CN117723473A

CN117723473A - Detection equipment for semiconductor packaging material

Info

Publication number: CN117723473A
Application number: CN202310831883.XA
Authority: CN
Inventors: 张佳; 翟丹; 蔡智勇
Original assignee: Jiangsu Hanwei Electronic Materials Co ltd
Current assignee: Jiangsu Hanwei Electronic Materials Co ltd
Priority date: 2023-07-07
Filing date: 2023-07-07
Publication date: 2024-03-19

Abstract

The invention belongs to the technical field of material detection, and particularly relates to detection equipment for semiconductor packaging materials, which comprises a detection main body, an azimuth adjusting mechanism, an oxidation resistance detection mechanism and a physical testing mechanism, wherein the oxidation resistance detection mechanism is arranged in the detection main body, the physical testing mechanism is arranged on the right side of the oxidation resistance detection mechanism, and the azimuth adjusting mechanism is arranged at the upper end of the oxidation resistance detection mechanism; the invention provides a device for detecting the semiconductor packaging material, which is simple, quick and accurate to operate, can qualitatively and quantitatively evaluate the oxidation resistance of the semiconductor packaging material by observing the color change, the weight change and the structural change of a sample through an oxidation resistance detection mechanism, and can obtain information about the oxidation degree, the quality loss and the structural change of the sample by recording and analyzing data, thereby evaluating the oxidation resistance of the material.

Description

Detection equipment for semiconductor packaging material

Technical Field

The invention belongs to the technical field of material detection, and particularly relates to detection equipment for semiconductor packaging materials.

Background

In the production and application of semiconductor packaging materials, accurate and reliable detection of quality and performance is of paramount importance. There are some devices and methods for semiconductor packaging material inspection, but there are some challenges and limitations. Conventional inspection equipment may require complex operating steps and expertise, and furthermore, conventional inspection equipment may be too expensive, limiting its wide use in a production environment.

Therefore, there is a need to provide a semiconductor encapsulating material inspection apparatus that is simple to operate, fast, and accurate.

Disclosure of Invention

Aiming at the situation, in order to overcome the defects of the prior art, the invention provides the equipment for detecting the semiconductor packaging material, which is simple, quick and accurate to operate, can qualitatively and quantitatively evaluate the oxidation resistance of the semiconductor packaging material by observing the color change, the weight change and the structural change of a sample through an oxidation resistance detection mechanism, can obtain information about the oxidation degree, the quality loss and the structural change of the sample by recording and analyzing data, and further evaluate the oxidation resistance of the material.

The technical scheme adopted by the invention is as follows: the invention provides a detection device for a semiconductor packaging material, which comprises a detection main body, an azimuth adjusting mechanism, an oxidation resistance detection mechanism and a physical testing mechanism, wherein the oxidation resistance detection mechanism is arranged in the detection main body, the physical testing mechanism is arranged on the right side of the oxidation resistance detection mechanism, and the azimuth adjusting mechanism is arranged at the upper end of the oxidation resistance detection mechanism; the oxidation resistance detection mechanism comprises a sample placement component, an oxidation environment maintaining component, an internal circulation heating component and an air pressure balancing component, wherein the sample placement component is arranged in the detection main body, the oxidation environment maintaining component is arranged on the left side of the detection main body, the internal circulation heating component is arranged in the sample placement component, and the air pressure balancing component is arranged on the sample placement component.

Further, the detection main body comprises a detection table, a detection frame, a base, a first baffle, a microscope and an electronic scale, wherein the detection table is arranged at the lower end of the detection main body, the detection frame is arranged at the upper end of the detection table, the base is arranged on the detection table, the first baffle is arranged at the upper end of the base, the microscope is arranged on the azimuth adjusting mechanism, and the electronic scale is arranged in the base.

Further, the sample placement component comprises a detection box, a cover, a frame plate, a vent hole, a sample cylinder and a supporting net, wherein the detection box is arranged on the electronic scale, the cover is detachably arranged on the detection box, the frame plate is arranged in the detection box, the vent hole is arranged on the frame plate, the sample cylinder is arranged on the frame plate, and the supporting net is arranged in the frame plate.

Further, the oxidation environment keeps subassembly to include low concentration oxygen storage jar, electronic valve one, output tube one and bellows one, the low concentration oxygen storage jar is located on the detection frame one side, the output of low concentration oxygen storage jar is located in the one end link up of output tube one, electronic valve one locates on the output tube one, the other end of output tube one is located to the one end of bellows one, the other end link up of bellows one is located on the lateral wall of detection case.

Further, the internal circulation heating assembly comprises a fan, an air inlet barrel and a heating ring, the air inlet barrel is sleeved on the frame plate, the fan is arranged at the upper end of the air inlet barrel, and the heating ring is arranged at the lower end of the air inlet barrel.

Further, the air pressure balance component comprises a collecting box, an air outlet pipe, a second baffle, a first spring, a sealing ball, an air outlet hole, a connecting hose and a first water pump, one end of the air outlet pipe is communicated with the lower end of the left side wall of the detecting box, the collecting box is arranged at the inner upper end of the detecting table, one end of the connecting hose is communicated with the other end of the air outlet pipe, the other end of the connecting hose is arranged in the collecting box, the second baffle is arranged at the upper left side of the inner wall of the air outlet pipe, the air outlet hole is arranged in the second baffle, one end of the first spring is arranged at the right end of the inner part of the air outlet pipe, the sealing ball is arranged at the other end of the first spring, the sucking end of the first water pump is communicated with the lower end of the right side wall of the collecting box, and the output end of the first water pump is communicated with the lower end of the physical testing mechanism.

Further, the physical testing mechanism comprises a durability detection component and a cavitation vibration component, wherein the durability detection component is arranged on the right side of the oxidation resistance detection mechanism, and the cavitation vibration component is arranged on the durability detection component.

Further, the durability detection assembly comprises a water tank, a water pump II, an output pipe II, a return pipe, an electronic valve II, an electronic valve III, a corrugated pipe II and a corrugated pipe III, wherein the water tank is arranged on the right side of the upper end of the detection table, the suction end of the water pump II is arranged at the lower end of the left outer side wall of the water tank, one end of the output pipe II is communicated with the output end of the water pump II, the electronic valve III is arranged on the output pipe II, one end of the corrugated pipe III is communicated with the other end of the output pipe II, the other end of the corrugated pipe III is communicated with the lower end of the right outer side wall of the detection box, one end of the return pipe is communicated with the upper end of the left side wall of the water tank, the electronic valve II is arranged on the return pipe, one end of the corrugated pipe II is arranged at the other end of the return pipe, and the other end of the corrugated pipe II is communicated with the upper end of the right outer side wall of the detection box.

Further, cavitation vibration subassembly includes supersonic generator, fixed chamber, spring two, air pump, connecting pipe and electronic valve four, the fixed chamber link up the lower extreme of locating output tube two, on the diapire in fixed chamber was located to spring two, supersonic generator locates on the spring two, on the water tank was located to the air pump, the one end of connecting pipe link up the output of locating the air pump, the other end of connecting pipe link up the left end upside of locating the back flow, electronic valve four is located on the connecting pipe.

Further, the azimuth adjustment mechanism comprises a sliding rod, a screw rod, a lifting cylinder, a motor, a first fixed block and a second fixed block, the first fixed block is arranged at the left output end of the lifting cylinder, the second fixed block is arranged at the right output end of the lifting cylinder, one end of the sliding rod is arranged on the side wall of the first fixed block, the other end of the sliding rod is arranged on the side wall of the second fixed block, the motor is arranged on the other side wall of the second fixed block, one end of the screw rod is rotationally arranged on the side wall of the first fixed block, the other end of the screw rod is arranged at the output end of the motor, the microscope is sleeved on the microscope in a sliding mode, the microscope is sleeved on the screw rod, and the microscope and the screw rod are connected in a meshed rotation mode.

The beneficial effects obtained by the invention by adopting the structure are as follows: the invention provides a detection device for semiconductor packaging materials, which has the following beneficial effects:

(1) In order to solve the problems that the conventional inspection apparatus may require complicated operation steps and expertise, and in addition, the conventional inspection apparatus may be too expensive, so that its wide application in a production environment is limited, the present invention can qualitatively and quantitatively evaluate the oxidation resistance of a semiconductor package material by observing the color change, weight change and structural change of a sample through the oxidation resistance inspection mechanism.

(2) By means of the oxidation resistance detection means, information about the oxidation degree, mass loss and structural change of the sample can be obtained by recording and analyzing the data, so that the oxidation resistance of the material is evaluated.

(3) The oxidation resistance of a large number of samples can be rapidly evaluated through an oxidation resistance detection mechanism, and a basis is provided for quality control and optimization of materials.

(4) The oxidizing environment maintaining assembly is used for ensuring the oxidizing environment, so that the sample is maintained at a set temperature and time at a high temperature, and the sample undergoes an oxidizing reaction.

(5) The air pressure balance component can keep the air pressure balance of the detection box in the oxidation resistance detection process.

(6) The arrangement of the azimuth adjusting mechanism facilitates the observation and recording of the microscope on the sample.

(7) In order to further improve practicality and generalizability, the invention provides a physical testing mechanism, and the adhesion performance of the packaging material can be evaluated by observing the adhesion of the material and water, which has important significance for ensuring the adhesion reliability of the packaging material in a wet environment.

(8) By physically testing the mechanism, the deformation of the material is observed, and its elastic properties can be deduced, which helps to understand the flexibility and resilience of the encapsulating material.

(9) The physical testing mechanism is used for evaluating the structural integrity and the cracking condition of the material under ultrasonic vibration, so that the durability of the packaging material can be primarily judged. This is of great importance for the reliability of the material in practical applications.

(10) The hydrolyzability of the material can be initially assessed by physical testing mechanisms to see if dissolution or decomposition of the material occurs upon contact with water. This is important for understanding the chemical stability and reliability of the encapsulation material in a humid environment.

Drawings

Fig. 1 is a front view of a semiconductor package material inspection apparatus according to the present invention;

FIG. 2 is a front cross-sectional view of a semiconductor package inspection apparatus according to the present invention;

FIG. 3 is a schematic view of a sample placement assembly;

FIG. 4 is a schematic diagram of a physical testing mechanism;

FIG. 5 is a schematic diagram of a gas-filled barrier mechanism;

FIG. 6 is a schematic view of an oxidizing environment holding assembly;

FIG. 7 is an enlarged partial view of portion A of FIG. 3;

fig. 8 is a partial enlarged view of a portion B in fig. 5.

Wherein 1, a detection main body, 2, an oxidation resistance detection mechanism, 3, a physical testing mechanism, 4, an azimuth adjusting mechanism, 5, a detection table, 6, a detection frame, 7, a base, 8, a baffle I, 9, a microscope, 10, an electronic scale, 11, a sample placement component, 12, an oxidation environment holding component, 13, an internal circulation heating component, 14, a gas pressure balancing component, 15, a detection box, 16, a cover, 17, a frame plate, 18, a vent hole, 19, a sample cylinder, 20, a support net, 21, a low-concentration oxygen storage tank, 22, an electronic valve I, 23, an output pipe I, 24, a corrugated pipe I, 25, a fan, 26, a wind inlet cylinder, 27 and a heating ring, 28, a collecting box, 29, an air outlet pipe, 30, a second baffle plate, 31, a first spring, 32, a sealing ball, 33, an air outlet hole, 34, a connecting hose, 35, a first water pump, 36, a durability detection component, 37, a cavitation vibration component, 38, a water tank, 39, a second water pump, 40, a second output pipe, 41, a return pipe, 42, a second electronic valve, 43, a third electronic valve, 44, a second corrugated pipe, 45, a third corrugated pipe, 46, an ultrasonic generator, 47, a fixed cavity, 48, a second spring, 49, an air pump, 50, a connecting pipe, 51, a fourth electronic valve, 52, a slide bar, 53, a lead screw, 56, a lifting cylinder, 57, a motor, 58, a first fixed block, 59 and a second fixed block.

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate orientation or positional relationships based on those shown in the drawings, merely to facilitate description of the invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

As shown in fig. 1 to 8, the present invention proposes a semiconductor packaging material detecting device, comprising a detecting body 1, an azimuth adjusting mechanism 4, an oxidation resistance detecting mechanism 2 and a physical testing mechanism 3, wherein the oxidation resistance detecting mechanism 2 is arranged in the detecting body 1, the physical testing mechanism 3 is arranged on the right side of the oxidation resistance detecting mechanism 2, and the azimuth adjusting mechanism 4 is arranged on the upper end of the oxidation resistance detecting mechanism 2; the oxidation resistance detection mechanism 2 comprises a sample placement component 11, an oxidation environment holding component 12, an internal circulation heating component 13 and a pneumatic balance component 14, wherein the sample placement component 11 is arranged in the detection main body 1, the oxidation environment holding component 12 is arranged on the left side of the detection main body 1, the internal circulation heating component 13 is arranged in the sample placement component 11, and the pneumatic balance component 14 is arranged on the sample placement component 11.

The detection main body 1 comprises a detection table 5, a detection frame 6, a base 7, a first baffle 8, a microscope 9 and an electronic scale 10, wherein the detection table 5 is arranged at the lower end of the detection main body 1, the detection frame 6 is arranged at the upper end of the detection table 5, the base 7 is arranged on the detection table 5, the first baffle 8 is arranged at the upper end of the base 7, the microscope 9 is arranged on the azimuth adjusting mechanism 4, and the electronic scale 10 is arranged in the base 7.

The physical testing mechanism 3 comprises a durability detecting component 36 and a cavitation vibration component 37, wherein the durability detecting component 36 is arranged on the right side of the oxidation resistance detecting mechanism 2, and the cavitation vibration component 37 is arranged on the durability detecting component 36.

The durability detection assembly 36 includes a water tank 38, a water pump two 39, an output pipe two 40, a return pipe 41, an electronic valve two 42, an electronic valve three 43, a corrugated pipe two 44 and a corrugated pipe three 45, the water tank 38 is arranged on the right side of the upper end of the detection table 5, the suction end of the water pump two 39 is arranged at the lower end of the left outer side wall of the water tank 38, one end of the output pipe two 40 is communicated with the output end of the water pump two 39, the electronic valve three 43 is arranged on the output pipe two 40, one end of the corrugated pipe three 45 is communicated with the other end of the output pipe two 40, the other end of the corrugated pipe three 45 is communicated with the lower end of the right outer side wall of the detection box 15, one end of the return pipe 41 is communicated with the upper end of the left side wall of the water tank 38, the electronic valve two 42 is arranged on the return pipe 41, one end of the corrugated pipe two 44 is arranged at the other end of the return pipe 41, and the other end of the corrugated pipe two 44 is communicated with the upper end of the right outer side wall of the detection box 15.

The cavitation vibration assembly 37 comprises an ultrasonic generator 46, a fixed cavity 47, a second spring 48, an air pump 49, a connecting pipe 50 and an electronic valve IV 51, wherein the fixed cavity 47 is communicated with the lower end of the output pipe II 40, the second spring 48 is arranged on the bottom wall of the fixed cavity 47, the ultrasonic generator 46 is arranged on the second spring 48, the air pump 49 is arranged on the water tank 38, one end of the connecting pipe 50 is communicated with the output end of the air pump 49, the other end of the connecting pipe 50 is communicated with the upper side of the left end of the return pipe 41, and the electronic valve IV 51 is arranged on the connecting pipe 50.

The azimuth adjusting mechanism 4 comprises a slide bar 52, a screw rod 53, a lifting cylinder 56, a motor 57, a first fixing block 58 and a second fixing block 59, wherein the first fixing block 58 is arranged at the left output end of the lifting cylinder 56, the second fixing block 59 is arranged at the right output end of the lifting cylinder 56, one end of the slide bar 52 is arranged on the side wall of the first fixing block 58, the other end of the slide bar 52 is arranged on the side wall of the second fixing block 59, the motor 57 is arranged on the other side wall of the second fixing block 59, one end of the screw rod 53 is rotatably arranged on the side wall of the first fixing block 58, the other end of the screw rod 53 is arranged at the output end of the motor 57, the microscope 9 is sleeved on the microscope 9 in a sliding manner, the microscope 9 is sleeved on the screw rod 53 in a sleeved manner, and the microscope 9 and the screw rod 53 are connected in a meshed rotation manner.

The sample placement module 11 comprises a detection box 15, a cover 16, a frame plate 17, a vent hole 18, a sample cylinder 19 and a supporting net 20, wherein the detection box 15 is arranged on the electronic scale 10, the cover 16 is detachably arranged on the detection box 15, the frame plate 17 is arranged in the detection box 15, the vent hole 18 is arranged on the frame plate 17, the sample cylinder 19 is arranged on the frame plate 17, and the supporting net 20 is arranged in the frame plate 17.

The oxidizing environment holding assembly 12 comprises a low-concentration oxygen storage tank 21, an electronic valve I22, an output pipe I23 and a corrugated pipe I24, wherein the low-concentration oxygen storage tank 21 is arranged on one side of the detection frame 6, one end of the output pipe I23 is communicated with the output end of the low-concentration oxygen storage tank 21, the electronic valve I22 is arranged on the output pipe I23, one end of the corrugated pipe I24 is arranged on the other end of the output pipe I23, and the other end of the corrugated pipe I24 is communicated with the outer side wall of the detection box 15.

The internal circulation heating assembly 13 comprises a fan 25, an air inlet cylinder 26 and a heating ring 27, the air inlet cylinder 26 is sleeved on the frame plate 17, the fan 25 is arranged at the upper end of the interior of the air inlet cylinder 26, and the heating ring 27 is arranged at the lower end of the interior of the air inlet cylinder 26.

The air pressure balance assembly 14 comprises a collecting box 28, an air outlet pipe 29, a second baffle 30, a first spring 31, a sealing ball 32, an air outlet hole 33, a connecting hose 34 and a first water pump 35, wherein one end of the air outlet pipe 29 is communicated with the lower end of the left side wall of the detecting box 15, the collecting box 28 is arranged at the inner upper end of the detecting table 5, one end of the connecting hose 34 is communicated with the other end of the air outlet pipe 29, the other end of the connecting hose 34 is arranged in the collecting box 28, the second baffle 30 is arranged at the upper left side of the inner wall of the air outlet pipe 29, the air outlet hole 33 is arranged in the second baffle 30, one end of the first spring 31 is arranged at the inner right end of the air outlet pipe 29, the sealing ball 32 is arranged at the other end of the first spring 31, the sucking end of the first water pump 35 is communicated with the lower end of the right outer side wall of the collecting box 28, and the output end of the first water pump 35 is communicated with the lower end of the physical testing mechanism 3.

When the device is specifically used, firstly, a plastic packaging material to be detected is placed on a supporting net 20, a cover 16 is packaged, a first electronic valve 22, a fourth electronic valve 51, a second electronic valve 42 and a third electronic valve 43 are closed, a fan 25 and a heating ring 27 are started, the fan 25 blows hot air flow heated by the heating ring 27 to a detection sample, the hot air flow is blown out from the upper end of a sample cylinder 19 and then enters the lower surface of a frame plate 17 from a vent hole 18, the sample is subjected to a heating test again through an air inlet cylinder 26, in the process of heating the detection sample, the first electronic valve 22 is opened, low-concentration oxygen compressed in a low-concentration oxygen storage tank 21 enters a detection box 15 through an output pipe 23, so that an oxidation environment is ensured, the sample is kept at a set temperature and time at a high temperature, oxidation reaction is caused, redundant air in the detection box 15 pushes a sealing ball 32 open, the sealing ball 32 is pushed open while the first spring 31 is stretched, the excessive gas is discharged from the connection hose 34, the cover 16 is opened at regular time, and the color change thereof is observed, the color information of the oxidized sample is recorded, the difference from the initial color is compared, the weight change of the sample is measured using the electronic scale 10, the difference of the weight of the oxidized sample from the initial weight is recorded, the structural change of the sample, particularly the surface morphology and the possible crack or deformation are observed using the microscope 9, the color change, the weight change and the structural change of the sample can be observed by the oxidation resistance detecting mechanism 2, the oxidation resistance of the semiconductor package material can be qualitatively and quantitatively evaluated, the information about the oxidation degree, the quality loss and the structural change of the sample can be obtained by recording and analyzing the data, thereby evaluating the oxidation resistance of the material, the scheme is simple to operate, the oxidation resistance of a large number of samples can be rapidly evaluated, providing basis for quality control and optimization of materials, when physical properties of a sample are detected, closing the first electronic valve 22 and the fourth electronic valve 51, starting the ultrasonic generator 46 and the second water pump 39, pumping the water in the water tank 38 into the detection box 15 through the second output pipe 40 by the second water pump 39, when water flows through the ultrasonic generator 46, the water subjected to cavitation of the ultrasonic generator 46 enters the sample cylinder 19 through the air inlet pipe 26 and finally flows back into the water tank 38 from the return pipe 41, after a period of time, closing the second electronic valve 42 and the first electronic valve 22, opening the fourth electronic valve 51, starting the air pump 49, extruding the water in the detection box 15 into the collection box 28 through the air outlet pipe 29 by using air pressure, finally flowing back into the water tank 38 through the first water pump 35, and adjusting the height of the microscope 9 by movement of the output end of the lifting cylinder 56, the output end of the motor 57 rotates to drive the screw 53 to rotate, the screw 53 rotates to drive the microscope 9 to move left and right, the cover 16 is opened, the structural change of a sample is observed by utilizing the microscope 9, the ultrasonic vibration can apply stress to the material, the elastic property of the material can be deduced by observing the deformation condition of the material, if the material has better elasticity, the material can be restored to the original shape, the durability of the material can be evaluated by ultrasonic vibration, if the material can keep the structural integrity under the ultrasonic vibration and is not easy to break, the material can be considered to have better durability, some packaging materials can react with water chemically to cause hydrolysis, the hydrolytic property of the material can be primarily evaluated by observing whether the material is dissolved or decomposed when the material contacts with the water under the ultrasonic vibration, and the whole working flow of the invention is just above, repeating the steps when the medicine is used next time.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.

Claims

1. A semiconductor package material inspection apparatus comprising an inspection main body (1) and an azimuth adjusting mechanism (4), characterized in that: the device for detecting the semiconductor packaging material further comprises an oxidation resistance detection mechanism (2) and a physical testing mechanism (3), wherein the oxidation resistance detection mechanism (2) is arranged in the detection main body (1), the physical testing mechanism (3) is arranged on the right side of the oxidation resistance detection mechanism (2), and the azimuth adjusting mechanism (4) is arranged at the upper end of the oxidation resistance detection mechanism (2); the oxidation resistance detection mechanism (2) comprises a sample placement component (11), an oxidation environment holding component (12), an internal circulation heating component (13) and a pneumatic balance component (14), wherein the sample placement component (11) is arranged in the detection main body (1), the oxidation environment holding component (12) is arranged on the left side of the detection main body (1), the internal circulation heating component (13) is arranged in the sample placement component (11), and the pneumatic balance component (14) is arranged on the sample placement component (11).

2. A testing apparatus for semiconductor packaging material according to claim 1, wherein: the detection main body (1) comprises a detection table (5), a detection frame (6), a base (7), a first baffle (8), a microscope (9) and an electronic scale (10), wherein the detection table (5) is arranged at the lower end of the detection main body (1), the detection frame (6) is arranged at the upper end of the detection table (5), the base (7) is arranged on the detection table (5), the first baffle (8) is arranged at the upper end of the base (7), the microscope (9) is arranged on the azimuth adjusting mechanism (4), and the electronic scale (10) is arranged in the base (7).

3. A testing apparatus for semiconductor packaging material according to claim 2, wherein: the sample placement component (11) comprises a detection box (15), a cover (16), a frame plate (17), a vent hole (18), a sample cylinder (19) and a support net (20), wherein the detection box (15) is arranged on the electronic scale (10), the cover (16) is detachably arranged on the detection box (15), the frame plate (17) is arranged in the detection box (15), the vent hole (18) is arranged on the frame plate (17), the sample cylinder (19) is arranged on the frame plate (17), and the support net (20) is arranged in the frame plate (17).

4. A testing apparatus for semiconductor packaging material according to claim 3, wherein: the oxidation environment maintaining assembly (12) comprises a low-concentration oxygen storage tank (21), an electronic valve I (22), an output pipe I (23) and a corrugated pipe I (24), wherein the low-concentration oxygen storage tank (21) is arranged on one side of the detection frame (6), one end of the output pipe I (23) is communicated with an output end of the low-concentration oxygen storage tank (21), the electronic valve I (22) is arranged on the output pipe I (23), one end of the corrugated pipe I (24) is arranged at the other end of the output pipe I (23), and the other end of the corrugated pipe I (24) is communicated with an outer side wall of the detection box (15).

5. A semiconductor package material inspection apparatus according to claim 4, wherein: the internal circulation heating assembly (13) comprises a fan (25), an air inlet cylinder (26) and a heating ring (27), the air inlet cylinder (26) is sleeved on the frame plate (17), the fan (25) is arranged at the upper end of the inside of the air inlet cylinder (26), and the heating ring (27) is arranged at the lower end of the inside of the air inlet cylinder (26).

6. A semiconductor package material inspection apparatus according to claim 5, wherein: the air pressure balance assembly (14) comprises a collecting box (28), an air outlet pipe (29), a second baffle (30), a first spring (31), a sealing ball (32), an air outlet hole (33), a connecting hose (34) and a first water pump (35), wherein one end of the air outlet pipe (29) is communicated with the lower end of the left side wall of the detecting box (15), the collecting box (28) is arranged at the inner upper end of the detecting table (5), one end of the connecting hose (34) is communicated with the other end of the air outlet pipe (29), the other end of the connecting hose (34) is arranged in the collecting box (28), the second baffle (30) is arranged at the left side on the inner wall of the air outlet pipe (29), the air outlet hole (33) is arranged in the second baffle (30), one end of the first spring (31) is arranged at the right end of the inner part of the air outlet pipe (29), the sealing ball (32) is arranged at the other end of the first spring (31), and the sucking end of the first water pump (35) is communicated with the lower end of the right outer side wall of the detecting box (28), and the output end of the first water pump (35) is arranged at the lower end of the testing mechanism (3).

7. A semiconductor package material inspection apparatus according to claim 6, wherein: the physical testing mechanism (3) comprises a durability detection component (36) and a cavitation vibration component (37), wherein the durability detection component (36) is arranged on the right side of the oxidation resistance detection mechanism (2), and the cavitation vibration component (37) is arranged on the durability detection component (36).

8. A semiconductor package material inspection apparatus according to claim 7, wherein: the durability detection assembly (36) comprises a water tank (38), a water pump II (39), an output pipe II (40), a return pipe (41), an electronic valve II (42), an electronic valve III (43), a corrugated pipe II (44) and a corrugated pipe III (45), wherein the water tank (38) is arranged on the right side of the upper end of the detection table (5), the suction end of the water pump II (39) is arranged at the lower end of the left outer side wall of the water tank (38), one end of the output pipe II (40) is communicated with the output end of the water pump II (39), the electronic valve III (43) is arranged on the output pipe II (40), one end of the corrugated pipe III (45) is communicated with the other end of the output pipe II (40), the other end of the corrugated pipe III (45) is communicated with the lower end of the right outer side wall of the detection box (15), one end of the return pipe (41) is communicated with the upper end of the left side wall of the water tank (38), the electronic valve II (42) is arranged on the upper end of the return pipe (41), one end of the corrugated pipe II (44) is arranged at the other end of the return pipe II is communicated with the upper side wall of the detection box (15).

9. A semiconductor package material inspection apparatus according to claim 8, wherein: cavitation vibrations subassembly (37) include supersonic generator (46), fixed chamber (47), spring two (48), air pump (49), connecting pipe (50) and electronic valve four (51), fixed chamber (47) link up the lower extreme of locating output tube two (40), spring two (48) are located on the diapire of fixed chamber (47), supersonic generator (46) are located on spring two (48), on water tank (38) are located in air pump (49), the output of air pump (49) is located in link up of one end of connecting pipe (50), the left end upside of locating back flow (41) is link up to the other end of connecting pipe (50), electronic valve four (51) are located on connecting pipe (50).

10. A testing apparatus for semiconductor packaging material according to claim 9, wherein: the azimuth adjusting mechanism (4) comprises a sliding rod (52), a screw rod (53), a lifting cylinder (56), a motor (57), a first fixed block (58) and a second fixed block (59), wherein the first fixed block (58) is arranged at the left output end of the lifting cylinder (56), the second fixed block (59) is arranged at the right output end of the lifting cylinder (56), one end of the sliding rod (52) is arranged on the side wall of the first fixed block (58), the other end of the sliding rod (52) is arranged on the side wall of the second fixed block (59), the motor (57) is arranged on the other side wall of the second fixed block (59), one end of the screw rod (53) is rotationally arranged on the side wall of the first fixed block (58), the other end of the screw rod (53) is arranged at the output end of the motor (57), the microscope (9) is sleeved on the microscope (9) in a sliding mode, the microscope (9) is sleeved on the screw rod (53), and the microscope (9) and the screw rod (53) are connected in a meshed and rotationally mode.