CN115286917B - High-speed low-consumption resin composition containing benzocyclobutene resin and application thereof - Google Patents

High-speed low-consumption resin composition containing benzocyclobutene resin and application thereof Download PDF

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CN115286917B
CN115286917B CN202211139385.0A CN202211139385A CN115286917B CN 115286917 B CN115286917 B CN 115286917B CN 202211139385 A CN202211139385 A CN 202211139385A CN 115286917 B CN115286917 B CN 115286917B
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resin
compound
resin composition
benzocyclobutene
derivative
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CN115286917A (en
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邓万能
陈功田
李海林
张桢
桂鹏
文经豪
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Chenzhou Gongtian Electronic Ceramics Technology Co ltd
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Chenzhou Gongtian Electronic Ceramics Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention provides a high-speed low-consumption resin composition containing benzocyclobutene resin, which comprises the following components: a resin compound A, a benzocyclobutene compound B, a derivative B and an accelerator C; wherein the molecular structure of the resin compound A at least comprises a structure shown in a formula (1) in the specification: the cured product of the resin composition has the advantages of low dielectric constant, low dielectric loss, excellent heat resistance, good processability and the like. The present invention also provides a prepreg, a film, a metal foil, a laminate and a wiring board each comprising the resin composition.

Description

High-speed low-consumption resin composition containing benzocyclobutene resin and application thereof
Technical Field
The invention relates to the technical field of resin compositions, in particular to a high-speed low-consumption resin composition containing benzocyclobutene resin and application thereof.
Background
With the increase in information processing capacity, various electronic devices are rapidly being mounted with high integration of mounted semiconductor devices, high density of wiring, and multi-layered mounting technologies. Further, as wiring boards used in various electronic devices, wiring boards for coping with high frequencies such as millimeter wave radar boards in vehicle-mounted applications are also demanded. In order to increase the transmission speed of signals and reduce the loss during signal transmission, a substrate material used as a base material for forming wiring boards used in various electronic devices is required to have a low dielectric constant and a low dielectric loss tangent.
It is known that polyphenylene ether has excellent dielectric characteristics such as dielectric constant and dielectric loss tangent, and also has excellent dielectric characteristics in a high frequency range (high frequency range) from MHz to GHz. For this reason, polyphenylene ether has been studied for use as a molding material for high frequency applications, for example. More specifically, polyphenylene ether has been studied for use as a substrate material or the like for a base material constituting a printed wiring board provided in an electronic device utilizing a high frequency band.
On the other hand, when used as a molding material such as a substrate material, it is required to have excellent heat resistance, moldability, and the like as well as excellent dielectric characteristics. In this regard, since polyphenylene ether is thermoplastic, sufficient heat resistance may not be obtained. On the other hand, when used as a molding material such as a substrate material, it is required to have excellent dielectric characteristics and heat resistance. Therefore, it is considered to modify polyphenylene ether to improve heat resistance.
Examples of the substrate material include: prepregs, laminates, and the like using the modified polyphenylene ether-containing resin composition. Patent document 1 describes a prepreg and a laminate using the polyphenylene ether resin composition, which comprises: polyphenylene ether having a polyphenylene ether moiety in the molecular structure, having a vinylbenzyl group or the like at the molecular terminal thereof, and having a number average molecular weight of 1000 to 7000: a curable cross-linking agent. Generally, TAIC is used as a curing type crosslinking agent, and a laminate having high heat resistance, moldability and the like without lowering dielectric characteristics can be obtained, but it has drawbacks such as high water absorption and large loss after moisture absorption. With the development of the age, in order to further increase the transmission speed of signals while pursuing high heat resistance, it is required to further reduce the loss at the time of signal transmission, and therefore, a substrate is required to have not only excellent heat resistance but also more excellent dielectric characteristics.
In general, polyphenylene ether has a relatively high molecular weight and a high softening point, and therefore tends to have a high viscosity and low fluidity. When a prepreg used for manufacturing a multilayer printed wiring board or the like is formed using such a polyphenyl, and a printed wiring board is manufactured using the prepreg thus formed, there is a possibility that a problem of formability, that is, a forming defect such as a void may occur at the time of manufacturing, for example, at the time of multilayer forming, is caused, and it is difficult to manufacture a highly reliable printed wiring board.
Accordingly, in order to suppress the occurrence of such problems, the present inventors have studied to use polyphenylene ether having a relatively low molecular weight. However, according to the studies by the present inventors, when such polyphenylene ether having a reduced molecular weight is used in a simple manner, the curing of the resin composition is insufficient and the heat resistance of the cured product tends to be insufficient even when the polyphenylene ether is used in combination with a thermosetting resin or the like.
Further, patent document 1 (publication No. CN 100547033) discloses that a modified polyphenylene ether compound can be produced, which can maintain excellent dielectric properties and can improve solder heat resistance and formability. Further, patent document 2 (publication No. JP 2004339328A) discloses that a polyphenylene ether resin composition which can produce a laminate having high heat resistance and moldability can be produced even if a polyphenylene ether having a small molecular weight is used for the purpose of producing a prepreg without deteriorating dielectric characteristics.
Further, it is required to further improve the heat resistance and moldability of the cured product as compared with the case of using the modified polyphenylene ether compound disclosed in patent document 1 and patent document 2. That is, it is required to have dielectric characteristics possessed by polyphenylene ether and to further improve heat resistance and moldability of a cured product.
Therefore, in order to further improve the moldability and heat resistance of the cured product, there is a demand for a modified polyphenylene ether compound which is excellent in not only reactivity contributing to the curing reaction but also storage stability, and which is low in viscosity and excellent in fluidity.
Disclosure of Invention
Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a high-speed low-consumption resin composition containing a benzocyclobutene resin, which has advantages of low dielectric constant, low dielectric loss, excellent heat resistance, and good processability. The present invention also provides a prepreg, a film, a metal foil, a laminate and a wiring board each comprising the resin composition.
The present invention provides a novel resin composition having excellent heat resistance, dielectric properties, peeling resistance, and the like as compared with conventional resin compositions, and the applicant has found that the selection of a crosslinking agent has a large influence on the dielectric properties, and the like, of the resin composition. When a crosslinking agent containing a cyano group, an ester group, an amino group or the like is used, the dielectric constant and dielectric loss properties of the final resin composition are poor. The reason is presumed to be that: when the crosslinking agent containing a cyano group, an ester group, an amino group or the like is used, the final cured product of the resin composition contains a large amount of highly polar groups, and highly polar groups such as ether groups are formed in the final cured product of the resin composition, which deteriorates the dielectric properties of the final cured product of the resin composition. Thus, the present invention creates the following summary by using benzocyclobutene compounds and derivatives thereof as a crosslinking agent.
A high-speed low-consumption resin composition containing benzocyclobutene resin, comprising:
the molecular structure of the resin compound A at least comprises a structure shown in the following formula (1), a benzocyclobutene compound and a derivative B thereof, an accelerator C,
in the formula (1), R 1 -R 4 Each independently selected from hydrogen atom, alkyl, alkenyl, alkynyl, halogenated hydrocarbon and the like, R 1 -R 4 May be identical or partially identical or different from each other.
Further, R is as described above 1 -R 4 The alkyl group of (2) is not particularly limited. Preferably containing at least one arylene or benzylene group. Preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms.
Further, the arylene group or the benzylene group is not particularly limited. The arylene or benzylidene group includes monocyclic aromatic groups and non-monocyclic polycyclic aromatic groups, and also includes derivatives in which a hydrogen atom bonded to an aromatic ring is substituted with other hydrocarbon groups or acyl groups.
For the above resin composition: the resin compound A is crosslinked with the benzocyclobutene compound and the derivative B thereof under the action of the accelerator C to obtain a cured product with high heat resistance. Consider that: the benzocyclobutene compound and the derivative B thereof are subjected to crosslinking reaction, so that high-polarity bonds such as ether bonds and CN are difficult to generate, and a cured product with low dielectric constant and low dielectric loss can be obtained.
Further, the resin compound a is a modified polyphenylene ether compound having at least one molecular structure in the above formula (1) in its molecular structure or a polymer having a unit of the following formula (3) in its molecule;
in the formula (3), R 1 -R 4 、R 6 -R 8 Each independently selected from hydrogen atom, alkyl, alkenyl, alkynyl, halogenated hydrocarbon, etc., i.e. R 1 -R 4 、R 6 -R 8 The groups may be the same or different. In particular, R 6 -R 8 Preferably a hydrogen atom or a hydrocarbon group having 1 to 7 carbon atoms.
Further, the resin compound a may have a group represented by the formula (1), and the atom to which the group is bonded is not particularly limited, and includes, but is not limited to, modified polyphenylene ether, styrene and its derivatives, divinylbenzene and its oligomers, low-molecular or high-molecular weight homopolymers or copolymers such as acenaphthylene, butadiene/styrene/divinylbenzene, and its modified forms, and maleimide compounds. The resin compound a may be used alone or in combination of two or more.
The modified polyphenylene ether compound is not particularly limited as long as it has a structure of the group represented by the formula (1) at the molecular terminal.
Further, the modified polyphenylene ether compound has a polyphenylene ether chain in the molecule, and is preferably a modified polyphenylene ether compound having the following structural formula (4), particularly preferably model SA9000 of Sabic corporation.
In the formula (4), m represents a range of 1 to 80, R 9 -R 12 Are each independently selected from a hydrogen atom or any other group. Preferred R 9 -R 12 Are independent hydrogen atoms or alkyl groups.
The modified polyphenylene ether compound may be a graft modified compound having a structural unit of the formula (6) or a modified compound such as a block modified compound or a terminal group modified compound.
The modified polyphenylene ether compound may be used alone or in combination of two or more.
The benzocyclobutene compound and the derivative B thereof are not particularly limited as long as they contain the structure represented by the above formula (2).
In the formula (2), R 5 Can be optionally substituted;
preferably, R 5 Including independent hydrogen atoms or other groups or atoms;
more preferably, R 5 Is hydrocarbon or organic silicon resin.
Further, the benzocyclobutene compound and the derivative B thereof may be used alone or in combination of two or more.
Further, the benzocyclobutene compound and the derivative B thereof are preferably a compound represented by the following formula (5).
Further, the promoter C includes, but is not limited to, peroxy compounds and derivatives thereof, azo compounds and derivatives thereof, metal organic catalysts.
Preferably, the accelerator C is an azo compound and its derivatives. Particularly preferred are azo compounds which do not contain heteroatoms other than azo groups.
In addition, as the above-mentioned accelerator C, the above-mentioned compounds may be used alone or in combination of two or more.
Further, the mass fraction of the resin compound a is preferably 50 to 95 parts, more preferably 60 to 95 parts, relative to 100 parts by mass of the total of the resin compound a and the benzocyclobutene compound and the derivative B thereof.
The benzocyclobutene compound and the derivative B thereof are preferably 5 to 50 parts by mass, more preferably 5 to 40 parts by mass, relative to 100 parts by mass of the total of the resin compound a and the benzocyclobutene compound and the derivative B thereof.
The content of the accelerator C is preferably 0.01 to 2 parts, more preferably 0.1 to 1 part, based on 100 parts by mass of the total of the resin compound a and the benzocyclobutene compound and the derivative B thereof.
The contents of the resin compound A, the benzocyclobutene compound and the derivative B thereof, and the accelerator C are within the above ranges, and a cured product having excellent dielectric properties, heat resistance, and peeling resistance can be obtained. In addition, if the content of the resin compound a, the benzocyclobutene compound and the derivative B thereof, and the accelerator C is too small, the heat resistance may be lowered.
The resin composition according to the present invention may further contain components other than the resin compound a, the benzocyclobutene compound and its derivative B, and the accelerator C, as long as the effects of the present invention are not impaired. Other components added as the resin composition of the present invention may include, but are not limited to, additives such as a silane coupling agent, a flame retardant, an antifoaming agent, an antioxidant, a heat stabilizer, an antistatic agent, an ultraviolet absorber, a dye or pigment, a lubricant, a filler, and the like. The resin composition may contain a thermosetting resin such as an epoxy resin, an unsaturated polyester resin, a thermosetting polyimide resin, and an unsaturated hydrocarbon resin, in addition to the resin compound a.
Further, a silane coupling agent may be contained in the resin composition of the present invention. The silane coupling agent may be contained in the resin composition, and preferably, the surface of the filler may be pretreated, and more preferably, the surface of the filler may be pretreated, and the silane coupling agent may be contained in the resin composition. In addition, the prepreg may contain a coupling agent for surface pretreatment of the fibrous substrate.
The silane coupling agent is not particularly limited, and may be a compound having one of a vinyl group, a styryl group, a methacryloyl group, an acryl group, and a phenylamino group as a reactive group, and having a hydrolyzable group such as a methoxy group or an ethoxy group. In addition, as the silane coupling agent, it may be used alone or in combination of two or more.
In the present invention, the flame retardancy of the cured product of the resin composition can be improved by adding the flame retardant. The flame retardant is not particularly limited. Including but not limited to halogen based flame retardants, phosphorus based flame retardants, nitrogen based flame retardants, etc., for example, bromine based halogen flame retardants such as decabromodiphenyl ether, hexabromobenzene, decabromodiphenyl ethane, ethylene bis tetrabromophthalimide, etc., for example, phosphorus based flame retardants such as tris (2, 6-dimethylphenyl) -phosphine, phenoxyphosphazene, xylylene bis (diphenylphosphino) and hypophosphite, etc. In addition, as the flame retardant, it may be used alone or in combination of two or more.
As described above, the resin composition of the present invention may contain a filler such as an inorganic filler. The filler is not particularly specified, and may be added to improve flame retardancy and heat resistance of a cured product of the resin composition. Including but not limited to silica such as spherical silica, metal oxides such as alumina, metal hydroxides such as aluminum hydroxide, aluminum borate, calcium carbonate, and the like. As the filler, silica or the like is preferable, and spherical silica or the like is more preferable. In addition, as the filler, two or more kinds may be used singly or in combination. The filler may be used as it is, or may be used after surface treatment with a silane coupling agent. In particular, when the filler is contained, the filler content thereof is preferably 30 to 270 parts by mass, more preferably 50 to 250 parts by mass, relative to the mass of the aforementioned resin composition.
The method for producing the resin composition is not particularly limited. The resin compound a, the benzocyclobutene compound and its derivative B, and the accelerator C are mixed under conditions that the contents are specified, and the method is not particularly limited. In general, after the above-mentioned resin composition is obtained, the following methods and the like are exemplified.
The invention also provides a prepreg, a metal foil-clad laminate, a wiring board, a metal foil with copper foil and a film with resin, which contain the resin composition containing benzocyclobutene resin.
Prepreg material
Embodiments of the present invention contemplate prepregs comprising: the resin composition or the semi-cured product of the resin composition, and a fiber-based material.
The prepreg is a substance obtained by curing a portion of the resin composition to a state that can be further cured. The resin composition or the resin composition prepreg may be obtained by drying the resin composition or by heat drying.
In the production of the prepreg, the resin composition is often formulated into a resin varnish, and a fiber-based material is attached by dipping or coating.
In the production of varnishes of the above-mentioned resin compositions, in many cases, the above-mentioned resin compositions are dissolved in a suitable solvent, and if necessary, the resin compositions may be heated and dispersed in a prescribed dispersion state by means of a ball mill, a bead mill, a homogenizer, an emulsifying machine or the like. In particular, the solvent is not particularly required as long as it can dissolve the resin compound a, the benzocyclobutene compound and its derivative B, and the accelerator C, and does not react with any of them or inhibit the curing reaction of the resin composition.
The fiber-based material may be specifically glass cloth, aramid cloth, polyester cloth, glass nonwoven fabric, aramid nonwoven fabric, polyester nonwoven fabric, pulp paper, cotton woven fabric, or the like. Preferably, the glass cloth provides the laminate with more excellent mechanical properties, more preferably the glass cloth is subjected to a fiber-opening treatment.
The method for producing the prepreg is not particularly limited as long as the prepreg can be produced.
Metal foil-clad laminate
Embodiments of the present invention contemplate a metal foil-clad laminate comprising: and a metal foil coated on one or both surfaces of the insulating layer and the insulating layer of the cured resin composition or the cured prepreg. The type and thickness of the metal foil are not particularly limited, depending on the actual requirements. The thickness of the metal foil may preferably be 0.2-105 μm, and the kind of metal foil may include, but is not limited to, copper foil, aluminum foil, etc.
As a method for producing the metal foil-clad laminate, there is no particular need as long as the metal foil-clad laminate can be produced.
The resin composition of the present invention can produce a cured product of the resin composition having low dielectric properties and high heat resistance. Therefore, the metal foil-clad laminate having the insulating layer cured from the resin composition of the present invention is also a metal foil-clad laminate having low dielectric properties and high heat resistance. In particular, the metal foil-clad laminate having the insulating layer cured from the resin composition of the present invention can be used for producing a wiring board having low dielectric properties and high heat resistance.
Wiring board
The wiring board according to the embodiment of the present invention should include: and a wiring formed by metal foil covering the etched part of the insulating layer of the cured resin composition or the cured prepreg with one or both surfaces of the insulating layer.
As a method for manufacturing a wiring board, there is no particular need as long as the wiring board can be manufactured.
The wiring board of the present invention is a wiring board having low dielectric properties and high heat resistance.
Resin-coated metal foil
Embodiments of the present invention contemplate that the metal foil with resin should include: an insulating layer and a metal foil of the resin composition or the cured product of the resin composition. The insulating layer may contain the resin composition or the cured product of the resin composition, may or may not comprise a fibrous substrate. The resin composition or the resin composition prepreg may be obtained by drying the resin composition or by heat drying.
The resin-coated metal foil may be covered with a release film as needed to prevent contamination and damage. The release film is not particularly limited as long as it does not react with the insulating layer and can be separated from the insulating layer and does not remain.
As a method for producing the resin-coated metal foil, there is no particular need as long as the resin-coated metal foil can be produced.
Resin-coated film
Embodiments of the present invention contemplate that a film with resin should comprise: a resin layer and a support film of the resin composition or a cured product of the resin composition. The resin layer may or may not include a fibrous base material as long as it includes the resin composition or the cured product of the resin composition. The resin composition or the resin composition prepreg may be obtained by drying the resin composition or by heat drying. The support film is not particularly limited as long as it does not react with the insulating layer and can be separated from the insulating layer, and does not remain.
The resin-coated film may be covered with a release film as needed to prevent contamination and damage. The release film is not particularly limited as long as it does not react with the insulating layer and can be separated from the insulating layer and does not remain.
The method for producing the resin-coated film is not particularly limited as long as the resin-coated film can be produced.
Compared with the prior art, the invention has the following beneficial effects:
the cured product of the resin composition has excellent heat and humidity resistance, higher glass brick change temperature, lower dielectric constant, lower dielectric loss, lower expansion coefficient and excellent heat resistance, and simultaneously has good processability, thereby being capable of fully meeting the requirements of high-performance printed circuit boards on high frequency and high speed.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The details of the materials used in the examples of the present invention are shown in Table 1 below
Table 1 statistics of materials
Preparation method and performance test
And dissolving a series of other auxiliary agents such as the resin compound A, the curing crosslinking agent B, the accelerator C and the like in a toluene and ketone mixed solvent, and fully stirring and adjusting the mixture to be suitable for viscosity. The resin glue solution is soaked with 1078 glass fiber cloth to make the single weight suitable, and the resin glue solution is dried in an oven to remove toluene and ketone solvents, so that 1078 prepreg is prepared, and the glue content is ensured to be about 65%. 6 pieces of 1078 prepreg are overlapped, copper foil with the thickness of HoZ is matched on the upper surface and the lower surface, the copper foil is subjected to vacuum lamination and solidification in a press for 120min, the solidification pressure is 3MPa, the solidification temperature is 210 ℃, and the high-speed copper-clad plate is prepared, and the performance of the plate is shown in table 2 and table 3.
Glass transition temperature (DMA) (Tg)
The Tg of the prepreg was determined using a dynamic thermo-mechanical analyzer "DMA850" manufactured by TA. At this time, dynamic viscoelasticity measurement (DMA) was performed with the flexural modulus at a frequency of 1Hz, and tan. Delta. At a temperature rise rate of 5 ℃/min from room temperature to 300℃was set as Tg, and the measured data are shown in tables 2 and 3.
Glass transition Temperature (TMA) (Tg)
When the evaluation board was manufactured, a copper foil-clad laminate (metal foil-clad laminate) having a thickness of about 0.8mm and a copper foil having a thickness of 18 μm bonded to both surfaces was obtained by setting the number of prepreg sheets to 6. The copper foil on both sides of the formed copper clad laminate was removed by etching. For the laminate for evaluation thus obtained, glass transition temperature (Tg) by TMA method was evaluated in accordance with IPCTM 650. The measurement was performed using a thermo-mechanical analysis (TMA) apparatus (TMAQ 400 manufactured by TA), and the measurement was performed at a temperature in the range of 40 to 260℃and the measured data are shown in tables 2 and 3.
Heat resistance (TMA method: T-300)
When the evaluation board was manufactured, a copper foil-clad laminate (metal foil-clad laminate) having a thickness of about 0.8mm and a copper foil having a thickness of 18 μm bonded to both surfaces was obtained by setting the number of prepreg sheets to 6. The heat resistance of the above-mentioned evaluation substrate was evaluated by measuring the delamination time at 300℃in accordance with IPC-TM-650, and the measured data are shown in tables 2 and 3.
Copper foil peel strength
When the evaluation board was manufactured, a copper foil-clad laminate (metal foil-clad laminate) having a thickness of about 0.8mm and a copper foil having a thickness of 18 μm bonded to both surfaces was obtained by setting the number of prepreg sheets to 6. The copper foil on both sides of the formed copper clad laminate was treated with a 3 mm-characteristic tape, the remaining copper foil was removed by etching, and the sample was tested using a peel strength tester, and the data are shown in tables 2 and 3.
Water absorption rate
The water absorption rate of the film was measured at 2MPa and 120℃for 180 minutes using a high-pressure accelerated aging tester, and the measured data are shown in tables 2 and 3.
Dielectric loss factor
Dielectric loss factors of the evaluation substrates at 10GHz and 15GHz were measured by a cavity perturbation method. Specifically, dielectric loss factors of the evaluation substrates at 10GHz and 15GHz were measured using a network analyzer (E5071C manufactured by Keysight Technologies corporation), and the measured data are shown in tables 2 and 3.
Table 2 performance test table
TABLE 3 Table 3
As can be seen from tables 2 and 3: (examples 1, 5, 6) the weight ratio of the resin compound A and the crosslinking curing agent B was 65:35, the ratio of the accelerator C is 0.8 part by weight of the sum of the resin compound A and the crosslinking curing agent B, and when the accelerator C is an azo initiator having no hetero nitrogen atom other than azo group, the dielectric loss can be reduced because the-CN group polarity is large and the dielectric loss is reduced after the azo initiator having no hetero nitrogen atom other than azo group is used. The peroxide initiator has a group with large polarity of-OH generated in the reaction, so the dielectric loss is high. In addition, the board also has low water absorption, high interlayer adhesion and high glass transition temperature.
As can be seen from tables 2 and 3: (examples 1, 6 to 10) the weight ratio of the resin compound A and the crosslinking curing agent B was 65:35, the ratio of the accelerator C is 0.1 part by weight, 0.8 part by weight, and 2.0 parts by weight of the sum of the resin compound a and the crosslinking curing agent B, and the accelerator C is an azo initiator having no hetero nitrogen atom other than azo group, and when the amount of the accelerator C is 0.1 part by weight, a low dielectric loss can be obtained in the high-speed circuit board, but the heat resistance is poor. When the weight part of the initiator is 2.0, the heat resistance is improved, but the dielectric property is not good. This means that the content of the accelerator C should preferably be 0.01 to 2 parts, more preferably 0.1 to 1 part by weight.
As can be seen from tables 2 and 3: (examples 1, 11, 12) the weight ratio of the resin compound A and the crosslinking curing agent B was 60:35, the ratio of the accelerator C is 0.8 part by weight of the sum of the resin compound a and the crosslinking type curing agent B, and when the accelerator C is an azo initiator having no hetero nitrogen atom other than azo group, the high-speed circuit board can obtain low dielectric loss, and the weight ratio of the resin compound a and the crosslinking type curing agent B is 95:5, the electrical properties are excellent but the heat resistance is insufficient. The weight parts of the resin compound A and the crosslinking curing agent B are 50: at 50, the heat resistance is high, but the dielectric properties are poor. This means that the ratio of the resin compound A to the crosslinking curing agent B in parts by weight is preferably 50:50 to 95:5, more preferably 60:40 to 95:5.
as can be seen from tables 2 and 3: (comparative examples 1 to 5) the weight ratio of the resin compound a and the crosslinking curing agent B was 65: when DVSBCB is used as the crosslinking curing agent B, 0.8 part of the sum of the parts by weight of the resin compound a and the crosslinking curing agent B is used as the accelerator C, and the azo initiator having no hetero nitrogen atom other than azo group is used as the accelerator C, the high-speed circuit board can obtain lower dielectric loss and high heat resistance, because the DVSBCB as the crosslinking curing agent has better electrical and thermal properties than the other four crosslinking curing agents, so that the board can obtain lower water absorption, lower dielectric loss and high glass transition temperature performance.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (4)

1. A high-speed low-consumption resin composition containing benzocyclobutene resin, characterized by comprising:
a resin compound A, a benzocyclobutene compound B, a derivative B and an accelerator C;
wherein the resin compound A is SA9000 produced by Sabic or ODV-XET X04 produced by Nissan chemical materials Co., ltd;
the benzocyclobutene compound and the derivative B thereof include compounds represented by the following formula (5):
the ratio of the resin compound A to the benzocyclobutene compound and the derivative B thereof is 50-90%, and the ratio of the benzocyclobutene compound and the derivative B thereof is 10-50%; the accelerator C accounts for 0.01-2% of the mixture of the resin compound A and the benzocyclobutene compound and the derivative B thereof.
2. The high-speed low-consumption resin composition comprising benzocyclobutene resin of claim 1, wherein the accelerator C comprises any one or a mixture of a peroxy compound and its derivative, an azo compound and its derivative, and a metal-organic catalyst.
3. The high-speed low-consumption resin composition comprising a benzocyclobutene resin of claim 2, further comprising: silane coupling agents, flame retardants, defoamers, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, dyes or pigments, lubricants, and fillers.
4. Use of a benzocyclobutene resin-containing high-speed low-consumption resin composition as claimed in claim 3 for the preparation of prepregs, films, metal foils, laminates and wiring boards.
CN202211139385.0A 2022-09-19 2022-09-19 High-speed low-consumption resin composition containing benzocyclobutene resin and application thereof Active CN115286917B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054119A (en) * 2003-08-06 2005-03-03 Sumitomo Bakelite Co Ltd Resin composition
CN101226786A (en) * 2007-12-14 2008-07-23 华南理工大学 Low dielectric constant composite and preparation method thereof
JP2009212260A (en) * 2008-03-04 2009-09-17 Fujifilm Corp Film
CN111647247A (en) * 2020-05-29 2020-09-11 上海材料研究所 Resin composition for high-frequency high-speed copper-clad plate and application thereof
CN114736096A (en) * 2021-05-21 2022-07-12 华为技术有限公司 Benzocyclobutene monomer, benzocyclobutene resin, preparation of benzocyclobutene resin, low dielectric material and application of low dielectric material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005054119A (en) * 2003-08-06 2005-03-03 Sumitomo Bakelite Co Ltd Resin composition
CN101226786A (en) * 2007-12-14 2008-07-23 华南理工大学 Low dielectric constant composite and preparation method thereof
JP2009212260A (en) * 2008-03-04 2009-09-17 Fujifilm Corp Film
CN111647247A (en) * 2020-05-29 2020-09-11 上海材料研究所 Resin composition for high-frequency high-speed copper-clad plate and application thereof
CN114736096A (en) * 2021-05-21 2022-07-12 华为技术有限公司 Benzocyclobutene monomer, benzocyclobutene resin, preparation of benzocyclobutene resin, low dielectric material and application of low dielectric material

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