CN117757244A - Resin composition and application thereof - Google Patents
Resin composition and application thereof Download PDFInfo
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- CN117757244A CN117757244A CN202311848243.6A CN202311848243A CN117757244A CN 117757244 A CN117757244 A CN 117757244A CN 202311848243 A CN202311848243 A CN 202311848243A CN 117757244 A CN117757244 A CN 117757244A
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- resin composition
- resin
- metal foil
- coupling agent
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- 239000011342 resin composition Substances 0.000 title claims abstract description 75
- 229920005989 resin Polymers 0.000 claims abstract description 59
- 239000011347 resin Substances 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 34
- 239000011888 foil Substances 0.000 claims abstract description 27
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 18
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- GLTDLAUASUFHNK-UHFFFAOYSA-N n-silylaniline Chemical compound [SiH3]NC1=CC=CC=C1 GLTDLAUASUFHNK-UHFFFAOYSA-N 0.000 claims abstract description 7
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 18
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims description 13
- 229920001955 polyphenylene ether Polymers 0.000 claims description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 10
- 239000003063 flame retardant Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000012779 reinforcing material Substances 0.000 claims description 9
- -1 vinylbenzyl Chemical group 0.000 claims description 9
- 239000003999 initiator Substances 0.000 claims description 8
- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 6
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229920005672 polyolefin resin Polymers 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- ZXLAFQNTMMFLSA-UHFFFAOYSA-N 1-ethenyl-4-[2-(4-ethenylphenyl)ethyl]benzene Chemical compound C1=CC(C=C)=CC=C1CCC1=CC=C(C=C)C=C1 ZXLAFQNTMMFLSA-UHFFFAOYSA-N 0.000 claims description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 2
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 2
- 239000005350 fused silica glass Substances 0.000 claims description 2
- 238000005470 impregnation Methods 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 18
- 239000004744 fabric Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 10
- 239000003365 glass fiber Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- MYOQALXKVOJACM-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)C MYOQALXKVOJACM-UHFFFAOYSA-N 0.000 description 1
- CCNDOQHYOIISTA-UHFFFAOYSA-N 1,2-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1C(C)(C)OOC(C)(C)C CCNDOQHYOIISTA-UHFFFAOYSA-N 0.000 description 1
- IKFPAKYBSYICFK-UHFFFAOYSA-N 1-[4-(4-propylphenoxy)phenyl]pyrrole-2,5-dione Chemical compound C1=CC(CCC)=CC=C1OC1=CC=C(N2C(C=CC2=O)=O)C=C1 IKFPAKYBSYICFK-UHFFFAOYSA-N 0.000 description 1
- YNSSPVZNXLACMW-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3-ethyl-5-methylphenyl]methyl]-2-ethyl-6-methylphenyl]pyrrole-2,5-dione Chemical compound C=1C(C)=C(N2C(C=CC2=O)=O)C(CC)=CC=1CC(C=C1CC)=CC(C)=C1N1C(=O)C=CC1=O YNSSPVZNXLACMW-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical group C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention relates to a resin composition and application thereof. The resin composition comprises the following components in parts by weight: 100 parts of matrix resin, 2-10 parts of maleimide resin, 1-3 parts of silane coupling agent and 65-300 parts of silicon dioxide; the silane coupling agent comprises an anilino silane coupling agent and/or a vinyl silane coupling agent. According to the invention, through designing the components of the resin composition, the binding force between the resin composition and the metal foil is obviously improved, and the fluidity of the resin composition is improved, so that the prepared metal foil-clad laminated plate has excellent dielectric property and heat resistance, and the problem of poor reliability of the high-frequency high-speed multilayer metal foil-clad laminated plate is effectively solved.
Description
Technical Field
The invention belongs to the technical field of copper-clad plate materials, in particular to a resin composition and application thereof, and more particularly relates to a resin composition, prepreg containing the resin composition, a metal-clad laminate and a printed circuit board.
Background
In recent years, with the development of high performance, high functionality and networking of computers and information communication devices, in order to transmit and process large-capacity information at high speed, operation signals tend to be high-frequency, and in order to meet the design requirements of HPE/high-end switches/high-end general and AI servers/optical communication/module market products, materials are subjected to scheme upgrading and switching in the Low CTE direction, but the Low CTE tends to bring about reduction of fluidity, so that higher challenges exist for filling of PP, and how to balance CTE and fluidity relations becomes a research difficulty.
Among the existing materials for printed circuit boards, epoxy resins are most widely used, and have good adhesion performance, processability and cost advantages. However, epoxy resin circuit boards have poor dielectric properties, generally have high dielectric constants and dielectric loss tangents (dielectric constants of more than 4 and dielectric loss tangents of about 0.02), and have insufficient high-frequency characteristics, and cannot meet the requirements for increasing the frequency of signals. Therefore, development of a resin excellent in dielectric characteristics, that is, a resin having a low dielectric constant and low dielectric loss tangent is a hot spot problem in recent years.
The research shows that the polyphenyl ether resin has lower dielectric constant and low dielectric loss, and is a high-frequency material with good dielectric property. CN103467967a discloses a thermosetting resin composition comprising a polyphenylene ether resin containing an unsaturated double bond, an epoxy resin, a curing agent and an initiator, and may further comprise a compound containing both an epoxy group and an ethylenic bond, a flame retardant, an accelerator, and the like. The thermosetting resin composition has low dielectric constant and dielectric loss, but the polyphenyl ether resin has poor fluidity and processing performance, and the molecular structure of the polyphenyl ether resin has symmetry, low polarity and poor binding force with copper foil. In addition, since the polyphenyl ether is applied to the high-speed field and needs to be a multi-layer board, the polyphenyl ether has high requirements on heat resistance, and if the binding force with the copper foil is poor and the heat resistance is insufficient, the problem of layered board explosion easily occurs, so that the performance reliability has a great hidden trouble.
Therefore, development of a resin composition having excellent dielectric properties, low CTE, and good fluidity, and having a strong bonding force with a metal foil has been a technical problem to be solved in the art.
Disclosure of Invention
In view of the shortcomings of the prior art, the invention aims to provide a resin composition and application thereof. According to the invention, through designing the components of the resin composition, the binding force between the resin composition and the metal foil is obviously improved, and the fluidity of the resin composition is improved, so that the prepared metal foil-clad laminated plate has excellent dielectric property and heat resistance, and the problem of poor reliability of the high-frequency high-speed multilayer metal foil-clad laminated plate is effectively solved.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a resin composition comprising the following components in parts by weight:
the matrix resin comprises 40-80 parts by weight of thermosetting polyphenyl ether resin and 20-60 parts by weight of cross-linking agent;
the silane coupling agent comprises an anilino silane coupling agent and/or a vinyl silane coupling agent.
In the metal foil-clad laminated board provided by the invention, the resin composition comprises the matrix resin and the silica filler with higher proportion, so that the problem of poor binding force between the polyphenyl ether resin system and the metal foil is solved pertinently, the fluidity of the resin composition is obviously improved, and the binding strength between the resin composition and the metal foil is improved, so that the prepared metal foil-clad laminated board has the advantages of high glass transition temperature (Tg), excellent heat resistance and dielectric property, lower thermal expansion rate, improved reliability, good fluidity and processability, and fully meets the requirements of high-frequency high-speed electronic circuit substrates on comprehensive properties such as low dielectric loss, high copper foil heat resistance, high peeling strength and the like.
In the present invention, the maleimide resin may be used in an amount of 2 to 10 parts, for example, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts or 10 parts, etc., and specific point values between the above point values are limited in space and for the sake of brevity, and the present invention is not exhaustive of the specific point values included in the range. The addition of the maleimide resin with a specific dosage can improve the problem of lower fluidity of a high filler system and improve the fluidity of the resin composition. If the amount of maleimide resin is small, the effect of improving fluidity cannot be achieved; if the maleimide resin is contained in a large amount, the dielectric properties and water absorption of the resin composition are affected.
In the invention, the phenylaminosilane coupling agent and/or the vinyl silane coupling agent is directly added into the resin composition, and the binding force between the resin composition and the metal foil can be improved under the condition that the fluidity of the system is not affected or the fluidity is slightly improved through the use of the specific silane coupling agent. If other types of silane coupling agents, such as those using an epoxy group and a methacrylic group, are used, the fluidity of the resin composition is adversely affected to a large extent. If only the filler treated with the phenylaminosilane coupling agent and/or the vinylsilane coupling agent is used, the bonding force between the resin composition and the metal foil cannot be effectively improved, instead of directly adding the silane coupling agent to the resin composition.
In the present invention, the silane coupling agent is used in an amount of 1 to 3 parts, for example, 1 part, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, 2 parts, 2.2 parts, 2.4 parts, 2.6 parts, 2.8 parts or 3 parts, etc., and specific point values among the above point values are limited in terms of space and for brevity, and the present invention is not intended to be exhaustive. If the dosage of the silane coupling agent is small, the bonding force between the resin composition and the metal foil is not greatly improved; if the amount of the silane coupling agent is large, the dielectric properties of the resin composition are adversely affected.
In the present invention, the weight part of silica in the resin composition may be 65 parts, 70 parts, 80 parts, 100 parts, 120 parts, 140 parts, 160 parts, 180 parts, 200 parts, 220 parts, 250 parts, 270 parts or 300 parts, etc., and specific point values among the above point values are limited in terms of space and for brevity, the present invention is not exhaustive to list the specific point values included in the range.
In the present invention, the weight parts of the thermosetting polyphenylene ether resin in the matrix resin may be 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts or 80 parts, etc., and specific point values between the above point values are limited in space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range.
In the present invention, the weight part of the crosslinking agent in the matrix resin may be 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts or 60 parts, etc., and specific point values between the above point values are limited to a space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range.
The following is a preferred technical scheme of the present invention, but not a limitation of the technical scheme provided by the present invention, and the following preferred technical scheme can better achieve and achieve the objects and advantages of the present invention.
As a preferable technical scheme of the invention, the thermosetting polyphenyl ether resin is thermosetting polyphenyl ether resin containing unsaturated groups at the terminal positions.
Preferably, the unsaturated group comprises at least any one of vinylbenzyl, vinylphenyl, or acrylate groups, or a combination of at least two.
Preferably, the thermosetting polyphenylene ether resin has a number average molecular weight of 500 to 10000, and may be, for example, 500, 1000, 2000, 3000, 4000, 5000, 6000, 7000, 8000, 9000 or 10000, etc., and specific point values among the above point values, which are limited in space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range.
In the present invention, the number average molecular weight of the thermosetting polyphenylene ether resin was measured by gel permeation chromatography based on polystyrene calibration (hereinafter referred to as GB/T21863-2008).
Preferably, the thermosetting polyphenylene ether resin has a structure as described by formula I below:
wherein Z representsThe dotted line indicates the attachment site, the same applies below;
a represents any of carbonyl, C6-C30 (e.g., C6, C9, C10, C12, C14, C16, C18, C20, C22, C24, C26, or C28, etc.), arylene, C1-C10 (e.g., C1, C2, C3, C4, C5, C6, C7, C8, C9, or C10) straight or branched alkylene;
R 5 、R 6 、R 7 each independently represents any one of a hydrogen atom, a C1-C10 (e.g., C1, C2, C3, C4, C5, C6, C7, C8, C9, or C10) straight-chain or branched alkyl group;
n, m each independently represent an integer from 0 to 10, and may be, for example, 0, 1,2, 3, 4, 5, 6, 7, 8, 9 or 10; when n is 0, the benzene ring is connected with the main chain of the thermosetting polyphenyl ether resin shown in the formula I through a single bond; when m is 0, the representative alkenyl group is linked to the main chain of the thermosetting polyphenylene ether resin of formula I by a single bond.
In the formula I, X represents
R 1 、R 2 、R 3 、R 4 、R 8 、R 9 、R 10 、R 11 、R 12 、R 13 、R 14 、R 15 Each independently selected from any of hydrogen, halogen, phenyl, C1-C10 (e.g., C1, C2, C3, C4, C5, C6, C7, C8, C9, or C10) straight or branched alkyl;
y is selected from a single bond, C1-C10 (e.g., C1, C2, C3, C4, C5, C6, C7, C8, C9 or C10) straight or branched alkylene, - - -O- -Any one of them;
in formula I, a and b represent the number of repeating units and are each independently selected from integers ranging from 1 to 30, and may be, for example, 2,5, 8, 10, 12, 15, 18, 20, 22, 25 or 28, and specific point values between the above point values, although the invention is not limited in space and for brevity, exhaustive list of specific point values included in the range is not intended.
Preferably, said Z is selected fromAny one of the following.
Preferably, said R 5 Is hydrogen or methyl.
As a preferable embodiment of the present invention, Z is any one selected from vinylbenzyl, vinylphenyl, acrylate or methacrylate groups.
In the present invention, the crosslinking agent is capable of reacting with the maleimide resin and the thermosetting polyphenylene ether resin to thereby cure a resin composition comprising the maleimide resin and the thermosetting polyphenylene ether resin. Therefore, the present invention is not particularly limited as long as it is a crosslinking agent that can cure the thermosetting polyphenylene ether resin and the maleimide resin.
As a preferred embodiment of the present invention, the crosslinking agent includes an ethylenically unsaturated monomer and/or a polyolefin resin.
Preferably, the ethylenically unsaturated monomer includes any one or a combination of at least two of a vinyl group-containing compound, an allyl group-containing compound, an acenaphthylene structure-containing compound, and an isocyanurate group-containing compound.
Preferably, the ethylenically unsaturated monomer comprises any one or a combination of at least two of triallyl isocyanurate, trimethylallyl isocyanate, triallyl cyanurate, triallyl isocyanurate, diallyl phthalate, divinylbenzene, 1, 2-bis (p-vinylphenyl) ethane, or polyfunctional (meth) acrylates.
Preferably, the polyolefin resin comprises any one or a combination of at least two of polybutadiene, a styrene-butadiene copolymer, a styrene-butadiene-styrene triblock copolymer, a styrene-isoprene copolymer, a hydrogenated styrene-butadiene copolymer, a hydrogenated styrene-isoprene copolymer, a multifunctional vinyl aromatic polymer, or a vinyl cycloaliphatic polymer.
As a preferred embodiment of the present invention, the number average molecular weight of the maleimide resin is 300 to 1000, and may be, for example, 300, 400, 500, 600, 700, 800, 900 or 1000, etc., and specific point values among the above point values, the present invention is not exhaustive of the specific point values included in the range for the sake of brevity and conciseness. If the number average molecular weight of the maleimide resin is too high, the fluidity of the resin composition may be poor. The number average molecular weight of the maleimide resin is determined by gel permeation chromatography.
In the present invention, the specific choice of maleimide resin is not particularly limited, as long as maleimide resins having a number average molecular weight of 300 to 1000 are suitable.
Preferably, the maleimide resin is selected from any one or a combination of at least two of bis (3-ethyl-5-methyl-4-maleimidophenyl) methane (number average molecular weight 442), 2' -bis [4- (4-maleimidophenoxy) phenyl ] propane (number average molecular weight 570), N ' - (4, 4' -methylenediphenyl) bismaleimide (number average molecular weight 358).
As a preferred embodiment of the present invention, the silica includes any one or a combination of at least two of crystalline silica, fused silica, spherical silica, angular silica, chemical silica, hollow silica, and silica micropowder.
The particle size range of the silica is not particularly limited, and silica having a particle size within a range commonly used in the art is applicable.
As a preferred embodiment of the present invention, the resin composition further includes a radical initiator.
Preferably, the weight part of the radical initiator is 0.01 to 5 parts, for example, 0.05 parts, 0.1 parts, 0.5 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts or 4.5 parts, based on 100 parts by weight of the matrix resin, and specific point values between the above point values are not exhaustive for the sake of brevity and conciseness.
Preferably, the half-life temperature of the free radical initiator is not less than 130 ℃, for example, 132 ℃, 135 ℃, 138 ℃, 140 ℃, 142 ℃, 145 ℃ or the like.
Preferably, the radical initiator includes any one or a combination of at least two of an organic peroxide, an azo compound or a carbon-based radical initiator, and further preferably an organic peroxide.
Preferably, the organic peroxide comprises any one or a combination of at least two of dicumyl peroxide, tert-butyl peroxybenzoate, 2, 5-bis (2-ethylhexanoylperoxy) -2, 5-dimethylhexane, di (tert-butylperoxyisopropyl) benzene, 2, 4-dichlorobenzoyl peroxide, 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) hexane, tert-butyl peroxy-2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) -3-hexyne, butyl 4, 4-bis (tert-butylperoxy) valerate, 1-bis (tert-butylperoxy) -3, 5-trimethylcyclohexane, 3,5, 7-pentamethyl-1, 2, 4-trioxepane, di-tert-butyl peroxide or tert-butylcumyl peroxide.
As a preferable technical scheme of the invention, the resin composition further comprises a flame retardant according to the requirement, and the flame retardance of the resin composition can be V-0 grade after the flame retardant is added.
Preferably, the mass of the flame retardant is 0.1 to 20 parts, for example, 0.5 parts, 1 part, 3 parts, 5 parts, 7 parts, 9 parts, 10 parts, 11 parts, 13 parts, 15 parts, 17 parts or 19 parts, and specific point values among the above point values, based on 100 parts by mass of the matrix resin, are not exhaustive, and the present invention is not limited to the specific point values included in the range for brevity.
Preferably, the flame retardant includes any one or a combination of at least two of a halogen flame retardant, a phosphorus flame retardant, or a nitrogen flame retardant.
In view of the preparation and processing requirements, the resin composition further includes a solvent, and the amount of the solvent is not limited as long as the viscosity of the dope of the resin composition satisfies the processing requirements.
In the present invention, the type of the solvent is not particularly limited, and includes any one or a combination of at least two of an alcohol solvent, an ether solvent, an aromatic hydrocarbon solvent, an ester solvent, a ketone solvent, and a nitrogen-containing solvent; exemplary include, but are not limited to: methanol, ethanol, butanol, ethyl cellosolve, butyl cellosolve, ethylene glycol methyl ether, carbitol, butyl carbitol, acetone, butanone, methyl ethyl ketone, cyclohexanone, toluene, xylene, ethyl acetate, ethoxyethyl acetate, N-dimethylformamide or N, N-dimethylacetamide; the above solvents may be used alone or in combination of two or more.
Preferably, the solvent comprises any one or a combination of at least two of acetone, butanone, methyl ethyl ketone, cyclohexanone, toluene or xylene.
In the present invention, the preparation method of the resin composition is not particularly limited, and exemplary ones include, but are not limited to: and uniformly mixing all components of the resin composition to obtain the resin composition.
In a second aspect, the present invention provides a prepreg comprising a reinforcing material and a resin composition according to the first aspect;
the resin composition is attached to the reinforcing material by impregnation drying.
Preferably, the reinforcing material includes any one of an organic fiber cloth, an inorganic fiber woven cloth or a non-woven cloth.
Preferably, the reinforcing material comprises any one of glass fiber cloth, quartz glass blended cloth, glass fiber paper, non-woven cloth or organic fiber cloth; exemplary include, but are not limited to: e-glass fiber cloth, D-glass fiber cloth, S-glass fiber cloth, T-glass fiber cloth, NE-glass fiber cloth or quartz cloth.
Preferably, the organic fiber cloth comprises an aramid cloth.
Preferably, the thickness of the reinforcing material is between 0.01 and 0.2mm, for example, it may be 0.03mm, 0.05mm, 0.08mm, 0.1mm, 0.11mm, 0.13mm, 0.15mm, 0.17mm or 0.19mm, and the specific values between the above values are limited in length and for simplicity, the invention is not intended to be exhaustive of the specific values included in the range.
Preferably, the reinforcing material is subjected to a fiber opening treatment and/or a silane coupling agent treatment.
Preferably, the silane coupling agent includes any one or a combination of at least two of an epoxy silane coupling agent, an amino silane coupling agent, or a vinyl silane coupling agent.
In the invention, the preparation method of the prepreg comprises the following steps: and impregnating the reinforcing material with the resin glue solution of the resin composition, and then drying to obtain the prepreg.
Preferably, the drying temperature is 100-180 ℃, such as 105 ℃, 110 ℃, 115 ℃, 120 ℃, 125 ℃, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, 155 ℃, 160 ℃, 165 ℃, 170 ℃ or 175 ℃, etc., and specific point values between the above point values, are limited in space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range.
Preferably, the drying time is 1-10 min, such as 2min, 3min, 4min, 5min, 6min, 7min, 8min or 9min, and the specific point values among the above point values are limited in space and for brevity, the present invention is not exhaustive of the specific point values included in the range.
In a third aspect, the present invention provides a metal foil-clad laminate comprising a sheet of prepreg according to the second aspect and a metal foil coated on either or both sides of the prepreg;
alternatively, the metal foil-clad laminate comprises at least two superimposed prepregs and metal foils coated on either or both sides of the superimposed prepregs, wherein at least one of the at least two superimposed prepregs is a prepreg according to the second aspect.
Preferably, the metal foil includes any one of copper foil, nickel foil, aluminum foil, or SUS foil, and further preferably copper foil.
In the invention, the copper foil comprises any one of common copper foil, roughness copper foil or low-profile copper foil, and HVLP copper foil is preferred in the high-speed field; the thickness of the copper foil is not particularly limited.
The metal foil-clad laminate provided by the invention comprises at least one prepreg; the number of sheets of the prepreg is 1 to 20, and may be 1,2, 3,5,7, 9, 10, 11, 13, 15, 17, 19, or the like, for example.
In the present invention, the side of the metal foil contacting the prepreg may be further provided with a silane coupling agent layer, and the side of the metal foil away from the prepreg is not particularly limited and may be provided with or without a silane coupling agent layer.
Preferably, the method for disposing the silane coupling agent layer on one side of the metal foil includes: and coating the silane coupling agent solution on the metal foil, and drying to obtain the silane coupling agent layer.
In the present invention, the method for producing the metal foil-clad laminate is not particularly limited, and any production method commonly used in the art is used. The method for preparing the metal foil-clad laminated board provided by the invention comprises the following steps of: pressing metal foil on one side or two sides of a piece of prepreg, and curing to obtain the metal foil-clad laminated board; or, laminating at least two prepregs on a laminated board, laminating metal foils on one side or two sides of the laminated board, and curing to obtain the metal foil-clad laminated board; the side of the metal foil, which is contacted with the prepreg, is provided with a silane coupling agent layer.
Preferably, the curing temperature is 200-250 ℃, such as 205 ℃, 210 ℃, 212 ℃, 215 ℃, 218 ℃, 220 ℃, 223 ℃, 225 ℃, 228 ℃, 230 ℃, 235 ℃, 240 ℃ or 245 ℃, etc., and specific point values between the above point values, are limited in space and for the sake of brevity, the present invention is not exhaustive of the specific point values included in the range, more preferably 210-230 ℃.
Preferably, the curing pressure is 10 to 60kg/cm 2 For example 15kg/cm 2 、20kg/cm 2 、25kg/cm 2 、30kg/cm 2 、35kg/cm 2 、40kg/cm 2 、45kg/cm 2 、50kg/cm 2 Or 55kg/cm 2 Etc., as well as specific point values between the above-mentioned point values, are limited in space and for the sake of brevity, the present invention is not intended to exhaustively list the specific point values encompassed by the described range.
In a fourth aspect, the present invention provides a printed wiring board comprising at least one metal foil-clad laminate according to the third aspect.
Compared with the prior art, the invention has the following beneficial effects:
(1) According to the metal foil-clad laminated board provided by the invention, through designing the components of the resin composition, the problem of poor binding force between a polyphenyl ether resin system and a metal foil is solved, the binding strength between the resin composition and the metal foil is obviously improved, the fluidity is obviously increased, the peeling strength between the resin composition and common copper foil A of different manufacturers is more than or equal to 0.70N/mm, the lowest melting viscosity of the metal foil-clad laminated board is less than or equal to 1300Pa & s, the dielectric constant of 10GHz is 3.78-3.92, and the dielectric loss factor is less than or equal to 0.0038.
(2) The metal foil-clad laminated board provided by the invention has excellent heat resistance, dielectric property and reliability, and good fluidity and processability, and fully meets the requirements of high-frequency high-speed electronic circuit substrates on comprehensive performances such as low dielectric loss, high copper foil heat resistance, high peeling strength and the like.
Detailed Description
To facilitate understanding of the present invention, examples are set forth below. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
Some of the components in the following examples and comparative examples are shown in Table 1 below:
TABLE 1
Example 1-example 14, comparative example 1-comparative example 6
Examples 1-14, comparative examples 1-6 provided a resin composition and a metal foil-clad laminate, respectively, the specific composition of the resin composition and the amounts of the respective components are shown in tables 2 and 3 below (the amounts of the respective components in tables 2 and 3 are parts by weight);
the preparation method of the metal foil-clad laminated plate comprises the following steps:
(1) Glue mixing
The resin composition was obtained by adding the components in the proportions shown in Table 2 and adding a proper amount of a solvent so that the solid content of the glue became 65%, and mechanically stirring for 4 hours to dissolve and age.
(2) Preparation of prepregs
And (3) pre-soaking the glass fiber cloth subjected to the methyl propenyl treatment in the resin composition obtained in the step (1), removing part of liquid resin through a rolling clamping shaft, controlling the resin on the glass fiber cloth to be about 65%, and drying the glass fiber cloth in an oven at 145 ℃ for 5min to obtain the prepreg.
(3) Preparation of copper-clad plate
Different copper foils (as shown in tables 2 and 3) were prepared, 5 prepregs obtained in step (2) were laminated, four sides were well-stacked, and one prepared copper foil was coated on each of the upper and lower surfaces of the laminate, and then the laminate was put into a laminator, and laminate curing was performed under the following conditions:
heating the laminating machine to 90 ℃ and applying full pressure with the full pressure of 30kgf/cm 2 The method comprises the steps of carrying out a first treatment on the surface of the And continuously heating to 120 ℃, controlling the temperature rising rate of the material at 2 ℃/min until reaching 220 ℃, maintaining for 120min, and curing to obtain the copper-clad plate.
Performance testing
The metal foil-clad laminates provided for examples 1-14 and comparative examples 1-6 were tested according to the following requirements:
(1) Dielectric constant (Dk) and dielectric loss tangent (Df): the measurement was performed at 10GHz using the separation medium column resonator (SPDR) method according to the method prescribed by IPC-TM-650.2.5.5.13.
(2) Minimum melt viscosity (P-chip test): the test was performed using a An Dongpa rheometer MCR301 at a 3 ℃/min ramp rate. The lowest point of the viscosity curve drawn by the instrument is the lowest melt viscosity of the sample.
(3) Peel strength (a state): IPC-TM-650; peeling strength tester
The results of the performance tests are shown in tables 2 and 3 below.
TABLE 2
TABLE 3 Table 3
As is clear from the above, in the metal foil-clad laminate provided by the invention, the problem of poor binding force between a polyphenyl ether resin system and a metal foil is solved in a targeted manner by designing the components of the resin composition, the binding strength between the resin composition and the metal foil is remarkably improved, the fluidity is remarkably increased, the peeling strength between the resin composition and an ordinary copper foil A state of different manufacturers is more than or equal to 0.70N/mm, the lowest melting viscosity of the metal foil-clad laminate is less than or equal to 1300 Pa.s, specifically 1000-1300 Pa.s, the dielectric constant of 10GHz is 3.78-3.92, and the dielectric loss factor is less than or equal to 0.0038.
As is clear from comparison of the data relating to examples 1 to 10 and examples 11 and comparative examples 1 to 5, in the present invention, by designing the components of the resin composition, by using a maleimide resin and a specific silane coupling agent and controlling the number average molecular weight of the maleimide resin within a specific range, a resin composition excellent in performance was produced, and if the components of the resin composition were not within the range claimed in the present invention, the overall performance of the produced resin composition was poor. Comparative example 5 uses only the phenylamino silane coupling agent-treated silica, but does not add the phenylamino silane coupling agent and/or vinyl silane coupling agent to the resin composition, and the coupling agent acts on the filler, which cannot effectively improve the peel strength of the resin and the copper foil.
As is clear from the comparison of the data relating to examples 1 to 10 and comparative examples 6 to 7, if the amount of maleimide resin used in the resin composition is too small (comparative example 6), the fluidity of the resulting resin composition is poor and the peel strength is low; if the amount of maleimide resin in the resin composition is too large (comparative example 7), the resulting metal foil-clad laminate has poor dielectric properties.
As is clear from the comparison of the data relating to examples 1 to 10 and comparative examples 8 to 9, if the amount of the silane coupling agent in the resin composition is too small (comparative example 8), the bonding force of the resin composition to the metal foil is poor and the peel strength is low; if the amount of the silane coupling agent used in the resin composition is too large (comparative example 9), the fluidity of the resulting resin is poor, and the metal foil-clad laminate thus produced has poor dielectric properties.
In summary, the metal foil-clad laminated board prepared by designing the components of the resin composition has excellent heat resistance, dielectric property and reliability, and has good fluidity and processability, thereby fully meeting the requirements of high-frequency high-speed electronic circuit base materials on the comprehensive properties such as low dielectric loss, high copper foil heat resistance, high peeling strength and the like.
The applicant states that the detailed process flow of the present invention is illustrated by the above examples, but the present invention is not limited to the above detailed process flow, i.e. it does not mean that the present invention must be implemented depending on the above detailed process flow. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of raw materials for the product of the present invention, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present invention and the scope of disclosure.
Claims (10)
1. The resin composition is characterized by comprising the following components in parts by weight:
the matrix resin comprises 40-80 parts by weight of thermosetting polyphenyl ether resin and 20-60 parts by weight of cross-linking agent;
the silane coupling agent comprises an anilino silane coupling agent and/or a vinyl silane coupling agent.
2. The resin composition according to claim 1, wherein the thermosetting polyphenylene ether resin is a thermosetting polyphenylene ether resin having an unsaturated group at a terminal position;
preferably, the unsaturated group comprises at least any one of vinylbenzyl, vinylphenyl, or acrylate groups, or a combination of at least two thereof;
preferably, the thermosetting polyphenylene ether resin has a number average molecular weight of 500 to 10000.
3. The resin composition according to claim 1 or 2, wherein the crosslinking agent comprises an ethylenically unsaturated monomer and/or a polyolefin resin;
preferably, the ethylenically unsaturated monomer comprises any one or a combination of at least two of a vinyl group-containing compound, an allyl group-containing compound, an acenaphthylene structure-containing compound, and an isocyanurate group-containing compound;
preferably, the ethylenically unsaturated monomer comprises any one or a combination of at least two of triallyl isocyanurate, trimethylallyl isocyanate, triallyl cyanurate, triallyl isocyanurate, diallyl phthalate, divinylbenzene, 1, 2-bis (p-vinylphenyl) ethane, or polyfunctional (meth) acrylate;
preferably, the polyolefin resin comprises any one or a combination of at least two of polybutadiene, a styrene-butadiene copolymer, a styrene-butadiene-styrene triblock copolymer, a styrene-isoprene copolymer, a hydrogenated styrene-butadiene copolymer, a hydrogenated styrene-isoprene copolymer, a multifunctional vinyl aromatic polymer, or a vinyl cycloaliphatic polymer.
4. A resin composition according to any one of claims 1 to 3, wherein the maleimide resin has a number average molecular weight of 300 to 1000.
5. The resin composition according to any one of claims 1 to 4, wherein the silica comprises any one or a combination of at least two of crystalline silica, fused silica, spherical silica, angular silica, chemical silica, hollow silica, and silica micropowder.
6. The resin composition according to any one of claims 1 to 5, further comprising a radical initiator;
preferably, the weight part of the radical initiator is 0.01 to 5 parts based on 100 parts by weight of the matrix resin.
7. The resin composition according to any one of claims 1 to 6, further comprising a flame retardant;
preferably, the flame retardant is 0.1 to 20 parts by mass based on 100 parts by mass of the matrix resin.
8. A prepreg comprising a reinforcing material and the resin composition of any one of claims 1 to 7;
the resin composition is attached to the reinforcing material by impregnation drying.
9. A metal foil-clad laminate comprising a sheet of the prepreg of claim 8 and a metal foil coated on either or both sides of the prepreg;
alternatively, the metal foil-clad laminate comprises at least two superimposed prepregs and metal foils coated on either or both sides of the superimposed prepregs, wherein at least one of the at least two superimposed prepregs is a prepreg according to claim 8.
10. A printed circuit board comprising at least one prepreg according to claim 8.
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