CN117767079A - Conversion device for converting high-speed signal parallel double lines into double ports - Google Patents
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Abstract
The invention provides a conversion device for converting high-speed signals into double ports by parallel double lines, which comprises: the double-sided copper-clad circuit board, the double signal lines, the first port, the second port, the third port and the plurality of conductive through holes; the double-sided copper-clad plate comprises a first copper-clad plate, a dielectric plate and a second copper-clad plate; the first copper-clad plate is divided into a first ground, a second ground and a third ground by the double signal lines; the double signal lines are branched into a first signal line and a second signal line, and the edge of the third ground near the branching position of the double signal lines is arranged in a Gaussian curve shape. The arrangement of the Gaussian curve shape enables the parallel double-line structure to be matched with the first port and the second port more easily, and meanwhile, the vertex of the Gaussian curve shape is in smooth transition, so that signal discontinuity caused by wedge transition is avoided, and signal transmission quality when the high-speed signal parallel double-line is converted into double-port is improved.
Description
Technical Field
The invention relates to the technical field of high-speed signal transmission, in particular to a conversion device for converting high-speed signals into double ports by parallel double lines.
Background
In the transmission of high-speed signals, differential signals are increasingly widely used, and the critical signal transmission in the high-speed signal circuit nowadays often adopts differential structure design, and the differential pair structure also often adopts a parallel double-line form, wherein the parallel double-line can be a strip line structure or a microstrip line structure. However, in the signal line conversion device, when the signal line is converted from the parallel two-wire structure to the two-port structure, reflection of the transmission signal is very easily caused, and thus the signal transmission quality is deteriorated.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a conversion device for converting high-speed signals into double-port signals by parallel double lines.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a high-speed signal parallel two-wire to dual port conversion device comprising: the double-sided copper-clad circuit board, the double signal lines, the first port, the second port, the third port and the plurality of conductive through holes;
the double-sided copper-clad plate comprises a first copper-clad plate, a dielectric plate and a second copper-clad plate;
the first copper-clad plate is divided into a first ground, a second ground and a third ground by the double signal lines, and the second copper-clad plate is a fourth ground;
the plurality of conductive through holes penetrate through the double-sided copper-clad circuit board and connect the first copper-clad plate and the second copper-clad plate;
the double signal lines comprise a first signal line and a second signal line, and the first signal line and the second signal line are connected with the third port and form a parallel coupling microstrip line;
the dual signal line diverges at the third ground such that the first signal line is connected to a first port and the second signal line is connected to a second port;
the first port is arranged between the first ground and a third ground, the second port is arranged between the second ground and the third ground, and the third port is arranged between the first ground and the second ground;
the third ground is arranged on one side of the bifurcation part close to the double signal lines in a Gaussian curve shape.
As a preferred embodiment of the present invention, the third ground includes a non-vertex edge and a vertex edge at a side near the bifurcation of the dual signal line;
the shape of the vertex edge satisfies the formulaWhere μ=0, σ=0.26.
As a preferred embodiment of the present invention, the gaps between the non-vertex edges and the first signal line or the second signal line are s.
As a preferred embodiment of the present invention, the gap between the first ground and the first signal line is s, and the gap between the second ground and the second signal line is s.
As a preferred embodiment of the present invention, the first port and the second port form a coplanar waveguide port, and are connected to a coaxial cable.
As a preferred embodiment of the present invention, the impedance of the first port and the second port is 50Ω.
As a preferred embodiment of the present invention, the double-sided coatingThe thickness h of the copper circuit board satisfies the formulaWherein lambda is min Epsilon for transmitting the wavelength corresponding to the highest frequency signal in the signals r Is the relative dielectric constant of the dielectric plate.
As a preferred embodiment of the present invention, the width w of the first signal line 1 And width w of the second signal line 2 Satisfy the formulaWherein lambda is min Epsilon for transmitting the wavelength corresponding to the highest frequency signal in the signals r Is the relative dielectric constant of the dielectric plate.
As a preferred embodiment of the present invention, the plurality of conductive vias includes a first conductive via group, a second conductive via group, and a third conductive via group;
the first conductive via group is used for connecting the first ground and the fourth ground, and is arranged on the edge of the first ground, which is close to the first signal line;
the second conductive via group is used for connecting the second ground and the fourth ground, and is arranged on the edge of the second ground, which is close to the second signal line;
the third conductive via group is used for connecting the third ground and the fourth ground, and is arranged on the edge, close to the first signal line and the second signal line, of the third ground.
As a preferred embodiment of the invention, the diameters of the conductive vias are all a, and a is less than or equal to lambda min/20, wherein lambda min For the wavelength corresponding to the highest frequency signal in the transmitted signal.
Compared with the prior art, the invention has the advantages and positive effects that:
according to the invention, through the arrangement of the technical scheme, the double signal line is bifurcated into two independent coplanar ports (the first port and the second port) by the parallel double line structure, the first copper-clad plate is divided into the first ground, the second ground and the third ground by the double signal line, and the third ground is arranged in a Gaussian curve shape on one side close to the bifurcation position of the double signal line, so that the parallel double line structure at the third port is more easily matched with the first port and the second port. In addition, the vertex of the Gaussian curve is in smooth transition, so that signal discontinuity caused by wedge transition is avoided, and signal transmission quality is improved when a high-speed signal parallel double-line is converted into a double-port signal.
Drawings
Fig. 1 is a schematic structural diagram of a conversion device for converting a high-speed signal parallel double line into a dual port;
fig. 2 is a schematic structural diagram of a double-sided copper-clad plate provided by the invention;
FIG. 3 is a schematic view of a third ground according to the present invention;
fig. 4 is a schematic structural diagram of a conversion device for converting a high-speed signal parallel double line into a dual port.
Detailed Description
In order that the above objects, features and advantages of the invention will be more clearly understood, a further description of the invention will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as described herein, and therefore the present invention is not limited to the specific embodiments of the disclosure that follow.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, or can be communicated between two elements or the interaction relationship between the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1, an embodiment of the present invention provides a conversion device for converting a high-speed signal parallel two-wire into a dual-port signal.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
referring to fig. 1-3, an embodiment of the present invention provides a conversion device for converting a high-speed signal parallel two-wire into a dual-port, including: the double-sided copper-clad circuit board 100, the double-signal line 200, the first port 300, the second port 400, the third port 500 and the plurality of conductive vias 600;
the double-sided copper-clad laminate 100 includes a first copper-clad laminate 110, a dielectric plate 120, and a second copper-clad laminate 130;
the first copper-clad plate 110 is divided into a first ground 111, a second ground 112 and a third ground 113 by the double signal lines, and the second copper-clad plate 130 is a fourth ground;
the plurality of conductive vias 600 penetrate through the double-sided copper-clad circuit board 100 and connect the first copper-clad plate 110 and the second copper-clad plate 130; the dual signal line 200 includes a first signal line 210 and a second signal line 220, and the first signal line 210 and the second signal line 220 are connected to the third port 500 and form a parallel coupling microstrip line;
the dual signal line 200 diverges at the third ground such that the first signal line 210 is connected to the first port 300 and the second signal line 220 is connected to the second port 400;
the first port 300 is disposed between the first surface 111 and the third surface 113, the second port 400 is disposed between the second surface 112 and the third surface 113, and the third port 500 is disposed between the first surface 111 and the second surface 112;
the third ground 113 is disposed in a gaussian curve shape on one side near the bifurcation of the dual signal line 200.
According to the invention, through the arrangement of the technical scheme, the double signal line is bifurcated into two independent coplanar ports (namely the first port and the second port) by the parallel double line structure, the first copper-clad plate is divided into the first ground, the second ground and the third ground by the double signal line, and one side of the third ground, which is close to the bifurcation position of the double signal line, is arranged in a Gaussian curve shape. Because the parallel two-wire structure is a symmetrical structure and the first port and the second port are an asymmetrical structure, the impedance between the three ports is generally different, for example, in the embodiment of the invention, the impedance at the third port connected by the parallel two-wire structure is 100 Ω, and the impedance of the first port and the second port is 50 Ω, so that the conversion between them needs to be balanced to unbalanced conversion and impedance conversion, thereby avoiding the problem of unmatched very easy occurrence. In addition, the vertex of the Gaussian curve is in smooth transition, so that signal discontinuity caused by wedge transition is avoided, and signal transmission quality is improved when a high-speed signal parallel double-line is converted into a double-port signal.
As a preferred embodiment of the present invention, referring to fig. 4, the third ground 113 includes a non-vertex edge 1131 and a vertex edge 1132 at a side near the bifurcation of the dual signal line 200;
the shape of the vertex edge 1132 satisfies the formulaWhere μ=0, σ=0.26, the reflection of the differential signal at the third port 500 is small, i.e. the value of σ is continuously reduced, gaussian curveThe line tip is sharper but the reflection is not significantly reduced. Sharper peaks tend to cause signal discontinuities, and therefore μ=0, σ=0.26 are preferred in embodiments of the present invention to optimize signal transmission quality.
As a preferred embodiment of the present invention, the gaps between the non-vertex edges and the first signal line or the second signal line are s.
As a preferred embodiment of the present invention, the gap between the first ground 111 and the first signal line 210 is s, and the gap between the second ground 112 and the second signal line 220 is s. The setting mode of the equal gap s ensures that the signal transmission line obtains the best shielding effect and ensures the good transmission quality of high-speed signals.
As a preferred embodiment of the present invention, the first port 300 and the second port 400 form a coplanar waveguide port, and are connected to a coaxial cable.
As a preferred embodiment of the present invention, the impedance of the first port 300 and the second port 400 is 50Ω. In the embodiment of the invention, when the characteristic impedance is 50Ω, the circuit has smaller loss, and the good transmission quality of the high-speed signal is ensured.
As a preferred embodiment of the invention, the thickness h of the double-sided copper-clad circuit board satisfies the formulaWherein lambda is min Epsilon for transmitting the wavelength corresponding to the highest frequency signal in the signals r Is the relative dielectric constant of the dielectric plate. The size limitation of the thickness h of the double-sided copper-clad circuit board ensures that the waveguide mode and the surface wave mode in the signal are attenuated rapidly, the occurrence of chromatic dispersion is reduced, and the transmission quality and the transmission effect of the high-speed signal are further improved.
As a preferred embodiment of the present invention, the width w of the first signal line 210 1 And the width w of the second signal line 220 2 Satisfy the formulaThe size limitation of the line width of the signal line further improves the transmission quality and the transmission effect of the high-speed signal.
As a preferred embodiment of the present invention, the plurality of conductive vias 600 includes a first conductive via group 610, a second conductive via group 620, and a third conductive via group 630;
the first conductive via group 610 is configured to connect the first ground 111 and the fourth ground, and the first conductive via group 610 is disposed at an edge of the first ground 111 near the first signal line 210;
the second conductive via group 620 is configured to connect the second ground 112 and the fourth ground, and the second conductive via group 620 is disposed on an edge of the second ground 112 near the second signal line 220;
the third conductive via group 630 is configured to connect the third ground 113 and the fourth ground, and the third conductive via group 630 is disposed at an edge of the third ground 113 near the first signal line 210 and the second signal line 220.
The above-mentioned conductive via hole's setting mode for conductive via hole sets up along the edge of first signal line and second signal line, links to each other through conductive via hole between first ground 111, second ground 112, third ground 113 and the fourth ground respectively, makes first signal line and second signal line and external shielding, thereby reduces the interference of external to signal transmission, also makes the quality and the effect of high-speed signal transmission in the circuit better simultaneously.
As a preferred embodiment of the present invention, the diameters of the conductive vias 600 are all a, and a +.lamda.min/20, where lamda min For the wavelength corresponding to the highest frequency signal in the transmitted signal. The size of the diameter a of the conductive via hole is related to the highest frequency of the transmission signal, the circuit can obtain the best shielding effect only when the formula condition is satisfied, and the transmission quality and the transmission effect of the high-speed signal are further improved.
Preferably, for the above-mentioned positions of the conductive vias, the conductive vias for both sides of the same signal line, such as: for the first signal line (or the second signal lineNumber line) and the distance between the conductive vias corresponding to the positions of the two sides is L, and the formula is satisfied: l is greater than or equal to w 1 (or w) 2 ) +2s. And for the conductive via holes on the same side of the first signal line (or the second signal line), the distance between adjacent conductive via holes is d, and the formula is satisfied: d +.lambda. min /10。
Further, in the embodiment of the present invention, the impedance calculation of the parallel coupled microstrip line (i.e., the parallel double-line structure) at the third port generally adopts the odd-even mode parametric method. The difference between the odd mode and the even mode is mainly that the excitation modes are different, the two wires are positively charged at the same time in the even mode state, and the two wires are oppositely charged in the odd mode. Preferably, in the embodiment of the present invention, the first signal line 210 and the second signal line 220 are differential signal pairs, so the third port applies an impedance calculation formula of an odd mode, and the odd mode impedance of the third port is 100deg.Q, which is formed by the thickness h of the double-sided copper-clad circuit board, the relative dielectric constant εr of the dielectric board, and the width w of the first signal line 210 1 Width w of second signal line 220 2 And a gap s between the first signal line and the second signal line.
Specifically, for example: when h=1.5 mm, er=4.4, s=0.9 mm, w=0.3 mm, s0=0.08 mm, the port odd mode impedance will be 100Ω, and the characteristic impedance of the coplanar waveguide port formed by the first port and the second port adopts the following calculation formula:
(1) Wherein: k (ki) is the first type of complete elliptic integral, ki is the modulus, and K' i is the residual modulus, i.eThe first type of complete elliptic integral, which is the modulo of the remainder.
(2) Wherein: the constant is i=1, 2;
(3) The equivalent dielectric constant epsilon in the formula eff The values of (2) are:
the characteristic impedance of the coplanar waveguide port is calculated to be 50Ω, and is determined by the above formulas (1) to (4).
When the characteristic impedance of the coplanar port is 50Ω and the highest working frequency is 25GHz, the following requirements and formulas are adopted:
L≧w+2s＝2.1mm；
d≤λmin/10＝1.2mm；
a≤λmin/20＝0.6mm。
when the parameters of the conversion device provided by the embodiment of the invention meet the above range, the best shielding effect and transmission quality can be achieved.
The present invention is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present invention without departing from the technical content of the present invention still belong to the protection scope of the technical solution of the present invention.
Claims (10)
1. A conversion device for converting a high-speed signal into a dual port signal in parallel with two lines, comprising: the double-sided copper-clad circuit board, the double signal lines, the first port, the second port, the third port and the plurality of conductive through holes;
the double-sided copper-clad plate comprises a first copper-clad plate, a dielectric plate and a second copper-clad plate;
the first copper-clad plate is divided into a first ground, a second ground and a third ground by the double signal lines, and the second copper-clad plate is a fourth ground;
the plurality of conductive through holes penetrate through the double-sided copper-clad circuit board and connect the first copper-clad plate and the second copper-clad plate;
the double signal lines comprise a first signal line and a second signal line, and the first signal line and the second signal line are connected with the third port and form a parallel coupling microstrip line;
the dual signal line diverges at the third ground such that the first signal line is connected to a first port and the second signal line is connected to a second port;
the first port is arranged between the first ground and a third ground, the second port is arranged between the second ground and the third ground, and the third port is arranged between the first ground and the second ground;
the third ground is arranged in a Gaussian curve shape at the edge close to the bifurcation of the double signal lines.
2. The high-speed signal parallel two-wire conversion device according to claim 1, wherein the edge of the third ground near the bifurcation of the two signal wires comprises a non-vertex edge and a vertex edge;
the shape of the vertex edge satisfies the formulaWhere μ=0, σ=0.26.
3. The device for converting a parallel double-line of high-speed signals into a double-port signal according to claim 2, wherein the gaps between the non-vertex edges and the first signal line or the second signal line are s.
4. A high-speed signal parallel two-wire conversion device according to claim 3, wherein the gap between the first ground and the first signal wire is s, and the gap between the second ground and the second signal wire is s.
5. The device for converting a parallel two-wire high-speed signal into a two-port signal according to claim 1, wherein the first port and the second port form a coplanar waveguide port and are connected to a coaxial cable.
6. The device for converting a parallel two-wire high-speed signal into a two-port signal according to claim 5, wherein the impedance of the first port and the second port are each 50Ω.
7. The device for converting parallel double lines of high-speed signals into double ports according to claim 1, wherein the thickness h of the double-sided copper-clad circuit board satisfies the formulaWherein lambda is min Epsilon for transmitting the wavelength corresponding to the highest frequency signal in the signals r Is the relative dielectric constant of the dielectric plate.
8. The device for converting a parallel two-wire high-speed signal into a two-port signal according to claim 1, wherein the width w of the first signal wire 1 And width w of second signal line 2 Satisfy the formulaWherein lambda is min Epsilon for transmitting the wavelength corresponding to the highest frequency signal in the signals r To be the instituteThe relative dielectric constant of the dielectric plate.
9. The device for converting parallel double lines of high-speed signals into double ports according to claim 1, wherein said plurality of conductive vias comprises a first set of conductive vias, a second set of conductive vias and a third set of conductive vias;
the first conductive via group is used for connecting the first ground and the fourth ground, and is arranged on the edge of the first ground, which is close to the first signal line;
the second conductive via group is used for connecting the second ground and the fourth ground, and is arranged on the edge of the second ground, which is close to the second signal line;
the third conductive via group is used for connecting the third ground and the fourth ground, and is arranged on the edge, close to the first signal line and the second signal line, of the third ground.
10. The conversion device for converting a high-speed signal into a dual port signal by parallel two wires according to claim 1, the method is characterized in that the diameters of the conductive vias are all a, and a is less than or equal to lambda min/20, wherein lambda is min For the wavelength corresponding to the highest frequency signal in the transmitted signal.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311779814.5A CN117767079A (en) | 2023-12-21 | 2023-12-21 | Conversion device for converting high-speed signal parallel double lines into double ports |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311779814.5A CN117767079A (en) | 2023-12-21 | 2023-12-21 | Conversion device for converting high-speed signal parallel double lines into double ports |
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| US20050090152A1 (en) * | 2003-10-22 | 2005-04-28 | Broomall James R. | Apparatus, system, and method for improved calibration and measurement of differential devices |
| US20120139656A1 (en) * | 2009-06-04 | 2012-06-07 | Henrie Justin J | Magnetic field system and method for mitigating passive intermodulation distortion |
| WO2021147040A1 (en) * | 2020-01-22 | 2021-07-29 | 华为技术有限公司 | Integrated circuit |
| CN113745787A (en) * | 2021-08-23 | 2021-12-03 | 格兰康希微电子系统(上海)有限公司 | Signal converter and microstrip line-waveguide signal conversion device |
| CN218770134U (en) * | 2022-10-10 | 2023-03-28 | 维沃移动通信有限公司 | Radio frequency device and electronic equipment |
| CN116209136A (en) * | 2021-11-30 | 2023-06-02 | 荣耀终端有限公司 | Signal transmission structure, electronic equipment and PCB |
-
2023
- 2023-12-21 CN CN202311779814.5A patent/CN117767079A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050090152A1 (en) * | 2003-10-22 | 2005-04-28 | Broomall James R. | Apparatus, system, and method for improved calibration and measurement of differential devices |
| US20120139656A1 (en) * | 2009-06-04 | 2012-06-07 | Henrie Justin J | Magnetic field system and method for mitigating passive intermodulation distortion |
| WO2021147040A1 (en) * | 2020-01-22 | 2021-07-29 | 华为技术有限公司 | Integrated circuit |
| CN113745787A (en) * | 2021-08-23 | 2021-12-03 | 格兰康希微电子系统(上海)有限公司 | Signal converter and microstrip line-waveguide signal conversion device |
| CN116209136A (en) * | 2021-11-30 | 2023-06-02 | 荣耀终端有限公司 | Signal transmission structure, electronic equipment and PCB |
| CN218770134U (en) * | 2022-10-10 | 2023-03-28 | 维沃移动通信有限公司 | Radio frequency device and electronic equipment |
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