CN117761936A - ODF process and application thereof - Google Patents
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- CN117761936A CN117761936A CN202311583878.8A CN202311583878A CN117761936A CN 117761936 A CN117761936 A CN 117761936A CN 202311583878 A CN202311583878 A CN 202311583878A CN 117761936 A CN117761936 A CN 117761936A
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- 238000000034 method Methods 0.000 title claims abstract description 59
- 239000003292 glue Substances 0.000 claims abstract description 88
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000001723 curing Methods 0.000 claims abstract description 14
- 238000001029 thermal curing Methods 0.000 claims abstract description 14
- 238000000016 photochemical curing Methods 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000007711 solidification Methods 0.000 claims abstract description 3
- 230000008023 solidification Effects 0.000 claims abstract description 3
- 230000035515 penetration Effects 0.000 claims description 30
- 238000013007 heat curing Methods 0.000 claims description 14
- 230000000052 comparative effect Effects 0.000 description 33
- 230000001070 adhesive effect Effects 0.000 description 28
- 239000000853 adhesive Substances 0.000 description 23
- 238000012360 testing method Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 238000004458 analytical method Methods 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 238000003848 UV Light-Curing Methods 0.000 description 4
- 239000012945 sealing adhesive Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009755 vacuum infusion Methods 0.000 description 1
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- Liquid Crystal (AREA)
Abstract
The invention relates to an ODF process and application thereof, wherein the ODF process comprises the following steps: coating frame glue on the edge of a CF substrate, and pre-baking; (2) dropping liquid crystal on the surface of the CF substrate; (3) Vacuum bonding is carried out on the TFT substrate and the CF substrate, and then solidification is carried out; in the step (1), the pre-baking temperature is 70-150 ℃, and the pre-baking time is 1-15 minutes; in the step (2), when the liquid crystal is dripped, the distance between the liquid crystal and the frame glue is 0.5-5mm; the curing includes sequentially performing photo-curing and thermal-curing. In the invention, the ODF process can effectively improve the liquid crystal puncture phenomenon of the frame glue, and is suitable for liquid crystal display products with various sizes.
Description
Technical Field
The present invention relates to the technical field of ODF process, and in particular, to an ODF process and an application thereof.
Background
Compared with the traditional vacuum pouring process, the liquid crystal dripping One Drop Forming (ODF) process has considerable advantages in terms of product quality and productivity. The ODF process has the most important advantages that liquid crystal does not need to be injected through an injection hole, so that the Cell forming process is simplified, and the process time is shortened; the traditional vacuum filling process has low liquid crystal utilization rate, the utilization rate is about 50% or less, the ODF process is not influenced by the size of the panel, and the utilization rate is up to 95% or more. In addition, the conventional vacuum infusion process requires immersing the Cell in the liquid crystal, and although there is a cleaning step after the infusion, the liquid crystal is easily remained on the external terminal, so that pollution is caused, and the terminal is even corroded after a long time of residual; the ODF process completely avoids the problem and improves the product quality.
CN109375409a discloses a liquid crystal display panel, a manufacturing method thereof and a display device, and relates to the technical field of display. The liquid crystal display panel comprises a first substrate and a second substrate which are oppositely arranged, and the method disclosed by the liquid crystal display panel comprises the following steps: forming a first substrate coated with an outer layer frame sealing adhesive and an inner layer frame sealing adhesive, wherein the outer layer frame sealing adhesive is positioned at the periphery of the inner layer frame sealing adhesive; and forming a second substrate on which liquid crystal is dropped by a drop-on-drop injection method; performing box forming process treatment on the first substrate and the second substrate to form a liquid crystal display panel; and after the outer layer frame sealing glue in the formed liquid crystal display panel is subjected to Ultraviolet (UV) pre-curing, the outer layer frame sealing glue and the inner layer frame sealing glue are subjected to heat curing at the same time.
Although the current ODF process is very well established, there are still some problems to be overcome, the most typical being the penetration of the gum. In the prior art, a method for improving the distance between the liquid crystal and the frame glue is utilized to improve the puncture of the frame glue, but the technology is very difficult to realize for small-size product models (the size is less than 0.1 inch).
Therefore, development of an ODF process capable of meeting various sizes of machines is urgently needed, and the phenomenon of liquid crystal penetration is fundamentally and effectively improved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide an ODF process and application thereof, wherein the ODF process can effectively improve the liquid crystal puncture phenomenon of the frame glue and is suitable for liquid crystal display products with various sizes.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an ODF process, the ODF process comprising the steps of:
(1) Coating frame glue on the edge of a CF substrate (carbon fiber substrate), and pre-baking;
(2) Dropping liquid crystal on the surface of the CF substrate;
(3) Vacuum bonding is carried out on a TFT substrate (thin film conductive liquid crystal substrate) and a CF substrate, and then solidification is carried out;
in the step (1), the pre-baking temperature is 70-150 ℃, such as 80 ℃, 90 ℃, 100 ℃, 110 ℃, 120 ℃, 130 ℃, 140 ℃ or the like, and the pre-baking time is 1-15 minutes, such as 2 minutes, 4 minutes, 6 minutes, 8 minutes, 10 minutes, 12 minutes, 14 minutes or the like;
in the step (2), when the liquid crystal is dropped, the distance between the liquid crystal and the frame glue is 0.5-5mm, for example, 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm or 4.5mm, etc.;
in the step (3), the curing includes sequentially performing photo-curing and thermal-curing.
In the prior art, after two substrates are attached, liquid crystal can slowly diffuse in a box, when the liquid crystal and the frame glue are contacted for a certain time, if the frame glue is not cured or is not cured fully during the contact, the corrosion of the liquid crystal to the frame glue can be caused, the liquid crystal can be polluted slightly, the holding voltage rate of the liquid crystal is reduced, peripheral Mura (the phenomenon that the brightness of a display is uneven and various marks are caused) and the like are generated, and the frame glue puncture product is scrapped.
In the invention, the ODF process is characterized in that the frame glue is pre-baked firstly, and the frame glue is subjected to chemical reaction under the action of pre-baking, so that the surface of the frame glue is pre-cured to a certain extent, the uncured frame glue is prevented from being dissolved into liquid crystal as far as possible after the liquid crystal is dripped, the liquid crystal penetration phenomenon of the frame glue can be effectively improved, and the ODF process is suitable for liquid crystal display products with various sizes.
In the invention, the pre-baking temperature is 70-150 ℃, and the frame glue can be effectively pre-cured within the temperature range; the temperature is higher, so that the frame glue is quickly solidified to influence the subsequent bonding process; the lower temperature can lead to the frame glue not being solidified, and the uncured frame glue can not be prevented from being dissolved into liquid crystal. The pre-baking time is 1-15 minutes, and the frame glue can be effectively pre-cured within the time range; the time is short, which can lead to uncured frame glue, and the uncured frame glue can not be prevented from being dissolved into liquid crystal; the frame glue is sufficiently cured due to the long time, so that the subsequent bonding process is affected. The distance between the liquid crystal and the frame glue is 0.5-5mm, so that the process requirement can be met in the range, and the liquid crystal puncture is ensured to meet the requirement; the distance between the two is higher, which can influence the display effect of the product; the lower distance between the two can lead to obvious penetration of liquid crystal. In the prior art, although there is a method for improving the penetration of the frame glue (shrinking the liquid crystal pattern) by increasing the distance between the liquid crystal and the frame glue, the technology is very difficult to realize for small-sized product models (the size is less than 0.1 inch), and the penetration cannot be improved by increasing the distance between the liquid crystal and the frame glue (the liquid crystal pattern cannot be shrunk). According to the invention, the frame glue is pre-baked firstly, so that the frame glue is subjected to chemical reaction, and pre-curing is performed to a certain extent on the surface of the frame glue, so that the frame glue is prevented from contacting with uncured frame glue as much as possible after liquid crystal is dripped, the frame glue is prevented from being dissolved into the liquid crystal, and the problem that the size of a small-size product model is small enough and puncture cannot be improved by increasing the distance between the liquid crystal and the frame glue can be solved.
In the present invention, the reason why the curing includes sequentially performing photo-curing and thermal curing is that: firstly, photo-curing is carried out to enable the frame glue to be rapidly pre-cured and molded, so that liquid crystal puncture caused by long-time contact between uncured frame glue and liquid crystal is avoided, and then heat curing is carried out to enable the frame glue to be completely cured; only photo-curing is carried out, and part of the frame glue can be shielded due to the metal wiring of the Array substrate, so that part of the frame glue can not be cured; with thermal curing alone, the uncured frame glue is easily dissolved in the liquid crystal during this period of time, resulting in liquid crystal penetration, due to the long thermal curing time (typically greater than 30 minutes).
Preferably, the power of the photo-curing is 80-180mW/cm 2 (e.g. 90mW/cm 2 、100mW/cm 2 、110mW/cm 2 、120mW/cm 2 、130mW/cm 2 、140mW/cm 2 、150mW/cm 2 、160mW/cm 2 Or 170mW/cm 2 Etc.).
Preferably, the energy of the photo-curing is 2000-8000mJ/cm 2 For example 3000mJ/cm 2 、4000mJ/cm 2 、5000mJ/cm 2 、6000mJ/cm 2 Or 7000mJ/cm 2 Etc.
In the present invention, the reason why the energy of the photo-curing is in a preferable range is that: in the energy range, the UV curing of the frame glue can be fully performed; the lower energy can lead to insufficient curing degree of the photo-curing part of the frame glue, so that incomplete curing or prolonged heat curing time can be caused, and the puncture distance/glue width value is increased; the energy is high, and although the curing effect of the frame glue is not affected, the energy consumption and the production efficiency are affected by the high energy.
Preferably, the temperature of the thermal curing is 80-150 ℃, e.g., 90 ℃, 100 ℃, 110 ℃, 120 ℃, 130 ℃, 140 ℃, etc.
In the present invention, the reason why the temperature of the heat curing is in a preferable range is that: in the temperature range, the heat curing of the frame glue can be fully performed; the temperature is lower, so that the frame glue is not completely cured or the heat curing time is prolonged, and the puncture distance/glue width value is increased; the temperature is higher, and although the curing effect of the frame glue is not affected, the energy consumption and the production efficiency are affected by the too high energy.
Preferably, the time for the thermal curing is 30 to 150 minutes, for example 40 minutes, 50 minutes, 60 minutes, 80 minutes, 100 minutes, 120 minutes, 140 minutes, etc.
In the present invention, the reason why the time of the heat curing is in a preferable range is that: in the temperature range, the heat curing of the frame glue can be fully performed; the shorter time can lead to incomplete curing or prolonged thermal curing time of the frame glue, and the increased value of penetration distance/glue width.
In a second aspect, the present invention provides an application of the ODF process of the first aspect in improving liquid crystal penetration.
Compared with the prior art, the invention has the following beneficial effects:
(1) In the invention, the ODF process can effectively improve the liquid crystal puncture phenomenon of the frame glue, and is suitable for liquid crystal display products with various sizes.
(2) In the invention, the penetration distance of the ODF formed by the ODF process is between 10 and 47 mu m, and the penetration distance/glue width value is between 1.0 and 7.83 percent, thereby effectively improving the liquid crystal penetration phenomenon; the adhesive force of the adhesive test piece obtained by the ODF process on one side of the ITO film is more than 4.2MPa, and the adhesive force on one side of the polyimide film is more than 4.1 MPa. Preferably (taking examples 1-12 as an example), the ODF process forms ODFs with a penetration distance of between 10 and 31 μm and a penetration distance/glue width of between 1.0 and 5.17%; the adhesive force of the adhesive test piece obtained by the ODF process on one side of the ITO film is more than 4.7MPa, and the adhesive force on one side of the PI film is more than 4.7 MPa.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
In each embodiment of the present invention, the purchase information of a part of raw materials is as follows:
frame glue: purchased from ponding chemistry under the brand S-WB101.
Liquid crystal: purchased from Jiegen liquid crystal materials Co., ltd, under the trade designation ZAU-7220XX.
Example 1
The embodiment provides an ODF process, in which the Cell size after the box forming is 0.09 inches, comprising the steps of:
(1) Coating frame glue (purchased from ponding chemistry and with the mark of S-WB 101) on the edge of the CF substrate, wherein the width of the frame glue is 600 mu m, and pre-baking for 5 minutes at 70 ℃;
(2) The liquid crystal is dripped, wherein the distance between the liquid crystal and the frame glue is 0.5mm;
(3) Vacuum bonding is carried out on the TFT substrate and the CF substrate;
(4) UV light curing with power of 120mW/cm 2 Total energy of 3000mJ/cm 2 And finally, performing heat curing, wherein the curing temperature is 120 ℃, the curing time is 60 minutes, and the ODF process is completed.
Examples 2 to 4
Examples 2-4 differ from example 1 in that: the temperature and time of the pre-baking are different. The pre-bake temperatures and times for examples 2-4 were 80℃/4min (example 2), 100℃/3min (example 3), 120℃/2min (example 4) in this order, the remainder being the same as in example 1.
Examples 5 to 7
Examples 5-7 differ from example 1 in that: the energy of UV light curing was different, and the UV curing energy of examples 5-7 was 2000mJ/cm in order 2 (example 5), 5000mJ/cm 2 (example 6), 7000mJ/cm 2 (example 7) the remainder were the same as in example 1.
Examples 8 to 10
Examples 8-10 differ from example 1 in that: the temperature and time of thermal curing are different, and the thermal curing temperatures and times in examples 8-10 are in order: 90 ℃/100min (example 8), 100 ℃/80min (example 9), 110 ℃/70min (example 10), the remainder being the same as example 1.
Examples 11 to 12
Examples 11-12 differ from example 1 in that: cell size is different after the box, and frame glue are different with the distance of liquid crystal, and specifically as follows:
example 11: the Cell size was 5.2 inches, the width of the frame glue was 800 μm, the distance between the frame glue and the liquid crystal was 1mm, and the rest was the same as in example 1;
the Cell size of example 12 was 17.3 inches, the width of the frame gel was 1000 μm, the distance between the frame gel and the liquid crystal was 2mm, and the rest was the same as in example 1.
Example 13
Example 13 differs from example 1 in that: the heat curing temperature was different, and the heat curing temperature in example 13 was: 75℃and the rest is the same as in example 1.
Example 14
Example 14 differs from example 1 in that: the time for thermal curing was varied and the time for thermal curing in example 14 was: 25min, the remainder being the same as in example 1.
Comparative example 1
This comparative example differs from example 1 in that no preliminary baking was performed, and the rest was the same as example 1.
Comparative example 2
This comparative example 2 was different from example 11 in that no preliminary baking was performed, and the rest was the same as example 11.
Comparative example 3
This comparative example 3 was different from example 12 in that no preliminary baking was performed, and the rest was the same as example 12.
Comparative examples 4 to 5
Comparative examples 4 to 5 differ from example 1 in that: the time of the preliminary drying was varied, and the time of the preliminary drying in the step (1) was 20 minutes (comparative example 4), 30 seconds (comparative example 5) in this order, and the rest was the same as in the example 1.
Comparative examples 6 to 7
Comparative examples 6 to 7 differ from example 1 in that: the pre-baking temperatures in step (1) were 160 ℃ (comparative example 6) and 60 ℃ (comparative example 7) in this order, and the rest was the same as in example 1.
Comparative example 8
The comparative example was different from example 1 in that the distance between the liquid crystal and the frame glue was adjusted to 0.3mm when the liquid crystal was dropped, and the rest was the same as example 1.
Performance testing
ODFs obtained from the ODF process described in examples 1-14 and comparative examples 1-8 were tested as follows:
(1) Liquid crystal puncture: all cells formed by ODF boxes are inspected by using a portable microscope, the liquid crystal puncture distance is counted, the inspection position of each Cell is fixed, and if the frame glue puncture distance is larger than/the glue width is larger than 20%, the sample inspection is judged to be bad (NG), otherwise, the sample inspection is judged to be qualified (OK). The frame glue penetration test apparatus uses a portable microscope (model: AM 4113T).
(2) Adhesion: the frame glue is dripped on two glass sheets with 30 multiplied by 40mm and attached with ITO film and Polyimide (PI) film respectively in tiny liquid dropsOne glass was pre-baked in the process steps of examples and comparative examples, and the other glass test piece was bonded directly in a cross without the pre-baking step, and was completely bonded by pressing. Subsequently, according to the curing conditions in examples and comparative examples, metal halide ultraviolet lamp irradiation was first performed, and thermosetting was further performed, to obtain an adhesive test piece, which was subjected to a tensile test (2 mm/sec) with a jig prepared up and down. Dividing the measured value (N) by the seal coating cross-sectional area (mm) 2 ) The obtained value is the adhesion of the adhesive. The adhesive force is more than 4.0MP, and the adhesive force is judged to be qualified (OK), otherwise, the adhesive force is bad (NG). The adhesion testing device uses a universal tester.
The test results are summarized in table 1.
TABLE 1
As can be seen from the data in Table 1, the ODF formed by the ODF process of the invention has a penetration distance of 10-47 μm and a penetration distance/adhesive width value of 1.0-7.83%; the adhesive force of the adhesive test piece obtained by the ODF process on one side of the ITO film is more than 4.2MPa, and the adhesive force on one side of the PI film is more than 4.1 MPa; the ODF process provided by the invention can effectively improve the liquid crystal puncture phenomenon of the frame glue, and is suitable for liquid crystal display products with various sizes.
In a preferred range (examples 1-12 are taken as examples), the penetration distance of the ODF formed by the ODF process of the invention is between 10 and 31 mu m, and the penetration distance/glue width value is between 1.0 and 5.17 percent; the adhesive force of the adhesive test piece obtained by the ODF process on one side of the ITO film is more than 4.7MPa, and the adhesive force on one side of the PI film is more than 4.7 MPa; the ODF process provided by the invention can effectively improve the liquid crystal puncture phenomenon of the frame glue, and is suitable for liquid crystal display products with various sizes.
As can be seen from the analysis of example 13 and example 1, the performance of example 13 is inferior to that of example 1, and the heat curing temperature is within the preferable range, which is more favorable for improving the liquid crystal penetration phenomenon of the frame glue, and the adhesive performance is not affected.
As can be seen from the analysis of example 14 and example 1, the performance of example 14 is inferior to that of example 1, and the heat curing time is within the preferable range, which is more favorable for improving the liquid crystal penetration phenomenon of the frame glue, and the adhesive performance is not affected.
Analysis of comparative example 1 and example 1 shows that comparative example 1 does not perform as well as example 1, increasing penetration distance/gel width by 22.3%; analysis of comparative example 2 and example 11 shows that comparative example 2 does not perform as well as example 11, increasing penetration distance/gel width by 22.7%; as can be seen from the analysis of comparative example 3 and example 12, the performance of comparative example 3 is not as good as that of example 12, the puncture distance/glue width is increased by 21%, and it is proved that the pre-baking after the coating of the edge-frame glue can improve the liquid crystal puncture phenomenon of the edge-frame glue, and the ODF process for pre-baking can improve the liquid crystal puncture phenomenon of the edge-frame glue, so that the adhesive is applicable to liquid crystal display products with various sizes.
As can be seen from the analysis of comparative examples 4 to 5 and example 1, if the pre-baking time is too long (comparative example 4), the adhesive property is reduced, and if the pre-baking time is too short (comparative example 5), the penetration distance/adhesive width is increased, which proves that the ODF process with the pre-baking time within a specific range can simultaneously improve the liquid crystal penetration phenomenon of the frame glue and maintain higher adhesive property.
As can be seen from the analysis of comparative examples 6 to 7 and example 1, if the pre-baking temperature is too high (comparative example 6), the adhesive property is lowered, and if the pre-baking temperature is too low (comparative example 7), the penetration distance/adhesive width is increased, which proves that the ODF process with the pre-baking temperature within a specific range can simultaneously improve the liquid crystal penetration phenomenon of the frame glue and maintain the higher adhesive property.
As can be seen from the analysis of comparative example 8 and example 1, if the distance between the liquid crystal and the frame glue is too short (comparative example 8), the penetration distance/glue width increases, which proves that the ODF process in which the distance between the liquid crystal and the frame glue is within a specific range can simultaneously improve the liquid crystal penetration phenomenon of the frame glue and maintain higher adhesive property.
The present invention is described in detail by the above examples, but the present invention is not limited to the above detailed methods, i.e., it does not mean that the present invention must be practiced depending on the above detailed methods. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of raw materials for the product of the present invention, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present invention and the scope of disclosure.
Claims (6)
1. An ODF process, comprising the steps of:
(1) Coating frame glue on the edge of the CF substrate, and pre-baking;
(2) Dropping liquid crystal on the surface of the CF substrate;
(3) Vacuum bonding is carried out on the TFT substrate and the CF substrate, and then solidification is carried out;
in the step (1), the pre-baking temperature is 70-150 ℃, and the pre-baking time is 1-15 minutes;
in the step (2), when the liquid crystal is dripped, the distance between the liquid crystal and the frame glue is 0.5-5mm;
in the step (3), the curing includes sequentially performing photo-curing and thermal-curing.
2. The ODF process of claim 1 wherein the photo-curing power is 80-180mW/cm 2 。
3. The ODF process of claim 1 wherein the energy of the photo-curing is 2000-8000mJ/cm 2 。
4. The ODF process of claim 1 wherein the heat curing temperature is 80-150 ℃.
5. The ODF process of claim 1 wherein the thermal curing time is 30-150 minutes.
6. Use of an ODF process according to any one of claims 1-5 for improving liquid crystal penetration.
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| CN202311583878.8A CN117761936A (en) | 2023-11-24 | 2023-11-24 | ODF process and application thereof |
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| CN202311583878.8A CN117761936A (en) | 2023-11-24 | 2023-11-24 | ODF process and application thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1506735A (en) * | 2002-12-04 | 2004-06-23 | ���ǵ�����ʽ���� | Method for producing liquid crystal display |
| TW200919043A (en) * | 2007-10-24 | 2009-05-01 | Au Optronics Corp | Method for manufacturing liquid crystal display |
| JP2009168972A (en) * | 2008-01-15 | 2009-07-30 | Epson Imaging Devices Corp | Method of manufacturing liquid crystal display panel |
| CN104756003A (en) * | 2012-08-27 | 2015-07-01 | 日本化药株式会社 | Sealing agent for liquid crystal, and liquid-crystal display cell obtained using same |
| CN106405946A (en) * | 2016-11-29 | 2017-02-15 | 深圳市华星光电技术有限公司 | Sealant curing method and liquid crystal panel manufacturing method |
| CN116047817A (en) * | 2023-01-17 | 2023-05-02 | 惠科股份有限公司 | Display device manufacturing method and display device |
-
2023
- 2023-11-24 CN CN202311583878.8A patent/CN117761936A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1506735A (en) * | 2002-12-04 | 2004-06-23 | ���ǵ�����ʽ���� | Method for producing liquid crystal display |
| TW200919043A (en) * | 2007-10-24 | 2009-05-01 | Au Optronics Corp | Method for manufacturing liquid crystal display |
| JP2009168972A (en) * | 2008-01-15 | 2009-07-30 | Epson Imaging Devices Corp | Method of manufacturing liquid crystal display panel |
| CN104756003A (en) * | 2012-08-27 | 2015-07-01 | 日本化药株式会社 | Sealing agent for liquid crystal, and liquid-crystal display cell obtained using same |
| CN106405946A (en) * | 2016-11-29 | 2017-02-15 | 深圳市华星光电技术有限公司 | Sealant curing method and liquid crystal panel manufacturing method |
| CN116047817A (en) * | 2023-01-17 | 2023-05-02 | 惠科股份有限公司 | Display device manufacturing method and display device |
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