CN117769733A

CN117769733A - Spliced display panel and display device

Info

Publication number: CN117769733A
Application number: CN202280002334.5A
Authority: CN
Inventors: 徐宸科; 谢相伟; 叶岩溪
Original assignee: Xiamen Xinying Display Technology Co ltd
Current assignee: Xiamen Xinying Display Technology Co ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2024-03-26
Also published as: WO2024020720A1

Abstract

The application provides a splice display panel and display device, splice display panel includes display area and non-display area, and it still includes apron, a plurality of display substrate and a plurality of flip chip film. By arranging a plurality of display substrates in the display area, arranging a plurality of flip chip films in the non-display area, and avoiding splicing gaps in the display area; each flip chip film is arranged corresponding to a plurality of display substrates, and metal wires are arranged on the cover plate to bridge the display substrates and the flip chip films, so that the manufacturing cost is reduced.

Description

Spliced display panel and display device

Technical Field

The application relates to the technical field of display, in particular to a spliced display panel and a display device.

Background

In the related art, the split joint screen requires smaller gaps between two adjacent screens after split joint, at present, the split joint screen is a modularized single screen formed by narrowing the frames of the screens, then the single screens are split joint Cheng Pinjie screens in a matrix arrangement through a machine component, and the signal control of the split joint screen is realized by controlling each single screen and then carrying out signal coordination among the single screens.

However, controlling each single screen requires the utilization of COF (Chip On Film) bound to the single screen, and after a large screen is formed by splicing a plurality of single screens, the number of COFs in the spliced screen is excessive, and the number of cooperative devices between the single screens is increased, which results in excessive cost of the spliced screen. In addition, the presence of COF requires a certain binding space on each single screen, which makes the technique of eliminating the gap between two adjacent single screens a bottleneck.

Technical problem

The present application provides a tiled display panel and a display device, which aim to solve at least one of the above problems.

Technical solution

The application provides a tiled display panel, including the display area with around the non-display area of display area, tiled display panel still includes: the cover plate is provided with a metal wire; the display substrates are positioned in the display areas and are arranged on one side of the cover plate; the plurality of flip chip films are positioned in the non-display area, each flip chip film is arranged corresponding to the plurality of display substrates, and the plurality of flip chip films and the plurality of display substrates are arranged on the same side of the cover plate; the metal wire is electrically connected with the flip chip film in the non-display area, and the metal wire is electrically connected with the display substrate in the display area.

In some embodiments of the present application, the display substrates are arranged in an array manner along a first direction and a second direction, where the first direction is perpendicular to the second direction; the display substrate comprises a plurality of pixel units, and the pixel units are arranged corresponding to the metal lines, wherein each pixel unit comprises a plurality of sub-pixels; the cover plate is provided with a first central axis and a second central axis, wherein the extending directions of the first central axis and the second central axis are respectively the first direction and the second direction.

In some embodiments of the present application, a plurality of the flip chip films are disposed on opposite sides of the second central axis.

In some embodiments of the present application, the metal line includes a plurality of metal wires, and the plurality of metal wires are disposed along the first direction and correspond to the plurality of pixel units; and each metal connecting wire in the display area is connected with two adjacent display substrates along the first direction, one end of each metal connecting wire in the non-display area along the first direction is connected with one display substrate, and the other end of each metal connecting wire is bound with one flip-chip film.

In some embodiments of the present application, the metal lines include a plurality of groups of metal wires, and the plurality of groups of metal wires are arranged along the first direction and are arranged at intervals along the second direction; wherein, each group of the metal connecting lines is correspondingly arranged with a plurality of the pixel units along the first direction; each group of metal connecting wires comprises a plurality of sub-connecting wires which are mutually spaced along the second direction, one end of each sub-connecting wire in the same group of metal connecting wires along the first direction is respectively connected with different display substrates, and the other end of each sub-connecting wire is bound with the same flip-chip film.

In some embodiments of the present application, a plurality of the flip chip films are disposed around the cover plate.

In some embodiments of the present application, the metal line includes a plurality of first metal lines and a plurality of second metal lines, the plurality of first metal lines are disposed along the first direction and correspond to the plurality of pixel units, and the plurality of second metal lines are disposed along the second direction and correspond to the plurality of sub-pixels; wherein, each first metal wire in the display area is connected with two adjacent display substrates along the first direction, one end of each first metal wire in the non-display area is connected with one display substrate along the first direction, and the other end is bound with one flip chip film; and connecting each second metal connecting wire in the display area with two adjacent display substrates along the second direction, connecting one display substrate along the second direction at one end of each second metal connecting wire in the non-display area, and binding the other end of each second metal connecting wire with one flip-chip film along the second direction.

In some embodiments of the present application, the metal lines include a plurality of groups of first metal lines and a plurality of groups of second metal lines, wherein the plurality of groups of first metal lines are disposed along the first direction and are arranged at intervals along the second direction, and the plurality of groups of second metal lines are disposed along the second direction and are arranged at intervals along the first direction; each group of the first metal connecting lines are correspondingly arranged with the plurality of pixel units along the first direction, and each group of the second metal connecting lines are correspondingly arranged with the plurality of sub-pixels along the second direction; each group of first metal connecting lines comprises a plurality of first sub-connecting lines which are mutually spaced along the second direction, one end of each first sub-connecting line in the same group of first metal connecting lines along the first direction is respectively connected with different display substrates, and the other end of each first sub-connecting line is bound with the same flip-chip film; each group of second metal connecting lines comprises a plurality of second sub-connecting lines which are mutually spaced along the first direction, one end of each second sub-connecting line in the same group of second metal connecting lines along the second direction is respectively connected with different display substrates, and the other end of each second sub-connecting line is bound with the same flip-chip film.

In some embodiments of the present application, an insulating layer is disposed between the plurality of groups of the first metal wires and the plurality of groups of the second metal wires.

In some embodiments of the present application, the display substrate further includes a driving substrate and a packaging adhesive layer disposed on the driving substrate, conductive balls are disposed in the packaging adhesive layer, and two ends of each conductive ball are respectively connected with the metal wire and the driving substrate.

In some embodiments of the present application, the tiled display panel further includes a plurality of light emitting devices, and the plurality of light emitting devices are bound to the driving substrate through a metal or anisotropic conductive adhesive film.

The application also provides a display device comprising the spliced display panel.

Advantageous effects

According to the first aspect of the application, the plurality of display substrates are arranged in the display area, and the plurality of flip chip films are arranged in the non-display area, so that splicing gaps caused by binding spaces required by the flip chip films in the display area are avoided; in the second aspect, each flip chip film is correspondingly arranged with a plurality of display substrates, so that each display substrate is prevented from being provided with an independent flip chip film, and the number of the flip chip films required for controlling all the display substrates on the spliced display panel is reduced, thereby achieving the effect of reducing the cost of the spliced screen; in the third aspect, the bridging between the display substrate and the flip chip film is realized by arranging the metal wire on the cover plate, so that the cost brought by a cooperative device can be saved, and the cost of splicing the display panel is further reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a tiled display panel according to an embodiment of the present application;

fig. 2A is a schematic diagram of a wiring structure of a metal wire according to an embodiment of the present application;

FIG. 2B is a schematic diagram of another metal wire routing structure according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of another tiled display panel according to an embodiment of the present disclosure;

fig. 4A is a schematic diagram of a wiring structure of a metal wire according to an embodiment of the present application;

FIG. 4B is a schematic diagram of another metal wire routing structure according to an embodiment of the present disclosure;

fig. 5A is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;

fig. 5B is a schematic structural diagram of another display panel according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view of the structure at D-D' in FIG. 2A;

FIG. 7A is a schematic cross-sectional view of the structure at A-A' in FIG. 2B;

FIG. 7B is a schematic cross-sectional view of the structure at B-B' in FIG. 2B;

FIG. 7C is a schematic cross-sectional view of the structure at C-C' in FIG. 2B.

Embodiments of the invention

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a tiled display panel provided in the present application. As shown in fig. 1, the tiled display panel 10 includes a display area AA and a non-display area NA, and the non-display area NA is disposed around the display area AA. The tiled display panel 10 further includes a cover plate 11, a plurality of display substrates 12, and a plurality of flip chip films 13. Wherein, the plurality of display substrates 12 are positioned in the display area AA, and the plurality of display substrates 12 are arranged on one side of the cover plate 11; the plurality of flip-chip films 13 are located in the non-display area NA, each flip-chip film 13 is disposed corresponding to the plurality of display substrates 12, and the plurality of flip-chip films 13 and the plurality of display substrates 12 are disposed on the same side of the cover plate 11.

In the embodiment of the application, the plurality of flip chip films 13 are arranged in the non-display area NA, and the plurality of flip chip films 13 are arranged in the non-display area NA, so that a splicing gap brought by the binding space required by the flip chip films 13 in the display area AA is avoided; in this embodiment, each flip chip film 13 is further disposed corresponding to a plurality of display substrates 12, so as to avoid that each display substrate 12 is disposed with an independent flip chip film 13, thereby reducing the number of flip chip films 13 required for controlling all display substrates 12 on the tiled display panel 10, and achieving the effect of reducing the cost of the tiled display screen.

Referring to fig. 2A, fig. 2B, fig. 4A and fig. 4B, fig. 2A, fig. 2B, fig. 4A and fig. 4B are schematic diagrams of wiring structures of four metal lines provided in the embodiments of the present application, as shown in fig. 2A, fig. 2B, fig. 4A and fig. 4B, a metal line 14/24/34/44 is disposed on the cover plate 11, the metal line 14/24/34/44 is electrically connected to the flip-chip film 13 in the non-display area NA, and the metal line 14/24/34/44 is electrically connected to the display substrate 12 in the display area AA. Since the bridging between the display substrate 12 and the flip chip film 13 is realized on the cover plate 11 through the metal wire 14/24/34/44, and the metal wire 14/24/34/44 can be used for transmitting signals, no additional cooperative device is required to be arranged for transmitting signals between the display substrates, so that the cost brought by the cooperative device can be saved, and the cost of splicing the display panels can be further reduced.

With continued reference to fig. 1, the display substrates 12 may be arranged in an array along a first direction and a second direction, where the first direction is perpendicular to the second direction, and in fig. 1, the first direction corresponds to the x direction and the second direction corresponds to the y direction. As shown in fig. 2A and 2B, the display substrate 12 includes a plurality of pixel units 123, the plurality of pixel units 123 being disposed corresponding to the metal lines 14, wherein each pixel unit 123 includes a plurality of sub-pixels 1231; the cover plate 11 has a first central axis L1 and a second central axis L2 extending in x-direction and y-direction, respectively. Alternatively, the sub-pixel 1231 may be any one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of pixel units 123 are arrayed in the x-direction and the y-direction.

In one embodiment corresponding to fig. 1, a plurality of flip chip films 13 are disposed on opposite sides of the second central axis pair L2.

In one embodiment, when the plurality of flip chip films 13 are disposed on opposite sides of the second central axis pair L2, as shown in fig. 2A, the metal line 14 includes a plurality of metal lines 141 for transmitting the first signal, and the plurality of metal lines 141 are disposed corresponding to the plurality of pixel units 123 along the x direction. Referring to fig. 6 in conjunction with fig. 2A, fig. 6 is a schematic cross-sectional structure of a plurality of metal lines 141 at D-D' in fig. 2A, wherein each metal line 141 in the display area AA is connected to two adjacent display substrates 12 along the x direction, one end of each metal line 141 in the non-display area NA along the x direction is connected to one display substrate 12, and the other end is bound to one flip-chip film 13. In the embodiment corresponding to fig. 2A, a plurality of display substrates 12 are connected in series by using metal wires 14 to realize bridging of signals between the display substrates 12. Alternatively, the first signal may be a Data signal/Gate signal/other common signal.

In another embodiment, when the plurality of flip chip films 13 are disposed on opposite sides of the second central axis L2, as shown in fig. 2B, the metal lines 24 include a plurality of sets of metal lines 241 for transmitting the first signal, and the plurality of sets of metal lines 241 are disposed along the x-direction and are arranged at intervals along the y-direction. Alternatively, when the number of display substrates 12 spliced in the x-direction and the y-direction is even, for example, in the splicing manner of 4*6, the plurality of sets of metal wires 241 may be further disposed symmetrically about the second central axis L2 according to the splicing manner of the display substrates 12.

Wherein, each group of metal wires 241 is disposed corresponding to the plurality of pixel units 123 along the x direction. Each of the metal wires 241 includes a plurality of sub-wires 2411 spaced apart from each other along the y-direction, referring to fig. 7A to 7C in conjunction with fig. 2B, fig. 7A, fig. 7B and fig. 7C are schematic cross-sectional structures of the plurality of metal wires 141 at A-A ', B-B ' and C-C ' in fig. 2B, respectively, wherein one end of each sub-wire 2411 in the same group 241 is connected to a different display substrate 12, and the other end is bound to the same flip-chip film 13.

In the embodiment corresponding to fig. 2B, since one end of each sub-connection line 2411 in the same group of metal connection lines 241 is respectively connected to a different display substrate 12, and the other end is bonded to the same flip-chip film 13, bridging of signals between the display substrate 12 and the flip-chip film 13 is realized. Alternatively, the first signal may be a Data signal/Gate signal/other common signal.

Referring to fig. 3, fig. 3 is a schematic structural diagram of another tiled display panel according to an embodiment of the present application, in which a plurality of flip chip films are disposed around a cover plate 11.

In one embodiment, when the plurality of flip chip films 13 are disposed around the cover plate 11, as shown in fig. 4A, the metal lines 34 include a plurality of first metal lines 341 for transmitting the first signals and a plurality of second metal lines 342 for transmitting the second signals, the plurality of first metal lines 341 are disposed corresponding to the plurality of pixel units 123 along the x direction, and the plurality of second metal lines 342 are disposed corresponding to the plurality of sub-pixels 1231 along the y direction. Wherein, each first metal connection line 341 in the display area AA is connected to two adjacent display substrates 12 along the x direction, one end of each first metal connection line 341 in the non-display area NA is connected to one display substrate 12 along the x direction, and the other end is bound to one flip chip film 13; each second metal wire 342 in the display area NA is connected to two adjacent display substrates 12 along the y direction, one end of each second metal wire 342 in the non-display area NA is connected to one display substrate 12 along the y direction, and the other end is bound to one flip-chip film 13 along the y direction.

In the embodiment corresponding to fig. 4A, the plurality of display substrates 12 are connected in series by using the metal lines 34 to realize bridging of signals between the display substrates 12, and since the first metal lines 341 and the second metal lines 342 are connected in series with two adjacent display substrates 12 along different directions respectively, there is no intersection between the first metal lines 341 and the second metal lines 342 in the display area AA, so that the first metal lines 341 and the second metal lines 342 may be disposed in the same layer of the metal lines, thereby reducing capacitive-resistive loading effect between the first metal lines 341 and the second metal lines 342. Alternatively, the first signal may be a Data signal/Gate signal/other common signal, and the second signal may be one of the Gate signal/Data signal/other common signal different from the first signal.

In another embodiment, when a plurality of flip chip films are disposed around the cover plate 11, as shown in fig. 4B, the metal lines 44 include a plurality of groups of first metal lines 441 for transmitting the first signals and a plurality of groups of second metal lines 442 for transmitting the second signals, the plurality of groups of first metal lines 441 are disposed along the x direction and are spaced apart along the y direction, and the plurality of groups of second metal lines 442 are disposed along the y direction and are spaced apart along the x direction. Specifically, an insulating layer is disposed between the plurality of groups of first metal wires 441 and the plurality of groups of second metal wires 442 to avoid shorting between the first metal wires 441 and the second metal wires 442, which leads to crosstalk in signal transmission. Alternatively, according to the manner of stitching the display substrates 12, when the number of display substrates 12 stitched along the x-direction and the y-direction is even, for example, in the manner of stitching 4*6, the plurality of groups of first metal wires 441 may be further disposed symmetrically about the second central axis L2, and the plurality of groups of second metal wires 442 may be further disposed symmetrically about the first central axis L1.

Each of the first metal lines 441 is disposed corresponding to the plurality of pixel units 123 along the x-direction, and each of the second metal lines 442 is disposed corresponding to the plurality of sub-pixels 1231 along the y-direction. Each group of first metal wires 441 includes a plurality of first sub-wires 4411 spaced apart from each other along the y-direction, one end of each first sub-wire 4411 in the same group of first metal wires 441 along the x-direction is respectively connected to a different display substrate 12, and the other end is bound to the same flip-chip film 13. Each group of second metal wires 442 includes a plurality of second sub-wires 4421 spaced apart from each other along the x-direction, one end of each second sub-wire 4421 in the same group of second metal wires 442 along the y-direction is respectively connected to a different display substrate 12, and the other end is bound to the same flip-chip film 13.

In the embodiment corresponding to fig. 4B, the plurality of display substrates 12 may be connected in parallel along the x-direction by using the same set of the plurality of first metal wires 441, and the plurality of display substrates 12 may be connected in parallel along the y-direction by using the same set of the plurality of second metal wires 442, so as to realize bridging of signals between all the display substrates 12 and the flip-chip film 13. Since the first metal wire 441 and the second metal wire 442 are crossed when being connected in parallel with the plurality of display substrates 12, in the embodiment of the present application, the first metal wire 441 and the second metal wire 442 are respectively disposed in different layers, and the insulating layers are used to separate the different layers, so that the phenomenon of shorting between the first metal wire 441 and the second metal wire 442 is avoided. Alternatively, the first signal may be a Data signal/Gate signal/other common signal, and the second signal may be a Gate signal/Data signal/other common signal.

In the embodiment corresponding to fig. 3, 4A and 4B, by disposing a plurality of flip-chip films 13 around the cover plate 11, compared with the embodiment corresponding to fig. 1, 2A and 2B, the space of each pixel unit 123 distributed in the x direction and the y direction can be further utilized for wiring, and when the wiring space is lifted, the splicing space is increased, which is beneficial to splicing more display substrates 12 and realizing a larger display area.

Referring to fig. 5A and 5B, fig. 5A and 5B are schematic cross-sectional structures of two display substrates, wherein the display substrate 12 includes a driving substrate and a packaging adhesive layer 124 disposed on the driving substrate, the plurality of light emitting devices 20 are disposed on the driving substrate, and conductive balls 125 are disposed in the packaging adhesive layer 124. In the display substrate 12, the plurality of light emitting devices 20 are in one-to-one correspondence with the plurality of sub-pixels 1231. In the tiled display panel 10, both ends of the conductive balls 125 are connected to the metal lines 14 and the driving substrate, respectively. The driving substrate includes a substrate 121, a thin film transistor layer 122, the thin film transistor layer 122, and a plurality of light emitting devices 20 sequentially disposed on the substrate 121. In the tiled display panel 10, the encapsulation adhesive layer 124 is located between the cover plate 11 and the thin film transistor layer 122, and is distributed around the display substrate 12.

In one embodiment, as shown in fig. 5A, the light emitting devices 20 may be bound on the driving substrate by the anisotropic conductive film 126 and electrically connected to the thin film transistor layer 122. In another embodiment, as shown in fig. 5B, the plurality of light emitting devices 20 may be bonded to the plurality of pixel electrodes 127 of the driving substrate through metal.

Alternatively, the light emitting device 20 may be any one of a red light emitting device, a green light emitting device and a blue light emitting device, the conductive balls 125 may be gold balls (Au Ball) or other connection blocks with conductive function, and the encapsulation adhesive 124 is made of one of silica gel, ethylene-vinyl acetate copolymer, polymethyl methacrylate, epoxy resin or fluororesin. The encapsulation adhesive 124 is specifically used for adhering and fixing the display substrate 12 and the cover plate 11.

In the embodiment corresponding to fig. 2A or fig. 4A, since the plurality of display substrates 12 are connected in series through the metal lines 14/34 and the display substrates 12 and the flip-chip film 13 are connected in series, the positions of the conductive balls 125 on each corresponding display substrate 12 may be identical. In the embodiment corresponding to fig. 2B or fig. 4B, since the plurality of display substrates 12 and the flip-chip film 13 are connected in parallel through the metal wires 24/44, the positions of the conductive balls 125 on each of the sub-wires 2411/the first sub-wires 4411/the second sub-wires 4421 connected to different display substrates 12 are offset from each other, so as to avoid the disorder of the signal transmission between the display substrates 12.

The embodiment of the present application also provides a display device (not shown in the drawings) including the tiled display panel 10 as described above.

In addition to the above embodiments, other embodiments are possible. All technical schemes adopting equivalent replacement or equivalent replacement fall within the protection scope of the application.

In summary, although the preferred embodiments have been described above, the above preferred embodiments are not intended to limit the present application, and those skilled in the art can make various modifications and adaptations without departing from the spirit and scope of the present application, and the scope of the present application is therefore defined by the claims.

Claims

A tiled display panel comprising a display area and a non-display area surrounding the display area, the tiled display panel further comprising:

the cover plate is provided with a metal wire;

the display substrates are positioned in the display areas and are arranged on one side of the cover plate;

the plurality of flip chip films are positioned in the non-display area, each flip chip film is arranged corresponding to the plurality of display substrates, and the plurality of flip chip films and the plurality of display substrates are arranged on the same side of the cover plate;

the metal wire is electrically connected with the flip chip film in the non-display area, and the metal wire is electrically connected with the display substrate in the display area.
The tiled display panel of claim 1, wherein a plurality of the display substrates are arranged in an array tile along a first direction and a second direction, the first direction being perpendicular to the second direction; the display substrate comprises a plurality of pixel units, and the pixel units are arranged corresponding to the metal lines, wherein each pixel unit comprises a plurality of sub-pixels; the cover plate is provided with a first central axis and a second central axis, wherein the extending directions of the first central axis and the second central axis are respectively the first direction and the second direction.
The tiled display panel of claim 2, wherein a plurality of the flip chip films are disposed on opposite sides of the second central axis.
The tiled display panel of claim 3, wherein the metal lines include a plurality of metal lines disposed along the first direction corresponding to the plurality of pixel elements;

and each metal connecting wire in the display area is connected with two adjacent display substrates along the first direction, one end of each metal connecting wire in the non-display area along the first direction is connected with one display substrate, and the other end of each metal connecting wire is bound with one flip-chip film.
The tiled display panel of claim 3, wherein the metal lines include a plurality of sets of metal lines disposed along the first direction and arranged at intervals along the second direction;

wherein, each group of the metal connecting lines is correspondingly arranged with a plurality of the pixel units along the first direction; each group of metal connecting wires comprises a plurality of sub-connecting wires which are mutually spaced along the second direction, one end of each sub-connecting wire in the same group of metal connecting wires along the first direction is respectively connected with different display substrates, and the other end of each sub-connecting wire is bound with the same flip-chip film.
The tiled display panel of claim 2, wherein a plurality of the flip chip films are disposed around the cover plate.
The tiled display panel of claim 6, wherein the metal lines include a plurality of first metal lines and a plurality of second metal lines, the plurality of first metal lines being disposed along the first direction corresponding to the plurality of pixel elements, the plurality of second metal lines being disposed along the second direction corresponding to the plurality of sub-pixels;

wherein, each first metal wire in the display area is connected with two adjacent display substrates along the first direction, one end of each first metal wire in the non-display area is connected with one display substrate along the first direction, and the other end is bound with one flip chip film; and connecting each second metal connecting wire in the display area with two adjacent display substrates along the second direction, connecting one display substrate along the second direction at one end of each second metal connecting wire in the non-display area, and binding the other end of each second metal connecting wire with one flip-chip film along the second direction.
The tiled display panel of claim 6, wherein the metal lines include a plurality of sets of first metal lines and a plurality of sets of second metal lines, the plurality of sets of first metal lines being disposed along the first direction and being spaced apart along the second direction, the plurality of sets of second metal lines being disposed along the second direction and being spaced apart along the first direction;

each group of the first metal connecting lines are correspondingly arranged with the plurality of pixel units along the first direction, and each group of the second metal connecting lines are correspondingly arranged with the plurality of sub-pixels along the second direction; each group of first metal connecting lines comprises a plurality of first sub-connecting lines which are mutually spaced along the second direction, one end of each first sub-connecting line in the same group of first metal connecting lines along the first direction is respectively connected with different display substrates, and the other end of each first sub-connecting line is bound with the same flip-chip film;

each group of second metal connecting lines comprises a plurality of second sub-connecting lines which are mutually spaced along the first direction, one end of each second sub-connecting line in the same group of second metal connecting lines along the second direction is respectively connected with different display substrates, and the other end of each second sub-connecting line is bound with the same flip-chip film.
The tiled display panel of claim 8, wherein an insulating layer is disposed between the plurality of sets of first metal lines and the plurality of sets of second metal lines.
The tiled display panel of claim 1, wherein the display substrate further comprises a drive substrate and a packaging adhesive layer disposed on the drive substrate, wherein conductive balls are disposed in the packaging adhesive layer, and two ends of the conductive balls are respectively connected with the metal wires and the drive substrate.
The tiled display panel of claim 10, further comprising a plurality of light emitting devices, the plurality of light emitting devices being bound to the drive substrate by a metal or anisotropic conductive adhesive film.
A display device comprising the tiled display panel as claimed in claim 1.