CN117711802A

CN117711802A - Preparation method of transformer, transformer chip and semiconductor device

Info

Publication number: CN117711802A
Application number: CN202311436788.6A
Authority: CN
Inventors: 张伟伟; 徐洪光; 王超群
Original assignee: Shanghai Boxincheng Microelectronics Technology Co ltd
Current assignee: Shanghai Boxincheng Microelectronics Technology Co ltd
Priority date: 2023-10-31
Filing date: 2023-10-31
Publication date: 2024-03-15

Abstract

The invention discloses a preparation method of a transformer, the transformer, a transformer chip and a semiconductor device, wherein the preparation method comprises the following steps: providing a primary coil substrate and a secondary coil substrate; the primary coil substrate comprises a first substrate with a first surface and primary coil lines arranged on the first surface, and the projection of the primary coil lines on the first surface encloses a first area; the secondary coil substrate comprises a second substrate with a second surface and a secondary coil circuit arranged on the second surface, and the projection of the secondary coil circuit on the second surface encloses a second area; laminating the primary coil substrate and the secondary coil substrate; the projection of the primary coil wire on the first surface overlaps the projection of the secondary coil wire on the second surface, and the first area is larger or smaller than the second area. The technical scheme provided by the invention reduces the volume of the transformer and improves the production efficiency of the transformer.

Description

Preparation method of transformer, transformer chip and semiconductor device

Technical Field

The embodiment of the invention relates to the technical field of transformers, in particular to a preparation method of a transformer, the transformer, a transformer chip and a semiconductor device.

Background

The transformer is a device for changing output voltage by utilizing the principle of electromagnetic induction, and is a device commonly used in a circuit. The existing transformer mainly comprises a framework, a magnetic core and a coil, is large in size, is unfavorable for the development trend of miniaturization of devices, is complex in preparation process, and affects the production efficiency of the transformer.

Disclosure of Invention

The embodiment of the invention provides a preparation method of a transformer, the transformer, a transformer chip and a semiconductor device, which are used for reducing the volume of the transformer and improving the production efficiency of the transformer.

In a first aspect, an embodiment of the present invention provides a method for manufacturing a transformer, including:

providing a primary coil substrate and a secondary coil substrate, wherein the primary coil substrate comprises a first substrate with a first surface and primary coil lines arranged on the first surface, the projection of the primary coil lines on the first surface surrounds a first area, the secondary coil substrate comprises a second substrate with a second surface and secondary coil lines arranged on the second surface, the projection of the secondary coil lines on the second surface surrounds a second area, and the second surface is parallel to the first surface;

Bonding the primary coil substrate and the secondary coil substrate to laminate the primary coil substrate and the secondary coil substrate; the projection of the primary coil wire on the first surface overlaps the projection of the secondary coil wire on the second surface, and the first area is larger or smaller than the second area.

Optionally, the step of providing a primary coil substrate and a secondary coil substrate includes:

providing a carrier plate; forming a metal layer on the surface of the carrier plate, and patterning the metal layer to form a plurality of primary coil circuits and a plurality of secondary coil circuits; cutting the carrier plate to form a plurality of primary coil substrates and a plurality of secondary coil substrates.

Optionally, after providing a carrier, the method further includes: forming an opening in the carrier plate, wherein the cut primary coil substrate and the cut secondary coil substrate are provided with the opening;

the step of forming a metal layer on the surface of the carrier plate further comprises the step of forming a magnetic core layer on the surface of the carrier plate, wherein the magnetic core layer fills the opening;

the step of bonding the primary coil substrate and the secondary coil substrate includes: and aligning the openings in the primary coil substrate and the secondary coil substrate, wherein the two openings form through holes of the transformer.

Optionally, the primary coil circuit includes a first primary winding group and a second primary winding group that are connected and arranged side by side, and the primary coil circuit is configured to pass a first current, where the first current is configured to pass through the first primary winding group and the second primary winding group in sequence; the secondary coil comprises a first secondary winding group and a second secondary winding group which are connected and arranged side by side, the secondary coil circuit is used for inducing a second current, the second current is used for sequentially passing through the first secondary winding group and the second secondary winding group, the first primary winding group is surrounded by a first inner ring, the second primary winding group is surrounded by a second inner ring, and the first inner ring and the second inner ring are respectively provided with the open holes;

the step of forming a magnetic core layer on the surface of the carrier plate further comprises:

patterning the magnetic core layers formed on the primary coil substrate and the secondary coil substrate to form a magnetic core pattern, wherein the magnetic core pattern is positioned between the two openings; the magnetic core layer filled in the opening is used for forming a magnetic core connecting column; the magnetic core connecting column is connected with the magnetic core patterns of the first substrate and the second substrate, the open holes in the first inner ring are directed to the open holes in the second inner ring, and the magnetic core patterns and the magnetic core connecting column form a closed magnetic core structure.

In a second aspect, an embodiment of the present invention provides a transformer, including:

a primary coil substrate including a first substrate having a first surface and primary coil lines disposed on the first surface, a projection of the primary coil lines on the first surface enclosing a first area;

a secondary coil substrate laminated with the primary coil substrate, the secondary coil substrate including a second substrate having a second surface and a secondary coil wiring provided on the second surface, a projection of the secondary coil wiring on the second surface enclosing a second area, the second surface being parallel to the first surface; wherein a projection of the primary coil wire on the first surface overlaps a projection of the secondary coil wire on the second surface, and the first area is larger or smaller than the second area.

Optionally, the transformer further includes: a through hole penetrating the primary coil substrate and the secondary coil substrate; and the magnetic core is at least partially filled in the through hole, wherein the through hole is positioned in the primary coil line or outside the primary coil line.

Optionally, the first substrate further includes a third surface opposite to the first surface, where the first surface is a surface of the first substrate close to the second substrate, the third surface is a surface of the first substrate far away from the second substrate, or the first surface is a surface of the first substrate far away from the second substrate, and the third surface is a surface of the first substrate close to the second substrate;

the second substrate further comprises a fourth surface opposite to the second surface, the second surface is a surface of the second substrate close to the first substrate, the fourth surface is a surface of the second substrate far away from the first substrate, or the second surface is a surface of the second substrate far away from the first substrate, and the fourth surface is a surface of the second substrate close to the first substrate.

Optionally, the primary coil circuit includes a first primary winding group and a second primary winding group connected and arranged side by side, and the primary coil circuit is used for passing a first current, wherein the first current is used for passing through the first primary winding group and the second primary winding group in sequence, and the direction of the first current passing through the first primary winding group is opposite to the direction of the first current passing through the second primary winding group;

The secondary coil comprises a first secondary winding group and a second secondary winding group which are connected and arranged side by side, the secondary coil circuit is used for inducing second current, the second current is used for sequentially passing through the first secondary winding group and the second secondary winding group, and the direction of the second current passing through the first secondary winding group is opposite to the direction of the second current passing through the second secondary winding group.

Optionally, the first primary winding group encloses and has first inner circle, the second primary winding group encloses and has the second inner circle, be equipped with respectively in first inner circle and the second inner circle the through-hole, the magnetic core includes:

the magnetic core pattern is positioned on the surface of the first substrate far away from the second substrate and the surface of the second substrate far away from the first substrate, and the magnetic core pattern is positioned between the two through holes;

the magnetic core connecting column is positioned in the through hole, the magnetic core connecting column is connected with the magnetic core graph positioned on the surface of the first substrate far away from the second substrate and the surface of the second substrate far away from the first substrate, the through hole in the first inner ring points to the direction of the through hole in the second inner ring, and the magnetic core graph and the magnetic core connecting column form a closed magnetic core structure.

Optionally, the first primary winding group is provided with a first terminal, the second primary winding group is provided with a second terminal, and the first terminal and the second terminal are oppositely arranged and are respectively used for being connected with an external circuit; the second secondary winding group is provided with a third terminal, the second secondary winding group is provided with a fourth terminal, and the third terminal and the fourth terminal are oppositely arranged and are respectively used for being connected with an external circuit; the first terminal, the second terminal, the third terminal and the fourth terminal are respectively positioned on two opposite sides of the first substrate and the second substrate which are arranged in the lamination way along the direction that the first primary winding group points to the second primary winding group.

Optionally, the first terminal is disposed on the first inner ring, the second terminal is disposed on the second inner ring, and the first terminal and the second terminal are disposed opposite to each other along a direction in which the first primary winding group points to the second primary winding group.

Optionally, the first substrate comprises any one of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate and a polyimide film or a composite substrate; the second substrate comprises any one of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate and a polyimide film or a composite substrate.

Optionally, the thickness of the first substrate and the second substrate ranges from 10 micrometers to 10 millimeters, respectively.

Optionally, the spacing between adjacent coils ranges from 5 microns to 1000 microns; and/or the line width of the coil ranges from 5 microns to 1000 microns.

Optionally, the transformer further includes: and a bonding layer between the first substrate and the second substrate for bonding the first substrate and the second substrate.

In a third aspect, an embodiment of the present invention provides a transformer, including:

a primary coil substrate including a first substrate having a first surface and a primary coil wire disposed on the first surface, the primary coil wire having a first number of turns;

a secondary coil substrate disposed in a stacked relation with the primary coil substrate, the secondary coil substrate including a second substrate having a second surface and a secondary coil wire disposed on the second surface, the secondary coil wire having a second number of turns, the second surface being parallel to the first surface; wherein,

the projection of the primary coil wire on the first surface overlaps the projection of the secondary coil wire on the second surface, and the first number of turns is greater than or less than the second number of turns.

In a fourth aspect, an embodiment of the present invention provides a transformer chip, including a transformer according to any one of the embodiments of the present invention.

In a fifth aspect, an embodiment of the present invention provides a semiconductor device including the transformer chip according to any one of the embodiments of the present invention.

According to the technical scheme provided by the embodiment of the invention, the primary coil circuit and the secondary coil circuit are prepared on the substrate, so that the transformer can be prepared and formed in batches by adopting the cutting process of the substrate, the preparation efficiency is high, the process difficulty is low, and the yield of finished products is high; in addition, the primary coil substrate and the secondary coil substrate are combined to form a laminated arrangement of the primary coil substrate and the secondary coil substrate, so that the primary winding group and the secondary winding group are laminated, the mode that a coil winding group is manufactured by adopting a coil in the traditional method is avoided, the volume of the transformer is effectively reduced, and the volume of an electronic device applying the transformer is reduced.

Furthermore, the magnetic core is added in the transformer, so that the magnetic conduction efficiency between the primary coil circuit and the secondary coil circuit can be improved, and the electromagnetic transmission performance of the transformer is further improved.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a flowchart of a method for manufacturing a transformer according to an embodiment of the present invention;

fig. 2 is a top view of a plurality of primary coil lines and a plurality of secondary coil lines formed after patterning a metal layer on a surface of a carrier according to an embodiment of the present invention;

fig. 3 is a top view of a first substrate in a transformer according to an embodiment of the present invention;

Fig. 4 is a top view of a second substrate in a transformer according to an embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of the structure of FIG. 3 taken along section line A-A 1;

FIG. 6 is a schematic cross-sectional view of another transformer according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of another transformer according to an embodiment of the present invention;

FIG. 8 is a top view of the first substrate in the structure of FIG. 7;

FIG. 9 is a top view of a second substrate in the structure of FIG. 7;

FIG. 10 is a schematic cross-sectional view of the structure of FIG. 8 taken along section line B-B1;

fig. 11 is a schematic flow diagram of a first current in a first primary winding set and a second primary winding set according to an embodiment of the present invention;

FIG. 12 is a schematic cross-sectional view of another transformer according to an embodiment of the present invention;

FIG. 13 is a schematic cross-sectional view of another transformer according to an embodiment of the present invention;

FIG. 14 is a schematic cross-sectional view of another transformer according to an embodiment of the present invention;

fig. 15 is a top view of a first substrate in another transformer according to an embodiment of the present invention;

fig. 16 is a top view of a second substrate in another transformer according to an embodiment of the present invention;

fig. 17 is a schematic cross-sectional view of the structure of fig. 15 along section line C-C1.

Detailed Description

In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential, e.g., chronological or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

An embodiment of the present invention provides a method for manufacturing a transformer, and fig. 1 is a flowchart of the method for manufacturing a transformer provided in the embodiment of the present invention, and referring to fig. 1, the method for manufacturing a transformer includes:

s110, providing a primary coil substrate and a secondary coil substrate, wherein the primary coil substrate comprises a first substrate with a first surface and primary coil circuits arranged on the first surface, the projection of the primary coil circuits on the first surface surrounds the first area, the secondary coil substrate comprises a second substrate with a second surface and secondary coil circuits arranged on the second surface, the projection of the secondary coil circuits on the second surface surrounds the second area, and the second surface is parallel to the first surface.

S120, combining the primary coil substrate and the secondary coil substrate so as to enable the primary coil substrate and the secondary coil substrate to be arranged in a lamination way; the projection of the primary coil wire on the first surface overlaps the projection of the secondary coil wire on the second surface, and the first area is larger or smaller than the second area.

In particular, the most basic form of transformer comprises two sets of coils wound with wires and inductively coupled to each other. When an alternating current (with a known frequency) flows through one of the coils, an alternating voltage with the same frequency is induced in the other coil, and the magnitude of the induced voltage depends on the degree of coupling and magnetic cross-linking of the two coils. The coil line connected with the alternating current power supply is a primary coil line, and the coil line inducing the alternating current voltage with the same frequency is a secondary coil line. According to the technical scheme provided by the embodiment of the invention, the primary coil substrate and the secondary coil substrate are formed on the substrate by preparing the primary coil circuit and the secondary coil circuit, so that the transformers can be prepared in batches by adopting the cutting process of the substrate, the preparation efficiency is high, the process difficulty is low, and the yield of finished products is high; in addition, the primary coil substrate and the secondary coil substrate are combined to form a laminated arrangement of the primary coil substrate and the secondary coil substrate, so that the primary winding group and the secondary winding group are laminated, the mode that a coil winding group is manufactured by adopting a coil in the traditional method is avoided, the volume of the transformer is effectively reduced, and the volume of an electronic device applying the transformer is reduced more conveniently.

Optionally, the step of providing a primary coil substrate and a secondary coil substrate in step S110 further includes:

s101, providing a carrier plate.

S102, forming a metal layer on the surface of the carrier plate, and patterning the metal layer to form a plurality of primary coil circuits and a plurality of secondary coil circuits.

S103, cutting the carrier plate to form a plurality of primary coil substrates and a plurality of secondary coil substrates.

Specifically, the carrier plate may be a single-layer substrate of any one of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate, and a polyimide film; the carrier may be a composite substrate having a plurality of laminated layers, and may include at least two of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate, and a polyimide film. Forming a metal layer on the surface of the carrier plate, and patterning the metal layer in an etching mode to form a plurality of primary coil circuits and a plurality of secondary coil circuits.

Fig. 2 is a top view of a plurality of primary coil lines and a plurality of secondary coil lines formed after patterning a metal layer on a surface of a carrier plate according to an embodiment of the present invention, and referring to fig. 2, a plurality of primary coil lines 101 and a plurality of secondary coil lines 102 may be arranged in an array so as to facilitate cutting of the carrier plate 1 and form a regular-pattern primary coil substrate and a regular-pattern secondary coil substrate. Since the first area enclosed by the primary coil wire 101 is not equal to the second area enclosed by the secondary coil wire 102, the same coil wire can be formed in the same row or column, thereby facilitating patterning of the metal layer. For example, referring to fig. 2, a plurality of rows of primary coil lines 101 and a plurality of rows of primary coil lines 101 are formed, the rows in which the primary coil lines 101 are arranged and the rows in which the secondary coil lines 102 are arranged in order along the column direction. The primary coil circuit 101 and the secondary coil circuit 102 on the carrier are manufactured in the same process, and then cut to obtain the primary coil substrate and the secondary coil substrate in the present application. It is possible to further improve the manufacturing efficiency of the primary coil substrate and the secondary coil substrate, and to improve the uniformity of the primary coil wiring 101 and the secondary coil wiring 102. The number of winding groups included in each of the primary coil line 101 and the secondary coil line 102 may be one or a plurality of. The example in fig. 2 shows that two winding groups are included in each of the primary coil wire 101 and the secondary coil wire 102.

Optionally, after the step of providing a carrier, the method further includes: openings are formed in the carrier plate, and openings are formed in the cut primary coil substrate and the cut secondary coil substrate. Specifically, the step of forming the openings in the carrier plate may be performed before or after cutting the carrier plate. The step of forming the metal layer on the surface of the carrier plate further comprises forming a magnetic core layer on the surface of the carrier plate, wherein the magnetic core layer is filled with the open holes.

In step S120, the step of bonding the primary coil substrate and the secondary coil substrate specifically includes: and aligning the openings in the primary coil substrate and the secondary coil substrate, wherein the two openings form through holes of the transformer.

In particular, the material of the magnetic core layer may comprise manganese zinc ferrite. The magnetic core layer is used for preparing the magnetic core, and the through hole is filled to the magnetic core layer, so that at least partial magnetic core is filled in the through hole. The magnetic core has high magnetic permeability, and based on the high magnetic permeability of the magnetic core, the primary coil circuit of the transformer can generate larger magnetic induction intensity (also called magnetic flux density or magnetic line density) with smaller exciting current, and most magnetic lines of force are restrained in the magnetic core, so that the two groups of coils can obtain higher degree of magnetic coupling, and magnetic energy can be effectively transferred to the secondary coil circuit.

On the basis of the above embodiment, optionally, the primary coil circuit includes a first primary winding group and a second primary winding group connected and arranged side by side, and the primary coil circuit is configured to pass a first current, where the first current is configured to pass through the first primary winding group and the second primary winding group in sequence; the secondary coil comprises a first secondary winding group and a second secondary winding group which are connected and arranged side by side, the secondary coil circuit is used for inducing second current, the second current is used for sequentially passing through the first secondary winding group and the second secondary winding group, the first primary winding group is surrounded by a first inner ring, the second primary winding group is surrounded by a second inner ring, and openings are respectively arranged in the first inner ring and the second inner ring. The step of forming the magnetic core layer on the surface of the carrier plate further comprises:

patterning the magnetic core layers formed on the primary coil substrate and the secondary coil substrate to form a magnetic core pattern, wherein the magnetic core pattern is positioned between the two openings; the magnetic core layer filled in the open hole is used for forming a magnetic core connecting column; the magnetic core connecting column is connected with the magnetic core patterns positioned on the first substrate and the second substrate, the magnetic core patterns and the magnetic core connecting column form a closed magnetic core structure along the direction that the opening in the first inner ring points to the opening in the second inner ring.

The core pattern in the transformer of the present embodiment may be formed simultaneously with, before, or after the primary winding wire and the secondary winding wire are formed, or may be formed after the first substrate and the second substrate are stacked. The formation of the magnetic core structure is not limited in order.

An embodiment of the present invention further provides a transformer, which is formed by the method for manufacturing a transformer according to any of the embodiments of the present invention, where fig. 3 is a top view of a first substrate in the transformer provided by the embodiment of the present invention, fig. 4 is a top view of a second substrate in the transformer provided by the embodiment of the present invention, and fig. 5 is a schematic cross-sectional view of a structure shown in fig. 3 along a section line AA1, and referring to fig. 3 to fig. 5, the transformer includes:

a primary coil substrate including a first substrate 11 having a first surface 01 and a primary coil wire 20 disposed on the first surface 01, a projection of the primary coil wire 20 on the first surface 01 enclosing a first area;

a secondary coil substrate laminated with the primary coil substrate, the secondary coil substrate including a second substrate 12 having a second surface 02 and a secondary coil wire 30 disposed on the second surface 02, a projection of the secondary coil wire 30 on the second surface 02 enclosing a second area, the second surface 02 being parallel to the first surface 01; wherein the projection of the primary coil wire 20 on the first surface 01 overlaps the projection of the secondary coil wire 30 on the second surface 02, and the first area is larger or smaller than the second area.

It should be noted that, since the primary coil line 20 is in a coil shape, the projection on the first surface 11 is also in a coil shape, and the first area may be defined as an area surrounded by a coil at the outermost periphery of the primary coil line 20, including a blank area between two adjacent coils in the primary coil line 20. Similarly, the second area in the secondary winding line 30 may be defined as an area surrounded by the outermost one of the secondary winding lines 30, including a blank area between two adjacent windings in the secondary winding line 30. The first area and the second area can be determined based on the width and length of each of the primary coil wire 20 and the secondary coil wire 30, the degree of the density of the coils, the number of turns, and the like.

Specifically, the materials of the first substrate 11 and the second substrate 12 are respectively insulating materials, that is, the first substrate 11 and the second substrate 12 are respectively insulating substrates, so that the short circuit between the coils in the primary coil line 20 and the short circuit between the coils in the secondary coil line 30 are prevented. The material of the first substrate 11 may be the same as or different from the material of the second substrate 12. The first substrate 11 may be a single-layer substrate of any one of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate, and a polyimide film; the first substrate 11 may be a composite substrate having a plurality of laminated layers, and may include at least two of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate, and a polyimide film. The second substrate 12 may be a single-layer substrate of any one of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate, and a polyimide film; the second substrate 12 may be a composite substrate having a plurality of laminated layers, and may include at least two of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate, and a polyimide film. The primary coil circuit 20 is arranged on the surface of the first substrate 11, and the secondary coil circuit 30 is arranged on the surface of the second substrate 12, so that the primary coil substrate and the secondary coil substrate can be manufactured in batches by adopting a cutting process of the substrates, and the transformer is manufactured in batches, and the transformer has the characteristics of high manufacturing efficiency, low process difficulty and high yield. When the material of the first substrate 11 is the same as that of the second substrate 12, the primary coil wire 20 and the secondary coil wire 30 may be simultaneously prepared on the same substrate, and then cut to obtain the primary coil substrate and the secondary coil substrate. The manufacturing efficiency of the primary coil substrate and the secondary coil substrate can be further improved.

The secondary coil substrate and the primary coil substrate are arranged in a stacked mode, so that the primary winding group and the secondary winding group are arranged in a stacked mode, the mode that coils are made of coils in the traditional method is avoided, the size of the transformer is effectively reduced, and the size of an electronic device applying the transformer is effectively reduced and is more convenient. The projection of the primary coil circuit 20 on the first surface 01 encloses a first area, the projection of the secondary coil circuit 30 on the second surface 02 encloses a second area, the projection of the primary coil circuit 20 on the first surface 01 and the projection of the secondary coil circuit 30 on the second surface 02 overlap, and the larger the overlapping area is, the higher the power transmission efficiency of the transformer is, which is more beneficial to the output of voltage. When the first area is larger than the second area, the transformer plays a role in reducing voltage, and when the first area is smaller than the second area, the transformer plays a role in increasing voltage. In addition, the primary coil line and the secondary coil line are respectively carried by two substrates, and the output voltage of the transformer can be adjusted by adjusting the distance between the first substrate 11 and the second substrate 12.

With reference to fig. 3 to 5, the transformer further includes: a through hole penetrating the primary coil substrate and the secondary coil substrate; and a magnetic core 40, at least a portion of the magnetic core 40 being filled in the through hole, wherein the through hole is located inside the primary coil line 20 or outside the primary coil line 20.

Specifically, the transformer further includes a through hole penetrating the primary and secondary coil substrates and a magnetic core 40 at least partially filled in the through hole. The material of the magnetic core 40 may include manganese zinc ferrite. The magnetic core 40 has high magnetic permeability, so that the primary coil line 20 of the transformer can generate larger magnetic induction intensity (also called magnetic flux density or magnetic line density) with smaller exciting current based on the high magnetic permeability of the magnetic core 40, and most magnetic lines of force are restrained in the magnetic core 40, therefore, the two groups of coils can obtain higher degree of magnetic coupling, so that magnetic energy can be effectively transferred to the secondary coil line 30.

In another embodiment of the present invention, fig. 6 is a schematic cross-sectional view of another transformer according to an embodiment of the present invention, and referring to fig. 6, a through hole is located outside the primary coil line 20. That is, the through-hole may be located inside the primary coil wire 20 or outside the primary coil wire 20, i.e., at least part of the magnetic core 40 may be located inside the primary coil wire 20 or outside the primary coil wire 20, as long as it is ensured that at least part of the magnetic core 40 is located at the position of the magnetic force lines.

Based on the above embodiments, in one embodiment of the present invention, fig. 7 is a schematic structural view of another transformer provided in the embodiment of the present invention, fig. 8 is a top view of a first substrate in the structure shown in fig. 7, fig. 9 is a top view of a second substrate in the structure shown in fig. 7, fig. 10 is a schematic sectional view of the structure shown in fig. 8 along a section line B-B1, and referring to fig. 7 to 10, a primary coil line 20 includes a first primary winding group 21 and a second primary winding group 22 connected and arranged side by side, the primary coil line 20 is used for passing a first current, the first current is used for passing through the first primary winding group 21 and the second primary winding group 22 in sequence, and a direction of the first current passing through the first primary winding group 21 is opposite to a direction of the first current passing through the second primary winding group 22; the secondary coil includes a first secondary winding group 31 and a second secondary winding group 32 connected and arranged side by side, and the secondary coil line 30 is used for inducing a second current, wherein the second current is used for sequentially passing through the first secondary winding group 31 and the second secondary winding group 32, and the direction of the second current passing through the first secondary winding group 31 is opposite to the direction of the second current passing through the second secondary winding group 32.

Specifically, referring to fig. 8, the primary coil line 20 includes a first primary winding group 21 including one or more turns of primary coils and a second primary winding group 22 including one or more turns of primary coils connected in series, the first primary winding group 21 including one or more turns of primary coils; the number of coil turns included in the first primary winding group 21 may or may not be the same as the number of coil turns included in the second primary winding group 22. The exemplary drawing in fig. 8 shows that the number of coil turns included in the first primary winding group 21 is the same as the number of coil turns included in the second primary winding group 22. The first and second primary winding groups 21 and 22 may be formed around a first wire, and the transformer further includes first and second terminals a and b, which are opposite ends of the first wire, respectively. The first current is input from the first terminal a and flows along the first wire to the second terminal b, or the first current is input from the second terminal b and flows along the first wire to the first terminal a, so that the first current is used to sequentially pass through the first primary winding set 21 and the second primary winding set 22.

In the present embodiment, the first primary winding set 21 and the second primary winding set 22 are wound in such a way that the first wire is wound around the first terminal a from the counterclockwise direction to form the first primary winding set 21, and after the first wire is wound around the predetermined number of turns, the first wire is wound around the first terminal a from the clockwise direction and then wound around the second terminal a from the inward direction to form the second primary winding set 22. In other embodiments, the first wire formed by the first primary winding group 21 and the second primary winding group 22 may have other winding manners.

Fig. 11 is a schematic flow diagram of a first current in a first primary winding set and a second primary winding set according to an embodiment of the present invention, and referring to fig. 11, the first current is input from a first terminal a and flows along a first wire to a second terminal b, and a direction of the first current passing through the first primary winding set 21 is opposite to a direction of the first current passing through the second primary winding set 22 when the substrate is viewed from above. Since the directions of the first currents are opposite, as shown in fig. 11, if the directions of the first currents in the first primary winding 21 are counterclockwise, the directions of the magnetic lines of force generated by the first primary winding 21 are clockwise, according to the right-hand rule, the directions of the magnetic lines of force generated by the first primary winding 21 are perpendicular to the first surface outwards, indicated by the addition of "·" in a circle, the directions of the magnetic lines of force generated by the second primary winding 22 are perpendicular to the first surface inwards, indicated by the addition of "×" in a circle, and the directions of the magnetic lines of force generated by the first primary winding 21 and the second primary winding 22 are opposite, so that the magnetic interference of the whole transformer to the outside is reduced.

Referring to fig. 9, the secondary coil wire 30 includes a first secondary winding group 31 and a second secondary winding group 32 connected in series, the first secondary winding group 31 including one or more turns of the secondary coil, the second secondary winding group 32 including one or more turns of the secondary coil; the number of coil turns included in the first secondary winding group 31 may or may not be the same as the number of coil turns included in the second secondary winding group 32. The exemplary drawing in fig. 9 shows that the number of coil turns included in the first secondary winding group 31 is the same as the number of coil turns included in the second secondary winding group 32. The first and second secondary winding groups 31 and 32 may be surrounded by a second wire, and the transformer further includes a third terminal c and a fourth terminal d, one end of the second wire being electrically connected to the third terminal c, and the other end of the second wire being connected to the fourth terminal d. The projection of the first primary winding set 21 onto the first surface 01 at least partially overlaps the projection of the first secondary winding wire 30 onto the second surface 02, and the projection of the second primary winding set 22 onto the first surface 01 at least partially overlaps the projection of the second secondary winding wire 30 onto the second surface 02. The second current induced by the secondary coil line 30 may flow from the third terminal c to the fourth terminal d along the second wire or from the fourth terminal d to the third terminal c along the second wire, such that the second current is used to sequentially pass through the first secondary winding group 31 and the second secondary winding group 32, and the direction of the second current passing through the first secondary winding group 31 is opposite to the direction of the first current passing through the second secondary winding group 32 along the direction of the top substrate.

In the embodiment, the first secondary winding set 31 and the second secondary winding set 32 are wound in such a manner that the second wire is wound around the first terminal c clockwise to form the first secondary winding set 31, and after the second wire is wound around the first terminal c for a predetermined number of turns, the second wire is wound around the second terminal c in a counterclockwise direction and then is wound around the second terminal c inward to form the second secondary winding set 32. In other embodiments, the second wire formed by the first secondary winding group 31 and the second secondary winding group 32 may have other winding manners.

In other embodiments of the present invention, the primary coil line 20 may include three or more primary winding groups connected in series; the secondary coil circuit 30 may include three or more secondary winding groups connected in series, and may be set according to actual requirements.

On the basis of the above embodiments, optionally, fig. 12 is a schematic cross-sectional view of another transformer provided in the embodiment of the present invention, fig. 13 is a schematic cross-sectional view of another transformer provided in the embodiment of the present invention, fig. 14 is a schematic cross-sectional view of another transformer provided in the embodiment of the present invention, and referring to fig. 10, fig. 12 to fig. 14, the first substrate 11 further includes a third surface 03 opposite to the first surface 01, the first surface 01 is a surface of the first substrate 11 near the second substrate 12, the third surface 03 is a surface of the first substrate 11 far from the second substrate 12, or the first surface 01 is a surface of the first substrate 11 far from the second substrate 12, and the third surface 03 is a surface of the first substrate 11 near the second substrate 12; the second substrate 12 further includes a fourth surface 04 opposite to the second surface 02, the second surface 02 being a surface of the second substrate 12 close to the first substrate 11, the fourth surface 04 being a surface of the second substrate 12 remote from the first substrate 11, or the second surface 02 being a surface of the second substrate 11 remote from the first substrate 11, the fourth surface 04 being a surface of the second substrate 12 close to the first substrate 11.

Specifically, fig. 10 exemplarily illustrates that the first surface 01 is a surface of the first substrate 11 away from the second substrate 12, and the second surface 02 is a surface of the second substrate 12 away from the first substrate 11, so that the primary coil circuit 20 and the secondary coil circuit are both located on the outer surfaces of the respective substrates, so as to facilitate connection between the coil circuit and the external circuit. Fig. 12 illustrates that the first surface 01 is a surface of the first substrate 11 adjacent to the second substrate 12, and the second surface 02 is a surface of the second substrate 12 adjacent to the first substrate 11, so that the primary coil line 20 and the secondary coil line are located between the first substrate 11 and the second substrate 12, and the first substrate 11 and the second substrate 12 can play a role of packaging protection for the primary coil line 20 and the secondary coil line 30. Fig. 13 exemplarily shows that the first surface 01 is a surface of the first substrate 11 away from the second substrate 12, the second surface 02 is a surface of the second substrate 12 close to the first substrate 11, fig. 14 exemplarily shows that the first surface 01 is a surface of the first substrate 11 close to the second substrate 12, and the second surface 02 is a surface of the second substrate 12 away from the first substrate 11. In the structure shown in fig. 10, 13 and 14, the primary coil wiring 20 and the secondary coil wiring 30 are separated by at least one insulating substrate of the first substrate and the second substrate, which is advantageous in improving the high voltage resistance of the transformer. The positions of the primary coil lines 20 and the secondary coil lines 30 may be set according to actual needs.

Based on the above embodiments, in one embodiment of the present invention, please continue to refer to fig. 8 to 10, the first primary winding group 21 encloses a first inner ring, the second primary winding group 22 encloses a second inner ring, through holes are respectively disposed in the first inner ring and the second inner ring, and the magnetic core 40 includes:

a magnetic core pattern located between the surface of the first substrate 11 away from the second substrate 12 and the surface of the second substrate 12 away from the first substrate 11;

the magnetic core connecting column is positioned in the through hole, the magnetic core connecting column is connected with the magnetic core pattern positioned on the surface of the first substrate 11 far away from the second substrate 12 and the surface of the second substrate 12 far away from the first substrate 11, the magnetic core pattern and the magnetic core connecting column form a closed magnetic core 40 structure along the direction X of the through hole in the first inner ring pointing to the through hole in the second inner ring.

Specifically, core 40 includes first core pattern 411, second core pattern 412, first core connection leg 401, and second core connection leg 402. A vertical projection of the first core pattern 411 on the first surface 01 covers coils of adjacent portions of the first primary winding group 21 and the second primary winding group 22; the perpendicular projection of the second core pattern 412 on the second surface 02 covers the coils of adjacent portions of the first secondary winding group 31 and the second secondary winding group 32. The first core connection leg 401 and the second core connection leg 402 are located between the first core pattern 411 and the second core pattern 412, and each connect the first core pattern 411 located on the surface of the first substrate 11 away from the second substrate 12 and the second core pattern 412 located on the surface of the second substrate 12 away from the first substrate 11. Along the direction X of the through hole in the first inner ring pointing to the through hole in the second inner ring, the magnetic core pattern and the magnetic core connecting column form a closed magnetic core structure. The magnetic core 40 is arranged into a closed magnetic core structure, so that magnetic force lines can be bound in the closed magnetic core structure, the transmission efficiency between the primary coil line 20 and the secondary coil line 30 is improved, the probability of disordered radiation of the magnetic force lines is reduced, and the interference of the whole transformer on peripheral circuits or external circuits is further reduced.

In this embodiment, the through hole may be a strip-shaped through hole, so that the magnetic core connecting column (401/402) located in the through hole is sheet-shaped, and compared with a cylindrical magnetic core connecting column, the sheet-shaped magnetic core connecting column has smaller resistance, so that loss caused by eddy current and generated heat during magnetic flux change can be reduced.

On the basis of the above embodiments, in one embodiment of the present invention, please continue to refer to fig. 8 to 10, the first primary winding set 21 has a first terminal a, the second primary winding set 22 has a second terminal b, and the first terminal a and the second terminal b are disposed opposite to each other and are respectively used for connecting to an external circuit; the second secondary winding set 32 has a third terminal c, and the second secondary winding set 32 has a fourth terminal d, where the third terminal c and the fourth terminal d are disposed opposite to each other and are respectively used for connecting to an external circuit. Along the direction that the first primary winding set 21 points to the second primary winding set 22, the first terminal a and the second terminal b, and the third terminal c and the fourth terminal d are respectively located at two opposite sides of the first substrate 11 and the second substrate 12 which are stacked, so that the four terminals can be conveniently connected with an external circuit, and the external circuit can be a direct lead wire or a lead wire through hole digging on the substrate.

The first terminal a is disposed on a first inner ring surrounded by the first primary winding group 21, the second terminal b is disposed on a second inner ring surrounded by the second primary winding group 22, and the first terminal a is disposed opposite to the second terminal b along a direction in which the first primary winding group 21 points to the second primary winding group 22. By providing the first terminal a and the second terminal b on the same side of the first substrate 11, an external circuit connected to the primary coil line 20 can be connected to the primary coil line 20 from the same side of the substrate, thereby simplifying wiring of the external circuit connected to the primary coil line 20. The first secondary winding group 31 is surrounded by a third inner ring, the second secondary winding group 32 is surrounded by a fourth inner ring, the third terminal c is positioned in the third inner ring, and the fourth terminal d is positioned in the fourth inner ring. Along the direction in which the first secondary winding group 31 points to the second secondary winding group 32, the third terminal c is disposed opposite to the fourth terminal d. By providing the third terminal c and the fourth terminal d on the same side of the second substrate 12, the external circuit connected to the secondary coil line 30 can be connected to the primary coil line 20 from the same side of the substrate, thereby simplifying wiring of the external circuit connected to the secondary coil line 30.

Based on the above embodiments, in one embodiment of the present invention, the first substrate 11 and the second substrate 12 are glass substrates, the thickness of the first substrate 11 ranges from 10 micrometers to 10 millimeters, and the thickness of the second substrate 12 ranges from 10 micrometers to 10 millimeters, which is beneficial for the light and thin design of the transformer. Preferably, the thickness of the first substrate 11 and the second substrate 12 ranges from 200um to 500um, respectively.

On the basis of the above-described embodiments, in one embodiment of the present invention, referring to fig. 10, a first connection layer 51 is provided between the primary coils in the first primary winding group 21 and the second primary winding group 22 and the first substrate 11; a second connection layer 52 is provided between the secondary windings in the first and second secondary winding groups 31 and 32 and the second substrate 12. The materials of the first and second connection layers 51 and 52 include, for example, titanium, so that the materials of the primary and secondary winding groups are easily formed on the surface of the glass substrate, improving the bonding force of each winding group to the glass substrate.

Based on the above embodiments, in one embodiment of the invention, the line width of the coils in the primary coil line 20 and the secondary coil line 30 is in the range of 5 micrometers to 1000 micrometers, preferably 20-200 micrometers, for example 40 micrometers, 60 micrometers; the spacing between adjacent coils ranges from 5 microns to 1000 microns, preferably 20-200 microns, for example 40 microns, 60 microns. The volume of the transformer is further reduced, so that the volume of an electronic device applying the transformer is further reduced. In addition, the coil thickness is in the range of 200 angstroms to 150 microns, preferably 300 angstroms to 500 angstroms, which is more advantageous for the lightening and thinning of the transformer.

Alternatively, the shape of the coils in the first primary winding group 21 may be square, circular, elliptical, diamond-shaped or polygonal; the shape of the coils in the second primary winding group 22 may be square, circular, oval, diamond-shaped or polygonal. The shape of the coils in the first secondary winding group 31 may be square, circular, oval, diamond-shaped or polygonal; the shape of the coils in the second secondary winding group 32 may be square, circular, oval, diamond-shaped or polygonal. The shape of the coil can be set according to actual requirements. Preferably, the shape of each winding coil is square with arc angles, so that the utilization rate of the carrier plate can be improved. In addition, the material of each winding coil comprises one or more of copper, copper alloy and titanium.

Based on the above embodiments, in one embodiment of the invention, referring to fig. 10, the transformer further includes: a first insulating layer 61 and a second insulating layer 62. The first insulating layer 61 covers the primary coils in the first and second primary winding groups 21 and 22 and fills between adjacent primary coils; the first insulating layer 61 is used for electrically insulating the first primary winding set 21 and the second primary winding set 22; the second insulating layer 62 covers the secondary coils in the first and second secondary winding groups 31 and 32 and is filled between adjacent secondary coils, and the second insulating layer 62 serves to electrically insulate the first and second secondary winding groups 31 and 32.

With continued reference to fig. 10, the transformer further includes: and a bonding layer 70 between the first substrate 11 and the second substrate 12 for bonding the first substrate 11 and the second substrate 12. The material constituting the bonding layer 70 may be an adhesive material. Referring to fig. 12 to 14, when the primary coil wire 20 and/or the secondary coil wire 30 is located between the first substrate 11 and the second substrate 12, the material of the bonding layer 70 needs to have insulation.

It will be appreciated that when the primary and secondary circuit substrates are defined, the primary and secondary coil circuits are also defined, so that the output voltage can be adjusted by adjusting the thickness of the bonding layer. When the first substrate 11 is bonded to the second substrate 12, the openings in the first substrate 11 and the second substrate 12 are aligned, but due to the presence of the bonding layer 70, the magnetic cores in the openings in the first substrate 11 and the second substrate 12 are separated, and in order to make the magnetic cores formed by laminating the first substrate 11 and the second substrate 12 into a continuous structure, a magnetic core connecting layer (not shown) is provided in the bonding layer 70 at positions facing the openings to connect the magnetic cores in the openings in the first substrate 11 and the second substrate 12.

An embodiment of the present invention further provides a transformer, fig. 15 is a top view of a first substrate in another transformer provided in an embodiment of the present invention, fig. 16 is a top view of a second substrate in another transformer provided in an embodiment of the present invention, fig. 17 is a schematic cross-sectional view of a structure shown in fig. 15 along a section line C-C1, and referring to fig. 15 to fig. 17, the transformer includes: a primary coil substrate including a first substrate 11 and a primary coil wire 20 disposed on the first substrate 11, the first substrate 11 including a first surface 01, the primary coil wire 20 having a first number of turns; a secondary coil substrate laminated with the primary coil substrate, the secondary coil substrate including a second substrate 12 and a secondary coil wire 30 provided on the second substrate 12, the second substrate 12 including a second surface 02 provided in parallel with the first surface 01, the secondary coil wire 30 having a second number of turns; wherein the projection of the primary winding wire 20 on the first surface 01 overlaps the projection of the secondary winding wire 30 on the second surface 02, and the first number of turns is greater or less than the second number of turns.

Specifically, when the number of turns of the coil in the primary coil line 20 is larger than the number of turns of the coil in the secondary coil line 30, the transformer plays a role in reducing the voltage; when the number of turns in the primary coil line 20 is smaller than the number of turns in the secondary coil line 30, the transformer functions as a step-down and the transformer functions as a step-up. Fig. 15-17 exemplarily illustrate that the number of coil turns in the primary coil line 20 is greater than the number of coil turns in the secondary coil line 30. The specific structure and position of the primary coil wire 20 and the secondary coil wire 30 can be referred to the above embodiments, and will not be described here again.

Optionally, the transformer further comprises: a through hole penetrating the primary coil substrate and the secondary coil substrate; and a magnetic core 40, at least a portion of the magnetic core 40 being filled in the through hole. Wherein the through hole is located inside the primary coil line 20 or outside the primary coil line 20. The specific structure of the magnetic core 40 may refer to the above embodiment, and will not be described herein.

The embodiment of the invention also provides a transformer chip, which comprises the transformer in any embodiment. The transformer chip comprises the transformer in any embodiment, and is packaged by the transformer, and leads and pins are arranged.

The embodiment of the invention also provides a semiconductor device which comprises the transformer chip. Or further comprises a PCB board or other semiconductor components, wherein the semiconductor device is formed by packaging the transformer chip, the PCB board and the other semiconductor components together.

Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims

1. A method of manufacturing a transformer, the method comprising:

2. The method of claim 1, wherein the step of providing a primary coil substrate and a secondary coil substrate comprises:

Providing a carrier plate;

forming a metal layer on the surface of the carrier plate, and patterning the metal layer to form a plurality of primary coil circuits and a plurality of secondary coil circuits;

cutting the carrier plate to form a plurality of primary coil substrates and a plurality of secondary coil substrates.

3. The method of manufacturing a transformer according to claim 2, further comprising, after providing a carrier plate:

forming an opening in the carrier plate, wherein the cut primary coil substrate and the cut secondary coil substrate are provided with the opening;

the step of bonding the primary coil substrate and the secondary coil substrate includes:

and aligning the openings in the primary coil substrate and the secondary coil substrate, wherein the two openings form through holes of the transformer.

4. The method of manufacturing a transformer according to claim 3, wherein the primary coil circuit includes a first primary winding group and a second primary winding group connected and arranged side by side, the primary coil circuit is configured to pass a first current, and the first current is configured to pass through the first primary winding group and the second primary winding group in sequence; the secondary coil comprises a first secondary winding group and a second secondary winding group which are connected and arranged side by side, the secondary coil circuit is used for inducing a second current, the second current is used for sequentially passing through the first secondary winding group and the second secondary winding group, the first primary winding group is surrounded by a first inner ring, the second primary winding group is surrounded by a second inner ring, and the first inner ring and the second inner ring are respectively provided with the open holes;

patterning the magnetic core layers formed on the primary coil substrate and the secondary coil substrate to form a magnetic core pattern, wherein the magnetic core pattern is positioned between the two openings; the magnetic core layer filled in the opening is used for forming a magnetic core connecting column; the magnetic core connecting column is connected with the magnetic core patterns positioned on the surfaces of the first substrate and the second substrate, the open holes in the first inner ring are directed to the open holes in the second inner ring, and the magnetic core patterns and the magnetic core connecting column form a closed magnetic core structure.

5. A transformer, comprising:

a secondary coil substrate laminated with the primary coil substrate, the secondary coil substrate including a second substrate having a second surface and a secondary coil wiring provided on the second surface, a projection of the secondary coil wiring on the second surface enclosing a second area, the second surface being parallel to the first surface; wherein,

The projection of the primary coil wire on the first surface overlaps the projection of the secondary coil wire on the second surface, and the first area is larger or smaller than the second area.

6. The transformer according to claim 5, further comprising:

a through hole penetrating the primary coil substrate and the secondary coil substrate;

a magnetic core, at least part of which is filled in the through hole, wherein,

the through hole is located inside the primary coil line or outside the primary coil line.

7. The transformer according to claim 6, wherein the transformer comprises a transformer,

the first substrate further comprises a third surface opposite to the first surface, wherein the first surface is a surface of the first substrate close to the second substrate, the third surface is a surface of the first substrate far away from the second substrate, or the first surface is a surface of the first substrate far away from the second substrate, and the third surface is a surface of the first substrate close to the second substrate;

8. The transformer of claim 6, wherein the primary coil circuit comprises a first primary winding group and a second primary winding group connected and arranged side by side, the primary coil circuit for passing a first current for passing through the first primary winding group and the second primary winding group in sequence, and a direction of the first current passing through the first primary winding group is opposite to a direction of the first current passing through the second primary winding group;

9. The transformer of claim 8, wherein the first primary winding is surrounded by a first inner ring, the second primary winding is surrounded by a second inner ring, the through holes are respectively formed in the first inner ring and the second inner ring, and the magnetic core comprises:

10. The transformer of claim 9, wherein the first primary winding has a first terminal and the second primary winding has a second terminal, the first and second terminals being disposed opposite each other and each for connection to an external circuit;

the second secondary winding group is provided with a third terminal, the second secondary winding group is provided with a fourth terminal, and the third terminal and the fourth terminal are oppositely arranged and are respectively used for being connected with an external circuit;

the first terminal, the second terminal, the third terminal and the fourth terminal are respectively positioned on two opposite sides of the first substrate and the second substrate which are arranged in a laminated way along the direction that the first primary winding group points to the second primary winding group.

11. The transformer of claim 10, wherein the first terminal is disposed on the first inner ring, the second terminal is disposed on the second inner ring, and the first terminal is disposed opposite the second terminal along a direction in which the first primary winding group is directed toward the second primary winding group.

12. The transformer according to claim 5, wherein the transformer comprises a transformer,

the first substrate comprises any one of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate and a polyimide film or a composite substrate;

the second substrate comprises any one of a glass substrate, a silicon substrate, a ceramic substrate, a glass fiber plate and a polyimide film or a composite substrate.

13. The transformer of claim 5, wherein the first and second substrates each have a thickness in the range of 10 microns to 10 millimeters.

14. The transformer of claim 5, wherein the spacing between adjacent coils is in the range of 5 microns to 1000 microns; and/or the line width of the coil ranges from 5 microns to 1000 microns.

15. The transformer according to claim 5, further comprising:

and a bonding layer between the first substrate and the second substrate for bonding the first substrate and the second substrate.

16. A transformer, comprising:

17. The transformer of claim 16, further comprising:

a magnetic core, at least part of which is filled in the through hole, wherein,

18. A transformer chip comprising a transformer according to any one of claims 5 to 17.

19. A semiconductor device comprising the transformer chip of claim 18.