CN117727405B - Method and device for analyzing interaction of soft mold-composite material grid structure - Google Patents
Method and device for analyzing interaction of soft mold-composite material grid structure Download PDFInfo
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Abstract
The application relates to the technical field of composite materials, in particular to a method and a device for analyzing interaction of a soft mold-composite material grid structure. The method comprises the following steps: determining a theoretical process gap required when the target composite material is generated by adopting the target soft film based on the target soft film parameter and the target composite material parameter; determining equivalent material parameters based on the theoretical process gap and the target soft film parameters; the equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion; establishing a finite element model based on the target soft film, the equivalent material and the target composite material; analyzing interactions between the two when the target soft film is utilized to generate the target composite grid structure by utilizing the finite element model; wherein the parameters of the equivalent material change with changes in strain during finite element analysis. The application can convert the geometric discontinuity problem in the solidification process into the nonlinear problem of the material, and improve the calculation efficiency.
Description
Technical Field
The invention relates to the technical field of composite materials, in particular to a method and a device for analyzing interaction of a soft mold-composite material grid structure.
Background
When the soft film structure is used for producing the composite material, a process gap needs to be reserved between the soft film and the composite material because the soft film deforms greatly in the curing process. When the interaction of the soft film-composite material grid structure is analyzed by the existing simulation method, the soft film and the composite material are not contacted at the initial stage of the curing process due to the existence of a process gap, so that the interaction between the soft film and the composite material is complex in calculation. And as curing proceeds, abrupt contact of the geometry results in severe discontinuous iterations of the computation process, severely degrading the computation efficiency, and even not converging.
Therefore, a method and a device for analyzing the interaction of the soft mold and the composite material grid structure are needed to solve the above technical problems.
Disclosure of Invention
The embodiment of the invention provides a method and a device for analyzing interaction of a soft mold-composite material grid structure, which can convert a geometric discontinuity problem in a curing process into a nonlinear problem of a material and improve the calculation efficiency.
In a first aspect, an embodiment of the present invention provides a method for analyzing interaction between a soft mold and a composite grid structure, including:
determining a theoretical process gap required when the target composite material is generated by adopting the target soft film based on the target soft film parameter and the target composite material parameter;
Determining equivalent material parameters based on the theoretical process gap and the target soft film parameters; equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;
Establishing a finite element model based on the target soft film, the equivalent material and the target composite material;
Analyzing interactions between the two when the target soft film is utilized to generate the target composite grid structure by utilizing the finite element model; wherein the parameters of the equivalent material change with changes in strain during finite element analysis.
In a second aspect, an embodiment of the present invention further provides a soft mold-composite mesh structure interaction analysis apparatus, including:
a theoretical process gap determining unit, configured to determine a theoretical process gap required when the target composite material is generated by using the target soft film, based on a target soft film parameter and a target composite material parameter;
an equivalent material determining unit, configured to determine an equivalent material parameter based on the theoretical process gap and the target soft film parameter; the equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;
the model building unit is used for building a finite element model based on the target soft film, the equivalent material and the target composite material;
An analysis unit for analyzing, using the finite element model, interactions between the two when the target composite grid structure is generated using the target soft film; wherein the parameters of the equivalent material change with changes in strain during finite element analysis.
In a third aspect, an embodiment of the present invention further provides an electronic device, including a memory and a processor, where the memory stores a computer program, and when the processor executes the computer program, the method described in any embodiment of the present specification is implemented.
In a fourth aspect, embodiments of the present invention also provide a computer-readable storage medium having stored thereon a computer program which, when executed in a computer, causes the computer to perform a method according to any of the embodiments of the present specification.
The embodiment of the invention provides a method and a device for analyzing interaction of a soft mold-composite material grid structure. Firstly, determining equivalent material parameters through a theoretical process gap and target soft film parameters, and constructing a finite element model by utilizing equivalent materials to replace the theoretical process gap. Then, when the finite element model is used for calculating the solidification process of the target composite material grid structure, the modulus and the thermal expansion coefficient of the target composite material grid structure are updated according to the change of the equivalent material strain, so that the geometric discontinuity problem can be converted into the material nonlinearity problem, and the calculation convergence rate is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a method for analyzing interaction between a soft mold and a composite grid structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the structure of a soft film, equivalent materials and composite materials in a finite element model according to an embodiment of the present invention;
FIG. 3 is a hardware architecture diagram of an electronic device according to an embodiment of the present invention;
Fig. 4 is a block diagram of a device for analyzing interaction between a soft mold and a composite grid structure according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a method for analyzing interaction between a soft mold and a composite grid structure, the method comprising:
Step 100, determining a theoretical process gap required when a target soft film is adopted to generate a target composite material based on a target soft film parameter and a target composite material parameter;
102, determining equivalent material parameters based on theoretical process gaps and target soft film parameters; equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;
104, establishing a finite element model based on the target soft film, the equivalent material and the target composite material;
Step 106, analyzing interaction between the two when the target soft film is utilized to generate a target composite material grid structure by utilizing a finite element model; wherein the parameters of the equivalent material change with the change of strain thereof during the finite element analysis.
In this embodiment, first, equivalent material parameters are determined by theoretical process gap and target soft film parameters, and a finite element model is constructed using equivalent materials instead of the theoretical process gap. Then, when the finite element model is used for calculating the solidification process of the target composite material grid structure, the modulus and the thermal expansion coefficient of the target composite material grid structure are updated according to the change of the equivalent material strain, so that the geometric discontinuity problem can be converted into the material nonlinearity problem, and the calculation convergence rate is improved.
The manner in which the individual steps shown in fig. 1 are performed is described below.
First, for step 100, a theoretical process gap required when generating a target composite using a target soft film is determined based on target soft film parameters and target composite parameters.
Compared with the traditional hard film, when the soft film is used for producing the composite material grid structure, the soft film can generate larger deformation under the action of temperature, and the deformation can extrude the composite material to influence the cross-sectional shape of the ribs. Therefore, in order to obtain a higher quality lattice structure, a theoretical process gap needs to be reserved between the flexible film and the composite material in the actual production process to improve the above-mentioned problems.
Different flexible films and composite materials have different deformation and performance requirements. Therefore, in the actual simulation process, the actually used soft film is taken as a target soft film, the composite material to be produced is taken as a target composite material according to the actual requirement of a user, and then the theoretical process gap required in the actual production or simulation is determined according to the performances of the target soft film and the target composite material.
Then, for step 102, determining equivalent material parameters based on the theoretical process gap and the target soft film parameters; equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion.
It should be noted that, in the finite element analysis process, parameters of the equivalent material are changed along with the change of the strain. In the curing process of the composite material, under the combined action of high temperature, soft film and composite material extrusion, the strain of the material is continuously changed, so that the parameters of the equivalent material are also required to be updated in real time according to the strain of the material, thereby ensuring the calculation accuracy.
In some embodiments, the initial thickness of the equivalent material is greater than the theoretical process gap. The specific reasons are as follows:
Since the equivalent material needs to simulate the process from the initial state to the disappearance of the process gap, if the initial thickness of the equivalent material is equal to or smaller than the theoretical process gap, the condition that the thickness of the equivalent material is compressed to 0 can occur in the finite element analysis process, so that the unit matrix of the equivalent material cannot be solved in singular. Therefore, the initial thickness of the equivalent material needs to be ensured to be larger than the theoretical process gap, the thickness of the equivalent material is ensured not to be compressed to 0 in the finite element analysis process, and the effective solution of the finite element analysis process is ensured.
Of course, the initial thickness of the equivalent material cannot be too large, otherwise, the space of part of the soft mold material is occupied, so that the initial thickness of the equivalent material is not too large in order to reduce the influence of the equivalent material on the soft mold of the silica gel.
In some embodiments, the initial thickness of the equivalent material is calculated by the following formula:
in the method, in the process of the invention, Is the initial thickness of the equivalent material; /(I)Is the theoretical process gap,/>Is a preset strain threshold.
The initial thickness of the equivalent material is calculated by adopting the formula, the condition that the thickness of the equivalent material is compressed to 0 can not occur, the thickness of the equivalent material can be ensured not to be too large, a small target soft film space is occupied, and the normal solution of finite element analysis is ensured.
In addition, the strain threshold is defined as the absolute value of the critical strain value of the equivalent material performance transformation under the compression working condition, the strain threshold is a dimensionless parameter, the value range is 0< k < 1, and the k value is preferably any value in 0.8-0.9 by combining the finite element analysis characteristic.
It should be noted that the cross-sectional area of the equivalent material is equal to the cross-sectional area of the target composite material at the position where the equivalent material is attached, so that the accuracy of calculation is ensured.
In addition, before the strain of the equivalent material reaches the strain threshold in the initial stage of curing, the performance of the equivalent material is far smaller than that of the material of the target soft film, so that the initial modulus of the equivalent material is taken as one thousandth of the modulus of the target soft film, and the initial thermal expansion coefficient is zero.
The setting mode has the advantages that: in the initial stage of curing, the soft film and the composite material are basically not contacted, so that a material with weaker performance is arranged, and the interaction force between the equivalent material and the soft film and the composite material is negligible, which is consistent with the actual curing process.
Of course, the user can set the parameters of the equivalent materials independently according to the needs, and the application is not limited in particular.
Then, for step 104, a finite element model is built based on the target soft membrane, the equivalent material, and the target composite material.
As shown in fig. 2, the structure of the soft film, the equivalent material and the composite material in the finite element model is schematically shown, and it can be seen from the figure that the equivalent material is placed between the soft film and the composite material in the finite element model to replace the process gap.
The equivalent material is utilized to replace the theoretical process gap, and the basic principle is as follows:
1) Before the strain of the equivalent material reaches the strain threshold, the mechanical property of the equivalent material is extremely low, and the stress generated by deformation of the equivalent material is far smaller than the stress of the target soft mode and the target composite material. And at the moment, the initial modulus and the initial thermal expansion coefficient of the equivalent material are smaller, so that the soft mode-equivalent material-composite material finite element model can be used for replacing the soft mode-process gap-composite material finite element model.
2) After the strain of the equivalent material reaches the strain threshold, the process gap can be judged to be disappeared, and the mechanical property of the equivalent material is updated to the mechanical property of the target soft mode, so that the soft mode-equivalent material-composite material finite element model can be used to be equivalent to the soft mode-composite material model.
This equivalent way has the following advantages: 1. since the research object of finite element analysis is a composite material, and the rigidity of the composite material is far greater than that of the soft membrane, the influence on the composite material can be reduced by setting the parameters of the equivalent material as the parameters of the target soft membrane. 2. The size of the composite material is far smaller than that of the soft film, so that the parameters of the equivalent material are set as the parameters of the target soft film, namely the equivalent material is used as a part of the soft film, and the simulation accuracy of the model is less affected.
From the above analysis, it can be seen that by defining equivalent material parameters, replacing the process gap with equivalent material, the geometric discontinuity problem can be converted into a material nonlinearity problem.
In the finite element model building process, corresponding boundary conditions, target soft film performance parameters, target soft film material constitutive models, composite material performance parameters, composite material constitutive models, metal mold material parameters and the like are input according to actual conditions. The user can adjust the device automatically according to the experimental requirements, which is a well-known technology and is not described in detail.
Finally, for step 106, interactions between the two are analyzed using a finite element model when generating a target composite mesh structure using the target pial.
In some embodiments, the specific implementation procedure of step 106 is:
Step A1, dividing an equivalent material into a plurality of subareas, and giving an initial thickness, an initial modulus and an initial thermal expansion coefficient to each subarea;
A2, calculating a curing process of the target composite material grid structure by using a finite element model, and continuously updating the modulus and the thermal expansion coefficient of the equivalent material in each sub-area until the modulus and the thermal expansion coefficient of each sub-area are updated;
And step A3, continuing to calculate the curing process of the target composite material grid structure by using the updated finite element model until the curing of the target composite material is finished, and obtaining the interaction between the target soft film and the target composite material grid structure.
In step A1, the greater the number of sub-regions, the higher the calculation accuracy, but the greater the calculation amount. Otherwise, the calculation accuracy is reduced, and the calculation speed is improved. Therefore, the present application is not limited to the number of sub-areas.
In step A2, as the curing process advances, the equivalent material is strained, and therefore, the modulus and the thermal expansion coefficient of the equivalent material in each sub-region need to be continuously updated, specifically:
determining an incremental step of a finite element model calculation process; the incremental steps are not greater than an incremental step threshold;
every increment step is added in the curing process, the following operation is carried out on each sub-area:
acquiring the current strain of the subarea, and judging whether the current strain is larger than a preset strain threshold value or not;
If yes, updating the modulus of the equivalent material in the subarea to the modulus of the target soft film, and updating the thermal expansion coefficient of the equivalent material in the subarea to the thermal expansion coefficient of the target soft film; if not, not updating.
In step A2, by acquiring the strain of each sub-area in real time, when the strain of a certain area is greater than the strain threshold, the modulus of the area is updated to the modulus of the target soft film, and the thermal expansion coefficient of the equivalent material in the sub-area is updated to the thermal expansion coefficient of the target soft film until each sub-area is completely updated. The updating mode is equivalent to taking the composite material as a material with abrupt change of performance, and when the strain is smaller, the performance is very weak, and the influence of the composite material on the soft film and the composite material can be ignored; and after the strain is larger than the strain threshold, the performance of the soft film is equivalent to that of the soft film, so that the soft film becomes a part of the soft film. Thus, the convergence rate is improved on the premise of ensuring geometric continuity.
It should be noted that, since the finite element model provided by the application needs to capture the performance change point of the equivalent material in time, the incremental steps cannot be excessively large. Excessive incremental steps can make finite element analysis steps incapable of capturing equivalent material performance change points in time; meanwhile, the problem that the total calculation time is too long is caused by too small increment steps and too high calculation iteration times.
In order to ensure that the finite element analysis step can capture the equivalent material performance change point and simultaneously reduce the iteration times as much as possible, the application determines the increment step threshold value through the following formula:
in the method, in the process of the invention, Is an incremental step threshold; /(I)For an incremental step factor, preferably 10; /(I)Is a theoretical process gap; The average distance from the edge to the center point of the target soft mode; /(I) Is the thermal expansion coefficient of the target soft film; /(I)Is the thickness of the target composite material; /(I)A coefficient of thermal expansion in the direction of the target composite material 2; /(I)Is the temperature difference between the glass transition temperature of the target composite material and room temperature.
After the incremental step threshold is determined, the equivalent material performance change point can be accurately captured only by selecting the incremental step within the range. Of course, the incremental steps are preferably incremental step thresholds.
As shown in fig. 3 and 4, an embodiment of the present invention provides a soft mold-composite grid structure interaction analysis device. The apparatus embodiments may be implemented by software, or may be implemented by hardware or a combination of hardware and software. In terms of hardware, as shown in fig. 3, a hardware architecture diagram of an electronic device where a soft mold-composite grid structure interaction analysis device provided in an embodiment of the present invention is located, in addition to a processor, a memory, a network interface, and a nonvolatile memory shown in fig. 3, the electronic device where the device is located in the embodiment may generally include other hardware, such as a forwarding chip responsible for processing a packet, and so on. For example, as shown in fig. 4, the device in a logic sense is formed by reading a corresponding computer program in a nonvolatile memory into a memory by a CPU of an electronic device where the device is located.
The embodiment provides a soft mold-composite material grid structure interaction analysis device, which comprises:
A theoretical process gap determining unit 400 for determining a theoretical process gap required when the target composite material is generated by using the target soft film based on the target soft film parameter and the target composite material parameter;
An equivalent material determining unit 402, configured to determine an equivalent material parameter based on the theoretical process gap and the target soft film parameter; equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;
a model building unit 404, configured to build a finite element model based on the target soft film, the equivalent material, and the target composite material;
An analysis unit 406 for analyzing, using a finite element model, interactions between the two when generating a target composite grid structure using the target soft film; wherein the parameters of the equivalent material change with the change of strain thereof during the finite element analysis.
In some embodiments, the analysis unit 406 is configured to perform the following operations:
dividing the equivalent material into a plurality of subareas, and giving an initial thickness, an initial modulus and an initial thermal expansion coefficient to each subarea;
calculating the solidification process of the target composite material grid structure by using the finite element model, and continuously updating the modulus and the thermal expansion coefficient of the equivalent material in each sub-area until the modulus and the thermal expansion coefficient of each sub-area are updated;
And continuously calculating the curing process of the target composite material grid structure by using the updated finite element model until the target composite material is cured, so as to obtain the interaction between the target soft film and the target composite material grid structure.
In some embodiments, the analysis unit 406 is configured to perform the following operations when performing the curing process that calculates the target composite lattice structure using the finite element model, and continuously updating the modulus and coefficient of thermal expansion of the equivalent material in each sub-region:
determining an incremental step of a finite element model calculation process; the incremental steps are not greater than an incremental step threshold;
every increment step is added in the curing process, the following operation is carried out on each sub-area:
acquiring the current strain of the subarea, and judging whether the current strain is larger than a preset strain threshold value or not;
If yes, updating the modulus of the equivalent material in the subarea to the modulus of the target soft film, and updating the thermal expansion coefficient of the equivalent material in the subarea to the thermal expansion coefficient of the target soft film; if not, not updating.
In some embodiments, the incremental step threshold is determined by the following formula:
in the method, in the process of the invention, Is an incremental step threshold; /(I)Is an increment step coefficient; /(I)Is a theoretical process gap; /(I)The average distance from the edge to the center point of the target soft mode; /(I)Is the thermal expansion coefficient of the target soft film; /(I)Is the thickness of the target composite material; /(I)A coefficient of thermal expansion in the direction of the target composite material 2; /(I)Is the temperature difference between the glass transition temperature of the target composite material and room temperature.
In some embodiments, the initial thickness of the equivalent material is greater than the theoretical process gap.
In some embodiments, the initial thickness of the equivalent material is calculated by the following formula:
in the method, in the process of the invention, Is the initial thickness of the equivalent material; /(I)Is the theoretical process gap,/>Is a preset strain threshold.
In some embodiments, the initial modulus is less than the modulus of the target soft film, preferably one thousandth of the modulus of the target soft film.
Furthermore, the initial thermal expansion coefficient is preferably zero.
It will be appreciated that the structure illustrated in the embodiments of the present invention is not intended to be limiting in any particular way for a device for analysis of interaction between a soft mold and a composite lattice structure. In other embodiments of the invention, a soft mold-composite lattice structure interaction analysis device may include more or fewer components than shown, or may combine certain components, or split certain components, or a different arrangement of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.
The content of information interaction and execution process between the modules in the device is based on the same conception as the embodiment of the method of the present invention, and specific content can be referred to the description in the embodiment of the method of the present invention, which is not repeated here.
The embodiment of the invention also provides electronic equipment, which comprises a memory and a processor, wherein the memory stores a computer program, and the processor realizes the interaction analysis method of the soft mold-composite material grid structure in any embodiment of the invention when executing the computer program.
The embodiment of the invention also provides a computer readable storage medium, and the computer readable storage medium stores a computer program, and the computer program when executed by a processor causes the processor to execute the soft mode-composite grid structure interaction analysis method in any embodiment of the invention.
Specifically, a system or apparatus provided with a storage medium on which a software program code realizing the functions of any of the above embodiments is stored, and a computer (or CPU or MPU) of the system or apparatus may be caused to read out and execute the program code stored in the storage medium.
In this case, the program code itself read from the storage medium may realize the functions of any of the above-described embodiments, and thus the program code and the storage medium storing the program code form part of the present invention.
Examples of storage media for providing program code include floppy disks, hard disks, magneto-optical disks, optical disks (e.g., CD-ROMs, CD-R, CD-RWs, DVD-ROMs, DVD-RAMs, DVD-RWs, DVD+RWs), magnetic tapes, nonvolatile memory cards, and ROMs. Alternatively, the program code may be downloaded from a server computer by a communication network.
Further, it should be apparent that the functions of any of the above-described embodiments may be implemented not only by executing the program code read out by the computer, but also by causing an operating system or the like operating on the computer to perform part or all of the actual operations based on the instructions of the program code.
Further, it is understood that the program code read out by the storage medium is written into a memory provided in an expansion board inserted into a computer or into a memory provided in an expansion module connected to the computer, and then a CPU or the like mounted on the expansion board or the expansion module is caused to perform part and all of actual operations based on instructions of the program code, thereby realizing the functions of any of the above embodiments.
It is noted that relational terms such as first and second, and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (11)
1. A method for analyzing interaction of a soft mold-composite grid structure, comprising:
determining a theoretical process gap required when the target composite material is generated by adopting the target soft film based on the target soft film parameter and the target composite material parameter;
Determining equivalent material parameters based on the theoretical process gap and the target soft film parameters; the equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;
Establishing a finite element model based on the target soft film, the equivalent material and the target composite material;
Analyzing interactions between the two when the target soft film is utilized to generate the target composite grid structure by utilizing the finite element model; wherein the parameters of the equivalent material change with the change of strain thereof during the finite element analysis;
The analyzing, using the finite element model, interactions between the target soft film and the target composite grid structure when the target composite grid structure is generated, comprising:
Dividing the equivalent material into a plurality of subareas, and giving an initial thickness, an initial modulus and an initial thermal expansion coefficient to each subarea;
calculating the solidification process of the target composite material grid structure by using the finite element model, and continuously updating the modulus and the thermal expansion coefficient of the equivalent material in each subarea until the modulus and the thermal expansion coefficient of each subarea are updated;
and continuously calculating the curing process of the target composite material grid structure by using the updated finite element model until the target composite material is cured, so as to obtain the interaction between the target soft film and the target composite material grid structure.
2. The method of claim 1, wherein said calculating a curing process of said target composite grid structure using said finite element model and continuously updating the modulus and coefficient of thermal expansion of the equivalent material in each of said sub-regions comprises:
Determining incremental steps of the finite element model calculation process; the incremental steps are not greater than an incremental step threshold;
every increment step of the curing process is added, the following operation is carried out on each subarea:
acquiring the current strain of the subarea, and judging whether the current strain is larger than a preset strain threshold value or not;
If yes, updating the modulus of the equivalent material in the subarea to the modulus of the target soft film, and updating the thermal expansion coefficient of the equivalent material in the subarea to the thermal expansion coefficient of the target soft film; if not, not updating.
3. The method of claim 2, wherein the incremental step threshold is determined by the formula:
in the method, in the process of the invention, A step threshold value for the increment; /(I)Is an increment step coefficient; /(I)Is the theoretical process gap; The average distance from the edge to the center point of the target soft mode; /(I) Is the thermal expansion coefficient of the target soft film; /(I)A thickness of the target composite; /(I)A coefficient of thermal expansion in the direction of the target composite material 2; /(I)Is the temperature difference between the glass transition temperature and room temperature of the target composite material.
4. The method of claim 2, wherein the initial thickness of the equivalent material is greater than the theoretical process gap.
5. The method of claim 2, wherein the initial thickness of the equivalent material is calculated by the formula:
in the method, in the process of the invention, Is the initial thickness of the equivalent material; /(I)For the theoretical process gap,/>Is a preset strain threshold.
6. The method of claim 1, wherein the initial modulus is less than the modulus of the target soft film.
7. The method of claim 6, wherein the initial modulus is one thousandth of the target soft film modulus.
8. The method of claim 1, wherein the initial coefficient of thermal expansion is zero.
9. A soft mold-composite mesh structure interaction analysis device, comprising:
a theoretical process gap determining unit, configured to determine a theoretical process gap required when the target composite material is generated by using the target soft film, based on a target soft film parameter and a target composite material parameter;
an equivalent material determining unit, configured to determine an equivalent material parameter based on the theoretical process gap and the target soft film parameter; the equivalent material parameters include material thickness, modulus, and coefficient of thermal expansion;
the model building unit is used for building a finite element model based on the target soft film, the equivalent material and the target composite material;
An analysis unit for analyzing, using the finite element model, interactions between the two when the target composite grid structure is generated using the target soft film; wherein the parameters of the equivalent material change with the change of strain thereof during the finite element analysis;
The analysis unit is used for executing the following operations:
Dividing the equivalent material into a plurality of subareas, and giving an initial thickness, an initial modulus and an initial thermal expansion coefficient to each subarea;
calculating the solidification process of the target composite material grid structure by using the finite element model, and continuously updating the modulus and the thermal expansion coefficient of the equivalent material in each subarea until the modulus and the thermal expansion coefficient of each subarea are updated;
and continuously calculating the curing process of the target composite material grid structure by using the updated finite element model until the target composite material is cured, so as to obtain the interaction between the target soft film and the target composite material grid structure.
10. A computing device comprising a memory and a processor, the memory having stored therein a computer program, the processor implementing the method of any of claims 1-8 when the computer program is executed.
11. A computer readable storage medium having stored thereon a computer program which, when executed in a computer, causes the computer to perform the method of any of claims 1-8.
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| CN116646037A (en) * | 2023-07-25 | 2023-08-25 | 北京理工大学 | Analysis method, device, equipment and medium for curing deformation of composite material |
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| US8288922B2 (en) * | 2006-06-30 | 2012-10-16 | The Penn State Research Foundation | Flexoelectric—piezoelectric composite based on flexoelectric charge separation |
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| CN109397724A (en) * | 2018-11-23 | 2019-03-01 | 航天特种材料及工艺技术研究所 | A kind of high temperature resistant composite and its high-temperature heat expansion forming method |
| CN116646037A (en) * | 2023-07-25 | 2023-08-25 | 北京理工大学 | Analysis method, device, equipment and medium for curing deformation of composite material |
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