CN117739873A - Board unevenness measuring method and system - Google Patents
Board unevenness measuring method and system Download PDFInfo
- Publication number
- CN117739873A CN117739873A CN202311754570.5A CN202311754570A CN117739873A CN 117739873 A CN117739873 A CN 117739873A CN 202311754570 A CN202311754570 A CN 202311754570A CN 117739873 A CN117739873 A CN 117739873A
- Authority
- CN
- China
- Prior art keywords
- measuring
- plate
- unevenness
- obtaining
- measured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000005259 measurement Methods 0.000 claims description 147
- 238000012360 testing method Methods 0.000 claims description 27
- 238000005516 engineering process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000007405 data analysis Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a method and a system for measuring plate unevenness, wherein the method comprises the following steps: and placing the measured plate on a platform, selecting a plurality of first measuring points on the measured plate, sequentially placing the target mirror at each first measuring point of the measured plate, and when the target mirror is placed at any one first measuring point of the measured plate, acquiring the spatial position of the target mirror by using a laser tracking device, and acquiring the distance from each first measuring point to a reference plane according to the spatial position corresponding to each first measuring point so as to acquire the unevenness of the measured plate. The method and the system for measuring the plate unevenness select the measuring points on the measured plate, and measure the spatial positions of the measuring points by using the laser tracking device so as to obtain the plate unevenness according to the obtained spatial positions of the measuring points, and compared with the traditional method for manually measuring by using a measuring tool, the method and the system can improve the measuring precision.
Description
Technical Field
The invention relates to the technical field of engineering measurement, in particular to a method and a system for measuring plate unevenness.
Background
The unevenness of the plate refers to the ratio of the maximum wave height d between the surface of the plate and the platform measured by placing the plate freely on the platform. The traditional method for measuring the unevenness of the plate is to freely place the plate on a platform, place a light ruler with high flatness and no bending deformation caused by dead weight on the plate, measure the maximum distance d between the surface of the plate and the light ruler by a feeler gauge, a micrometer or a scale, measure the length L, the width W or the chord length L of the plate by a measuring tool, and obtain the unevenness of the plate by calculation. This measurement method has the following disadvantages: because the traditional measuring tool is adopted for measurement, and manual measurement is difficult to measure accurately, such as the chord length l is difficult to measure accurately, the measurement result has low accuracy.
Therefore, how to improve the measurement accuracy of the plate unevenness is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
The invention aims to provide a method and a system for measuring plate unevenness, which can improve measurement accuracy.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a board unevenness measurement method comprising:
placing a measured plate on a platform, and selecting a plurality of first measuring points on the measured plate;
sequentially placing a target mirror at each first measuring point of the measured plate, and acquiring the spatial position of the target mirror by using a laser tracking device when the target mirror is placed at any one of the first measuring points of the measured plate;
and obtaining the distance from each first measuring point to a reference plane according to the corresponding spatial position of each first measuring point so as to obtain the unevenness of the measured plate, wherein the reference plane represents the plane corresponding to the platform.
Optionally, obtaining the reference plane includes:
selecting a plurality of second measuring points on the platform, sequentially placing the target mirror at each second measuring point of the platform, and acquiring the spatial position of the target mirror by using a laser tracking device when the target mirror is placed at any second measuring point of the platform;
and obtaining the reference plane according to the corresponding spatial position of each second measurement point.
Optionally, the selected plurality of the second measurement points are evenly distributed on the platform.
Optionally, selecting a plurality of first measurement points on the measured plate includes: sequentially selecting a plurality of first measuring points on the measured plate along the length direction of the measured plate;
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, wherein the obtaining the unevenness of the measured plate comprises the following steps:
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a first maximum distance according to the difference between the maximum distance and the minimum distance;
obtaining the longitudinal unevenness of the detected plate according to the first maximum distance and the length of the detected plate;
or/and, selecting a plurality of first measurement points on the measured plate comprises: sequentially selecting a plurality of first measuring points on the measured plate along the width direction of the measured plate;
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, wherein the obtaining the unevenness of the measured plate comprises the following steps:
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a second maximum distance according to the difference between the maximum distance and the minimum distance;
and obtaining the transverse unevenness of the detected plate according to the second maximum distance and the width of the detected plate.
Optionally, selecting a plurality of first measurement points on the measured plate includes: optionally selecting a plurality of preset intervals on the detected plate, and selecting a plurality of first measuring points in any preset interval, wherein the preset intervals have preset lengths;
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, wherein the obtaining the unevenness of the measured plate comprises the following steps:
for any preset interval, according to the space position corresponding to each first measurement point of the preset interval, obtaining the distance from each first measurement point to the reference plane, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and according to the difference between the maximum distance and the minimum distance and the length of the preset interval, obtaining the local unevenness corresponding to the preset interval;
and finding out the maximum value from the local unevenness corresponding to each preset interval, and taking the maximum value as the local unevenness of the measured plate.
Optionally, obtaining the distance from each first measurement point to the reference plane according to the spatial position corresponding to each first measurement point, so as to obtain the unevenness of the measured plate includes:
obtaining the distance from each first measurement point to a reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a third maximum distance according to the difference between the maximum distance and the minimum distance;
and according to the third maximum distance, obtaining the whole unevenness of the measured plate.
Optionally, at least three transverse measuring lines are drawn on the measured plate, the at least three transverse measuring lines are uniformly distributed, and the first measuring point is selected on the transverse measuring lines;
or/and, marking at least three longitudinal measuring lines on the measured plate, wherein the at least three longitudinal measuring lines are uniformly distributed, and selecting the first measuring point on the longitudinal measuring lines.
The plate unevenness measuring system comprises a platform, a target mirror, a laser tracking device and a control device, wherein the platform is used for placing a measured plate;
the laser tracking device is used for acquiring the space position of the target lens when the target lens is placed at any first measuring point of the measured plate, wherein a plurality of first measuring points are selected on the measured plate, and the target lens is placed at each first measuring point of the measured plate in sequence;
the control device is connected with the laser tracking device and is used for obtaining the distance from each first measuring point to a reference plane according to the corresponding space position of each first measuring point so as to obtain the unevenness of the measured plate, wherein the reference plane represents the plane corresponding to the platform.
Optionally, sequentially placing the target lens at each of the first measurement points of the measured plate includes: and controlling the target mirror to move, so that the target mirror is sequentially placed at each first measuring point of the measured plate.
According to the technical scheme, the measured plate is placed on the platform, a plurality of first measuring points are selected on the measured plate, the target mirror is sequentially placed at each first measuring point of the measured plate, when the target mirror is placed at any one of the first measuring points of the measured plate, the laser tracking device is used for acquiring the spatial position of the target mirror, and the distance from each first measuring point to the reference plane is acquired according to the spatial position corresponding to each first measuring point, so that the unevenness of the measured plate is obtained. The method for measuring the plate unevenness selects the measuring points on the measured plate, uses the laser tracking device to measure the spatial positions of all the measuring points so as to obtain the plate unevenness according to the obtained spatial positions of all the measuring points, and can improve the measuring precision compared with the traditional method for manually measuring by using a measuring tool.
The plate unevenness measuring system provided by the invention can achieve the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for measuring plate unevenness according to an embodiment of the present invention;
FIG. 2-1 is a top view of a test plate according to a first embodiment;
FIG. 2-2 is a schematic view of the longitudinal irregularities of the test plate shown in FIG. 2-1;
FIG. 3-1 is a top view of a second embodiment of a test plate;
FIG. 3-2 is a schematic view of the lateral irregularities of the test panel shown in FIG. 3-1;
FIG. 4-1 is a top view of a third embodiment of a test plate;
FIG. 4-2 is a schematic view of a partial unevenness of the test plate shown in FIG. 4-1;
FIG. 5 is a schematic view of a board to be tested placed on a platform according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a method of measuring plate unevenness according to an embodiment of the invention;
FIG. 7 is a flow chart of a method for measuring plate unevenness according to yet another embodiment of the present invention;
FIG. 8 is a schematic diagram of a plate unevenness measurement method using a laser tracking device and a target mirror for a stage measurement according to an embodiment of the invention.
Reference numerals in the drawings of the specification include:
10-measured plate, 11-platform, 12-target lens, 13-laser tracking device, 14-longitudinal measuring line and 15-transverse measuring line.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
Referring to fig. 1, fig. 1 is a flowchart of a board unevenness measuring method according to the present embodiment, and as shown in the drawing, the board unevenness measuring method includes the following steps:
s11: placing a measured plate on a platform, and selecting a plurality of first measuring points on the measured plate;
s12: sequentially placing a target mirror at each first measuring point of the measured plate, and acquiring the spatial position of the target mirror by using a laser tracking device when the target mirror is placed at any one of the first measuring points of the measured plate;
s13: and obtaining the distance from each first measuring point to a reference plane according to the corresponding spatial position of each first measuring point so as to obtain the unevenness of the measured plate, wherein the reference plane represents the plane corresponding to the platform.
When the target mirror is placed at any first measuring point of the measured plate, the laser tracking device is used for measuring the space position of the target mirror, and the measured space position of the target mirror can reflect the space position of the first measuring point on the measured plate. According to the measured spatial positions corresponding to the first measuring points, the distance between the first measuring points and the reference plane is obtained, and further the unevenness of the measured plate can be obtained according to the distance between each first measuring point on the measured plate and the reference plane. The method for measuring the plate unevenness of the embodiment selects measuring points on the measured plate, uses the laser tracking device to measure the spatial positions of the measuring points so as to obtain the plate unevenness according to the obtained spatial positions of the measuring points, and can improve the measuring precision compared with the traditional method for manually measuring by using a measuring tool.
And sending laser to the target mirror through the laser tracking device, reflecting the laser back after the laser irradiates the target mirror, and obtaining measurement data according to the reflected laser signal. The target mirror and the laser tracking device form a laser tracking measurement system (Laser Tracker System), and the laser tracking measurement system can comprise a laser tracking head (tracker), a controller, a user computer, a reflector (target mirror), a measurement accessory and the like, and is a high-precision large-size measurement instrument in an industrial measurement system. The method integrates various advanced technologies such as a laser interference ranging technology, a photoelectric detection technology, a precision mechanical technology, a computer and control technology, a modern numerical calculation theory and the like, tracks a space moving target and measures the space three-dimensional coordinates of the target in real time. The device has the characteristics of high precision, high efficiency, real-time tracking measurement, quick installation, simple and convenient operation and the like, and is suitable for large-size workpiece assembly measurement.
In this embodiment, the first measurement point is selected on the measured board, and the distribution form of the selected first measurement point on the measured board is not limited, and in practical application, the requirement of the board on the unevenness to be detected may be selected according to the area of the board on which the unevenness is to be detected.
Illustratively, the unevenness of the board includes a longitudinal unevenness of the board, and the longitudinal unevenness evaluation method of the board is: the percentage of the maximum wave height of the board along the length of the board, compared to the length of the board, is taken as the longitudinal unevenness of the board. The maximum wave height of the plate along the length of the plate is understood to be the difference in the vertical direction between the highest and lowest points of the plate along the length of the plate. Referring to fig. 2-1 and 2-2, fig. 2-1 is a top view of the measured plate according to the first embodiment, fig. 2-2 is a schematic view of the longitudinal irregularities of the measured plate shown in fig. 2-1, fig. 2-2 is a cross section along AA of the measured plate 10 shown in fig. 2-1, and the longitudinal irregularities of the measured plate 10 may be d as shown 1 Percentage of/L, d 1 The maximum wave height of the board 10 along the length direction thereof is shown, and L represents the length of the board 10. To detect the longitudinal unevenness of the test plate 10, a plurality of first measurement points may be sequentially selected on the test plate 10 along the length direction thereof.
The unevenness of the plate may further include a lateral unevenness of the plate, and the lateral unevenness evaluation method of the plate is as follows: the percentage of the maximum wave height of the panel along the width of the panel, as a ratio of the panel width, is referred to as the lateral unevenness of the panel. The maximum wave height of the plate along the plate width direction is understood as the difference in the vertical direction between the highest point and the lowest point of the plate along the plate width direction. Referring to FIGS. 3-1 and 3-2, FIG. 3-1 shows the depression of the test plate according to the second embodimentIn view, FIG. 3-2 is a schematic view showing the lateral unevenness of the test plate shown in FIG. 3-1, the test plate 10 shown in FIG. 3-1 is sectioned along BB in FIG. 3-2, and the lateral unevenness of the test plate 10 can be d as shown 2 Percentage of/W, d 2 The maximum wave height of the board 10 to be measured along the width direction thereof is shown, and W represents the width of the board 10 to be measured. To detect the lateral unevenness of the test sheet 10, a plurality of first measurement points may be sequentially selected on the test sheet 10 along the width direction thereof.
Alternatively, a plurality of the first measuring points may be sequentially selected on the board 10 to be measured along the length direction of the board 10 to be measured, in order to detect the longitudinal unevenness of the board 10 to be measured. Accordingly, obtaining the distance from each first measurement point to the reference plane according to the spatial position corresponding to each first measurement point, so as to obtain the unevenness of the measured plate 10 may include: obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a first maximum distance according to the difference between the maximum distance and the minimum distance; based on the first maximum distance and the length of the board under test 10, a longitudinal unevenness of the board under test 10 is obtained. And selecting each first measuring point selected along the length direction of the measured plate 10, inquiring the distance between each measuring point and the reference plane, finding out the maximum distance and the minimum distance, and obtaining the first maximum distance according to the difference between the maximum distance and the minimum distance, wherein the percentage of the ratio of the first maximum distance to the length of the measured plate 10 is the longitudinal unevenness of the measured plate 10. Alternatively, a measuring line along the length direction thereof, i.e., a longitudinal measuring line, may be drawn on the board under test 10, and measuring points may be sequentially selected on the longitudinal measuring line.
Alternatively, a plurality of the first measuring points may be sequentially selected on the board 10 to be measured along the width direction of the board 10 to be measured, in order to detect the lateral unevenness of the board 10 to be measured. Accordingly, obtaining the distance from each first measurement point to the reference plane according to the spatial position corresponding to each first measurement point, so as to obtain the unevenness of the measured plate 10 may include: obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a second maximum distance according to the difference between the maximum distance and the minimum distance; based on the second maximum distance and the width of the board under test 10, a lateral unevenness of the board under test 10 is obtained. And selecting each first measuring point selected along the width direction of the measured plate 10, inquiring the distance between each measuring point and the reference plane, finding out the maximum distance and the minimum distance, and obtaining a second maximum distance according to the difference between the maximum distance and the minimum distance, wherein the percentage of the ratio of the second maximum distance to the width of the measured plate 10 is the transverse unevenness of the measured plate 10. Alternatively, a measuring line along the width direction thereof, that is, a transverse measuring line, may be drawn on the board 10 to be measured, and measuring points may be sequentially selected on the transverse measuring line.
The unevenness of the plate also comprises local unevenness, and the local unevenness evaluation method of the plate comprises the following steps: the percentage of the maximum wave height over any spacing length on the plate, as compared to that spacing length of the plate, is the local unevenness of the plate. The spacing length of the plates may also be referred to as the chord length of the plates. Referring to fig. 4-1 and 4-2, fig. 4-1 is a top view of a third embodiment of the measured plate, fig. 4-2 is a schematic view of a local unevenness of the measured plate shown in fig. 4-1, fig. 4-2 is a cross-section of the measured plate 10 shown in fig. 4-1 along CC, and the local unevenness of the measured plate 10 may be d as shown 3 Percentage of/l, d 3 The maximum wave height of the measured plate 10 is shown, and l is the chord of the measured plate 10. To detect local irregularities of the board 10 under test, a spacing may be selected on the board 10 under test and a plurality of first measurement points may be selected within the respective spacing. Referring to fig. 5, fig. 5 is a schematic view illustrating a specific example of the placement of the measured plate on the platform, where the measured plate 10 may have a certain local area with uneven upper surface, and the chord length l may be measured along the length direction of the measured plate 10, and the measurement point may be selected in the local area. In addition, the maximum distance and the minimum distance from each first measuring point to the reference plane are found, and the highest point and the lowest point in each first measuring point, such as the highest point in the vertical direction, can be foundAnd a lowest point, the local unevenness is obtained from the difference between the highest point and the lowest point in the vertical direction and the interval length such as the chord length, and the local unevenness may be obtained as a percentage of the ratio of the difference between the highest point and the lowest point in the vertical direction to the interval length.
Alternatively, the local unevenness of the board 10 to be measured can be obtained by the following method: a plurality of preset intervals may be arbitrarily selected on the board 10 to be measured, and a plurality of the first measurement points may be selected within any preset interval, the preset intervals having a preset length. Accordingly, obtaining the distance from each first measurement point to the reference plane according to the spatial position corresponding to each first measurement point includes: for any preset interval, according to the space position corresponding to each first measurement point of the preset interval, obtaining the distance from each first measurement point to the reference plane, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and according to the difference between the maximum distance and the minimum distance and the length of the preset interval, obtaining the local unevenness corresponding to the preset interval; and finding out the maximum value from the local irregularities corresponding to the preset intervals, and taking the maximum value as the local irregularity of the measured plate 10. And (3) for the local unevenness corresponding to each preset interval, finding out the maximum value, and taking the maximum value as the final local unevenness of the measured plate 10. In practical applications, the preset interval may be selected on the board 10 to be measured according to the measurement requirement of the local unevenness of the board, and the preset interval may be along the length direction or the width direction of the board 10 to be measured, for example. The first measuring points selected within the preset interval can be distributed uniformly as much as possible.
In some embodiments, selecting the plurality of first measurement points on the board under test 10 includes: a plurality of the first measuring points are sequentially selected along a measuring line on the board 10 to be measured. Further, obtaining the distance from each first measurement point to the reference plane according to the spatial position corresponding to each first measurement point, so as to obtain the unevenness of the measured plate 10 may include: for each first measuring point on the measuring line, selecting the first measuring point on the measuring line in a range defined by a preset length with the first measuring point as a starting point, obtaining the distance from each first measuring point to the reference plane according to the selected spatial position corresponding to each first measuring point, finding out the maximum distance and the minimum distance from each first measuring point to the reference plane, and obtaining the local unevenness of the measured plate in the range defined by the preset length with the first measuring point as the starting point according to the difference between the maximum distance and the minimum distance and the preset length. Let the measured plate 10 be selected with 15 first measuring points along a certain measuring line, and the first measuring points are equally spaced apart by a predetermined length b=3a. Then, first to fourth first measurement points are selected from the first measurement points along the measurement line, local unevenness in the range is obtained according to the spatial positions corresponding to the measurement points, specifically, maximum distance and minimum distance from the reference plane are obtained according to the spatial positions of the four first measurement points, and the percentage of the ratio of the difference of the maximum distance and the minimum distance to the preset length b is taken as the local unevenness in the range. Sequentially, from the second first measuring point to the fifth first measuring point along the measuring line, obtaining the local unevenness in the range according to the corresponding space positions of the measuring points, and sequentially taking each subsequent first measuring point as a starting point to measure the local unevenness in the corresponding range. In this way, 12 local unevenness data can be obtained along the measurement line. The maximum of the 12 local unevenness data may also be taken as the local unevenness measurement result. In practical application, the first measuring points sequentially selected along the measuring line on the measured board 10 may be equidistant or non-equidistant, and the preset length may be set according to the local unevenness measuring requirement of the board. Such as 300 millimeters in one embodiment.
The unevenness of the plate also includes an overall unevenness, which can be evaluated according to the following method, including: obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a third maximum distance according to the difference between the maximum distance and the minimum distance; based on the third maximum distance, the global unevenness of the board 10 under test is obtained. The third maximum distance may be regarded as the global unevenness of the board 10 to be measured. Alternatively, among the respective first measurement points, the highest point and the lowest point, such as the highest point and the lowest point in the vertical direction, may be found, and the difference between the highest point and the lowest point in the vertical direction is taken as the overall unevenness of the board 10 to be measured.
In some embodiments, at least three transverse measuring lines are drawn on the board 10 to be measured, a first measuring point is selected on the transverse measuring lines, and each transverse measuring line is uniformly distributed when at least three transverse measuring lines are drawn on the board 10 to be measured. Or/and, at least three longitudinal measuring lines are drawn on the measured plate 10, the first measuring points are selected on the longitudinal measuring lines, and the longitudinal measuring lines are uniformly distributed under the condition that at least three longitudinal measuring lines are drawn on the measured plate 10, so that the first measuring points selected on the measured plate 10 are uniformly distributed as much as possible. The number of the transverse measuring lines and the longitudinal measuring lines may be determined according to the size of the measured plate 10, the transverse measuring lines may be measuring lines drawn along the width direction of the measured plate 10, and the longitudinal measuring lines may be measuring lines drawn along the length direction of the measured plate 10. Referring to fig. 6 for exemplary purposes, fig. 6 is a schematic diagram of a method for measuring plate unevenness according to an embodiment, in which a board 10 to be measured is placed on a platform 11, five longitudinal measuring lines 14 and eight transverse measuring lines 15 are drawn on the board 10 to be measured, the five longitudinal measuring lines 14 are uniformly distributed in the width direction, and the eight transverse measuring lines 15 are uniformly distributed in the length direction.
In this embodiment, for each lateral measurement line/longitudinal measurement line, according to the first measurement point on the present lateral measurement line/longitudinal measurement line, the lateral unevenness/longitudinal unevenness corresponding to the present lateral measurement line/longitudinal measurement line may be obtained, and the local unevenness corresponding to the present lateral measurement line/longitudinal measurement line may also be obtained. From a number of first measuring points on the measured plate 10, which are determined by the transverse measuring lines and the longitudinal measuring lines, the global unevenness of the measured plate 10 can be obtained.
In the traditional method for measuring by using a measuring tool manually, a light ruler with high flatness and no bending deformation caused by dead weight is placed on a plate, and the following defects can exist by measuring the maximum distance d between the surface of the plate and the light ruler through a feeler gauge, a micrometer or a scale: the manual measurement sampling data are limited, and the manual work can only measure board limit portion position, and large-size board intermediate position is far away from limit portion, can't measure, leads to board unevenness measurement and evaluation incomplete. In the method for measuring the plate unevenness in this embodiment, the laser tracking device and the target lens are used for measuring, and the measuring points can be arbitrarily selected on the plate according to the measuring requirement.
The reference plane represents a plane corresponding to the platform, and the distance between each first measurement point of the measured plate 10 and the platform is represented based on the reference plane in the method of the embodiment. In this embodiment, the method for setting the reference plane is not limited, and in some embodiments, the reference plane may be obtained by the following method, including: selecting a plurality of second measuring points on the platform 11, sequentially placing the target mirror 12 at each of the second measuring points of the platform 11, and acquiring the spatial position of the target mirror 12 by using a laser tracking device 13 when the target mirror 12 is placed at any one of the second measuring points of the platform 11; and obtaining the reference plane according to the corresponding spatial position of each second measurement point. Referring to fig. 7, fig. 7 is a flowchart of a method for measuring plate unevenness according to another embodiment, where a reference plane corresponding to a platform is obtained before the measured plate 10 is measured.
In this embodiment, the number of the second measurement points set on the platform 11 is not limited, and the number of the second measurement points may be determined according to the size of the platform 11 in practical applications. Preferably, the second measuring points selected on the platform 11 are uniformly distributed on the platform 11, i.e. the second measuring points are set at a relatively uniform position on the surface of the platform 11 to perform dotting measurement, which helps to improve accuracy of obtaining the reference plane and helps to improve measurement accuracy. According to the measured spatial position data corresponding to each second measuring point, data analysis can be carried out, and an optimal plane is fitted and is used as a reference plane. Referring to fig. 8 for exemplary purposes, fig. 8 is a schematic diagram of a measurement of a platform using a laser tracking device and a target mirror in a method for measuring plate unevenness according to an embodiment, wherein a plurality of second measuring points are selected on the platform 11, distributed in an array, and uniformly positioned on the platform 11 as shown.
The embodiment also provides a plate unevenness measuring system, referring to fig. 6, the plate unevenness measuring system comprises a platform 11, a target mirror 12, a laser tracking device 13 and a control device, wherein the platform 11 is used for placing a measured plate 10;
the laser tracking device 13 is configured to obtain a spatial position of the target lens 12 when the target lens 12 is placed at any first measurement point of the measured board 10, where a plurality of first measurement points are selected on the measured board 10, and the target lens 12 is placed at each of the first measurement points of the measured board 10 sequentially;
the control device is connected to the laser tracking device 13, and is configured to obtain, according to the spatial positions corresponding to the first measurement points, a distance from each first measurement point to a reference plane, so as to obtain the unevenness of the measured board 10, where the reference plane represents a plane corresponding to the platform 11.
The plate unevenness measuring system of the embodiment selects measuring points on a measured plate, uses a laser tracking device to measure the spatial positions of the measuring points, so as to obtain the unevenness of the plate according to the obtained spatial positions of the measuring points, and can improve the measuring precision compared with the traditional method of manually measuring by using a measuring tool.
Placing the target mirror 12 sequentially at each first measurement point of the board under test 10 includes: the movement of the target mirror 12 is controlled so that the target mirror 12 is sequentially placed at each of the first measurement points of the board under test 10.
In a specific example, a specific measurement process may include the following:
1) After the laser tracking device 13 is erected, the laser is electrified to perform laser preheating, and after the laser tracking device is stabilized, the laser self-calibration is performed. After calibration and inspection, the measurement mode is entered, as shown in fig. 8, the target lens 12 is placed on a plane base on the platform 11, the relative uniform positions are selected on the surface of the platform 11 to respectively perform dotting measurement coordinate values, after measurement is completed, data analysis is performed by using instrument measurement analysis software, and an optimal plane is fitted.
2) The board 10 to be measured is placed on the platform 11, as shown in fig. 6, and the number of the transverse measuring lines 15 and the longitudinal measuring lines 14 is determined according to the geometric dimension of the board 10 to be measured, so that the board is uniformly distributed as much as possible. The plane base is placed at the starting point position of the measuring line of the measured plate 10, and the measuring and analyzing software can be provided with measuring modes such as manual single-point measurement, stable point measurement or moving fixed distance measurement. The target 12 is placed on a plane base, the position of the plane base is moved to start measurement along a transverse measuring line 15 or a longitudinal measuring line 14, dotting coordinates of the transverse measuring line 15 and the longitudinal measuring line 14 are grouped and named so as to facilitate subsequent data processing, and after the measurement is completed, the measurement is stopped, and the data processing is performed.
3) For each transverse measuring line 15/longitudinal measuring line 14, the corresponding transverse/longitudinal unevenness of the present transverse measuring line 15/longitudinal measuring line 14 and the corresponding local unevenness of the present transverse measuring line 15/longitudinal measuring line 14 can be obtained from the measuring point data on the present transverse measuring line 15/longitudinal measuring line 14. From the data of each measurement point on the transverse measurement line 15 and the longitudinal measurement line 14 on the board 10 to be measured, the overall unevenness of the board 10 to be measured can be obtained. The data analysis is obtained by software automatic analysis, and the unevenness report and the coordinate point data schematic diagram can be selectively exported.
According to the embodiment, the plate is uniformly divided into a plurality of areas in a mode of drawing transverse measuring lines and longitudinal measuring lines on the plate, the three-dimensional coordinates of the target mirrors on the measuring lines are obtained through the laser tracking device, and the plate unevenness parameters are output in a three-dimensional point diagram mode through computer-aided software.
The method and system for measuring the unevenness of the plate of the embodiment can be applied to measuring the unevenness of various aluminum plates.
Compared with the prior art, the application has the following beneficial technical effects:
compared with the traditional measurement and analysis method, the method for collecting the data by utilizing the laser tracking measurement technology has the advantages of being rapid, accurate, high in precision, convenient to operate and the like, and the measurement speed and the precision of the plate unevenness are remarkably improved, and the analysis speed is remarkably improved. According to the method, the technology upgrading is realized through the application of the laser tracking measurement technology, the technology of measuring the unevenness of the edge of the plate by using the steel tape and the feeler gauge is innovated, the defect that the short plate of the unevenness of the middle position of the plate cannot be measured in the traditional technology is overcome, the detection means is obviously improved, and the detection quality level of the unevenness of the plate is greatly improved.
The method and system for measuring the plate unevenness provided by the invention are described in detail above. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (9)
1. A method of measuring board unevenness, comprising:
placing a measured plate on a platform, and selecting a plurality of first measuring points on the measured plate;
sequentially placing a target mirror at each first measuring point of the measured plate, and acquiring the spatial position of the target mirror by using a laser tracking device when the target mirror is placed at any one of the first measuring points of the measured plate;
and obtaining the distance from each first measuring point to a reference plane according to the corresponding spatial position of each first measuring point so as to obtain the unevenness of the measured plate, wherein the reference plane represents the plane corresponding to the platform.
2. The method of claim 1, wherein obtaining the reference plane comprises:
selecting a plurality of second measuring points on the platform, sequentially placing the target mirror at each second measuring point of the platform, and acquiring the spatial position of the target mirror by using a laser tracking device when the target mirror is placed at any second measuring point of the platform;
and obtaining the reference plane according to the corresponding spatial position of each second measurement point.
3. The method of claim 2, wherein a selected plurality of the second measurement points are uniformly distributed on the platform.
4. The method of claim 1, wherein selecting a plurality of first measurement points on the board under test comprises: sequentially selecting a plurality of first measuring points on the measured plate along the length direction of the measured plate;
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, wherein the obtaining the unevenness of the measured plate comprises the following steps:
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a first maximum distance according to the difference between the maximum distance and the minimum distance;
obtaining the longitudinal unevenness of the detected plate according to the first maximum distance and the length of the detected plate;
or/and, selecting a plurality of first measurement points on the measured plate comprises: sequentially selecting a plurality of first measuring points on the measured plate along the width direction of the measured plate;
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, wherein the obtaining the unevenness of the measured plate comprises the following steps:
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a second maximum distance according to the difference between the maximum distance and the minimum distance;
and obtaining the transverse unevenness of the detected plate according to the second maximum distance and the width of the detected plate.
5. The method of claim 1, wherein selecting a plurality of first measurement points on the board under test comprises: optionally selecting a plurality of preset intervals on the detected plate, and selecting a plurality of first measuring points in any preset interval, wherein the preset intervals have preset lengths;
obtaining the distance from each first measurement point to the reference plane according to the corresponding spatial position of each first measurement point, wherein the obtaining the unevenness of the measured plate comprises the following steps:
for any preset interval, according to the space position corresponding to each first measurement point of the preset interval, obtaining the distance from each first measurement point to the reference plane, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and according to the difference between the maximum distance and the minimum distance and the length of the preset interval, obtaining the local unevenness corresponding to the preset interval;
and finding out the maximum value from the local unevenness corresponding to each preset interval, and taking the maximum value as the local unevenness of the measured plate.
6. The method of claim 1, wherein obtaining the distance of each first measurement point to a reference plane based on the spatial position corresponding to each first measurement point to obtain the measured plate unevenness comprises:
obtaining the distance from each first measurement point to a reference plane according to the corresponding spatial position of each first measurement point, finding out the maximum distance and the minimum distance from each first measurement point to the reference plane, and obtaining a third maximum distance according to the difference between the maximum distance and the minimum distance;
and according to the third maximum distance, obtaining the whole unevenness of the measured plate.
7. The method for measuring plate unevenness according to claim 1, wherein at least three lateral measuring lines are drawn on the board to be measured, the at least three lateral measuring lines are uniformly distributed, and the first measuring point is selected on the lateral measuring lines;
or/and, marking at least three longitudinal measuring lines on the measured plate, wherein the at least three longitudinal measuring lines are uniformly distributed, and selecting the first measuring point on the longitudinal measuring lines.
8. The plate unevenness measuring system is characterized by comprising a platform, a target mirror, a laser tracking device and a control device, wherein the platform is used for placing a measured plate;
the laser tracking device is used for acquiring the space position of the target lens when the target lens is placed at any first measuring point of the measured plate, wherein a plurality of first measuring points are selected on the measured plate, and the target lens is placed at each first measuring point of the measured plate in sequence;
the control device is connected with the laser tracking device and is used for obtaining the distance from each first measuring point to a reference plane according to the corresponding space position of each first measuring point so as to obtain the unevenness of the measured plate, wherein the reference plane represents the plane corresponding to the platform.
9. The plate unevenness measurement system of claim 8, wherein sequentially placing the target mirror at each of the first measurement points of the measured plate comprises: and controlling the target mirror to move, so that the target mirror is sequentially placed at each first measuring point of the measured plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311754570.5A CN117739873A (en) | 2023-12-19 | 2023-12-19 | Board unevenness measuring method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311754570.5A CN117739873A (en) | 2023-12-19 | 2023-12-19 | Board unevenness measuring method and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117739873A true CN117739873A (en) | 2024-03-22 |
Family
ID=90255890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311754570.5A Pending CN117739873A (en) | 2023-12-19 | 2023-12-19 | Board unevenness measuring method and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117739873A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118067074A (en) * | 2024-04-19 | 2024-05-24 | 昆山固特杰散热产品有限公司 | Least square method-based method for judging bending and warping degree of heat radiation plate surface |
-
2023
- 2023-12-19 CN CN202311754570.5A patent/CN117739873A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118067074A (en) * | 2024-04-19 | 2024-05-24 | 昆山固特杰散热产品有限公司 | Least square method-based method for judging bending and warping degree of heat radiation plate surface |
| CN118067074B (en) * | 2024-04-19 | 2024-07-12 | 昆山固特杰散热产品有限公司 | Least square method-based method for judging bending and warping degree of heat radiation plate surface |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108801914B (en) | Method and system for detecting forming defects of multi-groove profile plate | |
| CN110940490B (en) | Laser spot scanning precision detection method and device of laser processing equipment | |
| CN105157606B (en) | Contactless complicated optical surface profile high precision three-dimensional measurement method and measurement apparatus | |
| CN117739873A (en) | Board unevenness measuring method and system | |
| US7593117B2 (en) | Apparatus and methods for measuring workpieces | |
| CN106813600B (en) | Non-contact discontinuous plane flatness measuring system | |
| CN111750801A (en) | Offline non-contact steel plate type evaluation method and measurement platform | |
| WO2007001327A2 (en) | Apparatus and methods for scanning conoscopic holography measurements | |
| US12018932B2 (en) | Determining the orientation of at least one object and method for relatively orienting rollers | |
| CN107246842A (en) | A kind of vehicle external profile Size Measuring System | |
| CN1593801A (en) | Automatic flatness measuring device and method | |
| CN115077412A (en) | Profile detection apparatus, profile detection method, and storage medium | |
| CN113251932A (en) | Displacement measurement method integrating confocal method and trigonometry | |
| CN112050729A (en) | Non-contact detection device and detection method | |
| CN114636379B (en) | Device and method for measuring diameter of invisible laser spot | |
| TWI806363B (en) | Intelligent digital geometric accuracy detection system of machine tool and method thereof | |
| CN113740033B (en) | Beam direction calibration method for optical measuring head in spectral confocal measurement system | |
| CN217179490U (en) | Gauge with measurement function for three-dimensional bent section | |
| CN109014725B (en) | Method and device for positioning pipe hole of workpiece and computer storage medium | |
| CN104019729B (en) | A kind of taper gage multiparameter measuring device and method | |
| CN110953987B (en) | Method and device for measuring fatigue crack outer deformation of steel bridge deck | |
| Li et al. | A new automatic steel tape verification system with low cost and high precision | |
| CN107339940A (en) | It is a kind of to compare difference value measurement method without pinpoint length | |
| CN109855538B (en) | Device and method for automatically measuring geometric initial defects of structural member | |
| Lishchenko et al. | Material Removal Rate Determination Based on a Laser Displacement Sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |