so that the laser light is transmitted to the collimator lens set 107'. After the collimating lens group 107 'collimates the laser light, the laser light exits the laser 10' to form an illumination beam.

However, the inventors of the present disclosure studied to find: in the process of manufacturing the laser 10' by the method in the related art, the plurality of light emitting chips 103' and the corresponding reflecting prisms 104' are required to be aligned respectively and then attached to the bottom plate 101' respectively, so that the manufacturing difficulty of the laser 10' is high and the time consumption is long. In addition, mounting errors easily occur in the laser 10', resulting in misalignment of a portion of the light emitting chip 103' with the corresponding reflecting prism 104 '. In this case, some or all of the laser light emitted from the partial light emitting chip 103' is transmitted to the housing 102', and the laser 10' cannot be emitted. At this time, at least some of the laser light emitted from the plurality of light emitting chips 103 'in the laser 10' does not participate in the formation of the illumination beam. Therefore, the light extraction rate of the laser 10' is low.

As can be seen, the laser 10' in the related art has the problems of high manufacturing difficulty and low light extraction rate.

Based on the above technical problems, there are two possible improvements. One possible improvement is: the volume of the reflecting prism 104 'is increased to increase the area of the plane of the reflecting prism 104' for reflecting the laser light. In this way, even if a certain light emitting chip 103 'is not aligned with the corresponding reflecting prism 104', part of the light in the laser emitted by the light emitting chip 103 'may be reflected by the reflecting prism 104' in a direction away from the bottom plate 101', so that the proportion of the light in the illumination beam may be increased, and the light extraction rate of the laser 10' may be improved. In addition, the manufacturing precision requirement of the laser 10 'can be reduced, so that the manufacturing difficulty of the laser 10' is reduced.

However, the possible modifications described above are disadvantageous for the compact design of the laser 10 'due to the increased volume of the reflecting prism 104'.

Another possible improvement is: the light emitting directions of the plurality of light emitting chips 103' are changed so that the plurality of light emitting chips 103' emit laser light in a direction away from the base plate 101 '. In this way, the laser 10 'does not need to design a plurality of reflecting prisms 104', and the manufacturing process of the laser 10 'does not need to align a plurality of light emitting chips 103' and a plurality of reflecting prisms 104', so that the manufacturing difficulty of the laser 10' can be reduced. In addition, the problem of the decrease of the light extraction rate of the laser 10 'caused by the misalignment of the light emitting chip 103' and the corresponding reflecting prism 104 'is avoided, and the light extraction rate of the laser 10' can be improved.

However, when the plurality of light emitting chips 103 'are caused to emit laser light in a direction away from the base plate 101', the opposite side of the light emitting side of the plurality of light emitting chips 103 'is fixed to the base plate 101'. As shown in fig. 9, since the area of the opposite side of the light emitting chip 103 'is small, the reliability of the laser 10' is low due to the poor stability of the light emitting chip 103 'fixed to the base plate 101' by the opposite side.

In view of the technical problems in the related art and the possible improvements, some embodiments of the present disclosure provide a laser projection device 1000, which can reduce the manufacturing difficulty of the laser 10 'and improve the light extraction rate of the laser 10' on the premise of facilitating the miniaturization design of the laser 10 'and ensuring the reliability of the laser 10'.

As shown in fig. 11, the laser 10 in the laser projection device 1000 includes a chassis 101, a frame 102, a light combining member 104, and a plurality of light emitting chips 103.

The frame 102 is disposed on the bottom plate 101, and a receiving space S is defined between the bottom plate 101 and the frame 102. The frame 102 has a light outlet K. The plurality of light emitting chips 103 are located in the accommodation space S and configured to emit laser light in a plurality of directions. The light combining member 104 is located in the accommodation space S and configured to guide laser light to the light outlet K so that the laser light exits the light outlet K in a direction parallel to the bottom plate 101 to constitute an illumination light beam. For example, the laser light may be emitted from the light outlet K on one side of the housing 102.

In the laser projection device 1000 provided in the embodiment of the present disclosure, the frame 102 of the laser 10 is provided with the light outlet K, so that the laser light emitted by the plurality of light emitting chips 103 can be emitted out of the light outlet K along the direction parallel to the bottom plate 101 to form the illumination beam. In this way, the laser emitted by the corresponding light emitting chip 103 is not required to be reflected to the light outlet K by the reflecting prism, so that a plurality of reflecting prisms are avoided being arranged in the laser 10, the number of components in the laser 10 is reduced, and the miniaturization design of the laser 10 is facilitated. In addition, since a plurality of reflecting prisms are not required to be arranged in the laser 10, a plurality of light emitting chips 103 and a plurality of reflecting prisms are not required to be aligned in the manufacturing process of the laser 10, the manufacturing difficulty of the laser 10 is reduced, and the production efficiency of the laser 10 is improved. In addition, the problem of reduced light output of the laser 10 caused by misalignment of the light emitting chip 103 and the corresponding reflecting prism is avoided, the light output of the laser 10 is improved, and the brightness of the illumination beam is increased, so that the display effect of the projection image displayed by the laser projection device 1000 is improved. In addition, by providing the light combining member 104 in the accommodation space S, the plurality of light emitting chips 103 in the laser 10 can be provided at different positions in the accommodation space S and emit laser light in different directions, and the space utilization of the accommodation space S can be improved. That is, without increasing the volume of the laser 10, more light emitting chips 103 can be provided in the laser 10, thereby further increasing the brightness of the illumination beam and facilitating the miniaturization design of the laser 10.

The frame 102 may be formed of four sidewalls, which are opposite to each other. At this time, other components for defining the accommodation space S in common are also included in the laser 10, and the structure of the other components will be described in the following embodiments. Or the frame 102 may be formed of the four side walls and an upper cover plate, the edge of which is connected to the side of the four side walls remote from the bottom plate 101. The upper cover plate is not shown in fig. 11 for ease of illustration of the internal structure of the laser 10.

The light outlet K may be an opening penetrating the housing 102, or may be a partial region of the housing 102 through which laser light can pass. When the frame 102 is formed by four side walls and an upper cover plate, and the light outlet K is a partial area of the frame 102 through which laser light can pass, the frame 102 and the bottom plate 101 can jointly close the accommodation space S, so that the plurality of light emitting chips 103 can be prevented from being corroded by water, oxygen and the like, the service lives of the plurality of light emitting chips 103 can be prolonged, and the reliability of the laser 10 can be improved.

The closed accommodation space S described above allows for assembly errors. That is, the closed accommodation space S does not require absolute sealing.

In some embodiments, the color of the laser light emitted by the plurality of light emitting chips 103 is the same. In this embodiment, the laser 10 is a monochromatic laser.

In other embodiments, the laser light emitted by the light emitting chips 103 includes at least two different colors of light. In this embodiment, the laser 10 is a polychromatic laser.

In some embodiments, as shown in fig. 12 and 13, a plurality of light emitting chips 103 are disposed on the base plate 101. The first light emitting chip 1031 is configured to emit first laser light toward the light outlet K, and the second light emitting chip 1032 is configured to emit second laser light toward the inside of the accommodation space S.

In some examples, referring to fig. 13, the frame 102 includes a first sidewall 1021, a second sidewall 1022, a third sidewall 1023, and a fourth sidewall 1024. The second side wall 1022 is opposite the first side wall 1021. The third sidewall 1023 is connected to a side of the first sidewall 1021 away from the light outlet and a side of the second sidewall 1022 away from the light outlet. The fourth side wall 1024 is connected to a side of the first side wall 1021 near the light outlet and a side of the second side wall 1022 near the light outlet, and the light outlet K penetrates at least a portion of the fourth side wall 1024.

When the light outlet K penetrates through the entire fourth side wall 1024, as shown in fig. 12, the frame 102 includes a first side wall 1021, a second side wall 1022, and a third side wall 1023, and the light outlet K is defined between the first side wall 1021 and the second side wall 1022.

The first light emitting chip 1031 is located between the light combining member 104 and the third sidewall 1023, and the second light emitting chip 1032 is located between the light combining member 104 and at least one of the first sidewall 1021 or the second sidewall 1022. In this embodiment, the light combining member 104 is configured to transmit the first laser light toward the light outlet K and reflect the second laser light toward the light outlet K.

Fig. 12 illustrates an example in which the light emitting direction of the first light emitting chip 1031 is perpendicular to the light emitting direction of the second light emitting chip 1032. The light emitting direction of the first light emitting chip 1031 and the light emitting direction of the second light emitting chip 1032 may be at other angles.

The structure of the light combining member 104 will be exemplarily described below with reference to the drawings.

In some embodiments, the light combining means 104 is a light combining mirror. The combiner may be, for example, a dichroic mirror.

With continued reference to fig. 12, the light combining member 104 includes a first reflecting surface F1 and a first transmitting surface T1. The first reflecting surface F1 is a surface of the light combining member 104 facing the light emitting side of the second light emitting chip 1032, and is configured to reflect the second laser light toward the light emitting opening K. The first transmission surface T1 is a surface of the light combining member 104 facing the light emitting side of the first light emitting chip 1031, and is configured to transmit the first laser light toward the light emitting opening K.

Because the volume of the light converging lens is small, when the light converging component 104 is the light converging lens, the volume of the accommodating space S can be saved, which is beneficial to the miniaturization design of the laser 10. Or when the size of the laser 10 is not changed, the light combining lens is adopted as the light combining component 104, so that the distance between the components in the laser 10 can be increased, the heat dissipation of the components is facilitated, and the service lives of the light emitting chips 103 are prolonged.

Illustratively, the front projection of the first reflecting surface F1 on the first sidewall 1021 may cover the front projection of the second light emitting chip 1032 on the first sidewall 1021; the orthographic projection of the first transmissive surface T1 on the third sidewall 1023 may cover the orthographic projection of the first light emitting chip 1031 on the third sidewall 1023. In this way, the beam combiner can make more light rays in the first laser and the second laser output the light outlet K, so as to increase the number of light rays in the illumination beam and improve the light output rate of the laser 10.

In other embodiments, the light combining component 104 is a prism assembly.

Referring to fig. 13, the light combining member 104 includes a first prism 1043 and a second prism 1044. The first prism 1043 is disposed at the light emitting side of the first light emitting chip 1031, the second prism 1044 is disposed at the light emitting side of the second light emitting chip 1032, and the first prism 1043 is in contact with the second prism 1044. The contact surface J of the first prism 1043 and the second prism 1044 is configured to transmit the first laser light toward the light outlet K and reflect the second laser light toward the light outlet K.

Since the contact areas of the first prism 1043 and the second prism 1044 with the base plate 101 are large, when the light combining member 104 is a prism assembly, the stability of the light combining member 104 can be improved, thereby improving the reliability of the laser 10.

Illustratively, the orthographic projection of the contact surface J on the first sidewall 1021 may cover the orthographic projection of the second light emitting chip 1032 on the first sidewall 1021; the orthographic projection of the contact surface J on the third sidewall 1023 may cover the orthographic projection of the first light emitting chip 1031 on the third sidewall 1023. In this way, the prism assembly can make more light rays in the first laser light and the second laser light output from the light outlet K, so as to improve the light output rate of the laser 10.

In the above two embodiments, the second light emitting chip 1032 is located between the light combining member 104 and the first sidewall 1021 or the second sidewall 1022.

In still other embodiments, the light combining component 104 is a light combining lens assembly. For example, referring to fig. 14 to 16, the light combining part 104 includes a first light combining mirror 1041 and a second light combining mirror 1042. The first light combining mirror 1041 and the second light combining mirror 1042 intersect. The first combiner 1041 is configured to reflect a portion of the second laser light toward the light exit K, and the second combiner 1042 is configured to reflect another portion of the second laser light toward the light exit K.

Thus, the light combining member 104 can reflect laser light from a plurality of directions to the light emitting port K, so that more light emitting chips 103 can be provided on different sides of the light combining member 104, and further, the brightness of the illumination light beam emitted from the light emitting port K can be increased, and the display effect of the projection image can be improved.

The structures of the first light combining mirror 1041 and the second light combining mirror 1042 will be exemplarily described below mainly in connection with the arrangement of the second light emitting chip 1032.

Referring to fig. 14, the second light emitting chip 1032 is positioned between the light combining member 104 and the first sidewall 1021, and between the light combining member 104 and the second sidewall 1022.

In some examples, the color of the laser light emitted by the second light emitting chip 1032 is the same.

In this example, the first light combining mirror 1041 is configured to reflect laser light emitted from the second light emitting chip 1032 between the light combining member 104 and the first sidewall 1021 toward the light emitting opening K, and the second light combining mirror 1042 is configured to reflect laser light emitted from the second light emitting chip 1032 between the light combining member 104 and the second sidewall 1022 toward the light emitting opening K.

In other examples, the laser light emitted by the second light emitting chip 1032 includes at least two different colors of light. The second light emitting chip 1032 exemplarily includes a first sub light emitting chip 10321 and a second sub light emitting chip 10322. The first sub-light emitting chip 10321 is configured to emit a first sub-laser light of the second laser light, and the second sub-light emitting chip 10322 is configured to emit a second sub-laser light of the second laser light. The first sub-laser may be, for example, a green laser and the second sub-laser may be, for example, a blue laser. In this example, the first and second light combining mirrors 1041 and 1042 are configured to reflect the first and second sub-lasers toward the light exit K.

In this example, a first sub light emitting chip 10321 and a second sub light emitting chip 10322 may be disposed between the light combining member 104 and the first sidewall 1021; the first and second sub light emitting chips 10321 and 10322 may be disposed between the light combining member 104 and the second sidewall 1022. In this way, in the case where the number of the second light emitting chips 1032 disposed between the light combining member 104 and the first sidewall 1021 is equal to the number of the second light emitting chips 1032 disposed between the light combining member 104 and the second sidewall 1022, the number of the first sub light emitting chips 10321 and the number of the second sub light emitting chips 10322 may not be identical, so that the proportion of the first sub laser light or the second sub laser light in the illumination light beam emitted by the laser 10 may be flexibly adjusted, so as to adjust the intensity of the laser light of different colors in the illumination light beam.

Or referring to fig. 14, the first sub-light emitting chip 10321 is disposed between the light combining member 104 and one of the first sidewall 1021 or the second sidewall 1022, and the second sub-light emitting chip 10322 is disposed between the light combining member 104 and the other of the first sidewall 1021 or the second sidewall 1022. That is, the first sub-light emitting chip 10321 is configured to emit the first sub-laser light in a first direction (e.g., direction z in fig. 14), and the second sub-light emitting chip 10322 is configured to emit the second sub-laser light in a second direction (e.g., direction opposite to direction z in fig. 14). The second direction is the opposite direction of the first direction. In this way, the propagation path of the first sub-laser transmitted from the first sub-light emitting chip 10321 to the light outlet K does not intersect or overlap with the propagation path of the second sub-laser transmitted from the second sub-light emitting chip 10322 to the light outlet K, so that the first sub-laser and the second sub-laser can be prevented from interfering with each other, thereby improving the quality of the illumination beam.

In some examples, as shown in fig. 14, the first light combining mirror 1041 includes a first sub-reflecting surface F11, where the first sub-reflecting surface F11 is a surface of the first light combining mirror 1041 facing the light emitting side of the first sub-light emitting chip 10321. The first sub-reflecting surface F11 is configured to reflect the first sub-laser light toward the light outlet K.

The second light combining mirror 1042 includes a second sub-reflecting surface F21, and the second sub-reflecting surface F21 is a surface of the second light combining mirror 1042 facing the light emitting side of the second sub-light emitting chip 10322. The second sub-reflecting surface F21 is configured to reflect the second sub-laser light toward the light outlet K. Illustratively, the second sub-reflecting surface F21 intersects the first sub-reflecting surface F11.

In other examples, as shown in fig. 15 and 16, the first light combining mirror 1041 further includes a first sub-transmission surface T11, where the first sub-transmission surface T11 is a surface of the first light combining mirror 1041 facing the light emitting side of the second sub-light emitting chip 10322. The first sub-transmission surface T11 is configured to transmit the second sub-laser light so that the second sub-laser light is transmitted to the second sub-reflection surface F21.

The second light combining mirror 1042 further includes a second sub-transmission surface T21, and the second sub-transmission surface T21 is a surface of the second light combining mirror 1042 facing the light emitting side of the first sub-light emitting chip 10321. The second sub-transmission surface T21 is configured to transmit the first sub-laser light so that the first sub-laser light is transmitted to the first sub-reflection surface F11.

As shown in fig. 15, the laser 10 in the above embodiment includes the second light emitting chip 1032, and does not include the first light emitting chip 1031. In this case, the first and second light combining mirrors 1041 and 1042 are configured to reflect the first and second sub-lasers toward the light outlet K. Or as shown in fig. 14 and 16, the laser 10 includes a first light emitting chip 1031 in addition to a second light emitting chip 1032. In this case, the first light combining mirror 1041 and the second light combining mirror 1042 are further configured to transmit the first laser light so that the first laser light is transmitted to the light outlet K.

In some embodiments, the first laser light is transmitted to the light combining member 104 to form a first light spot, and the second laser light is transmitted to the light combining member 104 to form a second light spot. The first spot overlaps the second spot.

In this embodiment, at the overlapping position of the first light spot and the second light spot, the laser light of different colors is transmitted to the light outlet K by the light combining part 104 in the same path. Thus, the illumination beam emitted from the overlapping portion is a mixed beam of the first laser light and the second laser light, and the brightness of the illumination beam can be improved, thereby improving the display effect of the projection image.

In some examples, the first spot overlaps the second spot. In this way, in addition to the higher brightness, since the light rays are mixed light beams of the first laser light and the second laser light everywhere in the illumination light beam, the uniformity of the illumination light beam is higher.

In some embodiments, as shown in fig. 17, the bottom plate 101 includes a first region Q1 and a second region Q2, the second region Q2 surrounding the first region Q1. The plurality of light emitting chips 103 are disposed in the first region Q1, and the first region Q1 is protruded with respect to the second region Q2. In this way, in the direction perpendicular to the bottom plate 101, the optical axes of the laser light emitted from the plurality of light emitting chips 103 in this embodiment are closer to the middle position of the light exit K. Since the laser light emitted from the plurality of light emitting chips 103 has a certain divergence angle, the embodiment can increase the proportion of the light rays emitted from the light emitting port K and constituting the illumination light beam among the laser light emitted from the plurality of light emitting chips 103, thereby improving the light emitting rate of the laser 10.

In this embodiment, a side of the frame 102 near the bottom plate 101 may be fixed to the second region Q2 of the bottom plate 101, and a side of the frame 102 facing the receiving space S may be fixed to the side C1 formed by protruding the first region Q1. In this way, the contact area between the frame 102 and the chassis 101 is large, and the stability of the connection between the frame 102 and the chassis 101 can be improved, thereby improving the reliability of the laser 10.

In other embodiments, as shown in fig. 18, a side area of the second area Q2 near the light exit K and the first area Q1 are recessed with respect to other side areas of the second area Q2.

In this embodiment, a side of the frame 102 close to the bottom plate 101 may be fixed to the first region Q1 of the bottom plate 101, and a side of the frame 102 away from the accommodation space S may be fixed to the side C2 of the other side region of the second region Q2. In this way, the other side region of the second region Q2 may wrap the housing 102, thereby protecting the housing 102. In addition, the side area of the second area Q2 near the light outlet K is recessed relative to the other side areas of the second area Q2, so that the laser light emitted from the light outlet K can be ensured not to be blocked, and the light outlet rate of the laser 10 can be improved.

In some embodiments, as shown in fig. 19, the laser 10 further includes a plurality of collimating lenses 105. The plurality of collimator lenses 105 correspond to the plurality of light emitting chips 103, and are configured to collimate the laser light emitted from the corresponding light emitting chips 103.

In some examples, the plurality of collimating lenses 105 are separate pieces, and the plurality of collimating lenses 105 are disposed on the light emitting sides of the corresponding light emitting chips 103, respectively. The collimating lens 105 can collimate the laser light with a certain divergence angle into a parallel beam, so that the light rays in the laser light are more concentrated, and more light rays in the laser light can be ensured to be emitted out of the accommodating space S along the direction parallel to the bottom plate 101, and the light emitting rate of the laser 10 is improved.

In other examples, the plurality of collimating lenses 105 are one piece, and the plurality of collimating lenses 105 are disposed on a side of the light outlet K away from the accommodating space S.

Illustratively, as shown in fig. 20, in the case where the first region Q1 is flat, the optical axes of the laser light emitted from the plurality of light emitting chips 103 are in the same plane, and therefore, the plurality of collimator lenses 105 are arranged in a row and a plurality of columns. Any one of the collimator lenses 105 collimates the laser light emitted from the at least one light emitting chip 103.

Alternatively, as shown in fig. 21, when the first region Q1 has the first sub-region Q11 protruding from the second sub-region Q12, the optical axes of the laser light emitted from the plurality of light emitting chips 103 are positioned in a plurality of planes, and therefore, the plurality of collimator lenses 105 are arranged in a plurality of rows and a plurality of columns.

Taking the example that the first region Q1 has one first sub-region Q11, the plurality of collimator lenses 105 are arranged in two rows and a plurality of columns. Of the two or more rows of collimator lenses 105, a row of collimator lenses 105 distant from the base plate 101 corresponds to the light emitting chips 103 in the first sub-region Q11, and a row of collimator lenses 105 close to the base plate 101 corresponds to the light emitting chips 103 in the second sub-region Q12.

In some embodiments, as shown in fig. 17, the laser 10 further includes a cap assembly 109. The upper cover assembly 109 is secured to the side of the frame 102 remote from the base plate 101. In this way, in the direction perpendicular to the bottom plate 101, protection can be provided for the respective components provided in the accommodation space S.

In some examples of this embodiment, with continued reference to fig. 17, the light source assembly 1 further includes a light transmissive layer 110, an edge of the light transmissive layer 110 being fixed to an edge of the light exit K. In this way, the plurality of light emitting chips 103 can be placed in the closed accommodation space S, so that the plurality of light emitting chips 103 can be prevented from being corroded, thereby improving the reliability of the laser 10.

In other examples of this embodiment, referring to fig. 18, the light source assembly 1 includes a cover plate 111 in addition to the light-transmitting layer 110. The cover 111 is annular, the outer edge of the cover 111 is fixed to the edge of the light outlet K, and the inner edge of the cover 111 is fixed to the edge of the light-transmitting layer 110. In this way, the cover plate 111 and the light-transmitting layer 110 together enclose the accommodation space S.

In both of the above examples, in the case where the plurality of collimator lenses 105 are disposed on the side of the light outlet K away from the accommodation space S, the plurality of collimator lenses 105 may be fixed to the side of the light-transmitting layer 110 away from the accommodation space S.

Some embodiments of the present disclosure also provide another laser projection device 1000. Unlike the above-described embodiment, as shown in fig. 22, the laser 10 of the laser projection apparatus 1000 includes a plurality of collimator lenses 105 and converging members 106 in addition to the above-described base plate 101, frame 102, and plurality of light emitting chips 103.

The plurality of collimator lenses 105 correspond to the plurality of light emitting chips 103, and are configured to collimate the laser light emitted from the corresponding light emitting chips 103. The plurality of collimator lenses 105 are respectively disposed on the light-emitting sides of the corresponding light-emitting chips 103. The collimating lens 105 can collimate the laser light with a certain divergence angle into a parallel beam, so that the light rays in the laser light are more concentrated, and more light rays in the laser light can be ensured to be emitted out of the accommodating space S along the direction parallel to the bottom plate 101, and the light emitting rate of the laser 10 is improved.

The laser 10 also includes a converging component 106. The converging member 106 is disposed at a side of the light outlet K away from the accommodation space S, and is configured to converge laser light. The front projection of the converging part 106 on a plane perpendicular to the base plate 101 covers the front projection of the plurality of collimator lenses 105 on this plane. In this way, the laser light collimated by the plurality of collimating lenses 105 and emitted out of the accommodating space S may be converged by the converging component 106 and emitted out of the laser 10, so as to reduce the size of the spot of the illumination beam, thereby reducing the volume of other components in the laser projection device 1000 that need to process the illumination beam, and further facilitating the miniaturization design of the laser projection device 1000.

The structure of the base plate 101 will be exemplarily described below mainly with reference to the drawings.

In some embodiments, with continued reference to fig. 18, the first region Q1 is flat. In this way, the flatness of the bottom plate 101 is high, the structure of the bottom plate 101 is simple, the manufacturing process of the laser 10 is simplified, and the manufacturing efficiency of the laser 10 is improved.

The first region Q1 is flat, and the first region Q1 is not required to be absolutely flat, and may have a curvature, a dent, or the like due to a machining error or the like.

In other embodiments, as shown in fig. 23, the first region Q1 includes a first sub-region Q11 and a second sub-region Q12. The first sub-region Q11 is raised relative to the second sub-region Q12. Some of the plurality of light emitting chips 103 are disposed in the first sub-region Q11, and another part of the light emitting chips 103 are disposed in the second sub-region Q12.

In this way, the propagation path of a part of the laser light emitted from the light emitting chip 103 disposed in the first sub-region Q11 does not intersect or overlap with the propagation path of another part of the laser light emitted from the light emitting chip 103 disposed in the second sub-region Q12, and the interference between the part of the laser light and the another part of the laser light can be avoided, thereby improving the quality of the illumination light beam. In addition, the above-mentioned one part of light emitting chips 103 and the other part of light emitting chips 103 are arranged on different planes, so that the heat dissipation areas of the two parts of light emitting chips 103 are not overlapped, the probability of damage of the plurality of light emitting chips 103 due to overheat during operation can be reduced, and the reliability of the laser 10 can be improved.

Note that, the above-described part of the light emitting chip 103 and the other part of the light emitting chip 103 may include one light emitting chip 103 or may include a plurality of light emitting chips 103. Fig. 23 exemplifies that the one part of the light emitting chips 103 includes one kind of light emitting chip 103 (first light emitting chip 1031) and that the other part of the light emitting chips 103 includes one kind of light emitting chip 103 (second light emitting chip 103).

In addition, taking the direction z as the row direction and the direction x as the column direction in fig. 23 as an example, a part of the light emitting chips 103 in the first sub-region Q11 may be arranged in one row or a plurality of columns as shown in fig. 23, or may be arranged in a plurality of rows or a plurality of columns. For example, in the case where the light emitting chips 103 are arranged in two or more rows, one row of the light emitting chips 103 relatively far from the light outlet K may be aligned with the arrangement gap of the other row of the light emitting chips 103, so as to avoid the laser light emitted from the one row of the light emitting chips 103 from being blocked by the other row of the light emitting chips 103, thereby ensuring the light output rate of the laser 10. The arrangement gap refers to a gap between two light emitting chips 103 that are in the same row and are adjacent to each other.

Similarly, taking the direction z in fig. 23 as the row direction and the direction x as the column direction as an example, another part of the light emitting chips 103 in the second sub-region Q12 may be arranged in one row and multiple columns as shown in fig. 23, or may be arranged in multiple rows and multiple columns. For example, in a case where the other portion of the light emitting chips 103 are arranged in two or more rows, one row of the light emitting chips 103 may be aligned with an arrangement gap of the other row of the light emitting chips 103.

In some examples, as shown in fig. 22, the first region Q1 includes a plurality of first sub-regions Q11. The height of the first subarea Q11 close to the light outlet K relative to the second subarea Q12 in the adjacent two first subareas Q11 is smaller than the height of the first subarea Q11 far from the light outlet K relative to the second subarea Q12. In this way, the laser emitted by at least one light emitting chip 103 in the first sub-region Q11 far away from the light outlet K in the two adjacent first sub-regions Q11 is not blocked by at least one light emitting chip 103 in the first sub-region Q11 near the light outlet K, so that the accommodating space S can be emitted, thereby being beneficial to improving the light outlet rate of the laser 10.

At least one light emitting chip 103 of a part of the light emitting chips 103 is provided in any one of the first sub-regions Q11. In this way, more light emitting chips 103 can be provided in the direction perpendicular to the bottom plate 101 (for example, the direction y in fig. 22), thereby improving the utilization of the accommodation space S, facilitating the miniaturization design of the laser 10.

Illustratively, the color of the laser light emitted from at least one light emitting chip provided in any one of the first sub-regions Q11 is the same. Further, among the plurality of first sub-regions Q11, the color of the laser light emitted from at least one light emitting chip 103 provided in a different first sub-region Q11 is different. Like this, the light path of the laser of different colours is located accommodation space S' S different planes respectively, can avoid the mutual interference between the laser of different colours to promote the quality of illumination light beam.

In some embodiments, as shown in fig. 24, the light source assembly 1 further comprises a polarization conversion component 107, the polarization direction of the first laser light being perpendicular to the polarization direction of the second laser light. The polarization conversion member 107 is located in the accommodation space S and configured to change at least one of a polarization direction of the first laser light or a polarization direction of the second laser light so that the polarization direction of the first laser light is the same as the polarization direction of the second laser light.

Since the transmission rates of the laser light with different polarization directions are different when transmitting through other optical components (for example, the lens 3) in the laser projection device 1000, if the illumination beam provided by the laser 10 includes laser light with multiple polarization directions, the illumination beam is modulated by the optical machine 2 and projected by the lens 3, and then color spots, color patches and the like appear in the projected image, so that the display effect is poor. In the above-described embodiment, since the polarization direction of the first laser light is perpendicular to the polarization direction of the second laser light, by providing the polarization conversion member 107, the first laser light and the second laser light can be made to have the same polarization direction. Therefore, the polarization directions of the light rays in the illumination light beams are consistent, so that the transmittance of the transmission optical component of the illumination light beams is consistent, color spots, color blocks and the like in the projection image displayed by the laser projection equipment 1000 are avoided, and finally the display effect of the projection image is improved.

Taking the example that the first light emitting chip 1031 is configured to emit the first laser light toward the light outlet K, and the second light emitting chip 1032 is configured to emit the second laser light toward the light outlet K, in some examples, the polarization conversion component 107 includes a half-wave plate.

With continued reference to fig. 24, the half-wave plate is located between the first light emitting chip 1031 and the light outlet K and is configured to rotate the polarization direction of the first laser light by 90 degrees. The front projection of the half-wave plate on a plane perpendicular to the bottom plate 101 covers the front projection of the collimator lens 105 corresponding to the first light emitting chip 1031 on the plane. And, the front projection of the half-wave plate on the plane and the front projection of the collimator lens 105 corresponding to the second light emitting chip 1032 on the plane do not overlap.

In this way, the polarization conversion element 107 can rotate the polarization direction of the first laser light by 90 degrees without changing the polarization direction of the second laser light so that the polarization direction of the first laser light exiting the accommodation space S coincides with the polarization direction of the second laser light.

Or the half-wave plate may be located between the second light emitting chip 1032 and the light outlet K and configured to rotate the polarization direction of the second laser light by 90 degrees without changing the polarization direction of the first laser light.

In other examples, the polarization conversion component 107 includes a quarter wave plate between the plurality of light emitting chips 103 and the light exit K. The quarter wave plate is configured to rotate the polarization direction of the first laser light by 45 degrees and to rotate the polarization direction of the second laser light by 45 degrees.

In some embodiments, as shown in fig. 25, the laser 10 further includes a diffuser 108. The diffusion sheet 108 is located in the accommodation space S and is disposed between the plurality of light emitting chips 103 and the light outlet K. For example, in the case where the laser 10 includes the polarization conversion member 107, the diffusion sheet 108 is provided between the polarization conversion member 107 and the light outlet K. The diffuser 108 is configured to homogenize the laser light. Thus, the laser light emitted by the light emitting chips 103 can be homogenized by the diffusion sheet 108 and then emitted out of the laser 10, so that the quality of the illumination beam can be improved. In addition, in the case where the diffusion sheet 108 is provided in the laser 10, the first shaping assembly 21 in the optical bench 2 may be omitted, thereby reducing the number of components in the optical bench 2, which is advantageous for the compact design of the laser projection apparatus 1000.

In some embodiments, as shown in fig. 17, the laser 10 further includes a cap assembly 109 and a light transmissive layer 110. In other embodiments, as shown in fig. 18, the laser 10 further includes a cap assembly 109, a light transmissive layer 110, and a cover plate 111.

It should be noted that, the structure of the upper cover assembly 109, the light-transmitting layer 110 or the cover 111 may refer to the foregoing embodiments, and will not be described herein again.

In some embodiments, as shown in fig. 24 and 25, the laser 10 further includes a plurality of conductive pins 112. The frame 102 includes a plurality of side walls, wherein the first side wall 1021 is disposed opposite to the second side wall 1022. The first sidewall 1021 and the second sidewall 1022 include a plurality of openings, through which the plurality of conductive pins 112 extend into the accommodating space S and are fixed in the plurality of openings. Illustratively, one aperture corresponds to one conductive pin 112. The plurality of conductive pins 112 are configured to be electrically connected with electrodes of at least one light emitting chip 103 of the plurality of light emitting chips 103 to transmit current to the at least one light emitting chip 103 through an external power source to power the at least one light emitting chip 103.

In other embodiments, as shown in fig. 21 and 23, the laser 10 further includes a plurality of insulators 114. The plurality of insulators 114 extend through at least one sidewall of the housing 102. Illustratively, the end of the at least one sidewall adjacent the base plate 101 has a plurality of indentations, with an insulator 114 filling in one indentation. The insulator 114 includes a first portion surrounded by a sidewall of the housing 102, and a second portion located outside the sidewall. The side of the first portion remote from the base plate 101 has a bare conductive layer for electrically connecting with the electrodes of at least one light emitting chip 103 of the plurality of light emitting chips 103 by wires, thereby powering the at least one light emitting chip 103. The insulator 114 may bear the weight of the conductive layer and may isolate the conductive layer from other components, avoiding the influence of other components on the conductive effect of the conductive layer.

In some embodiments, as shown in fig. 23 and 24, the laser 10 further includes a plurality of heat sinks 113. The plurality of heat sinks 113 correspond to the plurality of light emitting chips 103. A heat sink 113 is located between the corresponding light emitting chip 103 and the base plate 101 and is configured to assist in dissipating heat from the light emitting chip 103 so that heat generated by the light emitting chip 103 is more rapidly conducted to the base plate 101. In some embodiments, one heat sink 113 may be shared by a plurality of light emitting chips 103, which is not limited by the present disclosure.

In summary, in the laser projection device 1000 provided in some embodiments of the present disclosure, the frame 102 of the laser 10 is provided with the light outlet K, so that the laser light emitted by the light emitting chips 103 can be emitted out of the light outlet K along the direction parallel to the bottom plate 101, thereby forming the illumination beam. In this way, the plurality of reflecting prisms are avoided being arranged in the laser 10, so that a plurality of light emitting chips 103 and a plurality of reflecting prisms do not need to be aligned in the manufacturing process of the laser 10, the manufacturing difficulty of the laser 10 is reduced, the problem of reduced light emitting rate of the laser 10 caused by misalignment of the light emitting chips 103 and the corresponding reflecting prisms is avoided, and the light emitting rate of the laser 10 is improved.

It will be understood by those skilled in the art that the scope of the present disclosure is not limited to the specific embodiments described above, and that certain elements of the embodiments may be modified and substituted without departing from the spirit of the application. The scope of the application is limited by the appended claims.

Claims

A laser projection device, comprising:

A light source assembly configured to provide an illumination beam;

An optical engine configured to modulate the illumination beam with an image signal to obtain a projection beam; and

A lens configured to project the projection beam into an image; wherein, the light source subassembly includes:

A bottom plate;

the frame body is positioned on the bottom plate, and an accommodating space is defined between the bottom plate and the frame body; the frame body is provided with a light outlet;

A plurality of light emitting chips located in the accommodation space and configured to emit laser light in a plurality of directions;

And the light combining component is positioned in the accommodating space and is configured to guide the laser to the light outlet so that the laser can be emitted out of the light outlet along the direction parallel to the bottom plate to form the illumination light beam.
The laser projection device of claim 1, wherein the frame comprises:

a first sidewall;

A second sidewall opposite the first sidewall;

The third side wall is connected with one side of the first side wall far away from the light outlet and one side of the second side wall far away from the light outlet;

The fourth side wall is connected with one side of the first side wall, which is close to the light outlet, and one side of the second side wall, which is close to the light outlet; the light outlet penetrates through at least part of the fourth side wall;

the plurality of light emitting chips are disposed on the bottom plate, and include:

the first light emitting chip is configured to emit first laser light in the laser towards the light outlet;

A second light emitting chip configured to emit a second laser light of the laser lights toward an inside of the accommodation space;

The light combining component is arranged on the bottom plate; the first light emitting chip is positioned between the light combining component and the third side wall, and the second light emitting chip is positioned between the light combining component and at least one of the first side wall or the second side wall; the light combining component is configured to transmit the first laser light toward the light outlet and reflect the second laser light toward the light outlet.
The laser projection device of claim 2, wherein the second light emitting chip is located between the light combining member and the first side wall or the second side wall;

The light combining member includes:

a first reflecting surface; the first reflecting surface is a surface of the light combining component facing the light emitting side of the second light emitting chip and is configured to reflect the second laser light to the light emitting opening;

A first transmissive surface; the first transmission surface is a surface of the light combining component facing the light emitting side of the first light emitting chip, and is configured to transmit the first laser light to the light emitting opening.
The laser projection apparatus according to claim 1 or 2, wherein the frame body includes:

a first sidewall;

A second sidewall opposite the first sidewall;

The third side wall is connected with one side of the first side wall far away from the light outlet and one side of the second side wall far away from the light outlet;

The fourth side wall is connected with one side of the first side wall, which is close to the light outlet, and one side of the second side wall, which is close to the light outlet; the light outlet penetrates through at least part of the fourth side wall;

The plurality of light emitting chips are arranged on the bottom plate and comprise a second light emitting chip; the second light emitting chip is configured to emit a second laser light of the laser lights toward the inside of the accommodation space;

The second light emitting chip includes:

A first sub-light emitting chip configured to emit a first sub-laser light of the second laser light toward a first direction;

a second sub-light emitting chip configured to emit a second sub-laser light of the second laser light toward a second direction; the second direction is the opposite direction of the first direction;

The light combining component is arranged on the bottom plate; the first sub light emitting chip is positioned between the light combining component and one of the first side wall or the second side wall, and the second sub light emitting chip is positioned between the light combining component and the other of the first side wall or the second side wall; the light combining component is configured to reflect the first sub-laser and the second sub-laser toward the light outlet.
The laser projection device of claim 4, wherein the light combining means comprises:

a first light combining mirror comprising a first sub-reflecting surface; the first sub-reflecting surface is a surface of the first light converging mirror facing the light emitting side of the first sub-light emitting chip and is configured to reflect the first sub-laser light to the light emitting opening;

A second light combining mirror comprising a second sub-reflecting surface; the second sub-reflecting surface is a surface of the second light converging mirror facing the light emitting side of the second sub-light emitting chip, and is configured to reflect the second sub-laser light to the light emitting opening; the first light converging lens intersects the second light converging lens.
The laser projection device of claim 5, wherein the first light combining mirror further comprises a first sub-transmissive surface; the first sub-transmission surface is a surface of the first light converging mirror facing the light emitting side of the second sub-light emitting chip, and is configured to transmit the second sub-laser light so as to transmit the second sub-laser light to the second sub-reflection surface;

The second light converging lens further comprises a second sub-transmission surface; the second sub-transmission surface is a surface of the second light converging mirror facing the light emitting side of the first sub-light emitting chip, and is configured to transmit the first sub-laser light so that the first sub-laser light is transmitted to the first sub-reflection surface.
The laser projection device of claim 2, wherein the light combining means comprises:

the first prism is arranged on the light emitting side of the first light emitting chip;

The second prism is arranged on the light emitting side of the second light emitting chip;

The first prism is in contact with the second prism; the contact surface of the first prism and the second prism is configured to transmit the first laser to the light outlet and reflect the second laser to the light outlet.
The laser projection device of any of claims 2 to 7, wherein the first laser light is transmitted onto the light combining means to form a first spot and the second laser light is transmitted onto the light combining means to form a second spot;

The first light spot overlaps the second light spot.
The laser projection device of any of claims 1 to 8, wherein the base plate comprises:

A first region; the plurality of light emitting chips are disposed in the first region;

A second region surrounding the first region;

The first region is raised relative to the second region; or alternatively

One side area of the second area, which is close to the light outlet, and the other side area of the first area, which is opposite to the second area, are recessed.
The laser projection device of any of claims 1 to 9, wherein the light source assembly further comprises:

A plurality of collimating lenses corresponding to the plurality of light emitting chips and configured to collimate laser light emitted from the corresponding light emitting chips; wherein the method comprises the steps of

The collimating lenses are respectively arranged on the light emitting sides of the corresponding light emitting chips; or alternatively

The collimating lenses are arranged on one side of the light outlet far away from the accommodating space.
The laser projection device of claim 10, wherein the base plate includes a first region; the plurality of light emitting chips are disposed in the first region;

The plurality of light emitting chips includes:

the first light emitting chip is configured to emit first laser light in the laser towards the light outlet;

A second light emitting chip configured to emit a second laser light of the laser lights toward an inside of the accommodation space;

The first region includes:

A first sub-region;

A second sub-region, the first sub-region being raised relative to the second sub-region; one of the first light emitting chip or the second light emitting chip is disposed in the first sub-area, and the other is disposed in the second sub-area;

The collimating lenses are arranged on one side of the light outlet far away from the accommodating space and are arranged in two rows and a plurality of columns; a row of the plurality of collimating lenses, which is far from the bottom plate, corresponds to the light emitting chips in the first sub-area, and a row of the plurality of collimating lenses, which is close to the bottom plate, corresponds to the light emitting chips in the second sub-area.
The laser projection device of any of claims 1 to 11, wherein the light source assembly further comprises:

The upper cover assembly is fixed with one side of the frame body far away from the bottom plate; and the light source assembly satisfies one of:

The light source assembly further includes:

The edge of the light-transmitting layer is fixed with the edge of the light outlet;

Or alternatively

The light source assembly further includes:

The cover plate is annular, the outer edge of the cover plate is fixed with the edge of the light outlet, and the inner edge of the cover plate is fixed with the edge of the light-transmitting layer.
A laser projection device, comprising:

A light source assembly configured to provide an illumination beam;

An optical engine configured to modulate the illumination beam with an image signal to obtain a projection beam; and

A lens configured to project the projection beam into an image; wherein, the light source subassembly includes:

A bottom plate;

the frame body is positioned on the bottom plate, and an accommodating space is defined between the bottom plate and the frame body; the frame body is provided with a light outlet;

A plurality of light emitting chips located in the accommodation space and configured to emit laser light; the laser emits the light outlet along the direction parallel to the bottom plate so as to form the illumination light beam;

a plurality of collimating lenses corresponding to the plurality of light emitting chips and configured to collimate laser light emitted from the corresponding light emitting chips; the collimating lenses are respectively arranged on the light emitting sides of the corresponding light emitting chips;

A converging part disposed at a side of the light outlet remote from the accommodation space and configured to converge the laser light to reduce a spot size of the laser light; the front projection of the converging part on a plane perpendicular to the base plate covers the front projection of the plurality of collimating lenses on the plane.
The laser projection device of claim 13, wherein the base plate includes a first region; the plurality of light emitting chips are disposed in the first region; the first region satisfies one of:

The first region is flat;

Or alternatively

The first region includes:

A first sub-region;

A second sub-region, the first sub-region being raised relative to the second sub-region; a part of the plurality of light emitting chips is disposed in the first sub-area, and another part of the plurality of light emitting chips is disposed in the second sub-area.
The laser projection device of claim 14, wherein said first region comprises a plurality of said first sub-regions;

The height of the first subarea, which is close to the light outlet, protruding relative to the second subarea is smaller than the height of the first subarea, which is far away from the light outlet, protruding relative to the second subarea;

at least one light emitting chip of the part of light emitting chips is provided in any one of the first sub-areas.
The laser projection device of claim 15, wherein the color of the laser light emitted by the at least one light emitting chip is the same; the colors of the laser light emitted by the at least one light emitting chip arranged in different first sub-areas are different in the plurality of first sub-areas.
The laser projection device of any of claims 13 to 16, wherein the base plate comprises a first region in which the plurality of light emitting chips are disposed;

The plurality of light emitting chips includes:

a first light emitting chip configured to emit a first laser light of the laser lights;

A second light emitting chip configured to emit a second laser light of the laser lights; the polarization direction of the first laser light is perpendicular to the polarization direction of the second laser light;

The light source assembly further includes:

And a polarization conversion part located in the accommodation space and configured to change at least one of a polarization direction of the first laser light or a polarization direction of the second laser light so that the polarization direction of the first laser light is the same as the polarization direction of the second laser light.
The laser projection device of claim 17, wherein the first light emitting chip is configured to emit the first laser light toward the light exit port; the second light emitting chip is configured to emit the second laser light toward the light outlet;

The polarization conversion means includes a half-wave plate; the half-wave plate is positioned between the first light emitting chip and the light outlet and is configured to rotate the polarization direction of the first laser by 90 degrees;

The front projection of the half-wave plate on a plane perpendicular to the bottom plate covers the front projection of the collimating lens corresponding to the first light-emitting chip on the plane; the front projection of the half-wave plate on the plane is not overlapped with the front projection of the collimating lens corresponding to the second light-emitting chip on the plane.
The laser projection device of any of claims 13 to 18, wherein the light source assembly further comprises:

The diffusion sheet is positioned in the accommodating space and is arranged between the plurality of light emitting chips and the light outlet; the diffuser is configured to homogenize the laser light.
The laser projection device of any of claims 13 to 19, wherein the light source assembly further comprises:

The upper cover assembly is fixed with one side of the frame body far away from the bottom plate; and the light source assembly satisfies one of:

The light source assembly further includes:

The edge of the light-transmitting layer is fixed with the edge of the light outlet;

Or alternatively

The light source assembly further includes:

The cover plate is annular, the outer edge of the cover plate is fixed with the edge of the light outlet, and the inner edge of the cover plate is fixed with the edge of the light-transmitting layer.