CN117769135A - Circuit board processing method and device and circuit board - Google Patents
Circuit board processing method and device and circuit board Download PDFInfo
- Publication number
- CN117769135A CN117769135A CN202311826201.2A CN202311826201A CN117769135A CN 117769135 A CN117769135 A CN 117769135A CN 202311826201 A CN202311826201 A CN 202311826201A CN 117769135 A CN117769135 A CN 117769135A
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- China
- Prior art keywords
- circuit board
- flexible circuit
- opposite ends
- butt joint
- shaping
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Links
- 238000003672 processing method Methods 0.000 title abstract description 8
- 238000007493 shaping process Methods 0.000 claims abstract description 62
- 238000003825 pressing Methods 0.000 claims abstract description 39
- 210000001503 joint Anatomy 0.000 claims abstract description 36
- 238000005452 bending Methods 0.000 claims abstract description 24
- 238000011282 treatment Methods 0.000 claims abstract description 23
- 238000011221 initial treatment Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000047 product Substances 0.000 description 6
- 238000003475 lamination Methods 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a processing method and device of a circuit board, and the circuit board, wherein the processing method of the circuit board comprises the following steps: performing primary treatment on the flexible circuit board; bending the flexible circuit board subjected to the preliminary treatment; butt-jointing and pressing the two opposite ends of the flexible circuit board after the bending treatment to form the flexible circuit board with a closed curved surface; and shaping the butt joint of the two opposite ends of the flexible circuit board. After the two opposite ends of the flexible circuit board after bending treatment are mutually butted and pressed, the butt joint positions of the two opposite ends of the flexible circuit board are shaped, so that the corrugations existing at the butt joint positions of the two opposite ends of the flexible circuit board after pressing can be shaped well effectively, and the service performance of a final finished product can meet the requirements.
Description
Technical Field
The present invention relates to the field of circuit boards, and in particular, to a method and an apparatus for processing a circuit board, and a circuit board.
Background
Nowadays, as the requirements for improving the quality of flexible printed circuit boards so as to have good performance are gradually increased in the industry, the requirements for corresponding manufacturing processes thereof are also increasing.
However, when the flexible printed circuit board is used to manufacture the antenna flexible printed circuit board with the hollow circular tube structure, a joint point is necessarily present in the 360-degree lamination process of the flexible printed circuit board, and the prior art cannot realize the 360-degree seamless lamination process, so that after lamination is completed, a crease phenomenon exists at the joint point, and the usability of the final product is affected.
Disclosure of Invention
In order to solve the problem that in the prior art, a 360-degree seamless lamination process cannot be realized, so that after lamination is completed, a crease phenomenon exists at the joint point, and the usability of a final finished product is affected.
In a first aspect, the present invention provides a method for processing a circuit board, including:
performing primary treatment on the flexible circuit board;
bending the flexible circuit board subjected to the preliminary treatment;
butt-jointing and pressing the two opposite ends of the flexible circuit board after the bending treatment to form the flexible circuit board with a closed curved surface;
and shaping the butt joint of the two opposite ends of the flexible circuit board.
In some alternative embodiments, the preliminary processing of the flexible circuit board includes:
and performing pattern transfer and circuit etching on the flexible circuit board.
In some alternative embodiments, the bending process of the flexible circuit board after the preliminary processing includes:
and the flexible circuit board after preliminary treatment is clung to the outer surface of the first pressing die so as to be bent.
In some alternative embodiments, the second press-fit die is a hollow cylindrical structural member including an opening;
the butt joint and pressing of the two opposite ends of the flexible circuit board after the bending treatment are carried out to form the flexible circuit board with a closed curved surface, comprising:
and sleeving the second pressing die on the flexible circuit board subjected to bending treatment so as to enable the two opposite ends of the flexible circuit board to be mutually butted, locking the opening of the second pressing die, heating the opening to a preset temperature, and pressing the butted part of the flexible circuit board at the preset temperature of 150-170 ℃ to form the flexible circuit board with a closed curved surface.
In some alternative embodiments, the shaping the interface between the opposite ends of the flexible circuit board includes:
inserting and tightly attaching a first shaping clamp to the inner wall of the closed curved surface, wherein the contact part of the first shaping clamp and the flexible circuit board comprises the butt joint parts of the two opposite ends of the flexible circuit board;
and tightly attaching the part of the flexible circuit board, which comprises the butt joint part, to a groove of a second shaping clamp so as to shape the butt joint part, wherein the shape of the second shaping clamp is matched with that of the first shaping clamp.
In a second aspect, the present invention provides a processing device for a circuit board, including a first press mold, a second press mold, a first shaping fixture and a second shaping fixture, wherein:
the outer surface of the first pressing die is clung to the flexible circuit board so as to bend the flexible circuit board;
the second pressing die is a hollow cylindrical structural member provided with an opening, is sleeved on the bent flexible circuit board and is used for enabling the opposite ends of the flexible circuit board to be in butt joint for pressing, so that the flexible circuit board with a closed curved surface is formed;
the first shaping clamp is inserted into and clung to the inner wall of the closed curved surface, and the contact part of the first shaping clamp and the flexible circuit board comprises the butt joint parts of the two opposite ends of the flexible circuit board;
the second shaping clamp is matched with the first shaping clamp, the second shaping clamp is provided with a groove, the butt joint part is clung to the groove, and shaping is carried out at the butt joint part.
In some alternative embodiments, the first press-fit die is a metal structural round tube.
In some alternative embodiments, the first press mold is a hollow semi-cylindrical structural member.
In some alternative embodiments, the recess is mated with a curved portion of the first compression mold.
In a third aspect, the present invention provides a circuit board, which is obtained by the processing method of the circuit board in the first aspect.
Based on the technical scheme, the processing method of the circuit board provided by the invention has the beneficial effects that compared with the prior art:
after the two opposite ends of the flexible circuit board after bending treatment are mutually butted and pressed, the butt joint positions of the two opposite ends of the flexible circuit board are shaped, so that the buckling and shaping existing at the butt joint positions of the two opposite ends of the flexible circuit board after pressing can be effectively shaped, and the service performance of a final finished product can meet the requirements.
Drawings
Fig. 1 is a flow chart of a processing method of a circuit board according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1, an embodiment of a first aspect of the present invention provides a method for processing a circuit board, including:
step S1: performing primary treatment on the flexible circuit board;
step S2: bending the flexible circuit board subjected to the preliminary treatment;
step S3: butt-jointing and pressing the two opposite ends of the flexible circuit board after the bending treatment to form the flexible circuit board with a closed curved surface;
step S4: and shaping the butt joint of the two opposite ends of the flexible circuit board.
According to the processing method of the circuit board, after the two opposite ends of the flexible circuit board after being subjected to bending treatment are mutually butted and pressed, the butted positions of the two opposite ends of the flexible circuit board are shaped, so that the buckling patterns existing at the butted positions of the two opposite ends of the flexible circuit board after being pressed can be shaped well, and the service performance of a final finished product can meet requirements.
In some optional embodiments, in step S1, the performing a preliminary processing on the flexible circuit board includes: and performing pattern transfer and circuit etching on the flexible circuit board. Specifically, to ensure that a hollow antenna flexible printed circuit board without wrinkles is finally manufactured, after a flexible circuit board is obtained, a preliminary treatment is performed on the flexible circuit board, for example, dry film pasting, pattern transfer, preset circuit etching are performed on the flexible circuit board, and further etching and cleaning are performed on the surface of the flexible circuit board, and then the surface of the flexible circuit board is milled according to preset shapes so as to correspond to patches.
In some alternative embodiments, the bending process of the flexible circuit board after the preliminary processing includes: and the flexible circuit board after preliminary treatment is clung to the outer surface of the first pressing die so as to be bent. The flexible circuit board after the bending treatment can be of a circular tube structure with consistent inner diameter, or of a circular tube structure with the inner diameter gradually decreasing from one end to the other end.
In some alternative embodiments, the second press-fit die is a hollow cylindrical structural member including an opening;
the butt joint and pressing of the two opposite ends of the flexible circuit board after the bending treatment are carried out to form the flexible circuit board with a closed curved surface, comprising:
and sleeving the second pressing die on the flexible circuit board subjected to bending treatment so as to enable the two opposite ends of the flexible circuit board to be mutually butted, locking the opening of the second pressing die, heating the opening to a preset temperature, and pressing the butted part of the flexible circuit board at the preset temperature of 150-170 ℃ to form the flexible circuit board with a closed curved surface. Before the butt joint of the two opposite ends of the flexible circuit board which is arranged in a bending way is pressed, the flexible circuit board is placed into an oven to be heated to any reasonable temperature of 150-170 ℃ and then the butt joint is pressed, and the subsequent shaping process is completed.
In some alternative embodiments, the shaping the interface between the opposite ends of the flexible circuit board includes:
inserting and tightly attaching a first shaping clamp to the inner wall of the closed curved surface, wherein the contact part of the first shaping clamp and the flexible circuit board comprises the butt joint parts of the two opposite ends of the flexible circuit board;
and tightly attaching the part of the flexible circuit board, which comprises the butt joint part, to a groove of a second shaping clamp so as to shape the butt joint part, wherein the shape of the second shaping clamp is matched with that of the first shaping clamp.
In this embodiment, the groove of the second shaping fixture is matched with the curved surface portion of the first shaping fixture, which is tightly attached to the flexible circuit board, so as to clamp the joint of the flexible circuit board from the inner side and the outer side, thereby removing the gap between the joint of the flexible circuit board and the first shaping fixture, so that the flexible circuit board can smoothly transition at the joint of the flexible circuit board, and no crease exists, and the 360-degree smooth transition of the circuit board of the final product is ensured.
According to a second aspect of the present application, a processing device for a circuit board is provided, including a first press-fit die, a second press-fit die, a first shaping jig and a second shaping jig, wherein:
the outer surface of the first pressing die is clung to the flexible circuit board so as to bend the flexible circuit board;
the second pressing die is a hollow cylindrical structural member provided with an opening, is sleeved on the bent flexible circuit board and is used for enabling the opposite ends of the flexible circuit board to be in butt joint for pressing, so that the flexible circuit board with a closed curved surface is formed;
the first shaping clamp is inserted into and clung to the inner wall of the closed curved surface, and the contact part of the first shaping clamp and the flexible circuit board comprises the butt joint parts of the two opposite ends of the flexible circuit board; the first shaping jig may be a hollow or solid semi-cylindrical structure, and in other embodiments, the first shaping jig may also be a circular tube or a cylinder structure, and the outer diameter thereof is slightly smaller than the inner diameter of the flexible circuit board with a closed curved surface, so that the outer surface of the first shaping jig can be closely attached to the inner wall of the flexible circuit board when the first shaping jig is inserted into the flexible circuit board with a closed curved surface;
the second shaping clamp is matched with the first shaping clamp, the second shaping clamp is provided with a groove, the butt joint part is clung to the groove, and shaping is carried out at the butt joint part. The second shaping fixture is a structural member comprising a groove matched with the curved surface part of the first shaping fixture, and the structural part connected with the groove of the second shaping fixture can be a curved surface in smooth transition with the groove or a planar open structural member, so that when the second shaping fixture is used for pressing and shaping the corrugated part of the flexible circuit board, other parts of the flexible circuit board are in an open state and no corrugation acting force is further generated, thus the flexible circuit board of the whole finished product can be smoothly transited by 360 degrees without corrugation, and the corrugation generated in the previous pressing process is shaped well, so that the finished circuit board with good use performance is finally obtained.
According to the processing device for the circuit board, after the two opposite ends of the flexible circuit board after being subjected to bending treatment are mutually butted and pressed through the first pressing die and the second pressing die, the butt joint positions of the two opposite ends of the flexible circuit board are shaped through the first shaping clamp and the second shaping clamp, so that the buckling patterns existing at the butt joint positions of the two opposite ends on the flexible circuit board after being pressed can be shaped effectively, and the service performance of a final finished product can meet requirements.
In some alternative embodiments, the first press-fit die is a metal structural round tube.
In other alternative embodiments, the first press-fit die is a hollow semi-cylindrical structural member.
Specifically, the first pressing mold is a metal structure circular tube, such as one of a steel tube, an iron tube or a copper tube, and the outer surface of the first pressing mold can complete bending of the flexible circuit board, and opposite ends of the first pressing mold can be mutually butted for pressing. In other embodiments, the first pressing mold may be a material tube made of other materials, which has a certain hardness and is not deformed by heat, or a structural member made of metal or other materials in a solid cylinder shape, which is not limited in this application.
In some alternative embodiments, the recess cooperates with a curved portion of the first compression mold. The groove is matched with a curved surface part which is tightly attached to the flexible circuit board on the first shaping clamp, so that the joint of the flexible circuit board can be clamped from the inner side and the outer side, and therefore gaps between the joint of the flexible circuit board and the first shaping clamp are removed, the flexible circuit board can smoothly transition at the joint of the flexible circuit board without wrinkles, and the 360-degree smooth transition of the circuit board of a final finished product is ensured.
In a third aspect of the present application, a circuit board is provided, where the circuit board is obtained by the method for processing a circuit board according to the first aspect.
In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus the following claims are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate preferred embodiment of this invention.
The foregoing description includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, as used in the specification or claims, the term "comprising" is intended to be inclusive in a manner similar to the term "comprising," as interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean "non-exclusive or".
Claims (10)
1. A method of processing a circuit board, comprising:
performing primary treatment on the flexible circuit board;
bending the flexible circuit board subjected to the preliminary treatment;
butt-jointing and pressing the two opposite ends of the flexible circuit board after the bending treatment to form the flexible circuit board with a closed curved surface;
and shaping the butt joint of the two opposite ends of the flexible circuit board.
2. The method of processing a circuit board according to claim 1, wherein the preliminary processing of the flexible circuit board comprises:
and performing pattern transfer and circuit etching on the flexible circuit board.
3. The method of processing a circuit board according to claim 1, wherein the bending process of the preliminarily processed flexible circuit board includes:
and the flexible circuit board after preliminary treatment is clung to the outer surface of the first pressing die so as to be bent.
4. The method of claim 3, wherein the second press-fit die is a hollow cylindrical structure having an opening;
the butt joint and pressing of the two opposite ends of the flexible circuit board after the bending treatment are carried out to form the flexible circuit board with a closed curved surface, comprising:
and sleeving the second pressing die on the flexible circuit board subjected to bending treatment so as to enable the two opposite ends of the flexible circuit board to be mutually butted, locking the opening of the second pressing die, heating the opening to a preset temperature, and pressing the butted part of the flexible circuit board at the preset temperature of 150-170 ℃ to form the flexible circuit board with a closed curved surface.
5. The method of claim 4, wherein shaping the interface between the two opposite ends of the flexible circuit board comprises:
inserting and tightly attaching a first shaping clamp to the inner wall of the closed curved surface, wherein the contact part of the first shaping clamp and the flexible circuit board comprises the butt joint parts of the two opposite ends of the flexible circuit board;
and tightly attaching the part of the flexible circuit board, which comprises the butt joint part, to a groove of a second shaping clamp so as to shape the butt joint part, wherein the shape of the second shaping clamp is matched with that of the first shaping clamp.
6. The utility model provides a processingequipment of circuit board, its characterized in that includes first press-fit die, second press-fit die, first plastic anchor clamps and second plastic anchor clamps, wherein:
the outer surface of the first pressing die is clung to the flexible circuit board so as to bend the flexible circuit board;
the second pressing die is a hollow cylindrical structural member provided with an opening, is sleeved on the bent flexible circuit board and is used for enabling the opposite ends of the flexible circuit board to be in butt joint for pressing, so that the flexible circuit board with a closed curved surface is formed;
the first shaping clamp is inserted into and clung to the inner wall of the closed curved surface, and the contact part of the first shaping clamp and the flexible circuit board comprises the butt joint parts of the two opposite ends of the flexible circuit board;
the second shaping clamp is matched with the first shaping clamp, the second shaping clamp is provided with a groove, the butt joint part is clung to the groove, and shaping is carried out at the butt joint part.
7. The apparatus of claim 6, wherein the first press mold is a metal round tube.
8. The apparatus of claim 6, wherein the first press mold is a hollow semi-cylindrical structure.
9. The processing apparatus according to claim 7 or 8, wherein the groove is mated with a curved portion of the first press-fit die.
10. A circuit board, characterized in that it is obtained by the method for processing a circuit board according to any one of claims 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311826201.2A CN117769135A (en) | 2023-12-28 | 2023-12-28 | Circuit board processing method and device and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311826201.2A CN117769135A (en) | 2023-12-28 | 2023-12-28 | Circuit board processing method and device and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117769135A true CN117769135A (en) | 2024-03-26 |
Family
ID=90325561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311826201.2A Pending CN117769135A (en) | 2023-12-28 | 2023-12-28 | Circuit board processing method and device and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117769135A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339295A (en) * | 2005-05-31 | 2006-12-14 | Nippon Mektron Ltd | Flexible circuit board |
| CN105050337A (en) * | 2015-07-02 | 2015-11-11 | 广州杰赛科技股份有限公司 | Manufacturing method for rigid-flex printed circuit board |
| CN113709977A (en) * | 2020-05-22 | 2021-11-26 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
-
2023
- 2023-12-28 CN CN202311826201.2A patent/CN117769135A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339295A (en) * | 2005-05-31 | 2006-12-14 | Nippon Mektron Ltd | Flexible circuit board |
| CN105050337A (en) * | 2015-07-02 | 2015-11-11 | 广州杰赛科技股份有限公司 | Manufacturing method for rigid-flex printed circuit board |
| CN113709977A (en) * | 2020-05-22 | 2021-11-26 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
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