CN117727405B - Method and device for analyzing interaction of soft mold-composite material grid structure - Google Patents

Abstract

The present invention relates to the technical field of composite materials, and in particular to a method and device for analyzing the interaction between a soft mold and a composite material grid structure. The method comprises: determining the theoretical process gap required when the target composite material is generated by the target soft film based on target soft film parameters and target composite material parameters; determining equivalent material parameters based on the theoretical process gap and target soft film parameters; the equivalent material parameters include material thickness, modulus and thermal expansion coefficient; establishing a finite element model based on the target soft film, the equivalent material and the target composite material; using the finite element model to analyze the interaction between the two when the target composite material grid structure is generated by the target soft film; wherein, during the finite element analysis process, the parameters of the equivalent material change with the change of its strain. The present application can transform the geometric discontinuity problem in the curing process into a nonlinear problem of the material, thereby improving the calculation efficiency.

Description

Soft mold-composite material grid structure interaction analysis method and device

Technical Field

The invention relates to the technical field of composite materials, and in particular to a method and a device for analyzing the interaction between a soft mold and a composite material grid structure.

Background technique

When using a soft film structure to generate a composite material, since the soft film deforms greatly during the curing process, it is necessary to reserve a process gap between the soft film and the composite material. When analyzing the interaction between the soft film and the composite mesh structure, the existing simulation method does not contact the composite material at the beginning of the curing process due to the existence of the process gap, which makes the calculation of the interaction between the soft mold and the composite material complicated. And as the curing progresses, the sudden contact of the geometric structure will cause serious discontinuous iterations in the calculation process, seriously reducing the calculation efficiency, or even non-convergence.

Therefore, there is an urgent need for a soft mold-composite material grid structure interaction analysis method and device to solve the above technical problems.

Summary of the invention

The embodiment of the present invention provides a method and device for analyzing the interaction between a soft mold and a composite material grid structure, which can transform the geometric discontinuity problem in the curing process into a nonlinear problem of the material, thereby improving the calculation efficiency.

In a first aspect, an embodiment of the present invention provides a method for analyzing the interaction between a soft mold and a composite material grid structure, comprising:

Based on the target soft film parameters and the target composite material parameters, determining the theoretical process gap required when the target soft film is used to generate the target composite material;

Determining equivalent material parameters based on the theoretical process gap and the target soft film parameters; the equivalent material parameters include material thickness, modulus and thermal expansion coefficient;

Establishing a finite element model based on the target soft film, the equivalent material and the target composite material;

The finite element model is used to analyze the interaction between the target soft film and the target composite material grid structure when the target soft film is used to generate the target composite material grid structure; wherein, during the finite element analysis process, the parameters of the equivalent material change as its strain changes.

In a second aspect, an embodiment of the present invention further provides a soft mold-composite material grid structure interaction analysis device, comprising:

A theoretical process gap determination unit, used to determine the theoretical process gap required when the target composite material is generated by using the target soft film based on the target soft film parameters and the target composite material parameters;

An equivalent material determination unit, used to determine equivalent material parameters based on the theoretical process gap and the target soft film parameters; the equivalent material parameters include material thickness, modulus and thermal expansion coefficient;

A model building unit, used for building a finite element model based on the target soft film, the equivalent material and the target composite material;

An analysis unit is used to use the finite element model to analyze the interaction between the two when the target composite material grid structure is generated by using the target soft film; wherein, during the finite element analysis process, the parameters of the equivalent material change as its strain changes.

In a third aspect, an embodiment of the present invention further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the method described in any embodiment of this specification is implemented.

In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed in a computer, the computer is caused to execute the method described in any embodiment of this specification.

The embodiment of the present invention provides a method and device for analyzing the interaction between a soft mold and a composite material grid structure. First, the equivalent material parameters are determined by the theoretical process gap and the target soft film parameters, and a finite element model is constructed by using the equivalent material to replace the theoretical process gap. Then, when the finite element model is used to calculate the curing process of the target composite material grid structure, the modulus and thermal expansion coefficient are updated according to the change of the equivalent material strain, so that the geometric discontinuity problem can be converted into a material nonlinear problem, thereby improving the convergence speed of the calculation.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

FIG1 is a schematic diagram of a method for analyzing the interaction between a soft mold and a composite material grid structure provided by an embodiment of the present invention;

FIG2 is a schematic diagram of the structures of a soft film, an equivalent material and a composite material in a finite element model provided by an embodiment of the present invention;

FIG3 is a hardware architecture diagram of an electronic device provided by an embodiment of the present invention;

FIG. 4 is a structural diagram of a soft mold-composite material grid structure interaction analysis device provided by an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

Referring to FIG. 1 , an embodiment of the present invention provides a method for analyzing the interaction between a soft mold and a composite material grid structure, the method comprising:

Step 100, based on the target soft film parameters and the target composite material parameters, determining the theoretical process gap required when the target soft film is used to generate the target composite material;

Step 102, determining equivalent material parameters based on the theoretical process gap and the target soft film parameters; the equivalent material parameters include material thickness, modulus and thermal expansion coefficient;

Step 104, establishing a finite element model based on the target soft film, the equivalent material and the target composite material;

Step 106, using a finite element model to analyze the interaction between the target soft film and the target composite material grid structure when the target soft film is used to generate the target composite material grid structure; wherein, during the finite element analysis process, the parameters of the equivalent material change as the strain thereof changes.

In this embodiment, first, the equivalent material parameters are determined by the theoretical process gap and the target soft film parameters, and the finite element model is constructed by using the equivalent material to replace the theoretical process gap. Then, when the finite element model is used to calculate the curing process of the target composite material grid structure, the modulus and thermal expansion coefficient of the equivalent material are updated according to the change of the strain of the equivalent material, so that the geometric discontinuity problem can be converted into a material nonlinear problem, thereby improving the convergence speed of the calculation.

The following describes how to execute each step shown in FIG. 1 .

First, for step 100, based on the target soft film parameters and the target composite material parameters, the theoretical process gap required when the target soft film is used to generate the target composite material is determined.

Compared with traditional hard films, when using soft films to produce composite mesh structures, the soft films will produce greater deformation under the action of temperature, which will squeeze the composite materials and affect the cross-sectional shape of the ribs. Therefore, in order to obtain a higher quality mesh structure, in the actual production process, it is necessary to reserve a theoretical process gap between the soft film and the composite material to improve the above problem.

Different soft films and composite materials have different deformation and performance requirements. Therefore, in the actual simulation process, the actual soft film used can be used as the target soft film, and the composite material to be produced can be used as the target composite material according to the actual needs of the user. Then, the theoretical process gap required for actual production or simulation can be determined based on the performance of the target soft film and the target composite material.

Then, for step 102, based on the theoretical process gap and the target soft film parameters, equivalent material parameters are determined; the equivalent material parameters include material thickness, modulus and thermal expansion coefficient.

It should be noted that in the finite element analysis process, the parameters of the equivalent material change with the change of its strain. During the curing process of the composite material, under the combined effects of high temperature, soft film and composite material extrusion, the strain of the equivalent material changes continuously. Therefore, it is also necessary to update the parameters of the equivalent material in real time according to its strain to ensure the accuracy of the calculation.

In some embodiments, the initial thickness of the equivalent material is greater than the theoretical process gap. The specific reasons are as follows:

Since the equivalent material needs to simulate the process of the process gap being compressed from the initial state to disappearance, if the initial thickness of the equivalent material is equal to or less than the theoretical process gap, the equivalent material thickness will be compressed to 0 during the finite element analysis process, resulting in the singular unit matrix of the equivalent material being unable to be solved. Therefore, it is necessary to ensure that the initial thickness of the equivalent material is greater than the theoretical process gap, to ensure that the thickness of the equivalent material is not compressed to 0 during the finite element analysis process, and to ensure the effective solution of the finite element analysis process.

Of course, the initial thickness of the equivalent material cannot be too large, otherwise it will occupy part of the space of the soft mold material. Therefore, in order to reduce the impact of the equivalent material on the silicone soft mold, the initial thickness of the equivalent material should not be too thick.

In some embodiments, the initial thickness of the equivalent material is calculated by the following formula:

In the formula, is the initial thickness of the equivalent material; /> is the theoretical process gap, /> is the preset strain threshold.

By using the above formula to calculate the initial thickness of the equivalent material, the thickness of the equivalent material will not be compressed to 0, and the thickness of the equivalent material will not be too large, occupying a smaller target soft film space, thereby ensuring the normal solution of the finite element analysis.

In addition, the strain threshold means the absolute value of the critical strain value of the equivalent material performance transformation under pressure conditions. The strain threshold is a dimensionless parameter with a value range of 0＜k＜1. Combined with the characteristics of finite element analysis, the k value is preferably any value between 0.8 and 0.9.

It should also be noted that the cross-sectional area of the equivalent material is equal to the cross-sectional area of the target composite material where it is attached to ensure the accuracy of the calculation.

In addition, in the initial stage of curing, before the strain of the equivalent material reaches the strain threshold, the performance of the equivalent material is much smaller than the material performance of the target soft film. Therefore, the initial modulus of the equivalent material is taken as one thousandth of the modulus of the target soft film, and the initial thermal expansion coefficient is zero.

The advantage of this setting is that in the initial stage of curing, the soft film and the composite material are basically not in contact, so a material with weaker performance is set, so weak that the interaction force between the equivalent material and the soft film and the composite material can be ignored, which is in line with the actual curing process.

Of course, users can also set the parameters of equivalent materials according to their needs, and this application does not make specific limitations.

Then, for step 104, a finite element model is established based on the target soft film, the equivalent material and the target composite material.

As shown in FIG2 , it is a schematic diagram of the structure of the soft film, equivalent material and composite material in the finite element model. It can be seen from the figure that the finite element model places the equivalent material between the soft film and the composite material to replace the process gap.

The basic principle of using equivalent materials to replace the theoretical process gap is:

1) Before the strain of the equivalent material reaches the strain threshold, its mechanical properties are extremely low, and the stress generated by its deformation is much smaller than the stress of the target soft mold and the target composite material. Since the initial modulus and initial thermal expansion coefficient of the equivalent material are both small at this time, the soft mold-equivalent material-composite material finite element model can be used to replace the soft mold-process gap-composite material finite element model.

2) After the strain of the equivalent material reaches the strain threshold, it can be determined that the process gap has disappeared, and the mechanical properties of the equivalent material are updated to the mechanical properties of the target soft mold. Therefore, the soft mold-equivalent material-composite material finite element model can be equivalent to the soft mold-soft mold-composite material model.

This equivalent method has the following advantages: 1. Since the research object of finite element analysis is composite materials, and the stiffness of composite materials is much greater than that of soft membranes, setting the parameters of equivalent materials to the parameters of target soft membranes can reduce the impact on composite materials. 2. The size of composite materials is much smaller than that of soft membranes, so setting the parameters of equivalent materials to the parameters of target soft membranes, that is, treating the equivalent materials as part of the soft membrane, has little impact on the simulation accuracy of the model.

From the above analysis, it can be seen that by defining equivalent material parameters and replacing process gaps with equivalent materials, the geometric discontinuity problem can be transformed into a material nonlinear problem.

It should also be noted that in the process of establishing the finite element model, it is also necessary to input corresponding boundary conditions, target soft film performance parameters, target soft film material constitutive model, composite material performance parameters, composite material constitutive model, metal mold material parameters, etc. according to actual conditions. This is a relatively well-known technology, and users can adjust it independently according to experimental requirements, and this application will not repeat it.

Finally, for step 106 , the finite element model is used to analyze the interaction between the target soft film and the target composite material grid structure when the target soft film is used to generate the target composite material grid structure.

In some implementations, the specific implementation process of step 106 is:

Step A1, dividing the equivalent material into a plurality of sub-regions, and giving each sub-region an initial thickness, an initial modulus, and an initial thermal expansion coefficient;

Step A2, using a finite element model to calculate the curing process of the target composite material grid structure, and continuously updating the modulus and thermal expansion coefficient of the equivalent material in each sub-region until the modulus and thermal expansion coefficient of each sub-region are updated;

Step A3, using the updated finite element model to continue calculating the curing process of the target composite material grid structure until the target composite material is cured, and obtaining the interaction between the target soft film and the target composite material grid structure.

In step A1, the more sub-regions there are, the higher the calculation accuracy is, but the amount of calculation is also greater. Conversely, the calculation accuracy decreases and the calculation speed increases. Therefore, this application does not make a specific limit on the number of sub-regions.

In step A2, as the curing process progresses, the equivalent material will be strained. Therefore, the modulus and thermal expansion coefficient of the equivalent material in each sub-region need to be continuously updated. The specific process is:

Determine the incremental step of the finite element model calculation process; the incremental step is not greater than the incremental step threshold;

Each time an incremental step is added during the solidification process, the following operations are performed on each sub-region:

Obtaining the current strain of the sub-region, and determining whether the current strain is greater than a preset strain threshold;

If yes, the modulus of the equivalent material in the sub-region is updated to the modulus of the target soft film, and the thermal expansion coefficient of the equivalent material in the sub-region is updated to the thermal expansion coefficient of the target soft film; if no, no update is performed.

In step A2, by obtaining the strain of each sub-region in real time, when the strain of a certain region is greater than the strain threshold, the modulus of the region is updated to the modulus of the target soft film, and the thermal expansion coefficient of the equivalent material in the sub-region is updated to the thermal expansion coefficient of the target soft film, until each sub-region is updated. This update method is equivalent to treating the composite material as a material with a sudden change in performance. When the strain is small, the performance is very weak, and its influence on the soft film and the composite material can be ignored; when the strain is greater than the strain threshold, its performance is equivalent to the performance of the soft film, making it a part of the soft film. In this way, the convergence speed is improved while ensuring geometric continuity.

It should be noted that since the finite element model provided in this application needs to capture the performance change points of equivalent materials in a timely manner, the incremental step cannot be too large. Too large an incremental step will make it impossible for the finite element analysis step to capture the performance change points of equivalent materials in a timely manner; at the same time, too small an incremental step will lead to too many calculation iterations and too long overall calculation time.

In order to ensure that the finite element analysis step can capture the change point of equivalent material performance while minimizing the number of iterations, this application determines the incremental step threshold through the following formula:

In the formula, is the incremental step threshold; /> is the incremental step coefficient, preferably 10;/> is the theoretical process gap; is the average distance from the edge to the center of the target soft mold; /> is the thermal expansion coefficient of the target soft film; /> is the thickness of the target composite material; /> is the thermal expansion coefficient of the target composite material in 2 directions; /> is the temperature difference between the glass transition temperature of the target composite material and room temperature.

After determining the incremental step threshold, as long as the incremental step is selected within this range, the change point of equivalent material performance can be accurately captured. Of course, the incremental step preferably has the incremental step threshold.

As shown in Figures 3 and 4, an embodiment of the present invention provides a soft mold-composite material grid structure interaction analysis device. The device embodiment can be implemented by software, or by hardware or a combination of software and hardware. From the hardware level, as shown in Figure 3, a hardware architecture diagram of an electronic device in which a soft mold-composite material grid structure interaction analysis device provided in an embodiment of the present invention is located, in addition to the processor, memory, network interface, and non-volatile memory shown in Figure 3, the electronic device in the embodiment where the device is located can generally include other hardware, such as a forwarding chip responsible for processing messages, etc. Taking software implementation as an example, as shown in Figure 4, as a device in a logical sense, it is formed by the CPU of the electronic device in which it is located reading the corresponding computer program in the non-volatile memory into the memory for execution.

This embodiment provides a soft mold-composite material grid structure interaction analysis device, comprising:

The theoretical process gap determination unit 400 is used to determine the theoretical process gap required when the target soft film is used to generate the target composite material based on the target soft film parameters and the target composite material parameters;

An equivalent material determination unit 402 is used to determine equivalent material parameters based on the theoretical process gap and the target soft film parameters; the equivalent material parameters include material thickness, modulus and thermal expansion coefficient;

A model building unit 404 is used to build a finite element model based on the target soft film, the equivalent material and the target composite material;

The analysis unit 406 is used to analyze the interaction between the target soft film and the target composite material grid structure by using the finite element model; wherein, in the finite element analysis process, the parameters of the equivalent material change as the strain thereof changes.

In some implementations, the analysis unit 406 is configured to perform the following operations:

The equivalent material is divided into a plurality of sub-regions, and each sub-region is given an initial thickness, an initial modulus and an initial thermal expansion coefficient;

The curing process of the target composite material grid structure is calculated using a finite element model, and the modulus and thermal expansion coefficient of the equivalent material in each sub-region are continuously updated until the modulus and thermal expansion coefficient of each sub-region are updated;

The updated finite element model is used to continue calculating the curing process of the target composite material grid structure until the target composite material is cured, and the interaction between the target soft film and the target composite material grid structure is obtained.

In some embodiments, the analysis unit 406 is used to perform the following operations when calculating the curing process of the target composite material grid structure using the finite element model and continuously updating the modulus and thermal expansion coefficient of the equivalent material in each sub-region:

Determine the incremental step of the finite element model calculation process; the incremental step is not greater than the incremental step threshold;

Each time an incremental step is added during the solidification process, the following operations are performed on each sub-region:

Obtaining the current strain of the sub-region, and determining whether the current strain is greater than a preset strain threshold;

If yes, the modulus of the equivalent material in the sub-region is updated to the modulus of the target soft film, and the thermal expansion coefficient of the equivalent material in the sub-region is updated to the thermal expansion coefficient of the target soft film; if no, no update is performed.

In some embodiments, the incremental step threshold is determined by the following formula:

In the formula, is the incremental step threshold; /> is the incremental step coefficient; /> is the theoretical process gap; /> is the average distance from the edge to the center of the target soft mold; /> is the thermal expansion coefficient of the target soft film; /> is the thickness of the target composite material; /> is the thermal expansion coefficient of the target composite material in 2 directions; /> is the temperature difference between the glass transition temperature of the target composite material and room temperature.

In some embodiments, the initial thickness of the equivalent material is greater than the theoretical process gap.

In some embodiments, the initial thickness of the equivalent material is calculated by the following formula:

In the formula, is the initial thickness of the equivalent material; /> is the theoretical process gap, /> is the preset strain threshold.

In some embodiments, the initial modulus is smaller than the modulus of the target soft film, and the initial modulus is preferably one thousandth of the modulus of the target soft film.

Furthermore, the initial thermal expansion coefficient is preferably zero.

It is to be understood that the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on a soft mold-composite material grid structure interaction analysis device. In other embodiments of the present invention, a soft mold-composite material grid structure interaction analysis device may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

The information interaction, execution process and other contents between the modules in the above-mentioned device are based on the same concept as the embodiment of the method of the present invention. For the specific contents, please refer to the description in the embodiment of the method of the present invention, and no further description is given here.

An embodiment of the present invention further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, a method for analyzing the interaction between a soft mold and a composite material grid structure in any embodiment of the present invention is implemented.

An embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the processor executes a soft mold-composite material grid structure interaction analysis method in any embodiment of the present invention.

Specifically, a system or device equipped with a storage medium can be provided, on which software program code that implements the functions of any of the above-mentioned embodiments is stored, and a computer (or CPU or MPU) of the system or device can be enabled to read and execute the program code stored in the storage medium.

In this case, the program code itself read from the storage medium can realize the function of any one of the above-mentioned embodiments, and thus the program code and the storage medium storing the program code constitute a part of the present invention.

The storage medium embodiments for providing the program code include a floppy disk, a hard disk, a magneto-optical disk, an optical disk (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), a magnetic tape, a non-volatile memory card, and a ROM. Alternatively, the program code can be downloaded from a server computer via a communication network.

In addition, it should be clear that the functions of any of the above embodiments can be implemented not only by executing the program code read by the computer, but also by enabling an operating system operating on the computer to complete part or all of the actual operations based on instructions from the program code.

In addition, it can be understood that the program code read from the storage medium is written to a memory provided in an expansion board inserted into the computer or written to a memory provided in an expansion module connected to the computer, and then based on the instructions of the program code, a CPU installed on the expansion board or expansion module is enabled to perform part or all of the actual operations, thereby realizing the functions of any of the above-mentioned embodiments.

It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical factors in the process, method, article or device including the elements.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (11)

1. A method for analyzing interaction of a soft mold-composite grid structure, comprising:

determining a theoretical process gap required when the target composite material is generated by adopting the target soft film based on the target soft film parameter and the target composite material parameter;

Determining equivalent material parameters based on the theoretical process gap and the target soft film parameters; the equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;

Establishing a finite element model based on the target soft film, the equivalent material and the target composite material;

Analyzing interactions between the two when the target soft film is utilized to generate the target composite grid structure by utilizing the finite element model; wherein the parameters of the equivalent material change with the change of strain thereof during the finite element analysis;

The analyzing, using the finite element model, interactions between the target soft film and the target composite grid structure when the target composite grid structure is generated, comprising:

Dividing the equivalent material into a plurality of subareas, and giving an initial thickness, an initial modulus and an initial thermal expansion coefficient to each subarea;

calculating the solidification process of the target composite material grid structure by using the finite element model, and continuously updating the modulus and the thermal expansion coefficient of the equivalent material in each subarea until the modulus and the thermal expansion coefficient of each subarea are updated;

and continuously calculating the curing process of the target composite material grid structure by using the updated finite element model until the target composite material is cured, so as to obtain the interaction between the target soft film and the target composite material grid structure.

2. The method of claim 1, wherein said calculating a curing process of said target composite grid structure using said finite element model and continuously updating the modulus and coefficient of thermal expansion of the equivalent material in each of said sub-regions comprises:

Determining incremental steps of the finite element model calculation process; the incremental steps are not greater than an incremental step threshold;

every increment step of the curing process is added, the following operation is carried out on each subarea:

acquiring the current strain of the subarea, and judging whether the current strain is larger than a preset strain threshold value or not;

If yes, updating the modulus of the equivalent material in the subarea to the modulus of the target soft film, and updating the thermal expansion coefficient of the equivalent material in the subarea to the thermal expansion coefficient of the target soft film; if not, not updating.

3. The method of claim 2, wherein the incremental step threshold is determined by the formula:

in the method, in the process of the invention, A step threshold value for the increment; /(I)Is an increment step coefficient; /(I)Is the theoretical process gap; The average distance from the edge to the center point of the target soft mode; /(I) Is the thermal expansion coefficient of the target soft film; /(I)A thickness of the target composite; /(I)A coefficient of thermal expansion in the direction of the target composite material 2; /(I)Is the temperature difference between the glass transition temperature and room temperature of the target composite material.

4. The method of claim 2, wherein the initial thickness of the equivalent material is greater than the theoretical process gap.

5. The method of claim 2, wherein the initial thickness of the equivalent material is calculated by the formula:

in the method, in the process of the invention, Is the initial thickness of the equivalent material; /(I)For the theoretical process gap,/>Is a preset strain threshold.

6. The method of claim 1, wherein the initial modulus is less than the modulus of the target soft film.

7. The method of claim 6, wherein the initial modulus is one thousandth of the target soft film modulus.

8. The method of claim 1, wherein the initial coefficient of thermal expansion is zero.

9. A soft mold-composite mesh structure interaction analysis device, comprising:

a theoretical process gap determining unit, configured to determine a theoretical process gap required when the target composite material is generated by using the target soft film, based on a target soft film parameter and a target composite material parameter;

an equivalent material determining unit, configured to determine an equivalent material parameter based on the theoretical process gap and the target soft film parameter; the equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;

the model building unit is used for building a finite element model based on the target soft film, the equivalent material and the target composite material;

An analysis unit for analyzing, using the finite element model, interactions between the two when the target composite grid structure is generated using the target soft film; wherein the parameters of the equivalent material change with the change of strain thereof during the finite element analysis;

The analysis unit is used for executing the following operations:

Dividing the equivalent material into a plurality of subareas, and giving an initial thickness, an initial modulus and an initial thermal expansion coefficient to each subarea;

calculating the solidification process of the target composite material grid structure by using the finite element model, and continuously updating the modulus and the thermal expansion coefficient of the equivalent material in each subarea until the modulus and the thermal expansion coefficient of each subarea are updated;

and continuously calculating the curing process of the target composite material grid structure by using the updated finite element model until the target composite material is cured, so as to obtain the interaction between the target soft film and the target composite material grid structure.

10. A computing device comprising a memory and a processor, the memory having stored therein a computer program, the processor implementing the method of any of claims 1-8 when the computer program is executed.

11. A computer readable storage medium having stored thereon a computer program which, when executed in a computer, causes the computer to perform the method of any of claims 1-8.