CN117715296A - Printed circuit board and electronic equipment - Google Patents
Printed circuit board and electronic equipment Download PDFInfo
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- CN117715296A CN117715296A CN202311753353.4A CN202311753353A CN117715296A CN 117715296 A CN117715296 A CN 117715296A CN 202311753353 A CN202311753353 A CN 202311753353A CN 117715296 A CN117715296 A CN 117715296A
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- golden finger
- circuit board
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- finger
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 50
- 229910052737 gold Inorganic materials 0.000 claims description 50
- 239000010931 gold Substances 0.000 claims description 50
- 238000002955 isolation Methods 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 21
- 238000004088 simulation Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- WABPQHHGFIMREM-AHCXROLUSA-N lead-203 Chemical compound [203Pb] WABPQHHGFIMREM-AHCXROLUSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Abstract
The application provides a printed circuit board and electronic equipment, this printed circuit board includes: a body; a golden finger set arranged along a preset edge area of the body, wherein the golden finger set comprises a plurality of golden fingers; the distance between the contact point of the golden finger and the first end of the golden finger is a first distance, the distance between the contact point and the second end of the golden finger is a second distance, the first distance is larger than the second distance, and a connecting lead is arranged at a position close to the first end of the golden finger; the contact point is a position where the golden finger contacts the connector when the body is matched with the connector, and the connecting lead is used for transmitting an electric signal.
Description
Technical Field
The present application relates to the field of electronic devices, and more particularly, to a printed circuit board and an electronic device.
Background
With the increasing complexity of system design, the modularized design in the printed circuit board is more and more, and the high-speed connectors and golden fingers are more and more connected, so that on one hand, the high-speed signals are interconnected more and more quickly, on the other hand, the design cost is lower and lower, the reliability is higher and higher, and how to use the relatively cheap and reliable connector golden fingers to support the higher signal transmission speed is a current hot problem.
In the prior art, the layout of the device in the printed circuit board is not limited, so that the high-speed wiring is closer to the golden finger, but the layout planning of the device is affected, and other structures or wirings of other high-speed signals can be sacrificed.
Disclosure of Invention
In view of this, the present application provides a printed circuit board and an electronic device, as follows:
a printed circuit board, comprising:
a body;
a golden finger set arranged along a preset edge area of the body, wherein the golden finger set comprises a plurality of golden fingers;
the distance between the contact point of the golden finger and the first end of the golden finger is a first distance, the distance between the contact point and the second end of the golden finger is a second distance, the first distance is larger than the second distance, and a connecting lead is arranged at a position close to the first end of the golden finger;
the contact point is a position where the golden finger contacts the connector when the body is matched with the connector, and the connecting lead is used for transmitting an electric signal.
Optionally, in the above printed circuit board, one end of the gold finger is close to a first edge corresponding to a preset edge area of the body, and the other end of the gold finger is far away from the first edge corresponding to the preset edge area of the body.
Optionally, in the above printed circuit board, the gold finger is disposed on the first layer of the body; the first layer is further provided with a first via hole, one end of the connecting lead is connected with the first end of the golden finger, and the other end of the connecting lead extends to the second layer of the body through the first via hole so as to be connected with the target chip.
Optionally, in the above printed circuit board, the target chip is disposed on the first layer of the body;
the first layer is further provided with a second via hole, and the other end of the connecting lead wire extends from the second layer of the body to a target chip in the first layer through the second via hole so as to be connected with the target chip.
Optionally, in the above printed circuit board, the target chip is disposed on the second layer of the body;
the other end of the connection lead extends to the target chip at the second layer of the body to be connected with the target chip.
Optionally, in the above printed circuit board, the size of the first via hole is matched with a preset connection lead width of a gold finger.
Optionally, in the above printed circuit board, the size of the first via hole is matched with a preset connection lead width of a preset number of golden fingers and a preset isolation width between the connection leads.
Optionally, in the above printed circuit board, one end of the first connecting wire is connected with a first end of the first golden finger, the first connecting wire is parallel to the first golden finger through a space between the first golden finger and the second golden finger, the other end of the first connecting wire is connected with a target chip in the printed circuit board, and the second golden finger is a golden finger arranged adjacent to the first golden finger.
Optionally, in the above printed circuit board, the first end of the gold finger is far away from the first edge corresponding to the preset edge area of the body, and the second end of the gold finger is near to the first edge corresponding to the preset edge area of the body.
An electronic device, comprising:
a printed circuit board as claimed in any one of the preceding claims.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings may be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a prior art printed circuit board structure;
fig. 2 is a schematic structural view of a printed circuit board embodiment 1 provided in the present application;
FIG. 3 is a schematic view of a printed circuit board according to embodiment 2 of the present application;
FIG. 4 is another schematic view of the structure of embodiment 2 of a printed circuit board provided in the present application;
FIG. 5 is a schematic view of a printed circuit board according to embodiment 3 of the present application;
FIG. 6 is another schematic view of the structure of embodiment 3 of a printed circuit board provided in the present application;
FIG. 7 is a schematic view of a printed circuit board according to embodiment 3 of the present application;
FIG. 8 is a schematic view of a printed circuit board according to embodiment 4 of the present application;
fig. 9 is another structural schematic diagram of a printed circuit board embodiment 4 provided in the present application;
FIG. 10 is a schematic diagram of the TDR effect of SI simulation in printed circuit board example 4 provided herein;
FIG. 11 is a schematic diagram showing the effect of the insertion loss of SI simulation in printed circuit board example 4 provided herein;
FIG. 12 is a schematic diagram showing the return loss effect of SI simulation in printed circuit board example 4 provided herein;
fig. 13 is a schematic structural view of a printed circuit board embodiment 5 provided in the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
As shown in fig. 1, the printed circuit board 101 is connected to the connector 102 by the contact 1011 of a gold finger, the distance between the contact of the gold finger and the free second end 1013 is smaller, and the distance between the contact of the gold finger and the free second end 1012 is larger. Wherein the bare copper of the gold finger is 2.5mm (millimeters), the insertion depth of the contact point of the gold finger is 3.5mm, and the length from the opening of the gold finger to the printed circuit board is 4mm, therefore, the distance between the contact point 1011 and the first end 1012 in the gold finger is 0.5mm, and the distance between the contact point and the second end 1013 is 2mm,2mm is far greater than 0.5mm, which makes the high-frequency signal of the signal transmitted through the gold finger and the connector more severely affected.
As shown in fig. 2, a schematic structural diagram of an embodiment 1 of a printed circuit board provided in the present application includes the following structures: a body 201 and a golden finger set 202;
the golden finger set comprises a plurality of golden fingers, and the golden finger set is arranged along a preset edge area of the body.
The plurality of golden fingers are sequentially arranged, and the distances between any two adjacent golden fingers are the same;
the distance between the contact point 2021 of the golden finger and the first end 2022 of the golden finger is a first distance, the distance between the contact point and the second end 2023 of the golden finger is a second distance, the first distance is greater than the second distance, and the connection lead 203 is arranged at a position close to the first end of the golden finger;
when the body is matched with the connector, the golden finger is in contact with the connector, and the connecting lead is used for transmitting electric signals.
The first end of the golden finger is connected with the connecting lead, and the printed circuit board is connected with the connector through the connecting lead, the first end of the golden finger and the contact point. Accordingly, signal transmission between the printed circuit board and the connector is also achieved by connecting the lead wires, the first end of the gold finger, to the portion between the contact points.
A stub is arranged between the contact point of the golden finger and the second end.
When the printed circuit board is actually applied and is connected with the connector through the golden finger, the stub is used as an idle section, the stub is used as an antenna structure to radiate signals transmitted through the lead outwards, the high-frequency signals are seriously reflected due to the existence of the stub, the high-frequency signals transmitted through the golden finger and the connector are influenced, and the longer the length of the stub, the larger the impedance, and the larger the influence on the high-frequency signals. In this embodiment, the distance between the contact point of the golden finger and the first end is greater than the distance between the contact point of the golden finger and the second end, so that the length of the stub is shorter, and the influence on the high-frequency signal is reduced.
In summary, the printed circuit board provided in this embodiment includes: the golden finger set comprises a body and a golden finger set arranged along a preset edge area of the body, wherein the golden finger set comprises a plurality of golden fingers; the distance between the contact point of the golden finger and the first end of the golden finger is a first distance, the distance between the contact point and the second end of the golden finger is a second distance, the first distance is larger than the second distance, and a connecting lead is arranged at a position close to the first end of the golden finger; when the contact point is a position where the golden finger is contacted with the connector when the body is matched with the connector for use, the connecting lead is used for transmitting an electric signal, and the length of a stub between the contact point and the second end in the golden finger is smaller than that between the contact point and the first end, so that the influence on a high-frequency signal is reduced relative to the existing printed circuit board design.
In embodiment 2 of the printed circuit board provided herein, the printed circuit board includes the following structure: a body and a golden finger set;
the structures of the body and the golden finger set in this embodiment are the same as those in embodiment 1, and no description is given in this application.
One end of the golden finger is close to the first edge corresponding to the preset edge area 3011 of the body, and the other end of the golden finger is far away from the first edge corresponding to the preset edge area of the body.
The golden finger is arranged in the area, close to the edge, of the body so as to realize that the printed circuit board can be spliced with the connector.
The golden finger is close to one end of the first edge of the body, and can be a first end of the golden finger or a second end of the golden finger.
A schematic structural diagram of embodiment 2 of a printed circuit board provided in the present application as shown in fig. 3 is a side view of the printed circuit board, and the printed circuit board includes the following structures: a body 301, a gold finger 302 and a connecting lead 303, the body comprising an edge region 3011, which is indicated by a dashed box in fig. 3.
The golden finger comprises a first end 3021, a contact point 3022 and a second end 3023.
The first end 3021 of the golden finger is close to a first edge 3012 corresponding to the preset edge area of the body, the first end 3021 is connected to the connection lead 303, and the second end 3023 is far away from the first edge.
The length direction of the golden finger is perpendicular to the first edge.
In the following embodiments, specific implementation details of the foregoing structures will be described, which will not be described in detail in this embodiment.
Wherein the contact point is spaced from the first end more than the second end.
Another structural schematic diagram of embodiment 2 of a printed circuit board provided herein as shown in fig. 4 is a side view of the printed circuit board, which includes the following structures: the body 401, the golden finger 402 and the connecting lead 403 are shown by a dashed box in fig. 4.
The golden finger includes a first end 4021, a contact point 4022 and a second end 4023.
The first end 4021 of the golden finger is far away from the first edge 4012 corresponding to the preset edge area of the body, the first end 4021 is connected with the connecting lead 403, and the second end 4023 of the golden finger is near to the first edge corresponding to the preset edge area of the body.
Wherein the contact point is spaced from the first end more than the second end.
In a specific implementation, in order to ensure that the distance between the contact point and the first end is greater than the distance between the contact point and the second end, a mode of reducing the length of the golden finger can be adopted to reduce the length of the area between the contact point and the second end; the gold finger can be moved to the inner side of the body at the arrangement position, so that the distance between the contact point and the first end is increased, and the distance between the contact point and the second end is reduced.
By adopting the printed circuit board in the embodiment, the distance between the contact point and the first end in the golden finger is larger than the distance between the contact point and the second end.
It should be noted that the golden finger is disposed in the edge area of the body, which can be plugged by the domain connector, and the structure of the existing connector is not required to be changed.
In summary, the printed circuit board provided in this embodiment includes: one end of the golden finger is close to the first edge corresponding to the preset edge area of the body, the other end of the golden finger is far away from the first edge corresponding to the preset edge area of the body, and the golden finger is arranged at the edge position of the body, so that the printed circuit board can be plugged with the connector through the golden finger without changing the structure of the connector matched with the printed circuit board.
A schematic structural diagram of embodiment 3 of a printed circuit board provided in the present application as shown in fig. 5 is a side view of the printed circuit board, and the printed circuit board is a multilayer structure, comprising: a body 501, a golden finger 502, a connection lead 503 and a target chip 504;
the connection manner of the golden finger and the connection lead is the same as that in embodiment 2, and a detailed description is omitted in this embodiment.
The first end 5021 of the golden finger is close to a first edge 5011 corresponding to a preset edge area of the body.
Wherein the golden finger is arranged on the first layer 5012 of the body; the first layer is further provided with a first via hole, one end of the connecting lead is connected with the first end of the golden finger, and the other end of the connecting lead extends to the second layer 5013 of the body through the first via hole to be connected with the target chip.
Wherein a lead is provided near the target chip, and the connection lead 503 is connected to the lead of the target chip.
The first end of the golden finger is close to a first edge corresponding to a preset edge of the body, the target chip is arranged on the inner side of the body, and in order to connect the connecting lead connected with the first end with the target chip in the body, the connecting lead needs to be led back to the inner side of the body.
The first layer and the second layer in the body are arranged in a layer-by-layer mode, the golden finger is arranged on the first layer of the body, and the target chip can be arranged on the second layer of the body or the first layer of the body.
Wherein, set up first via hole in this first layer, extend the other end of connecting wire into the second layer of this body through this via hole to guide back the inboard of body through the second layer.
The high-speed signal at the first end is moved to the inner layer of the body through the first via hole arranged on the first layer, so that the influence of the stub on the high-speed signal is eliminated.
The shape setting position of the golden finger in the embodiment and the like do not need to be changed, only one end of the connecting lead arranged at the inner side of the body is changed from one end close to the edge of the body in the prior art, and the connecting lead is led back to the inner side of the body through the through hole, so that the connection mode of the golden finger and the connector is not changed.
The bare copper of the golden finger is 2.5mm, the insertion depth of the contact point of the golden finger is 3.5mm, the length from the opening of the golden finger to the edge of the printed circuit board is 4mm, as shown in the structure of fig. 5, the distance between the contact point and the first end in the golden finger is 2mm, the distance between the contact point and the second end is 0.5mm, the length of the stub is obviously reduced, and the size and the shape of the golden finger are not required to be changed, and only the arrangement of the circuit on the body is required.
Another structural schematic diagram of embodiment 3 of a printed circuit board provided by the present application as shown in fig. 6, the schematic diagram being a side view of the printed circuit board, includes: body 601, golden finger 602, connecting leads 603 and target chip 604;
the first body includes a first layer 6011 and a second layer 6012, and the target chip is disposed on the first layer 6011 of the body; the first layer is provided with a first via 60111 and a second via 60112.
One end of the connecting lead 603 is connected to the first end 6021 of the gold finger, and the other end of the connecting lead extends to the second layer through the first via hole and is connected to the target chip in the first layer after passing through the second layer Kong Huidao.
According to the fact that the target chip and the golden finger are located on the first layer, after the connecting lead is extended to the second layer through the first via hole, the connecting lead is also extended back to the first layer through the second via hole, and therefore connection with the target chip is achieved.
The second via may or may not be a via specifically provided for the connection lead from the first layer to the second layer.
A further structural schematic diagram of embodiment 3 of a printed circuit board provided by the present application, as shown in fig. 7, is a side view of the printed circuit board, and includes: a body 701, a gold finger 702, a connection lead 703 and a target chip 704;
the first body includes a first layer 7011 and a second layer 7012, and the target chip is disposed on the second layer 7012 of the body, where the first layer is provided with a first via 70111.
One end of the connecting lead 703 is connected to the first end 7021 of the gold finger, and the other end of the connecting lead extends to the target chip at the second layer of the body to be connected to the target chip.
According to the fact that the target chip and the golden finger are located on different layers, after the connecting lead is extended to the second layer through the first via hole, the connecting lead is directly connected with the target chip in the second layer, and connection with the target chip is achieved.
In summary, in the printed circuit board provided in the present embodiment, the gold finger is disposed on the first layer of the body; the first layer is also provided with a first via hole, one end of the connecting lead is connected with the first end of the golden finger, the other end of the connecting lead extends to the second layer of the body through the first via hole so as to be connected with the target chip, the golden finger is arranged in the edge area of the body, the connecting lead in the edge area is led back to the inner side of the body, the first via hole is arranged on the first layer so as to extend the connecting lead to the second layer of the body through the first via hole, and the connecting lead is led back to the inner side of the body on the second layer.
In embodiment 4 of the printed circuit board provided herein, the printed circuit board includes the following structure: the device comprises a body, a golden finger set, a connecting lead and a target chip;
the structures of the body and the golden finger set in this embodiment are the same as those in embodiment 3, and no description is given in this application.
A schematic structural diagram of embodiment 4 of a printed circuit board provided in the present application as shown in fig. 8, the schematic structural diagram is a top view, and includes: body 801, golden finger 802, and lead 803.
The first end 8021 of each gold finger is close to a first edge 8011 corresponding to a preset edge area of the body, and a first via 8012 is correspondingly disposed for a connection lead of each gold finger.
The size of the first via hole is matched with the preset connecting lead width of one golden finger.
The size of the first via hole comprises the diameter and the thickness of the via hole, and the thickness of the via hole is the same as the thickness of the first layer of the body.
The diameter of the first via hole is matched with the width of one connecting lead.
In order to extend the connecting lead of the golden finger into the second layer through the first via hole, the size of the first via hole is set to match with one connecting lead, in particular the width of the connecting lead.
The width of the connecting lead is set according to practical situations, and is not limited in the application.
Another schematic structural diagram of embodiment 4 of a printed circuit board provided in the present application as shown in fig. 9, the schematic structural diagram is a top view, and includes: body 901, golden finger 902, lead 903.
The first end 9021 of the gold finger is close to a first edge 9011 corresponding to a preset edge region of the body, and a common first via hole 9012 is provided for connection leads of a plurality of gold fingers.
The size of the first via hole is matched with the preset connecting lead widths of the preset number of golden fingers and the preset isolation widths among the connecting leads.
The size of the first via hole comprises the diameter and the thickness of the via hole, and the thickness of the via hole is the same as the thickness of the first layer of the body.
The diameter of the first via hole is matched with the width of the plurality of connecting leads.
In order to extend the connecting leads of the golden finger into the second layer through the first via holes, the size of the first via holes is set to be matched with the corresponding connecting leads, particularly the widths of the connecting leads.
Furthermore, in order to prevent the transmission signals between the connection leads from affecting each other, it is also necessary to provide an isolation space between the connection leads.
Accordingly, the size of the first via hole is set based on the number of connection leads passing therethrough, the width of each connection lead, and the isolation width between connection leads.
The number of connecting lead lines through which the first via hole can pass, the width of the connecting lead lines and the isolation width can be set according to practical situations, and the first via hole is not limited in the application.
As shown in fig. 10, which is a schematic diagram of the TDR effect of SI (Signal Integrity) simulation, two curves are respectively printed circuit board corresponding curves 1001 in this embodiment, and the TDR (Time Domain Reflectometry, time domain reflection) deviation is optimized from 27 ohms to 23.4 ohms in the prior art using the printed circuit board corresponding simulation curve 1002 in the prior art.
The vertical axis of fig. 10 shows the impedance value, and the horizontal axis shows the transmission time (or each position on the printed circuit board from the starting point), and the time for the TDR curve to reach smoothing in this scheme is shorter.
As shown in fig. 11, which is a schematic diagram of the insertion loss effect of SI simulation, two curves are printed circuit board corresponding curves 1101 in the present embodiment, and a printed circuit board corresponding simulation curve 1102 in the prior art is adopted.
The vertical axis of fig. 11 shows the attenuation (in dB), and the horizontal axis shows the frequency, and specifically, the insertion loss of the transmission signal is detected for two points, and the loss transmitted from the point a to the point B is less in this embodiment as can be seen from fig. 11.
Fig. 12 is a schematic diagram showing the return loss effect of SI simulation, in which two curves are printed circuit board corresponding curves 1201 in the present embodiment, and printed circuit board corresponding simulation curves 1202 in the prior art are adopted.
The vertical axis of fig. 12 shows loss (in dB), the horizontal axis shows frequency, and specifically, insertion loss detection of a transmission signal is performed for two points, and loss is reduced in this embodiment as a result of the fact that the transmission signal is transmitted from point a to point B and the point B is retransmitted back to point a.
In summary, according to the printed circuit board provided in this embodiment, the first via hole in the first layer of the body can be matched with the width of the one connecting lead through one or more connecting leads, correspondingly, the size of the first via hole is matched with the width of the plurality of connecting leads and the preset isolation width between the connecting leads, so that the connecting leads in the first layer are ensured to extend into the second layer, and the quality of the signal transmission of the connecting leads is ensured.
A schematic structural diagram of embodiment 5 of a printed circuit board provided in the present application as shown in fig. 13, the schematic structural diagram being a top view, the printed circuit board comprising: body 1301, gold finger set 1302, connection leads 1303 and target chip 1304;
the structures of the body and the golden finger set in this embodiment are the same as those in embodiment 1, and no description is given in this application.
One end of the first connecting wire 1303 is connected to a first end of the first gold finger 13021, the first connecting wire is disposed parallel to the first gold finger through a space between the first gold finger and the second gold finger, the other end of the first connecting wire is connected to a target chip in the printed circuit board, and the second gold finger is a gold finger disposed adjacent to the first gold finger.
The first end of the first golden finger corresponds to the first connecting lead, and the first connecting lead is led back to the inner side of the body through a space between the first golden finger and the second golden finger.
The space width between the first golden finger and the second golden finger is larger than the first connecting lead, and the distance between the first connecting lead and the first golden finger as well as the distance between the first connecting lead and the second golden finger are not smaller than the preset isolation width, so that the electric signals transmitted by the first connecting lead are not influenced by the electric signals transmitted by the first golden finger and the second golden finger.
If the body is of a multi-layer structure, the lead and the golden fingers are arranged on the same layer, the first connecting lead is led back to the inner side of the body through the space between the two golden fingers, and other part structures in the body do not need to be changed.
In a specific implementation, the structure of the printed circuit board in this embodiment may be implemented by reducing the width of the connecting lead, or by increasing the width of the gap between two golden fingers.
In summary, in the printed circuit board provided in this embodiment, one end of the first connection lead is connected to the first end of the first gold finger, the first connection lead is disposed parallel to the first gold finger through the space between the first gold finger and the second gold finger, the other end of the first connection lead is connected to the target chip in the printed circuit board, the second gold finger is a gold finger disposed adjacent to the first gold finger, and the first connection lead connected to the first gold finger extends from the edge of the body back to the inner side of the body through the space between the first gold finger and the adjacent second gold finger, so as to achieve the purpose of guiding the connection lead back to the inner side of the body to connect with the target chip in the body.
Corresponding to one printed circuit board embodiment provided in the application described above, the application also provides an electronic device embodiment comprising a printed circuit board.
Wherein, this electronic equipment includes: the structure of the printed circuit board of any of the embodiments described above.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. The device provided in the embodiment corresponds to the method provided in the embodiment, so that the description is simpler, and the relevant points refer to the description of the method.
The previous description of the provided embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features provided herein.
Claims (10)
1. A printed circuit board, comprising:
a body;
a golden finger set arranged along a preset edge area of the body, wherein the golden finger set comprises a plurality of golden fingers;
the distance between the contact point of the golden finger and the first end of the golden finger is a first distance, the distance between the contact point and the second end of the golden finger is a second distance, the first distance is larger than the second distance, and a connecting lead is arranged at a position close to the first end of the golden finger;
the contact point is a position where the golden finger contacts the connector when the body is matched with the connector, and the connecting lead is used for transmitting an electric signal.
2. The printed circuit board of claim 1, wherein one end of the gold finger is close to a first edge corresponding to a preset edge region of the body, and the other end of the gold finger is far away from the first edge corresponding to the preset edge region of the body.
3. The printed circuit board of claim 2, the gold finger disposed on the first layer of the body; the first layer is further provided with a first via hole, one end of the connecting lead is connected with the first end of the golden finger, and the other end of the connecting lead extends to the second layer of the body through the first via hole so as to be connected with the target chip.
4. The printed circuit board of claim 3, the target chip disposed on a first layer of the body;
the first layer is further provided with a second via hole, and the other end of the connecting lead wire extends from the second layer of the body to a target chip in the first layer through the second via hole so as to be connected with the target chip.
5. The printed circuit board of claim 3, the target chip disposed on a second layer of the body;
the other end of the connection lead extends to the target chip at the second layer of the body to be connected with the target chip.
6. The printed circuit board of claim 3, wherein the first via hole has a size matching a predetermined connection lead width of one gold finger.
7. The printed circuit board of claim 3, wherein the first via hole has a size matching a predetermined connection lead width of a predetermined number of gold fingers and a predetermined isolation width between connection leads.
8. The printed circuit board of claim 2, wherein one end of the first connecting wire is connected with a first end of a first golden finger, the first connecting wire is arranged in parallel with the first golden finger through a space between the first golden finger and a second golden finger, the other end of the first connecting wire is connected with a target chip in the printed circuit board, and the second golden finger is a golden finger arranged adjacent to the first golden finger.
9. The printed circuit board of claim 2, wherein the first end of the gold finger is away from the first edge corresponding to the predetermined edge region of the body, and the second end of the gold finger is near the first edge corresponding to the predetermined edge region of the body.
10. An electronic device, comprising:
the printed circuit board of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311753353.4A CN117715296A (en) | 2023-12-19 | 2023-12-19 | Printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311753353.4A CN117715296A (en) | 2023-12-19 | 2023-12-19 | Printed circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117715296A true CN117715296A (en) | 2024-03-15 |
Family
ID=90160397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311753353.4A Pending CN117715296A (en) | 2023-12-19 | 2023-12-19 | Printed circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117715296A (en) |
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2023
- 2023-12-19 CN CN202311753353.4A patent/CN117715296A/en active Pending
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