CN117758346A

CN117758346A - Solar cell electroplating device

Info

Publication number: CN117758346A
Application number: CN202211353351.1A
Authority: CN
Inventors: 李�杰; 李国洪; 凡银生; 程军; 薛朝伟
Original assignee: Longi Green Energy Technology Co Ltd
Current assignee: Longi Green Energy Technology Co Ltd
Priority date: 2022-09-26
Filing date: 2022-09-26
Publication date: 2024-03-26
Also published as: CN117802559A

Abstract

The application discloses a solar cell electroplating device, which relates to the technical field of photovoltaic power generation, and comprises an electroplating bath, at least one cathode conductive unit and an anode with at least one through hole; the anode is attached to the inner wall of the electroplating bath, which is provided with at least one through hole, and the through hole of the anode corresponds to the through hole on the inner wall of the electroplating bath; the cathode conductive unit passes through the through hole of the anode and the through hole on the inner wall of the electroplating bath; during electroplating, the distance between the anode and the solar cell is 1-10 mm along the thickness direction of the solar cell.

Description

Solar cell electroplating device

Cross Reference to Related Applications

The present application claims that the chinese patent office, application number 2022111793228, entitled "a solar cell plating apparatus and solar cell plating method" was filed on day 26, 9, 2022, and the entire contents of which are incorporated herein by reference.

Technical Field

The application belongs to the technical field of photovoltaic power generation, and particularly relates to a solar cell electroplating device.

Background

At present, an electroplating technology is widely and widely studied as a novel preparation method of a grid line electrode of a solar cell. As a promising grid line electrode preparation method, the electroplating technology can greatly reduce the cost in the solar cell production process, and compared with the grid line electrode prepared by the traditional screen printing technology, the grid line electrode prepared by the electroplating technology has higher aspect ratio, better conductivity and lower internal resistance of the cell, can reduce shading loss, and further can effectively improve the photoelectric conversion efficiency of the solar cell.

When the grid line electrode of the solar cell is prepared through an electroplating process, the solar cell is usually fixed by using a hanger, and the hanger and the solar cell are integrally placed in an electroplating bath, and the electroplating bath with a larger volume is required to be matched with the hanger due to larger space occupied by the hanger.

When the electroplating bath circulates through the liquid inlet and the liquid outlet, the circulation rate of the electroplating liquid in the electroplating bath can be greatly reduced due to the large volume of the electroplating bath under the condition that the volume of the electroplating liquid is unchanged in unit time, so that the electroplating rate is reduced, and the production efficiency of the solar cell is affected.

Disclosure of Invention

The application provides a solar wafer electroplating device to solve among the current electroplating device, because plating bath volume is great, the plating solution circulation rate in the plating bath can greatly reduced, leads to electroplating rate decline, the problem that the productivity reduces.

In order to solve the technical problems, the application is realized as follows:

the embodiment of the application provides a solar cell electroplating device, which comprises: plating bath, at least one cathode conductive unit, and an anode having at least one through hole;

the anode is attached to the inner wall of the electroplating bath, which is provided with at least one through hole, and the through hole of the anode corresponds to the through hole on the inner wall of the electroplating bath; the cathode conductive unit passes through the through hole of the anode and the through hole on the inner wall of the electroplating bath;

during electroplating, the distance between the anode and the solar cell is 1-10 mm along the thickness direction of the solar cell.

Optionally, the electroplating device includes a first conductive component, a second conductive component, the cathode conductive unit has more than one first conductive unit and more than one second conductive unit, and the first conductive unit is formed on the first conductive component, and the second conductive unit is formed on the second conductive component.

Optionally, the first conductive component comprises a plurality of first conductive units, the second conductive component comprises a plurality of second conductive units, and the first conductive units and the second conductive units are respectively used for being electrically connected with grid line feeding points on the surface of the solar cell;

the first conductive units and the second conductive units are distributed in an array.

Optionally, the plating tank includes: a plating bath body and a cover plate;

when the plating tank body and the cover plate are positioned at a first relative position, a gap for loading and unloading the solar cell is formed between the plating tank body and the cover plate;

when the plating tank body and the cover plate are positioned at the second relative position, the plating tank body and the cover plate are buckled into the plating tank.

Optionally, a sealing member is arranged between the plating tank body and the cover plate.

Optionally, the plating tank body is provided with first location portion, the apron is provided with second location portion, first location portion with second location portion location cooperation.

Optionally, one of the plating tank body and the cover plate is provided with a guide rod, and the other of the plating tank body and the cover plate is provided with a guide hole;

The guide rod penetrates through the guide hole and is in sliding connection with the guide hole.

Optionally, the cover plate is provided with a plurality of first through holes;

the first conductive component and the second conductive component extend into the plating bath through the first through hole.

Optionally, the anode is arranged at one side of the cover plate close to the plating bath body;

the anode is provided with a plurality of second through holes, and the first conductive component and the second conductive component extend into the electroplating bath through the first through holes and the second through holes.

Optionally, the solar cell electroplating device further includes: a first driving mechanism;

the first driving mechanism is connected with at least one of the plating tank body and the cover plate to drive the plating tank body and the cover plate to switch between the first relative position and the second relative position.

Optionally, the plating tank is provided with a liquid inlet and a liquid outlet;

the minimum sectional area of the liquid inlet is not less than twice of the minimum sectional area of the inner cavity of the electroplating bath in the direction perpendicular to the flowing direction of the electroplating liquid.

Optionally, at least part of the outer surface of the first conductive element and/or at least part of the outer surface of the second conductive element is provided with an isolating insulation layer.

In an embodiment of the application, the solar cell electroplating device comprises an electroplating bath, at least one cathode conductive unit and an anode with at least one through hole; the anode is attached to the inner wall of the electroplating bath, which is provided with at least one through hole, and the through hole of the anode corresponds to the through hole on the inner wall of the electroplating bath; the cathode conductive unit passes through the through hole of the anode and the through hole on the inner wall of the electroplating bath; during electroplating, the distance between the anode and the solar cell is 1-10 mm along the thickness direction of the solar cell. The cathode conductive unit only needs to pass through the through hole of the anode and the through hole on the inner wall of the electroplating bath, and the conductive part of the cathode conductive unit stretches into the electroplating bath, so that the conduction of an electroplating loop between the anode and the cathode conductive unit can be realized, and the space inside the electroplating bath is saved. When the electroplating bath circulates the electroplating solution through the liquid inlet and the liquid outlet, under the condition that the volume of the electroplating solution is unchanged in unit time, the flow rate of the electroplating solution can be greatly accelerated when the electroplating solution flows into the inner cavity of the electroplating bath from the liquid inlet due to the small volume of the inner cavity of the electroplating bath, so that the flow rate of the surface of the solar cell is also accelerated, the current density of the surface of the solar cell can be increased, and the electroplating rate is further improved.

Drawings

Fig. 1 is a schematic structural diagram of a solar cell electroplating apparatus according to an embodiment of the present application;

FIG. 2 is a schematic view of the structure along the direction a in FIG. 1 according to the embodiment of the present application;

FIG. 3 is a schematic view of the structure along direction b in FIG. 1 according to an embodiment of the present application;

FIG. 4 is a schematic view of the structure along direction c in FIG. 1 according to an embodiment of the present application;

FIG. 5 is a schematic view showing a top structure of a solar cell electroplating apparatus according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of the structure along the direction d in FIG. 5 according to the embodiment of the present application;

FIG. 7 is a schematic view of the structure along direction e in FIG. 5 according to an embodiment of the present application;

FIG. 8 is a schematic view of the structure along the direction f in FIG. 5 according to the embodiment of the present application;

FIG. 9 is a schematic view showing a lower structure of a solar cell electroplating apparatus according to an embodiment of the present disclosure;

fig. 10 is a schematic view of the structure along the g direction in fig. 9 according to the embodiment of the present application;

fig. 11 is a schematic structural view along the h direction in fig. 9 according to the embodiment of the present application;

fig. 12 is a schematic view of the structure along the i direction in fig. 9 according to the embodiment of the present application;

FIG. 13 is a schematic view of an anode structure according to an embodiment of the present application;

fig. 14 is a schematic structural view of a solar cell according to an embodiment of the present disclosure;

fig. 15 is a flowchart of a solar cell electroplating method according to an embodiment of the present application.

Reference numerals illustrate:

10-electroplating bath; 101-a plating tank body; 102-cover plate; 103-a seal; 104-a first positioning portion; 105-a guide bar; 106-a guide hole; 107-liquid inlet; 108-a liquid outlet; 20-a first conductive component; 201-a first conductive element; 30-a second conductive component; 301-a second conductive element; 40-an electroplating power supply control module; 50-anode; 501-a second through hole; 60-solar cell pieces; 601-a gate line feed point; 70-deplating the cathode; 80-a first drive mechanism; 90-a second drive mechanism; 100-third drive mechanism.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

The solar cell electroplating device provided by the embodiment of the application is described in detail below by means of specific embodiments and application scenes thereof with reference to the accompanying drawings.

Referring to fig. 1 to 14, an embodiment of the present application further provides a solar cell electroplating apparatus, including: plating cell 10, at least one cathodic conductive unit, and an anode having at least one through-hole; the anode is attached to the inner wall of the electroplating tank 10 with at least one through hole, and the through hole of the anode corresponds to the through hole on the inner wall of the electroplating tank 10; the cathode conductive unit passes through the through hole of the anode and the through hole on the inner wall of the electroplating bath 10; in the thickness direction of the solar cell 60 at the time of electroplating, the distance between the anode 50 and the solar cell 60 is 1mm to 10mm.

Specifically, as shown in fig. 1 to 14, in the electroplating process, the negative electrode of the electroplating power supply is conducted with the cathode conductive unit, and the positive electrode of the anode plate is conducted with the positive electrode of the electroplating power supply. The cathode conductive unit only needs to pass through the through hole of the anode plate and the through hole on the inner wall of the electroplating bath 10, and the conductive part of the cathode conductive unit stretches into the electroplating bath 10, so that the conduction of an electroplating loop between the anode plate and the cathode conductive unit can be realized. When the electroplating bath 10 circulates the electroplating solution through the liquid inlet and the liquid outlet, under the condition that the volume of the electroplating solution passing through the electroplating bath in unit time is unchanged, because the volume of the inner cavity of the electroplating bath 10 is smaller, when the electroplating solution flows into the inner cavity of the electroplating bath 10 from the liquid inlet, the flow speed of the electroplating solution can be greatly accelerated, so that the flow speed of the surface of the solar cell 60 is also accelerated, the current density of the surface of the solar cell 60 can be increased, and the electroplating speed is further improved.

The anode 50 is disposed below the cover plate 102, and after the cover plate 102 is buckled with the plating tank body, the solar cell 60 is located in an inner cavity formed by the cover plate 102 and the plating tank body. Along the thickness direction of the solar cell 60, the distance between the anode 50 and the solar cell 60 is 1mm-10mm, the distance is small, the distance for the cation plating movement is short, and the current density can be increased, so that the plating rate is greatly improved.

Alternatively, referring to fig. 1 to 6, the plating apparatus includes a first conductive member 20, a second conductive member 30, the cathode conductive unit has one or more first conductive units 201 and one or more second conductive units 301, and the first conductive units 201 are formed on the first conductive member 20, and the second conductive units 301 are formed on the second conductive member 30.

Specifically, as shown in fig. 1 to 6, at least one first conductive unit 201 is disposed on the first conductive member 20, and at least one second conductive unit 301 is disposed on the second conductive member 30. The specific number of the first conductive units 201 and the second conductive units 301 may be selected according to the number of the grid line feeding points 601 on the surface of the solar cell 60.

Alternatively, referring to fig. 5 to 8 and 14, the first conductive assembly 20 includes a plurality of first conductive units 201, the second conductive assembly 30 includes a plurality of second conductive units 301, and the first conductive units 201 and the second conductive units 301 are respectively electrically connected to a grid line feeding point 601 on the surface of the solar cell 60; the plurality of first conductive elements 201 and the plurality of second conductive elements 301 are distributed in an array.

Specifically, as shown in fig. 5 to 8, 14, in the embodiment of the present application, the solar cell 60 may be a heterojunction cell having an intrinsic amorphous layer (Hetero-junctionwith Intrinsic Thin-layer, HJT), a TOPCon (Tunnel Oxide Passivating Contacts) cell, or the like. The solar cell 60 has a grid pattern and a grid feeding point 601 on a surface thereof, and the plurality of first conductive units 201 of the first conductive assembly 20 and the plurality of second conductive units 301 of the second conductive assembly 30 are respectively used for electrically connecting with the grid feeding point 601. The distribution manner of the grid line feeding points 601 of the solar cell 60 is matched with the arrangement manner of the first conductive units 201 and the second conductive units 301. The non-gate line region of the solar cell 60 is covered with an insulating layer (or referred to as a plating mask), and during the plating process, the region covered with the insulating layer is not in direct contact with the plating solution, and the plating solution is in contact with only the region to be plated with the gate line.

The plurality of first conductive units 201 may be disposed on the same base, and the base is made of a conductive material and is electrically connected to the plating power control module 40, and the plating power control module 40 energizes the base to transfer current to the plurality of first conductive units 201. The first conductive unit 201 may be a spring probe, a conductive fiber bundle, or the like.

The plurality of second conductive units 301 may be disposed on the same base, and the base is made of a conductive material and is electrically connected to the plating power control module 40, and the plating power control module 40 energizes the base to transfer the current to the plurality of second conductive units 301. The second conductive unit 301 may also be a spring probe, a conductive fiber bundle, or the like.

The plurality of first conductive units 201 and the plurality of second conductive units 301 are distributed in an array, and a plurality of conductive contact points are formed on the surface of the solar cell 60, thereby improving the electroplating efficiency and quality.

Alternatively, referring to fig. 1 to 4, the plating tank 10 includes: a plating tank body 101 and a cover plate 102; when the plating tank body 101 and the cover plate 102 are positioned at the first relative position, a gap for loading and unloading the solar cell 60 is arranged between the plating tank body 101 and the cover plate 102; when the plating vessel body 101 and the cover plate 102 are in the second relative position, the plating vessel body 101 and the cover plate 102 are engaged to form the plating vessel 10.

Specifically, as shown in fig. 1 to 4, the plating tank 10 adopts a split structure, including a plating tank body 101 and a cover plate 102, where the plating tank body 101 and the cover plate 102 are buckled to form a complete plating tank 10, so as to ensure tightness in the plating process. The plating tank body 101 and the cover plate 102 have a first relative position and a second relative position. When the plating tank body 101 and the cover plate 102 are in the first relative position, a gap for mounting and dismounting the solar cell 60 is formed between the plating tank body 101 and the cover plate 102, so that the solar cell 60 can be mounted and dismounted conveniently. When the plating vessel body 101 and the cover plate 102 are in the second relative position, the plating vessel body 101 and the cover plate 102 are engaged to form the plating vessel 10. By utilizing the switching between the first relative position and the second relative position of the plating tank body 101 and the cover plate 102, the rapid switching between the loading and unloading scene and the electroplating scene of the solar cell 60 can be realized, and the production efficiency is improved.

Alternatively, as shown with reference to fig. 9 to 12, a seal 103 is provided between the plating tank body 101 and the cover plate 102.

Specifically, as shown in fig. 9 to 12, the tightness of the inner cavity of the plating vessel 10 is ensured after the plating vessel body 101 and the cover plate 102 are engaged. A sealing member 103 is provided between the plating tank body 101 and the cover plate 102, and the sealing member 103 may be provided on the plating tank body 101 or the cover plate 102 alone, or the sealing member 103 may be provided on both the plating tank body 101 and the cover plate 102. The material of the sealing member 103 may be flexible material such as rubber or silica gel.

Alternatively, referring to fig. 9 to 12, the plating tank body 101 is provided with a first positioning portion 104, and the cover plate 102 is provided with a second positioning portion, the first positioning portion 104 and the second positioning portion being in positioning engagement.

Specifically, as shown in fig. 9 to 12, in order to ensure alignment accuracy when the plating tank body 101 and the cover plate 102 are engaged, the plating tank body 101 is provided with a first positioning portion 104, and the cover plate 102 is provided with a second positioning portion. The first positioning portion 104 may be a positioning slot, and correspondingly, the second positioning portion may be a positioning shaft; likewise, the first positioning portion 104 may be a positioning shaft, and correspondingly, the second positioning portion may be a positioning slot. The first positioning portion 104 and the second positioning portion may be disposed at edges of the plating tank body 101 and the cover plate 102, so as to avoid encroaching on the inner cavity space of the plating tank 10.

Alternatively, referring to fig. 1 to 4, one of the plating tank body 101 and the cover plate 102 is provided with a guide bar 105, and the other of the plating tank body 101 and the cover plate 102 is provided with a guide hole 106;

specifically, as shown in fig. 1 to 4, a guide bar 105 may be provided on the plating tank body 101, a guide hole 106 may be provided on the cover plate 102, the number of guide bars 105 and guide holes 106 may be the same, and the number of guide bars 105 and guide holes 106 may be selected according to the size of the plating tank 10. For example, with a square plating vessel 10, four sets of guide rods 105 and guide holes 106 may be provided at four corners of the plating vessel 10. Of course, the plating tank body 101 may be provided with a guide hole 106, and the cover plate 102 may be provided with a guide bar 105. The guide rod 105 penetrates through the guide hole 106 and is in sliding connection with the guide hole 106. When the plating tank body 101 and the cover plate 102 relatively move, the plating tank body 101 and the cover plate 102 can be limited by utilizing the cooperation of the guide rods 105 and the guide holes 106, and the alignment precision of the plating tank body 101 and the cover plate 102 is improved.

Optionally, the cover plate 102 is provided with a plurality of first through holes; the first conductive member 20 and the second conductive member 30 extend into the plating tank 10 through the first through hole.

Specifically, the first conductive component 20 and the second conductive component 30 may be directly disposed inside the plating tank 10, or may be partially disposed inside the plating tank 10, with the remainder being located outside the plating tank 10.

In the embodiment of the present application, the first conductive component 20 and the second conductive component 30 are controlled by an external driving mechanism, and a plurality of first through holes are disposed on the cover plate 102, and the first conductive component 20 and the second conductive component 30 extend into the plating tank 10 through the first through holes. The number of first vias matches the number of conductive elements on the first conductive assembly 20 and the second conductive assembly 30.

Through set up first through-hole so that first conductive component 20 and second conductive component 30 pass through on apron 102, compare in the scheme of directly setting up first conductive component 20 and second conductive component 30 in plating bath 10 inside, the preparation degree of difficulty and cost are all lower. To avoid leakage of plating solution, the aperture of the first via may be matched to the outer diameter of the conductive element, reducing the gap between the first via and the conductive element.

Alternatively, referring to fig. 13, the anode 50 is disposed at one side of the cover plate 102 near the plating tank body 101; the anode 50 is provided with a plurality of second through holes 501, and the first conductive member 20 and the second conductive member 30 extend into the plating tank 10 through the first through holes and the second through holes 501.

Specifically, as shown in fig. 13, the anode 50 may be a soluble anode or an insoluble anode. In the embodiment of the present application, the anode 50 is an insoluble anode, the anode 50 is disposed on one side of the cover plate 102 close to the plating tank body 101, and a plurality of second through holes 501 are disposed on the anode 50. The number of second vias 501 matches the number of conductive elements on the first conductive assembly 20 and the second conductive assembly 30. The first conductive component 20 and the second conductive component 30 extend into the plating tank 10 through the first through hole and the second through hole 501. In the electroplating process, the conductive elements on the first conductive component 20 or the second conductive component 30 are partially penetrated in the second through holes 501, so that the current distribution between the anode 50 and the conductive elements is more uniform, and the uniformity of the electroplated grid line electrode is improved.

Optionally, referring to fig. 1 to 4, the solar cell electroplating apparatus further includes: a first drive mechanism 80; the first driving mechanism 80 is connected with at least one of the plating tank body 101 and the cover plate 102 to drive the plating tank body 101 and the cover plate 102 to switch between the first relative position and the second relative position.

Specifically, as shown in fig. 1 to 4, the manner of switching between the first relative position and the second relative position of the plating tank body 101 and the cover plate 102 may be manually, or the movement of the plating tank body 101 or the cover plate 102 may be controlled by the first driving mechanism 80. The first driving mechanism 80 may be a combination of a motor and a screw, or a combination of a cylinder and a link. When the first driving mechanism 80 is provided, the first driving mechanism 80 may be connected to at least one of the plating tank body 101 and the cover plate 102 to drive the plating tank body 101 and the cover plate 102 to switch between the first relative position and the second relative position. By arranging the first driving mechanism 80, the automation degree of the solar cell electroplating device can be improved, and the production efficiency is further improved.

Alternatively, referring to fig. 1, 2, 9, and 11, the plating tank 10 is provided with a liquid inlet 107 and a liquid outlet 108; the minimum cross-sectional area of the inlet 107 is not less than twice the minimum cross-sectional area of the interior chamber of the plating vessel 10 in the direction perpendicular to the flow of the plating solution.

Specifically, as shown in fig. 1, 2, 9 and 11, the plating solution in the inner cavity of the plating tank 10 circulates through the solution inlet 107 and the solution outlet 108, and the plating solution is introduced into the inner cavity of the plating tank 10 through the solution inlet 107, so that the flow rate of the plating solution is affected due to the difference in volume between the solution inlet 107 and the inner cavity of the plating tank 10. The minimum cross-sectional area of the inlet 107 is not less than twice the minimum cross-sectional area of the interior chamber of the plating vessel 10 in the direction perpendicular to the flow of the plating solution. Under the condition that the volume of the electroplating solution passing through the electroplating tank 10 is unchanged in unit time, because the volume of the inner cavity of the electroplating tank 10 is smaller, when the electroplating solution flows into the inner cavity of the electroplating tank 10 from the liquid inlet 107, the flow speed of the electroplating solution can be greatly accelerated, the current density in the inner cavity of the electroplating tank 10 can be increased, and the electroplating speed is further improved. In addition, the flow rate of the electroplating solution is increased, dendrites and bubble holes on the surface of the solar cell 60 may be washed away, so that the degradation of the electroplating layer is not easy to form, and the quality of the electroplated grid line electrode is improved.

Optionally, at least part of the outer surface of the first conductive element 201 and/or at least part of the outer surface of the second conductive element 301 is provided with an isolating insulation layer.

Specifically, in the electroplating process, the first conductive unit 201 and the second conductive unit 301 inevitably contact with the electroplating solution, in order to prevent the first conductive unit 201 and the second conductive unit 301 from corroding and plating, an insulating layer is disposed on at least part of the outer surface of the first conductive unit 201 and/or at least part of the outer surface of the second conductive unit 301, and the insulating layer at least partially covers the first conductive unit 201 and the second conductive unit 301, so that only the positions of the first conductive unit 201 and the second conductive unit 301 for electrically contacting with the solar cell 60 are exposed, thereby ensuring the stability of the electrical connection between the first conductive unit 201 and the second conductive unit 301 and the solar cell 60. Through setting up the insulating layer, can prevent that first conductive element 201 and second conductive element 301 from corroding, plating the phenomenon, reduce follow-up deplating's work load, practiced thrift the cost, also promoted the durability of device.

The insulating layer may be made of teflon, silica gel, or the like, or may be formed on the outer surfaces of the first conductive unit 201 and the second conductive unit 301 by spraying an insulating paint.

Fig. 1 to 4 are schematic structural views of a solar cell electroplating apparatus according to an embodiment of the present application.

In this embodiment of the present application, the solar cell electroplating apparatus may specifically include: plating tank 10, first conductive assembly 20, second conductive assembly 30, and plating power control module 40; an anode 50 is arranged in the electroplating bath 10; the first conductive component 20 and the second conductive component 30 are respectively used for being electrically connected with a grid line feeding point 601 on the surface of the solar cell 60; the plating power supply control module 40 is electrically connected with the plating power supply, the first conductive component 20 and the second conductive component 30 respectively, and is used for controlling the first conductive component 20 and the second conductive component 30 to switch between the positive electrode and the negative electrode of the plating power supply; when the first conductive component 20 is conducted with the negative electrode of the electroplating power supply and the second conductive component 30 is conducted with the positive electrode of the electroplating power supply, the first conductive component 20 and the anode 50 form a first electroplating loop, and the first conductive component 20 and the second conductive component 30 form a first deplating loop; when the second conductive element 30 is electrically connected to the negative electrode of the plating power supply and the first conductive element 20 is electrically connected to the positive electrode of the plating power supply, the second conductive element 30 and the anode 50 form a second plating circuit, and the first conductive element 20 and the second conductive element 30 form a second deplating circuit.

Specifically, as shown in fig. 1 to 4, the plating tank 10 is used to provide a plating place, the plating tank 10 has an inner cavity, the plating tank 10 may be closed or semi-closed, the inner cavity of the plating tank 10 is filled with a plating solution, and the plating solution includes a water-soluble metal salt and a buffer. During the electroplating process, one or more of copper powder, nickel powder, copper oxide powder, copper salt, tin salt or nickel salt may be added to the electroplating bath 10 to maintain the concentration of the electroplating bath stable and to ensure the duration of the electroplating process.

During the electroplating process or the deplating process, the anode 50 is positioned in the inner cavity of the electroplating tank 10, and at least part of the anode 50 is positioned in the electroplating solution; likewise, the conductive portions of the first conductive member 20 and the second conductive member 30 are also located in the plating solution. The electroplating power supply is provided with a positive electrode and a negative electrode, the positive electrode 50 can be directly and electrically connected with the positive electrode of the electroplating power supply, and the positive electrode 50 can be connected in series with the positive electrode of the electroplating power supply through a flexible wire or connected in series with the positive electrode of the electroplating power supply through a rigid conductive member. The anode 50 may also be connected to a plating power supply through the plating power supply control module 40. The anode 50 can be a soluble anode, and can separate out metal cations in the electroplating process so as to supplement the metal cations in the electroplating solution; the anode 50 can also be an insoluble anode, metal cations are supplemented only through the circulation of the electroplating solution, the anode 50 cannot be dissolved and lost in the electroplating process, the anode 50 is not required to be replaced frequently, and the electroplating efficiency is improved. The number of anodes 50 may be set according to the actual requirements of the plating.

At least part of the first conductive component 20 and the second conductive component 30 are made of conductive materials and are respectively used for being electrically connected with the grid line feeding point 601 on the surface of the solar cell 60. The first conductive assembly 20 and the second conductive assembly 30 are connected to a plating power source through a plating power source control module 40. The plating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to switch between the positive electrode and the negative electrode of the plating power supply, for example, the plating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to be conducted with the positive electrode of the plating power supply, can control the first conductive component 20 and the second conductive component 30 to be conducted with the negative electrode of the plating power supply, and can also control one of the first conductive component 20 and the second conductive component 30 to be conducted with the positive electrode of the plating power supply, and the other to be conducted with the negative electrode of the plating power supply.

When the first conductive component 20 is conducted with the negative electrode of the electroplating power supply and the second conductive component 30 is conducted with the positive electrode of the electroplating power supply, the first conductive component 20 and the anode 50 form a first electroplating loop, and in the first electroplating loop, under the action of the electroplating power supply, metal cations in the electroplating solution are deposited on the surface of the solar cell 60 contacted with the first conductive component 20 under the attraction of the first conductive component 20 to form a grid electrode. The first conductive component 20 and the second conductive component 30 form a first deplating circuit, at this time, the second conductive component 30 can be regarded as a soluble anode 50, the metal plating plated on the second conductive component 30 can be corroded and consumed, and metal cations are separated out, so that the deplating of the second conductive component 30 is realized, and the metal cations separated out from the second conductive component 30 can be utilized by the first electroplating circuit and be coated on the surface of the solar cell 60 again to form a grid line electrode, thereby improving the electroplating efficiency.

Under the control of the plating power control module 40, electrical interchange on the first conductive member 20 and the second conductive member 30 can be achieved. When the second conductive component 30 is conducted with the negative electrode of the electroplating power supply and the first conductive component 20 is conducted with the positive electrode of the electroplating power supply, the second conductive component 30 and the anode 50 form a second electroplating loop, and in the second electroplating loop, under the action of the electroplating power supply, metal cations in the electroplating solution are deposited on the surface of the solar cell 60 contacted with the second conductive component 30 under the attraction of the second conductive component 30 to form a grid electrode. The first conductive component 20 and the second conductive component 30 form a second deplating circuit, at this time, the first conductive component 20 can be regarded as a soluble anode 50, the metal plating plated on the first conductive component 20 can be corroded and consumed, and metal cations are separated out, so that the deplating of the first conductive component 20 is realized, and the metal cations separated out by the first conductive component 20 can be utilized by a second electroplating circuit to form a grid line electrode on the surface of the solar cell 60, thereby improving the electroplating efficiency.

The number of the plating power sources may be one, two or more, the anode 50, the first conductive component 20 and the second conductive component 30 may be powered by the same power source, or may be powered by different power sources, or may be powered by the same power source for two of the anode 50, the first conductive component 20 and the second conductive component 30, and the other one may be powered by another power source, so long as a plating circuit or a deplating circuit may be formed between the anode 50, the first conductive component 20 and the second conductive component 30.

The first conductive component 20 and the second conductive component 30 may be distributed on the same side of the solar cell 60, so as to implement single-sided electroplating on the solar cell 60; the first conductive component 20 and the second conductive component 30 may also be located on two sides of the solar cell 60 at the same time, for example, the first surface and the second surface of the solar cell 60 are both provided with the first conductive component 20 and the second conductive component 30, so as to implement double-sided electroplating of the solar cell 60, where the first surface and the second surface are two opposite sides of the solar cell 60.

In this embodiment, through electroplating power control module 40 to first conductive component 20 and second conductive component 30 control, when having guaranteed that solar wafer 60 normally electroplates, can also be to first conductive component 20 and second conductive component 30 and carry out the deplating in turn, utilize the principle of electrochemical reaction to corrode the metal of plating the deposit on consuming first conductive component 20 and second conductive component 30, need not to dismantle the clearance to first conductive component 20 and second conductive component 30, help promoting the continuity of electroplating process, guarantee production efficiency and productivity. In addition, when the first conductive element 20 or the second conductive element 30 is deplating, the metal cations precipitated from the first conductive element 20 or the second conductive element 30 can be utilized by the electroplating circuit, and the metal cations are plated on the surface of the solar cell 60 again to form a grid electrode, so that the electroplating efficiency is further improved.

The embodiment of the application also provides a solar cell electroplating device, which comprises: plating cell 10, at least one cathode conductive unit, and an anode plate having at least one through hole; the anode plate is attached to the inner wall of the electroplating tank 10 with at least one through hole, and the through hole of the anode plate corresponds to the through hole on the inner wall of the electroplating tank 10; the cathode conductive unit passes through the through-hole of the anode plate and the through-hole on the inner wall of the plating tank 10.

Specifically, in the electroplating process, the negative electrode of the electroplating power supply is conducted with the cathode conductive unit, and the anode plate is conducted with the positive electrode of the electroplating power supply. The cathode conductive unit only needs to pass through the through hole of the anode plate and the through hole on the inner wall of the electroplating bath 10, and the conductive part of the cathode conductive unit stretches into the electroplating bath 10, so that the conduction of an electroplating loop between the anode plate and the cathode conductive unit can be realized. When the electroplating bath 10 circulates the electroplating solution through the liquid inlet and the liquid outlet, under the condition that the volume of the electroplating solution passing through the electroplating bath in unit time is unchanged, because the volume of the inner cavity of the electroplating bath 10 is smaller, when the electroplating solution flows into the inner cavity of the electroplating bath 10 from the liquid inlet, the flow speed of the electroplating solution can be greatly accelerated, so that the flow speed of the surface of the solar cell 60 is also accelerated, the current density of the surface of the solar cell 60 can be increased, and the electroplating speed is further improved.

Optionally, the electroplating apparatus includes a first conductive assembly 20, a second conductive assembly 30, and an electroplating power supply control module 40 connected to the first conductive assembly 20 and the second conductive assembly 30, the cathode conductive unit has one or more first conductive units 201 and one or more second conductive units 301, and the first conductive units 201 are formed on the first conductive assembly 20, and the second conductive units 301 are formed on the second conductive assembly 30.

Specifically, the first conductive component 20 and the second conductive component 30 are connected to the plating power supply through the plating power supply control module 40, where the plating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to switch between the positive electrode and the negative electrode of the plating power supply, for example, the plating power supply control module 40 can control the first conductive component 20 and the second conductive component 30 to be both conductive to the positive electrode of the plating power supply, can also control the first conductive component 20 and the second conductive component 30 to be both conductive to the negative electrode of the plating power supply, and can also control one of the first conductive component 20 and the second conductive component 30 to be conductive to the positive electrode of the plating power supply and the other to be conductive to the negative electrode of the plating power supply.

At least one first conductive unit 201 is disposed on the first conductive member 20, and at least one second conductive unit 301 is disposed on the second conductive member 30. The specific number of the first conductive units 201 and the second conductive units 301 may be selected according to the number of the grid line feeding points 601 on the surface of the solar cell 60.

Alternatively, referring to fig. 1 to 4, the first conductive member 20 has a first position and a second position; in the first position, the first conductive component 20 is conducted with the negative electrode of the electroplating power supply, and the first conductive component 20 is electrically connected with the grid line feed point 601 on the surface of the solar cell 60; in the second position, the first conductive component 20 is conducted with the anode of the electroplating power supply, and the first conductive component 20 is separated from the solar cell 60; the second conductive assembly 30 has a third position and a fourth position; in the third position, the second conductive component 30 is conducted with the negative electrode of the electroplating power supply, and the second conductive component 30 is electrically connected with the grid line feed point 601 on the surface of the solar cell 60; in the fourth position, the second conductive element 30 is electrically connected to the positive electrode of the electroplating power source, and the second conductive element 30 is separated from the solar cell 60.

Specifically, as shown in fig. 1 to 4, in the embodiment of the present application, the control logic of the plating power control module 40 may be matched with the positions of the first conductive member 20 and the second conductive member 30. The first conductive member 20 has a first position and a second position, the second conductive member 30 has a third position and a fourth position, and the switching of the first conductive member 20 between the first position and the second position, and the switching of the second conductive member 30 between the third position and the fourth position can be controlled by a driving mechanism, or can be controlled manually, which is not limited in the embodiment of the present application.

When the first conductive element 20 is at the first position, correspondingly, the second conductive element 30 is at the fourth position, the plating power control module 40 controls the first conductive element 20 to be conducted with the negative electrode of the plating power, and the plating power control module 40 controls the second conductive element 30 to be conducted with the positive electrode of the plating power. At this time, the first conductive member 20 is electrically connected to the grid line feeding point 601 on the surface of the solar cell 60, and forms a first electroplating loop with the anode 50; the second conductive assembly 30 is separated from the solar cell 60 and forms a first deplating loop with the first conductive assembly 20.

When the first conductive component 20 is at the second position, correspondingly, the second conductive component 30 is at the third position, the electroplating power control module 40 controls the first conductive component 20 to be conducted with the anode of the electroplating power, and the electroplating power control module 40 controls the second conductive component 30 to be conducted with the cathode of the electroplating power. At this time, the first conductive component 20 is separated from the solar cell 60, and forms a second deplating loop with the second conductive component 30; the second conductive member 30 is electrically connected to the grid feed point 601 on the surface of the solar cell 60, and forms a second plating loop with the anode 50.

By matching the control logic of the plating power supply control module 40 with the positions of the first conductive component 20 and the second conductive component 30, when the first conductive component 20 or the second conductive component 30 needs to participate in plating, the first conductive component 20 or the second conductive component 30 can be moved to a position electrically connected with the grid line feeding point 601 on the surface of the solar cell 60; when the first conductive member 20 or the second conductive member 30 needs to be deplated, the first conductive member 20 or the second conductive member 30 is moved to a position separated from the solar cell 60. While ensuring the normal electroplating process, shielding of the first conductive component 20 or the second conductive component 30 on the grid line electrode on the surface of the solar cell 60 during deplating can be reduced, the circulation rate of electroplating liquid can be accelerated, and the consistency of the electroplated grid line electrode can be improved.

Optionally, the plating power control module 40 is electrically connected to the anode 50 for controlling the anode 50 to switch between the positive and negative poles of the plating power.

Specifically, during the electroplating process, the electroplating power control module 40 may control the anode 50 to be in conduction with the anode of the electroplating power, and the anode 50, the first conductive component 20 and the second conductive component 30 may form an electroplating loop.

After the electroplating process of the solar cell 60 is completed, the first conductive component 20 and the second conductive component 30 may have incomplete alternate deplating, and still have a part of the plating layer, which may affect the electroplating of the subsequent solar cell 60. Therefore, when the first conductive component 20 and the second conductive component 30 are incompletely deplating, the electroplating power supply control module 40 can control the anode 50 to be conducted with the negative electrode of the electroplating power supply, at least one of the first conductive component 20 and the second conductive component 30 is conducted with the positive electrode of the electroplating power supply, the first conductive component 20 and/or the second conductive component 30 is deplating by utilizing the anode 50, no component participating in deplating is needed to be newly added, the device is simplified, and the production cost is reduced.

Optionally, referring to fig. 9 to 10, the solar cell electroplating apparatus further includes: a deplating cathode 70; the electroplating power supply control module 40 is connected with the deplating cathode 70 and is used for controlling the connection and disconnection between the deplating cathode 70 and the electroplating power supply cathode; when at least one of the first conductive element 20 and the second conductive element 30 is in conduction with the positive electrode of the plating power supply and the deplating cathode 70 is in conduction with the negative electrode of the plating power supply, the deplating cathode 70 and the first conductive element 20, or the deplating cathode 70 and the second conductive element 30, or the deplating cathode 70, the first conductive element 20 and the second conductive element 30 form a third deplating circuit.

Specifically, as shown in fig. 9 to 10, after the electroplating process of the solar cell 60 is completed, a part of the plating layer may remain on the first conductive component 20 and the second conductive component 30 due to incomplete alternate deplating, which may affect the electroplating of the subsequent solar cell 60. Therefore, when the first conductive member 20 and the second conductive member 30 are incompletely deplating, the first conductive member 20 and/or the second conductive member 30 may be deplated again using the third deplating circuit.

In the third stripping circuit, the stripping cathode 70 may be made of a metal material such as copper or iron, and preferably the same material as the plating material. The deplating cathode 70 is in communication with the negative pole of the electroplating power supply, and at least one of the first conductive assembly 20 and the second conductive assembly 30 is in communication with the positive pole of the electroplating power supply, thereby forming a complete deplating circuit. The third stripping loop may include the following three sub-loops: a stripping sub-loop consisting of a stripping cathode 70 and a first conductive assembly 20, a stripping sub-loop consisting of a stripping cathode 70 and a second conductive assembly 30, a stripping sub-loop consisting of a stripping cathode 70, a first conductive assembly 20, and a second conductive assembly 30.

By providing the third stripping circuit, when the pre-process alternating stripping is incomplete, the third stripping circuit can be utilized and a larger current is applied to rapidly strip the first conductive component 20 and/or the second conductive component 30, thereby improving the stripping efficiency and avoiding influencing the electroplating of the subsequent solar cell 60.

Alternatively, referring to fig. 9 to 10, a deplating cathode 70 is provided at the bottom of the solar cell 60 mounting site; the deplating cathode 70 is removable or position adjustable.

Specifically, as shown in fig. 9 to 10, the deplating cathode 70 is disposed at the bottom of the solar cell 60, and does not occupy too much space in the inner cavity of the plating tank 10. The stripping cathode 70 is detachable, and the stripping cathode 70 can be detached and replaced when the stripping cathode 70 is plated with more plating layers. The position of the stripping cathode 70 is adjustable, and in the process of stripping, the distance between the stripping cathode 70 and the solar cell 60 can be adjusted according to the thickness of the plating layer on the stripping cathode 70, so that the solar cell 60 is prevented from being interfered. In addition, the stripping area of the stripping cathode 70 exposed to the plating solution is preferably slightly smaller than the area of the battery cell 60 in terms of convenience of structural design, but may be optimally adjusted in terms of the structure of the battery cell fixing base. The stripping of the conductive elements on the first conductive assembly 20 and the second conductive assembly 30 is preferably performed with a larger footprint stripping cathode, where the structure permits. But even when a small area of exposed stripping cathode 70 is used, stripping of the conductive elements on the first conductive assembly 20 and the second conductive assembly 30 can be accomplished (as shown in fig. 9-10).

Alternatively, the first conductive unit 201 and the second conductive unit 301 are arranged to cross.

Specifically, the first conductive units 201 and the second conductive units 301 are arranged in a crossing manner, which may be specifically arranged in a manner that an array includes a plurality of rows or columns of conductive units, and the first conductive units 201 and the second conductive units 301 are arranged in a crossing manner in adjacent rows and/or columns. The first conductive units 201 and the second conductive units 301 which are arranged in a crossed manner can be uniformly distributed on the surface of the solar cell 60, and in the electroplating or deplating process, the current and the metal cations are uniformly distributed, so that the consistency of the electroplated grid line electrode can be improved.

Alternatively, the array is divided into a first half area and a second half area by an array center line or an array diagonal line, the plurality of first conductive units 201 are located in the first half area, and the plurality of second conductive units 301 are located in the second half area.

Specifically, the first conductive units 201 and the second conductive units 301 may also be arranged in a half-area, where the conductive unit array is divided into a first half area and a second half area by a central line or an array diagonal line, and the plurality of first conductive units 201 are located in the first half area and the plurality of second conductive units 301 are located in the second half area.

By adopting the arrangement mode, the structure is simple, the first conductive unit 201 and the second conductive unit 301 can be controlled conveniently, and the first conductive unit 201 and the second conductive unit 301 are not easy to interfere with each other when moving respectively.

Alternatively, the array is divided into an array inner ring and an array outer ring, the plurality of first conductive units 201 are located in the array inner ring, and the plurality of second conductive units 301 are located in the array outer ring.

Specifically, the first conductive unit 201 and the second conductive unit 301 may also adopt an arrangement manner of an array inner ring and an array outer ring. The outer ring of the array surrounds the inner ring of the array to form a complete array of conductive units, the plurality of first conductive units 201 are located in the inner ring of the array, and the plurality of second conductive units 301 are located in the outer ring of the array.

Specifically, as shown in fig. 13, the anode 50 may employ a soluble anode 50 or an insoluble anode 50. In the embodiment of the present application, the anode 50 is an insoluble anode 50, the anode 50 is disposed on one side of the cover plate 102 close to the plating tank body 101, and a plurality of second through holes 501 are disposed on the anode 50. The number of second vias 501 matches the number of conductive elements on the first conductive assembly 20 and the second conductive assembly 30. The first conductive component 20 and the second conductive component 30 extend into the plating tank 10 through the first through hole and the second through hole 501. In the electroplating process, the conductive elements on the first conductive component 20 or the second conductive component 30 are partially penetrated in the second through holes 501, so that the current distribution between the anode 50 and the conductive elements is more uniform, and the uniformity of the electroplated grid line electrode is improved.

Alternatively, the distance between the anode 50 and the solar cell 60 is 1mm to 10mm in the thickness direction of the solar cell 60 at the time of electroplating.

Specifically, the anode 50 is disposed below the cover plate 102, and after the cover plate 102 is fastened to the plating tank body, the solar cell 60 is disposed in an inner cavity formed by the cover plate 102 and the plating tank body. Along the thickness direction of the solar cell 60, the distance between the anode 50 and the solar cell 60 is 1mm-10mm, the distance is small, the distance for the cation plating movement is short, and the current density can be increased, so that the plating rate is greatly improved.

Optionally, referring to fig. 1 to 8, the solar cell electroplating apparatus further includes: a second drive mechanism 90; the second drive mechanism 90 is coupled to the first conductive assembly 20 to drive the first conductive assembly 20 to switch between the first position and the second position.

Specifically, as shown in fig. 1 to 8, the first conductive member 20 may be manually switched between the first position and the second position, or the movement of the first conductive member 20 may be controlled by the second driving mechanism 90. The second driving mechanism 90 may be a combination of a motor and a screw, or a combination of a cylinder and a link. Through setting up second actuating mechanism 90, can promote solar wafer electroplating device's degree of automation, and then promote production efficiency.

Optionally, referring to fig. 1 to 8, the solar cell electroplating apparatus further includes: a third drive mechanism 100; the third driving mechanism 100 is connected to the second conductive assembly 30 to drive the second conductive assembly 30 to switch between the third position and the fourth position.

Specifically, as shown in fig. 1 to 8, the second conductive element 30 may be switched between the third position and the fourth position manually, or the movement of the second conductive element 30 may be controlled by the third driving mechanism 100. The third driving mechanism 100 may be a combination of a motor and a screw, or a combination of a cylinder and a link. By arranging the third driving mechanism 100, the automation degree of the solar cell electroplating device can be improved, and the production efficiency can be improved.

In summary, the solar cell electroplating device according to the embodiment of the application at least includes the following advantages:

in the embodiment of the present application, the plating power control module 40 can control one of the first conductive member 20 and the second conductive member 30 to be in conduction with the positive electrode of the plating power, and the other to be in conduction with the negative electrode of the plating power. When the first conductive component 20 is conducted with the negative electrode of the electroplating power supply and the second conductive component 30 is conducted with the positive electrode of the electroplating power supply, the first conductive component 20 and the anode 50 form a first electroplating loop, and the first conductive component 20 and the second conductive component 30 form a first deplating loop; when the second conductive element 30 is electrically connected to the negative electrode of the plating power supply and the first conductive element 20 is electrically connected to the positive electrode of the plating power supply, the second conductive element 30 and the anode 50 form a second plating circuit, and the first conductive element 20 and the second conductive element 30 form a second deplating circuit. The solar cell 60 can be plated alternately with the first conductive component 20 and the second conductive component 30 while normal electroplating is ensured, the deposited metal on the first conductive component 20 and the second conductive component 30 is corroded and consumed by utilizing the principle of electrochemical reaction, the first conductive component 20 and the second conductive component 30 are not required to be disassembled and cleaned, the continuity of an electroplating process is improved, and the production efficiency and the productivity are ensured. In addition, when the first conductive element 20 or the second conductive element 30 is deplating, the metal cations precipitated from the first conductive element 20 or the second conductive element 30 can be utilized by the electroplating circuit, and the metal cations are plated on the surface of the solar cell 60 again to form a grid electrode, so that the electroplating efficiency is further improved.

Referring to fig. 15, a flowchart of a solar cell electroplating method according to an embodiment of the present application is shown.

In the embodiment of the application, the solar cell electroplating method comprises the following steps:

step 101, controlling a first conductive component to be at a first position and controlling a second conductive component to be at a fourth position, wherein the first position is a position where the first conductive component is electrically connected with a grid line feeding point on the surface of a solar cell, and the fourth position is a position where the second conductive component is separated from the solar cell.

Before electroplating, the solar cell is placed in an electroplating bath, and the first conductive component is controlled to be in a first position so that the first conductive component is in contact with a grid line feed point on the surface of the solar cell. The second conductive component does not participate in the electroplating process, and can be separated from the solar cell.

Step 102, controlling the electroplating power supply control module to be in a first state so as to enable the first conductive component to be conducted with the negative electrode of the electroplating power supply, and enabling the second conductive component to be conducted with the positive electrode of the electroplating power supply.

When the electroplating power supply control module is in a first state, the first conductive component is conducted with the negative electrode of the electroplating power supply, the second conductive component is conducted with the positive electrode of the electroplating power supply, and the anode is conducted with the positive electrode of the electroplating power supply. The first conductive component and the anode form a first electroplating loop, and in the first electroplating loop, under the action of an electroplating power supply, metal cations in the electroplating solution are attracted by the first conductive component and deposited on the surface of the solar cell sheet contacted with the first conductive component to form a grid line electrode.

The first conductive component and the second conductive component form a first deplating loop, the second conductive component can be regarded as a soluble anode at the moment, a metal plating layer plated on the second conductive component can be corroded and consumed, metal cations are separated out, so that deplating of the second conductive component is realized, the metal cations separated out of the second conductive component can be utilized by the first electroplating loop, and the plating is performed on the surface of the solar cell to form a grid electrode, so that the electroplating efficiency is improved.

Step 103, after a first preset time interval, controlling the first conductive component to be in a second position and controlling the second conductive component to be in a third position, wherein the second position is a position where the first conductive component is separated from the solar cell, and the third position is a position where the second conductive component is electrically connected with a grid line feed point on the surface of the solar cell.

After the first preset time is implemented in step 102, the first preset time may be 1min, 3min, 5min, 10min, 30min, 60min, and other time periods, which may be specifically selected according to the actual electroplating situation of the gate line electrode. The first conductive component is involved in the electroplating process, so that the surface of the first conductive component is plated, and the subsequent electroplating process is affected. The electroplating power supply can be disconnected firstly, and then the first conductive component is controlled to be positioned at the second position so as to be separated from the solar cell; and controlling the second conductive component to be in a third position so that the second conductive component is in contact with the grid line feed point on the surface of the solar cell.

Step 104, controlling the electroplating power supply control module to be in a second state so as to enable the first conductive component to be conducted with the positive electrode of the electroplating power supply, and enabling the second conductive component to be conducted with the negative electrode of the electroplating power supply.

When the control module of the electroplating power supply is in the second state, the first conductive component is conducted with the positive electrode of the electroplating power supply, the second conductive component is conducted with the negative electrode of the electroplating power supply, and the positive electrode of the electroplating power supply is conducted with the positive electrode of the electroplating power supply. The second conductive component and the anode form a second electroplating loop, and in the second electroplating loop, under the action of an electroplating power supply, metal cations in the electroplating solution are attracted by the second conductive component and deposited on the surface of the solar cell sheet contacted with the second conductive component to form a grid line electrode.

The first conductive component and the second conductive component form a second deplating loop, at the moment, the first conductive component can be regarded as a soluble anode, a metal plating layer plated on the first conductive component can be corroded and consumed, and metal cations are separated out, so that deplating of the first conductive component is realized, and the metal cations separated out of the first conductive component can be utilized by the second electroplating loop and are plated on the surface of the solar cell to form a grid electrode again, so that the electroplating efficiency is improved.

In an embodiment of the present application, the solar cell electroplating method further includes:

step 105, disconnecting the passage between the electroplating power supply and the anode for a second preset time before the electroplating is finished.

The second preset time can be 1min, 2min, 5min, 10min, 15min, 30min and other time periods, in which the grid line electrode on the surface of the solar cell slice is plated basically, the path between the electroplating power supply and the anode can be disconnected, and the first conductive component or the second conductive component is only adopted as the anode, so that the greater current stripping can be adopted, and the stripping efficiency and the stripping integrity can be improved.

and 106A, after electroplating is completed, controlling the electroplating power supply control module to be in a third state so as to enable at least one of the first conductive component and the second conductive component to be conducted with the positive electrode of the electroplating power supply, and enabling the deplating cathode to be conducted with the negative electrode of the electroplating power supply.

After the electroplating process of the solar cell is completed, partial plating layer may still remain on the first conductive component and the second conductive component due to incomplete alternate deplating in the preamble, which may affect the electroplating of the subsequent solar cell. Therefore, when the first conductive component and the second conductive component are incompletely deplated, the electroplating power supply control module can be controlled to be in a third state so as to enable the anode to be conducted with the cathode of the electroplating power supply, at least one of the first conductive component and the second conductive component is conducted with the anode of the electroplating power supply, the first conductive component and/or the second conductive component is deplated by utilizing the anode, and a component participating in deplating is not required to be newly added, so that the device is simplified, and the production cost is reduced.

and 106B, after electroplating is completed, controlling the electroplating power supply control module to be in a fourth state so as to enable at least one of the first conductive component and the second conductive component to be conducted with the anode of the electroplating power supply and the anode to be conducted with the cathode of the electroplating power supply.

After the electroplating process of the solar cell is completed, partial plating layer may still remain on the first conductive component and the second conductive component due to incomplete alternate deplating in the preamble, which may affect the electroplating of the subsequent solar cell. Therefore, when the first conductive component and the second conductive component are incompletely deplated, the electroplating power supply control module can be controlled to be in a fourth state, so that at least one of the first conductive component and the second conductive component is conducted with the positive electrode of the electroplating power supply, the deplating cathode is conducted with the negative electrode of the electroplating power supply, and the first conductive component and/or the second conductive component is deplated again by utilizing the third deplating loop.

In the third stripping circuit, the stripping cathode can be made of metal materials such as copper, iron and the like, the stripping cathode is conducted with the negative electrode of the electroplating power supply, and at least one of the first conductive component and the second conductive component is conducted with the positive electrode of the electroplating power supply, so that a complete stripping circuit is formed. The third stripping loop may include the following three sub-loops: the device comprises a deplating sub-loop formed by a deplating cathode and a first conductive component, a deplating sub-loop formed by the deplating cathode and a second conductive component, and a deplating sub-loop formed by the deplating cathode, the first conductive component and the second conductive component.

Through setting up the third and move back the plating return circuit, when the preface alternately moves back the plating incompletely, can utilize the third to move back the plating return circuit to apply great electric current, move back the plating fast to first electrically conductive subassembly and/or second electrically conductive subassembly, promote and move back the plating efficiency, avoid producing the influence to the electroplating of follow-up solar wafer.

In this embodiment, step 102, controlling the electroplating power control module to be in a first state includes:

and S11, controlling the electroplating power supply control module to introduce gradually increased electroplating current to the first conductive component until a first current threshold is reached.

When the electroplating power supply control module is in a first state, the first conductive component is electrically connected with the grid line feeding point on the surface of the solar cell, and as the grid line electrode is thinner during initial electroplating, if larger current is introduced, the potential at the grid line feeding point is lower, the potential in the surrounding area is higher, and after the potential difference occurs, the phenomenon of deplating of the thinner grid line electrode near the first conductive component is caused. The electroplating power supply control module can be utilized to firstly charge smaller electroplating current into the first conductive component, and after the thickness of the grid electrode is stable, the electroplating current is gradually increased until the first current threshold is reached, wherein the first current threshold is the current value during stable electroplating. By introducing the electroplating current which is gradually increased to the first conductive component, the problem of deplating the grid line electrode can be reduced, and the quality of the grid line electrode is improved.

In this embodiment, step 104 of controlling the electroplating power control module to be in the second state includes:

s21, controlling the electroplating power supply control module to introduce the gradually increased electroplating current to the second conductive component until the second current threshold is reached.

When the electroplating power supply control module is in a second state, the second conductive component is electrically connected with the grid line feeding point on the surface of the solar cell, and as the grid line electrode is thinner during initial electroplating, if larger current is introduced, the potential at the grid line feeding point is lower, the potential in the surrounding area is higher, and after the potential difference occurs, the phenomenon of deplating of the thinner grid line electrode near the second conductive component is caused. The electroplating power supply control module can be utilized to firstly charge smaller electroplating current into the second conductive component, and after the thickness of the grid line electrode is stable, the electroplating current is gradually increased until the second current threshold value is reached, wherein the second current threshold value is the current value during stable electroplating. By introducing the electroplating current which is gradually increased to the second conductive component, the problem of deplating the grid line electrode can be reduced, and the quality of the grid line electrode can be improved.

The first current threshold and the second current threshold may be the same or different, and may specifically be adjusted according to the actual plating conditions of the node and the gate line electrode of the electroplating process.

and S31, controlling the electroplating power supply control module to introduce progressively increased deplating current to the second conductive component until a third current threshold is reached.

When the power control module is in the first state, gradually increased electroplating current is led into the first conductive component, and the increase of the electroplating current can also cause the plating condition of the first conductive component or the second conductive component to be aggravated. Thus, the electroplating power supply control module may be controlled to apply a progressively increasing stripping current to the second conductive component until a third current threshold is reached, the third current threshold being matched to the stripping rate. The second conductive component is led with the progressively increased stripping current, so that the stripping speed of the second conductive component is increased, and the problem that the plating layer is accumulated on the second conductive component due to untimely stripping is avoided.

s41, controlling the electroplating power supply control module to introduce progressively increased deplating current to the first conductive component until a fourth current threshold is reached.

When the power control module is in the second state, gradually increased electroplating current is led into the second conductive component, and the increase of the electroplating current can also cause the plating condition of the first conductive component or the second conductive component to be aggravated. Thus, the electroplating power supply control module may be controlled to apply a progressively increasing stripping current to the first conductive component until a fourth current threshold is reached, the fourth current threshold being matched to the stripping rate. The first conductive component is fed with the progressively increased stripping current, so that the stripping speed of the first conductive component is increased, and the problem that the plating layer is accumulated on the first conductive component due to untimely stripping is avoided.

In this embodiment of the present application, in step 101, before controlling the first conductive component to be in the first position and controlling the second conductive component to be in the fourth position, the solar cell electroplating method further includes:

step S101, controlling the first conductive component to be at the first position, and controlling the second conductive component to be at the third position.

In order to avoid the phenomenon that the grid line electrode is thinner and is subjected to deplating, the first conductive component is controlled to be positioned at a first position before the first conductive component and the second conductive component are subjected to alternate electroplating and deplating processes, and the second conductive component is controlled to be positioned at a third position, so that the first conductive component and the second conductive component are both contacted with the grid line feeding point on the surface of the solar cell, the first conductive component and the second conductive component simultaneously electroplate the solar cell, and after the stable grid line electrode is formed, the alternate electroplating and deplating processes are performed.

Step S102, controlling the plating power control module to be in a fifth state, so that the first conductive component and the second conductive component are both conducted with the negative electrode of the plating power.

When the electroplating power supply control module is in a fifth state, the first conductive component and the second conductive component are both communicated with the negative electrode of the electroplating power supply, the anode is communicated with the positive electrode of the electroplating power supply, the first conductive component, the second conductive component and the anode form an electroplating loop, and the first conductive component and the second conductive component are used for electroplating the solar cell. The plating power supply control module may apply a gradually increasing plating current to the first conductive member and the second conductive member, and then apply a constant current after forming a stable gate line electrode.

After the stable grid line electrode is formed, the alternating electroplating and deplating process is carried out, so that the deplating problem of the grid line electrode can be reduced, and the quality of the grid line electrode is improved.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.

Claims

1. A solar cell electroplating apparatus, comprising: plating bath, at least one cathode conductive unit, and an anode having at least one through hole;

2. The solar cell plating apparatus of claim 1, wherein the plating apparatus comprises a first conductive member, a second conductive member, the cathode conductive unit has one or more first conductive units and one or more second conductive units, and the first conductive units are formed on the first conductive member, and the second conductive units are formed on the second conductive member.

3. The solar cell plating apparatus of claim 2, wherein the first conductive assembly comprises a plurality of first conductive units and the second conductive assembly comprises a plurality of second conductive units, the first conductive units and the second conductive units being respectively for electrical connection with a grid line feed point of the solar cell surface;

4. The solar cell plating apparatus according to claim 3, wherein the plating tank comprises: a plating bath body and a cover plate;

5. The solar cell electroplating apparatus according to claim 4, wherein a seal is provided between the plating tank body and the cover plate.

6. The solar cell electroplating device according to claim 4, wherein the plating tank body is provided with a first positioning portion, the cover plate is provided with a second positioning portion, and the first positioning portion and the second positioning portion are in positioning fit.

7. The solar cell electroplating device according to claim 4, wherein one of the plating tank body and the cover plate is provided with a guide rod, and the other of the plating tank body and the cover plate is provided with a guide hole;

8. The solar cell plating apparatus as recited in claim 4, wherein said cover plate is provided with a plurality of first through holes;

9. The solar cell electroplating device according to claim 4, wherein the anode is disposed on a side of the cover plate adjacent to the plating tank body;

10. The solar cell plating apparatus according to claim 4, further comprising: a first driving mechanism;

11. The solar cell electroplating device according to claim 1, wherein the electroplating tank is provided with a liquid inlet and a liquid outlet;

12. A solar cell electroplating apparatus according to claim 3, wherein at least part of the outer surface of the first conductive unit and/or at least part of the outer surface of the second conductive unit is provided with an insulating layer.