CN117736409A - Epoxy resin modified epoxy curing agent and preparation method thereof - Google Patents
Epoxy resin modified epoxy curing agent and preparation method thereof Download PDFInfo
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- CN117736409A CN117736409A CN202311679734.2A CN202311679734A CN117736409A CN 117736409 A CN117736409 A CN 117736409A CN 202311679734 A CN202311679734 A CN 202311679734A CN 117736409 A CN117736409 A CN 117736409A
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- epoxy resin
- curing agent
- epoxy
- butanol
- toluene
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 82
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 82
- 239000004593 Epoxy Substances 0.000 title claims abstract description 48
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title abstract description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 72
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims abstract description 49
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims abstract description 48
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims abstract description 23
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000002994 raw material Substances 0.000 claims description 19
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 16
- 239000008096 xylene Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 8
- 239000001569 carbon dioxide Substances 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 8
- 239000011259 mixed solution Substances 0.000 claims description 8
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- 238000004321 preservation Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000010276 construction Methods 0.000 description 5
- 238000012216 screening Methods 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
The invention discloses an epoxy curing agent modified by epoxy and a preparation method thereof, which is prepared from 5 to 15 mass percent of ethylenediamine, 10 to 20 mass percent of ethylene glycol diethyl ether, 20 to 35 mass percent of epoxy resin, 10 to 20 mass percent of toluene, 10 to 20 mass percent of n-butanol and 10 to 20 mass percent of dimethylbenzene. Through performance detection, the cured product has excellent performances such as appearance, flexibility, impact strength and the like, and has moderate curing time, so that the cured product is mainly suitable for building structural adhesive and can meet the use requirements of most customers.
Description
Technical Field
The invention relates to an epoxy curing agent modified by epoxy resin, in particular to an epoxy curing agent which has excellent performances such as appearance, flexibility, impact strength and the like, can be cured at room temperature, has moderate curing time, is mainly used for building structural adhesive, can meet the use requirements of most customers and a preparation method thereof, and belongs to the technical field of high polymer materials.
Background
The building structural adhesive is a novel material for connecting gaps of objects, and consists of epoxy resin and a matched epoxy curing agent. The machine is mainly suitable for curtain wall installation, the granite and ceramic tile veneers are poured and pasted in a hollowing mode, and a machine equipment support is fixed with a foundation; fixing a bridge support gasket machine tool; grouting the prestressed steel cable, bonding electronic elements and instrument parts, sealing, protecting and reinforcing; repair and adhesion of various metals, porcelain, wooden products, rubber, plastics, glass, etc.
The building structural adhesive needs to have loose curing conditions, a large proportioning range and moderate curing time. According to the construction characteristics, the material is generally molded at 25 ℃ for 2 hours, is dried for 24 hours, and achieves the optimal hardness in three days. Excellent toughness and impact resistance, aging resistance, chemical resistance and water resistance are also required.
Epoxy resins for construction adhesives generally use low viscosity epoxy resins, and the selection of the curing agent plays a critical role in the performance of the construction adhesive. Therefore, the epoxy curing agent modified by the epoxy resin, which has excellent comprehensive performance and can be suitable for building structural adhesive, is developed through a large number of experimental screening and optimizing the selection and the proportion of raw materials for a plurality of times.
Disclosure of Invention
The invention aims to: the invention aims to provide the epoxy curing agent which has excellent performances such as appearance, flexibility, impact strength and the like, can be cured at room temperature, has moderate curing time, is mainly used for building structural adhesive and can meet the use requirements of most customers according to the requirements of application occasions; the invention also aims at providing a preparation method of the epoxy curing agent.
The technical scheme is as follows: in order to achieve the above purpose, the invention adopts the following technical scheme:
an epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
5-15% of ethylenediamine, 10-20% of ethylene glycol diethyl ether, 20-35% of epoxy resin, 10-20% of toluene, 10-20% of n-butanol and 10-25% of dimethylbenzene.
As a preferable scheme, the epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
8% of ethylenediamine, 10% of ethylene glycol diethyl ether, 27% of epoxy resin, 20% of toluene, 17% of n-butanol and 18% of xylene.
As a preferable scheme, the epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
10% of ethylenediamine, 17% of ethylene glycol diethyl ether, 25% of epoxy resin, 17% of toluene, 14% of xylene and 17% of n-butanol.
As a preferable scheme, the epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
10% of ethylenediamine, 10% of ethylene glycol diethyl ether, 25% of epoxy resin, 20% of toluene, 18% of xylene and 17% of n-butanol.
Preferably, the epoxy resin modified epoxy curing agent is one or a mixture of several of SM601, SM618, SM634, SM6101 and SM 828.
The preparation method of the epoxy resin modified epoxy curing agent comprises the following steps:
(1) Adding ethylenediamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to mass percent, and stirring to uniformly mix the materials;
(2) Then introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 50-60 ℃;
(3) Pouring the metered epoxy resin and dimethylbenzene into an overhead tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle in a specified time, and controlling the temperature to be 60-80 ℃;
(5) After the epoxy resin is added dropwise, the reaction is carried out for 1 to 4 hours at the temperature of 60 to 90 ℃;
(6) And after the heat preservation is finished, filtering and packaging after the central control is qualified to obtain the epoxy curing agent modified by the epoxy resin.
The beneficial effects are that: compared with the prior art, the invention has the following advantages:
according to the invention, the optimal raw material proportioning composition is obtained through a large number of experimental screening, according to the performance requirements of application occasions, the hardness and yellowing resistance of the product can be improved by using ethylenediamine, the epoxy resin is used for modification so as to adjust the curing speed, and finally, the viscosity of the product is adjusted by using a solvent, so that the construction is facilitated.
The invention discovers that the dosage of each raw material is very critical in the experimental process. When the amount of ethylenediamine is less than the amount of the present invention, yellowing resistance is affected; the use amount of epoxy resin, xylene, toluene, n-butanol and ethylene glycol diethyl ether affects the curing speed and viscosity of the product, and is unfavorable for product construction if the use amount exceeds the mass percent range of the invention. Therefore, the invention obtains the optimal composition and dosage ratio of each raw material through a large number of experimental screening.
The performance detection shows that the epoxy curing agent prepared by the invention has excellent performance indexes such as hardness, flexibility, yellowing resistance and the like, has moderate curing time, can meet the application requirements of building structural adhesive, and achieves very good technical effects.
Detailed Description
Example 1
1. An epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
8% of ethylenediamine (99.8% of content supplied by Nanjing Le Xuan Co., ltd.), 10% of ethylene glycol diethyl ether, 27% of epoxy resin (SM 6101-80), 20% of toluene, 18% of xylene, 17% of n-butanol.
2. The preparation method of the epoxy resin modified epoxy curing agent comprises the following steps:
(1) Adding ethylenediamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to the mass percentages, and stirring to uniformly mix the materials;
(2) Then introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 50 ℃;
(3) Putting the metered epoxy resin (SM 6101-80) and dimethylbenzene into an overhead tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle within 1 hour, and controlling the temperature to be 60-70 ℃;
(5) After the epoxy resin is added dropwise, the temperature is kept between 60 and 70 ℃ for reaction for 1 hour;
(6) And after the heat preservation is finished, filtering and packaging after the central control is qualified to obtain the epoxy curing agent modified by the epoxy resin.
Example 2
1. An epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
12% of ethylenediamine (99.9% of content supplied by Nanj old field Co., ltd.), 15% of toluene, 15% of n-butanol, 15% of ethylene glycol diethyl ether, 20% of epoxy resin (SM 601) and 23% of xylene.
2. The preparation method of the epoxy resin modified epoxy curing agent comprises the following steps:
(1) Adding ethylenediamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to the correct mass percentage, and stirring to uniformly mix the materials;
(2) Introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 60 ℃;
(3) Pouring the metered epoxy resin (SM 601) and xylene into a head tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle within 1 hour, and controlling the temperature to be 70-80 ℃;
(5) After the epoxy resin is added dropwise, the temperature is kept between 70 and 80 ℃ for 2 hours;
(6) And after the heat preservation is finished, filtering and packaging after the central control is qualified to obtain the epoxy curing agent modified by the epoxy resin.
Example 3
1. An epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
15% of ethylenediamine (Yangzi petrochemical-Basv, content 99.9%), 10% of toluene, 12% of n-butanol, 17% of ethylene glycol diethyl ether, 25% of epoxy resin (SM 618) and 21% of xylene.
2. The preparation method of the epoxy resin modified epoxy curing agent comprises the following steps:
(1) Adding ethylenediamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to the mass percentage, and stirring to uniformly mix the materials;
(2) Introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 60 ℃;
(3) Pouring the metered epoxy 618 and xylene into an overhead tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle within 2 hours, and controlling the temperature to be 60-70 ℃;
(5) After the epoxy resin is added dropwise, the temperature is kept between 80 and 90 ℃ for 3 hours;
(6) And after the heat preservation is finished, filtering and packaging after the central control is qualified to obtain the epoxy curing agent modified by the epoxy resin.
Example 4
1. An epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
10% ethylenediamine (99.8% ethylene glycol ethyl ether, supplied by Nanjing Le Xuan Co., ltd.), 25% epoxy resin (SM 6101-80), 20% toluene, 18% xylene, 17% n-butanol
2. The preparation method of the epoxy resin modified epoxy curing agent comprises the following steps:
(1) Adding ethylenediamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to the mass percentages, and stirring to uniformly mix the materials;
(2) Introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 50 ℃;
(3) Pouring metered epoxy resin 6101-80 and dimethylbenzene into an overhead tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle within 1 hour, and controlling the temperature to be 60-70 ℃;
(5) After the epoxy resin is added dropwise, the temperature is kept between 60 and 70 ℃ for reaction for 1 hour;
(6) And after the heat preservation is finished, filtering and packaging after the central control is qualified to obtain the epoxy curing agent modified by the epoxy resin.
Example 5
1. An epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
10% ethylenediamine (99.8% ethylene glycol ethyl ether, from Nanjing Le Xuan Co., ltd.), 17% ethylene glycol ethyl ether, 25% epoxy resin (SM 6101-80), 17% toluene, 14% xylene, 17% n-butanol
2. The preparation method of the epoxy resin modified epoxy curing agent comprises the following steps:
(1) Adding ethylenediamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to the mass percentages, and stirring to uniformly mix the materials;
(2) Introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 50 ℃;
(3) Putting the metered epoxy resin (SM 6101-80) and dimethylbenzene into an overhead tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle within 1 hour, and controlling the temperature to be 60-70 ℃;
(5) After the epoxy resin is added dropwise, the temperature is kept between 60 and 70 ℃ for reaction for 1 hour;
(6) And after the heat preservation is finished, filtering and packaging after the central control is qualified to obtain the epoxy curing agent modified by the epoxy resin.
Comparative example 1
1. An epoxy resin modified epoxy curing agent is prepared from the following raw materials in percentage by mass:
10% of Diethylenetriamine (DETA), 17% of ethylene glycol diethyl ether, 25% of epoxy resin (SM 6101-80), 17% of toluene, 14% of xylene and 17% of n-butanol.
2. The preparation method of the epoxy resin modified epoxy curing agent comprises the following steps:
(1) Putting diethylenetriamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to the mass percentages, and stirring to uniformly mix the materials;
(2) Introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 50 ℃;
(3) Pouring metered epoxy resin 6101-80 and dimethylbenzene into an overhead tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle within 1 hour, and controlling the temperature to be 60-70 ℃;
(5) After the epoxy resin is added dropwise, the temperature is kept between 60 and 70 ℃ for reaction for 1 hour;
(6) Filtering and packaging to obtain the epoxy resin modified epoxy curing agent.
Example 6 Performance test
Epoxy resin (828 of Jiangsu Sanmu chemical Co., ltd.) and a modified epoxy curing agent were mixed in a weight ratio of 1:1 and uniformly coated on a tin plate to form a film with a film thickness of 40. Mu.m. The basic properties after curing are measured as follows in table 1.
Table 1 results of performance testing of different embodiments
The performance detection results show that the modified epoxy curing agent prepared from different raw materials through a large number of experimental screening has excellent performance indexes such as appearance, hardness, flexibility, yellowing resistance and the like, has moderate curing time, meets the application requirements of most customers, and achieves very good technical effects.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (7)
1. The epoxy resin modified epoxy curing agent is characterized by being prepared from the following raw materials in percentage by mass:
5-15% of ethylenediamine, 10-20% of ethylene glycol diethyl ether, 20-35% of epoxy resin, 10-20% of toluene, 10-20% of n-butanol and 10-20% of dimethylbenzene.
2. The epoxy resin modified epoxy curing agent according to claim 1, which is characterized by being prepared from the following raw materials in percentage by mass:
8% of ethylenediamine, 10% of ethylene glycol diethyl ether, 27% of epoxy resin, 20% of toluene, 17% of n-butanol and 18% of xylene.
3. The epoxy resin modified epoxy curing agent according to claim 1, which is characterized by being prepared from the following raw materials in percentage by mass:
10% of ethylenediamine, 17% of ethylene glycol diethyl ether, 25% of epoxy resin, 17% of toluene, 14% of xylene and 17% of n-butanol.
4. The epoxy resin modified epoxy curing agent according to claim 1, which is characterized by being prepared from the following raw materials in percentage by mass:
10% of ethylenediamine, 10% of ethylene glycol diethyl ether, 25% of epoxy resin, 20% of toluene, 18% of xylene and 17% of n-butanol.
5. The epoxy resin modified epoxy curing agent according to claim 1, wherein the epoxy resin is one or a mixture of several of SM601, SM618, SM634, SM6101, SM 828.
6. The method for producing an epoxy resin-modified epoxy curing agent according to any one of claims 1 to 5, comprising the steps of:
(1) Adding ethylenediamine, toluene, n-butanol and ethylene glycol diethyl ether into a reaction kettle according to mass percent, and stirring to uniformly mix the materials;
(2) Then introducing nitrogen or carbon dioxide protective gas, removing air in the kettle, and then starting to heat up to 50-60 ℃;
(3) Pouring the metered epoxy resin and dimethylbenzene into an overhead tank;
(4) Dripping the mixed solution of the epoxy resin and the dimethylbenzene in the overhead tank into a reaction kettle in a specified time, and controlling the temperature to be 60-80 ℃;
(5) After the epoxy resin is added dropwise, the reaction is carried out for 1 to 4 hours at the temperature of 60 to 90 ℃;
(6) And after the heat preservation is finished, filtering and packaging after the central control is qualified to obtain the epoxy curing agent modified by the epoxy resin.
7. Use of the epoxy resin modified epoxy curing agent of any one of claims 1 to 5 as an epoxy resin curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311679734.2A CN117736409A (en) | 2023-12-08 | 2023-12-08 | Epoxy resin modified epoxy curing agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311679734.2A CN117736409A (en) | 2023-12-08 | 2023-12-08 | Epoxy resin modified epoxy curing agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117736409A true CN117736409A (en) | 2024-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311679734.2A Pending CN117736409A (en) | 2023-12-08 | 2023-12-08 | Epoxy resin modified epoxy curing agent and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117736409A (en) |
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2023
- 2023-12-08 CN CN202311679734.2A patent/CN117736409A/en active Pending
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