CN117776086A - Packaging substrate and preparation method thereof - Google Patents

Abstract

The present disclosure provides a package substrate and a method for manufacturing the same, which belong to the technical field of micro electro mechanical systems. The package substrate of the present disclosure includes a first substrate and a second substrate disposed opposite to each other, a plurality of MEMS devices and a support assembly disposed between the first substrate and the second substrate; the MEMS is arranged on the first substrate, a certain gap is formed between the MEMS and the second substrate, and two ends of the supporting component are respectively propped against the first substrate and the second substrate; the MEMS device and the support assembly are non-overlapping in orthographic projection on the first substrate base plate.

Description

Packaging substrate and preparation method thereof

Technical Field

The disclosure belongs to the technical field of micro-electromechanical systems, and particularly relates to a packaging substrate and a preparation method thereof.

Background

Microelectromechanical systems (MEMS, micro-Electro-Mechanical System) are Micro devices or systems that integrate microsensors, micro actuators, micromechanical structures, micro power supplies, micro energy sources, signal processing and control circuits, high performance electronics integrated devices, interfaces, communications, and the like. MEMS is a revolutionary new technology, widely applied to the high and new technology industry, and is a key technology related to national technological development, economic prosperity and national defense safety. With the rapid development of the information age, MEMS devices with high integration, miniaturization, multiple functions, and low cost will bring great economic value.

Disclosure of Invention

The invention aims to at least solve one of the technical problems in the prior art and provides a packaging substrate and a preparation method thereof.

In a first aspect, embodiments of the present disclosure provide a package substrate including first and second oppositely disposed substrate substrates, a plurality of MEMS devices and a support assembly disposed between the first and second substrate substrates; the MEMS is arranged on the first substrate, a certain gap is formed between the MEMS and the second substrate, and two ends of the supporting component are respectively propped against the first substrate and the second substrate; the MEMS device and the support assembly are non-overlapping in orthographic projection on the first substrate base plate.

The number of the supporting components is multiple, and the supporting components are uniformly distributed.

The packaging substrate is divided into a middle area and a peripheral area surrounding the middle area; the packaging substrate further comprises a driving signal line which is arranged on the first substrate and is electrically connected with the MEMS device, and the driving signal line and the MEMS are positioned on the same side of the first substrate;

the MEMS device is positioned in the middle area, and the driving signal line extends from the middle area to the peripheral area; the second substrate exposes a portion of the driving signal line located in the peripheral region.

The packaging substrate further comprises a driving signal line arranged on one side, away from the MEMS device, of the first substrate, and the driving signal line is electrically connected with the MEMS device through a through hole penetrating through the first substrate.

The packaging substrate is divided into a middle area and a peripheral area surrounding the middle area; the package substrate further includes a first driving signal line and a second driving signal line disposed on the first substrate; the first driving signal line and the MEMS device are positioned on the same side of the first substrate and are electrically connected; the MEMS device is positioned in the middle area, and the first driving signal line extends from the middle area to the peripheral area; the second substrate exposes a part of the first driving signal line located in the peripheral area;

the second driving signal line is arranged on one side, away from the MEMS device, of the first substrate base plate, and is electrically connected with the MEMS device through a via hole penetrating through the first substrate base plate.

The packaging substrate is divided into a middle area and a peripheral area surrounding the middle area; the MEMS device is positioned in the middle area; the package substrate further includes a sealing assembly disposed between the first and second substrate substrates and located at the peripheral region.

And inert gas is filled in the space defined by the sealing assembly, the first substrate base plate and the second substrate base plate.

The orthographic projection of the support component on the first substrate base plate is any one of ring shape, triangle shape, cross shape and Y shape.

Wherein the second substrate base plate comprises a glass base.

In a second aspect, an embodiment of the present disclosure provides a method for manufacturing a package substrate, including: providing a first substrate, and forming a plurality of MEMS devices on the first substrate; pairing the first and second substrate substrates and forming a support assembly between the first and second substrate substrates;

a certain gap is formed between the MEMS device and the second substrate, and two ends of the supporting component are respectively propped against the first substrate and the second substrate; the MEMS device and the support assembly are non-overlapping in orthographic projection on the first substrate base plate.

Wherein the step of pairing the first and second substrate substrates and forming a support assembly between the first and second substrate substrates comprises:

forming the support assembly on the second substrate base plate;

the first substrate base plate formed with the MEMS device and the second substrate base plate formed with the support member are opposed to the case.

The preparation method of the packaging substrate further comprises the following steps:

forming a driving signal line on the first substrate, the driving signal line being on the same side as the MEMS device and being electrically connected with the MEMS device;

the package substrate includes a middle region and a peripheral region surrounding the middle region, and further includes, after the pairing of the first and second substrate substrates:

and cutting the second substrate base plate to expose the part of the driving signal line extending to the peripheral area.

Wherein the first substrate base plate is provided with a through hole penetrating along the thickness direction; the preparation method further comprises the following steps:

and forming a driving signal line on one side of the first substrate, which is away from the MEMS device, and electrically connecting the driving signal line with the MEMS device through the via hole.

Wherein the package substrate includes a middle region and a peripheral region surrounding the middle region; the first substrate base plate is provided with a through hole penetrating along the thickness direction; the preparation method further comprises the following steps:

forming a first driving signal line on the first substrate, the first driving signal line being on the same side as the MEMS device and being electrically connected with the MEMS device;

forming a second driving signal line on one side of the first substrate, which is away from the MEMS device, wherein the second driving signal line is electrically connected with the MEMS device through the via hole;

the method further comprises the steps of:

and cutting the second substrate base plate to expose the part of the first driving signal line extending to the peripheral area.

Wherein the package substrate includes a middle region and a peripheral region surrounding the middle region; the preparation method further comprises the following steps:

a seal assembly is formed between the first and second substrate plates in the peripheral region.

Wherein, the preparation method also comprises the following steps: and filling inert gas in the space defined by the sealing assembly, the first substrate and the second substrate.

Drawings

FIG. 1 is an on-state schematic diagram of an exemplary MEMS device as a switching device;

FIG. 2 is an off-state schematic diagram of an exemplary MEMS device as a switching device;

FIG. 3 is an on-state schematic diagram of an exemplary MEMS device as another switching device;

FIG. 4 is an off-state schematic diagram of an exemplary MEMS device as another switching device;

FIG. 5 is a schematic diagram of a package substrate according to an embodiment of the disclosure;

FIG. 6 is a schematic diagram of an arrangement of support assemblies for a package substrate according to an embodiment of the disclosure;

FIG. 7 is a schematic diagram of an orthographic projection of a support assembly of a package substrate on a first substrate according to an embodiment of the present disclosure;

FIG. 8 is a schematic illustration of filling inertness in a package substrate according to an embodiment of the present disclosure;

FIG. 9 is a schematic diagram of an exemplary package substrate according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of another exemplary package substrate according to an embodiment of the present disclosure;

FIG. 11 is a schematic view of another exemplary package substrate according to an embodiment of the present disclosure;

fig. 12 is a flowchart of a method of manufacturing a package substrate according to an embodiment of the present disclosure.

Detailed Description

The present invention will be described in further detail below with reference to the drawings and detailed description for the purpose of better understanding of the technical solution of the present invention to those skilled in the art.

Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

Microelectromechanical systems (MEMS, micro-Electro-Mechanical System), also called microelectromechanical systems, microsystems, micromechanical etc., refer to high-tech devices with dimensions of a few millimeters or even smaller. The MEMS device in embodiments of the present disclosure may be any MEMS-based device, such as: can be used for radio frequency RF switch, probe detection and resonance beam. The method is also applicable to the design and application of other microstructures such as circular diaphragms, polygonal diaphragms and the like, including but not limited to accelerometers, angular velocity meters, miniature microphones, microelectromechanical interference displays, microelectromechanical capacitive ultrasonic transducers, micromirrors and the like.

MEMS devices may be used as switching devices, fig. 1 is an on-state schematic diagram of an exemplary MEMS device as a switching device; FIG. 2 is an off-state schematic diagram of an exemplary MEMS device as a switching device; as shown in fig. 1 and 2, the MEMS device 100 is disposed on a first substrate board, and includes a driving electrode 30 disposed on a first substrate board 10, an interlayer insulating layer 40 covering the driving electrode 30, and a first component disposed above the interlayer insulating layer 40. The first component is a membrane bridge 20, and the membrane bridge 20 comprises a bridge deck structure 21 and connecting arms 22 connected to two ends of the bridge deck structure 21. The bridge deck structure 21 of the membrane bridge 20 spans the drive moving electrode with a distance from the interlayer insulating layer 40 above the drive electrode 30. I.e. the membrane bridge 20 and the first substrate 10 enclose a movable space. When a certain voltage is applied to the driving electrode 30 and the membrane bridge 20, the bridge deck structure 21 of the membrane bridge 20 moves to the driving electrode 30 side under the action of electrostatic force, thereby realizing the off state of the switch. When the voltage on the drive electrode 30 and the membrane bridge 20 is removed, the membrane bridge 20 will return to the original position, at which time the switch is on.

It should be noted that, in fig. 1 and 2, a MEMS switch with a dual-arm fixed beam structure is shown, and the MEMS switch may also include only one connection arm 22, that is, the MEMS switch has a cantilever beam structure, and fig. 3 is an on-state schematic diagram of an exemplary MEMS device as another switching device; FIG. 4 is an off-state schematic diagram of an exemplary MEMS device as another switching device; as shown in fig. 3 and 4, the operation principle of the switch is the same as that of the MEMS switch of the double-arm fixed beam structure described above, so that the description is not repeated here.

The inventors have made it difficult to realize packaging of MEMS devices when integrating a large number of MEMS devices for a large-area first substrate board due to the small size of the MEMS devices.

In view of the above problems, the following technical solutions are provided in the embodiments of the present disclosure. Before describing the technical solution of the present application, it should be noted that in the following examples, MEMS switches with MEMS devices as cantilever structures are taken as examples. However, the MEMS switch does not constitute a limitation on the kind of MEMS device in the package substrate described below.

In a first aspect, fig. 5 is a schematic view of a package substrate according to an embodiment of the disclosure; as shown in fig. 5, the embodiment of the present disclosure provides a package substrate including a first substrate 10 and a second substrate 20 disposed opposite to each other, a plurality of MEMS devices 100 disposed between the first substrate 10 and the second substrate 20, and a support assembly 101. Wherein, the MEMS device 100 is disposed on the first substrate 10 with a certain gap from the second substrate 20; both ends of the supporting component 101 are respectively abutted against the first substrate 10 and the second substrate 20, and the front projection of the MEMS device 100 and the supporting component 101 on the first substrate 10 are not overlapped.

In the embodiment of the disclosure, the MEMS device 100 is disposed on the first substrate 10, and the second substrate 20 is opposite to the first substrate 10, and the two ends of the supporting component 101 are respectively propped against the first substrate 10 and the second substrate 20 to maintain the thickness of the case between the first substrate 10 and the second substrate 20, so as to realize the packaging of the MEMS device 100, thereby improving the reliability and consistency of the device.

In some examples, fig. 6 is a schematic diagram of an arrangement of support assemblies 101 of a package substrate according to an embodiment of the disclosure; as shown in fig. 6, the number of the supporting members 101 is plural, and the plurality of supporting members 101 are uniformly arranged. For example: the support members 101 are disposed between the adjacently disposed MEMS devices 100, and the support members 101 are disposed at four corner positions of the package substrate. In this way, uniformity of the thickness of the cassette between the first and second substrate boards 10 and 20 is ensured. Further, the material of the supporting component 101 may be an organic material, for example, PS glue, resin glue, etc. The organic material is adopted as the supporting component 101, so that the height of the prepared supporting component 101 is convenient to control, and the organic material has good elastic capability, so that the risk of fragments of the first substrate 10 and the second substrate 20 after the box alignment is effectively reduced. The height of the support member 101 is about 5 μm to 100 μm. The support member 101 may be cylindrical or circular truncated cone, that is, the support member 101 is orthographically projected on the first substrate base plate 10 as shown in fig. 7 (a). Of course, the support assembly 101 is not limited thereto, for example: with continued reference to fig. 7, the support assembly 101 orthographically projects a triangle (b), a cross (c), a Y (d), etc. on the first substrate base plate 10.

In some examples, with continued reference to fig. 5, the package substrate is divided into a middle region and a peripheral region surrounding the middle region. The sealing assembly 102 is arranged in the peripheral area and surrounds the middle area of the first substrate 10 and the second substrate 20, so that the sealing of the MEMS device 100 is realized, and interference factors such as water vapor, oxygen and the like are prevented from entering the MEMS device 100. For example: the seal assembly 102 may be a frame sealant.

In some examples, the package environment in which the MEMS device 100 is finally packaged is controlled by controlling the atmosphere environment of the first and second substrate boards 10 and 20 during the dicing process. The first substrate 10 and the second substrate 20 having a large area are subjected to a dicing operation using, for example, a vacuum apparatus, thereby obtaining a vacuum-packaged MEMS device 100. The vacuum packaging has the advantages that corrosion failure of vapor, oxygen and the like to the MEMS device 100 can be effectively reduced, and air damping can be effectively reduced for MEMS components of mechanical movement such as cantilever beams, clamped beams and the like, so that the sensitivity and response speed of the device are improved.

In some examples, fig. 7 is a schematic diagram of an orthographic projection of a package substrate support assembly 101 on a first substrate 10 according to an embodiment of the present disclosure; as shown in fig. 7, the MEMS device 100 can be effectively prevented from being oxidized by filling an inert gas in the space defined by the first substrate 10, the second substrate 20, and the sealing member 102. The inert gas environment has the advantage that under the condition of larger array area and insufficient distribution of the supporting components 101, the glass substrate may be bent and deformed, and the inert gas is filled to increase the pressure in the space defined by the first substrate 10, the second substrate 20 and the sealing component 102 to neutralize the external atmospheric pressure, so that the external pressure to the first substrate 10 and the second substrate 20 is effectively reduced, and the effect of stabilizing the structure is achieved.

In some examples, the package substrate may include not only the above-described structure, but also a driving signal line 103 that provides a driving signal to the MEMS device 100. For example: the driving signal line 103 includes a first driving signal line 1031 electrically connected to the driving electrode of the MEMS device 100, and a second driving signal line 1032 electrically connected to the film bridge.

In one example, fig. 9 is a schematic diagram of an exemplary package substrate of an embodiment of the present disclosure; as shown in fig. 9, the driving signal line 103 and the MEMS device 100 are disposed on the same side of the first substrate 10, and the driving signal line 103 extends from the middle region of the package substrate to the peripheral region and is electrically connected to the connection pad 104 located in the peripheral region, so as to facilitate bonding connection with the external driving circuit board. In this case, the second substrate 20 exposes a portion of the driving signal line 103 extending to the peripheral region at the peripheral region.

In another example, fig. 10 is a schematic view of another exemplary package substrate of an embodiment of the present disclosure; as shown in fig. 10, the first substrate 10 has a via hole penetrating in a thickness direction thereof, and the driving signal line 103 may be disposed at a side of the first substrate 10 facing away from the MEMS device 100, in which case the driving signal line 103 may be electrically connected to the MEMS device 100 through the via hole on the first substrate 10.

In another example, fig. 11 is a schematic view of another exemplary package substrate of an embodiment of the present disclosure; as shown in fig. 11, the first substrate base 10 has a via hole penetrating in its thickness direction, and the driving signal line 103 includes a first driving signal line 1031 electrically connected to the driving electrode of the MEMS device 100, and a second driving signal line 1032 electrically connected to the film bridge; the first driving signal line 1031 and the MEMS device 100 are disposed on the same side of the first substrate 10, and the first driving signal line 1031 extends from the middle region of the package substrate to the peripheral region and is electrically connected to the connection pad 104 located in the peripheral region, so as to facilitate bonding connection with the external driving circuit board. In this case, the second substrate 20 exposes a portion of the first driving signal line 1031 extending to the peripheral region at the peripheral region. The second driving signal line 1032 may be disposed at a side of the first substrate 10 facing away from the MEMS device 100, in which case the second driving signal line 1032 may be electrically connected to the MEMS device 100 through a via hole on the first substrate 10. In this case, the first driving signal lines 1031 and the second driving signal lines 1032 are provided on both side surfaces of the first substrate 10, respectively, and wiring is facilitated and signal crosstalk can be prevented for the case where the MEMS device 100 is large in size and large in number.

In some examples, both the first substrate 10 and the second substrate 20 in embodiments of the present disclosure may be glass-based.

In a second aspect, embodiments of the present disclosure provide a method for manufacturing a package substrate, where the method may be used to manufacture the package substrate described above. The preparation method of the packaging substrate comprises the following steps: providing a first substrate 10, and forming a plurality of MEMS devices 100 on the first substrate 10; pairing the first and second substrate boards 10 and 20, and forming a support assembly 101 between the first and second substrate boards 10 and 20; a certain gap is formed between the MEMS device 100 and the second substrate 20, and two ends of the supporting component 101 are respectively propped against the first substrate 10 and the second substrate 20; the front projection of the MEMS device 100 and the support component 101 onto the first substrate base 10 does not overlap.

In the embodiment of the disclosure, the MEMS device 100 is formed on the first substrate 10, and the second substrate 20 is opposite to the first substrate 10, and the two ends of the supporting component 101 are respectively propped against the first substrate 10 and the second substrate 20 to maintain the thickness of the case between the first substrate 10 and the second substrate 20, so that the packaging of the MEMS device 100 is realized, and the reliability and consistency of the device are further improved.

The following describes a method for manufacturing a package substrate according to an embodiment of the present disclosure with reference to specific examples. FIG. 12 is a flowchart of a method of manufacturing a package substrate according to an embodiment of the present disclosure; as shown in fig. 12, the preparation method specifically includes the following steps:

s11, providing a first substrate 10, and forming a plurality of MEMS devices 100 on the first substrate 10.

S12, providing a second substrate 20, and forming the support assembly 101 on the first substrate 10.

S13, forming a sealing assembly 102 in the peripheral area of the second substrate 20, wherein the sealing assembly 102 is arranged around the middle area of the second substrate 20.

S14, the second substrate 20 forming the supporting member 101 and the sealing member 102 is opposed to the first substrate 10 forming the MEMS device 100.

It should be noted that, after step S13, the above step S11 may also be performed, that is, the structure on the first substrate 10 or the structure on the second substrate 20 may be prepared first.

In some examples, at the same time as the MEMS device 100 is formed in step S11, a driving signal line 103 electrically connected to the MEMS device 100 is also formed, where the driving signal line 103 extends from the middle region to the peripheral region of the package substrate, and is electrically connected to a connection pad 104 located in the peripheral region, so as to facilitate bonding connection with an external driving circuit board. In this case, a step of dicing the second substrate 20 is further included after step S14 so that the second substrate 20 exposes a portion of the driving signal line 103 extending to the peripheral region at the peripheral region.

In some examples, the first substrate base plate 10 has a via hole penetrating in its thickness direction. The method for manufacturing the package substrate may further include forming the driving signal line 103 on a side of the first substrate 10 facing away from the MEMS device 100, where the driving signal line 103 may be electrically connected to the MEMS device 100 through a via hole on the first substrate 10. Wherein the vias on the first substrate base plate 10 may be TGV openings.

In some examples, the first substrate base 10 has a via hole penetrating in a thickness direction thereof, and the driving signal line 103 includes a first driving signal line 1031 electrically connected to a driving electrode of the MEMS device 100, and a second driving signal line 1032 electrically connected to the film bridge. At the same time as the MEMS device 100 is formed in step S11, a first driving signal line 1031 electrically connected to the MEMS device 100 is also formed, and the first driving signal line 1031 extends from the middle region of the package substrate to the peripheral region and is electrically connected to the connection pad 104 located in the peripheral region, so as to facilitate bonding connection with an external driving circuit board. In this case, a step of dicing the second substrate 20 so that the second substrate 20 exposes a portion of the first driving signal line 1031 extending to the peripheral region at the peripheral region is further included after step S14. The method for manufacturing the package substrate may further include forming the driving signal line 103 on a side of the first substrate 10 facing away from the MEMS device 100, where the driving signal line 103 may be electrically connected to the MEMS device 100 through a via hole on the first substrate 10. Wherein the vias on the first substrate base plate 10 may be TGV openings. In this case, the first driving signal lines 1031 and the second driving signal lines 1032 are provided on both side surfaces of the first substrate 10, respectively, and wiring is facilitated and signal crosstalk can be prevented for the case where the MEMS device 100 is large in size and large in number.

In some examples, the fabrication method of the embodiments of the present disclosure includes not only the above-described steps, but also filling inert gas in the space defined by the first and second substrate boards 10 and 20 and the sealing assembly 102, so that the MEMS device 100 can be effectively prevented from being oxidized. The inert gas environment has the advantage that under the condition of larger array area and insufficient distribution of the supporting components 101, the glass substrate may be bent and deformed, and the inert gas is filled to increase the pressure in the space defined by the first substrate 10, the second substrate 20 and the sealing component 102 to neutralize the external atmospheric pressure, so that the external pressure to the first substrate 10 and the second substrate 20 is effectively reduced, and the effect of stabilizing the structure is achieved.

It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.

Claims (16)

1. A package substrate comprising oppositely disposed first and second substrate substrates, a plurality of MEMS devices and a support assembly disposed between the first and second substrate substrates; the MEMS is arranged on the first substrate, a certain gap is formed between the MEMS and the second substrate, and two ends of the supporting component are respectively propped against the first substrate and the second substrate; the MEMS device and the support assembly are non-overlapping in orthographic projection on the first substrate base plate.

2. The package substrate of claim 1, wherein the number of the support members is plural, and the plurality of the support members are uniformly arranged.

3. The package substrate of claim 1, wherein the package substrate is divided into a middle region and a peripheral region surrounding the middle region; the packaging substrate further comprises a driving signal line which is arranged on the first substrate and is electrically connected with the MEMS device, and the driving signal line and the MEMS are positioned on the same side of the first substrate;

the MEMS device is positioned in the middle area, and the driving signal line extends from the middle area to the peripheral area; the second substrate exposes a portion of the driving signal line located in the peripheral region.

4. The package substrate of claim 1, wherein the package substrate further comprises a drive signal line disposed on a side of the first substrate facing away from the MEMS device, and the drive signal line is electrically connected to the MEMS device through a via penetrating the first substrate.

5. The package substrate of claim 1, wherein the package substrate is divided into a middle region and a peripheral region surrounding the middle region; the package substrate further includes a first driving signal line and a second driving signal line disposed on the first substrate; the first driving signal line and the MEMS device are positioned on the same side of the first substrate and are electrically connected; the MEMS device is positioned in the middle area, and the first driving signal line extends from the middle area to the peripheral area; the second substrate exposes a part of the first driving signal line located in the peripheral area;

the second driving signal line is arranged on one side, away from the MEMS device, of the first substrate base plate, and is electrically connected with the MEMS device through a via hole penetrating through the first substrate base plate.

6. The package substrate of claim 1, wherein the package substrate is divided into a middle region and a peripheral region surrounding the middle region; the MEMS device is positioned in the middle area; the package substrate further includes a sealing assembly disposed between the first and second substrate substrates and located at the peripheral region.

7. The package substrate of claim 6, wherein an inert gas is filled in a space defined by the sealing assembly and the first and second substrate substrates.

8. The package substrate of claim 1, wherein an orthographic projection of the support assembly on the first substrate is any one of a ring, triangle, cross, Y-shape.

9. The package substrate of any of claims 1-8, wherein the second substrate comprises a glass-based.

10. A method of manufacturing a package substrate, comprising: providing a first substrate, and forming a plurality of MEMS devices on the first substrate; pairing the first and second substrate substrates and forming a support assembly between the first and second substrate substrates;

a certain gap is formed between the MEMS device and the second substrate, and two ends of the supporting component are respectively propped against the first substrate and the second substrate; the MEMS device and the support assembly are non-overlapping in orthographic projection on the first substrate base plate.

11. The method of manufacturing a package substrate according to claim 10, wherein the pairing of the first and second substrate substrates, and forming a support assembly between the first and second substrate substrates, comprises:

forming the support assembly on the second substrate base plate;

the first substrate base plate formed with the MEMS device and the second substrate base plate formed with the support member are opposed to the case.

12. The method of manufacturing a package substrate of claim 10, further comprising:

forming a driving signal line on the first substrate, the driving signal line being on the same side as the MEMS device and being electrically connected with the MEMS device;

the package substrate includes a middle region and a peripheral region surrounding the middle region, and further includes, after the pairing of the first and second substrate substrates:

and cutting the second substrate base plate to expose the part of the driving signal line extending to the peripheral area.

13. The manufacturing method of the package substrate according to claim 10, wherein the first substrate has a via hole penetrating in a thickness direction thereof; the preparation method further comprises the following steps:

and forming a driving signal line on one side of the first substrate, which is away from the MEMS device, and electrically connecting the driving signal line with the MEMS device through the via hole.

14. The method of manufacturing a package substrate according to claim 10, wherein the package substrate comprises a middle region and a peripheral region surrounding the middle region; the first substrate base plate is provided with a through hole penetrating along the thickness direction; the preparation method further comprises the following steps:

forming a first driving signal line on the first substrate, the first driving signal line being on the same side as the MEMS device and being electrically connected with the MEMS device;

forming a second driving signal line on one side of the first substrate, which is away from the MEMS device, wherein the second driving signal line is electrically connected with the MEMS device through the via hole;

the method further comprises the steps of:

and cutting the second substrate base plate to expose the part of the first driving signal line extending to the peripheral area.

15. The method of manufacturing a package substrate according to claim 10, wherein the package substrate comprises a middle region and a peripheral region surrounding the middle region; the preparation method further comprises the following steps:

a seal assembly is formed between the first and second substrate plates in the peripheral region.

16. The method of manufacturing a package substrate of claim 15, wherein the method of manufacturing further comprises: and filling inert gas in the space defined by the sealing assembly, the first substrate and the second substrate.