CN117768755A

CN117768755A - Collaborative design of camera module and display

Info

Publication number: CN117768755A
Application number: CN202311232444.3A
Authority: CN
Inventors: N·D·彼达德; 篠原义和; R·J·邓恩
Original assignee: Apple Inc
Current assignee: Apple Inc
Priority date: 2022-09-23
Filing date: 2023-09-22
Publication date: 2024-03-26

Abstract

The present disclosure relates to collaborative design of camera modules and displays. The invention provides an electronic device. The electronic device includes a camera module having an optical axis and a set of one or more lenses centered along the optical axis. The electronic device further includes a display panel including an enhanced light transmission region. The enhanced light transmission region allows a greater amount of light to pass through than at least one other region of the display panel. The electronic device also includes a display Printed Circuit Board (PCB). Further, the electronic device includes an aperture stop positioned between the set of one or more lenses and the display panel. The electronic device includes a transparent cover positioned over the display panel on a side of the display panel opposite the display PCB. The electronic device further includes a housing configured to hold the camera module, the display panel, the display PCB, and the aperture stop therein.

Description

Collaborative design of camera module and display

This patent application claims priority from U.S. provisional patent application Ser. No. 63/376,980, titled "Co-Design of aCamera Module and a Display," filed on 9/23 of 2022, which is hereby incorporated by reference in its entirety.

Technical Field

The present disclosure relates generally to camera modules for portable electronic devices, and in particular to mounting a camera module in a portable electronic device.

Background

The advent of small mobile multi-purpose devices such as smartphones, smartwatches, and tablet computers or tablet devices has led to a need for high resolution low profile cameras to be integrated into the device. Some cameras may incorporate an Optical Image Stabilization (OIS) mechanism that may sense and react to external stimuli/disturbances by adjusting the position of the optical lens in the X-axis and/or the Y-axis in an attempt to compensate for unwanted actions of the lens. In addition, some cameras may incorporate an Auto Focus (AF) mechanism by which the focal length of the subject may be adjusted to focus the plane of the subject in front of the camera at the image plane to be captured by the image sensor. In some such AF mechanisms, the optical lens moves as a single rigid body along the optical axis of the camera to refocus the camera. Because of its small size, many devices may contain many closely integrated components. Some cameras may be strategically mounted to these devices to accommodate tight tolerances created by many closely integrated components.

Drawings

Fig. 1 illustrates an exemplary electronic device having a transparent cover covering a display screen, according to some embodiments.

Fig. 2 illustrates a top view of at least some components for integrating a camera module front crystal into an electronic device, according to some embodiments.

Fig. 3 illustrates a cross-sectional view across the A-A plane of at least some components for integrating a camera module front crystal into an electronic device, in accordance with some embodiments.

Fig. 4 illustrates a bottom view across the A-A plane of at least some components for integrating a camera module front crystal into an electronic device, according to some embodiments.

Fig. 5 illustrates an exploded view of at least some components for integrating a camera module front crystal into an electronic device, according to some embodiments.

Fig. 6 illustrates a top view of at least some components for integrating a camera module housing side into an electronic device, according to some embodiments.

Fig. 7 illustrates a cross-sectional view across a B-B plane of at least some components for camera module housing side integration into an electronic device, in accordance with some embodiments.

Fig. 8 illustrates a bottom view across the B-B plane of at least some components for integrating a camera module housing side into an electronic device, according to some embodiments.

Fig. 9 illustrates an exploded view of at least some components for integrating a camera module housing side into an electronic device, according to some embodiments.

Fig. 10 illustrates a cross-sectional top view of a configuration of an electronic device, according to some embodiments.

Fig. 11 illustrates a cross-sectional top view of an electronic device according to some embodiments.

Fig. 12 illustrates a cross-sectional top view of an electronic device according to some embodiments.

Fig. 13 illustrates a cross-sectional top view of an electronic device according to some embodiments.

Fig. 14 illustrates a cross-sectional top view of a configuration of an electronic device, according to some embodiments.

Fig. 15 illustrates a cross-sectional top view of an electronic device according to some embodiments.

Fig. 16 illustrates a cross-sectional top view of an electronic device according to some embodiments.

Fig. 17 illustrates a cross-sectional view of a construction of an electronic device, according to some embodiments.

Fig. 18 illustrates a cross-sectional view of an electronic device, according to some embodiments.

Fig. 19 illustrates a cross-sectional view of an electronic device, according to some embodiments.

Fig. 20 illustrates a cross-sectional view of a camera display package according to some embodiments.

Fig. 21 illustrates a cross-sectional view of a camera display package according to some embodiments.

Fig. 22 illustrates a cross-sectional view of a camera display package according to some embodiments.

Fig. 23 shows a schematic diagram of an exemplary device that may include a camera, according to some embodiments.

FIG. 24 illustrates a schematic block diagram of an exemplary computing device, referred to as a computer system, that may include or host an embodiment of a camera, according to some embodiments.

The present specification includes references to "one embodiment" or "an embodiment. The appearances of the phrase "in one embodiment" or "in an embodiment" are not necessarily referring to the same embodiment. The particular features, structures, or characteristics may be combined in any suitable manner consistent with the present disclosure.

The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps. Consider the claims referenced below: such claims do not exclude that the apparatus comprises additional components (e.g. a network interface unit, a graphics circuit, etc.).

Various units, circuits, or other components may be described or described as "configured to" perform a task or tasks. In such contexts, "configured to" implies that the structure (e.g., circuitry) is used by indicating that the unit/circuit/component includes the structure (e.g., circuitry) that performs the task or tasks during operation. As such, the unit/circuit/component may purportedly be configured to perform this task even when the specified unit/circuit/component is currently inoperable (e.g., not turned on). Units/circuits/components used with a "configured as" language include hardware-e.g., circuits, memory storing program instructions executable to perform the operations, etc. Reference to a unit/circuit/component being "configured to" perform one or more tasks is expressly intended to not refer to the sixth paragraph of 35u.s.c. ≡112 for that unit/circuit/component. Further, "configured to" may include a general-purpose structure (e.g., a general-purpose circuit) that is manipulated by software and/or firmware (e.g., an FPGA or a general-purpose processor executing software) to operate in a manner that is capable of performing one or more tasks to be solved. "configured to" may also include adjusting a manufacturing process (e.g., a semiconductor fabrication facility) to manufacture a device (e.g., an integrated circuit) suitable for performing or executing one or more tasks.

"first", "second", etc. As used herein, these terms serve as labels for the nouns they precede and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, the buffer circuit may be described herein as performing a write operation of a "first" value and a "second" value. The terms "first" and "second" do not necessarily imply that a first value must be written before a second value.

"based on". As used herein, the term is used to describe one or more factors that affect a determination. The term does not exclude additional factors affecting the determination. That is, the determination may be based solely on these factors or at least in part on these factors. Consider the phrase "determine a based on B". In this case, B is a factor affecting the determination of A, and such phrases do not preclude the determination of A from being based on C. In other examples, a may be determined based on B alone.

It will also be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first contact may be referred to as a second contact, and similarly, a second contact may be referred to as a first contact, without departing from the intended scope. The first contact and the second contact are both contacts, but they are not the same contact.

The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the specification and the appended claims, the singular forms "a," "an," and "the" are intended to cover the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

As used herein, the term "if" may be interpreted to mean "when..or" at..times "or" in response to a determination "or" in response to detection "depending on the context. Similarly, the phrase "if a condition or event is identified" or "if a condition or event is detected" may be interpreted to mean "upon identification of the condition or event," or "upon detection of the condition or event, depending on the context.

Detailed Description

Various embodiments described herein relate to integrating a camera module into an electronic device, for example, behind a display panel and/or a display PCB. For example, a Front Crystal (FC) integration may be used to integrate a camera module into an electronic device. For example, the camera module may be assembled into an FC or display such that the camera module resides on the display. As another example, the camera module may be integrated into the electronic device using shell-side integration. For example, the camera module may be fixedly attached to the housing of the electronic device and pressed against the alarm stand via the stand such that the camera module resides at a fixed location within the electronic device. In some aspects, the camera module may be placed within a corner of the electronic device. The display in front of the camera module may optionally remain emission pixelated such that the camera module is hidden behind the display panel. In some aspects, the display area above the camera module may include removed pixelation, such as holes or recesses in the display panel. In at least these configurations, the camera module may be positioned along a central axis of the electronic device for symmetrical aesthetics.

In some aspects, the electronic device may include a camera module positioned behind an emissive display of the hidden camera module for improved aesthetics and better fit and construction. Some display panels may be very opaque, allowing little light to pass through to the camera module. The display panel may include a high light transmission region (e.g., an enhanced light transmission region) for increasing light transmission to the camera module without damaging the entire display panel. The high light transmission region may include a hole punch (e.g., a pinhole-sized hole punch), a notch, or a region having a low pixel count or wiring density through the display panel. The size of the high light transmission region may depend on several camera module parameters including field of view, entrance pupil size and position, lens barrel size, F-number, etc. The high light transmission region may be co-designed with camera module parameters to achieve smaller high light transmission regions and better camera module performance.

Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. It will be apparent, however, to one of ordinary skill in the art that some embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

FIG. 1 illustrates an exemplary electronic device 100/600 having a transparent cover covering a display screen in accordance with at least some embodiments. Fig. 1 shows a top view of the exterior of the electronic device 100/600. The electronic device 100/600 may include one or more features that are the same as or similar to the features described with respect to fig. 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, and 24 or shown in these figures. The exemplary X-Y-Z coordinate system shown in fig. 1 is used to discuss aspects of the component and/or system and may be applied to the embodiments described throughout this disclosure. Like the other included figures, fig. 1 is shown for illustrative purposes and is not limiting of the possible embodiments of the invention or the claims.

As shown in FIG. 1, the electronic device 100/600 may include a housing 102/602 supporting a transparent cover 104 covering a display screen 105, and one or more control buttons 106. In this example, the electronic device 100/600 may be a wearable computing device (e.g., a smartwatch), but other embodiments may be incorporated into other electronic devices, such as portable computing devices, tablet computers, desktop computers, laptop computers, single-body computers, smart phones, storage devices, portable media players, navigation systems, monitors, power supplies, video delivery systems, adapters, remote control devices, chargers, and other devices. In some aspects, the display screen 105 may be a touch screen. The electronic device 100/600 may also include an internal battery (e.g., battery 1004 shown in fig. 10 and 11, battery 1204 shown in fig. 12). The internal battery may be charged inductively or through a connector. The battery may provide power to the components of the electronic device 100/600 (e.g., the display screen 105). The display screen 105 may be used by an application running on the electronic device 100/600 to provide information to a user. The display screen 105 may also be used to provide other information, such as information about the state of charge of the battery. For example, a graphical indicator may be provided to the user on the display screen 105 showing a percentage of the remaining battery capacity.

In some aspects, the electronic device 100/600 may contain tightly integrated components, adding to the challenges of incorporating additional modules into the system of the electronic device 100/600. For example, integrating a camera module into the electronic device 100/600 may be difficult due to tightly integrated components of the system, the manufacturing process used to assemble the electronic device 100/600, and/or the placement of the lens of the camera module relative to the display screen 105. As described herein, various embodiments may be used to integrate a camera module into an electronic device 100/600. For example, front crystal integration and/or housing side integration may be used to integrate the camera module into the electronic device 100/600. Furthermore, as further described herein, a system layout for placing cameras at different locations of the electronic device 100/600 may be provided.

As described herein, a Front Crystal (FC) integration may be used to integrate a camera module into an electronic device. For example, the camera module may be assembled into an FC or display such that the camera module resides on the display. The FC integration of camera modules may provide easier camera module calibration and functional inspection without requiring complete assembly of the electronic device. In the case of FC integration, the positional tolerance of the camera module relative to the display may be tight, as the camera module may have to be viewed through traces and Light Emitting Diodes (LEDs) on the display. In some aspects, curvature on the display may affect the camera module, enhancing the need for tight positional tolerances of the camera module relative to the display.

Fig. 2, 3, 4, and 5 illustrate components used with the camera module 202 to integrate the camera module 202FC into the electronic device 100 according to some embodiments. Fig. 2 shows a top view of at least some of the components of the electronic device 100. Fig. 3 shows a cross-sectional view of the electronic device 100 across the A-A plane. Fig. 4 illustrates a bottom view of at least some components of the electronic device 100 across the A-A plane.

Fig. 5 shows an exploded view of at least some of the components of the electronic device 100. The electronic device 100 may include one or more features that are the same as or similar to the features described with respect to fig. 1, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, and 24 or shown in these figures. The exemplary X-Y-Z coordinate systems shown in fig. 2, 3, 4, and 5 may be used to discuss aspects of the components and/or systems and may be applicable to the embodiments described throughout this disclosure. Like the other included figures, fig. 2, 3, 4 and 5 are shown for illustrative purposes and are not limiting of the possible embodiments of the invention or the claims.

As shown in fig. 2, the electronic device 100 may include a camera module 202, a cradle 204, one or more camera electrical traces 206 attached to one or more camera electrical connections 208, one or more device electrical traces 212 attached to one or more device electrical connections 210, and an alert cradle 214. The camera module 202 may be used to photograph to capture images for viewing by a person. In some aspects, the camera module 202 may be a machine vision camera module (e.g., in addition to a photographic camera module, as an alternative to a photographic camera module). The machine vision camera module may be smaller than the photographic camera module and may capture images that are not intended to be seen by humans, but are processed by one or more machine learning algorithms. For example, the machine vision camera module may capture monochromatic images and/or infrared images for processing face recognition, authentication, and/or object/face tracking.

The housing 102 may contain or house a camera module 202, a cradle 204, one or more camera electrical traces 206 attached to one or more camera electrical connections 208, one or more device electrical traces 212 attached to one or more device electrical connections 210, and an alert cradle 214. In some aspects, the housing 202 may include an attachment receiver 318. The attachment receiver 318 may be configured to receive an attachment device for attaching the electronic device 100 to another object (e.g., an object external to or separate from the electronic device 100). For example, the attachment receiver 318 may be configured to receive a strap, belt, or clip for attaching the electronic device 100 to a body (e.g., human, animal), a table, a hook, or a rod. As further described herein, the bracket 204 may fixedly attach the camera module 202 to a display PCB (e.g., the display PCB 302 shown in fig. 3). The alert bracket 214 may include an alert module (e.g., alert module 315 shown in fig. 3) configured to provide a physical indication by the electronic device 100 that an event has occurred. For example, in response to determining that the battery of the electronic device 100 is below a threshold, the alarm module residing in/on the alarm stand 214 may vibrate, thereby causing vibration of the entire electronic device 100. As another example, in response to determining that the battery of the electronic device 100 is fully charged, an alarm module residing in/on the alarm stand 214 may sound indicating that the electronic device 100 is fully charged. The alert support 214 may include one or more alert modules, such as a vibration alert module, a speaker alert module, and the like.

The one or more camera electrical traces 206 may be used to communicate image data from the image sensor of the camera module 202 to a packaging system (e.g., a System On Chip (SOC) (e.g., the packaging system 314 shown in fig. 3), such as an Image Signal Processor (ISP) (e.g., the ISP 316 shown in fig. 3) located in/on the packaging system and included within the packaging system as further described herein, the one or more camera electrical connections 208 (e.g., zero Insertion Force (ZIF) connections) may be used to electrically connect the camera module 202 (e.g., the image sensor of the camera module 202) to a display PCB (e.g., the display PCB 302 shown in fig. 3) via the one or more camera electrical traces 206, the one or more device electrical traces 212 may be in electrical communication with the packaging system (e.g., the ISP shown in fig. 3) via the packaging system electrical connection 313), and may be in electrical communication with the display PCB 202 via the one or more device electrical connection 210 (e.g., the ZIF connection) and the one or more camera module electrical connection(s) may be in electrical communication with the one or more display PCB(s) and the one or more image sensor electrical trace(s) such as may be in electrical communication with the one or more display PCB(s) of the one or more camera module(s) electrical trace(s).

As shown in fig. 3, and as described herein, the electronic device 100 may include a camera module 202, a cradle 204, one or more camera electrical traces 206 attached to one or more camera electrical connectors 210, one or more device electrical traces 212 attached to one or more device electrical connectors 208, and an alert cradle 214 including an alert module 315. The electronic device 100 may also include a display PCB 302, a display panel 306, and a transparent cover 104 residing over the display PCB 304 and the display panel 306. The display PCB 302 may be electrically connected to the display panel 306 via display panel electrical traces 317 and display panel electrical connections 317a and may be configured to instruct pixels on the display panel 306 to individually emit a particular color and a particular brightness for image display. In some aspects, the display panel 306 may be an Organic Light Emitting Diode (OLED) display, a micro LED display, a Liquid Crystal Display (LCD), or the like.

In some aspects, the bracket 204 may fixedly attach the camera module 202 to the display PCB 302. As shown in fig. 3, the rack 204 may include a top rack 204a and a bottom rack 204b. The top mount 204a may be fastened (e.g., soldered, laser soldered) to the bottom surface of the display PCB 302 and hold the camera module 202 in a fixed position in the x-direction and the y-direction (e.g., fixed in one or more directions orthogonal to the optical axis 301). The top mount 204 may be coupled to the bottom mount 204b such that the bottom mount 204b holds the camera module 202 in a fixed position in the z-direction (e.g., fixed or held in one or more directions parallel to the optical axis 301). As shown in fig. 5, a top bracket 204a surrounds the camera module 202 for holding the camera module 202 in a fixed position in the x-direction and the y-direction. Further, as shown in fig. 5, the bottom bracket 204 has a "U-shape" for holding the camera module 202 at a fixed position in the z-direction. Additionally, due to the "U-shape" of the bottom bracket 204, the circuit board 310 may also remain in a fixed position in the z-direction while allowing the camera electrical traces 206 to extend from the circuit board 310 (e.g., through the open end of the "U-shape") and connect (e.g., physically, electrically) to the display PCB 302. In some aspects, a damping structure 312 positioned between the camera module 202 and the bottom bracket 204b (e.g., between the circuit board 310 and the bottom bracket 204 b) may inhibit movement of the camera module 202 in the z-direction, for example, in response to a drop event. In some aspects, the damping structure 312 may include a foam pad, one or more springs, or a cushion.

As described herein, the cradle 204 holds the camera module 202 in a fixed position within the electronic device 100. The stand 204 also aligns the camera module 202 with a cutout 305 extending through the display PCB 302 such that the cutout 305 is centered about the optical axis 301 of the camera module 202. With the cutout 305 aligned with the optical axis 301 of the camera module 202, the camera module 202 may be able to receive light through the display panel 306 to capture an image. In some aspects, an isolator 308 (e.g., a ring) positioned on the display PCB 302 and surrounding the cutout 305 may be configured to isolate light from the volume between the display panel 306 and the camera module 202. In some aspects, the isolator 308 may also be configured to keep dust and particles away from the lens of the camera module 202. In some aspects, the camera module 202 may receive light through the cutout 305 and the display panel 306 for image capture. In some aspects, the display PCB 302 may instruct the area of the display panel 306 above the camera module 202 to allow more light to pass through the display panel 306 so that the camera module 202 may capture an image. In some aspects, the display panel 306 may include holes to allow light to pass through so that the camera module 202 may capture images. In some aspects, the display panel 306 may include a small area aligned with the optical axis 301 and having high transparency (e.g., relative to the remainder of the display panel 306) such that the camera module receives light for image capture.

The one or more camera electrical traces 206 may be used to communicate image data from the image sensor of the camera module 202 to a packaging system 314 (e.g., a system on a chip (SOC)), such as received by an ISP 316 residing in/on or included within the packaging system 314. In some aspects, ISP 316 may reside at another location away from packaging system 314, and other electrical traces and other electrical connectors may be used to provide image data from camera module 202 to ISP 316 residing at another location away from packaging system 314. The one or more camera electrical connections 208 (e.g., (ZIF) connections) may electrically connect the camera module 202 (e.g., an image sensor of the camera module 202) to the display PCB 302 via the one or more camera electrical traces 206. The one or more device electrical traces 212 may be in electrical communication with an ISP 316 residing in the packaging system 314 via the packaging system electrical connection 313 and with the display PCB 302 via the one or more device electrical connections 210. Thus, the camera module 202 (e.g., an image sensor of the camera module 202) may be in electronic communication with the ISP 316 (e.g., residing in/on the packaging system 314) via the one or more camera electrical traces 206, the one or more camera electrical connections 208, the display PCB 302, the one or more device electrical connections 210, the one or more device electrical traces 212, and the one or more packaging system electrical connections 313 and communicate image data to the ISP. In some aspects, the electrical traces and/or electrical connections described herein may include additional and/or dedicated traces and pins for transmitting image data.

As described herein, the camera module 202 may be integrated into the electronic device via the stand 204 using FC integration, so the camera module 202 may be assembled into an FC or display such that the camera module 202 may be calibrated and inspected (e.g., functional inspection) prior to and/or without being fully assembled with the electronic device. Furthermore, in the case of FC integration, the positional tolerance of the camera module relative to the display may be tight, as the camera module may have to be viewed through traces and Light Emitting Diodes (LEDs) on the display. In some aspects, curvature on the display may affect the camera module, enhancing the need for tight positional tolerances of the camera module relative to the display. It should be noted that due to the configuration of the camera module 202 and cradle 204, a slightly smaller battery may be included in the electronic device 100, and the antenna module (not shown) may be reconfigured due to space loss within the housing 102. In addition, when the packaging system 314 does not include the ISP 316, additional sidecars that occupy additional space within the housing 102 may be required to hold the ISP 316. In some aspects, the cut-out 305 through the display PCB 302 may affect a Near Field Communication (NFC) coil, thereby causing the NFC coil to jog around the cut-out 305.

As shown in fig. 4, the electronic device 100 includes a camera module 202, a cradle 204, a display PCB 302, a camera electrical trace 206, a camera electrical connection 208, a device electrical connection 210, and a device electrical trace 212. The camera module 202 and the cradle 204 occupy space on the display PCB 302. Thus, the Ambient Light Sensor (ALS) 402 may move in the y-direction (e.g., further down the page) and reside in the position shown in fig. 4. Similarly, the device electrical connector 210 may move in the y-direction (e.g., further down the page) and reside in the position shown in fig. 4. Further, as shown in fig. 4, the battery profile 404 of the battery may occupy a large cross-sectional area of the electronic device 100.

As shown in fig. 5, the electronic device 100 includes a display PCB 302 having a cutout 305 and an isolator 308 positioned on the display PCB 302 and surrounding the cutout 305. The electronic device 100 also includes a top bracket 204a and a bottom bracket 204b of the bracket 204. The top bracket 204a includes an upper arm 501 for securing the top bracket 204a to the display PCB 302 and includes an aperture 503 for receiving at least a portion of the camera module 202. Since the aperture 503 receives at least a portion of the camera module 202, the top bracket 204a surrounds the camera module 202 for holding the camera module 202 in a fixed position in the x-direction and the y-direction. The top bracket 204a also includes a lower arm 505 for coupling the top bracket 204a to the arm 507 of the bottom bracket 204b. The protrusion 509 extending from the arm 507 of the bottom bracket 204b is received by a cutout 511 through the lower arm 505 of the top bracket 204a to securely fasten the top bracket 204a to the bottom bracket 204a to hold the camera module 202 in a fixed position. The bottom bracket 204 having a "U-shape" may hold the camera module 202 in a fixed position in the z-direction. Additionally, due to the "U-shape" of the bottom bracket 204, the circuit board 310 may also remain in a fixed position in the z-direction while allowing the camera electrical traces 206 to extend from the circuit board 310 (e.g., through the open end of the "U-shape") and connect (e.g., physically, electrically) to the display PCB 302 via the camera electrical connection 208. In some aspects, a damping structure 312 may be positioned between the bottom bracket 204b and the camera module 202 and inhibit movement of the camera module 202 in the z-direction, for example, in response to a drop event. In some aspects, the damping structure 312 may include a foam pad, one or more springs, or a cushion.

As described herein, a camera module may be integrated into an electronic device using shell-side integration. For example, the camera module may be fixedly attached to the housing of the electronic device and pressed against the alarm stand via the stand such that the camera module resides at a fixed location within the electronic device. In the case of housing-side integration, the camera module may be fixedly attached to the lower portion of the housing and move with the lower portion of the electronic device. Furthermore, in the case of case-side integration, the electronic device may need to be fully assembled before the camera module is calibrated and functionally inspected. Furthermore, in the case of housing-side integration, the positional tolerance of the camera module with respect to the display may not be as tight as that of FC integration. Thus, alignment of the camera module with the display may be less accurate. Further, with housing-side integration, camera module testing may be performed prior to attaching the display to the electronic device.

Fig. 6, 7, 8, and 9 illustrate components used with the camera module 202 to integrate the housing side of the camera module 202 into an electronic device 600 according to some embodiments. Fig. 6 illustrates a top view of at least some components of an electronic device 600. Fig. 7 shows a cross-sectional view of the electronic device 600 across the B-B plane. Fig. 8 illustrates a bottom view of at least some components of the electronic device 600 across the B-B plane. Fig. 9 illustrates an exploded view of at least some of the components of the electronic device 600. The electronic device 600 may include one or more features that are the same as or similar to the features described with respect to fig. 1, 2, 3, 4, 5, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, and 24 or shown in these figures. The exemplary X-Y-Z coordinate systems shown in fig. 6, 7, 8, and 9 may be used to discuss aspects of the components and/or systems and may be applicable to the embodiments described throughout this disclosure. Like the other included figures, fig. 6, 7, 8 and 9 are shown for illustrative purposes and are not limiting of the possible embodiments of the invention or the claims.

As shown in fig. 6, the electronic device 600 may include a camera module 202, a cradle 604, one or more camera electrical traces 606 attached to one or more camera electrical connections 608. The housing 602 may contain or house the camera module 202, the cradle 604, the one or more camera electrical traces 606, and the one or more camera electrical connections 608. In some aspects, the housing 602 may include an attachment receiver 318. The attachment receiver 318 may be configured to receive an attachment device for attaching the electronic device 600 to another object (e.g., an object external to or separate from the electronic device 600). For example, the attachment receiver 318 may be configured to receive a strap, belt, or clip for attaching the electronic device 600 to a body (e.g., human, animal), a table, a hook, or a rod.

As further described herein, the stand 604 may fixedly attach the camera module 202 to a lower portion of the electronic device 600 (e.g., an inner surface within the electronic device 600). In some aspects, a lower portion of the electronic device 600 may include a housing 602 and components (e.g., speakers) extending from the housing 602 and into an interior of the housing 602. In some aspects, a lower portion of the electronic device 600 may include components of the electronic device 602 that do not include display components (e.g., the transparent cover 104, the display panel 306, the display PCB 702, etc.). For example, the bracket 604 may fixedly attach the camera module 202 to an inner surface of the housing 602. As another example, the bracket 602 may fixedly attach the camera module 202 to a body that extends from an inner surface of the housing 602 and into an interior of the housing 602. In some aspects, the bracket 602 may fixedly attach the camera module 202 to the housing 602 via the first fastener 604a and fixedly attach the camera module to an alarm bracket (e.g., the alarm bracket 714 shown in fig. 7) via the second fastener 604 b. The alarm support 714 may include an alarm module (e.g., alarm module 715 shown in fig. 7) and may extend from an inner surface of the housing 602 to an interior of the housing 602. The alert bracket 714 may include an alert module (e.g., the alert module 715 shown in fig. 7) configured to provide a physical indication by the electronic device 600 that an event has occurred. For example, in response to determining that the battery of the electronic device 600 is below a threshold, the alarm module residing in/on the alarm stand 714 may vibrate, thereby causing vibration of the entire electronic device 600. As another example, in response to determining that the battery of the electronic device 600 is fully charged, an alarm module residing in/on the alarm stand 714 may sound indicating that the electronic device 600 is fully charged. The alert support 714 may include one or more alert modules, such as a vibration alert module, a speaker alert module, and the like.

The one or more camera electrical traces 506 may be used to communicate image data from the image sensor of the camera module 202 to a packaging system (e.g., the packaging system 314 shown in fig. 7) (e.g., a System On Chip (SOC)), such as an ISP (e.g., the ISP 316 shown in fig. 7) residing in/on or included within the packaging system. As further described herein, the one or more camera electrical connections 608 (e.g., (ZIF) connections) may electrically connect the camera module 202 (e.g., an image sensor of the camera module 202) directly to a packaging system (e.g., ISP 316 of the packaging system 314). Thus, the camera module 202 (e.g., an image sensor of the camera module 202) may electronically communicate with and transmit image data to an ISP (residing in the packaged system) via the one or more camera electrical traces 606 and the one or more camera electrical connections 608.

As shown in fig. 7, and as described herein, the electronic device 600 may include a camera module 202, a cradle 604, one or more camera electrical traces 606 attached to one or more camera electrical connections 608, and an alert cradle 714 that includes an alert module 715. The electronic device 600 may also include a display PCB 702, a display panel 306, and a transparent cover 104 residing over the display PCB 702 and the display panel 306. The display PCB 702 may be electrically connected to the display panel 306 via display panel electrical traces 317 and display panel electrical connections 317a and may be configured to instruct pixels on the display panel 306 to individually emit a particular color and a particular brightness for image display. In some aspects, the display panel 306 may be an Organic Light Emitting Diode (OLED) display, a micro LED display, a Liquid Crystal Display (LCD), or the like. As similarly described herein, the one or more device electrical traces 212 may be in electrical communication with the packaging system 314 (e.g., and ISP 316 residing in the packaging system) via packaging system electrical connections 313 and with the display PCB 702 via the one or more device electrical connections 210 to provide electronic communication between the display PCB 702 and the packaging system 314.

In some aspects, the bracket 604 may fixedly attach the camera module 202 to the housing 602 and the alarm bracket 714. As shown in fig. 3, the bracket 604 may include a first fastener receiver 704a and a second fastener receiver 704b. With the first fastener receiver 704a, the first fastener 704c may be assembled through at least a portion of the housing 602, thereby securing the bracket 604 to the housing 602 and fixedly attaching the camera module 202 to the housing 602. Similarly, with the second fastener receiver 704b, the second fastener 704d may fit through at least a portion of the alert bracket 714, thereby securing the bracket 604 to the alert bracket 714 and fixedly attaching the camera module 202 to the alert bracket 714. As shown in fig. 9, the stand 604 may have a hole (e.g., hole 901 shown in fig. 9) for receiving the camera module 202 and holding the camera module 202 in a fixed position in the x-direction and the y-direction. The alert support 714 may provide support for the camera module 202 and hold the camera module 202 in a fixed position along the optical axis 701 (e.g., in the z-direction). With the camera module 202 extending through the aperture, the lower surface of the bracket 604 may press against the upper surface of the camera module 202 and exert a compressive force on the camera module 202 toward the alert bracket 714, thereby securing the camera module 202 in a fixed position along the optical axis 701. Additionally, since the standoff 604 engages the upper surface of the camera module 202, the circuit board 310 may also be held in a fixed position in the z-direction while allowing the camera electrical traces 606 to extend from the circuit board 310 (e.g., under the standoff 604) and connect (e.g., physically, electrically) to the packaging system 314. In some aspects, a damping structure 712 positioned between the camera module 202 and the alert bracket 714 (e.g., positioned between the circuit board 310 and the alert bracket 714) may inhibit movement of the camera module 202 in the z-direction, for example, in response to a drop event. In some aspects, the damping structure 712 may include a foam pad, one or more springs, or a cushion.

As described herein, the cradle 604 holds the camera module 202 in a fixed position within the electronic device 600. The stand 604 also aligns the camera module 202 with a cutout 705 extending through the display PCB 702 such that the cutout 705 is centered on the optical axis 701 of the camera module 202. With the cut-out 705 aligned with the optical axis 701 of the camera module 202, the camera module 202 may be able to receive light through the display panel 306 to capture an image. In some aspects, an isolator 308 (e.g., a ring) positioned on the display PCB 702 and surrounding the cutout 705 may be configured to isolate light from the volume between the display panel 306 and the camera module 202. In some aspects, the isolator 308 may also be configured to keep dust and particles away from the lens of the camera module 202. In some aspects, the camera module 202 may receive light through the cutout 705 and the display panel 306 for image capture. In some aspects, the display PCB 702 may instruct the area of the display panel 306 above the camera module 202 to allow more light to pass through the display panel 306 so that the camera module 202 may capture an image. In some aspects, the display panel 306 may include holes to allow light to pass through so that the camera module 202 may capture images. In some aspects, the display panel 306 may include a small area aligned with the optical axis 301 and having high transparency (e.g., relative to the remainder of the display panel 306) such that the camera module receives light for image capture.

The one or more camera electrical traces 606 may be used to communicate image data from the image sensor of the camera module 202 to the packaging system 314 (e.g., a system on a chip (SOC)), such as received by the ISP 316 residing in/on or included within the packaging system 314. In some aspects, ISP 316 may reside at another location away from packaging system 314, and other electrical traces and other electrical connectors may be used to provide image data from camera module 202 to ISP 316 residing at another location away from packaging system 314. The one or more camera electrical connections 608 (e.g., (ZIF) connections) may electrically connect the camera module 202 (e.g., an image sensor of the camera module 202) directly to the packaging system 314 and/or the ISP 316 via the one or more camera electrical traces 606. In some aspects, the electrical traces and/or electrical connections described herein may include additional and/or dedicated traces and pins for transmitting image data.

As described herein, the camera module 202 may be integrated into an electronic device via the cradle 604, the housing 602, and the alarm cradle 714 using housing-side integration and fully assembled before calibration and functional inspection may be performed on the camera module. Furthermore, in the case of housing-side integration, the positional tolerance of the camera module with respect to the display may not be as tight as that of FC integration. Thus, alignment of the camera module with the display may be less accurate. Further, with housing-side integration, camera module testing may be performed prior to attaching the display to the electronic device. It should be noted that due to the configuration of the camera module 202 and cradle 604, a slightly smaller battery may be included in the electronic device 600 and the antenna module (not shown) may be reconfigured due to space loss within the housing 602. In addition, when packaging system 314 does not include ISP 316, additional sidecars that occupy additional space within enclosure 602 may be required to hold ISP 316. In some aspects, the cut-out 305 through the display PCB 302 may affect a Near Field Communication (NFC) coil, thereby causing the NFC coil to jog around the cut-out 305.

As shown in fig. 8, the electronic device 600 includes a display PCB 702, a cutout 705, and a device electrical connector 210. The cutout 705 may occupy space on the display PCB 702. Thus, the Ambient Light Sensor (ALS) 802 may move in the y-direction (e.g., further down the page) and reside in the position shown in fig. 8. Similarly, the device electrical connector 210 may move in the y-direction (e.g., further down the page) and reside in the position shown in fig. 8. Further, as shown in fig. 8, the battery profile 804 of the battery may occupy a large cross-sectional area of the electronic device 600.

As shown in fig. 9, the electronic device 600 includes a display PCB 702 having a cutout 705 and an isolator 308 positioned on the display PCB 702 and surrounding the cutout 705. The electronic device 600 also includes a bracket 604 having a first fastener receiver 704a (shown in fig. 7), a first fastener 704c, a second fastener receiver 704b, and a second fastener 704d. With the first fastener receiver 704a, the first fastener 704c may be assembled through at least a portion of the housing 602, thereby securing the bracket 604 to the housing 602 and fixedly attaching the camera module 202 to the housing 602. Similarly, with the second fastener receiver 704b, the second fastener 704d may fit through at least a portion of the alert bracket 714, thereby securing the bracket 604 to the alert bracket 714 and fixedly attaching the camera module 202 to the alert bracket 714.

As shown in fig. 9, the cradle 604 may have an aperture 901 for receiving the camera module 202 and holding the camera module 202 in a fixed position in the x-direction and the y-direction. The alert support 714 may provide support for the camera module 202 and hold the camera module 202 in a fixed position along the optical axis 701 (e.g., in the z-direction). With the camera module 202 extending through the aperture 901, the lower surface of the bracket 604 may press against the upper surface of the camera module 202 and exert a compressive force on the camera module 202 toward the alert bracket 714, thereby securing the camera module 202 in a fixed position along the optical axis 701 (e.g., in the z-direction). Additionally, since the standoff 604 engages the upper surface of the camera module 202, the circuit board 310 may also be held in a fixed position in the z-direction while allowing the camera electrical traces 606 to extend from the circuit board 310 (e.g., under the standoff 604) and connect (e.g., physically, electrically) to the packaging system 314. In some aspects, a damping structure 712 positioned between the camera module 202 and the alert bracket 714 (e.g., positioned between the circuit board 310 and the alert bracket 714) may inhibit movement of the camera module 202 in the z-direction, for example, in response to a drop event. In some aspects, the damping structure 712 may include a foam pad, one or more springs, or a cushion.

As described herein, a camera module may be placed within a corner of an electronic device. The display in front of the camera module may optionally remain emission pixelated such that the camera module is hidden behind the display panel. In some aspects, the display area above the camera module may include removed pixelation, such as holes or recesses in the display panel. In at least these configurations, the camera module may be positioned along a central axis of the electronic device for symmetrical aesthetics.

Fig. 10, 11, 12, and 13 illustrate electronic device configurations according to some embodiments. Fig. 10 shows a cross-sectional top view of a configuration of an electronic device 1000. Fig. 11 shows a cross-sectional top view of an electronic device 1100. Fig. 12 shows a cross-sectional top view of an electronic device 1200. Fig. 13 shows a cross-sectional top view of an electronic device 1300. The electronic device 1000 shown in fig. 10, the electronic device 1100 shown in fig. 11, the electronic device 1200 shown in fig. 12, and the electronic device 1300 shown in fig. 13 may contain and/or incorporate one or more components from each and/or may contain or incorporate one or more components or configurations of the electronic device 100 shown in fig. 1, 2, 3, 4, and 5 and the electronic device 600 shown in fig. 1, 6, 7, 8, and 9. In addition, the electronic device 1000 shown in fig. 10, the electronic device 1100 shown in fig. 11, the electronic device 1200 shown in fig. 12, and the electronic device 1300 shown in fig. 13 may include one or more features that are the same as or similar to the features described with respect to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, and 24 or shown in these figures. The exemplary X-Y-Z coordinate systems shown in fig. 10, 11, 12, and 13 may be used to discuss aspects of the components and/or systems and may be applicable to the embodiments described throughout this disclosure. Like the other included figures, fig. 10, 11, 12 and 13 are shown for illustrative purposes and are not limiting of the possible embodiments of the invention or the claims.

As shown in fig. 10, the electronic device 1000 may include a housing 1002, an input device 1006, a battery 1004, and an alert holder 1014. The battery 1004 and the alarm holder 1014 can be positioned such that both the battery 1004 and the alarm holder 1014 are bifurcated by the centerline 1006 of the electronic device. In some aspects, the electronic device 1000 may not include a camera module, allowing for greater tolerance for the inclusion of the battery 1004 and the alert holder 1014. As shown in fig. 11, the electronic device 1100 may include a housing 1002 and an input device 1006. The electronic device 1100 may also include a camera module 1102 (which may be the same as or at least similar to the camera module 202 shown in fig. 2, 3, 4, 5, 6, 7, 8, and 9), a battery 1104, and an alert holder 1114. Because of the space occupied by the camera module 1102, the battery 1104 and/or the alarm mount 1114 may be smaller and/or have a different configuration than the battery 1004 and/or the alarm mount 1014 shown in fig. 10. For example, the alert holder 1014 can have an L-shaped configuration compared to the more rectangular configuration of the alert holder 1114 and/or can be smaller in the x-direction and larger in the y-direction compared to the alert holder 1014. The camera module 1102 may include an optical axis 1103. The optical axis 1103, the battery 1104, and the alert holder 1114 may be positioned on the centerline 1106 such that the battery 1104, the alert holder 1114, and the camera module 1102 (e.g., the optical axis 1103) diverge from the centerline 1106 of the electronic device 1100. Because the display area above the camera module 1102 may include removed pixelation (e.g., holes or recesses in the display panel) and/or a different color than the rest of the display panel, the camera module 1102 (e.g., the optical axis 1104 of the camera module 1102) may be positioned along the centerline 1106 of the electronic device 1100 to achieve a symmetrical aesthetic.

As shown in fig. 12, the electronic device 1200 may include a housing 1002, an input device 1006, and a camera module 1102. The electronic device 1200 may also include a battery 1204 and an alert cradle 1214. Because of the space occupied by the camera module 1102, the battery 1204 and/or the alarm stand 1214 may be smaller and/or have a different configuration than the battery 1004 and/or the alarm stand 1014 shown in fig. 10. For example, the alert support 1214 may have an L-shaped configuration compared to the more rectangular configuration of the alert support 1014 and/or may be smaller in the x-direction and larger in the y-direction compared to the alert support 1014. The camera module 1102 may include an optical axis 1103. The battery 1204 and the alert bracket 1214 may be rotated 90 degrees relative to the battery 1104 and the alert bracket 1114 such that the battery 1204 and the alert bracket 1214 are not bifurcated by the centerline 1106 of the electronic device 1200. However, because the display area above the camera module 1102 may include removed pixelation (e.g., holes or recesses in the display panel) and/or a different color than the rest of the display panel, the camera module 1102 (e.g., the optical axis 1104 of the camera module 1102) may be positioned along the centerline 1106 of the electronic device 1100 to achieve a symmetrical aesthetic.

As shown in fig. 13, the electronic device 1300 may include a housing 1002 and an input device 1006. The electronic device 1300 may also include a display panel 1304 (as described herein) that includes a high light transmission region 1306 that extends through the display panel 1304 and along a centerline 1106. A camera module (e.g., camera module 1102 shown in fig. 11 and 12) may be positioned below the high light transmission region 1306 of the display panel 1304 along the centerline 1106 such that the high light transmission region 1306 is aligned with the optical axis. The high light transmission region 1306 may include removed pixelation (e.g., holes or notches through the display panel 1304) and/or a different color than the rest of the display panel 1304, and is positioned along the centerline 1106 of the electronic device 1300 to achieve a symmetrical aesthetic.

As described herein, an electronic device may include a camera module positioned behind an emissive display of a hidden camera module for improved aesthetics and better fit and construction. Some display panels may be very opaque, allowing little light to pass through to the camera module. As described above, the display panel may include a high light transmission region (e.g., an enhanced light transmission region) for increasing light transmission to the camera module without damaging the entire display panel. The high light transmission region may include a hole punch (e.g., a pinhole-sized hole punch), a notch, or a region having a low pixel count or wiring density through the display panel. The size of the high light transmission region may depend on several camera module parameters including field of view, entrance pupil size and position, lens barrel size, F-number, etc. The high light transmission region may be co-designed with camera module parameters to achieve smaller high light transmission regions and better camera module performance. For example, the high light transmission region may be co-designed with camera module parameters to achieve the smallest possible high light transmission region without sacrificing and/or changing camera module design and/or performance.

As described herein, the display panel may include a high light transmission region for increasing light transmission to a camera module positioned behind the display panel without damaging the entire display panel. The high light transmission region may include a hole punch (e.g., a pinhole-sized hole punch), a notch, or a region having a low pixel count or wiring density through the display panel. Fig. 14, 15, and 16 illustrate electronic device configurations according to some embodiments. Fig. 14 shows a cross-sectional top view of a configuration of an electronic device 1400. Fig. 15 shows a cross-sectional top view of an electronic device 1500. Fig. 16 shows a cross-sectional top view of an electronic device 1600. The electronic device 1400 shown in fig. 14, the electronic device 1500 shown in fig. 15, and the electronic device 1600 shown in fig. 16 may include and/or incorporate one or more components from each and/or may include or incorporate one or more components or configurations of the electronic device 100 shown in fig. 1, 2, 3, 4, and 5, the electronic device 600 shown in fig. 1, 6, 7, 8, and 9, the electronic device 1000 shown in fig. 10, the electronic device 1100 shown in fig. 11, the electronic device 1200 shown in fig. 12, and the electronic device 1300 shown in fig. 13. In addition, the electronic device 1400 shown in fig. 14, the electronic device 1500 shown in fig. 15, and the electronic device 1600 shown in fig. 16 may include one or more features that are the same as or similar to the features described with respect to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7, fig. 8, fig. 9, fig. 10, fig. 11, fig. 12, fig. 13, fig. 17, fig. 18, fig. 19, fig. 20, fig. 21, fig. 22, fig. 23, and fig. 24. The exemplary X-Y-Z coordinate systems shown in fig. 14, 15, and 16 may be used to discuss aspects of the components and/or systems, and may be applicable to the embodiments described throughout this disclosure. Like the other included figures, fig. 14, 15 and 16 are shown for illustrative purposes and are not limiting of the possible embodiments of the invention or the claims.

As shown in fig. 14, the electronic device 1400 may include a housing 1402, a display panel 1404, and a display area cutout 1406. The display area cutout 1406 may be a high light transmission area. The display area cutout 1406 may have a circular shape to match the circular shape of one or more lenses of the camera module. The camera module may be positioned behind the display panel 1404 and directly below the display area cutout 1406. The display area cutout 1406 may allow 50% to 100% of the light received by the display panel to pass through to the camera module, as compared to the remaining display panel 1404, which only allows about 0.15% of the received light to pass through.

As shown in fig. 15, the electronic device 1500 may include a housing 1402, a display panel 1504, and a display area recess 1506. The display region recess 1506 may be a high light transmission region. The camera module may be positioned behind the display panel 1404 and below the display area recess 1506. For aesthetic purposes, the display area recess 1506 may be located along an edge of the display panel 1504. The display area notch 1406 may allow 50% to 100% of the light received by the display panel to pass through to the camera module, as compared to the remaining display panel 1504, which only allows about 0.15% of the received light to pass through.

As shown in fig. 16, electronic device 1600 may include housing 1402, display panel 1604, and display panel low density region 1606. The display panel low density region 1606 may be a high light transmission region. The camera module may be positioned behind the display panel 1404 and directly below the display panel low density region 1606. In some aspects, the display panel 1604 may be an OLED display panel. When the display panel 1604 is an OLED display panel, the density of pixels at the display panel low density region 1606 may be reduced to increase light transmission through the display panel low density region 1606. In some aspects, the display panel 1604 may be a micro LED display panel. When display panel 1604 is a micro LED display panel, display panel low density region 1606 may maintain a lower pixel density for a limited space of display panel low density region 1606 and reroute connections and drivers to allow increased light through display panel 1604. In some aspects, the display panel 1604 may be a liquid crystal display (LDC). When display panel 1604 is an LCD, pixels can be activated or deactivated to change the size and/or shape of display panel low density region 1606. Thus, as the size and/or shape of the display panel low density region 1606 changes, parameters of the camera module, such as F-number (described further herein), may be changed, modified, and/or adjusted. The display panel low density region 1606 may allow 10% to 15% of the light received by the display panel to pass through to the camera module, as compared to the remaining display panel 1504, which only allows approximately 0.15% of the received light to pass through. In some aspects, the camera module (e.g., for performing machine vision image capture) may require about 10% of the light received by the display panel 1604 to adequately capture an image (e.g., for machine vision image capture).

For at least some camera modules and for a given field of view and aperture size, the position of the aperture stop relative to the lens may affect the size of the display area and thus the size of the high light transmission area. Fig. 17, 18, and 19 illustrate electronic device configurations according to some embodiments. Fig. 17 shows a cross-sectional view of a configuration of an electronic device 1700. Fig. 18 shows a cross-sectional view of an electronic device 1800. Fig. 19 shows a cross-sectional view of an electronic device 1900. The electronic device 1700 shown in fig. 17, the electronic device 1800 shown in fig. 18, and the electronic device 1900 shown in fig. 19 may include and/or incorporate one or more components from each and/or may include or incorporate one or more components or configurations of the electronic device 100 shown in fig. 1, 2, 3, 4, and 5, the electronic device 1000 shown in fig. 1, 6, 7, 8, and 9, the electronic device 1000 shown in fig. 10, the electronic device 1100 shown in fig. 11, the electronic device 1200 shown in fig. 12, the electronic device 1300 shown in fig. 13, the electronic device 1400 shown in fig. 14, the electronic device 1500 shown in fig. 15, and the electronic device 1600 shown in fig. 16. In addition, the electronic device 1700 shown in fig. 17, the electronic device 1800 shown in fig. 18, and the electronic device 1900 shown in fig. 19 may include one or more features that are the same as or similar to the features described with respect to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7, fig. 8, fig. 9, fig. 10, fig. 11, fig. 12, fig. 13, fig. 14, fig. 15, fig. 16, fig. 20, fig. 21, fig. 22, fig. 23, and fig. 24. The exemplary X-Y-Z coordinate systems shown in fig. 17, 18, and 19 may be used to discuss aspects of the components and/or systems, and may be applicable to the embodiments described throughout this disclosure. Like the other included figures, fig. 17, 18 and 19 are shown for illustrative purposes and are not limiting of the possible embodiments of the invention or the claims.

As shown in fig. 17, the electronic device 1700 may include a housing 1701, a transparent cover 1716, a display panel 1712 including a high light transmission region 1714, and a first camera module 1702. The high light transmission region 1714 may be the same or at least similar to the high light transmission regions provided in fig. 14, 15, and/or 16. The first camera module 1702 may include an image sensor 1704, a plurality of lens elements 1706, and an aperture stop 1708. The first camera module 1702 (e.g., the lens element 1706) may have a first size and/or horizontal performance. The plurality of lens elements 1706 may include a first lens element 1706a position located at the top of the stack of lens elements closest to the display panel 1712. As shown in fig. 17, an aperture stop 1708 may be positioned directly below the first lens element 1706a within the lens stack. Due to the position of the aperture stop 1708 and the size of the first camera module 1702, edge light rays extending from the image sensor 1702, through the first lens element 1706a, and up through the high light transmission region 1714 create a large cone of light and may require the high light transmission region 1714 to have a first distance 1705 (e.g., diameter).

As shown in fig. 18, the electronic device 1800 may include a housing 1701, a transparent cover 1716, a display panel 1812 including a high light transmission area 1814, and a second camera module 1802. The high light transmission region 1814 may be the same as or at least similar to the high light transmission region provided in fig. 14, 15, and/or 16. An aperture stop 1808 may be positioned on the display panel 1812 and overlap at least a portion of the high light transmission region 1814. The second camera module 1802 can include an image sensor 1804, a plurality of lens elements 1806. The second camera module 1802 (e.g., the lens element 1806) may have a second size and/or performance level that is greater than and/or greater than the size and/or performance of another camera module (e.g., the first camera module 1702 shown in fig. 17, the lens element 1706 shown in fig. 17). Due to the position of the aperture stop 1808, marginal rays extending from the image sensor 1804, through the lens element 1806, through the aperture stop 1808, and up through the high light transmission region 1814 produce a small cone of light and may use a high light transmission region 1814 having a second distance 1805 (e.g., diameter) that is less than the first distance 1705 of the high light transmission region 1714. With a relatively smaller second distance 1805 (e.g., diameter) of the high light transmission region 1814, less of the display panel 1812 may be obscured to display an image. However, the size of the second camera module 1802 (e.g., the size of the lens element 1806 of the second camera module 1802) may be larger than the size of the first camera module 1802 (e.g., the size of the lens element 1706 of the first camera module 1702) to accommodate a larger distance between the entrance pupil formed by the aperture stop 1808 and the lens element 1806 than the distance between the aperture stop 1708 and the lens element 1706 shown in fig. 17. The larger second camera module 1802 (and the larger lens element 1806) may create too small a tolerance with the electronic device 1800 and/or may prevent other components disposed within the electronic device 1800 from properly assembling and/or operating.

As shown in fig. 19, the electronic device 1900 may include a housing 1701, a transparent cover 1716, a display panel 1912 including a high light transmission region 1914, and a third camera module 1902. The high light transmission region 1914 may be the same as or at least similar to the high light transmission regions provided in fig. 14, 15, and/or 16. The third camera module 1902 may include an image sensor 1704, a plurality of lens elements 1706, and an aperture stop 1908. The third camera module 1702 may have the same or similar size and/or performance level as the first camera module 1702 shown in fig. 17. The plurality of lens elements 1706 may include a first lens element 1706a position at the top of the stack of lens elements closest to the display panel 1912. As shown in fig. 19, the aperture stop 1908 may be positioned directly over the first lens element 1706a and over the lens stack. Due to the position of aperture stop 1908, marginal rays extending from image sensor 1904, through lens element 1906, through aperture stop 1908, and up through high light transmission region 1914 produce a moderate magnitude of light cone, and high light transmission region 1914 may be used with a third distance 1905 (e.g., diameter) that is greater than first distance 1705 of high light transmission region 1714 and less than second distance 1805 of high light transmission region 1814. With a relatively modest third distance 1905 (e.g., diameter) of the high light transmission region 1914, a modest amount of the display panel 1912 may be hindered from displaying images. However, the size of the third camera module 1902 (e.g., the size of the lens element 1706 of the second camera module 1802) may be the same as the size of the first camera module 1702 (e.g., the lens element 1706) while accommodating a greater distance between the lens element 1706 and the entrance pupil formed by the aperture stop 1908 than the distance between the aperture stop 1708 and the lens element 1706 shown in fig. 17. Thus, with the aperture stop 1908 positioned between the plurality of lenses 1706 and the high light transmission region 1914 (e.g., not abutting the display panel 1912), the third camera module 1902 (e.g., the lens element 1706) may maintain dimensions and configuration for acceptable tolerances with the electronic device 1900 to allow for functional and aesthetic acceptable positioning of the camera module 1902 within the electronic device 1900, and may allow for placement of other components within the electronic device 1900 for proper execution of appropriate operations.

When the aperture stop (and thus the entrance pupil) is positioned between the lens and the high light transmission region, the configurations described herein may minimize the camera module size (e.g., the size of the lens element 1706) and the display area (e.g., the size or distance over the high light transmission region (e.g., the high light transmission region 1914)). These minimisation may depend on several camera module parameters including field of view, entrance pupil size and position, lens barrel size, F-number, focal length etc. It should be appreciated that the field of view may be the range of the observable world seen by the camera module at any given moment. The field of view may be characterized by degrees. It should also be appreciated that the F-value or F-number may be the ratio of the focal length of the camera module to the diameter of the entrance pupil. It should also be appreciated that the focal length may be the distance from the lens or mirror of the camera module to its focal point.

As described herein, to minimize camera module size (e.g., the size of the lens element 1706) and display area (e.g., the size or distance over the high light transmission area (e.g., the high light transmission area 1914)), an aperture stop (and thus an entrance pupil) may be positioned between the lens and the high light transmission area. In some aspects, the camera module may utilize an injection molded lens optical package with an integral lens barrel. In some aspects, the camera module may utilize a wafer level optical lens package that does not require an integral lens barrel. As described herein, the closer the lens may be positioned to the display surface, the smaller the display area (and thus the high light transmission area) may be.

Fig. 20, 21, and 22 illustrate a camera display package according to some embodiments. Fig. 20 shows a cross-sectional view of the camera display package 2000. Fig. 21 shows a cross-sectional view of a camera display package 2100. Fig. 22 shows a cross-sectional view of the camera display package 2200. The camera display package 2000 illustrated in fig. 20, the camera display package 2100 illustrated in fig. 21, and the camera display package 2200 illustrated in fig. 22 may contain and/or incorporate one or more components from each and/or may contain or incorporate one or more components or configurations of the electronic device 100 illustrated in fig. 1, 2, 3, 4, and 5, the electronic device 600 illustrated in fig. 1, 6, 7, 8, and 9, the electronic device 1000 illustrated in fig. 10, the electronic device 1100 illustrated in fig. 11, the electronic device 1200 illustrated in fig. 12, the electronic device 1300 illustrated in fig. 13, the electronic device 1400 illustrated in fig. 14, the electronic device 1500 illustrated in fig. 15, the electronic device 1600 illustrated in fig. 16, the electronic device 1700 illustrated in fig. 17, the electronic device 1800 illustrated in fig. 18, and the electronic device 1900 illustrated in fig. 19. In addition, the camera display package 2000 illustrated in fig. 20, the camera display package 2100 illustrated in fig. 21, and the camera display package 2200 illustrated in fig. 22 may include one or more features identical or similar to those described with respect to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 23, and 24 or illustrated in these figures. The exemplary X-Y-Z coordinate systems shown in fig. 20, 21, and 22 may be used to discuss aspects of the components and/or systems, and may be applicable to the embodiments described throughout this disclosure. Like the other included figures, fig. 20, 21 and 22 are shown for illustrative purposes and are not limiting of the possible embodiments of the invention or the claims.

As shown in fig. 20, the camera display package 2000 may include a camera module 2001 and a display panel 2008. The camera module 2001 may utilize an injection molded lens optical package 2005 including a plurality of lens elements 2002 and a lens barrel 2004, as well as an image sensor 2006. The camera module 2001 may also include an aperture stop 2010 positioned between the top two lens elements 2002 (e.g., the two lens elements 2002 closest to the display panel 2008). Due to the lens barrel 2004 and the top lens element, a distance is formed between the entrance pupil formed by the aperture stop 2010 and the display panel 2008. As a result, the cone of light formed by the right light ray 2016 may utilize a first distance 2014 that forms a diameter across the high light transmission region 2018. In some aspects, the first distance 2014 may be a distance greater than other distances described herein.

As shown in fig. 21, the camera display package 2100 may include a camera module 2101 and a display panel 2108. Similar to the camera module 2001 shown in fig. 20, the camera module 2101 may utilize an injection molded lens optical package 2105 including a plurality of lens elements 2102 and one lens barrel 2104, and an image sensor 2106. The camera module 2101 may also include an aperture stop 2110 (e.g., formed by the lens barrel 2104 or positioned adjacent to the lens barrel 2104) positioned between the stack of lens elements 2102 (e.g., above a top lens element closest to the display panel 2108) and the display panel 2108. Due to the thickness of the lens barrel 2104, a distance is formed between the entrance pupil formed by the aperture stop 2110 and the display panel 2108. As a result, the light cone formed by the right light ray 2116 may utilize a second distance 2114 that forms across the diameter of the high light transmission region 2118. In some aspects, the second distance may be less than the first distance 2014, thereby achieving a smaller high light transmission region 2118 on the display panel 2108 as compared to the high light transmission region 2018 on the display panel 2008 shown in fig. 20.

As shown in fig. 22, the camera display package 2200 may include a camera module 2201 and a display panel 2208. The camera module 2201 may utilize a wafer level optical lens package 2205 that does not require an integral lens barrel, as well as an image sensor 2106. The wafer level optical lens package 2205 may include a glass substrate 2204 with lens elements 2202 formed on a top surface and a bottom surface of the glass substrate 2204. The camera module 2101 can also include an image sensor 2206 and an aperture stop 2210. The aperture stop 2210 may be positioned between the stack of lens elements 2202 (e.g., above the top lens element closest to the display panel 2208) and the display panel 2008. Because the wafer level optical package 2205 does not include a lens barrel, the distance between the entrance pupil formed by the aperture stop 2210 and the display panel 2208 may be smaller as compared to the injection molded lens optical packages 2005 and 2105. The display area or high light transmission area 2218 may be an aperture of the camera module 2201. In other words, the aperture of the camera module 2201 may be a portion of the display area or the high light transmission area 2218. As a result, the light cone formed by right light line 2216 may utilize a third distance 2214 formed across the diameter of high light transmission region 2218. In some aspects, the third distance may be less than the first distance 2014 and the second distance 2114, thereby achieving a smaller high light transmission region 2118 on the display panel 2208 as compared to the high light transmission region 2018 on the display panel 2008 shown in fig. 20 and as compared to the high light transmission region 2118 on the display panel 2108 shown in fig. 21.

Fig. 23 shows a schematic diagram of an example device 2300 that may include a camera (e.g., as described herein with respect to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, and 24) according to some embodiments. In some embodiments, device 2300 may be a mobile device and/or a multi-function device. In various embodiments, device 2300 may be any of a variety of types of devices, including but not limited to: personal computer systems, desktop computers, laptop computers, notebook computers, tablet computers, all-in-one computers, tablet or netbook computers, mainframe computer systems, handheld computers, workstations, network computers, cameras, set-top boxes, mobile devices, augmented Reality (AR) and/or Virtual Reality (VR) headsets, consumer devices, video game controllers, handheld video game devices, application servers, storage devices, televisions, video recording devices, peripheral devices (such as switches, modems, routers) or generally any type of computing or electronic device.

In some implementations, the device 2300 may include a display system 2302 (e.g., including a display and/or a touch-sensitive surface) and/or one or more cameras 2304. In some non-limiting implementations, the display system 2302 and/or one or more forward facing cameras 2304a may be provided at a front side of the device 2300, for example, as indicated in fig. 23. Additionally or alternatively, one or more rearward facing cameras 2304b may be provided at the rear side of the device 2300. In some embodiments including multiple cameras 2304, some or all of the cameras may be the same or similar to each other. Additionally or alternatively, some or all of the cameras may be different from each other. In various implementations, the position and/or arrangement of the camera 2304 may be different than those shown in fig. 23.

The device 2300 may include, among other things, memory 2306 (e.g., including an operating system 2308 and/or application/program instructions 2310), one or more processors and/or controllers 2312 (e.g., including a CPU, memory controller, display controller, and/or camera controller, etc.), and/or one or more sensors 2316 (e.g., orientation sensor, proximity sensor, and/or position sensor, etc.). In some embodiments, device 2300 may communicate with one or more other devices and/or services (such as computing device 2318, cloud service 2320, etc.) via one or more networks 2322. For example, device 2300 may include a network interface (e.g., network interface 2310) that enables device 2300 to transmit data to and receive data from network 2322. Additionally or alternatively, device 2300 may be capable of communicating with other devices via wireless communication using any of a variety of communication standards, protocols, and/or technologies.

Fig. 24 shows a schematic block diagram of an exemplary computing device referred to as a computer system 2400, which may include or host an embodiment of a camera (e.g., as described herein with respect to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, and 23). Further, computer system 2400 may implement methods for controlling the operation of a camera and/or for performing image processing on images captured with a camera. In some embodiments, device 2400 (described herein with reference to fig. 24) may additionally or alternatively include some or all of the functional components of computer system 2400 described herein.

Computer system 2400 may be configured to perform any or all of the embodiments described above. In different embodiments, computer system 2400 may be any of a variety of types of devices including, but not limited to: personal computer systems, desktop computers, laptop computers, notebook computers, tablet computers, all-in-one computers, tablet or netbook computers, mainframe computer systems, handheld computers, workstations, network computers, cameras, set-top boxes, mobile devices, augmented Reality (AR) and/or Virtual Reality (VR) headsets, consumer devices, video game controllers, handheld video game devices, application servers, storage devices, televisions, video recording devices, peripheral devices (such as switches, modems, routers) or generally any type of computing or electronic device.

In the illustrated embodiment, computer system 2400 includes one or more processors 2402 coupled to a system memory 2404 via an input/output (I/O) interface 2406. Computer system 2400 also includes one or more cameras 2408 coupled to I/O interface 2406. The computer system 2400 also includes a network interface 2410 coupled to the I/O interface 2406, and one or more input/output devices 2412, such as a cursor control device 2414, a keyboard 2416, and a display 2418. In some cases, it is contemplated that an embodiment may be implemented using a single instance of computer system 2400, while in other embodiments, multiple such systems or multiple nodes comprising computer system 2400 may be configured to host different portions or instances of an embodiment. For example, in one embodiment, some elements may be implemented by one or more nodes of computer system 2400 that are different from those implementing other elements.

In various embodiments, computer system 2400 may be a single processor system including one processor 2402, or a multi-processor system including several processors 2402 (e.g., two, four, eight, or another suitable number). Processor 2402 may be any suitable processor capable of executing instructions. For example, in various embodiments, processor 2402 may be a general-purpose or embedded processor implementing any of a variety of Instruction Set Architectures (ISAs), such as the x86, powerPC, SPARC, or MIPS ISAs, or any other suitable ISA. In a multiprocessor system, each of processors 2402 may typically, but need not necessarily, implement the same ISA.

The system memory 2404 may be configured to store program instructions 2420 that are accessible to the processor 2402. In various embodiments, system memory 2404 may be implemented using any suitable memory technology, such as Static Random Access Memory (SRAM), synchronous Dynamic RAM (SDRAM), non-volatile/flash-type memory, or any other type of memory. Additionally, existing camera control data 2422 of memory 2404 may include any of the information or data structures described above. In some embodiments, program instructions 2420 and/or data 2422 may be received, transmitted, or stored on a different type of computer-accessible medium separate from system memory 2404 or computer system 2400, or similar medium. In various embodiments, some or all of the functionality described herein may be implemented via such computer system 2400.

In one embodiment, the I/O interface 2406 may be configured to coordinate I/O communications between the processor 2402, the system memory 2404, and any peripheral devices in the device, including the network interface 2410 or other peripheral device interfaces, such as the input/output device 2412. In some implementations, the I/O interface 2406 may perform any necessary protocol, timing, or other data conversion to convert data signals from one component (e.g., the system memory 2404) into a format suitable for use by another component (e.g., the processor 2402). In some implementations, the I/O interface 2406 may include support for devices attached, for example, through various types of peripheral buses, such as variants of the Peripheral Component Interconnect (PCI) bus standard or the Universal Serial Bus (USB) standard. In some implementations, the functionality of I/O interface 2406 may be divided into two or more separate components, such as a north bridge and a south bridge, for example. Furthermore, in some implementations, some or all of the functionality of the I/O interface 2406 (such as an interface to the system memory 2404) may be incorporated directly into the processor 2402.

The network interface 2410 may be configured to allow data to be exchanged between the computer system 2400 and other devices (e.g., carriers or proxy devices) attached to the network 2424 or between nodes of the computer system 2400. In various embodiments, network 2424 may include one or more networks including, but not limited to, a Local Area Network (LAN) (e.g., ethernet or enterprise network), a Wide Area Network (WAN) (e.g., the internet), a wireless data network, some other electronic data network, or some combination thereof. In various embodiments, the network interface 2410 may support communication via a wired or wireless general-purpose data network (such as any suitable type of ethernet network), for example; communication via a telecommunications/telephony network, such as an analog voice network or a digital fiber optic communication network; communication via a storage area network (such as a fibre channel SAN), or via any other suitable type of network and/or protocol.

In some embodiments, the input/output devices 2412 may include one or more display terminals, keyboards, keypads, touchpads, scanning devices, voice or optical recognition devices, or any other devices suitable for inputting or accessing data by the one or more computer systems 2400. The plurality of input/output devices 2412 may reside in the computer system 2400 or may be distributed among various nodes of the computer system 2400. In some embodiments, similar input/output devices may be separate from computer system 2400 and may interact with one or more nodes of computer system 2400 through wired or wireless connections, such as through network interface 2410.

In some aspects, an electronic device may be provided. The electronic device may include a camera module having an optical axis and a set of one or more lenses centered along the optical axis. The electronic device may further include a display panel including an enhanced light transmission region. The enhanced light transmission region may allow a greater amount of light to pass through than at least one other region of the display panel. The electronic device may also include a display Printed Circuit Board (PCB). Further, the electronic device may include an aperture stop positioned between the set of one or more lenses and the display panel. The electronic device may include a transparent cover positioned over the display panel on a side of the display panel opposite the display PCB. The electronic device may further include a housing configured to hold the camera module, the display panel, the display PCB, and the aperture stop therein. In some aspects, the one or more lenses may include wafer level optical lenses. In some aspects, the aperture stop may be positioned against the set of one or more lenses. In some aspects, the aperture stop may be positioned against the display panel. In some aspects, the aperture stop and the enhanced light transmission region may be centered about the optical axis. In some aspects, the aperture stop may include a cross-section that is smaller than a cross-section of the enhanced light transmission region. In some aspects, the enhanced light transmission region may include a hole punch extending through the display panel. In some aspects, the enhanced light transmission region may include a notch extending through the display panel and adjacent an edge of the display panel. In some aspects, the enhanced light transmission region may include a region of the display panel having at least one of a lower pixel density or a lower wiring density than at least one other region of the display panel. In some aspects, the display panel may include a Liquid Crystal Display (LCD) panel, and the enhanced light transmission region may include a variable cross-sectional area. In some aspects, the camera module may include a machine vision camera module. In some aspects, the display panel may include a plurality of Light Emitting Diodes (LEDs), and the plurality of LEDs may include one or more Organic LEDs (OLEDs). In some aspects, the display panel may include a plurality of Light Emitting Diodes (LEDs), and the plurality of LEDs may include one or more micro LEDs. In some aspects, the enhanced light transmission region allows a greater amount of light to pass through than the entire remainder of the display panel.

In some aspects, a display package for an electronic device may be provided. The display package may include a camera module having an optical axis and a set of one or more lenses centered along the optical axis. The display package may further include a display panel including an enhanced light transmission region. The enhanced light transmission region may allow a greater amount of light to pass through than at least one other region of the display panel. The display package may also include a display Printed Circuit Board (PCB). Further, the display package may include a transparent cover positioned over the display panel on a side of the display panel opposite the display PCB. The display package may include an aperture stop positioned between the set of one or more lenses and the display panel. In some aspects, the one or more lenses comprise wafer level optical lenses. In some aspects, the aperture stop may be positioned against the set of one or more lenses. In some aspects, the aperture stop may be positioned against the display panel. In some aspects, the aperture stop and the enhanced light transmission region may be centered about the optical axis. In some aspects, the aperture stop may include a cross-section that is smaller than a cross-section of the enhanced light transmission region. In some aspects, the enhanced light transmission region may include a hole punch extending through the display panel. In some aspects, the enhanced light transmission region may include a notch extending through the display panel and adjacent an edge of the display panel. In some aspects, the enhanced light transmission region may include a region of the display panel having at least one of a lower pixel density or a lower wiring density than at least one other region of the display panel. In some aspects, the display panel may include a Liquid Crystal Display (LCD) panel and the enhanced light transmission region may include a variable cross-sectional area. In some aspects, the camera module may include a machine vision camera module. In some aspects, the display panel may include a plurality of Light Emitting Diodes (LEDs), and the plurality of LEDs may include one or more Organic LEDs (OLEDs). In some aspects, the display panel may include a plurality of Light Emitting Diodes (LEDs), and wherein the plurality of LEDs include one or more micro LEDs. In some aspects, the enhanced light transmission region allows a greater amount of light to pass through than the entire remainder of the display panel.

In some aspects, a camera assembly is provided. The camera assembly may include a camera module having an optical axis and a set of one or more lenses centered along the optical axis. The camera assembly may further include a display panel including an enhanced light transmission region. The enhanced light transmission region may allow a greater amount of light to pass through than at least one other region of the display panel. The camera assembly may also include a display Printed Circuit Board (PCB). Further, the camera assembly may include an aperture stop positioned between the set of one or more lenses and the display panel. In some aspects, the one or more lenses may include wafer level optical lenses. In some aspects, the aperture stop may be positioned against the set of one or more lenses. In some aspects, the aperture stop may be positioned against the display panel. In some aspects, the aperture stop and the enhanced light transmission region may be centered about the optical axis. In some aspects, the aperture stop may include a cross-section that is smaller than a cross-section of the enhanced light transmission region. In some aspects, the enhanced light transmission region may include a hole punch extending through the display panel. In some aspects, the enhanced light transmission region may include a notch extending through the display panel and adjacent an edge of the display panel. In some aspects, the enhanced light transmission region may include a region of the display panel having at least one of a lower pixel density or a lower wiring density than at least one other region of the display panel. In some aspects, the display panel may include a Liquid Crystal Display (LCD) panel and the enhanced light transmission region may include a variable cross-sectional area. In some aspects, the camera module may include a machine vision camera module. In some aspects, the display panel may include a plurality of Light Emitting Diodes (LEDs), and the plurality of LEDs may include one or more Organic LEDs (OLEDs). In some aspects, the display panel may include a plurality of Light Emitting Diodes (LEDs) and the plurality of LEDs may include one or more micro LEDs. In some aspects, the enhanced light transmission region allows a greater amount of light to pass through than the entire remainder of the display panel.

Those skilled in the art will appreciate that computer system 2400 is merely illustrative and is not intended to limit the scope of the embodiments. In particular, the computer systems and devices may include any combination of hardware or software that can perform the indicated functions, including computers, network devices, internet devices, PDAs, wireless telephones, pagers, and the like. The computer system 2400 may also be connected to other devices not shown, or vice versa may operate as a stand-alone system. Furthermore, the functionality provided by the illustrated components may be combined in fewer components or distributed in additional components in some embodiments. Similarly, in some embodiments, the functionality of some of the illustrated components may not be provided, and/or other additional functionality may be available.

Those skilled in the art will also recognize that while various items are shown as being stored in memory or on storage during use, these items or portions thereof may be transferred between memory and other storage devices for purposes of memory management and data integrity. Alternatively, in other embodiments, some or all of these software components may execute in memory on another device and communicate with the illustrated computer system via inter-computer communication. Some or all of the system components or data structures may also be stored (e.g., as instructions or structured data) on a computer-accessible medium or portable article of manufacture for reading by a suitable drive, various examples of which are described above. In some embodiments, instructions stored on a computer-accessible medium separate from computer system 2400 may be transmitted to computer system 2400 via a transmission medium or signal, such as an electrical, electromagnetic, or digital signal transmitted via a communication medium such as a network and/or wireless link. Various embodiments may also include receiving, transmitting, or storing instructions and/or data implemented in accordance with the foregoing description on a computer-accessible medium. Generally, computer-accessible media may include non-transitory computer-readable storage media or memory media such as magnetic or optical media, e.g., disk or DVD/CD-ROM, volatile or non-volatile media such as RAM (e.g., SDRAM, DDR, RDRAM, SRAM, etc.), ROM, and the like. In some embodiments, a computer-accessible medium may include transmission media or signals such as electrical, electromagnetic, or digital signals transmitted via a communication medium, such as a network and/or wireless link.

In various embodiments, the methods described herein may be implemented in software, hardware, or a combination thereof. Further, the order of the blocks of the method may be changed, and various elements may be added, reordered, combined, omitted, modified, etc. Various modifications and alterations will become apparent to those skilled in the art having the benefit of this disclosure. The various embodiments described herein are intended to be illustrative rather than limiting. Many variations, modifications, additions, and improvements are possible. Thus, multiple examples may be provided for components described herein as a single example. Boundaries between various components, operations and data stores are somewhat arbitrary, and particular operations are illustrated in the context of specific illustrative configurations. Other allocations of functionality are contemplated and may fall within the scope of the claims that follow. Finally, structures and functions presented as discrete components in an exemplary configuration may be implemented as a combined structure or component. These and other variations, modifications, additions, and improvements may fall within the scope of the embodiments as defined in the claims that follow.

Claims

1. An electronic device, comprising:

A camera module having an optical axis and a set of one or more lenses centered along the optical axis;

a display panel comprising an enhanced light transmission region, wherein the enhanced light transmission region allows a greater amount of light to pass through than at least one other region of the display panel;

displaying a Printed Circuit Board (PCB);

an aperture stop positioned between the set of one or more lenses and the display panel;

a transparent cover positioned over the display panel and on a side of the display panel opposite the display PCB; and

a housing configured to hold the camera module, the display panel, the display PCB, and the aperture stop therein.

2. The electronic device of claim 1, wherein the one or more lenses comprise wafer level optical lenses.

3. The electronic device of claim 1, wherein the aperture stop is positioned against the set of one or more lenses.

4. The electronic device of claim 1, wherein the aperture stop is positioned against the display panel.

5. The electronic device of claim 1, wherein the aperture stop and the enhanced light transmission region are centered about the optical axis.

6. The electronic device of claim 1, wherein the aperture stop comprises a cross-section that is smaller than a cross-section of the enhanced light transmission region.

7. The electronic device defined in claim 1 wherein the enhanced light transmission region comprises a punch that extends through the display panel.

8. A display package for an electronic device, comprising:

displaying a Printed Circuit Board (PCB);

an aperture stop positioned between the set of one or more lenses and the display panel.

9. The display package of claim 8, wherein the enhanced light transmission region comprises a notch extending through the display panel and adjacent an edge of the display panel.

10. The display package of claim 8, wherein the enhanced light transmission region comprises a region of the display panel having at least one of a lower pixel density or a lower wiring density than at least one other region of the display panel.

11. The display package of claim 8, wherein the display panel comprises a Liquid Crystal Display (LCD) panel, and wherein the enhanced light transmission region comprises a variable cross-sectional area.

12. The display package of claim 8, wherein the camera module comprises a machine vision camera module.

13. The display package of claim 8, wherein the display panel comprises a plurality of Light Emitting Diodes (LEDs), and wherein the plurality of LEDs comprises one or more Organic LEDs (OLEDs).

14. The display package of claim 8, wherein the display panel comprises a plurality of Light Emitting Diodes (LEDs), and wherein the plurality of LEDs comprises one or more micro LEDs.

15. The display package of claim 8, wherein the enhanced light transmission region allows a greater amount of light to pass through than the entire remainder of the display panel.

16. A camera assembly, comprising:

displaying a Printed Circuit Board (PCB); and

17. The camera assembly of claim 16, wherein the aperture stop and the enhanced light transmission region are centered about the optical axis.

18. The camera assembly of claim 16, wherein the enhanced light transmission region comprises a punch extending through the display panel.

19. The camera assembly of claim 16, wherein the enhanced light transmission region includes a notch extending through the display panel and adjacent an edge of the display panel.

20. The camera assembly of claim 16, wherein the enhanced light transmission region comprises a region of the display panel having at least one of a lower pixel density or a lower wiring density than at least one other region of the display panel.