CN117751343A

CN117751343A - Digitizer and electronic device including the same

Info

Publication number: CN117751343A
Application number: CN202280052798.7A
Authority: CN
Inventors: 朴昌柄; 朴明实
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2021-07-27
Filing date: 2022-07-27
Publication date: 2024-03-22
Also published as: EP4332737A1; US20230036968A1

Abstract

According to a particular embodiment, an electronic device includes: a display; a coil array layer disposed below the display; a magnetic layer disposed under the coil array layer; a conductive layer disposed below the magnetic layer; a conductive plate disposed under the conductive layer; the bracket is arranged below the conductive plate; and a magnetic assembly disposed on the support and below the conductive plate, wherein the conductive layer has a first opening, and the first opening and the magnetic assembly are at least partially overlapped with each other.

Description

Digitizer and electronic device including the same

Technical Field

Particular embodiments of the present disclosure relate to digitizers and electronic devices that include digitizers.

Background

Electronic devices are becoming thin, lightweight, small and multifunctional, and for this purpose, displays and various components are provided in the electronic devices. Since the flexible display can be folded, bent, curled, or unfolded, the flexible display is expected to greatly promote the reduction in size of the electronic device and cause a change in design of the electronic device.

The electronic device may include a flexible display and a digitizer may be applied to convert analog coordinates of a touch of an input device (e.g., a stylus) into digital data.

Disclosure of Invention

Technical problem

The foldable electronic device may include a magnetic assembly (e.g., a magnet) for securing the folded state. That is, when the foldable electronic device is in a folded state, there may be two housings connected by a hinge. The foldable electronic device may be folded like a book, wherein the edges of each housing are clustered together. The magnetic assembly may hold the edges together and at least prevent gravity from allowing one housing to move freely about the hinge.

When the magnetic component is located below the digitizer, the magnetic field generated from the magnetic component may affect the digitizer. In addition, the foldable electronic device may include other magnetic components, such as speakers, cameras, and vibration motors. Magnetic fields generated from these magnetic components (e.g., speakers, cameras, and vibration motors) may also affect the digitizer. In an electronic device according to certain embodiments of the present disclosure, a magnetic shielding layer (or magnetic shielding agent) may be disposed under the digitizer in order to reduce the magnetic field affecting the digitizer. The magnetic shield layer can reduce the influence of the magnetic force of the magnetic component.

To reduce the effect of the magnetic field on the digitizer, in an electronic device according to certain embodiments of the present disclosure, at least a portion of the conductive layer of the digitizer may be removed to form an opening or slit. In an electronic device according to certain embodiments of the present disclosure, a slit may be formed in order to reduce a magnetic field affecting a digitizer, but not in a cradle on which a magnetic component is disposed.

The technical problems to be solved by the present disclosure are not limited to the above technical problems, and other technical problems not described above may be clearly understood by those of ordinary skill in the related art to which the present disclosure pertains.

Technical proposal

According to a particular embodiment, an electronic device includes: a display; a coil array layer disposed below the display; a magnetic layer disposed under the coil array layer; a conductive layer disposed below the magnetic layer; a conductive plate disposed under the conductive layer; the bracket is arranged below the conductive plate; a magnetic assembly disposed on the bracket and below the conductive plate; and a magnetic shield disposed between the digitizer and the cradle and overlapping at least a portion of a top surface of the magnetic assembly, wherein the conductive layer has a first opening and the magnetic assembly are disposed at least partially overlapping each other.

According to a particular embodiment, an electronic device includes: a display; a coil array layer located below the display; a magnetic layer disposed under the coil array layer; a conductive layer disposed below the magnetic layer; a conductive plate disposed below the digitizer; the bracket is arranged below the conductive plate; the magnetic assembly is arranged on the bracket; and a magnetic shield portion provided so as to cover at least one surface of the magnetic component, wherein the conductive layer has a first opening, and the first opening and the magnetic component are provided so as to be at least partially overlapped with each other.

Technical effects

The electronic device according to the specific embodiment of the present disclosure can reduce the influence of the magnetic field of the magnetic assembly and the generation of eddy current, so that coordinate distortion due to non-uniformity of pen pressure or signal distortion of an electronic pen (e.g., a stylus pen) can be prevented or reduced.

Further, various effects identified directly or indirectly through the present disclosure may be provided.

Drawings

Fig. 1 is a block diagram illustrating an electronic device within a network environment according to a particular embodiment of the present disclosure.

Fig. 2 is a view illustrating an unfolded (e.g., open) state of an electronic device according to a specific embodiment of the present disclosure.

Fig. 3 is a view illustrating a folded (e.g., closed) state of an electronic device according to a specific embodiment of the present disclosure.

Fig. 4 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 5 is a view showing an electronic apparatus according to a comparative embodiment.

Fig. 6 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 7 is a diagram illustrating reducing the effects of eddy currents by forming a gap in a conductive layer of a digitizer, according to a particular embodiment of the present disclosure.

Fig. 8 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 9 is a view showing inductance when the conductive layer is disposed to overlap with the upper portion of the magnetic assembly and inductance variation when the portion of the conductive layer overlapping the magnetic assembly is removed.

Fig. 10 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 11 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 12 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 13 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 14 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 15 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 16 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 17 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 18 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure.

Fig. 19 is a view showing a bracket (e.g., an aluminum bracket) provided to surround the magnetic assembly.

Fig. 20 is a diagram illustrating a bracket (e.g., an aluminum bracket) disposed around a magnetic assembly according to a particular embodiment of the present disclosure.

Detailed Description

The present disclosure will begin with a description of the electronic device in fig. 1. Next, fig. 2 and 3 will describe a case of the foldable electronic device.

Fig. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection end 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above-described components (e.g., connection end 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 that is connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store commands or data received from another component (e.g., the sensor module 176 or the communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) or an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or combined with the main processor 121. For example, when the electronic device 101 comprises a main processor 121 and a secondary processor 123, the secondary processor 123 may be adapted to consume less power than the main processor 121 or to be dedicated to a particular function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 (instead of the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, by the electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be a Deep Neural Network (DNN), a Convolutional Neural Network (CNN), a Recurrent Neural Network (RNN), a boltzmann machine limited (RBM), a Deep Belief Network (DBN), a bi-directional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. Memory 130 may include volatile memory 132 or nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an Operating System (OS) 142, middleware 144, or applications 146.

The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons) or a digital pen (e.g., a stylus).

The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers may be used for general purposes such as playing multimedia or playing a record. The receiver may be used to receive an incoming call. Depending on the embodiment, the receiver may be implemented separate from the speaker or as part of the speaker.

Display module 160 may visually provide information to the outside (e.g., user) of electronic device 101. The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may comprise a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by a touch.

The audio module 170 may convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., the electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

Interface 177 may support one or more specific protocols that will be used to connect electronic device 101 with an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly. According to an embodiment, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrostimulator.

The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

Battery 189 may power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a primary non-rechargeable battery, a rechargeable battery, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a conventional cellular network, a 5G network, a next-generation communication network, the internet, or a computer network (e.g., a LAN or wide-area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

The wireless communication module 192 may support a 5G network following a 4G network as well as next generation communication technologies (e.g., new Radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), large-scale machine type communication (mctc), or Ultra Reliable Low Latency Communication (URLLC). The wireless communication module 192 may support a high frequency band (e.g., millimeter wave band) to achieve, for example, a high data transmission rate. The wireless communication module 192 may support various techniques for ensuring performance over high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or greater) for implementing an eMBB, a lost coverage (e.g., 164dB or less) for implementing an emtc, or a U-plane delay (e.g., a round trip of 0.5ms or less, or 1ms or less for each of the Downlink (DL) and Uplink (UL)) for implementing a URLLC.

The antenna module 197 may transmit signals or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate, such as a Printed Circuit Board (PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas, for example, by the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, further components (e.g., a Radio Frequency Integrated Circuit (RFIC)) other than radiating elements may additionally be formed as part of the antenna module 197.

According to various embodiments, antenna module 197 may form a millimeter wave antenna module. According to embodiments, a millimeter-wave antenna module may include a printed circuit board, a Radio Frequency Integrated Circuit (RFIC) disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., a millimeter-wave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

At least some of the above components may be interconnected via an inter-peripheral communication scheme (e.g., bus, general Purpose Input Output (GPIO), serial Peripheral Interface (SPI), or Mobile Industrial Processor Interface (MIPI)) and communicatively communicate signals (e.g., commands or data) therebetween.

According to an embodiment, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. According to an embodiment, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the function or service or perform another function or another service related to the request and transmit the result of the performing to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. For this purpose, for example, cloud computing technology, distributed computing technology, mobile Edge Computing (MEC) technology, or client-server computing technology may be used. The electronic device 101 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may comprise an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to smart services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to the embodiments of the present disclosure, the electronic device is not limited to those described above.

It should be understood that the various embodiments of the disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather include various modifications, equivalents or alternatives to the respective embodiments. For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to a term may include one or more things unless the context clearly indicates otherwise. As used herein, each of the phrases such as "a or B", "at least one of a and B", "at least one of a or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any or all possible combinations of items listed with a corresponding one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to simply distinguish one element from another element and not to limit the element in other respects (e.g., importance or order). It will be understood that if the terms "operatively" or "communicatively" are used or the terms "operatively" or "communicatively" are not used, then if an element (e.g., a first element) is referred to as being "coupled to," "connected to," or "connected to" another element (e.g., a second element), it is intended that the element can be directly (e.g., wired) connected to, wireless connected to, or connected to the other element via a third element.

As used in connection with various embodiments of the present disclosure, the term "module" may include an element implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

The various embodiments set forth herein may be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, under control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one of the one or more instructions stored in the storage medium with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the at least one instruction invoked. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein the term "non-transitory" merely means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be used as a product for conducting transactions between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disk read only memory (CD-ROM), or may be distributed via an application Store (e.g., a Play Store ^TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If it is issued online, thenAt least part of the computer program product may be temporarily generated or at least part of the computer program product may be temporarily stored in a machine readable storage medium, such as a memory of a server of the manufacturer, a server of the application store or a forwarding server.

According to various embodiments, each of the above-described components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. According to various embodiments, operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

It may be desirable for the size of the electronic device 101 to be reduced to allow portability. However, smaller sizes also result in smaller displays, which may reduce the quality of the user experience. The increased display results in an increase in at least one dimension, making it difficult for a user to carry in a pocket or hold with one hand.

The flexible display on the foldable electronic device allows the user to fold the device to a smaller size while carrying the device. When the user actively uses the device, the user can unfold the foldable electronic device.

According to an embodiment, the display module 160 shown in fig. 1 may include a display configured to be foldable or expandable. In an electronic device including a display, a flexible circuit board (e.g., an FRC cable) may be folded and unfolded in a folding region in which the display is folded when folded.

According to an embodiment, the display module 160 shown in fig. 1 may include a display slidably arranged to provide a screen (e.g., a display screen).

For example, the display area of the electronic device 101 is an area visually exposed to output an image, and the electronic device 101 may be configured such that the display area can be adjusted according to movement of a slide plate (not shown) or movement of a display. A coiled electronic device configured to selectively expand a display area by at least partially manipulating at least a portion (e.g., a housing) of electronic device 101 in a sliding manner may be an example of a display module 160 that includes such. For example, display module 160 may be referred to as a slide-out display or an expandable display.

Fig. 2 is a view illustrating an unfolded (e.g., open) state of the electronic device 101 according to a specific embodiment of the present disclosure. Fig. 3 is a view illustrating a folded (e.g., closed) state of the electronic device 101 according to a specific embodiment of the present disclosure.

Referring to fig. 2 and 3, the electronic device 101 may include: a housing 300; a hinge cover 330 covering a foldable portion of the case 300; an electronic pen 360 (e.g., the stylus or electronic pen 360 of fig. 4); and a flexible or foldable display 200 (hereinafter, simply referred to as "display 200") disposed within a space defined by the housing 300. Herein, the surface on which the display 200 is disposed is defined as a first surface or front surface of the electronic device 101. The surface opposite the front surface is defined as the second or rear surface of the electronic device 101. Further, a surface surrounding a space between the front surface and the rear surface is defined as a third surface or a side surface of the electronic device 101. For example, the electronic device 101 may be folded or unfolded in a first direction (e.g., an X-axis direction) relative to the folding region 203.

In an embodiment, the housing 300 may include a first housing structure 310, a second housing structure 320, a first rear cover 380, and a second rear cover 390, the second housing structure 320 including a sensor region 324. The housing 300 of the electronic device 101 is not limited to the shape and assembly shown in fig. 2 and 3, but may be implemented by other shapes or combinations and/or assemblies of components. For example, in another embodiment, the first housing structure 310 and the first rear cover 380 may be integrated with each other, and the second housing structure 320 and the second rear cover 390 may be integrated with each other.

In the illustrated embodiment, the first housing structure 310 and the second housing structure 320 may be disposed on opposite sides about the fold axis a and may have a generally symmetrical shape with respect to the fold axis a. As will be described later, the first housing structure 310 and the second housing structure 320 may have different angles or distances therebetween depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. In the illustrated state, the second housing structure 320 may further include a sensor region 324 in which various sensors are disposed, unlike the first housing structure 310, but the first and second housing structures may have shapes symmetrical to each other in other regions.

In an embodiment, the first housing structure 310 and the second housing structure 320 may together define a recess that accommodates the display 200. In the illustrated embodiment, the recess may have two or more different widths in a direction perpendicular to the fold axis a due to the sensor region 324.

For example, the recess may have a first width W1 between a first portion 310a of the first housing structure 310 and a first portion 320a of the second housing structure 320, the first portion 320a being disposed at an edge of the sensor region 324 of the second housing structure 320. The recess may have a second width W2, the second width W2 being formed by a second portion 310b of the first housing structure 310 in the first housing structure 310 parallel to the folding axis a and a second portion 320b of the second housing structure 320 that does not correspond to the sensor region 324 in the second housing structure 320 and is parallel to the folding axis a. In this case, the second width W2 may be greater than the first width W1. In other words, the first portion 310a of the first housing structure 310 and the first portion 320a of the second housing structure 320 having mutually asymmetric shapes may form the first width W1 of the recess. The second portion 310b of the first housing structure 310 and the second portion 320b of the second housing structure 320 having mutually symmetrical shapes may form a second width W2 of the recess. In an embodiment, the distance from the folding axis a to the first portion 320a of the second housing structure 320 and the distance from the folding axis a to the second portion 320b of the second housing structure 320 may be different from each other. The width of the recess is not limited to the example shown. In particular embodiments, the recess may have multiple widths due to the shape of the sensor region 324 or due to the asymmetric portions of the first housing structure 310 and the second housing structure 320.

In an embodiment, at least a portion of the first housing structure 310 and at least a portion of the second housing structure 320 may be formed using a metallic material or a non-metallic material having a stiffness level selected to support the display 200.

According to an embodiment, the sensor region 324 may have a predetermined region adjacent to one corner of the second housing structure 320. However, the arrangement, shape, and size of the sensor regions 324 are not limited to those in the illustrated example. For example, in another embodiment, the sensor region 324 may be disposed at another corner of the second housing structure 320, or in any region between the upper and lower corners. In an embodiment, components embedded in the electronic device 101 to perform various functions may be exposed to the front surface of the electronic device 101 through the sensor area 324 or one or more openings provided in the sensor area 324. In particular embodiments, the components may include various types of sensors. The sensor may include at least one of a front camera, a receiver, or a proximity sensor, for example.

The first rear cover 380 may be disposed on a rear surface of the electronic device on one side of the folding axis a and may have, for example, a substantially rectangular outer perimeter that may be surrounded by the first housing structure 310. Similarly, the second back cover 390 may be disposed on the other side of the folding axis a in the back surface of the electronic device, and the outer periphery of the second back cover 390 may be surrounded by the second housing structure 320.

In the illustrated embodiment, the first and second rear covers 380 and 390 may have a substantially symmetrical shape about the fold axis a. However, the first and second rear covers 380 and 390 do not necessarily have shapes symmetrical to each other. In another embodiment, the electronic device 101 may include a first rear cover 380 and a second rear cover 390 having various shapes. In another embodiment, the first rear cover 380 may be integral with the first housing structure 310 and the second rear cover 390 may be integral with the second housing structure 320.

In an embodiment, the first rear cover 380, the second rear cover 390, the first housing structure 310, and the second housing structure 320 may define a space in which various components of the electronic device 101 (e.g., a printed circuit board or a battery) may be disposed.

In an embodiment, an electronic pen 360 (e.g., a stylus) may be inserted and disposed on one side of the space of the electronic device 101. The electronic pen 360 may be inserted (e.g., pushed in) or removed (e.g., pulled out) through a pen hole (not shown) formed on a side surface of the electronic device 101. The input to electronic pen 360 may be detected using a digitizer (e.g., digitizer 400 of fig. 4) disposed below display 200.

Electronic pen 360 may be used to manipulate a user interface displayed on display 200. The user may pick up the electronic pen 360 and make contact with the display 200. The electronic device 101 may detect coordinates with which the electronic pen 360 is in contact on the display 200.

In embodiments, one or more components may be disposed on a rear surface of the electronic device 101 or visually exposed on the rear surface of the electronic device 101. For example, at least a portion of secondary display 290 may be visually exposed through first rear region 382 of first rear cover 380. In another embodiment, one or more components or sensors may be visually exposed through the second rear region 392 of the second rear cover 390. In particular embodiments, the sensor may include at least one of a proximity sensor, a fingerprint sensor, and/or a rear camera.

The hinge cover 330 may be disposed between the first housing structure 310 and the second housing structure 320 and configured to cover the internal components (e.g., the hinge structure). In an embodiment, the hinge cover 330 may be covered by a portion of the first housing structure 310 and a portion of the second housing structure 320, or may be exposed to the outside according to whether the electronic device 101 is in an unfolded state (flat state) or in a folded state.

As an example, as shown in fig. 2, when the electronic device 101 is in the unfolded state, the hinge cover 330 may not be exposed by being covered by the first and second case structures 310 and 320. As an example, as shown in fig. 3, when the electronic device 101 is in a folded state (e.g., a fully folded state), the hinge cover 330 may be exposed to the outside in a space between the first and second case structures 310 and 320. As an example, when the first and second case structures 310 and 320 are in an intermediate state where they are folded at a certain angle, the hinge cover 330 may be exposed to the outside in a space between the first and second case structures 310 and 320. However, in this case, the exposed area may be smaller than that in the fully folded state. In an embodiment, the hinge cover 330 may include a curved surface.

The display 200 may be disposed in a space defined by the housing 300. For example, the display 200 may be disposed in a recess defined by the housing 300 and may constitute a majority of the front surface of the electronic device 101.

Accordingly, the front surface of the electronic device 101 may include the display 200 and a partial area of the first housing structure 310 adjacent to the display 200 and a partial area of the second housing structure 320 adjacent to the display 200. Further, the rear surface of the electronic device 101 may include the first rear cover 380, a partial region of the first housing structure 310 adjacent to the first rear cover 380, the second rear cover 390, and a partial region of the second housing structure 320 adjacent to the second rear cover 390.

The display 200 may be a display in which at least a portion of the area is deformable to a flat surface or a curved surface. In an embodiment, the display 200 may include a folding region 203, a first region 201 disposed on one side of the folding region 203 (e.g., the left side of the folding region 203 (e.g., -X-axis direction) as shown in fig. 2), and a second region 202 disposed on the other side of the folding region 203 (e.g., the right side of the folding region 203 (e.g., X-axis direction) as shown in fig. 2). Display 200 may include a polarizing film (or polarizing layer), a window glass (e.g., ultra-thin glass (UTG) or a polymer window), and an optical compensation film (e.g., an Optical Compensation Film (OCF)).

As an example, display 200 may be combined with or disposed adjacent to touch sensing circuitry, pressure sensors capable of measuring the intensity (pressure) of a touch, and/or a digitizer (e.g., digitizer 400 in fig. 4) capable of detecting input from electronic pen 360.

As an example, the area division of the display 200 is exemplary, and the display 200 may be divided into a plurality of areas (e.g., four or more areas or two areas) according to its structure or function. By way of example, in the embodiment shown in fig. 2, the area of display 200 may be divided by fold area 203 or fold axis a extending parallel to the y-axis. However, in another embodiment, the area of the display 200 may be divided based on another folding area (e.g., a folding area parallel to the x-axis) or another folding axis (e.g., a folding axis parallel to the x-axis).

The first region 201 and the second region 202 may have a substantially symmetrical shape with respect to the folded region 203. However, unlike the first region 201, the second region 202 may include a notch cut due to the presence of the sensor region 324, but may have a symmetrical shape to the first region 201 in a region other than the sensor region. In other words, the first region 201 and the second region 202 may include a portion having a shape symmetrical to each other and a portion having a shape asymmetrical to each other.

Hereinafter, the operation of the first and second case structures 310 and 320 according to the states of the electronic device 101 (e.g., an unfolded state (flat state) and a folded state) and the operation of the respective regions of the display 200 will be described.

In an embodiment, when the electronic device 101 is in an unfolded state (flat state) (e.g., fig. 2), the first housing structure 310 and the second housing structure 320 may be disposed to form an angle of about 180 degrees therebetween and face the same direction. The surface of the first region 201 and the surface of the second region 202 of the display 200 may form about 180 degrees with respect to each other and may face in the same direction (e.g., a forward direction of the electronic device). The folded region 203 may form the same plane as the first region 201 and the second region 202.

In an embodiment, the first housing structure 310 and the second housing structure 320 may be disposed to face each other when the electronic device 101 is in a folded state (e.g., fig. 3). The surface of the first region 201 and the surface of the second region 202 of the display 200 may face each other while forming a narrow angle (e.g., an angle between 0 degrees and 10 degrees) with respect to each other. At least a portion of the fold region 203 may be configured as a curved surface having a predetermined curvature.

In an embodiment, the first housing structure 310 and the second housing structure 320 may be arranged to form a specific angle with respect to each other when the electronic device 101 is in an intermediate state (semi-folded state).

Fig. 4 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure. In fig. 4, an electronic pen 360 is in proximity to a digitizer 400 that is disposed below the display 200. The digitizer 400 may detect a position by scanning the strength of a magnetic field applied from the electronic pen 360.

Referring to fig. 4, an electronic device (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include a display (e.g., display 200 of fig. 2 and 3), a digitizer 400, and an electronic pen 360 (e.g., a stylus).

As an example, the digitizer 400 may be disposed below a display (e.g., the display 200 of fig. 2 and 3), and the digitizer 400 may be used to detect input from the electronic pen 360 (e.g., a stylus).

As an example, electronic pen 360 (e.g., a stylus) may include a resonant circuit for generating resonance. The resonant circuit may include a magnetic core 362 (e.g., a ferrite core) and a coil 364 (e.g., a coil or inductor for electromagnetic resonance (induction) operation) disposed around the magnetic core 362. Furthermore, the resonant circuit may comprise a capacitor. Electronic pen 360 (e.g., a stylus pen) can generate a current through interaction (e.g., electromagnetic induction) with digitizer 400, and the generated current can be used to form a magnetic field. The resonant circuit may be used to change the strength or frequency of the electromagnetic field depending on the user's manipulation state. For example, the resonant circuit may provide various frequencies for identifying hover inputs, drawing inputs, button inputs, or erase inputs. For example, the resonant circuit may provide various resonant frequencies by connecting a plurality of capacitors in various combinations, or may provide various resonant frequencies based on a variable inductor and/or variable capacitor.

As an example, digitizer 400 may include a coil array layer 410, a magnetic layer 420 (e.g., a ferromagnetic sheet), and a conductive layer 430. As an example, the coil array layer 410 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 420 may include Magnetic Metal Powder (MMP).

As an embodiment, digitizer 400 may use an electromagnetic field to detect input (e.g., touch input or hover input) through electronic pen 360 (e.g., a stylus). For example, a digitizer controller (not shown) may provide current to digitizer 400, and digitizer 400 may generate an electromagnetic field. When electronic pen 360 (e.g., a stylus pen) approaches the electromagnetic field of digitizer 400, electromagnetic induction phenomena may occur and the resonant circuit of the electronic pen may generate a current.

When electronic pen 360 (e.g., a stylus pen) approaches the electromagnetic field of digitizer 400, electromagnetic induction phenomena may occur and the resonant circuit of electronic pen 360 (e.g., a stylus pen) may generate an electrical current. The resonant circuit of electronic pen 360 (e.g., a stylus) may use the generated current to form a magnetic field. The digitizer controller may detect a position by scanning the strength of a magnetic field applied from an electronic pen 360 (e.g., a stylus) to the digitizer 400 over an entire area. The digitizer controller provides the detected position to a host device (e.g., processor 120 in fig. 1), and the host device can operate in response to the detected position, e.g., can output image information on a display (e.g., display 200 in fig. 2 and 3).

As an example, when an electronic pen 360 (e.g., a stylus pen) is positioned over the digitizer 400, magnetism generated from a magnetic core 362 of the electronic pen 360 (e.g., a stylus pen) is induced to the digitizer 400, and when there is no magnet outside of the digitizer 400, the magnetic layer 420 of the digitizer 400 (e.g., a stylus pen) and the electronic pen 360 may form a closed loop.

To accurately determine the position of electronic pen 360, it may be beneficial to avoid magnetic fields from other sources.

Fig. 5 is a diagram illustrating an electronic device with eddy currents from a magnetic assembly 440 disposed below a digitizer. In fig. 5, eddy currents from magnetic assembly 440 interfere with the electromagnetic field formed by electronic pen 360 and digitizer 400.

Referring to fig. 5, an electronic device (e.g., electronic device 101 of fig. 2 and 3) may include a magnetic assembly 440 for securing a folded state. Digitizer 400 may include a coil array layer 410, a magnetic layer 420 (e.g., a ferromagnetic plate), and a conductive layer 430. As an example, the coil array layer 410 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 420 may include Magnetic Metal Powder (MMP). By way of example, the magnetic assembly 440 may include a magnet, speaker, camera, or vibration motor.

When the electronic pen 360 (e.g., a stylus pen) approaches the electromagnetic field of the digitizer 400, electromagnetic induction phenomena may occur, and the magnetic field of the electronic pen 360 (e.g., a stylus pen) may be induced into the magnetic layer 420 of the digitizer 400. The magnetic component 440 may be located below the digitizer 400, and the magnetic field 442 generated by the magnetic component 440 may affect the digitizer 400. The Magnetic Metal Powder (MMP) included in the magnetic layer 420 of the digitizer 400 is easily saturated even when exposed to a low-amplitude magnetic field (422). The permeability of the magnetic metal powder may drastically decrease, and MMP may not be normally used as a magnetic material. The magnetic field generated by electronic pen 360 (e.g., a stylus pen) reaches down to conductive layer 430 of digitizer 400 and eddy currents 432 may be generated around electronic pen 360 in a conductive plane. The magnetic field generated by the eddy current 432 may be formed in a direction opposite to that of the magnetic field generated by the electronic pen 360 (e.g., a stylus), and the strength of the magnetic field of the electronic pen 360 (e.g., a stylus) is reduced, and coordinate distortion may be generated due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus).

Eddy currents 432 are caused by saturation of Magnetic Metal Powder (MMP). When the generation of the eddy current 432 is reduced, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., handwriting pen) can be prevented or reduced.

Fig. 6 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure. The plate 640 is disposed between the digitizer 600 and the magnetic assembly 650. The plate 640 may include a magnetic shield 642 capable of blocking a magnetic field, such as a magnetic field from the magnetic assembly 650.

Referring to fig. 6, an electronic device (e.g., the electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include a digitizer 600, a display (e.g., the display 200 of fig. 2 and 3), an electronic pen 360 (e.g., a stylus), a plate 640, and a magnetic assembly 650 for securing the electronic device in a folded state.

As an example, digitizer 600 may be disposed below a display (e.g., display 200 in fig. 2 and 3). The plate 640 may be disposed between the digitizer 600 and the magnetic assembly 650. The digitizer 600 may be used to detect input from an electronic pen 360 (e.g., a stylus).

As an example, digitizer 600 may include a coil array layer 610, a magnetic layer 620 (e.g., a ferromagnetic sheet), and a conductive layer 630. As an example, the coil array layer 610 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 620 may include Magnetic Metal Powder (MMP).

As an example, the conductive layer 630 may include an opening 632 in which at least a portion is cut. The opening 632 may be formed to at least partially overlap the magnetic assembly 650.

As an example, plate 640 may be disposed between digitizer 600 and magnetic assembly 650. The plate 640 may be formed using a conductive metal material (e.g., aluminum). The plate 640 may include a magnetic shield 642 capable of blocking a magnetic field. The magnetic shield portion 642 of the plate 640 may be disposed to overlap the opening 632 and the magnetic assembly 650.

As an example, when the electronic pen 360 (e.g., a stylus pen) is proximate to the electromagnetic field of the digitizer 600, electromagnetic induction phenomena may occur, and the magnetic field of the electronic pen 360 (e.g., a stylus pen) may be induced into the magnetic layer 620 of the digitizer 600. The magnetic component 650 can be located below the digitizer 600. The magnetic field of the magnetic assembly 650 can be prevented from affecting the magnetic layer 620 of the digitizer 600 by the magnetic shield 642 of the plate 640. Even though the magnetic shield 642 blocks the magnetic field, the magnetic shield 642 may be partially saturated 622, but since at least a portion of the conductive layer 630 of the digitizer 600 is cut to form the opening 632, eddy currents formed in the conductive layer 630 of the digitizer 600 due to the magnetic field generated by the electronic pen 360 (e.g., a stylus pen) may be reduced.

Fig. 7 is a view illustrating an effect of reducing eddy current by forming a slit in a conductive layer according to a specific embodiment of the present disclosure.

Referring to fig. 6 and 7, in order to reduce the magnitude of the eddy current, a slit 634 may be formed in at least a portion of the conductive layer 630 such that a closed loop is not formed in the conductive layer 630. In this manner, by forming the slit 634 in the conductive layer 630, the magnitude of the eddy current can be reduced. Thereby, the influence of the magnetic field of the magnetic assembly 650 and the generated eddy current can be reduced, so that coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus pen) can be prevented or reduced.

Fig. 8 is a diagram illustrating an electronic device according to a particular embodiment of the present disclosure. Conductive layer 830 includes a portion 832 that forms a gap 834. In addition, a plate 842 is disposed over the magnetic assembly 850. The plate 842 may block the magnetic field generated by the magnetic assembly 850. In addition, including the slit 834 reduces eddy currents formed in the conductive layer 830 due to a magnetic field generated by the electronic pen 360 (e.g., a stylus pen). The foregoing prevents or reduces saturation of the magnetic layer 820 in the region 822 directly above the magnetic component 850.

Referring to fig. 8, an electronic device (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include a digitizer 800, a display (e.g., display 200 of fig. 2 and 3), an electronic pen 360 (e.g., a stylus), a board 840, and a magnetic assembly 850 for securing the electronic device in a folded state.

As an example, digitizer 800 may be disposed below a display (e.g., display 200 in fig. 2 and 3). A board 840 may be disposed between digitizer 800 and magnetic assembly 850. The digitizer 800 may be used to detect input from an electronic pen 360 (e.g., a stylus).

As an example, digitizer 800 may include a coil array layer 810, a magnetic layer 820 (e.g., a ferromagnetic sheet), and a conductive layer 830. As an example, the coil array layer 810 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 820 may include Magnetic Metal Powder (MMP). As an example, the conductive layer 830 may include a slit 834 in which at least a portion of the conductive layer is cut. Since the slit 834 is formed in a portion of the conductive layer 830, a portion 832 of the conductive layer 830 may be left, and the portion 832 of the conductive layer 830 may be formed to at least partially overlap the magnetic assembly 850.

As an example, board 840 may be disposed between digitizer 800 and magnetic component 850. The plate 840 may be formed using a conductive metal material (e.g., aluminum). The plate 840 may include a magnetic shield 842 capable of blocking a magnetic field. The magnetic shield 842 of the plate 840 may be disposed to overlap the portion 832 of the conductive layer 830 and the magnetic assembly 850.

As an example, when the electronic pen 360 (e.g., a stylus pen) is proximate to the electromagnetic field of the digitizer 800, electromagnetic induction phenomena may occur and the magnetic field of the electronic pen 360 (e.g., a stylus pen) may be induced into the magnetic layer 820 of the digitizer 800. The magnetic component 850 can be located below the digitizer 800. The magnetic field of the magnetic assembly 850 may be prevented from affecting the magnetic layer 820 of the digitizer 800 by the magnetic shield 842 of the plate 840. Accordingly, a region of the Magnetic Metal Powder (MMP) included in the magnetic layer 820 directly above the magnetic component 850, which is easily saturated by the magnetic field of the magnetic component 850, may be prevented from being saturated, or may be made to have reduced saturation. Further, since at least a portion of the conductive layer 830 of the digitizer 800 is cut to form the gap 834, eddy currents formed in the conductive layer 830 of the digitizer 800 due to a magnetic field generated by the electronic pen 360 (e.g., a stylus pen) can be reduced.

Referring to fig. 6 and 8, in order to reduce the magnitude of the eddy current, a gap 634 or a gap 834 may be formed in at least a portion of the conductive layer 630 or 830 such that a closed loop is not formed in the conductive layer 630 or 830. In this manner, by forming the gap 634 or the gap 834 in the conductive layer 630 or 830, the magnitude of the eddy current can be reduced, and the influence of the eddy current on the digitizer 600 or 800 can be reduced. For example, by adjusting the size of the slit 634 or the slit 834, adjustment may be made so that a difference between a region where the conductive layer 630 or 830 is removed and a region where the conductive layer 630 or 830 is not removed is not large. Thereby, the influence of the magnetic field of the magnetic assembly 850 and the generated eddy current can be reduced, so that coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., handwriting pen) can be prevented or reduced.

Referring to fig. 6, 8 and 9, the change in inductance 920 when a magnetic component 650 or 850 is located under a digitizer 600 or 800 and at least a portion of a conductive layer 630 or 830 of the digitizer 600 or 800 is cut to form an opening 632 or slot 834 is compared to the change in inductance 910 when the conductive layer is not removed.

On the left side of fig. 9 is a graph of inductance as a function of the two-dimensional coordinates of the display when the portion without the conductive layer is cut. On the right side of fig. 9 is a graph of inductance as a function of the two-dimensional coordinates of the display when there is a gap 834 cutting the conductive layer. The bottom graph shows the inductance as a function of the x-coordinate for the constant y (along line a and line B).

The change in inductance 920 when at least a portion of the conductive layer 630 or 830 of the digitizer 600 or 800 is cut to form the opening 632 or the slot 834 is less than when no portion of the conductive layer is cut. Accordingly, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Fig. 10 is a diagram illustrating an electronic device 1000 in accordance with certain embodiments of the present disclosure. In fig. 10, a magnetic assembly 1060 is provided at an end of the stand to secure the electronic device 1000 in a folded state.

Referring to fig. 10, an electronic device 1000 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1010 (e.g., display 200 of fig. 2 and 3), a flexible board 1020, a digitizer 1030, a board 1040, a support 1050, a magnetic assembly 1060, and a printed circuit board 1070.

Note that fig. 10 is not drawn to scale. Specific elements are drawn larger to emphasize specific features.

To secure the electronic device 1000 in the folded state, the magnetic assembly 1060 may be disposed on an opposite side of the bracket 1050. When the electronic device 1000 is in the folded state, the cradle 1050 bends at the fold region 1001 such that the magnetic assembly is close enough to be magnetically attracted. A recess or aperture may be formed in at least a portion of each of the opposite sides of the bracket 1050, and the magnetic assembly 1060 may be disposed in the recess or aperture formed in the opposite side of the bracket 1050.

As an example, a flexible board 1020 may be disposed under the display 1010 to support the display 1010. The flexible board 1020 may include a lattice portion 1022 so that when the electronic device 1000 is folded, the display 1010 may be smoothly supported, folded, and unfolded in the folding region 1001. When the electronic device 1000 is folded by the lattice portion 1022 of the flexible board 1020, an operation according to folding and unfolding can be stably provided.

As an embodiment, digitizer 1030 may be positioned under flex 1020. Plate 1040 may be disposed between digitizer 1030 and support 1050.

By way of example, display 1010 and digitizer 1030 may be electrically connected to printed circuit board 1070. Printed circuit board 1070 may include a processor (e.g., processor 120 in fig. 1), memory (e.g., memory 130 in fig. 1), a digitizer controller to drive digitizer 1030, and a display driver IC to drive display 1010.

As an example, digitizer 1030 may include coil array layer 1032, magnetic layer 1034 (e.g., a ferromagnetic plate), and conductive layer 1036. As an example, the coil array layer 1032 may include a flexible circuit board (FPCB) on which the coils are disposed. Magnetic layer 1034 may include Magnetic Metal Powder (MMP). The conductive layer 1036 may be disposed to overlap the support 1050 and the magnetic assembly 1060.

As an example, the display 1010 may have a thickness of about 400 μm. The flexible sheet 1020 may have a thickness of about 170 μm. The coil array layer 1032 may have a thickness of about 100 μm. The magnetic layer 1034 (e.g., ferromagnetic plate) may have a thickness of about 25 μm. The conductive layer 1036 may have a thickness of about 12 μm.

By way of example, plate 1040 may be disposed between digitizer 1030 and support 1050. For example, plate 1040 may be formed using a conductive metallic material (e.g., aluminum, stainless steel, or copper alloy). By way of example, plate 1040 may be formed using Fiber Reinforced Plastic (FRP) or Carbon Fiber Reinforced Plastic (CFRP). Plate 1040 may include an opening 1040a in which at least a portion of the plate is cut. The opening 1040a can overlap at least a portion of the conductive layer 1036 of the digitizer 1030. Further, the opening 1040a may overlap at least a portion of the bracket 1050 and at least a portion of the magnetic assembly 1060. When a portion of plate 1040 is not cut, plate 1040 is between magnetic component 1060 and conductive layer 1036 of digitizer 1030. At least a portion of plate 1040 is cut to form opening 1040a such that magnetic component 1060 can directly affect conductive layer 1036 of digitizer 1030.

By way of example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus pen) is proximate to the electromagnetic field of digitizer 1030, electromagnetic induction phenomena may occur and the magnetic field of electronic pen 360 (e.g., a stylus pen) may be induced into magnetic layer 1034 of digitizer 1030. A magnetic component 1060 may be located below digitizer 1030. By removing a portion of the plate 1040 (such as making a slit) disposed below the magnetic layer 1034, the generation amount of eddy current is reduced, so that coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus pen) can be prevented or reduced.

Fig. 11 is a diagram illustrating an electronic device 1100 in accordance with certain embodiments of the present disclosure.

Referring to fig. 11, an electronic device 1100 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1110 (e.g., display 200 of fig. 2 and 3), a flexible board 1120, a digitizer 1130, a board 1140, a stand 1150, a magnetic component 1160, and a printed circuit board 1170.

To secure the electronic device 1100 in the folded state, the magnetic assembly 1160 may be disposed on an opposite side of the support 1150. When the electronic device 1100 is in the folded state, the cradle 1150 is bent at the fold region 1101 such that the magnetic assembly 1160 is sufficiently close to be magnetically attracted. A groove or aperture may be formed in at least a portion of each of the opposite sides of the bracket 1150, and a magnetic assembly 1160 may be disposed in the groove or aperture formed in the opposite side of the bracket 1150.

As an example, a flexible board 1120 may be disposed under the display 1110 to support the display 1110. The flexible board 1120 may include a lattice portion 1122 such that when the electronic device 1100 is folded, the display 1110 may be smoothly supported, folded, and unfolded in the folding region 1101. When the electronic device 1100 is folded by the portion 1122 of the flexible board 1120, an operation according to folding and unfolding can be stably provided.

As an embodiment, digitizer 1130 may be positioned under flex 1120. A plate 1140 may be disposed between digitizer 1130 and cradle 1150.

By way of example, display 1110 and digitizer 1130 may be electrically connected to printed circuit board 1170. The printed circuit board 1170 can include a processor (e.g., processor 120 in fig. 1), memory (e.g., memory 130 in fig. 1), a digitizer controller to drive a digitizer 1130, and a display driver IC to drive a display 1110.

As an example, digitizer 1130 may include a coil array layer 1132, a magnetic layer 1134 (e.g., a ferromagnetic plate), and a conductive layer 1136. As an example, the coil array layer 1132 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 1134 may include Magnetic Metal Powder (MMP). Conductive layer 1136 of digitizer 1130 may include an opening 1136a in which at least a portion of the conductive layer is cut. The opening 1136a of the conductive layer 1136 may overlap the mount 1150 and the magnetic assembly 1160.

As an example, board 1140 can be disposed at a level or height above magnetic assembly 1160 and below digitizer 1130. The plate 1140 may be formed using a conductive metal material (e.g., aluminum). The plate 1140 may include an opening 1140a in which at least a portion of the plate is cut. The opening 1140a of plate 1140 may overlap at least a portion of conductive layer 1136 of digitizer 1130. In addition, the opening 1140a of the plate 1140 may overlap at least a portion of the bracket 1150 and at least a portion of the magnetic assembly 1160. At least a portion of plate 1140 is cut to form opening 1140a so that magnetic assembly 1160 may be stacked with digitizer 1130.

As an example, the opening 1136a of the conductive layer 1136 may have a first width w1, and the opening 1140a of the plate 1140 may have a second width w2 wider than the first width w 1. The present disclosure is not limited thereto, and the first width of the opening 1136a of the conductive layer 1136 and the second width of the opening 1140a of the plate 1140 may have the same size.

As an example, display 1110 may have a thickness of about 400 μm. The flexible sheet 1120 may have a thickness of about 170 μm. The coil array layer 1132 may have a thickness of about 100 μm. The magnetic layer 1134 (e.g., ferromagnetic sheet) may have a thickness of about 25 μm. The conductive layer 1136 may have a thickness of about 12 μm.

By way of example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus) is proximate to the electromagnetic field of digitizer 1130, electromagnetic induction phenomena may occur and the magnetic field of electronic pen 360 (e.g., a stylus) may be induced into magnetic layer 1134 of digitizer 1130. Magnetic component 1160 may be located below digitizer 1130. Since at least a portion of conductive layer 1136 of digitizer 1130 is cut to form opening 1136a, eddy currents formed in conductive layer 1036 of digitizer 1030 due to the magnetic field generated by electronic pen 360 (e.g., a stylus) may be reduced. Further, digitizer 1130 and magnetic assembly 1160 are disposed to be spaced apart from each other by a predetermined distance, and thus, saturation of Magnetic Metal Powder (MMP) included in magnetic layer 1134 due to the magnetic field of magnetic assembly 1160 may be prevented or reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Fig. 12 is a diagram illustrating an electronic device 1200 in accordance with a particular embodiment of the present disclosure.

Referring to fig. 12, an electronic device 1200 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1210 (e.g., display 200 of fig. 2 and 3), a flex-board 1220, a digitizer 1230, a board 1240, a support 1250, a magnetic assembly 1260, and a printed circuit board 1270.

To secure the electronic device 1200 in the folded state, the magnetic assembly 1260 may be disposed on an opposite side of the holder 1250. When the electronic device 1200 is in the collapsed state, the stent 1250 bends at the collapsed region 1201 such that the magnetic assembly 1260 is sufficiently close to be magnetically attracted.

Grooves or holes may be formed in at least a portion of each of the opposite sides of the stent 1250, and the magnetic assemblies 1260 may be disposed in grooves or holes formed in the opposite sides of the stent 1250.

As an example, the flexible board 1220 may be disposed under the display 1210 to support the display 1210. The flexible board 1220 may include a lattice portion 1222 so that when the electronic device 1200 is folded, the display 1210 may be smoothly supported, folded, and unfolded in the folding area 1201. When the electronic device 1200 is folded by the lattice portion 1222 of the flexible board 1220, operations according to folding and unfolding can be stably provided.

As an embodiment, the digitizer 1230 may be disposed under the flex 1220. Plate 1240 can be disposed between digitizer 1230 and stent 1250.

By way of example, the display 1210 and digitizer 1230 may be electrically connected to a printed circuit board 1270. The printed circuit board 1270 can include a processor (e.g., processor 120 in fig. 1), memory (e.g., memory 130 in fig. 1), a digitizer controller to drive a digitizer 1230, and a display driver IC to drive a display 1210.

As an example, digitizer 1230 may include a coil array layer 1232, a magnetic layer 1234 (e.g., a ferromagnetic sheet), an electrically conductive layer 1236, and a magnetic shielding layer 1238. As an example, the coil array layer 1232 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 1234 may include Magnetic Metal Powder (MMP). The conductive layer 1236 of the digitizer 1230 can include openings 1236a where at least a portion of the conductive layer is cut. The magnetic shield layer 1238 may be disposed in the opening 1236a of the conductive layer 1236. The magnetic shield layer 1238 may also be disposed over the printed circuit board 1270. As an example, the magnetic shield layer 1238 may include amorphous silicon, a general cold rolled steel Sheet (SPCC), and/or permalloy. The magnetic shield layer 1238 can overlap the holder 1250 and the magnetic assembly 1260.

As an example, the display 1210 may have a thickness of about 400 μm. The flexible plate 1220 may have a thickness of about 170 μm. The coil array layer 1232 may have a thickness of about 100 μm. The magnetic layer 1234 (e.g., ferromagnetic sheet) may have a thickness of about 25 μm. The conductive layer 1236 may have a thickness of about 12 μm. The magnetic shield layer 1238 may have a thickness of about 200 μm.

By way of example, plate 1240 can be disposed at a level or height above magnetic assembly 1260 and below digitizer 1230. Plate 1240 can be formed using a conductive metallic material (e.g., aluminum). Plate 1240 can include openings 1240a wherein at least a portion of the plate is cut. The openings 1240a of the plates 1240 can overlap at least a portion of the magnetic shielding layer 1238 and the conductive layer 1236 of the digitizer 1230. In addition, openings 1240a of plate 1240 can overlap at least a portion of stent 1250 and at least a portion of magnetic assembly 1260. At least a portion of plate 1240 is cut to form opening 1240a such that magnetic assembly 1260 can overlap digitizer 1230.

As an example, opening 1236a of conductive layer 1236 can have a first width w1 and opening 1240a of plate 1240 can have a second width w2 that is wider than first width w 1.

By way of example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus pen) is proximate to the electromagnetic field of digitizer 1230, electromagnetic induction phenomena may occur and the magnetic field of electronic pen 360 (e.g., a stylus pen) may be induced into magnetic layer 1234 of digitizer 1230. A magnetic component 1260 can be located below the digitizer 1230. Since at least a portion of the conductive layer 1236 of the digitizer 1230 may be cut to form an opening, and the magnetic shielding layer 1238 is disposed in the opening, eddy currents formed in the conductive layer 1236 of the digitizer 1230 due to a magnetic field generated from the electronic pen 360 (e.g., a stylus pen) may be reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Referring to fig. 13, an electronic device 1300 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1310 (e.g., display 200 of fig. 2 and 3), a flexible board 1320, a digitizer 1330, a board 1340, a stand 1350, a magnetic assembly 1360, and a printed circuit board 1370.

To secure the electronic device 1300 in the folded state, the magnetic assembly 1360 may be disposed on an opposite side of the stand 1350. When the electronic device 1300 is in the folded state, the holder 1350 is bent at the folded region 1301 such that the magnetic assembly 1360 is close enough to be magnetically attracted. A groove or aperture may be formed in at least a portion of each of the opposite sides of the holder 1350, and a magnetic assembly 1360 may be disposed in the groove or aperture formed in the opposite side of the holder 1350.

As an example, a flexible board 1320 may be disposed under the display 1310 to support the display 1310. The flexible board 1320 may include a lattice portion 1322 so that the display 1310 may be smoothly supported, folded, and unfolded in the folding region 1301 when the electronic apparatus 1300 is folded. When the electronic device 1300 is folded by the lattice portion 1322 of the flexible board 1320, an operation according to folding and unfolding can be stably provided.

As an embodiment, the digitizer 1330 may be disposed below the flexible plate 1320. A plate 1340 may be disposed between digitizer 1330 and cradle 1350.

By way of example, the display 1310 and digitizer 1330 may be electrically connected to a printed circuit board 1370. The printed circuit board 1370 may include a processor (e.g., the processor 120 of fig. 1), a memory (e.g., the memory 130 of fig. 1), a digitizer controller to drive the digitizer 1330, and a display driver IC to drive the display 1310.

As an example, digitizer 1330 may include a coil array layer 1332, a magnetic layer 1334 (e.g., a ferromagnetic sheet), an electrically conductive layer 1336, and a magnetic shield layer 1338. As an example, the coil array layer 1332 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 1334 may include Magnetic Metal Powder (MMP). The conductive layer 1336 of the digitizer 1330 can include an opening 1336a in which at least a portion of the conductive layer is cut. The magnetic shield layer 1338 may be disposed in the opening 1336a of the conductive layer 1336. The magnetic shield layer 1338 may also be disposed over the printed circuit board 1370. As an example, the magnetic shield layer 1338 may include amorphous silicon, a cold rolled steel Sheet (SPCC), and/or permalloy. The magnetic shield layer 1338 may overlap the holder 1350 and the magnetic assembly 1360.

For example, the magnetic shield layer 1338 is spaced apart from the end 1336b of the magnetic layer 1334 by a predetermined distance d1 such that the magnetic shield layer 1338 can overlap a portion of the magnetic assembly 1360.

As an example, the plate 1340 can be disposed at a level or height above the magnetic assembly 1360 and below the digitizer 1330. Plate 1340 may be formed using a conductive metal material (e.g., aluminum). Plate 1340 may include an opening 1340a in which at least a portion of the plate is cut. The opening 1340a of the plate 1340 can overlap at least a portion of the magnetic shielding layer 1338 and the conductive layer 1336 of the digitizer 1330. In addition, the opening 1340a of the plate 1340 may overlap at least a portion of the rack 1350 and at least a portion of the magnetic assembly 1360. At least a portion of the plate 1340 is cut to form an opening 1340a so that the magnetic assembly 1360 can be stacked with the digitizer 1330.

As an example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus pen) is proximate to the electromagnetic field of digitizer 1330, electromagnetic induction phenomena may occur, and the magnetic field of electronic pen 360 (e.g., a stylus pen) may be induced into magnetic layer 1334 of digitizer 1330. The magnetic component 1360 may be located below the digitizer 1330. At least a portion of the conductive layer 1336 of the digitizer 1330 can be cut to form an opening 1336a, and a magnetic shield layer 1338 can be disposed in the opening 1336a such that saturation 1334a of the magnetic layer 1334 can be reduced. Accordingly, eddy currents formed in the conductive layer 1336 of the digitizer 1330 due to the magnetic field generated by the electronic pen 360 (e.g., a stylus pen) may be reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Fig. 14 is a diagram illustrating an electronic device 1400 in accordance with a particular embodiment of the present disclosure.

Referring to fig. 14, an electronic device 1400 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1410 (e.g., display 200 of fig. 2 and 3), a flexible board 1420, a digitizer 1430, a stand 1450, a magnetic assembly 1460, a printed circuit board 1470, and a magnetic shield 1480.

To secure the electronic device 1400 in the folded state, the magnetic assembly 1460 may be disposed on opposite sides of the bracket 1450. When the electronic device 1400 is in the folded state, the bracket 1450 bends at the fold region 1401 such that the magnetic assembly 1460 is sufficiently close to be magnetically attracted. A groove or aperture may be formed in at least a portion of each of the opposite sides of the bracket 1450, and the magnetic assembly 1460 may be disposed in a groove or aperture formed in the opposite sides of the bracket 1450.

As an example, the flexible board 1420 may be disposed under the display 1410 to support the display 1410. The flexible board 1420 may include a lattice portion 1422 such that when the electronic device 1400 is folded, the display 1410 may be smoothly supported, folded, and unfolded in the folding area 1401. When the electronic device 1400 is folded by the lattice portion 1422 of the flexible board 1420, operations according to folding and unfolding can be stably provided.

As an embodiment, digitizer 1430 may be disposed under flexible plate 1420. A magnetic shield 1480 may be disposed between digitizer 1430 and support 1450.

By way of example, display 1410 and digitizer 1430 may be electrically connected to printed circuit board 1470. The printed circuit board 1470 may include a processor (e.g., processor 120 in fig. 1), memory (e.g., memory 130 in fig. 1), a digitizer controller to drive a digitizer 1430, and a display driver IC to drive a display 1410.

As an example, digitizer 1430 may include a coil array layer 1432, a magnetic layer 1434 (e.g., a ferromagnetic plate), and a conductive layer 1436. As an example, the coil array layer 1432 may include a flexible circuit board (FPCB) on which the coil is disposed. The magnetic layer 1434 may include Magnetic Metal Powder (MMP). The conductive layer 1436 of the digitizer 1430 can include a slit 1438 in which at least a portion of the conductive layer is cut. The slit 1438 may be formed to at least partially overlap the magnetic shield 1480.

As an example, the magnetic shield section 1480 may be provided to overlap the entire upper end portion of the magnetic assembly 1460. The magnetic shield section 1480 may also be disposed under the printed circuit board 1470. As an example, the magnetic shield section 1480 may include amorphous silicon, a cold-rolled steel Sheet (SPCC), and/or permalloy.

As an example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus pen) is proximate to the electromagnetic field of digitizer 1430, electromagnetic induction phenomena may occur and the magnetic field of electronic pen 360 (e.g., a stylus pen) may be induced into magnetic layer 1434 of digitizer 1430. Magnetic component 1460 may be located below digitizer 1430. At least a portion of the conductive layer 1436 of the digitizer 1430 can be cut to form a gap 1438 to reduce saturation of the magnetic layer 1434. Further, since the magnetic shield 1480 is provided to overlap with the magnetic assembly 1460, eddy currents formed in the conductive layer 1436 of the digitizer 1430 due to a magnetic field generated by the electronic pen 360 (e.g., a stylus pen) can be reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Fig. 15 is a diagram illustrating an electronic device 1500 in accordance with certain embodiments of the present disclosure.

Referring to fig. 15, an electronic device 1500 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1510 (e.g., display 200 of fig. 2 and 3), a flexible board 1520, a digitizer 1530, a cradle 1550, a magnetic component 1560, a printed circuit board 1570, and a magnetic shield 1580.

To secure the electronic device 1500 in the folded state, the magnetic assembly 1560 may be disposed on an opposite side of the cradle 1550. A groove or hole may be formed in at least a portion of each of the opposite sides of the bracket 1550, and the magnetic assembly 1560 may be disposed in the groove or hole formed in the opposite sides of the bracket 1550.

As an example, flexible board 1520 may be positioned below display 1510 to support display 1510. Flexible board 1520 may include a lattice portion 1522 such that display 1510 may be smoothly supported, folded, and unfolded in folding area 1501 when electronic device 1500 is folded. Operation according to folding and unfolding can be stably provided when the electronic device 1500 is folded by the lattice portion 1522 of the flexible board 1520.

As an example, digitizer 1530 may be disposed below flexible board 1520. The magnetic shield 1580 can be provided between the digitizer 1530 and the cradle 1550.

By way of example, the display 1510 and digitizer 1530 may be electrically connected to a printed circuit board 1570. Printed circuit board 1570 can include a processor (e.g., processor 120 in fig. 1), memory (e.g., memory 130 in fig. 1), a digitizer controller to drive digitizer 1530, and a display driver IC to drive display 1510.

As an example, digitizer 1530 may include a coil array layer 1532, a magnetic layer 1534 (e.g., a ferromagnetic sheet), and a conductive layer 1536. As an example, the coil array layer 1532 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 1534 may include Magnetic Metal Powder (MMP). Conductive layer 1536 of digitizer 1530 may include a slit 1538 in which at least a portion of the conductive layer is cut. The slit 1538 may be formed to at least partially overlap the magnetic shield 1580 and the magnetic assembly 1560.

As an example, the magnetic shield 1580 is provided to be spaced apart from an end portion of the magnetic layer 1534 by a predetermined distance d1 such that the magnetic shield 1580 may be provided to overlap a portion of an upper end portion of the magnetic assembly 1560. The magnetic shield 1580 can also be provided under the printed circuit board 1570. As an example, the magnetic shield 1580 may include amorphous silicon, a cold rolled steel Sheet (SPCC), and/or permalloy.

As an example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus pen) approaches the electromagnetic field of digitizer 1530, electromagnetic induction phenomena may occur, and the magnetic field of electronic pen 360 (e.g., a stylus pen) may be induced into magnetic layer 1534 of digitizer 1530. Magnetic component 1560 may be located below digitizer 1530. At least a portion of conductive layer 1536 of digitizer 1530 may be cut to form slits 1538, thereby reducing saturation of magnetic layer 1534. Further, since the magnetic shield 1580 is provided to at least partially overlap the magnetic assembly 1560, eddy currents formed in the conductive layer 1536 of the digitizer 1530 due to a magnetic field generated by the electronic pen 360 (e.g., a stylus pen) can be reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Fig. 16 is a diagram illustrating an electronic device 1600 in accordance with a particular embodiment of the present disclosure.

Referring to fig. 16, an electronic device 1600 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1610 (e.g., display 200 of fig. 2 and 3), a flex-board 1620, a digitizer 1630, a stand 1650, a magnetic component 1660, a printed circuit board 1670, and a magnetic shield 1680.

To secure the electronic device 1600 in the folded state, the magnetic assembly 1660 may be disposed on an opposite side of the bracket 1650. Grooves or holes may be formed in at least a portion of each of the opposite sides of the bracket 1650, and the magnetic assembly 1660 may be disposed in grooves or holes formed in the opposite sides of the bracket 1650.

As an example, a flexible board 1620 may be disposed under the display 1610 to support the display 1610. The flexible board 1620 may include a lattice portion 1622 such that when the electronic device 1600 is folded, the display 1610 may be smoothly supported, folded, and unfolded in the folding region 1601. When the electronic device 1600 is folded by the lattice portion 1622 of the flexible board 1620, operations according to folding and unfolding can be stably provided.

As an embodiment, digitizer 1630 may be disposed under flex 1620. Magnetic shield 1680 can be disposed between digitizer 1630 and cradle 1650.

By way of example, display 1610 and digitizer 1630 may be electrically connected to printed circuit board 1670. Printed circuit board 1670 can include a processor (e.g., processor 120 in fig. 1), memory (e.g., memory 130 in fig. 1), a digitizer controller to drive digitizer 1630, and a display driver IC to drive display 1610.

As an example, digitizer 1630 may include a coil array layer 1632, a magnetic layer 1634 (e.g., a ferromagnetic plate), and a conductive layer 1636. As an example, the coil array layer 1632 may include a flexible circuit board (FPCB) on which the coils are disposed. The magnetic layer 1634 may include Magnetic Metal Powder (MMP). The conductive layer 1636 of the digitizer 1630 can include an opening 1636a where a portion of the conductive layer is cut. The opening 1636a of the conductive layer 1636 can be formed to at least partially overlap the magnetic shield 1680 and the magnetic assembly 1660.

As an example, the magnetic shield 1680 may be disposed around the side surface 1662 and the bottom surface 1664 of the magnetic assembly 1660. The magnetic shield 1680 can be disposed to cover at least a portion of the top surface 1652 of the bracket 1650.

As an example, the magnetic shield portion 1680 may also be provided on a portion overlapping with the printed circuit board 1670. As an example, the magnetic shield portion 1680 may include amorphous silicon, a cold rolled steel Sheet (SPCC), and/or permalloy.

As an example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus pen) is proximate to the electromagnetic field of digitizer 1630, electromagnetic induction phenomena may occur and the magnetic field of electronic pen 360 (e.g., a stylus pen) may be induced into magnetic layer 1634 of digitizer 1630. Magnetic component 1660 may be located below digitizer 1630. At least a portion of conductive layer 1636 of digitizer 1630 may be cut to form opening 1636a. Since the opening 1636a is formed in at least a portion of the conductive layer 1636, saturation of the magnetic layer 1634 can be reduced. Further, since the magnetic shield 1680 surrounds the magnetic assembly 1660, eddy currents formed in the conductive layer 1636 of the digitizer 1630 due to the magnetic field generated by the electronic pen 360 (e.g., stylus) can be reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Fig. 17 is a diagram illustrating an electronic device 1700 in accordance with a particular embodiment of the present disclosure.

Referring to fig. 17, an electronic device 1700 (e.g., electronic device 101 of fig. 2 and 3) according to certain embodiments of the present disclosure can include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1710 (e.g., display 200 of fig. 2 and 3), a flex-board 1720, a digitizer 1705, a stand 1750, a magnetic assembly 1760, a printed circuit board 1770, a plate 1780, and a magnetic shield 1790.

To secure the electronic device 1700 in the collapsed state, magnetic assemblies 1760 may be disposed on opposite sides of the stand 1750. Grooves or holes may be formed in at least a portion of each of the opposite sides of the bracket 1750, and magnetic assemblies 1760 may be disposed in grooves or holes formed in the opposite sides of the bracket 1750.

As an example, a flexible plate 1720 may be disposed below the display 1710 to support the display 1710. The flexible panel 1720 may include a lattice portion 1722 such that the display 1710 may be smoothly supported, folded, and unfolded in the fold region 1701 when the electronic device 1700 is folded. When the electronic device 1700 is folded by the lattice portion 1722 of the flexible sheet 1720, an operation according to folding and unfolding can be stably provided.

As an embodiment, the digitizer 1705 may be disposed below the flexible plate 1720. The digitizer 1705 may include a coil array layer 1730, a magnetic plate 1740 (e.g., magnetic Metal Powder (MMP)) and a plate 1780. Magnetic plate 1740 may be disposed below coil array layer 1730. Plate 1780 may be disposed below magnetic plate 1740. The magnetic shield 1790 can be disposed under the plate 1780. As an example, the digitizer 1705 can be configured to include a magnetic shield 1790.

By way of example, the display 1710 and the digitizer 1705 may be electrically connected to a printed circuit board 1770. The printed circuit board 1770 can include a processor (e.g., processor 120 of fig. 1), memory (e.g., memory 130 of fig. 1), a digitizer controller to drive the digitizer 1705, and a display driver IC to drive the display 1710.

As an example, the plate 1780 can include an opening 1780a in which at least a portion of the plate is cut. The opening 1780a of the plate 1780 can overlap the magnetic assembly 1760.

As an example, the magnetic shield 1790 can be disposed between the plate 1780 and the magnetic assembly 1760.

As an example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus pen) is proximate to the electromagnetic field of digitizer 1705, electromagnetic induction phenomena may occur and the magnetic field of electronic pen 360 (e.g., a stylus pen) may be induced into digitizer 1705. By providing the magnetic shield 1790 over the entire bottom surface of the digitizer 1705 and forming the opening 1780a in the portion of the plate 1780 that overlaps the magnetic assembly 1760, the effect of the magnetic field of the magnetic assembly 1760 on the digitizer 1705 can be reduced. By reducing eddy currents formed in digitizer 1705 due to the magnetic field generated by electronic pen 360 (e.g., a stylus), saturation of magnetic plate 1740 (e.g., magnetic Metal Powder (MMP)) may be prevented or reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Fig. 18 is a diagram illustrating an electronic device 1800, according to a particular embodiment of the disclosure.

Referring to fig. 18, an electronic device 1800 (e.g., electronic device 101 of fig. 2 and 3) in accordance with certain embodiments of the present disclosure may include an electronic pen (e.g., electronic pen 360 of fig. 6 and 8) (e.g., a stylus), a display 1810 (e.g., display 200 of fig. 2 and 3), a flex-board 1820, a digitizer 1805, a support 1850, a magnetic assembly 1860, and a printed circuit board 1870. The digitizer 1805 can include a coil array layer 1830, a magnetic plate 1840 (e.g., magnetic Metal Powder (MMP)), a plate 1880 (e.g., an electrically conductive plate), and a magnetic shield 1890.

To secure the electronic device 1800 in the folded state, the magnetic assembly 1860 may be disposed on an opposite side of the support 1850. A groove or aperture may be formed in at least a portion of each of the opposite sides of the support 1850, and the magnetic assembly 1860 may be disposed in the groove or aperture formed in the opposite side of the support 1850.

As an example, a flexible board 1820 may be disposed under the display 1810 to support the display 1810. The flexible board 1820 may include a lattice section 1822 such that when the electronic device 1800 is folded, the display 1810 may be smoothly supported, folded, and unfolded in the folding area 1801. When the electronic device 1800 is folded by the lattice portion 1822 of the flexible board 1820, operations according to folding and unfolding can be stably provided.

As an example, digitizer 1805 may be disposed below flexible board 1820. A magnetic plate 1840 may be disposed below the digitizer 1805. The magnetic shield 1890 may be disposed under the magnetic plate 1840. The plate 1880 may be disposed under the magnetic shield portion 1890.

By way of example, the display 1810 and the digitizer 1805 may be electrically connected to the printed circuit board 1870. Printed circuit board 1870 can include a processor (e.g., processor 120 in fig. 1), memory (e.g., memory 130 in fig. 1), a digitizer controller to drive digitizer 1805, and a display driver IC to drive display 1810.

As an example, the magnetic shield 1890 may be disposed between the magnetic plate 1840 and the plate 1780. The magnetic shield 1890 can overlap the digitizer 1805 and the plate 1880. The plate 1880 may be disposed between the magnetic shield portion 1890 and the bracket 1850. The plate 1880 may overlap the magnetic shield 1890 and the magnetic assembly 1860.

By way of example, when an electronic pen (e.g., electronic pen 360 in fig. 6 and 8) (e.g., a stylus) is proximate to the electromagnetic field of digitizer 1805, electromagnetic induction phenomena may occur and the magnetic field of electronic pen 360 (e.g., a stylus) may be induced into digitizer 1805. By providing the magnetic shield 1890 over the entire bottom surface of the digitizer 1805 and providing the plate 1880 over the entire bottom surface of the magnetic shield 1890, the effect of the magnetic field of the magnetic assembly 1860 on the digitizer 1805 can be reduced. By reducing eddy currents formed in digitizer 1805 due to the magnetic field generated by electronic pen 360 (e.g., a stylus), saturation of magnetic plate 1840 (e.g., magnetic Metal Powder (MMP)) may be prevented or reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

Referring to fig. 19, a holder 1910 of an electronic device 1900 may be formed using a metallic material (such as aluminum), and a display module (e.g., display module 160 of fig. 1) may be attached to the holder 1910. A groove or aperture 1912 may be formed in a portion of the holder 1910, and a magnetic assembly 1920 may be disposed within the groove or aperture 1912 of the holder 1910. At this time, when the stent 1910 is formed in a closed loop, an eddy current 1930 may be generated.

Fig. 20 is a diagram illustrating a bracket (e.g., an aluminum bracket) disposed around a magnetic assembly according to a particular embodiment of the present disclosure. Bracket 2010 includes a gap 2014 to reduce eddy currents.

Referring to fig. 20, a recess or hole 2012 may be formed in a bracket 2010 of the electronic device 2000, and a magnetic assembly 2020 may be disposed in the recess or hole 2012 of the bracket 2010. At this time, in order to reduce the magnitude of the eddy current, a slit 2014 may be formed in at least a portion of the stent 2010 so that a closed loop is not formed in the stent 2010.

As an example, the gap 2014 may be formed in a portion adjacent to the magnetic assembly 2020 in the entire region of the bracket 2010. The gap 2014 may be formed in a portion adjacent to one side surface of the magnetic assembly 2020. The present disclosure is not limited thereto, and a plurality of slits may be formed in portions adjacent to a plurality of side surfaces of the magnetic assembly 2020. In this way, by forming the slit 2014 in the holder 2010, the magnitude of the eddy current can be reduced, and the influence of the eddy current on the digitizer can be reduced. Thus, coordinate distortion due to non-uniformity of pen pressure or signal distortion of the electronic pen 360 (e.g., a stylus) may be prevented or reduced.

An electronic device (e.g., electronic device 101 in fig. 2 and 3, electronic device 1000 in fig. 10, electronic device 1100 in fig. 11, electronic device 1200 in fig. 12, electronic device 1300 in fig. 13, electronic device 1400 in fig. 14, electronic device 1500 in fig. 15, electronic device 1600 in fig. 16, electronic device 1700 in fig. 17, electronic device 1800 in fig. 18, electronic device 1900 in fig. 19, or electronic device 2000 in fig. 20) according to certain embodiments of the present disclosure may include: a display (e.g., display 200 in fig. 2 and 3, display 1010 in fig. 10, display 1110 in fig. 11, display 1210 in fig. 12, display 1310 in fig. 13, display 1410 in fig. 14, display 1510 in fig. 15, display 1610 in fig. 16, display 1710 in fig. 17, or display 1810 in fig. 18); coil array layers (e.g., coil array layer 410 in fig. 4, coil array layer 610 in fig. 6, coil array layer 810 in fig. 8, coil array layer 1032 in fig. 10, coil array layer 1132 in fig. 11, coil array layer 1232 in fig. 12, coil array layer 1332 in fig. 13, coil array layer 1432 in fig. 14, coil array layer 1532 in fig. 15, coil array layer 1632 in fig. 16, coil array layer 1730 in fig. 17, or coil array layer 1830 in fig. 18) are disposed below the display; a magnetic layer (e.g., magnetic layer 420 in fig. 4, magnetic layer 620 in fig. 6, magnetic layer 820 in fig. 8, magnetic layer 1034 in fig. 10, magnetic layer 1134 in fig. 11, magnetic layer 1234 in fig. 12, magnetic layer 1334 in fig. 13, magnetic layer 1434 in fig. 14, magnetic layer 1534 in fig. 15, or magnetic layer 1634 in fig. 16) is disposed below coil array layer 410, 610, 810, 1032, 1132, 1232, 1332, 1432, 1532, 1632, 1730, or 1830; a conductive layer (e.g., conductive layer 430 in fig. 4, conductive layer 630 in fig. 6, conductive layer 830 in fig. 8, conductive layer 1036 in fig. 10, conductive layer 1136 in fig. 11, conductive layer 1236 in fig. 12, conductive layer 1336 in fig. 13, conductive layer 1436 in fig. 14, conductive layer 1536 in fig. 15, or conductive layer 1636 in fig. 16) is disposed under magnetic layer 420, 620, 820, 1034, 1134, 1234, 1334, 1434, 1534, or 1634; a conductive plate (e.g., plate 640 in fig. 6, plate 840 in fig. 8, plate 1040 in fig. 10, plate 1140 in fig. 11, plate 1240 in fig. 12, plate 1340 in fig. 13, plate 1780 in fig. 17, or plate 1880 in fig. 18) is disposed below the conductive layer; a rack (e.g., rack 1050 in fig. 10, rack 1150 in fig. 11, rack 1250 in fig. 12, rack 1350 in fig. 13, rack 1450 in fig. 14, rack 1550 in fig. 15, rack 1650 in fig. 16, rack 1750 in fig. 17, rack 1850 in fig. 18, rack 1910 in fig. 19, or rack 2010 in fig. 20); and magnetic assemblies (e.g., magnetic assembly 440 in fig. 4, magnetic assembly 650 in fig. 6, magnetic assembly 850 in fig. 8, magnetic assembly 1060 in fig. 10, magnetic assembly 1160 in fig. 11, magnetic assembly 1260 in fig. 12, magnetic assembly 1360 in fig. 13, magnetic assembly 1460 in fig. 14, magnetic assembly 1560 in fig. 15, magnetic assembly 1660 in fig. 16, magnetic assembly 1760 in fig. 17, magnetic assembly 1860 in fig. 18, magnetic assembly 1920 in fig. 19, or magnetic assembly 2020 in fig. 20) are provided on the support. The conductive plate 640, 840, 1040, 1140, 1240, 1340, 1780, or 1880 may be disposed under the digitizer 400, 600, 800, 1030, 1130, 1230, 1330, 1430, 1530, 1630, 1705, or 1805. The support 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010 may be disposed under the conductive plate 640, 840, 1040, 1140, 1240, 1340, 1780, or 1880. The magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 may be disposed below the support 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010. The conductive layer 430, 630, 830, 1036, 1136, 1236, 1336, 1436, 1536, or 1636 has a first opening, and the first opening and the magnetic component 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 may at least partially overlap each other.

According to an embodiment, at least a portion of the conductive plate 640, 840, 1040, 1140, 1240, 1340, 1780 or 1880 may have a second opening. The second opening and the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 are at least partially stacked upon one another.

According to an embodiment, the first opening may have a first width. The second opening may have a second width that is wider than the first width.

According to an embodiment, an electronic device 101, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, or 2000 according to particular embodiments of the present disclosure may further include a magnetic shielding layer disposed in the first opening.

According to an embodiment, the magnetic shielding layer may include amorphous silicon, a cold rolled steel Sheet (SPCC), or permalloy.

According to an embodiment, the magnetic shield layer may overlap the entire top surface of the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020.

According to an embodiment, the magnetic shield layer may be spaced apart from an end of the magnetic layer 420, 620, 820, 1034, 1134, 1234, 1334, 1434, 1534, or 1634 by a predetermined distance, and may overlap a portion of a top surface of the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020.

According to an embodiment, the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 may be disposed in a groove or hole formed in the bracket 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010. A gap may be formed in at least a portion of the bracket 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010 that is located adjacent to the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020.

An electronic device (e.g., electronic device 101 in fig. 2 and 3, electronic device 1000 in fig. 10, electronic device 1100 in fig. 11, electronic device 1200 in fig. 12, electronic device 1300 in fig. 13, electronic device 1400 in fig. 14, electronic device 1500 in fig. 15, electronic device 1600 in fig. 16, electronic device 1700 in fig. 17, electronic device 1800 in fig. 18, electronic device 1900 in fig. 19, or electronic device 2000 in fig. 20) according to certain embodiments of the present disclosure may include: a display (e.g., display 200 in fig. 2 and 3, display 1010 in fig. 10, display 1110 in fig. 11, display 1210 in fig. 12, display 1310 in fig. 13, display 1410 in fig. 14, display 1510 in fig. 15, display 1610 in fig. 16, display 1710 in fig. 17, or display 1810 in fig. 18); coil array layers (e.g., coil array layer 410 in fig. 4, coil array layer 610 in fig. 6, coil array layer 810 in fig. 8, coil array layer 1032 in fig. 10, coil array layer 1132 in fig. 11, coil array layer 1232 in fig. 12, coil array layer 1332 in fig. 13, coil array layer 1432 in fig. 14, coil array layer 1532 in fig. 15, coil array layer 1632 in fig. 16, coil array layer 1730 in fig. 17, or coil array layer 1830 in fig. 18) are disposed below the display; a magnetic layer (e.g., magnetic layer 420 in fig. 4, magnetic layer 620 in fig. 6, magnetic layer 820 in fig. 8, magnetic layer 1034 in fig. 10, magnetic layer 1134 in fig. 11, magnetic layer 1234 in fig. 12, magnetic layer 1334 in fig. 13, magnetic layer 1434 in fig. 14, magnetic layer 1534 in fig. 15, or magnetic layer 1634 in fig. 16) is disposed below coil array layer 410, 610, 810, 1032, 1132, 1232, 1332, 1432, 1532, 1632, 1730, or 1830; a conductive layer (e.g., conductive layer 430 in fig. 4, conductive layer 630 in fig. 6, conductive layer 830 in fig. 8, conductive layer 1036 in fig. 10, conductive layer 1136 in fig. 11, conductive layer 1236 in fig. 12, conductive layer 1336 in fig. 13, conductive layer 1436 in fig. 14, conductive layer 1536 in fig. 15, or conductive layer 1636 in fig. 16) is disposed under magnetic layer 420, 620, 820, 1034, 1134, 1234, 1334, 1434, 1534, or 1634; a conductive plate (e.g., plate 640 in fig. 6, plate 840 in fig. 8, plate 1040 in fig. 10, plate 1140 in fig. 11, plate 1240 in fig. 12, plate 1340 in fig. 13, plate 1780 in fig. 17, or plate 1880 in fig. 18); a bracket (e.g., bracket 1050 in fig. 10, bracket 1150 in fig. 11, bracket 1250 in fig. 12, bracket 1350 in fig. 13, bracket 1450 in fig. 14, bracket 1550 in fig. 15, bracket 1650 in fig. 16, bracket 1750 in fig. 17, bracket 1850 in fig. 18, bracket 1910 in fig. 19, or bracket 2010 in fig. 20) is positioned below the conductive plate; magnetic assemblies (e.g., magnetic assembly 440 in fig. 4, magnetic assembly 650 in fig. 6, magnetic assembly 850 in fig. 8, magnetic assembly 1060 in fig. 10, magnetic assembly 1160 in fig. 11, magnetic assembly 1260 in fig. 12, magnetic assembly 1360 in fig. 13, magnetic assembly 1460 in fig. 14, magnetic assembly 1560 in fig. 15, magnetic assembly 1660 in fig. 16, magnetic assembly 1760 in fig. 17, magnetic assembly 1860 in fig. 18, magnetic assembly 1920 in fig. 19, or magnetic assembly 2020 in fig. 20); and a magnetic shield portion (e.g., the magnetic shield portion 1480 in fig. 14, the magnetic shield portion 1580 in fig. 15, the magnetic shield portion 1680 in fig. 16, the magnetic shield portion 1790 in fig. 17, or the magnetic shield portion 1890 in fig. 18). The conductive plates 640, 840, 1040, 1140, 1240, 1340, 1780 or 1880 may be disposed under the conductive layer. The support 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010 may be disposed under the conductive plate 640, 840, 1040, 1140, 1240, 1340, 1780, or 1880. The magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 may be disposed above/below the brackets 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010 and below the conductive plates. The magnetic shield can be disposed between the digitizer 400, 600, 800, 1030, 1130, 1230, 1330, 1430, 1530, 1630, 1705, or 1805 and the bracket 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010 and can overlap at least a portion of a top surface of the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020. The digitizer 400, 600, 800, 1030, 1130, 1230, 1330, 1430, 1530, 1630, 1705, or 1805 is configured such that the conductive layers 430, 630, 830, 1036, 1136, 1236, 1336, 1436, 1536, or 1636 have a first opening, and the first opening and the magnetic component 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1920, or 2020 can be configured to at least partially overlie one another.

According to an embodiment, an electronic device 101, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, or 2000, a conductive layer 430, 630, 830, 1036, 1136, 1236, 1336, 1436, 1536, or 1636 according to particular embodiments of the present disclosure may include a plurality of slits.

According to an embodiment, a plurality of slits, magnetic shields 1480, 1580, 1680, 1790 or 1890, and magnetic assemblies 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920 or 2020 are stacked on top of each other.

According to an embodiment, the magnetic shield portion 1480, 1580, 1680, 1790 or 1890 may include amorphous silicon, a cold rolled steel Sheet (SPCC) or permalloy.

According to an embodiment, the magnetic shield 1480, 1580, 1680, 1790 or 1890 may overlap with the entire top surface of the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920 or 2020.

According to an embodiment, the magnetic shield 1480, 1580, 1680, 1790 or 1890 may be spaced apart from an end of the magnetic layer 420, 620, 820, 1034, 1134, 1234, 1334, 1434, 1534 or 1634 and may overlap a portion of a top surface of the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1920 or 2020.

An electronic device (e.g., electronic device 101 in fig. 2 and 3, electronic device 1000 in fig. 10, electronic device 1100 in fig. 11, electronic device 1200 in fig. 12, electronic device 1300 in fig. 13, electronic device 1400 in fig. 14, electronic device 1500 in fig. 15, electronic device 1600 in fig. 16, electronic device 1700 in fig. 17, electronic device 1800 in fig. 18, electronic device 1900 in fig. 19, or electronic device 2000 in fig. 20) according to certain embodiments of the present disclosure may include: a display (e.g., display 200 in fig. 2 and 3, display 1010 in fig. 10, display 1110 in fig. 11, display 1210 in fig. 12, display 1310 in fig. 13, display 1410 in fig. 14, display 1510 in fig. 15, display 1610 in fig. 16, display 1710 in fig. 17, or display 1810 in fig. 18); coil array layers (e.g., coil array layer 410 in fig. 4, coil array layer 610 in fig. 6, coil array layer 810 in fig. 8, coil array layer 1032 in fig. 10, coil array layer 1132 in fig. 11, coil array layer 1232 in fig. 12, coil array layer 1332 in fig. 13, coil array layer 1432 in fig. 14, coil array layer 1532 in fig. 15, coil array layer 1632 in fig. 16, coil array layer 1730 in fig. 17, or coil array layer 1830 in fig. 18); a magnetic layer (e.g., magnetic layer 420 in fig. 4, magnetic layer 620 in fig. 6, magnetic layer 820 in fig. 8, magnetic layer 1034 in fig. 10, magnetic layer 1134 in fig. 11, magnetic layer 1234 in fig. 12, magnetic layer 1334 in fig. 13, magnetic layer 1434 in fig. 14, magnetic layer 1534 in fig. 15, or magnetic layer 1634 in fig. 16) is disposed below coil array layer 410, 610, 810, 1032, 1132, 1232, 1332, 1432, 1532, 1632, 1730, or 1830; a conductive layer (e.g., conductive layer 430 in fig. 4, conductive layer 630 in fig. 6, conductive layer 830 in fig. 8, conductive layer 1036 in fig. 10, conductive layer 1136 in fig. 11, conductive layer 1236 in fig. 12, conductive layer 1336 in fig. 13, conductive layer 1436 in fig. 14, conductive layer 1536 in fig. 15, or conductive layer 1636 in fig. 16) is disposed under magnetic layer 420, 620, 820, 1034, 1134, 1234, 1334, 1434, 1534, or 1634; a conductive plate (e.g., plate 640 in fig. 6, plate 840 in fig. 8, plate 1040 in fig. 10, plate 1140 in fig. 11, plate 1240 in fig. 12, plate 1340 in fig. 13, plate 1780 in fig. 17, or plate 1880 in fig. 18); a rack (e.g., rack 1050 in fig. 10, rack 1150 in fig. 11, rack 1250 in fig. 12, rack 1350 in fig. 13, rack 1450 in fig. 14, rack 1550 in fig. 15, rack 1650 in fig. 16, rack 1750 in fig. 17, rack 1850 in fig. 18, rack 1910 in fig. 19, or rack 2010 in fig. 20); magnetic assemblies (e.g., magnetic assembly 440 in fig. 4, magnetic assembly 650 in fig. 6, magnetic assembly 850 in fig. 8, magnetic assembly 1060 in fig. 10, magnetic assembly 1160 in fig. 11, magnetic assembly 1260 in fig. 12, magnetic assembly 1360 in fig. 13, magnetic assembly 1460 in fig. 14, magnetic assembly 1560 in fig. 15, magnetic assembly 1660 in fig. 16, magnetic assembly 1760 in fig. 17, magnetic assembly 1860 in fig. 18, magnetic assembly 1920 in fig. 19, or magnetic assembly 2020 in fig. 20); and a magnetic shield portion (e.g., the magnetic shield portion 1480 in fig. 14, the magnetic shield portion 1580 in fig. 15, the magnetic shield portion 1680 in fig. 16, the magnetic shield portion 1790 in fig. 17, or the magnetic shield portion 1890 in fig. 18). The digitizer 400, 600, 800, 1030, 1130, 1230, 1330, 1430, 1530, 1630, 1705, or 1805 may be disposed under the display 200, 1010, 1110, 1210, 1310, 1410, 1510, 1610, 1710, or 1810. The conductive plate 640, 840, 1040, 1140, 1240, 1340, 1780, or 1880 may be disposed under the digitizer 400, 600, 800, 1030, 1130, 1230, 1330, 1430, 1530, 1630, 1705, or 1805. The support 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010 may be disposed under the conductive plate 640, 840, 1040, 1140, 1240, 1340, 1780, or 1880. The magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 may be disposed below the support 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910, or 2010. The magnetic shield 1480, 1580, 1680, 1790 or 1890 may be provided to cover at least one surface of the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920 or 2020. The conductive layer 430, 630, 830, 1036, 1136, 1236, 1336, 1436, 1536, or 1636 has a first opening. The first opening and the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 may be disposed at least partially over one another.

According to an embodiment, the magnetic shield 1480, 1580, 1680, 1790 or 1890 may surround one side surface and the bottom surface of the magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920 or 2020.

According to an embodiment, the magnetic shield portion 1480, 1580, 1680, 1790 or 1890 may cover the top surface of the bracket 1050, 1150, 1250, 1350, 1450, 1550, 1650, 1750, 1850, 1910 or 2010.

According to an embodiment, the conductive plate 640, 840, 1040, 1140, 1240, 1340, 1780 or 1880 may have a second opening. The second opening and magnetic assembly 440, 650, 850, 1060, 1160, 1260, 1360, 1460, 1560, 1660, 1760, 1860, 1920, or 2020 may be disposed at least partially over one another. The first opening may have a first width. The second opening may have a second width that is wider than the first width.

The electronic device according to certain embodiments of the present disclosure can reduce the influence of the magnetic field of the magnetic assembly and the generation of eddy currents, thereby preventing or reducing coordinate distortion due to non-uniformity of pen pressure or signal distortion of an electronic pen (e.g., a stylus pen).

Although specific embodiments have been described, it should be understood that the present disclosure is not limited to the foregoing embodiments. Furthermore, although embodiments herein have been described with a certain degree of particularity, it should be understood that the embodiments may be modified and that certain features may be omitted or modified without departing from the scope of this document.

Claims

1. An electronic device, comprising:

a display;

a coil array layer disposed below the display;

a magnetic layer disposed under the coil array layer;

a conductive layer disposed below the magnetic layer;

a conductive plate disposed under the conductive layer;

the bracket is arranged below the conductive plate; and

a magnetic component arranged on the bracket and below the conductive plate,

wherein the conductive layer has a first opening, and

the first opening and the magnetic assembly are at least partially stacked on one another.

2. The electronic device of claim 1, wherein the conductive plate has a second opening, and

the second opening and the magnetic assembly are at least partially stacked on each other.

3. The electronic device of claim 2, wherein the first opening has a first width, and

The second opening has a second width that is wider than the first width.

4. The electronic device of claim 1, the electronic device further comprising:

and a magnetic shield layer disposed in the first opening.

5. The electronic device of claim 4, wherein the magnetic shielding layer comprises amorphous silicon, a cold rolled steel Sheet (SPCC), or permalloy.

6. The electronic device of claim 4, wherein the magnetic shielding layer overlaps an entire top surface of the magnetic assembly.

7. The electronic device of claim 4, wherein the magnetic shield layer is spaced apart from an end of the magnetic layer and overlaps a portion of a top surface of the magnetic assembly.

8. The electronic device of claim 4, wherein the magnetic component is disposed in a recess or hole formed in the bracket, and

a slot is formed in at least a portion of the bracket that is located adjacent the magnetic assembly.