CN117769229B - Installation device of equipment monitoring data transmission encryption chip - Google Patents
Installation device of equipment monitoring data transmission encryption chip Download PDFInfo
- Publication number
- CN117769229B CN117769229B CN202410194708.9A CN202410194708A CN117769229B CN 117769229 B CN117769229 B CN 117769229B CN 202410194708 A CN202410194708 A CN 202410194708A CN 117769229 B CN117769229 B CN 117769229B
- Authority
- CN
- China
- Prior art keywords
- resistor
- chip
- triode
- water tank
- liquid level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012544 monitoring process Methods 0.000 title claims description 21
- 230000005540 biological transmission Effects 0.000 title claims description 18
- 238000009434 installation Methods 0.000 title description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 92
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 230000008844 regulatory mechanism Effects 0.000 claims abstract description 10
- 230000005855 radiation Effects 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 16
- 239000003990 capacitor Substances 0.000 claims description 12
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 230000000670 limiting effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 239000000306 component Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
Abstract
The device comprises a heat radiation mechanism, a chip fixing seat, a heat radiation mechanism, a contact detection mechanism, a liquid level detection mechanism, a voltage regulation mechanism and an overtemperature alarm mechanism; the heat dissipation mechanism comprises a water tank and a fan, the contact detection mechanism comprises a supporting frame, a pressure resistor, a screw rod and a prompt circuit, the liquid level detection mechanism is matched with a metal rod, the voltage regulation mechanism and the overtemperature alarm mechanism are matched with a thermistor, and the prompt circuit, the liquid level detection mechanism, the voltage regulation mechanism and the overtemperature alarm mechanism are arranged in the shell and are electrically connected. The invention can conveniently install the chip, can prompt a user to adjust when the chip is not attached to the heat dissipation mechanism, can adjust the working voltage of the fan motor in real time according to the working heat of the chip, and achieves the purposes of saving energy and prolonging the service life of the motor; when the chip exceeds the temperature threshold, the chip can prompt a user to overhaul, and when the liquid level in the water tank is too low, the chip can be timely prompted to add, so that heat dissipation of the chip is ensured.
Description
Technical Field
The invention relates to the technical field of installation and monitoring, in particular to an installation device of an equipment monitoring data transmission encryption chip.
Background
In the industrial field, in order to ensure the normal operation of equipment, various sensors installed at a production end on site are often required to remotely transmit various data of the working equipment to a remote end (such as a monitoring or control room), so that remote staff can conveniently know various data of the production equipment on site (such as temperature, current and voltage data of the production equipment on site, pressure in a pipeline, vibration data of the equipment on site and the like) in real time, and the corresponding data are correspondingly treated on site in time when abnormal, thereby reducing the probability of fault amplification or performing wireless control on the production equipment on site based on various data transmitted on site.
In practical situations, after various data collection of the production end, in order to effectively realize encrypted transmission of data (for example, some military departments and the like, in order to prevent interception by hostile parties in data transmission), a monitoring data transmission encryption chip with encrypted processing data is adopted to cooperate with other components (the composed equipment is commonly called as monitoring equipment in this embodiment), and after various data input by corresponding sensors are classified and encrypted, the data are remotely transmitted in a wireless or wired mode. The monitoring data transmission encryption chip is a core component of the equipment, and the monitoring data transmission encryption chip is a basic stone for ensuring the stable operation of the monitoring data transmission encryption chip and the whole equipment because of higher power consumption and large heat productivity during operation. In the prior art, for the installation and heat dissipation mode of the monitoring data transmission encryption chip, the monitoring data transmission encryption chip is generally inserted into a chip card seat, then an air cooling or water cooling radiator is installed at the upper heating surface end of the monitoring data transmission encryption chip to dissipate heat generated by the operation of the monitoring data transmission encryption chip, so that the working performance of the monitoring data transmission encryption chip (hereinafter referred to as chip) is ensured as much as possible. Although the above-described mounting and heat dissipation methods meet the actual needs to some extent, the following technical drawbacks are also presented due to structural and functional limitations. The method comprises the following steps: the device for fixing the water-cooling or air-cooling heat dissipation mechanism (collectively referred to as the heat dissipation mechanism) is installed in a mode of an immobilized screw nut and a fixing clamp, in practical application, the heat dissipation mechanism is not installed in place or after the follow-up screw nut and the fixing clamp are loosened due to vibration and other factors, the heat dissipation effect of the chip is poor because the heat absorption surface of the heat dissipation mechanism is not effectively attached to the heat generation surface of the chip (although the heat absorption surface of the heat dissipation mechanism can be compressed in a spring mode to be attached to the heat dissipation surface of the chip, when the elasticity of the spring is weakened due to quality factors and the like after a long time, the heat absorption surface of the heat dissipation mechanism cannot be attached to the heat generation surface of the chip), and the user cannot get effective prompt and treatment in time under the condition, so that adverse effects are brought to the working performance of the chip and even damage to the chip are caused. And two,: when the axial flow cooling fan radiates heat to the chip, the axial flow cooling fan is in a power supply long-pass working state in general, so that unnecessary electric energy waste can be brought to the axial flow cooling fan in a full-load working state when the power consumption of the chip is low and the heating value is low; although the prior art has the technology of controlling the axial flow cooling fan to work through the temperature control switch, specifically, when the temperature control switch detects that the chip is lower than the heat threshold value, the power supply of the axial flow cooling fan is disconnected, so that the energy saving purpose is realized, and in the above-mentioned situation, because the motor of the axial flow cooling fan is in a starting and stopping working state more frequently, the instantaneous impact current started after the motor is static can cause adverse effect on the service life of the motor, and the motor current is larger when the motor is started, so that the problem of motor energy consumption exists. In view of the above, it is necessary to provide a device that can easily install a chip and effectively ensure heat dissipation of the chip on the basis of energy saving.
Disclosure of Invention
In order to overcome the defects of the prior chip that the mounting and radiating mechanisms are limited by structures and functions and have the defects as described in the background, the invention provides the mounting device for the equipment monitoring data transmission encryption chip, which can conveniently mount the chip under the combined action of related mechanisms, can detect the contact condition between the radiating surface of the radiating mechanism and the radiating end of the chip in real time, can timely sound to prompt a user to adjust when the radiating surface of the radiating mechanism and the radiating end of the chip are not effectively attached, can adjust the working voltage of the axial flow radiating fan motor in real time according to the working heat of the chip, ensures the effective radiating basis of the chip, also realizes the purposes of saving energy and prolonging the service life of the motor, and can prompt the user to overhaul in time when the temperature of the chip exceeds a temperature threshold under extreme conditions, thereby reducing the damage probability of the chip.
The technical scheme adopted for solving the technical problems is as follows:
The device for mounting the equipment monitoring data transmission encryption chip comprises a heat dissipation mechanism and a chip fixing seat, wherein the chip fixing seat is arranged on a circuit board; the heat radiation mechanism comprises a water tank and an axial flow heat radiation fan, the axial flow heat radiation fan is arranged at the outer upper end of the water tank, and the water tank is provided with a liquid adding pipe; the contact detection mechanism comprises at least two supporting frames, pressure resistors, a screw rod and a prompting circuit, wherein two sides of the lower end of the first supporting frame are respectively arranged at two side ends of the chip fixing seat, the lower end of the second supporting frame is respectively arranged at two sides of the water tank, the upper end of the first supporting frame is provided with a screw hole, and the screw rod is in threaded connection with the screw hole of the first supporting frame; the upper end of the second supporting frame is rotatably provided with a connecting rod, the upper end of the connecting rod is provided with a connecting cylinder, the upper end of the connecting cylinder is provided with an opening, the pressure resistor is arranged in the connecting cylinder, the lower end of the screw rod is provided with a pressing plate, and the pressing plate is positioned at the upper end in the connecting cylinder; the liquid level detection mechanism is matched with a metal rod which is installed in the water tank in an insulating way; the voltage regulating mechanism and the overtemperature alarm mechanism are matched with a thermistor, the lower side of the outer part of the water tank is provided with a mounting groove, and the thermistor is mounted in the mounting groove; the signal output end of the thermistor is electrically connected with the signal input ends of the voltage regulating mechanism and the overtemperature alarming mechanism, and the power output end of the voltage regulating mechanism is electrically connected with the power input end of the axial flow cooling fan; and the signal input end of the prompting circuit is electrically connected with the two ends of the piezoresistor respectively.
Further, the water tank of the heat dissipation mechanism is filled with water, and the lower end of the water tank and the heating surface of the thermistor are tightly attached to the outer side of the upper end of the chip.
Further, the external diameter of clamp plate is less than the internal diameter of connecting cylinder, and the blotter is installed to the lower extreme of clamp plate, and the cushion lower extreme contacts with piezoresistor's atress face upper end.
Further, the prompting circuit of the contact detection mechanism comprises a resistor, a triode and a light emitting diode which are electrically connected, wherein one end of the first resistor is connected with one end of the second resistor, the other end of the first resistor is connected with one end of the third resistor, the other end of the third resistor is connected with a base electrode of the triode, a collector electrode of the triode is connected with a cathode of the light emitting diode, and an anode of the light emitting diode is connected with the other end of the second resistor.
Further, the liquid level detection mechanism comprises a resistor, a light emitting diode and a triode which are electrically connected, and is connected with two metal rods, wherein one end of the first resistor is connected with one end of the second resistor and the positive electrode of the light emitting diode, the other end of the first resistor is connected with the first metal rod, the second metal rod is connected with the base electrode of the first triode, the collector electrode of the first triode is connected with the other end of the second resistor, one end of the third resistor is connected with the base electrode of the second triode, the collector electrode of the second triode is connected with one end of the fourth resistor, the other end of the fourth resistor is connected with the negative electrode of the light emitting diode, and the emitters of the two triodes are connected.
Further, the voltage regulating mechanism comprises a capacitor, a three-terminal voltage regulator and a resistor which are electrically connected, one end of each capacitor is connected with the power input end and the power output end of the three-terminal voltage regulator respectively, and the other end of each capacitor is connected with one end of the resistor.
Further, the overtemperature alarm mechanism comprises a diode, an adjustable resistor, a triode and a buzzer which are electrically connected, wherein the positive power input end of the buzzer is connected with the collector of the triode, the base of the triode is connected with one end of the adjustable resistor, and the other end of the adjustable resistor is connected with the positive electrode of the diode.
Compared with the prior art, the invention has the beneficial effects that: (1) The invention can conveniently install the chip, can detect the contact condition between the radiating surface of the radiating mechanism and the radiating end of the chip in real time, can timely sound to prompt a user to adjust through the contact detecting mechanism when the radiating surface of the radiating mechanism and the radiating end of the chip are not effectively bonded, and the voltage adjusting mechanism can adjust the working voltage of the axial flow radiating fan motor in real time according to the working heat of the chip, thereby realizing the purposes of saving energy and prolonging the service life of the motor on the basis of ensuring the effective radiating of the chip; (2) The overtemperature alarm mechanism can prompt a user to overhaul in time when the temperature of the chip exceeds a temperature threshold under the extreme condition, so that the damage probability of the chip is reduced, and the liquid level detection mechanism can prompt the user to add when the liquid level in the water tank is too low, so that the effective heat dissipation of the chip is ensured.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of the overall structure and a schematic diagram of a partial enlarged structure of the present invention.
Fig. 2 is a circuit diagram of the present invention.
Detailed Description
The device comprises a power supply mechanism A1, a chip fixing seat 1, a heat dissipation mechanism, a contact detection mechanism, a liquid level detection mechanism 4, a voltage regulation mechanism 5 and an overtemperature alarm mechanism 6, wherein a plurality of pins below the periphery of the monitoring data transmission encryption chip 2 are respectively inserted into a plurality of jacks (the welding pins connected with the lower end are connected with corresponding electronic components on the circuit board) around the upper end of the chip fixing seat 1; the heat dissipation mechanism comprises a water tank 7 and an axial flow heat dissipation fan M, wherein the axial flow heat dissipation fan M is horizontally arranged in the middle of the outer upper end of the water tank 7 through a bolt, a liquid adding pipe 71 communicated with the water tank is welded on the rear right side of the upper end of the water tank 7, a hose is tightly sleeved on the liquid adding pipe in a sealing way, and the upper end of the hose (filled with water in the water tank through the hose) is positioned outside the upper end of the monitoring equipment shell; the contact detection mechanism comprises two n-shaped supporting frames 31 and 32, a pressure resistor RT, a screw rod 33 and a prompting circuit 34, wherein the two supporting frames are respectively arranged at the two sides of the lower end of the first supporting frame 31 on the middle parts of the two sides of the chip fixing seat 1 through bolts, the lower end of the second supporting frame 32 is respectively welded at the two outer sides of the upper end of the water tank 7, a bearing seat is arranged at the middle part of the upper end of the second supporting frame 32 through bolts, a screw hole is arranged at the middle part of the upper end of the first supporting frame 31, the middle part of the screw rod 33 is in threaded connection with the screw hole of the first supporting frame 31, and a handle 35 (the screw rod is convenient to rotate) is welded at the upper end of the screw rod; a connecting rod 36 is tightly sleeved in the bearing inner ring of the bearing seat of the second support frame 32, a connecting cylinder 37 is welded at the upper end of the connecting rod, an opening is formed in the middle of the upper end of the connecting cylinder 37, a pressure resistor RT is horizontally and insulatively arranged at the lower end in the connecting cylinder 37, a pressing plate 38 is welded at the lower end of the screw rod, the pressing plate 38 is positioned at the upper end in the connecting cylinder 37, and the lower end of the screw rod 33 is positioned in the opening at the upper end of the connecting cylinder 37 (the inner diameter of the opening is larger than the outer diameter of the screw rod); the liquid level detection mechanism 4 is matched with two metal copper rods Q, the two copper rods Q are distributed and insulated at the inner lower end of the water tank 7 at 2mm horizontal intervals (wires connected with the two copper rods are led out through holes at the left lower end of the water tank, and the holes are sealed by sealant); the voltage regulating mechanism and the overtemperature alarm mechanism are matched with a thermistor RK, the middle part of the outer lower side of the water tank 7 is provided with an upward concave mounting groove 72, the thermistor RK is tightly sleeved in the mounting groove 72, and the heating surface of the thermistor RK is positioned at the lower end and is in the same plane with the outer lower side of the water tank 7; the prompting circuit 34, the power supply mechanism A1, the liquid level detection mechanism 4, the voltage regulation mechanism 5 and the overtemperature alarm mechanism 6 are arranged in the element box 8 at the upper end of the shell of the monitoring equipment.
As shown in fig. 1 and 2, the water tank 7 of the heat dissipation mechanism is filled with water, and the lower end of the water tank 7 and the heating surface of the thermistor RK are closely attached to the outer side of the upper end of the encryption chip 2. The external diameter of the pressing plate 38 is slightly smaller than the internal diameter of the connecting cylinder 37, a buffer rubber cushion with the same external diameter is adhered to the lower end of the pressing plate 38 by using glue (the pressure resistor RT is protected), and the lower end of the rubber cushion is contacted with the upper end of the stress surface of the pressure resistor RT. The prompting circuit of the contact detection mechanism comprises resistors R1, R2 and R3 which are connected through wiring of a circuit board and a triode T1, a light emitting diode V1, one end of the resistor R1 is connected with one end of the resistor R3, the other end of the resistor R1 is connected with one end of the resistor R2, the other end of the resistor R2 is connected with a base electrode of the triode T1, a collector electrode of the triode T1 is connected with a cathode of the light emitting diode V1, and an anode of the light emitting diode V1 is connected with the other end of the resistor R3. The liquid level detection mechanism comprises resistors R4, R5, R6 and R7 which are connected through wiring of a circuit board, a light emitting diode V2, triodes T2 and T3, and are connected with two copper rods Q through wires, one end of the resistor R4 is connected with one end of the resistor R5, the positive electrode of the light emitting diode V2, the other end of the resistor R4 is connected with the outer end of the first copper rod Q, the outer end of the second copper rod Q is connected with the base electrode of the first triode T2, the collector electrode of the first triode T2 is connected with the other end of the resistor R5, one end of the resistor R6 is connected with the base electrode of the second triode T3, the collector electrode of the second triode T3 is connected with one end of the resistor R7, the other end of the resistor R7 is connected with the negative electrode of the light emitting diode V2, the emitters of the two triodes T1 and T2 are connected. The voltage regulating mechanism comprises capacitors C1 and C2, a three-terminal voltage regulator A2 and a resistor R8 which are connected through wiring of a circuit board, one end of each of the two capacitors C1 and C2 is connected with a pin 1 of a power input end and a pin 3 of a power output end of the three-terminal voltage regulator A2 respectively, and the other end of each of the two capacitors C1 and C2 is connected with one end of the resistor R8. The overtemperature alarm mechanism comprises a diode VD, an adjustable resistor RP, a triode T4 and a buzzer B which are connected through circuit board wiring, wherein the positive power input end of the buzzer B is connected with the collector of the triode T4, the base of the triode T4 is connected with one end of the adjustable resistor RP, and the other end of the adjustable resistor RP is connected with the positive electrode of the diode VD. The power input ends 1 and 2 pins of the power mechanism A1 and the two poles of an alternating current 220V power supply are respectively connected through wires, the power output ends 3 and 4 pins of the power mechanism A1 and the power input end resistor R5 end of the liquid level detection mechanism, the emitting electrode of the triode T2, the two ends of the power input end capacitor C1 of the voltage regulation mechanism, the emitting electrode of the power input end triode T4 of the overtemperature alarm mechanism and the negative power input end of the buzzer B, and the power input end resistor R1 end of the prompting circuit and the emitting electrode of the triode T1 are respectively connected through wires. The two ends of the thermistor RK are respectively connected with the other end of the resistor R8 and the 2 pin of the three-terminal voltage regulator A2 through wires, and the other end of the resistor R8 is connected with the cathode of the diode VD through wires. The 3 pin and the 2 pin of the three-terminal voltage stabilizer A2 at the power output end of the voltage regulating mechanism are respectively connected with the two ends of the power input end of the axial flow cooling fan M through wires. The other end of the signal input end resistor R1 of the prompting circuit and the two ends of the emitter of the triode T1 and the two ends of the pressure resistor RT are respectively connected through wires.
As shown in fig. 1 and 2, after the user installs the encryption chip 2 on the chip fixing base 1, and then adjusts by hand through the handle 35 and rotates the screw 33 clockwise, the screw 33 pushes the pressing plate 38 to move downwards along the internal thread of the screw hole at the upper end of the supporting frame 31, the pressing plate 38 pushes the connecting cylinder 37 to move downwards, the connecting rod 36 rotates along the bearing inner ring (the connecting cylinder 37 does not rotate, the wire connected with the piezoresistor RT is led out outwards through the opening at the lower left end of the connecting cylinder), so that the supporting frame 32 pushes the lower end of the water tank 7 to contact the upper end of the chip, and then the chip is effectively radiated. When the user adjusts the screw 33 by hand through the handle 35 and rotates the screw 33 anticlockwise, the screw 33 drives the pressing plate 38 to move upwards along the internal thread of the screw hole at the upper end of the supporting frame 31, the pressing plate 38 drives the connecting cylinder 37 to move upwards, and thus the supporting frame 32 drives the lower end of the water tank 7 and the upper end of the chip to pull the distance, and the chip is taken down according to the requirement. After the alternating current 220V power supply enters the power supply input end of the power supply mechanism A1, the 3 pin and the 4 pin of the power supply mechanism A1 output stable direct current 12V power supply to enter the power supply input ends of the liquid level detection mechanism, the voltage regulation mechanism, the overtemperature alarm mechanism and the prompt circuit, and the circuits are electrically operated. In practical situations, when the lower end of the water tank is not in effective contact with the upper end of the chip, the acting force of the lower end of the pressing plate 38 on the stress surface of the pressure resistor RT along the downward direction in the connecting cylinder is low, the resistance value of the pressure resistor RT is large, the voltage division between the resistor R1 is large, the 12V power supply is divided by the pressure resistor RT and the resistor R1, the voltage reduction and current limiting of the resistor R2 enter the base electrode of the triode T1 to be higher than 0.7V, the triode T1 can conduct the collector electrode to output low level to enter the cathode of the light-emitting diode V1, the light-emitting diode V1 emits light, and the lower end of the water tank is not in effective contact with the upper end of the chip. When the lower end of the water tank is effectively contacted with the upper end of the chip, the acting force of the lower end of the pressing plate 38 acting on the stress surface of the pressure resistor RT downwards along the inside of the connecting cylinder is large, the resistance value of the pressure resistor RT is small, the voltage division between the resistor R1 and the resistor RT is large, the 12V power supply is divided by the pressure resistor RT is divided by the resistor R1, the voltage reduction and current limitation of the resistor R2 enter the base electrode of the triode T1 to be lower than 0.7V, the triode T1 can stop the collector and no longer output low level to enter the negative power supply input end of the light emitting diode V1, the light emitting diode V1 does not emit light any more, the lower end of the water tank is effectively contacted with the upper end of the chip (the voltage reduction and current limitation of the resistor R3), the user can stop adjusting after the light emitting diode V1 is not seen to emit light (the water tank is ensured to be effectively contacted with the outside the upper end of the encryption chip 2), in the subsequent practical application, the LED V1 emits light, so that the lower end of the water tank can be timely known that the lower end of the water tank is not effectively contacted with the upper end of the encryption chip 2 due to various reasons, the screw can be timely adjusted, and the heat dissipation of the encryption chip 2 through the water tank and the axial flow heat dissipation fan M is effectively ensured. The axial flow cooling fan M generates wind power after being electrified to blow away the heat generated after the water tank 7 absorbs the work of the encryption chip 2 to the air, thereby playing a role in cooling the water tank 7 and correspondingly playing a role in effectively cooling the chip. Through the structure, the chip can be conveniently installed, the contact condition between the radiating surface of the radiating mechanism and the radiating end of the chip can be detected in real time, and when the radiating surface and the radiating end are not effectively attached, the radiating surface of the radiating mechanism and the radiating end of the chip can timely emit light to prompt a user to adjust through the contact detecting mechanism, so that the radiating mechanism is ensured to effectively radiate the chip.
In the liquid level detection mechanism shown in fig. 1 and 2, when the water volume in the water tank is more, the water can submerge two copper bars Q, the resistance value between the two copper bars Q becomes small, the 12V power supply is reduced in voltage and limited in current through the resistor R4, the two copper bars Q enter the base electrode of the triode T2, the triode T2 is conducted, the collector electrode outputs low level and enters the base electrode of the triode T3, the triode T3 is cut off, and then the light emitting diode V2 cannot emit light to represent that the water volume in the water tank is still sufficient. When the water quantity in the water tank is small, the water can not submerge two copper rods Q, the resistance value between the two copper rods Q becomes infinite, a 12V power supply can not enter the base electrode of the triode T2 through the two copper rods Q, the cut-off collector electrode of the triode T2 can not output low level to enter the base electrode of the triode T3, the base electrode of the triode T3 is subjected to voltage reduction and current limiting through the resistors R6 and R5, proper forward bias conduction is obtained from the positive electrode of the 12V power supply, the conduction collector electrode of the triode T3 outputs low level to enter the negative electrode power supply input end of the light-emitting diode V2, then the light-emitting diode V2 can obtain electric luminescence, the water quantity in the water tank is small, the water quantity in the water tank needs to be added, a user can timely add after seeing the light-emitting diode, and the water tank is guaranteed to absorb heat to a chip effectively.
In fig. 1 and 2, after the voltage regulating mechanism is powered on, when the heating surface of the thermistor RK contacts the upper end of the chip, the resistance value is lower as the temperature is higher, otherwise the resistance value is higher, in practical cases, after the three-terminal voltage regulator A2 is powered on, under the combined action of the internal circuit and the peripheral element capacitors C1 and C2 (filtering action), the resistance value between the 2 pin and the power ground (the power output by the 4 pins of the power supply mechanism A1) is changed, so that the voltage output by the 3 pins can be changed, specifically, the motor power voltage output by the 3 pins to the axial flow radiator fan M is higher as the resistance value is higher, and is lower otherwise. Because the higher the chip temperature is, the lower the resistance value of the thermistor RK is, and the lower the resistance of the three-terminal voltage regulator A2 is, then the 3-terminal voltage regulator A2 is output to the motor power supply voltage of the axial flow cooling fan M to be higher, the larger the wind power generated by the high working voltage is, the heat dissipation requirement of the axial flow cooling fan M on the water tank and the chip is met when the chip temperature is high, and the effective heat dissipation of the chip is ensured (the temperature is increased after the water in the water tank absorbs heat, the heat dissipation of the water in the water tank is reduced, the water temperature is reduced, and the chip temperature is also reduced). Because the lower the chip temperature is, the higher the resistance value of the thermistor RK is, and the 2 feet of the three-terminal voltage regulator A2 are grounded through the thermistor RK and the resistor R8 to become high, then the motor power supply voltage of the three-terminal voltage regulator A2 output to the axial flow cooling fan M is lower, the lower the wind power generated by the axial flow cooling fan M due to low working voltage is, and the heat dissipation requirement on the water tank and the chip is met when the chip temperature is low (the energy saving purpose is realized on the basis of reducing the water heat dissipation in the water tank and the temperature of the chip).
In the overtemperature alarm mechanism shown in fig. 1 and 2, when the chip can effectively dissipate heat and the upper end of the chip acts on the heating surface of the thermistor RK, the heat is low, the resistance value of the thermistor RK is large (the voltage division is large), the 12V power supply ground is conducted unidirectionally through the thermistor RK and the resistor R8 through the diode VD, the adjustable resistor RP is used for reducing the voltage and limiting the current, the base electrode of the triode T4 is lower than 0.7V, the triode T4 is not conducted, the buzzer B cannot generate electricity and sound, and the chip can effectively dissipate heat. Under extreme conditions, when the chip cannot effectively dissipate heat and the upper end of the chip acts on the heating surface of the thermistor RK, the heat is high, the resistance value of the thermistor RK is small (the voltage division is small), the 12V power supply ground is divided by the thermistor RK and the resistor R8 and is conducted unidirectionally by the diode VD, the adjustable resistor RP is used for reducing the voltage and limiting the current to enter the base electrode of the triode T4 to be higher than 0.7V, the triode T4 can conduct the collector to output low level to enter the negative power supply input end of the buzzer B, the buzzer B obtains electric sounding to prompt the user that the chip is overtemperature, and the user can timely find out reason maintenance, so that the stable and reliable operation of the whole equipment is ensured. In fig. 2, the power supply mechanism A1 is a finished product of a power supply module for converting alternating current 220V into direct current 12V; the resistances of the resistors R1, R2, R3, R4, R5, R6, R7 and R8 are respectively 10K, 47K, 1.8K, 40K, 100K, 47K, 1.8K and 100deg.C; the thermistor RK (the circuit symbol in fig. 2 is the circuit drawing symbol of the thermistor) is a negative temperature coefficient thermistor of model NTC 103D; the specifications of the capacitors C1 and C2 are 0.1 mu F; the triodes T1, T3 and T4 are NPN triodes of model 9013; triode T4 is a PNP triode of model 9012; the buzzer B is an active continuous sound buzzer alarm with the model MF 12V; the model A2 of the three-terminal voltage stabilizer is 7812 of direct current 12V voltage stabilizer; the light emitting diodes V1, V2 (the circuit symbol in fig. 2 is a circuit drawing symbol of the light emitting diode) are red light emitting diodes; the model VD of the diode is 1N4007; the power of the axial flow heat radiation fan M is 15W; the piezoresistor RT model is FSR402; the resistance of the adjustable resistor RP is 4.7M.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the two components can be connected mechanically and electrically, can be directly connected, can be indirectly connected through an intermediate medium, and can be communicated with each other inside the two components. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (1)
1. The device for mounting the equipment monitoring data transmission encryption chip comprises a heat dissipation mechanism and a chip fixing seat, wherein the chip fixing seat is arranged on a circuit board; the heat dissipation mechanism comprises a water tank and a fan, the fan is arranged at the upper end outside the water tank, and the water tank is provided with a liquid adding pipe; the contact detection mechanism comprises at least two supporting frames, pressure resistors, a screw rod and a prompting circuit, wherein two sides of the lower end of the first supporting frame are respectively arranged at two side ends of the chip fixing seat, the lower end of the second supporting frame is respectively arranged at two sides of the water tank, the upper end of the first supporting frame is provided with a screw hole, and the screw rod is in threaded connection with the screw hole of the first supporting frame; the upper end of the second supporting frame is rotatably provided with a connecting rod, the upper end of the connecting rod is provided with a connecting cylinder, the upper end of the connecting cylinder is provided with an opening, the pressure resistor is arranged in the connecting cylinder, the lower end of the screw rod is provided with a pressing plate, and the pressing plate is positioned at the upper end in the connecting cylinder; the liquid level detection mechanism is matched with a metal rod which is installed in the water tank in an insulating way; the voltage regulating mechanism and the overtemperature alarm mechanism are matched with a thermistor, the lower side of the outer part of the water tank is provided with a mounting groove, and the thermistor is mounted in the mounting groove; the prompt circuit, the liquid level detection mechanism, the voltage regulation mechanism and the overtemperature alarm mechanism are arranged in the shell, the signal output end of the thermistor is electrically connected with the signal input ends of the voltage regulation mechanism and the overtemperature alarm mechanism, and the power output end of the voltage regulation mechanism is electrically connected with the power input end of the fan; the signal input end of the prompting circuit is electrically connected with the two ends of the piezoresistor respectively; the water tank of the heat radiation mechanism is filled with water, and the lower end of the water tank and the heating surface of the thermistor are tightly attached to the outer side of the upper end of the chip; the outer diameter of the pressing plate is smaller than the inner diameter of the connecting cylinder, the lower end of the pressing plate is provided with a buffer cushion, and the lower end of the rubber cushion is contacted with the upper end of the stress surface of the pressure resistor; the prompting circuit of the contact detection mechanism comprises a resistor, a triode and a light-emitting diode which are electrically connected, wherein one end of the first resistor is connected with one end of the second resistor, the other end of the first resistor is connected with one end of the third resistor, the other end of the third resistor is connected with the base electrode of the triode, the collector electrode of the triode is connected with the cathode of the light-emitting diode, and the anode of the light-emitting diode is connected with the other end of the second resistor; the liquid level detection mechanism comprises resistors, light emitting diodes and triodes which are electrically connected, and is connected with two metal rods, wherein one end of the first resistor is connected with one end of the second resistor and the positive electrode of the light emitting diode, the other end of the first resistor is connected with the first metal rod, the second metal rod is connected with the base electrode of the first triode, the collector electrode of the first triode is connected with the other end of the second resistor, one end of the third resistor is connected with the base electrode of the second triode, the collector electrode of the second triode is connected with one end of the fourth resistor, the other end of the fourth resistor is connected with the negative electrode of the light emitting diode, and the emitters of the two triodes are connected; the voltage regulating mechanism comprises a capacitor, a three-terminal voltage regulator and a resistor which are electrically connected, one end of each capacitor is connected with the power input end and the power output end of the three-terminal voltage regulator respectively, and the other end of each capacitor is connected with one end of the resistor; the overtemperature alarm mechanism comprises an electrically connected diode, an adjustable resistor, a triode and a buzzer, wherein the positive power input end of the buzzer is connected with the collector of the triode, the base of the triode is connected with one end of the adjustable resistor, and the other end of the adjustable resistor is connected with the positive electrode of the diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410194708.9A CN117769229B (en) | 2024-02-22 | 2024-02-22 | Installation device of equipment monitoring data transmission encryption chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410194708.9A CN117769229B (en) | 2024-02-22 | 2024-02-22 | Installation device of equipment monitoring data transmission encryption chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117769229A CN117769229A (en) | 2024-03-26 |
| CN117769229B true CN117769229B (en) | 2024-05-24 |
Family
ID=90314789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410194708.9A Active CN117769229B (en) | 2024-02-22 | 2024-02-22 | Installation device of equipment monitoring data transmission encryption chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117769229B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015027592A1 (en) * | 2013-08-26 | 2015-03-05 | 浙江正泰电器股份有限公司 | Time relay used for metal halide lamp loads |
| CN217213488U (en) * | 2022-05-26 | 2022-08-16 | 北京亿东信息科技有限公司 | Industrial intelligent production control system based on big data |
| CN114964600A (en) * | 2022-05-16 | 2022-08-30 | 宁波工程学院 | Water flow pressure detection equipment of water meter |
| CN116519479A (en) * | 2023-03-16 | 2023-08-01 | 西华大学 | Tunnel concrete lining stress performance test equipment |
| CN219589193U (en) * | 2023-03-27 | 2023-08-25 | 珂赛达(上海)半导体科技有限公司 | Novel semiconductor refrigerator temperature control device |
| CN116860090A (en) * | 2023-07-19 | 2023-10-10 | 深圳市丰稔实业有限公司 | Heat abstractor of display chip |
| CN219990045U (en) * | 2023-05-06 | 2023-11-10 | 上海亥博胶粘材料有限公司 | Storage bottle for producing sealant |
| CN220078881U (en) * | 2023-06-29 | 2023-11-24 | 上海言泰科技有限公司 | Novel laboratory pure water preparation device |
-
2024
- 2024-02-22 CN CN202410194708.9A patent/CN117769229B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015027592A1 (en) * | 2013-08-26 | 2015-03-05 | 浙江正泰电器股份有限公司 | Time relay used for metal halide lamp loads |
| CN114964600A (en) * | 2022-05-16 | 2022-08-30 | 宁波工程学院 | Water flow pressure detection equipment of water meter |
| CN217213488U (en) * | 2022-05-26 | 2022-08-16 | 北京亿东信息科技有限公司 | Industrial intelligent production control system based on big data |
| CN116519479A (en) * | 2023-03-16 | 2023-08-01 | 西华大学 | Tunnel concrete lining stress performance test equipment |
| CN219589193U (en) * | 2023-03-27 | 2023-08-25 | 珂赛达(上海)半导体科技有限公司 | Novel semiconductor refrigerator temperature control device |
| CN219990045U (en) * | 2023-05-06 | 2023-11-10 | 上海亥博胶粘材料有限公司 | Storage bottle for producing sealant |
| CN220078881U (en) * | 2023-06-29 | 2023-11-24 | 上海言泰科技有限公司 | Novel laboratory pure water preparation device |
| CN116860090A (en) * | 2023-07-19 | 2023-10-10 | 深圳市丰稔实业有限公司 | Heat abstractor of display chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117769229A (en) | 2024-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN117769229B (en) | Installation device of equipment monitoring data transmission encryption chip | |
| CN214336742U (en) | Combined infrared transmitting tube support | |
| CN2573693Y (en) | Water-cooled engine temp. controller | |
| CN114110545A (en) | Device for keeping temperature of LED lamp constant | |
| CN217116791U (en) | Isolated driving power supply | |
| CN218095854U (en) | LED lamp heat radiation structure | |
| CN220674246U (en) | Remote alarm device for network machine room fault | |
| CN212164024U (en) | High-effect heat dissipation integrated circuit board that unmanned aerial vehicle used | |
| CN212568993U (en) | Novel electric power instrument | |
| CN218763983U (en) | Heating rack assembly device with over-high temperature and short circuit alarm reminding functions | |
| CN218243195U (en) | Low-energy-consumption permanent magnet speed regulation motor for hydraulic station | |
| CN221203126U (en) | Temperature control device of special motor | |
| CN220068144U (en) | Wireless safety monitoring equipment | |
| CN210490714U (en) | Variable pitch frequency converter of wind generating set and motor test platform | |
| CN212696422U (en) | Intelligent fuel automobile generator voltage regulator with good heat dissipation effect | |
| CN210867604U (en) | Power amplifier device | |
| CN219321517U (en) | Battery protection assembly of electric scooter | |
| CN221352180U (en) | Overheat alarm structure of electric tool | |
| CN217823847U (en) | Power supply device for engine controller | |
| CN215300417U (en) | Driver convenient to disassemble, assemble and maintain | |
| CN216356635U (en) | Multifunctional photovoltaic junction box | |
| CN212519219U (en) | Refrigeration type weak current engineering security protection supervisory equipment | |
| CN220796588U (en) | Over-temperature protection device for automobile motor controller | |
| CN220823559U (en) | LED lamp control panel heat radiation structure | |
| CN210273739U (en) | Fan with heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |