CN117754149A - Polycrystalline diamond film thickness homogenizing treatment device and method - Google Patents
Polycrystalline diamond film thickness homogenizing treatment device and method Download PDFInfo
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- CN117754149A CN117754149A CN202410076577.4A CN202410076577A CN117754149A CN 117754149 A CN117754149 A CN 117754149A CN 202410076577 A CN202410076577 A CN 202410076577A CN 117754149 A CN117754149 A CN 117754149A
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- polycrystalline diamond
- diamond film
- laser
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- film thickness
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 113
- 239000010432 diamond Substances 0.000 title claims abstract description 113
- 238000011282 treatment Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000000265 homogenisation Methods 0.000 claims abstract description 8
- 238000011065 in-situ storage Methods 0.000 claims abstract description 8
- 238000005259 measurement Methods 0.000 claims description 11
- 230000033001 locomotion Effects 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 6
- 238000000608 laser ablation Methods 0.000 claims description 4
- 238000002679 ablation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 2
- 238000012544 monitoring process Methods 0.000 abstract 1
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 238000013532 laser treatment Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Abstract
The invention provides a polycrystalline diamond film thickness homogenizing treatment device and method, and relates to the technical field of laser precision machining. Comprises a laser processor, a laser thickness measuring device and a control system. The device can realize local controllable removal of the polycrystalline diamond film material and in-situ real-time monitoring of the film thickness of a processing area, and finally, the rapid homogenization of the polycrystalline diamond film thickness is completed.
Description
Technical Field
The invention relates to the technical field of laser precision machining, in particular to a polycrystalline diamond film thickness homogenizing treatment device and method.
Background
Polycrystalline diamond has excellent mechanical, chemical, optical and thermal properties such as extremely high hardness, good chemical stability, extremely high thermal conductivity, high elastic modulus, wide light transmission band and the like, and is considered as a functional material with the most application prospect in the 21 st century. The polycrystalline diamond film can stably work under various extreme conditions, and is an excellent window material and heat dissipation material. The large-size polycrystalline diamond film is mostly obtained by adopting a Chemical Vapor Deposition (CVD) method, and is limited by a growth mechanism of the polycrystalline diamond film by the CVD method, the polycrystalline diamond film preferentially grows along certain crystal faces in the growth process, the surface roughness and the grain size of the polycrystalline diamond film can be increased to tens of micrometers along with the increase of the thickness, and a certain graphite layer remains on the surface, so that the thickness of the grown polycrystalline diamond film is uneven. At present, mechanical grinding is generally used for processing the polycrystalline diamond, and the polycrystalline diamond film grown by a CVD method has the characteristics of uneven thickness and thinner film thickness, so that the problems of cracking, damage and the like of the polycrystalline diamond film caused by uneven stress on the film surface in the subsequent mechanical grinding process can be caused.
Disclosure of Invention
The invention discloses a polycrystalline diamond film thickness homogenizing treatment device, which aims at solving the problem of nonuniform thickness of a polycrystalline diamond film grown by a current CVD method, and provides a device for homogenizing the thickness of the polycrystalline diamond film by laser ablation, and a device for combining a laser treatment polycrystalline diamond film with a polycrystalline diamond film real-time thickness measuring device to realize in-situ controllable removal of local materials of the polycrystalline diamond film and in-situ real-time measurement of the thickness of the polycrystalline diamond film, thereby realizing the thickness homogenization of the polycrystalline diamond film.
The invention adopts the following scheme:
the application provides a polycrystalline diamond film thickness homogenization treatment device, which comprises a frame, be provided with the plummer in the frame in order to be suitable for placing polycrystalline diamond film, still include: the laser thickness measuring device comprises an upper laser distance measuring head vertically arranged above a bearing table and a lower laser distance measuring head vertically arranged below the bearing table and positioned on the same line with the upper laser distance measuring head, so that continuous laser beams emitted by the upper laser distance measuring head and the lower laser distance measuring head are perpendicular to a polycrystalline diamond film placed on the bearing table to measure the thickness of a position irradiated by the continuous laser beams; the laser output direction of the laser processor and the irradiation direction of the continuous laser beam of the laser thickness measuring device are both directed to the same area of the polycrystalline diamond film, so that the real-time measurement and in-situ processing of the polycrystalline diamond film are realized under the control of the control system.
Further, the laser processor is a pulse laser device.
Further, the front end of the laser processor is provided with a beam expander, and the front end of the beam expander is provided with an angle-adjustable reflecting mirror.
Further, the front end of the reflecting mirror is also provided with a vibrating mirror and a field lens.
Further, an XYZ axis movement device is arranged on the frame, and the bearing table is arranged on the XYZ axis movement device to realize the position adjustment of the polycrystalline diamond film.
Further, defining the distance between the upper laser ranging head and the lower laser ranging head as A, the distance between the upper laser ranging head and the upper surface of the polycrystalline diamond as B, and the distance between the lower laser ranging head and the lower surface of the polycrystalline diamond as C, wherein the thickness sigma of the polycrystalline diamond film is as follows: σ=a-B-C.
The invention also provides a thickness homogenization treatment method of the polycrystalline diamond film, which uses the thickness homogenization treatment device of any polycrystalline diamond film, and comprises the following steps:
s1: fixing the polycrystalline diamond film above the bearing table, controlling the bearing table to move in the X, Y, Z axial direction through a control system, and adjusting the position of the polycrystalline diamond film;
s2: the overall thickness measurement of the polycrystalline diamond film is carried out through a polycrystalline diamond laser thickness measuring device, and thickness distribution data of the whole polycrystalline diamond film are obtained;
s3: calculating the removal allowance of the polycrystalline diamond film at each position relative to the reference by taking the minimum value in the thickness data of the polycrystalline diamond film as the reference;
s4: removing the region of the polycrystalline diamond film with the partial thickness by using a laser processor in an ablation way, measuring the thickness of the polycrystalline diamond film in the laser ablation process in real time by using a laser ranging device, and stopping processing until the removing allowance is zero;
s5: and (3) controlling the motion of the bearing table to move to the next area, and repeating the step (S4) until the removing allowance of all positions, higher than the reference, of the surface of the polycrystalline diamond film is zero, and homogenizing the thickness of the polycrystalline diamond film.
The beneficial effects are that:
according to the scheme, the laser processor and the laser thickness measuring device are arranged to realize local controllable removal of diamond materials and in-situ real-time measurement of thickness of a processing area, and the device can be used for completing rapid homogenization of thickness of the polycrystalline diamond film and guaranteeing processing accuracy.
Drawings
Fig. 1 is a schematic diagram of a polycrystalline diamond film thickness homogenizing treatment device according to the present invention.
Fig. 2 is a thickness profile of a polycrystalline diamond film originally grown.
Fig. 3 is a graph showing a thickness distribution of the polycrystalline diamond film after the homogenization treatment by the laser treatment.
Icon: the laser beam measuring device comprises a metal bracket 1, a laser processor 2, a pulse laser beam 3, a beam expander 4, a reflecting mirror 5, a vibrating mirror 6, a field lens 7, an upper laser distance measuring head 8, a continuous laser beam 9, a bearing table 10, a polycrystalline diamond film 11, a lower laser distance measuring head 12 and a control system 13.
Detailed Description
Example 1
Referring to fig. 1, the present embodiment provides a polycrystalline diamond film thickness uniformizing treatment device, which includes a frame, on which a carrying table 10 is disposed to be suitable for placing a polycrystalline diamond film 11, and further includes: the laser thickness measuring device comprises a control system 13, a laser processor 2 and a laser thickness measuring device, wherein the laser processor 2 and the laser thickness measuring device are electrically connected with the control system 13, the laser thickness measuring device comprises an upper laser distance measuring head 8 vertically arranged above a bearing table 10 and a lower laser distance measuring head 12 vertically arranged below the bearing table 10 and positioned on the same line with the upper laser distance measuring head 8, so that continuous laser beams 9 emitted by the upper laser distance measuring head 8 and the lower laser distance measuring head 12 are vertical to a polycrystalline diamond film 11 placed on the bearing table 10 to measure the thickness of a position irradiated by the continuous laser beams 9; the laser output direction of the laser processor 2 and the irradiation direction of the continuous laser beam 9 of the laser thickness measuring device are both directed to the same area of the polycrystalline diamond film 11, so as to realize real-time measurement and in-situ processing of the polycrystalline diamond film 11 under the control of the control system 13.
In this embodiment, the stand includes a metal support 1, an existing XYZ axis movement device is disposed on the metal support 1, and the carrying table 10 is disposed on the XYZ axis movement device to implement position adjustment of the polycrystalline diamond film 11. The bearing table 10 is arranged on the metal bracket 1 and is used for bearing and placing the polycrystalline diamond film 11. In an embodiment, the middle of the carrying platform 10 is hollowed out, and the edge of the polycrystalline diamond film 11 is suitable for being fixed at the hollowed-out position of the carrying platform 10, so that the laser ranging is not interfered by the thickness of the carrying platform 10.
In this embodiment, the laser processor 2 is a conventional pulse laser device. The front end of the laser processor 2 is provided with a beam expander 4, the front end of the beam expander 4 is provided with an angle-adjustable reflecting mirror 5, and the front end of the reflecting mirror 5 is also provided with a vibrating mirror 6 and a field lens 7. The laser processor 2 can be controlled by the control system 13 to realize the adjustment of laser repetition frequency, laser pulse energy and laser pulse width, and the galvanometer 6 can be controlled to realize the adjustment of laser scanning speed, laser scanning interval, laser scanning times and scanning track. By adjusting the laser parameters, the material can be removed controllably from the region of the polycrystalline diamond film 11 with a thicker thickness.
The laser ranging device comprises an upper laser ranging head 8 and a lower laser ranging head 12; the upper and lower laser ranging heads 12 are adapted to emit continuous laser beams 9, and the upper laser ranging head 8 and the lower laser ranging head 12 are positioned on the same straight line, so that the continuous laser beams 9 emitted by the upper laser ranging head 8 and the lower laser ranging head 12 are positioned on the same straight line and perpendicular to the polycrystalline diamond film 11 placed on the bearing table 10 to measure the thickness of the position irradiated by the continuous laser beams 9; the upper laser ranging head 8 and the lower laser ranging head 12 are existing laser generators. The thickness measurement principle of the polycrystalline diamond film 11 is as follows: the color confocal technology adopted by thickness measurement converts wavelength information and displacement information of light with different colors, specifically, the distance between the upper laser ranging head 8 and the lower laser ranging head 12 is defined as A, the distance between the upper laser ranging head 8 and the upper surface of polycrystalline diamond is defined as B, the distance between the lower laser ranging head 12 and the lower surface of polycrystalline diamond is defined as C, and the thickness sigma of the polycrystalline diamond film 11 is as follows: σ=a-B-C.
The control system 13 in this embodiment may be an existing computer control system, and may input corresponding parameters to control the operations of the carrier 10, the laser processor 2, and the laser ranging device according to the need, and also be used to calculate the data measured by the laser ranging device, and send corresponding control instructions according to the program instructions, where the control system 13 is the prior art, and will not be described herein.
Example 2
The embodiment of the invention also provides a polycrystalline diamond film thickness homogenizing treatment method, which uses the polycrystalline diamond film thickness homogenizing treatment device and comprises the following steps:
s1: fixing the polycrystalline diamond film 11 above the bearing table 10, controlling the bearing table 10 to move in the X, Y, Z axial direction through the control system 13, and adjusting the position of the polycrystalline diamond film 11;
s2: the overall thickness measurement of the polycrystalline diamond film 11 is carried out through a polycrystalline diamond laser thickness measuring device, and thickness distribution data of the whole polycrystalline diamond film 11 are obtained;
s3: calculating the removal allowance of the polycrystalline diamond film 11 at each position relative to the reference by taking the minimum value in the thickness data of the polycrystalline diamond film 11 as the reference;
s4: the laser processor 2 is utilized to ablate and remove the region with the thicker thickness of the polycrystalline diamond film 11, and the laser ranging device is utilized to measure the thickness of the polycrystalline diamond film 11 in the laser ablation process in real time, and the processing is stopped until the removing allowance is zero;
s5: the motion of the carrier table 10 is controlled to move to the next region, and the step S4 is repeated until the removal allowance of all positions higher than the reference on the surface of the polycrystalline diamond film 11 is zero, at which time the thickness of the polycrystalline diamond film is homogenized.
In one embodiment, the thickness distribution of the polycrystalline diamond film 11 is 562 μm to 815 μm, the laser wavelength is 355nm, the laser pulse width is 23ns, the laser repetition frequency is 50kHz, the laser pulse energy is 120 μj, the laser scanning speed is 150mm/s, and the laser scanning pitch is 5 μm. Of course, the setting parameter is not limited thereto. After the beam diameter of the laser beam emitted by the laser is increased by the beam expander 4, the laser beam enters the vibrating mirror 6 through the reflecting mirror 5, is focused on the surface of the polycrystalline diamond film 11 through the field mirror 7, and is processed according to the thickness real-time deviation measured by the polycrystalline diamond thickness measuring device until the control system 13 displays that the thickness deviation of the polycrystalline diamond is 0, and the processing of the next area is continued.
As shown in fig. 2 and 3, the continuous laser beam 9 of the laser ranging device and the nanosecond laser beam 3 emitted by the laser processor are located in the same area focused on the polycrystalline diamond film 11 during working, so that in-situ processing and real-time measurement of the polycrystalline diamond film 11 can be realized, and the thickness of the diamond film processed by the device can be more uniform through comparing the thickness distribution map after processing. In addition, through the scheme of the embodiment, the laser ranging device and the laser processor are synchronously coordinated to perform ranging and processing in real time, so that the problem of low working efficiency caused by separation of the two steps is solved.
It should be understood that: the above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention.
The description of the drawings in the embodiments above illustrates only certain embodiments of the invention and should not be taken as limiting the scope, since other related drawings may be made by those of ordinary skill in the art without the benefit of the inventive faculty.
Claims (7)
1. The utility model provides a polycrystalline diamond film thickness homogenization treatment device, includes the frame, be provided with the plummer in the frame in order to be suitable for placing polycrystalline diamond film, its characterized in that still includes: the laser thickness measuring device comprises an upper laser distance measuring head vertically arranged above a bearing table and a lower laser distance measuring head vertically arranged below the bearing table and positioned on the same line with the upper laser distance measuring head, so that continuous laser beams emitted by the upper laser distance measuring head and the lower laser distance measuring head are perpendicular to a polycrystalline diamond film placed on the bearing table to measure the thickness of a position irradiated by the continuous laser beams; the laser output direction of the laser processor and the irradiation direction of the continuous laser beam of the laser thickness measuring device are both directed to the same area of the polycrystalline diamond film, so that the real-time measurement and in-situ processing of the polycrystalline diamond film are realized under the control of the control system.
2. The polycrystalline diamond film thickness homogenizing treatment apparatus of claim 1 wherein the laser processor is a pulsed laser apparatus.
3. The polycrystalline diamond film thickness homogenizing treatment apparatus of claim 1, wherein a beam expander is provided at a front end of the laser processor, and an angle-adjustable mirror is provided at a front end of the beam expander.
4. The polycrystalline diamond film thickness homogenizing treatment apparatus of claim 3, wherein the reflecting mirror front end is further provided with a vibrating mirror and a field lens.
5. The polycrystalline diamond film thickness homogenizing treatment apparatus of claim 1, wherein an XYZ axis movement device is provided on the frame, and the stage is provided on the XYZ axis movement device to achieve positional adjustment of the polycrystalline diamond film.
6. The polycrystalline diamond film thickness homogenizing treatment apparatus of claim 1, wherein a distance between the upper laser ranging head and the lower laser ranging head is defined as a, a distance between the upper laser ranging head and the upper surface of the polycrystalline diamond is defined as B, a distance between the lower laser ranging head and the lower surface of the polycrystalline diamond is defined as C, and the polycrystalline diamond film thickness σ is defined as: σ=a-B-C.
7. A polycrystalline diamond film thickness uniformizing method, characterized by using the polycrystalline diamond film thickness uniformizing device according to any one of claims 1 to 6, comprising the steps of:
s1: fixing the polycrystalline diamond film above the bearing table, controlling the bearing table to move in the X, Y, Z axial direction through a control system, and adjusting the position of the polycrystalline diamond film;
s2: the overall thickness measurement of the polycrystalline diamond film is carried out through a polycrystalline diamond laser thickness measuring device, and thickness distribution data of the whole polycrystalline diamond film are obtained;
s3: calculating the removal allowance of the polycrystalline diamond film at each position relative to the reference by taking the minimum value in the thickness data of the polycrystalline diamond film as the reference;
s4: removing the region of the polycrystalline diamond film with the partial thickness by using a laser processor in an ablation way, measuring the thickness of the polycrystalline diamond film in the laser ablation process in real time by using a laser ranging device, and stopping processing until the removing allowance is zero;
s5: and (3) controlling the motion of the bearing table to move to the next area, and repeating the step (S4) until the removal allowance of all positions, higher than the reference, of the surface of the polycrystalline diamond film is zero, and homogenizing the thickness of the polycrystalline diamond film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410076577.4A CN117754149A (en) | 2024-01-18 | 2024-01-18 | Polycrystalline diamond film thickness homogenizing treatment device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410076577.4A CN117754149A (en) | 2024-01-18 | 2024-01-18 | Polycrystalline diamond film thickness homogenizing treatment device and method |
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| Publication Number | Publication Date |
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| CN117754149A true CN117754149A (en) | 2024-03-26 |
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| CN202410076577.4A Pending CN117754149A (en) | 2024-01-18 | 2024-01-18 | Polycrystalline diamond film thickness homogenizing treatment device and method |
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- 2024-01-18 CN CN202410076577.4A patent/CN117754149A/en active Pending
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