CN117740173A - Junction temperature measuring method by buried thermocouple - Google Patents
Junction temperature measuring method by buried thermocouple Download PDFInfo
- Publication number
- CN117740173A CN117740173A CN202311780265.3A CN202311780265A CN117740173A CN 117740173 A CN117740173 A CN 117740173A CN 202311780265 A CN202311780265 A CN 202311780265A CN 117740173 A CN117740173 A CN 117740173A
- Authority
- CN
- China
- Prior art keywords
- initial
- buried
- temperature
- thermocouples
- thermocouple
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 claims abstract description 41
- 238000010586 diagram Methods 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims abstract description 15
- 238000012216 screening Methods 0.000 claims description 26
- 238000009529 body temperature measurement Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract 1
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides a junction temperature measuring method of a buried thermocouple. The method relates to the field of semiconductor reliability testing. Determining one or more thermocouple testing positions through a packaging structure diagram of the device; and obtaining the package to be tested by punching holes on the package at fixed points, and burying the thermocouple in the package to be tested. And reading temperature data through a thermocouple, and measuring the junction temperature of the chip to be measured during working. The thermocouple can be placed at a plurality of positions such as chip upper surface, chip back, chip side, and the temperature variation of chip at the during operation of real-time supervision. The method has the advantages of more stable measurement environment, higher measurement stability and more accurate test result.
Description
Technical Field
The invention relates to the field of semiconductor testing, in particular to a junction temperature measuring method of a buried thermocouple.
Background
The current method for measuring the junction temperature of the packaging body mainly comprises the steps of sticking a thermocouple on the surface of the packaging body to measure and calculate the junction temperature of the chip.
However, in the mode of attaching the thermocouple to the surface of the device, the contact area is relatively small, and the distance from the surface of the chip can be different according to the thickness of the packaging body; when junction temperature test is carried out, the influence of the ambient temperature in the loop test equipment on the thermocouple temperature is very large, so that the measurement error is also very large; in addition, during the experiment, the thermocouple is easy to fall off, resulting in experimental failure.
Disclosure of Invention
The invention aims to provide a junction temperature measuring method of a buried thermocouple, which is used for improving the accuracy of junction temperature measurement.
In a first aspect, the present invention provides a junction temperature measuring method for a buried thermocouple, comprising:
determining a buried position of one or more thermocouples based on a device layout of the initial package;
burying thermocouples to be buried at the burying positions of the thermocouples in a mode of locally perforating the initial packaging body to obtain a packaging body to be tested;
and measuring the working temperature of the chip of the package to be measured, collecting temperature data of a thermocouple on the package to be measured, and calculating the junction temperature of the chip of the package to be measured.
In an alternative embodiment, the method further comprises:
analyzing the initial packaging body to determine a temperature distribution diagram of the initial packaging body;
the buried locations of the one or more thermocouples are determined based on the temperature profile and the device layout of the initial package.
In an alternative embodiment, analyzing the initial package to determine a temperature profile of the initial package includes:
and (3) applying test voltage and current to the initial packaging body, simulating the working state of the initial packaging body, and obtaining a temperature distribution diagram of the initial packaging body in the working state.
In an alternative embodiment, determining the placement of one or more thermocouples based on the device layout of the initial package includes:
determining a position where a thermocouple can be placed based on a device layout of the initial package;
and screening out the burying positions of one or more thermocouples with the most reasonable coverage range from all the positions where the thermocouples can be placed.
In an alternative embodiment, the screening principle of screening the buried position of the thermocouple or thermocouples with the most reasonable coverage range comprises that each area with the temperature exceeding a threshold value of the temperature distribution map is provided with one or more thermocouples corresponding to the area within a preset distance.
In an alternative embodiment, the region of the temperature profile where the temperature exceeds the threshold includes the location of the chip, and the buried location of the thermocouple includes one or more locations closest to the chip from among the locations directly above the chip or where the thermocouple may be placed within a preset distance of the chip.
In an alternative embodiment, the device type required to detect the temperature, and the number of thermocouples required for each device type are preset; the screening logic for screening out the buried position of one or more thermocouples with the most reasonable coverage range comprises the following steps: based on the location of the device in the initial package that meets the type of device that needs to detect temperature, the screening is performed in a location where thermocouples can be placed, according to the number of thermocouples required for the device and the principle of closest distance.
In an alternative embodiment, screening the buried locations of one or more thermocouples with the most reasonable coverage among all the locations where thermocouples can be placed comprises:
based on the initial positions of devices of the device type meeting the requirement of temperature detection in the packaging body, performing primary screening in the positions where thermocouples can be placed according to the number of thermocouples required by the devices and the principle of nearest distance, so as to obtain a plurality of initial positions;
determining a first position and a second position of which the distances between the initial positions are within a preset range;
determining a third location between the first location and the second location, closest to a center of a line connecting the first location and the second location, among the locations where thermocouples can be placed, based on the first location and the second location;
and replacing the first position and the second position in the initial positions with the third position to obtain one or more buried positions.
In an alternative embodiment, the method further comprises:
determining the accuracy of the result of the chip junction temperature of the package to be tested;
the screening logic is optimized based on this accuracy as feedback.
In an alternative embodiment, the thermocouple to be buried is buried in the buried position of each thermocouple by locally perforating the initial package body, so as to obtain a package body to be measured, which includes:
and burying the thermocouples to be buried at the burying positions of the thermocouples by adopting conductive silver glue in a mode of locally perforating the initial packaging body to obtain the packaging body to be tested.
The invention provides a junction temperature measuring method of a buried thermocouple. Determining the burying position of one or more thermocouples based on the device layout of the initial package; burying thermocouples to be buried at the burying positions of the thermocouples in a mode of locally perforating the initial packaging body to obtain a packaging body to be tested; and measuring the packaging body to be measured, collecting temperature data of a thermocouple on the packaging body to be measured, and calculating the chip junction temperature of the packaging body to be measured. Therefore, the thermocouple can be buried in a position where junction temperature is required to be measured in a mode of locally perforating the packaging body, and the thermocouple is measured as close to the surface of the chip as possible, so that the testing environment is more stable, the stability is higher, and the testing result is more accurate.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a junction temperature measurement method of a buried thermocouple according to an embodiment of the present invention;
FIG. 2 is an example of a temperature profile provided by an embodiment of the present invention;
fig. 3 is an example of distribution of buried positions of a thermocouple according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention.
The junction temperature (Junction Temperature) is the actual operating temperature of the semiconductor in the electronic device. In operation, it is typically higher than the Case Temperature (Case Temperature). The temperature difference is equal to the power of the heat therebetween times the thermal resistance.
The maximum junction temperature is calculated for the data specifying one constituent and given the power consumption, the thermal resistance between the housing and the environment. Or in turn may assist the designer in determining an appropriate heat sink.
Fig. 1 is a schematic flow chart of a junction temperature measurement method of a buried thermocouple according to an embodiment of the present invention. As shown in fig. 1, the method includes:
s110, determining the burying position of one or more thermocouples based on the device layout diagram of the initial package.
The initial package may be a packaged chip or a circuit board. The device layout of the initial package may be a layout of chips, leads, pads, peripheral components, etc., or a layout of individual devices, pads, wires, etc. on a circuit board. The layout may be obtained by scanning the initial package using a scanning device such as an electron microscope, or may be determined by acquiring a design drawing of the initial package.
A plurality of thermocouples can be buried on one chip, and the temperature change of different positions of the device can be monitored respectively. The temperature variation of the device at different locations can also be monitored.
The burying position of each thermocouple can be a bit or a region range, and the thermocouple can be placed at any position in the region range.
The method comprises the steps of determining a first area needing junction temperature measurement according to a device layout diagram, determining a second area which is in the area needing junction temperature measurement and is subjected to adverse effects such as interference and the like when a thermocouple is placed, removing the second area in the first area, dividing the remaining area into one or more third areas, wherein each third area has an inner angle of more than 90 degrees. A buried position of the one or more thermocouples is determined based on the third zone.
The dividing the remaining area into one or more third areas can be realized specifically by the following steps: determining a current continuous fourth area in the rest areas, and judging whether the fourth area contains less than 90 degrees or not; if the inner angle is smaller than 90 degrees, determining a triangular region containing the inner angle, deleting the triangular region to obtain a new fourth region, wherein the length of the edge corresponding to the inner angle of the fourth region in the triangular region is equal to a preset value, and the preset value is determined according to the size of the thermocouple.
In one example, the temperature profile of the initial package may also be determined by analyzing the initial package; the buried locations of the one or more thermocouples are determined based on the temperature profile and the device layout of the initial package. Among them, the more the thermocouple is positioned closer to the position where the temperature is highest, the more preferable is the scheme.
In some embodiments, the locations where thermocouples can be placed may be determined based on a device map of the initial package; and screening out the burying positions of one or more thermocouples with the most reasonable coverage range from all the positions where the thermocouples can be placed.
The screening principle of screening out the buried position of one or more thermocouples with the most reasonable coverage range can comprise: such that each region of the temperature profile having a temperature exceeding the threshold corresponds to one or more thermocouples within a predetermined distance. The threshold may be an empirical value.
The region where the temperature profile temperature exceeds the threshold may include: the position of the chip;
the embedding position of the thermocouple here may include: a position directly above the chip; alternatively, one or more locations closest to the chip among locations within a preset distance of the chip where thermocouples may be placed.
As shown in fig. 2, a test voltage and a test current may be applied to the outside of the initial package body, so as to simulate the working state of the initial package body, and obtain a temperature distribution diagram of the initial package body in the working state.
In some embodiments, the temperature profile of the initial package may also be determined by means of simulation. Geometric modeling can be performed according to the device layout diagram and the device parameters to obtain an initial package model; obtaining module power loss according to a preset current and an initial package model; and determining the temperature distribution in the module according to the power loss of the module.
When the initial package model is built, because the heating condition of each chip inside the device is mainly considered, other components such as: and the plastic frame, the connecting plate and the like do not generate heat and have basically no influence on the temperature distribution of chips in the device, so that simplification is omitted in modeling. During modeling, the module structure can be analyzed, the dimension of the module structure can be accurately measured, and then the module is built into an accurate geometric model, so that an initial package model is obtained. The preset current may be a current required by the package in operation. And setting constant current in the initial package model, so that operation data of the initial package model in the operation process can be obtained. Taking into account the change in the resistivity of the chips in the module caused by the junction temperature, setting a function of the resistivity with respect to the junction temperature based on the change, and then calculating the module power loss of the initial package model. According to the setting of the initial package body model, the temperature distribution in the module is determined by the module power loss and the contact thermal resistance, and the simulation is carried out according to the module power loss, so as to obtain the temperature distribution in the module.
In some embodiments, the type of device that needs to detect temperature, and the number of thermocouples required for each device type, may also be preset; the screening can be performed in a location where thermocouples can be placed, based on the location of the device in the initial package that meets the type of device that needs to detect temperature, in accordance with the number of thermocouples required for the device and the principle of closest distance.
In some embodiments, based on the initial position of the device type, which meets the requirement of detecting temperature, in the package, the initial screening is performed in the position where the thermocouple can be placed according to the number of thermocouples required by the device and the principle of closest distance, so as to obtain a plurality of initial positions.
After the primary screening, a secondary screening may also be performed. As one example, a first position and a second position, in which distances between a plurality of the initial positions are within a preset range, may be determined; determining a third location between the first location and the second location, closest to a center of a line connecting the first location and the second location, among the locations where thermocouples can be placed, based on the first location and the second location; and replacing the first position and the second position in the initial positions with the third position to obtain one or more buried positions.
Based on the method, two positions can be replaced by one buried position, and the detection effect is ensured as much as possible while simplifying the buried position. The preset range can be determined according to actual needs, and can be a fixed distance threshold value or a dynamic threshold value, and the dynamic threshold value is inversely related to the temperature value in the temperature distribution diagram. That is, as the distance threshold value corresponding to the buried position corresponding to the region having the higher temperature value is smaller, two buried positions smaller than the distance threshold value are combined to obtain a new buried position. In a specific implementation, each buried position may correspond to a distance threshold, that is, a first position corresponds to a first distance threshold, and a second position corresponds to a second distance threshold, where, when determining, it is determined that the first position and the second position need to be combined as long as the distance between the first position and the second position is less than the first distance threshold or the second distance threshold.
When the first position and the second position are combined, if it cannot be determined whether a third position exists between the first position and the second position, the first position or the second position is determined as the third position.
S120, burying thermocouples to be buried in all burying positions in a mode of locally perforating an initial packaging body to obtain a packaging body to be tested;
the thermocouple to be buried can be buried at the buried position of each thermocouple by adopting conductive silver adhesive in a mode of locally perforating the initial packaging body, so that the packaging body to be measured is obtained. The distribution of thermocouples to be buried may be as shown in fig. 3.
S130, measuring the working temperature of the chip of the package to be measured, collecting temperature data of a thermocouple on the package to be measured, and calculating the junction temperature of the chip of the package to be measured.
In some embodiments, the accuracy of the result of the chip junction temperature of the package under test may also be determined; the screening logic is optimized based on this accuracy as feedback.
In some embodiments, the location of the thermocouple is not necessarily at the highest temperature point. Therefore, when the junction temperature of the chip is calculated, the junction temperature can be estimated by combining the temperature distribution diagram of the initial packaging body. As one example, it may be determined whether the temperature data detected by the thermocouple and the temperature data of the position of the thermocouple in the temperature profile are large in the temperature trend, and if the difference is not large, junction temperature estimation is performed based on the temperature trend of the temperature profile and the temperature data detected by the thermocouple. The temperature trend here may refer to a gradient corresponding to the temperature values of two location points, based on which, assuming that the first location is a first temperature and the second location is a second temperature in the temperature distribution diagram, the first location is provided with a thermocouple, the detected temperature is a third temperature, and the second location is not provided with a thermocouple, the junction temperature value of the second location may be determined based on the fact that the ratio of the first temperature to the second temperature is equal to the ratio of the junction temperature value of the third temperature to the second location. As an example, all temperature values in the temperature profile may also be replaced with junction temperature values based on this process, resulting in a junction temperature profile.
If the temperature data detected by the thermocouple and the temperature data of the position of the thermocouple in the temperature distribution diagram are large in temperature trend, determining a region with large trend difference and a region with small difference, and for the region with small region, performing junction temperature estimation according to the temperature trend of the temperature distribution diagram and the temperature data detected by the thermocouple, and for the region with large difference, directly using the temperature data detected by the thermocouple as a result of junction temperature calculation.
According to the embodiment of the invention, the thermocouple can be buried in the position where junction temperature is required to be measured in a local hole opening mode of the packaging body, and the thermocouple is measured as close to the surface of the chip as possible, so that the testing environment is more stable, the reliability is higher, and the testing result is more accurate.
Further, the units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
Furthermore, functional modules in various embodiments of the present invention may be integrated together to form a single portion, or each module may exist alone, or two or more modules may be integrated to form a single portion.
It should be noted that the functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method of the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM) random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The above embodiments of the present invention are only examples, and are not intended to limit the scope of the present invention, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A junction temperature measuring method of a buried thermocouple, comprising:
determining a buried position of one or more thermocouples based on the initial device layout of the package;
burying thermocouples to be buried in each burying position in a mode of locally perforating the initial packaging body to obtain the packaging body to be tested;
and measuring the working temperature of the chip of the packaging body to be measured, collecting temperature data of a thermocouple on the packaging body to be measured, and calculating the junction temperature of the chip of the packaging body to be measured.
2. The method of junction temperature measurement for a buried thermocouple of claim 1, further comprising:
analyzing the initial packaging body and determining an initial temperature distribution diagram of the packaging body;
determining the burying position of one or more thermocouples based on the temperature distribution diagram and the initial device layout diagram of the packaging body.
3. The method of claim 2, wherein analyzing the initial package to determine an initial temperature profile of the package comprises:
and applying test voltage and current to the initial packaging body, simulating the initial working state of the packaging body, and acquiring the temperature distribution diagram of the initial working state of the packaging body.
4. The method of claim 2, wherein determining the buried position of one or more thermocouples based on the initial device layout of the package comprises:
determining a position where a thermocouple can be placed based on the initial device layout of the package;
and screening one or more buried positions with the most reasonable coverage range from all the positions where thermocouples can be placed.
5. The method of claim 4, wherein the screening principle of screening one or more buried sites with the most reasonable coverage includes making each temperature profile have a temperature exceeding a threshold value corresponding to one or more thermocouples within a predetermined distance.
6. The method of claim 5, wherein the region of the temperature profile having a temperature exceeding a threshold includes a location of a chip, and the buried location includes one or more locations nearest to the chip from a location directly above the chip or a location within a predetermined distance of the chip where a thermocouple can be placed.
7. The junction temperature measuring method of a buried thermocouple according to claim 4, wherein a device type requiring temperature detection and the number of thermocouples required for each device type are preset; the screening logic for screening out one or more buried positions with the most reasonable coverage range comprises the following steps: based on the initial position of the device type which meets the requirement of detecting temperature in the packaging body, screening is carried out in the position where the thermocouples can be placed according to the number of thermocouples required by the device and the principle of closest distance.
8. The method of claim 7, wherein screening one or more of the buried sites that have the most reasonable coverage among all of the sites where thermocouples can be placed comprises:
based on the initial positions of devices of the device type meeting the requirement of temperature detection in the packaging body, performing primary screening in the positions where thermocouples can be placed according to the number of thermocouples required by the devices and the principle of nearest distance, so as to obtain a plurality of initial positions;
determining a first position and a second position of which the distances between the initial positions are within a preset range;
determining a third location between the first location and the second location, closest to a center of a line connecting the first location and the second location, among the locations where thermocouples can be placed, based on the first location and the second location;
and replacing the first position and the second position in the initial positions with the third position to obtain one or more buried positions.
9. The method of junction temperature measurement for a buried thermocouple of claim 4, further comprising:
determining the accuracy of the result of the chip junction temperature of the package to be tested;
the screening logic is optimized based on this accuracy as feedback.
10. The junction temperature measurement method of a buried thermocouple according to claim 1, wherein the embedding the thermocouple to be buried in each of the embedding locations by locally perforating the initial package body to obtain a package body to be measured includes:
and burying the thermocouples to be buried at the burying positions by adopting conductive silver glue in a mode of locally perforating the initial packaging body to obtain the packaging body to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311780265.3A CN117740173A (en) | 2023-12-22 | 2023-12-22 | Junction temperature measuring method by buried thermocouple |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311780265.3A CN117740173A (en) | 2023-12-22 | 2023-12-22 | Junction temperature measuring method by buried thermocouple |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117740173A true CN117740173A (en) | 2024-03-22 |
Family
ID=90277432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311780265.3A Pending CN117740173A (en) | 2023-12-22 | 2023-12-22 | Junction temperature measuring method by buried thermocouple |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117740173A (en) |
-
2023
- 2023-12-22 CN CN202311780265.3A patent/CN117740173A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Rencz et al. | Measuring partial thermal resistances in a heat-flow path | |
| US8949767B2 (en) | Reliability evaluation and system fail warning methods using on chip parametric monitors | |
| Schweitzer et al. | Transient measurement of the junction-to-case thermal resistance using structure functions: chances and limits | |
| JP3940718B2 (en) | Test device, pass / fail criteria setting device, test method and test program | |
| US20140372068A1 (en) | Fault detection apparatus | |
| Bagnoli et al. | Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. II. Practice and experiments | |
| US8078438B2 (en) | Method for simulating thermal resistance value of thermal test die | |
| Pape et al. | Thermal transient modeling and experimental validation in the European project PROFIT | |
| CN105223488A (en) | The semi-conductor discrete device package quality detection method of structure based function and system | |
| Stoynova et al. | Thermographic approach for reliability estimation of PCB | |
| CN117740173A (en) | Junction temperature measuring method by buried thermocouple | |
| Codecasa et al. | Thermal resistance and impedance calculator (TRIC) | |
| US20140247857A1 (en) | System and Method for Measuring Thermal Reliability of Multi-Chip Modules | |
| Chen et al. | Transient thermal resistance analysis for ic packages | |
| CN112926259B (en) | Method for predicting junction temperature of semiconductor device based on RBF neural network model | |
| Vass-Varnai et al. | Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements | |
| Chen et al. | Thermal impact of randomly distributed solder voids on Rth-JC of MOSFETs | |
| CN214473738U (en) | Device for measuring thermal resistance of semiconductor chip | |
| US7590507B2 (en) | Structure and method for monitoring variation within an active region of a semiconductor device using scaling | |
| Rodriguez-Montanes et al. | Localization and electrical characterization of interconnect open defects | |
| JP4412781B2 (en) | Method for calculating delay time of integrated circuit | |
| Khare et al. | SRAM-based extraction of defect characteristics | |
| Goh et al. | Novel thermal validation metrology based on non-uniform power distribution for Pentium (R) III Xeon/sup TM/cartridge processor design with integrated level two cache | |
| US8832634B2 (en) | Integrated circuit characterization based on measured and static apparent resistances | |
| Mitterhuber et al. | TSEP-Sensitivity Study to Analyze the Soldering Process of a Power Diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |