CN117791431A - Wire processing method and wire - Google Patents

Abstract

The invention discloses a wire processing method and a wire, which belong to the technical field of wire treatment, wherein the wire processing method comprises the following steps: performing laser treatment on the outer coating of the lead to form notches and operation holes which are arranged at intervals along a first direction on the outer coating, wherein the notches divide the outer coating into an outer coating product section and an outer coating scrapped section, and the operation holes are positioned on the outer coating scrapped section, and the first direction is the length direction of the lead; performing a disconnection process on the braid exposed from the operation hole through the operation hole so that the braid is divided into a braid-retaining section and a braid-removing section; removing the scrapped section and the braiding removal section along the drawing direction to obtain a semi-finished wire, wherein the braiding retention section and the part of the inner quilt of the semi-finished wire, which is provided with the exposed outer product section, are the direction in which the outer product section points to the scrapped section; and forming the semi-finished wire to expose the first preset length of conductor. The method provided by the invention has less material waste, higher reliability and lower rejection rate of the lead.

Description

Wire processing method and wire

Technical Field

The invention relates to the technical field of wire processing, in particular to a wire processing method and a wire.

Background

The wire generally comprises a conductor, an inner jacket, a braid and an outer jacket, wherein the inner jacket is wrapped outside the conductor for insulation of the conductor, the braided material is generally a metal material and wrapped outside the inner jacket for shielding, and the outer jacket is wrapped outside the braid for insulation and protection.

After the wire is manufactured, the end surfaces of the two ends of the wire are plane, namely, the end surface of the conductor, the end surface of the inner quilt, the end surface of the braiding and the end surface of the outer quilt are positioned on the same plane. The conductors in the wire need to be processed when being connected with other structures so that the conductors and the inner parts are exposed for a preset length.

In the prior art, the processing method for the lead comprises the following steps: the laser process is adopted to cut the outer coating, and the material of the outer coating is usually an organic material because of the higher cutting problem of the laser process, so that the part of the outer coating irradiated by the laser is melted and a small opening is formed. Thereafter, the jacket is drawn through a small opening formed by a laser to enable exposure of the longer weave. After exposing the longer braiding, carrying out laser on the braiding by adopting a laser process, and bending the braiding back and forth for a plurality of times after the laser is finished, so that the braiding is broken, and the inner quilt and the conductor are exposed. When the wire is drawn, in order to enable the outer jackets at the two ends of the outer jacket needing to be drawn to be clamped smoothly, the length required to be reserved at the end part of the wire is at least 8 mm, the end part of the wire is cut to be waste, the length of the part of the processed wire exposing the outer jacket is only required to be 1.3 mm, at least 6.7 mm is wasted when the wire is processed, and when the outer jacket is drawn, the outer jacket is required to be drawn along the radial direction of the wire, braiding is easy to scatter in the drawing process, and the risk of damaging the inner jacket when laser braiding exists.

Disclosure of Invention

The invention aims to provide a wire processing method which has less material waste, higher reliability and lower rejection rate.

The technical scheme adopted by the invention is as follows:

the wire processing method is used for processing the wire and comprises the following steps:

s1, performing laser treatment on the outer coating of a wire to form notches and operation holes which are arranged at intervals along a first direction on the outer coating, wherein the notches divide the outer coating into an outer coating product section and an outer coating scrapped section, the operation holes are positioned on the outer coating scrapped section, and the first direction is the length direction of the wire;

s2, performing disconnection treatment on the knitting exposed by the operation hole through the operation hole so as to divide the knitting into a knitting retention section and a knitting removal section;

s3, removing the scrapped outer section and the braiding removal section along a drawing direction to obtain a semi-finished wire, wherein the braiding retention section and the inner quilt of the semi-finished wire are provided with parts exposing the scrapped outer section, and the drawing direction is the direction that the scrapped outer section points to the scrapped outer section;

s4, performing molding treatment on the semi-finished wire to expose the conductor with the first preset length.

Optionally, step S1 includes:

s11, carrying out laser treatment on the wire along the circumferential direction of the wire to obtain the notch;

s12, carrying out laser treatment on the surface of one side of the wire in a second direction to obtain one operation hole, wherein the second direction is the thickness direction of the wire;

s13, carrying out laser treatment on the surface of the other side of the wire in the second direction to obtain another operation hole, wherein the two operation holes are oppositely arranged;

in step S2, the knitting exposed by the operation holes is subjected to a breaking process from the two operation holes, respectively, so that the knitting is divided into a knitting retention section and a knitting removal section.

Optionally, the wire includes a plurality of cores that coaxial setting and parcel are in many the outer quilt of core is outside, every the core all includes the conductor, parcel in the outer interior quilt of conductor and parcel in interior quilt is outside weave, the operation hole is configured to can expose many the cores.

Optionally, step S2 includes:

performing laser treatment on the knitting exposed by the operation hole through the operation hole;

the braiding is folded so that the braiding is broken into a braiding reserving section and a braiding removing section, and the outer scrapped section on one side of the operation hole clamps the braiding reserving section so as to prevent the braiding reserving section from being scattered.

Optionally, the size of the operation hole in the first direction is 1.5 mm to 2.5 mm.

Optionally, the braid retaining segment has a portion that exposes the outer coated product segment.

Optionally, step S3 includes:

s31, fixing the outer coating product section;

s32, scraping the scrapped outer section and the braiding removal section by adopting a scraping piece so as to separate the braiding removal section from the inner scrapped section, wherein the scraping piece is contacted with the scrapped outer section and/or the braiding removal section.

Optionally, the length of the scrapped section is 3-4 mm.

Optionally, step S4 includes:

s41, cutting the inner quilt of the semi-finished wire and the conductor wrapped by the inner quilt so that the length of the inner quilt exposed out of the outer quilt product section is a second preset length;

s42, removing part or all of the inner quilt exposing the outer quilt product section, so that the length of the conductor exposing the outer quilt product section is the first preset length.

Another object of the present invention is to provide a wire with a high quality.

The wire is formed by processing the wire by the wire processing method.

The invention has the beneficial effects that:

according to the wire processing method and the wire, the notch and the operation hole are formed on the outer cover of the wire at intervals along the first direction, the outer cover on one side of the notch is the outer cover product section, the outer cover scrapped section on the other side of the notch is used for conducting disconnection processing on the braiding wrapped by the outer cover scrapped section through the operation hole so as to divide the braiding into the braiding retaining section and the braiding removing section, when the braiding retaining section and the braiding removing section are removed, the braiding removing section and the outer cover scrapped section are taken down from the inner cover along the direction of the outer cover product section to the outer cover scrapped section, and as the outer cover does not need to be drawn along the radial direction of the wire, the end part of the wire does not need to be reserved for clamping a long length, so that the waste amount of the wire can be short, the step of drawing the outer cover does not exist before the braiding disconnection processing, the situation that the inner cover is damaged due to braiding scattering does not occur, the reliability is high, and the rejection rate of the wire is reduced.

Drawings

FIG. 1 is a flow chart of a wire processing method according to an embodiment of the invention;

fig. 2 is a schematic diagram of a structure of a wire before processing according to an embodiment of the invention;

FIG. 3 is a schematic view of a wire for forming a notch and an operation hole according to a first embodiment of the present invention;

FIG. 4 is a schematic diagram of a wire with a laser path according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a first embodiment of the present invention, wherein the scrapped part is separated from the product part;

fig. 6 is a schematic diagram of a processed wire according to an embodiment of the invention.

In the figure:

1. a wire; 101. a notch; 102. an operation hole; 11. a coating product section; 12. an outer scrapped section; 21. braiding a reserved section; 22. braiding the removal section; 3. a conductor; 200. a laser path.

Detailed Description

In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

The embodiment provides a wire processing method, which is used for processing wires, can have less material waste, has higher reliability and lower rejection rate.

As shown in fig. 1, the wire processing method includes the steps of:

s1, performing laser treatment on the outer coating of a wire 1 to form a notch 101 and an operation hole 102 which are arranged at intervals along a first direction on the outer coating, wherein the notch 101 divides the outer coating into an outer coating product section 11 and an outer coating scrapped section 12, and the operation hole 102 is positioned on the outer coating scrapped section 12, and the first direction is the length direction of the wire 1;

in step S1, the specific manner and principle of the laser processing may be referred to in the prior art, and this embodiment is not described herein. The slit 101 and the operation hole 102 are formed after the outer layer is melted by laser irradiation. It should be noted that the melted coating may be removed by blowing, suction, or the like.

Fig. 2 is a schematic structural view of an untreated wire 1 according to the present embodiment, and the wire after forming the notch 101 and the operation hole 102 is shown in fig. 3.

It should be noted that the operation hole 102 can expose the wrapped braid for subsequent processing.

S2, performing disconnection treatment on the knitting exposed by the operation hole 102 through the operation hole 102 so that the knitting is divided into a knitting retention section 21 and a knitting removal section 22;

s3, removing the scrapped section 12 and the braiding removal section 22 along the drawing direction to obtain a semi-finished wire, wherein the braiding retention section 21 and the part of the inner quilt with the outer product section 11 are provided with the semi-finished wire, and the drawing direction is the direction of the outer product section 11 pointing to the scrapped section 12;

s4, performing molding treatment on the semi-finished wire to expose the conductor 3 with the first preset length.

It should be noted that the first preset length may be set according to actual needs, and the conductor 3 with the first preset length may be used for electrical connection with other electronic devices.

According to the wire processing method provided by the embodiment, the notch 101 and the operation hole 102 are formed on the outer cover of the wire 1 at intervals along the first direction, the outer cover on one side of the notch 101 is the outer cover product section 11, the outer cover scrapped section 12 on the other side is used for breaking the braiding wrapped by the outer cover scrapped section 12 through the operation hole 102 so as to divide the braiding into the braiding reserve section 21 and the braiding removal section 22, when the braiding reserve section 21 and the braiding removal section 22 are removed, the braiding removal section 22 and the outer cover scrapped section 12 are removed from the inner cover along the direction of the outer cover product section 11 pointing to the outer cover scrapped section 12, and as the outer cover does not need to be drawn along the radial direction of the wire 1, the end part of the wire 1 does not need to be reserved for clamping a long length, so that the waste amount of the wire 1 can be short, the condition that the inner cover is damaged due to the fact that the braiding is scattered does not occur before the braiding breaking treatment, high reliability is achieved, and the rejection rate is reduced.

In addition, since the braid retaining section 21 has been separated from the braid removing section 22 and the braid removing section 22 moves simultaneously with the outer scrapped section 12, the amount of braid residue can be reduced, further improving the quality of the product.

Optionally, step S1 includes:

s11, conducting wire laser treatment is conducted along the circumferential direction of the conducting wire 1, so that a notch 101 is obtained;

in step S11, the laser head of the laser apparatus is controlled to wind the wire 1 for one circle so as to form a slit extending along the circumferential direction of the wire 1, thereby enabling the outer coated product segment 11 to be thoroughly separated from the outer coated reject segment 12.

S12, carrying out laser treatment on the surface of one side of the wire 1 in the second direction to obtain an operation hole 102, wherein the second direction is the thickness direction of the wire 1;

the wire 1 in the present embodiment may be a flat wire, that is, the wire 1 has a length direction, a width direction, and a thickness direction. In step S12, one operation hole 102 is opened at one side in the thickness direction of the wire 1, so that the braid exposed by the operation hole 102 can be subjected to a disconnection process through the operation hole 102.

S13, carrying out laser treatment on the surface of the other side of the wire 1 in the second direction to obtain another operation hole, wherein the two operation holes 102 are oppositely arranged;

since the braid is wrapped inside and outside, both of the operation holes 102 have braid exposure. In step S13, the operation holes 102 are also opened on the other surface in the thickness direction of the wire 1 so that the entire braid is processed through the two operation holes 102.

In step S2, the braid exposed by the operation holes 102 is subjected to a disconnection process from the two operation holes 102, respectively, so that the braid is divided into the braid-retaining section 21 and the braid-removing section 22.

In the present embodiment, the sizes of the two operation holes 102 are the same or different, and the present embodiment is not limited thereto.

Alternatively, as shown in fig. 2 to 5, the wire 1 includes a plurality of cores coaxially arranged and an outer cover wrapped outside the plurality of cores, each core including a conductor 3, an inner cover wrapped outside the conductor, and a braid wrapped outside the inner cover. The operation hole 102 in the present embodiment is configured to expose braiding of a plurality of cores so as to facilitate disconnection processing of the plurality of cores at the same time.

In some alternative embodiments, step S2 comprises:

s21, performing laser treatment on the knitting exposed by the operation hole 102 through the operation hole 102;

in step S21, the knitting exposed by the operation holes 102 is scanned by laser, and when the operation holes include two operation holes, the knitting exposed by the two operation holes is sequentially laser-processed by the two operation holes, so that the knitting can be cut as much as possible, and the separation of the subsequent knitting retention section 21 and the knitting removal section 22 is facilitated.

S22, bending and braiding so that the braiding is broken into a braiding reserving section 21 and a braiding removing section 22, and the scrapped section 12 on one side of the operation hole 102 clamps the braiding reserving section 21 to prevent the braiding reserving section 21 from scattering during bending and braiding.

In step S22, since the laser cutting cannot completely divide the braid into two parts, it is necessary to bend the braid by manual operation or mechanical equipment, such as repeatedly bending the braid, and since the braid is made of metal, particularly a wire, the braid is broken during repeated bending, and the braid is further divided into a braid retaining section 21 and a braid removing section 22, and the braid retaining section 21 is used for protecting the inner quilt and the conductor 3.

After the knitting is cut by the laser, the outer scrapped section 12 between the operation hole 102 and the incision 101 can fix and clamp the knitting reserved section 21 because the position of the laser cutting is in the operation hole 102, so that the knitting reserved section 21 can be prevented from being scattered in the process of bending and knitting, and the reliability of knitting cutting is improved.

In this embodiment, as shown in fig. 5 or 6, the braid retaining section 21 has a portion exposing the outer product section 11 to secure the shielding effect of the conductor 3 and also to protect the conductor 3.

Optionally, step S3 includes:

s31, fixing the outer coating product section 11;

in step S31, the coated product segment 11 may be fixed using a structure such as a jig, a press block, or the like, to prevent the coated product segment 11 from being displaced during a subsequent operation.

S32, scraping the outer scrapped section 12 and the knitting removing section 22 by using a scraping piece so as to separate the knitting removing section 22 from the inner scrapped section, wherein the scraping piece is contacted with the outer scrapped section 12 and/or the knitting removing section 22.

Illustratively, the scraping member is a doctor blade, a squeegee, or the like, which is not limited in this embodiment. In this embodiment, the length of the scrapped outer section 12 and the length of the braiding removal section 22 are both shorter, so that the interference between the braiding removal section 22 and the inner quilt is smaller, the scrapped outer section 12 and the product outer section 11 are completely disconnected, and the braiding removal section 22 and the braiding retention section 21 are also completely disconnected, so that the scrapped outer section 12 and the braiding removal section 22 can be successfully separated by scraping the scrapped outer section 12 and the braiding removal section 22 directly along the direction of the scrapped outer section 12 away from the product outer section 11.

In some alternative embodiments, the length of the outer scrapped section 12 is 3-4 mm, as seen in less scrap of the wire 1. The size of the operation hole 102 in the first direction is 1.5 mm-2.5 mm, so that the portion of the scrapped outer section 12 located in the operation hole 102 is not too small, and the operation is convenient.

Optionally, step S4 includes:

s41, cutting the inner quilt of the semi-finished wire and the conductor 3 wrapped by the inner quilt so that the length of the inner quilt exposed outside product section 11 is a second preset length;

and S42, removing part or all of the inner quilt of the exposed product section 11 so that the length of the conductor 3 exposed by the exposed product section 12 is a first preset length.

The embodiment also provides a wire 1, the specific structure of the wire 1 is shown in fig. 6, and the wire 1 is formed by the wire processing method. The wire formed by the wire processing method is not damaged by laser, has higher reliability, ensures the quality of the wire 1, and ensures the quality because the wire 1 obtained after the processing has no knitting residue.

Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims (10)

1. The wire processing method is used for processing the wire and is characterized by comprising the following steps:

s1, performing laser treatment on the outer coating of a wire to form notches and operation holes which are arranged at intervals along a first direction on the outer coating, wherein the notches divide the outer coating into an outer coating product section and an outer coating scrapped section, the operation holes are positioned on the outer coating scrapped section, and the first direction is the length direction of the wire;

s2, performing disconnection treatment on the knitting exposed by the operation hole through the operation hole so as to divide the knitting into a knitting retention section and a knitting removal section;

s3, removing the scrapped outer section and the braiding removal section along a drawing direction to obtain a semi-finished wire, wherein the braiding retention section and the inner quilt of the semi-finished wire are provided with parts exposing the scrapped outer section, and the drawing direction is the direction that the scrapped outer section points to the scrapped outer section;

s4, performing molding treatment on the semi-finished wire to expose the conductor with the first preset length.

2. The wire processing method according to claim 1, wherein step S1 includes:

s11, carrying out laser treatment on the wire along the circumferential direction of the wire to obtain the notch;

s12, carrying out laser treatment on the surface of one side of the wire in a second direction to obtain one operation hole, wherein the second direction is the thickness direction of the wire;

s13, carrying out laser treatment on the surface of the other side of the wire in the second direction to obtain another operation hole, wherein the two operation holes are oppositely arranged;

in step S2, the knitting exposed by the operation holes is subjected to a breaking process from the two operation holes, respectively, so that the knitting is divided into a knitting retention section and a knitting removal section.

3. The method of claim 2, wherein the wire comprises a plurality of cores coaxially arranged and an outer jacket surrounding the plurality of cores, each of the cores comprising a conductor, an inner jacket surrounding the conductor, and a braid surrounding the inner jacket, the operating hole being configured to expose the plurality of cores.

4. The wire processing method according to claim 1, wherein step S2 includes:

performing laser treatment on the knitting exposed by the operation hole through the operation hole;

the braiding is folded so that the braiding is broken into a braiding reserving section and a braiding removing section, and the outer scrapped section on one side of the operation hole clamps the braiding reserving section so as to prevent the braiding reserving section from being scattered.

5. The wire processing method according to claim 1, wherein a dimension of the operation hole in the first direction is 1.5 mm to 2.5 mm.

6. The wire processing method of any one of claims 1-5 wherein said braid retaining segment has a portion exposing said outer coated product segment.

7. The wire processing method according to any one of claims 1 to 5, characterized in that it comprises, in step S3:

s31, fixing the outer coating product section;

s32, scraping the scrapped outer section and the braiding removal section by adopting a scraping piece so as to separate the braiding removal section from the inner scrapped section, wherein the scraping piece is contacted with the scrapped outer section and/or the braiding removal section.

8. The wire processing method of any one of claims 1-5 wherein the length of the outer scrapped section is 3 mm to 4 mm.

9. The wire processing method according to any one of claims 1 to 5, wherein step S4 includes:

s41, cutting the inner quilt of the semi-finished wire and the conductor wrapped by the inner quilt so that the length of the inner quilt exposed out of the outer quilt product section is a second preset length;

s42, removing part or all of the inner quilt exposing the outer quilt product section, so that the length of the conductor exposing the outer quilt product section is the first preset length.

10. A wire, characterized in that the wire is formed by the wire processing method according to any one of claims 1 to 9.