CN117750830A - Display panel - Google Patents

Abstract

The application discloses a display panel, wherein a light-transmitting display area comprises a plurality of light-proof unit areas which are connected with each other and a plurality of light-transmitting unit areas which are arranged at intervals; the light-proof unit areas are provided with a plurality of sub-pixels, the light-proof unit areas and the light-proof unit areas are arranged in an array, the light-proof unit areas and the light-proof unit areas of the same row are alternately arranged, and the light-proof unit areas of the same column are alternately arranged; the boundary between the adjacent light-transmitting unit area and the non-light-transmitting unit area is an arc; the light-transmitting unit area is a first quadrangle of a cross-section graph on a plane parallel to the first direction and the second direction, and four sides of the first quadrangle are convex circular arcs of non-concentric centers. According to the method, the light-transmitting unit area is prepared into the first quadrangle of the convex arc, so that more pixel area can be utilized, the opening area of the light-transmitting display area is increased, the diffraction range of the transmission hole is reduced, the light diffraction is reduced, and the visual imaging and the shooting effects are more uniform.

Description

Display panel

Technical Field

The application relates to the technical field of display, in particular to a display panel.

Background

With the increasing development of display technology, various new display technologies are continuously emerging. In order to meet the needs of users, local functional areas of some OLED (Organic Light-Emitting Diode) display devices are required to have high Light transmittance while normally displaying images. However, the under-screen sensing element in the related art is affected by the problem of light diffraction, so that the display and image capturing effects are not ideal.

Disclosure of Invention

In view of this, the present application provides a display panel to solve the problem that the under-screen sensing element is affected by the light diffraction problem in the prior art, so that the display and the image capturing effect are not ideal.

In order to solve the technical problems, the technical scheme provided by the application is as follows: a display panel is provided, including a light-transmitting display region; the light-transmitting display area comprises a plurality of light-proof unit areas which are connected with each other and a plurality of light-transmitting unit areas which are arranged at intervals; the light-tight unit areas are provided with a plurality of sub-pixels, a plurality of light-tight unit areas and a plurality of light-tight unit areas are arranged in an array, the light-tight unit areas and the light-tight unit areas of the same row are alternately arranged, and the light-tight unit areas of the same column are alternately arranged; the boundaries of the adjacent light-transmitting unit areas and the light-non-transmitting unit areas are circular arcs; the light-transmitting unit area is a first quadrangle of a cross-section graph on a plane parallel to the first direction and the second direction, and four sides of the first quadrangle are convex circular arcs with non-concentric centers.

In an embodiment, four sides of the first quadrangle are convex circular arcs with the same length; the corner of the first quadrangle is also an outward convex arc, and the radius R1 of the corner arc of the first quadrangle is smaller than the radius R2 of the arc of the side of the first quadrangle.

In an embodiment, the maximum distance of the opposite corners of the first quadrangle is D1, and the maximum distance of the opposite sides of the first quadrangle is D2, where D1 is greater than or equal to 2×r1, D2 is less than or equal to 2×r2, and D1 is greater than or equal to D2.

In an embodiment, the shape of a pattern formed by splicing the plurality of sub-pixels in the same opaque unit area is the same as the shape of the opaque unit area, and the sub-pixels in adjacent two different colors are isolated only by a conductive isolation structure.

In one embodiment, the conductive partition structure of the opaque unit area includes an annular conductive partition structure and a split conductive partition structure; the annular conductive partition structure extends along the boundary of the opaque unit area to form an annular shape, and the plurality of the partition conductive partition structures are positioned in the annular conductive partition structure and divide the area in the annular conductive partition structure into a plurality of sub-pixel areas; one sub-pixel is arranged corresponding to each sub-pixel area; the two light-proof unit areas connected with each other share part of the annular conductive partition structure at the joint.

In one embodiment, the annular conductive partition structure is broken to form a notch in a region other than the connection of the two light-impermeable unit areas connected to each other.

In one embodiment, the conductive partition structure of the opaque unit area includes an annular conductive partition structure and a split conductive partition structure; the annular conductive partition structure extends along the boundary of the opaque unit area to form an annular shape, and the plurality of the partition conductive partition structures are positioned in the annular conductive partition structure and divide the area in the annular conductive partition structure into a plurality of sub-pixel areas; each sub-pixel region is internally provided with one sub-pixel; the annular conductive partition structure is disconnected at the joint of the two light-tight unit areas which are connected with each other, and the two sub-pixels at the joint of the two light-tight unit areas which are connected with each other are the same in color and are connected with each other; or (b)

The conductive partition structure of the opaque unit area comprises a plurality of partition conductive partition structures, the opaque unit area is partitioned into a plurality of sub-pixel areas by the partition conductive partition structures, and each sub-pixel area is internally provided with one sub-pixel; and annular conductive partition structures are not arranged along the boundary of the light-tight unit areas, and the two sub-pixels at the joint of the two light-tight unit areas which are connected with each other have the same color and are connected with each other.

In one embodiment, the annular conductive partition structure comprises a conductive part and a partition part arranged at the top of the conductive part, and the partition part extends out of the conductive part towards the inner side of the annular conductive partition structure; wherein the isolating part extends out of the conductive part towards one side outside the ring of the annular conductive isolating structure; or the isolating part is flush with the conductive part at one side outside the ring of the annular conductive isolating structure.

In one embodiment, a portion of the display panel located in the opaque unit area includes: a substrate; a buffer layer disposed on the substrate; the driving circuit layer is arranged on one side of the buffer layer away from the substrate; the flattening layer is arranged on one side of the driving circuit layer, which is far away from the substrate; the anode conducting layer is arranged on one side of the planarization layer, which is far away from the substrate, and comprises a plurality of anode electrodes; the pixel definition layer is arranged on one side of the anode conductive layer away from the substrate; the pixel defining layer has a plurality of openings exposing the anode electrode; the conductive partition structure is arranged on one side of the pixel definition layer, which is far away from the substrate, and a sub-pixel area is defined around the opening; the conductive partition structure comprises a conductive part and a partition part arranged on one side of the conductive part far away from the pixel definition layer, wherein the partition part extends out of the conductive part, and the conductive parts of the plurality of opaque unit areas are connected into a conductive network; an organic light emitting layer including a plurality of organic light emitting units, each of the organic light emitting units being disposed in one of the sub-pixel regions; the cathode conducting layer is arranged on one side of the organic light-emitting layer, far away from the substrate, and comprises a plurality of cathode electrodes, each cathode electrode is arranged corresponding to one organic light-emitting unit, and two cathode electrodes positioned on two opposite sides of the conductive partition structure are electrically connected through conductive parts of the conductive partition structure; the anode electrode, the organic light emitting unit and the cathode electrode are stacked to form one sub-pixel; an encapsulation layer covering the conductive partition structure and the sub-pixels; the packaging layers comprise a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked; a cover plate covering the encapsulation layer; a shading layer is arranged between the flattening layer and the driving circuit layer; or the projection of the edge of the conductive part and the edge of the anode electrode on the substrate is overlapped, and the conductive part and the anode electrode are matched to form a shading layer.

In one embodiment, a portion of the display panel located in the light-transmitting unit region includes: the substrate; the buffer layer is arranged on the surface of the substrate; the organic packaging layer is arranged on the surface of the buffer layer, which is far away from the substrate, and the second inorganic packaging layer is arranged on the surface of the organic packaging layer, which is far away from the substrate; the cover plate is arranged on the surface, far away from the substrate, of the second inorganic packaging layer; or alternatively, the first and second heat exchangers may be,

the portion of the display panel located in the light transmitting unit region includes: the substrate; the buffer layer is arranged on the surface of the substrate; the cover plate is arranged at intervals with the buffer layer; wherein, air is filled between the cover plate and the buffer layer; the organic packaging layer covers the side surfaces of the driving circuit layer, the planarization layer, the pixel definition layer and the conductive partition structure, and the second inorganic packaging layer covers the outer side of the organic packaging layer; or alternatively, the first and second heat exchangers may be,

the portion of the display panel located in the light transmitting unit region includes: the substrate; the buffer layer is arranged on the surface of the substrate; the cover plate is arranged at intervals with the buffer layer; wherein, air is filled between the cover plate and the buffer layer; the first inorganic packaging layer covers the side surfaces of the driving circuit layer, the planarization layer, the pixel definition layer and the conductive partition structure, the organic packaging layer covers the outer side of the first inorganic packaging layer, and the second inorganic packaging layer covers the outer side of the organic packaging layer.

The beneficial effects of this application: unlike the prior art, the display panel of the present application includes a light-transmissive display region; the light-transmitting display area comprises a plurality of light-proof unit areas which are connected with each other and a plurality of light-transmitting unit areas which are arranged at intervals; the light-tight unit areas are provided with a plurality of sub-pixels, a plurality of light-tight unit areas and a plurality of light-tight unit areas are arranged in an array, the light-tight unit areas and the light-tight unit areas of the same row are alternately arranged, and the light-tight unit areas of the same column are alternately arranged; the boundaries of the adjacent light-transmitting unit areas and the light-non-transmitting unit areas are circular arcs; the light-transmitting unit area is a first quadrangle of a cross-section graph on a plane parallel to the first direction and the second direction, and four sides of the first quadrangle are convex circular arcs with non-concentric centers. According to the method, the light-transmitting unit area is prepared into the first quadrangle of the convex arc, so that more pixel area can be utilized, the opening area of the light-transmitting display area is increased, the diffraction range of the transmission hole is reduced, the light diffraction is reduced, and the visual imaging and the shooting effects are more uniform.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view of a display panel provided in the present application;

FIG. 2 is a schematic diagram of a light-transmitting display area according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of the first quadrilateral provided herein;

FIG. 4 is an enlarged partial schematic view of a portion C of the junction of the opaque cell regions of FIG. 2;

FIG. 5 is a schematic view of the structure of the present application dividing the area within one annular conductive partition structure into a plurality of sub-pixel areas;

FIG. 6 is a schematic view of a first configuration of a plurality of sub-pixels in an opaque unit area provided herein;

FIG. 7 is a schematic view of a second configuration of a plurality of sub-pixels within an opaque unit area provided herein;

FIG. 8 is a schematic view of a third configuration of a plurality of sub-pixels in an opaque unit area provided herein;

FIG. 9 is a schematic diagram of a fourth configuration of a plurality of sub-pixels within an opaque unit area provided herein;

FIG. 10 is a cross-sectional view of one construction provided herein along line A-A of FIG. 2;

FIG. 11 is another structural cross-sectional view taken along line A-A of FIG. 2 provided herein;

FIG. 12 is a schematic view of a light transmissive display area according to another embodiment of the present disclosure;

FIG. 13 is an enlarged partial view of a portion of the junction C' of the opaque cell region of FIG. 12;

FIG. 14 is a cross-sectional view taken along line D-D of FIG. 13, provided herein;

FIG. 15 is a schematic view of a structure of a removed portion of a ring-shaped conductive partition structure according to an embodiment of the present application

FIG. 16 is a schematic view of a structure for removing all annular conductive partition structures provided in another embodiment of the present application;

FIG. 17 is a cross-sectional view of the first construction taken along line B-B of FIG. 2, showing the partition extending out of the conductive portion to one side of the loop of the annular conductive partition;

FIG. 18 is a cross-sectional view of a second construction provided herein along line B-B of FIG. 2;

FIG. 19 is a cross-sectional view of a third construction provided herein along line B-B of FIG. 2;

fig. 20 is a cross-sectional view of the first construction provided herein along line B-B of fig. 2, showing the partition being flush with the conductive portion on the outer ring side of the annular conductive partition.

Reference numerals illustrate:

100. a light-transmitting display area; 200. a display panel; 300. a conventional display area; r1, the radius of the corner arc; r2, the arc radius of the edge of the first quadrangle; d1, maximum distance of opposite angles; d2, maximum distance between opposite sides; 10. an opaque cell region; 101. a notch; 102. a junction; 11. a second quadrangle; 110. a sub-pixel region; 1101. a driving circuit layer; 1102. a light shielding layer; 1103. a planarization layer; 1104. a pixel definition layer; 1105. an anode electrode; 1106. an organic light emitting unit; 1107. a cathode electrode; 1108. a conductive hole; 111. a third sub-pixel; 112. a second subpixel; 113. a first subpixel; 11021. a first via; 11031. a second via; 12. a substrate; 13. a buffer layer; 14. an encapsulation layer; 141. a first inorganic encapsulation layer; 142. an organic encapsulation layer; 143. a second inorganic encapsulation layer; 15. a cover plate; 16. a pixel unit; 20. a light transmitting unit region; 201. a corner; 21. a first quadrilateral; 50. a conductive partition structure; 51. a conductive portion; 52. a partition portion; 501. an annular conductive partition structure; 502. and dividing the conductive partition structure.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The terms "first," "second," and the like, herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "first", "second", or "first" may include at least one such feature, either explicitly or implicitly. All directional indications (such as up, down, left, right, front, back … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In order to meet the needs of users, the local functional area of some OLED display devices needs to set a light-transmitting display area in the screen area above the light sensing device (mainly the under-screen camera area) while displaying images normally. Applicants have found that the shape of the light transmissive and opaque cell regions of a light transmissive display region is related to light diffraction, e.g., light transmissive boundary lines and sharp corners tend to increase the range of diffraction. In order to reduce the influence of light diffraction on the under-screen light sensing element, the boundary of the light transmission unit area is designed to be an outer convex arc of a non-concentric center, so that the problems of light diffraction and influence on imaging effect and display effect in the prior art are solved.

Referring to fig. 1 to 5, fig. 1 is a schematic diagram of a display panel provided in the present application; FIG. 2 is a schematic diagram of a light-transmitting display area according to an embodiment of the present disclosure; FIG. 3 is a schematic view of the first quadrilateral provided herein; FIG. 4 is an enlarged partial schematic view of a portion C of the junction of the opaque cell regions of FIG. 2; fig. 5 is a schematic structural view of dividing a region in an annular conductive partition structure into a plurality of sub-pixel regions.

The display panel 200 provided herein includes a light transmissive display region 100; the light-transmitting display area 100 includes a plurality of light-impermeable unit areas 10 connected to each other and a plurality of light-transmitting unit areas 20 arranged at intervals; the opaque unit areas 10 are provided with a plurality of sub-pixels, the plurality of opaque unit areas 10 and the plurality of transparent unit areas 20 are arranged in an array, the opaque unit areas 10 and the transparent unit areas 20 of the same row are alternately arranged, and the opaque unit areas 10 and the transparent unit areas 20 of the same column are alternately arranged. Wherein, the boundary between the adjacent light-transmitting unit area 20 and the light-non-transmitting unit area 10 is an arc; the light-transmitting unit area 20 is a first quadrilateral 21, and four sides of the first quadrilateral 21 are convex arcs with non-concentric centers. Accordingly, the cross-sectional pattern of the opaque unit area 10 on the plane parallel to the first direction and the second direction is a second quadrangle 11, and four sides of the second quadrangle 11 are concave arcs.

It is understood that the area of the display panel 200 other than the light transmissive display area 100 may be the conventional display area 300. The conventional display area 300 is typically an opaque area.

In one embodiment, the four sides of the first quadrilateral 21 are convex arcs with the same length; the corner 201 of the first quadrangle 21 is also an outward convex arc, and the radius R1 of the arc of the corner 201 of the first quadrangle 21 is smaller than the radius R2 of the arc of the side of the first quadrangle 21, i.e. the area of the first quadrangle 21 is smaller than the area of the circle formed by each side and is also larger than the area of the rectangle with four sides being straight lines. Accordingly, the four sides of the second quadrangle 11 are concave arcs with the same length, so that the area of the first quadrangle 21 adopted by the light-transmitting unit area 20 is obviously larger than that of the second quadrangle 11 adopted by the light-non-transmitting unit area 10.

In an embodiment, as shown in fig. 3, the maximum distance of the opposite corners of the first quadrangle 21 is D1, and the maximum distance of the opposite sides of the first quadrangle 21 is D2, wherein D1 is equal to or greater than 2×r1, D2 is equal to or less than 2×r2, and D1 is equal to or greater than D2, so that the first quadrangle 21 has a larger area to improve the light transmission capability, and meanwhile, each arc side of the first quadrangle 21 is excessively curved, so that the strong light diffraction caused by the sharp area can be limited and improved.

Each opaque unit area 10 is provided with a plurality of sub-pixels, for example, three sub-pixels, namely, a first sub-pixel 113, a second sub-pixel 112 and a third sub-pixel 111 are provided for each opaque unit area 10. For example, in the present embodiment, the first subpixel 113 is a red pixel (R), the second subpixel 112 is a green pixel (G), and the third subpixel 111 is a blue pixel (B). In an embodiment, the shape of the pattern formed by splicing the plurality of sub-pixels of the same opaque unit area 10 is the same as the shape of the opaque unit area 10, so that the plurality of sub-pixels can completely cover the opaque unit area 10, and the utilization efficiency of the area of the opaque unit area 10 is improved. The adjacent two differently colored sub-pixels are isolated only by the conductive partition structure 50. Specifically, the present application provides a conductive isolation structure 50 between the periphery of the opaque unit region 10 and adjacent sub-pixels in the opaque unit region 10 through the semiconductor process, and then vapor-depositing an organic light emitting material. That is, the present application adopts the conductive partition structure 50 to evaporate the organic light emitting material instead of the process of evaporating the organic light emitting material using a Fine Metal Mask (FMM) in the conventional art, so that the shape of the sub-pixel in the present application can be set independently without being limited by the shape of the mask. Therefore, by designing the shape of the sub-pixels, the shape of the pattern formed by the plurality of sub-pixels of the same opaque unit area 10 by stitching can be made identical to the shape of the opaque unit area 10 and substantially identical in size. For example, in the present embodiment, the shape of the opaque unit area 10 is set to be the second quadrangle 11 with each side being a concave arc, the pattern formed by the first sub-pixel 113, the second sub-pixel 112 and the third sub-pixel 111 in the opaque unit area 10 is also the second quadrangle 11 with each side being a concave arc, and only the distance between the boundary of the pattern formed by the first sub-pixel 113, the second sub-pixel 112 and the third sub-pixel 111 and the boundary of the opaque unit area 10 is the width of the conductive partition structure 50, so that the space of the opaque unit area 10 can be fully utilized for displaying. It will be appreciated that the width of the conductive partition structure 50 fabricated by the semiconductor process is smaller than the interval between the sub-pixels evaporated by the FMM, so that the non-display opaque unit area 10 can be fully utilized and the display area of the transparent display area 100 can be increased compared to the conventional design.

The arrangement mode of the plurality of light-transmitting unit areas 20 in the light-transmitting display area 100 is better than the conventional island-shaped separated pixel luminous design display effect, and can effectively improve the particle sense of display. The cathode electrodes 1107 of adjacent sub-pixels are connected, so that a better display effect is achieved, and circuit wiring which penetrates through the whole surface can be arranged below the connection part 102, such as ELVDD, DATA and other signal lines, so that space overlapping utilization is achieved.

In one embodiment, the connection between two adjacent opaque unit regions 10 is formed by the conductive partition structure 50, and the connection 102 of two adjacent opaque unit regions 10 shares the conductive partition structure 50.

In one embodiment, as shown in fig. 2 and 4, the conductive partition structure 50 of the opaque unit region 10 includes an annular conductive partition structure 501 and a split conductive partition structure 502; the annular conductive partition structure 501 extends along the boundary of the opaque unit area 10 to form an annular shape, and the two opaque unit areas 10 connected with each other share part of the annular conductive partition structure 501 at the connection part 102. The plurality of split conductive partition structures 502 are located in the annular conductive partition structure 501 and divide the area in the annular conductive partition structure 501 into a plurality of sub-pixel areas 110, one sub-pixel is arranged corresponding to each sub-pixel area 110, and two adjacent sub-pixels are partitioned by the split conductive partition structure 502. For example, two divided conductive partition structures 502 disposed in parallel at intervals divide an area within the annular conductive partition structure 501 into three sub-pixel areas, and the three sub-pixel areas are provided with the first sub-pixel 113, the second sub-pixel 112, and the third sub-pixel 111, respectively.

For convenience of explanation, hereinafter, an extending direction of each sub-pixel within the sub-pixel region 110 is defined as a first direction, a row arrangement direction of the sub-pixels in fig. 2, 6 to 9 is defined as a second direction, and a thickness direction of the display panel 200 is defined as a third direction.

Referring to fig. 15, fig. 15 is a schematic structural diagram of a structure for removing part of a ring-shaped conductive partition according to an embodiment of the present application.

In a further embodiment, as shown in fig. 15, the annular conductive partition structure 501 is broken to form the notch 101 in an area other than the junction 102 of the two light-impermeable cell areas 10 connected to each other. For example, the opposite sides of the annular conductive partition structure 501 in the second direction may be removed, leaving only the opposite sides of the annular conductive partition structure 501 in the first direction and part of the common sides at the corners. The annular conductive partition structure 501 with the notch 101 occupies a smaller area; for example, the area corresponding to the notch 101 may be the light-transmitting unit area 20, so that the area of the light-transmitting unit area 20 is further increased; or the area corresponding to the notch 101 may be the opaque unit area 10 and be provided with an organic light emitting layer, so that the sub-pixel area of the opaque unit area 10 is further increased. It will be appreciated that the split conductive partition structure 502 may electrically connect the cathode electrodes 1107 of the sub-pixels within the same opaque unit region 10, and that the notch 101 may alternatively be formed at other positions of the annular conductive partition structure 501 while ensuring that the cathode electrodes 1107 of the sub-pixels of adjacent opaque unit regions 10 are electrically connected.

In one embodiment, three sub-pixels of different colors in the opaque unit area 10 form one pixel unit 16, and one or more pixel units 16 may be disposed in each opaque unit area 10.

Referring to fig. 6 to fig. 9, fig. 6 is a schematic diagram of a first structure of a plurality of sub-pixels in an opaque unit area provided in the present application; FIG. 7 is a schematic view of a second configuration of a plurality of sub-pixels within an opaque unit area provided herein; FIG. 8 is a schematic view of a third configuration of a plurality of sub-pixels in an opaque unit area provided herein; fig. 9 is a schematic diagram of a fourth structure of a plurality of sub-pixels in an opaque unit area provided in the present application.

In the first structure, as shown in fig. 2 and 6, each light-tight unit region 10 includes only one pixel unit 16, that is, only one set of the first, second, and third sub-pixels 113, 112, and 111, and the first, second, and third sub-pixels 113, 112, and 111 are juxtaposed and spaced apart in the second direction. Wherein, in every two adjacent opaque unit areas 10, the first subpixel 113 of the first opaque unit area 10 and the third subpixel 111 of the second opaque unit area 10 form the connection 102.

In the second structure, as shown in fig. 7, each opaque unit area 10 includes only one pixel unit 16, in each opaque unit area 10, the first sub-pixel 113 and the second sub-pixel 112 are disposed on the same side and are juxtaposed and spaced apart in the first direction, the third sub-pixel 111 is disposed on the other side of the first sub-pixel 113 and the second sub-pixel 112 and is spaced apart from the first sub-pixel 113 and the second sub-pixel 112 in the second direction, and the area of the third sub-pixel 111 is larger than the area of the first sub-pixel 113 and the second sub-pixel 112. In every two adjacent opaque unit areas 10, the second sub-pixel 112 of the first opaque unit area 10 and the third sub-pixel 111 of the second opaque unit area 10 form a junction 102. Wherein, in such a structure, the sum of the areas of the first subpixel 113 and the second subpixel 112 may be equal to the third subpixel 111.

Alternatively, as shown in the third structure of fig. 8, the first sub-pixel 113 and the second sub-pixel 112 are disposed on the same side and are disposed in parallel and spaced apart in the first direction, unlike the second structure, in this structure, the split conductive isolation structure 502 between the third sub-pixel 111 and the first sub-pixel 113 and the second sub-pixel 112 on the same side is disposed obliquely.

In the fourth structure, as shown in fig. 9, each opaque unit area 10 includes a plurality of pixel units 16, that is, includes a plurality of groups of first sub-pixels 113, second sub-pixels 112 and third sub-pixels 111, and the arrangement manner of the first sub-pixels 113, the second sub-pixels 112 and the third sub-pixels 111 in each group of pixel units 16 may be different, and may be arranged according to any of the above manners, which is not limited in this application. For example, each opaque unit region 10 includes two groups of pixel units 16, wherein the first sub-pixel 113, the second sub-pixel 112, and the third sub-pixel 111 in the first group of pixel units 16 may be arranged in parallel and at intervals according to the first structure; the first, second and third sub-pixels 113, 112 and 111 within the second group of pixel cells 16 may be arranged in a second configuration. In every two adjacent opaque unit areas 10, the first subpixel 113 of the first opaque unit area 10 and the third subpixel 111 of the second opaque unit area 10 form a junction 102.

Referring to fig. 10 to 11, fig. 10 is a structural cross-sectional view taken along line A-A of fig. 2 provided in the present application; fig. 11 is a cross-sectional view of another construction provided herein along the line A-A of fig. 2.

As shown in fig. 10, a portion of the display panel 200 located in the opaque unit region 10 includes a substrate 12, a buffer layer 13, a driving circuit layer 1101, a light shielding layer 1102, a planarization layer 1103, an anode conductive layer (not shown), a pixel defining layer 1104, an organic light emitting layer (not shown), and a cathode conductive layer (not shown).

In this embodiment, the conductive partition structure 50 includes a metal conductive portion 51 and a partition portion 52 disposed on top of the conductive portion 51, the partition portion 52 extends out of the conductive portion 51 in the second direction, and the conductive portions 51 of the plurality of opaque unit areas 10 are connected to form a conductive mesh; the organic light emitting layer includes a plurality of organic light emitting units 1106, and each organic light emitting unit 1106 is disposed in one sub-pixel region 110. The cathode conductive layer is disposed on a side of the organic light emitting layer away from the substrate 12, and the cathode conductive layer includes a plurality of cathode electrodes 1107, each cathode electrode 1107 is disposed corresponding to one organic light emitting unit 1106, and two cathode electrodes 1107 disposed on opposite sides of the conductive partition structure 50 are electrically connected through the conductive portion 51 of the conductive partition structure 50.

The buffer layer 13 is disposed on the substrate 12; the driving circuit layer 1101 is disposed on a side of the buffer layer 13 away from the substrate 12, wherein the driving circuit layer 1101 includes a plurality of driving units (not shown) and wirings (not shown) for connecting the driving units. The planarization layer 1103 is disposed on a side of the driving circuit layer 1101 away from the substrate 12; the anode conductive layer is disposed on a side of the planarization layer 1103 away from the substrate 12, and includes a plurality of anode electrodes 1105; the pixel defining layer 1104 is disposed on a side of the anode conductive layer away from the substrate 12; the pixel defining layer 1104 has a plurality of openings exposing the anode electrode 1105; the conductive partition structure 50 is disposed on a side of the pixel defining layer 1104 away from the substrate 12, and defines a sub-pixel region 110 around the opening, and sub-pixels may be disposed in the sub-pixel region 110.

In one cross-sectional structure along the line A-A of fig. 2, as shown in fig. 10, a planarization layer 1103 is provided on a side of the driving circuit layer 1101 away from the substrate 12, and the planarization layer 1103 covers the driving circuit layer 1101 to planarize the circuit wiring. The planarization layer 1103 can be made of an insulating light-proof material, which has a planarization function and can shield light, so that external light is prevented from irradiating the transistors in the driving circuit layer 1101.

In this embodiment, the planarization layer 1103 may also be made of a light-transmitting material, such as a resin, and accordingly, a light shielding layer 1102 is required to be further disposed between the planarization layer 1103 and the driving circuit layer 1101 to prevent external light from irradiating the transistors in the driving circuit layer 1101. As shown in fig. 10, the driving circuit layer 1101 is covered with a light shielding layer 1102. The light shielding layer 1102 is made of an insulating opaque material, on one hand, the insulating light shielding layer 1102 insulates the driving circuit layer 1101 from other layers of the light shielding layer 1102 far away from the driving circuit layer 1101, and on the other hand, the light shielding layer 1102 made of an opaque material can prevent external light from irradiating the transistor of the driving circuit layer 1101.

In this embodiment, as shown in fig. 10, the planarization layer 1103 is disposed on the side of the light shielding layer 1102 away from the driving circuit layer 1101; the light shielding layer 1102 has a first via 11021, the planarization layer 1103 has a second via 11031, and the second via 11031 communicates with the first via 11021, and a conductive material may be disposed in the first via 11021 and the second via 11031 to conduct electricity. The anode conductive layer is disposed on a side of the planarization layer 1103 away from the light shielding layer 1102, and the anode electrode 1105 is electrically connected to the driving circuit layer 1101 through the first via 11021 and the second via 11031. As described above, the driving circuit layer 1101 and the anode electrode 1105 are electrically connected by providing the conductive material in the first via 11021 and the second via 11031. It is also possible to deposit metal in the first via 11021 and the second via 11031 by means of metal deposition at the time of preparing the anode conductive layer, in direct integrated communication with the metal forming the anode electrode 1105, so that the anode electrode 1105 and the driving circuit layer 1101 are in communication.

In another cross-sectional configuration along line A-A of fig. 2, as shown in fig. 11, the edge of the conductive portion 51 overlaps with the projection of the edge of the anode electrode 1105 onto the substrate 12, and the conductive portion 51 cooperates with the anode electrode 1105 to form a light shielding layer 1102. In this embodiment, the light shielding layer 1102 in the above embodiment is not required to be provided exclusively, but the light shielding is performed by the overlapping portion of the projection of the conductive portion 51 and the anode conductive layer on the substrate 12. The specific arrangement mode is that the planarization layer 1103 is directly arranged on one side of the driving circuit layer 1101, the anode conductive layer is arranged on one side of the planarization layer 1103 far away from the driving circuit layer 1101, and the planarization layer 1103 is partially covered by the anode conductive layer, so that the edge of the anode conductive layer and the edge of the conductive part 51 are completely overlapped in the projection direction of the third direction, and the effect of shielding light is achieved. It is understood that the planarization layer 1103 in this embodiment also has an insulating function. The anode conductive layer and the conductive part 51 can be formed by metal, so that the anode conductive layer and the conductive part have the light shielding and conductive functions, thereby preventing poor imaging caused by light leakage at the edge of the organic light-emitting layer and improving imaging effect. The anode conductive layer in this embodiment may specifically communicate with the driving circuit layer 1101 through the conductive material in the conductive hole 1108.

The pixel defining layer 1104 has a plurality of openings (not shown) that expose the anode electrode 1105; each portion of the pixel defining layer 1104 is separated by the anode electrode 1105 such that the pixel defining layer 1104 breaks the anode electrode 1105, preventing electrical connection between the plurality of anode electrodes 1105 from causing a short circuit. The opening and the anode conductive layer together form a recess (not shown). The organic light emitting layer is disposed on a side of the anode conductive layer away from the planarization layer 1103 and is overlapped with the pixel defining layer 1104, and in particular, the organic light emitting layer is disposed in the groove and is overlapped with the pixel defining layer 1104 at a position where the organic light emitting layer contacts the pixel defining layer 1104. The cathode conductive layer is arranged on one side of the organic light-emitting layer far away from the anode conductive layer, namely, the cathode conductive layer is prepared on one side of the organic light-emitting layer far away from the anode conductive layer so as to cover the organic light-emitting layer.

The conductive portion 51 is disposed on a side of the pixel defining layer 1104 away from the planarization layer 1103, and is electrically connected to the plurality of cathode electrodes 1107. In actual production, the conductive portion 51 may be produced on the side of the pixel defining layer 1104 away from the planarizing layer 1103 after the pixel defining layer 1104 is produced, so that the arrangement positions of the organic light emitting layer and the cathode conductive layer are defined on the side of the anode conductive layer away from the planarizing layer 1103, and at the same time, each cathode electrode 1107 can be brought into contact with the conductive portion 51 provided on the periphery thereof directly to achieve electrical connection when the cathode electrode 1107 is produced. In order to increase the contact area between the cathode electrode 1107 and the conductive portion 51, the contact position between the cathode conductive layer and the conductive portion 51 may be extended in the third direction to increase the electrical connection effect between the cathode electrode 1107 and the conductive portion 51. It is understood that the organic light emitting unit 1106 may be disposed only in contact with the conductive part 51, or may be disposed in the same shape as the cathode electrode 1107.

The partition portion 52 is disposed on top of the conductive portion 51, and the partition portion 52 covers the top surface of the conductive portion 51 in the third direction, and has a length longer than that of the conductive portion 51 in the second direction and protrudes from the conductive portion 51, thereby improving the partition effect. The network distribution of the conductive parts 51 arranged on the whole surface can reduce the wiring resistance of the cathode conductive layer (cathode electrode 1107) and improve the display uniformity.

The anode electrode 1105, the organic light emitting unit 1106, and the cathode electrode 1107 which are stacked to form one sub-pixel. That is, each sub-pixel includes an anode electrode 1105, an organic light emitting unit 1106, and a cathode electrode 1107, and the cathode electrodes 1107 of adjacent sub-pixels are electrically connected through the conductive portion 51. For example, in the present embodiment, the first subpixel 113 is a red pixel (R), the second subpixel 112 is a green pixel (G), and the third subpixel 111 is a blue pixel (B). The cathode electrode 1107 of each sub-pixel is electrically connected to the conductive portion 51, thereby achieving communication between the cathode electrodes 1107 of a plurality of sub-pixels.

Referring to fig. 12 to 14, fig. 12 is a schematic structural diagram of a light-transmitting display area according to another embodiment of the present application; FIG. 13 is an enlarged partial view of a portion of the junction C' of the opaque cell region of FIG. 12; fig. 14 is a sectional view of the structure taken along the line D-D in fig. 13 provided in the present application.

In another embodiment, as shown in fig. 12 to 14, the conductive partition structure 50 of the opaque unit region 10 includes an annular conductive partition structure 501 and a split conductive partition structure 502; the plurality of dividing conductive partition structures 502 are located within the annular conductive partition structure 501 and divide the area within the annular conductive partition structure 501 into the plurality of sub-pixel areas 110; one subpixel is disposed in each subpixel region 110; the annular conductive partition structure 501 is disconnected at the junction 102 of the two opaque unit areas 10 connected to each other, and the two sub-pixels of the junction 102 of the two opaque unit areas 10 connected to each other are the same color and connected to each other. Wherein, "interconnect" means that the organic light emitting units 1106 of the two sub-pixels at the junction 102 of the two opaque unit regions 10 connected to each other are connected in one piece, and the cathode electrodes 1107 of the two sub-pixels at the junction 102 of the two opaque unit regions 10 connected to each other are the same transparent conductive layer. For example, two sub-pixels at the connection 102 of two opaque unit areas 10 connected to each other are the third sub-pixel 111 or the first sub-pixel 113.

For example, the first sub-pixel 113, the second sub-pixel 112, and the third sub-pixel 111 of each opaque unit region 10 are sequentially arranged along the row direction of the two-dimensional array formed by the plurality of opaque unit regions 10 and the plurality of opaque unit regions 20, and the three sub-pixels of the same row of opaque unit regions 10 are arranged in the same manner. The arrangement order of the three sub-pixels in the opaque unit area 10 in the odd numbered row is opposite to the arrangement order of the plurality of sub-pixels in the even numbered row, thereby realizing that the first sub-pixels 113 in the odd numbered row and the first sub-pixels 113 in the even numbered row are connected to each other in one piece, the third sub-pixels 111 in the odd numbered row and the third sub-pixels 111 in the even numbered row are connected to each other in one piece, and the second sub-pixels 112 in each row are still in a state independent from each other. For example, the arrangement order of the three sub-pixels of the opaque unit region 10 of the first row is blue, green, red, the arrangement order of the three sub-pixels of the opaque unit region 10 of the second row is red, green, blue, the arrangement order of the three sub-pixels of the opaque unit region 10 of the third row is blue, green, red, the arrangement order of the sub-pixels of the fourth row is red, green, blue … …, and so on, thereby realizing that the red pixels of the opaque unit region 10 of each column are connected to each other, the blue pixels of the opaque unit region 10 of each column are connected to each other, and the green pixels of each row are independent from each other.

Referring to fig. 16, fig. 16 is a schematic structural diagram of a structure for removing all annular conductive partition structures according to another embodiment of the present disclosure.

In a further embodiment, as shown in fig. 16, the conductive partition structure 50 of the opaque unit region 10 includes a plurality of partition conductive partition structures 502, and the plurality of partition conductive partition structures 502 partition the opaque unit region 10 into a plurality of sub-pixel regions 110, and one sub-pixel is disposed in each sub-pixel region 110; no annular conductive partition structure 501 is provided along the boundary of the opaque unit areas 10, and the two sub-pixels of the junction 102 of the two opaque unit areas 10 connected to each other are the same color and connected to each other.

Specifically, in this embodiment, the annular conductive partition structure 501 may be further removed, and only the plurality of partition conductive partition structures 502 that partition the plurality of sub-pixel regions 110 are reserved, and the edges of the plurality of sub-pixel regions 110 are surrounded to form the first quadrangle 21, which may also achieve the technical effect of increasing the light transmission area of the light transmission unit region 20 or increasing the sub-pixel area of the opaque unit region 10. In addition, since the plurality of first sub-pixels 113 of each column are connected to each other in one piece and the plurality of third sub-pixels 111 of each column are connected to each other in one piece, the two sub-pixels at the connection portion 102 of the two opaque unit areas 10 connected to each other are the same color and the cathode electrode 1107 are connected to each other in one piece in the present embodiment, the cathode electrodes 1107 of all the sub-pixels can be electrically connected to each other without providing the annular conductive partition structure 501 between the two opaque unit areas 10 connected to each other in the present embodiment. In this embodiment, the annular conductive isolation structure 501 is removed, so that the occupied area of the conductive isolation structure 50 is greatly reduced, and the light transmission area of the light transmission unit region 20 is increased or the sub-pixel area of the light-proof unit region 10 is increased.

Referring now to fig. 17-20, fig. 17 is a cross-sectional view of a first construction provided herein along line B-B of fig. 2, wherein the interruptions are shown extending out of the conductive portion to the inner side of the ring of the annular conductive interruption structure; FIG. 17 is a cross-sectional view of a second construction provided herein along line B-B of FIG. 2; FIG. 19 is a cross-sectional view of a third construction provided herein along line B-B of FIG. 2; fig. 20 is a cross-sectional view of the first construction provided herein along line B-B of fig. 2, showing the partition being flush with the conductive portion on the outer ring side of the annular conductive partition.

Referring to fig. 17 to 20, the light-impermeable unit area 10 may further be provided with an encapsulation layer 14 and a cover plate 15.

The encapsulation layer 14 covers the conductive barrier structure 50 and the sub-pixels, and the encapsulation layer 14 is disposed on a side of the conductive barrier structure 50 away from the pixel defining layer 1104, and on a side of the cathode conductive layer away from the organic light emitting layer.

Specifically, the substrate 12 is provided first, and the buffer layer 13 is provided between the substrate 12 and the driver circuit layer 1101. The buffer layer 13 is made of silicon nitride, silicon oxide, silicon oxynitride, or the like. The encapsulation layer 14 may specifically include a first inorganic encapsulation layer 141, an organic encapsulation layer 142, and a second inorganic encapsulation layer 143, which are sequentially disposed. The first inorganic encapsulation layer 141 may be inorganic silicon nitride or silicon oxynitride, the organic encapsulation layer 142 may be organic ink, and the second inorganic encapsulation layer 143 may be inorganic silicon nitride or silicon oxynitride. The first inorganic encapsulation layer 141, the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 are both light-transmissive to prevent blocking of outgoing light. In the opaque unit area 10, the first inorganic encapsulation layer 141 in the encapsulation layer 14 is in direct contact with and covers the partition portion 52 and the cathode conductive layer; the organic encapsulation layer 142 covers the first inorganic encapsulation layer 141 and the side areas of the driving circuit layer 1101, the planarization layer 1103, the pixel defining layer 1104, and the conductive barrier structure 50 in the opaque unit area 10.

The specific structure of the light transmitting unit region 20 is explained below. Three different configurations are provided. Referring to fig. 17 to 20, the light-transmitting unit region 20 may also be provided with the encapsulation layer 14 and the cover plate 15, but the specific structure of the encapsulation layer 14 is different from that of the light-impermeable unit region 10, as will be described in detail below.

In the first structure, as shown in fig. 17, a portion of the display panel 200 located in the light-transmitting unit region 20 includes a substrate 12, a buffer layer 13, an organic encapsulation layer 142, a second inorganic encapsulation layer 143, and a cover plate 15, the buffer layer 13 being disposed on a surface of the substrate 12; the organic encapsulation layer 142 is disposed on a surface of the buffer layer 13 away from the substrate 12, and the second inorganic encapsulation layer 143 is disposed on a surface of the organic encapsulation layer 142 away from the substrate 12; the cover plate 15 is disposed on a surface of the second inorganic encapsulation layer 143 away from the substrate 12.

Unlike the opaque unit area 10, only a portion of the encapsulation layer 14 of the transparent unit area 20 is disposed to cover the buffer layer 13. Specifically, the light-transmitting unit region 20 in this embodiment is not provided with the first inorganic encapsulation layer 141, and is directly contacted with and covered on the buffer layer 13 through the organic encapsulation layer 142, and the second inorganic encapsulation layer 143 is provided on the side of the organic encapsulation layer 142 away from the buffer layer 13 to cover the organic encapsulation layer 142.

In this embodiment, as shown in fig. 17, the annular conductive partition structure 501 includes a conductive portion 51 and a partition portion 52 provided on top of the conductive portion 51, the partition portion 52 extending out of the conductive portion 51 toward the inner side of the ring of the annular conductive partition structure 501; the partition 52 is used to partition the organic light emitting layer between adjacent sub-pixels. The isolating part 52 extends to the outside of the ring of the annular conductive isolating structure 501 to form a conductive part 51, so that the organic light emitting unit 1106 can be cut off, each sub-pixel is independently packaged and protected by the first inorganic packaging layer 141, the organic light emitting unit 1106, the cathode electrode 1107 and the first inorganic packaging layer 141 except for the sub-pixel area can be removed by subsequent etching, and the light transmittance of the light transmitting unit area 20 can be improved. The light-tight unit area 10 is packaged by adopting the first structure, and the packaging effect is good.

In the second structure, as shown in fig. 18, a portion of the display panel 200 located in the light-transmitting unit region 20 includes a substrate 12, a buffer layer 13, and a cover plate 15, the buffer layer 13 being disposed on a surface of the substrate 12; the cover 15 is spaced apart from the buffer layer 13. Wherein, air is filled between the cover plate 15 and the buffer layer 13 to form an air microcavity. The organic encapsulation layer 142 covers the sides of the driving circuit layer 1101, the planarization layer 1103, the pixel defining layer 1104, and the conductive isolation structure 50, and the second inorganic encapsulation layer 143 covers the outside of the organic encapsulation layer 142.

In this embodiment, the light-transmitting unit region 20 includes only the substrate 12, the buffer layer 13, and the cover plate 15, and the encapsulation layer 14 is not provided. The buffer layer 13 is disposed on one side of the substrate 12. The present embodiment is different from the first embodiment in that the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 have a bent portion (not shown) at a side close to the light transmitting unit region 20. That is, in the third direction, the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 are bent from the edge of the first inorganic encapsulation layer 141 toward the buffer layer 13 such that the organic encapsulation layer 142 completely encapsulates the driving circuit layer 1101, the planarization layer 1103, the pixel defining layer 1104, and the side regions of the conductive barrier structure 50, and at the bent portion, the buffer layer 13 is disposed in contact with the organic encapsulation layer 142 and the second inorganic encapsulation layer 143. The encapsulation layer 14 is not disposed in the light-transmitting unit area 20, that is, the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 in the above embodiment are removed, so that the light-transmitting effect of the light-transmitting unit area 20 can be further improved, and the lighting of the under-screen camera is facilitated.

In the preparation of the encapsulation layer 14 of the present embodiment, after the organic encapsulation layer 142 is coated, the organic encapsulation layer 142 is perforated, that is, after the organic encapsulation layer 142 is coated, the organic encapsulation layer 142 of the light-transmitting unit region 20 is partially scratched, so that the organic encapsulation layer 142 only covers the driving circuit layer 1101, the planarization layer 1103, the pixel defining layer 1104 and the side surfaces of the conductive isolation structure 50. Then, a second inorganic encapsulation layer 143 is deposited, and the shape of the second inorganic encapsulation layer 143 is adapted to the shape of the organic encapsulation layer 142. The materials of the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 in this embodiment are the same as those in the first embodiment, and will not be described here again.

In the third structure, as shown in fig. 19, a portion of the display panel 200 located in the light-transmitting unit region 20 includes a substrate 12, a buffer layer 13, and a cover plate 15, the buffer layer 13 being disposed on a surface of the substrate 12; the cover 15 is spaced apart from the buffer layer 13. Wherein, air is filled between the cover plate 15 and the buffer layer 13; the first inorganic encapsulation layer 141 covers the sides of the driving circuit layer 1101, the planarization layer 1103, the pixel defining layer 1104, and the conductive isolation structure 50, the organic encapsulation layer 142 covers the outside of the first inorganic encapsulation layer 141, and the second inorganic encapsulation layer 143 covers the outside of the organic encapsulation layer 142.

Specifically, this embodiment is substantially the same as the second embodiment, except that: the first inorganic encapsulation layer 141 in this embodiment covers the side surfaces of the driving circuit layer 1101, the planarization layer 1103, the pixel defining layer 1104, and the conductive isolation structure 50, in addition to the conductive isolation structure 50 and the sub-pixels. In preparation, the first inorganic encapsulation layer 141 may be deposited onto the conductive partition structure 50, the sub-pixels and the buffer layer 13, the first inorganic encapsulation layer 141 is perforated, and the portion of the transparent unit area 20 where the first inorganic encapsulation layer 141 is deposited is scratched, so that the first inorganic encapsulation layer 141 covers the driving circuit layer 1101, the planarization layer 1103, the pixel defining layer 1104 and the side surface of the conductive partition structure 50, and then the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 are sequentially coated, and the shapes of the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 are adapted to those of the first inorganic encapsulation layer 141. The materials of the first inorganic encapsulation layer 141, the organic encapsulation layer 142 and the second inorganic encapsulation layer 143 in this embodiment are the same as those in the first embodiment, and will not be described here again. The light-tight unit area 10 is packaged by adopting the third structure, so that the packaging effect is good, and the light-tight unit area is firm and durable.

In addition, as a modified structure of the first structure, as shown in fig. 20, the partition portion 52 may be flush with the conductive portion 51 on the outer side of the annular conductive partition structure 501, which is beneficial to improving the rupture resistance of the film structure of the opaque unit area 10 when the product is bent and deformed.

It should be noted that the organic encapsulation layer 142 of the opaque unit region 10 and the transparent unit region 20 may be formed as a single structure by one process, and the second inorganic encapsulation layer 143 of the opaque unit region 10 and the transparent unit region 20 may be formed as a single structure by one process.

After the encapsulation of the opaque unit area 10 and the transparent unit area 20 is completed, the encapsulation layer 14 is covered by the cover plate 15 to form a complete structure of the display panel 200, wherein the cover plate 15 may be made of glass, plastic, or the like.

The display panel disclosed by the application comprises a light-transmitting display area; the light-transmitting display area comprises a plurality of light-proof unit areas which are connected with each other and a plurality of light-transmitting unit areas which are arranged at intervals; the light-proof unit areas are provided with a plurality of sub-pixels, the light-proof unit areas and the light-proof unit areas are arranged in an array, the light-proof unit areas and the light-proof unit areas of the same row are alternately arranged, and the light-proof unit areas of the same column are alternately arranged; the boundary between the adjacent light-transmitting unit area and the non-light-transmitting unit area is an arc; the light-transmitting unit area is a first quadrangle of a cross-section graph on a plane parallel to the first direction and the second direction, and four sides of the first quadrangle are convex circular arcs of non-concentric centers. According to the method, the light-transmitting unit area is prepared into the first quadrangle of the convex arc, so that more pixel area can be utilized, the opening area of the light-transmitting display area is increased, the diffraction range of the transmission hole is reduced, the light diffraction is reduced, and the visual imaging and the shooting effects are more uniform.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (10)

1. A display panel comprises a light-transmitting display area; the light-transmitting display area comprises a plurality of light-proof unit areas which are connected with each other and a plurality of light-transmitting unit areas which are arranged at intervals; the light-tight unit areas are provided with a plurality of sub-pixels, and are characterized in that a plurality of the light-tight unit areas and a plurality of the light-tight unit areas are arranged in an array, the light-tight unit areas and the light-tight unit areas of the same row are alternately arranged, and the light-tight unit areas of the same column are alternately arranged; the boundaries of the adjacent light-transmitting unit areas and the light-non-transmitting unit areas are circular arcs; the light-transmitting unit area is a first quadrangle of a cross-section graph on a plane parallel to the first direction and the second direction, and four sides of the first quadrangle are convex circular arcs with non-concentric centers.

2. The display panel of claim 1, wherein four sides of the first quadrilateral are convex arcs of equal length; the corner of the first quadrangle is also an outward convex arc, and the radius R1 of the corner arc of the first quadrangle is smaller than the radius R2 of the arc of the side of the first quadrangle.

3. The display panel of claim 2, wherein the first quadrilateral has a maximum distance D1 across the corner and a maximum distance D2 across the first quadrilateral, wherein D1 is greater than or equal to 2 x r1, D2 is less than or equal to 2 x r2, and D1 is greater than or equal to D2.

4. A display panel according to any one of claims 1-3, wherein the pattern formed by the plurality of sub-pixels of the same opaque unit area is identical to the shape of the opaque unit area, and the sub-pixels of adjacent two different colors are isolated only by a conductive isolation structure.

5. The display panel of claim 4, wherein the conductive barrier structure of the opaque cell region comprises an annular conductive barrier structure and a split conductive barrier structure; the annular conductive partition structure extends along the boundary of the opaque unit area to form an annular shape, and the plurality of the partition conductive partition structures are positioned in the annular conductive partition structure and divide the area in the annular conductive partition structure into a plurality of sub-pixel areas; one sub-pixel is arranged corresponding to each sub-pixel area; the two light-proof unit areas connected with each other share part of the annular conductive partition structure at the joint.

6. The display panel of claim 5, wherein the annular conductive partition structure is broken to form a notch at an area other than a junction of the two light-impermeable cell regions connected to each other.

7. The display panel of claim 4, wherein the conductive barrier structure of the opaque cell region comprises an annular conductive barrier structure and a split conductive barrier structure; the annular conductive partition structure extends along the boundary of the opaque unit area to form an annular shape, and the plurality of the partition conductive partition structures are positioned in the annular conductive partition structure and divide the area in the annular conductive partition structure into a plurality of sub-pixel areas; each sub-pixel region is internally provided with one sub-pixel; the annular conductive partition structure is disconnected at the joint of the two light-tight unit areas which are connected with each other, and the two sub-pixels at the joint of the two light-tight unit areas which are connected with each other are the same in color and are connected with each other; or (b)

The conductive partition structure of the opaque unit area comprises a plurality of partition conductive partition structures, the opaque unit area is partitioned into a plurality of sub-pixel areas by the partition conductive partition structures, and each sub-pixel area is internally provided with one sub-pixel; and annular conductive partition structures are not arranged along the boundary of the light-tight unit areas, and the two sub-pixels at the joint of the two light-tight unit areas which are connected with each other have the same color and are connected with each other.

8. The display panel of any one of claims 5-7, wherein the annular conductive partition structure comprises a conductive portion and a partition portion disposed on top of the conductive portion, the partition portion extending out of the conductive portion to an in-loop side of the annular conductive partition structure; wherein,

the isolating part extends out of the conductive part towards one side outside the ring of the annular conductive isolating structure; or (b)

The isolating part is flush with the conductive part at one side outside the ring of the annular conductive isolating structure.

9. The display panel of claim 4, wherein a portion of the display panel located in the opaque cell region comprises:

a substrate;

a buffer layer disposed on the substrate;

the driving circuit layer is arranged on one side of the buffer layer away from the substrate;

the flattening layer is arranged on one side of the driving circuit layer, which is far away from the substrate;

the anode conducting layer is arranged on one side of the planarization layer, which is far away from the substrate, and comprises a plurality of anode electrodes;

the pixel definition layer is arranged on one side of the anode conductive layer away from the substrate; the pixel defining layer has a plurality of openings exposing the anode electrode;

The conductive partition structure is arranged on one side of the pixel definition layer, which is far away from the substrate, and a sub-pixel area is defined around the opening; the conductive partition structure comprises a conductive part and a partition part arranged on one side of the conductive part far away from the pixel definition layer, wherein the partition part extends out of the conductive part, and the conductive parts of the plurality of opaque unit areas are connected into a conductive network;

an organic light emitting layer including a plurality of organic light emitting units, each of the organic light emitting units being disposed in one of the sub-pixel regions;

the cathode conducting layer is arranged on one side of the organic light-emitting layer, far away from the substrate, and comprises a plurality of cathode electrodes, each cathode electrode is arranged corresponding to one organic light-emitting unit, and two cathode electrodes positioned on two opposite sides of the conductive partition structure are electrically connected through conductive parts of the conductive partition structure; the anode electrode, the organic light emitting unit and the cathode electrode are stacked to form one sub-pixel;

an encapsulation layer covering the conductive partition structure and the sub-pixels; the packaging layers comprise a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked;

A cover plate covering the encapsulation layer;

wherein,

a shading layer is arranged between the flattening layer and the driving circuit layer; or (b)

The edge of the conductive part is overlapped with the projection of the edge of the anode electrode on the substrate, and the conductive part is matched with the anode electrode to form a shading layer.

10. The display panel of claim 9, wherein a portion of the display panel located in the light-transmitting cell region comprises:

the substrate;

the buffer layer is arranged on the surface of the substrate;

the organic packaging layer is arranged on the surface of the buffer layer far away from the substrate

The second inorganic packaging layer is arranged on the surface of the organic packaging layer far away from the substrate;

the cover plate is arranged on the surface, far away from the substrate, of the second inorganic packaging layer; or alternatively, the first and second heat exchangers may be,

the portion of the display panel located in the light transmitting unit region includes:

the substrate;

the buffer layer is arranged on the surface of the substrate;

the cover plate is arranged at intervals with the buffer layer;

wherein, air is filled between the cover plate and the buffer layer; the organic packaging layer covers the side surfaces of the driving circuit layer, the planarization layer, the pixel definition layer and the conductive partition structure, and the second inorganic packaging layer covers the outer side of the organic packaging layer; or alternatively, the first and second heat exchangers may be,

The portion of the display panel located in the light transmitting unit region includes:

the substrate;

the buffer layer is arranged on the surface of the substrate;

the cover plate is arranged at intervals with the buffer layer;

wherein, air is filled between the cover plate and the buffer layer; the first inorganic packaging layer covers the side surfaces of the driving circuit layer, the planarization layer, the pixel definition layer and the conductive partition structure, the organic packaging layer covers the outer side of the first inorganic packaging layer, and the second inorganic packaging layer covers the outer side of the organic packaging layer.