CN117706874A - Substrate conveying mechanism, lithographic apparatus, and method for manufacturing article - Google Patents
Substrate conveying mechanism, lithographic apparatus, and method for manufacturing article Download PDFInfo
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- CN117706874A CN117706874A CN202310835958.1A CN202310835958A CN117706874A CN 117706874 A CN117706874 A CN 117706874A CN 202310835958 A CN202310835958 A CN 202310835958A CN 117706874 A CN117706874 A CN 117706874A
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- 239000000758 substrate Substances 0.000 title claims abstract description 244
- 230000007246 mechanism Effects 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000007723 transport mechanism Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 11
- 238000013461 design Methods 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 15
- 238000012546 transfer Methods 0.000 description 15
- 230000006835 compression Effects 0.000 description 10
- 238000007906 compression Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 7
- 238000005286 illumination Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 238000011161 development Methods 0.000 description 2
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- 239000011521 glass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
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- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a substrate conveying mechanism, a lithographic apparatus and a method for manufacturing articles, which are beneficial to simplification of the apparatus. The substrate conveying mechanism includes a holding portion including a surface for holding a substrate, a moving portion for moving the holding portion, and a guide for guiding movement of the moving portion, wherein the guide has a shape in which an angle of the surface is changed by movement of the moving portion along the guide, and the holding portion moves by the moving portion while holding the substrate in a state in which the surface is inclined.
Description
Technical Field
The present invention relates to a substrate transfer mechanism, a lithographic apparatus, and a method for manufacturing an article.
Background
In a process of manufacturing a semiconductor device, a liquid crystal display device, or the like, an operation of conveying the substrate from a mounting position to a predetermined position is performed, and the conveying operation is preferably performed in a short time. In addition, japanese patent application laid-open No. 2015-146045 discloses the following method: the substrate is carried by a substrate carrying-out device built in the substrate table while being sucked and held.
However, if a mechanism for sucking the substrate is provided in the conveying section for conveying the substrate while sucking and holding the substrate, the apparatus becomes complicated.
Disclosure of Invention
The invention provides a substrate conveying mechanism which is beneficial to simplifying the device.
In order to achieve the above object, a substrate transfer mechanism according to an aspect of the present invention includes: a holding portion including a surface for holding the substrate; a moving part for moving the holding part; and a guide for guiding movement of the moving portion, wherein the guide is shaped such that an angle of the surface is changed by movement of the moving portion along the guide, and the holding portion moves by the moving portion while holding the substrate in a state in which the surface is inclined.
According to the present invention, a substrate transfer mechanism that contributes to simplification of the apparatus can be provided.
Further features of the invention will become apparent from the following description of exemplary embodiments (with reference to the accompanying drawings).
Drawings
Fig. 1 is a schematic diagram showing the configuration of a substrate processing apparatus according to embodiment 1.
Fig. 2 is a cross-sectional view of the substrate table according to embodiment 1.
Fig. 3 is a diagram illustrating the detailed configuration of the 1 st cam follower and the 2 nd cam follower.
Fig. 4 is a diagram illustrating the detailed configuration of the 3 rd cam follower and the 4 th cam follower.
Fig. 5 is a view of the substrate transport mechanism and the substrate support section when viewed from the +z direction.
Fig. 6 is a diagram showing a substrate conveying operation according to embodiment 1.
Fig. 7 is a diagram showing the structure of the base of embodiment 2.
Fig. 8 is a flowchart of a method for manufacturing an article according to embodiment 3.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following embodiments do not limit the invention according to the claims. In the embodiments, a plurality of features are described, but not all of the plurality of features are essential to the invention, and a plurality of features may be arbitrarily combined. In the drawings, the same or similar components are denoted by the same reference numerals, and repetitive description thereof will be omitted.
In the present specification and the drawings, the vertical direction is basically referred to as the Z axis, the horizontal plane perpendicular to the vertical direction is referred to as the XY plane, and directions are represented by XYZ coordinate systems in which the axes are orthogonal to each other. In the case where an XYZ coordinate system is described in each drawing, the XYZ coordinate system is preferably used.
Hereinafter, in each embodiment, a specific configuration will be described.
< embodiment 1 >
Fig. 1 is a schematic diagram showing a configuration of a substrate processing apparatus 100 according to the present embodiment. In the present embodiment, the substrate processing apparatus 100 is a projection exposure apparatus that exposes a pattern of a master (mask, reticle) onto a substrate via a projection optical system. However, the substrate processing apparatus 100 is not limited to the exposure apparatus. For example, the substrate processing apparatus 100 may be a drawing apparatus that draws a pattern on a substrate by an electron beam, an ion beam, or the like. The substrate processing apparatus 100 may be another lithographic apparatus, for example, an imprint apparatus that forms a pattern on a substrate by molding an imprint material on the substrate with a mold. Alternatively, the substrate processing apparatus 100 may be another apparatus for processing a substrate such as a semiconductor wafer or a glass plate, such as an ion implantation apparatus, a developing apparatus, an etching apparatus, a film forming apparatus, an annealing apparatus, a sputtering apparatus, or a vapor deposition apparatus. The substrate processing apparatus 100 may be a planarizer for planarizing the composition on the substrate by using a flat plate.
The substrate processing apparatus 100 includes: an illumination optical system 1 as a light irradiation section for irradiating light; a reticle stage 3 holding a reticle 2; a projection optical system 4; a substrate table 6 capable of moving while holding the substrate 5; and a control unit 7 for controlling each part of the substrate processing apparatus 100. The reticle 2 is a master in which a pattern (for example, a circuit pattern) to be transferred to the surface of quartz glass is formed of chromium, for example. When the substrate 5 is, for example, monocrystalline silicon and the substrate processing apparatus 100 is an exposure apparatus, the substrate 5 transported by the substrate processing apparatus 100 is coated with a photosensitive material (photoresist) on the surface. Here, the illumination optical system 1 is a pattern forming portion that forms a pattern on the substrate 5. In the present embodiment, the example of the lithography apparatus for forming a pattern by using light is shown, but the patterning unit is the illumination optical system 1, but the lithography apparatus may be a lithography apparatus for curing a thermosetting material by heat. The pattern forming portion in this case is, for example, a heating portion for heating the thermosetting material.
In the substrate processing apparatus 100, exposure light from a light source (not shown) illuminates a reticle 2 held by a reticle stage 3 via an illumination optical system 1. The light transmitted through the reticle 2 is irradiated to the substrate 5 via the projection optical system 4. At this time, light from the pattern formed on the reticle 2 is imaged on the surface of the substrate 5. The substrate processing apparatus 100 exposes the exposure unit regions on the substrate 5 in this manner, and exposes the plurality of exposure unit regions in the same manner.
Fig. 2 is a cross-sectional view of the substrate table 6 according to the present embodiment. The substrate stage 6 includes a substrate mounting portion 20, an X driving portion 30, an X air bearing 30a, a Y driving portion 50, a Y air bearing 50a, a Y guide 60, a driving control portion 80, a support column 201, and an X-bar mirror 90. The substrate table 6 includes a conveyance guide 401, a conveyance moving unit 402, a Z guide 403, a Z moving unit 470, a base 404, a holding unit 430, and a compression coil spring 460. Further, the substrate table 6 has a 1 st guide 410a, a 2 nd guide 410b, a 3 rd guide 410c, and a 4 th guide 410d for configuring the position of the base 404 to an arbitrary position. By thus configuring the plurality of guides, the base 404 can be configured to any position. Here, by disposing the base (moving portion) 404 at an arbitrary position, the movement of the base 404 can be guided, and the movement of the base (moving portion) 404 can be restricted. The 1 st guide 410a, the 3 rd guide 410c, the 4 th guide 410d, and the 5 th guide 410e described later are each provided with an inclined portion. That is, the plurality of guides includes a plurality of guides provided with inclined portions. The amount of inclination (amount of change in angle) of the substrate 5 held by the susceptor 404 and the holding portion 430 is determined based on the shape of each guide determined by the length and angle of inclination of the inclined portion and the length of the horizontal portion of each guide. The length or angle of the inclination is determined based on 1 or more elements selected from the group consisting of the speed of conveying the substrate 5, the shape of the substrate 5, and the thickness of the substrate 5. Specifically, the determination is to determine the design value of each guide, and design the length or angle of the inclination of the inclined portion of each guide based on 1 or more elements selected from the speed of conveying the substrate 5, the shape of the substrate 5, and the thickness of the substrate 5. And, each guide including the designed inclined portion is manufactured. In the present embodiment, the movement of the substrate transport mechanism is guided by the guide having the plurality of inclined portions, but the holding portion 430 (substrate holding surface) may be inclined by a configuration in which at least 1 guide among the plurality of guides is provided with the inclined portion. Further, the substrate table 6 includes a 1 st cam follower 420a, a 2 nd cam follower 420b, a 3 rd cam follower 420c, and a 4 th cam follower 420d as cylindrical shaft bearings provided in the base 404.
In the present embodiment, the conveyance moving unit 402, the Z guide 403, the Z moving unit 470, the base 404, the holding unit 430, the compression coil spring 460, the cam followers, and the guides are collectively referred to as a substrate conveyance mechanism. The guides are part of the substrate transport mechanism, but since the guides are fixed at predetermined positions and cannot be moved, the guide is not included in a portion where the substrate transport mechanism moves (a portion where the position changes) in description of movement (position change) of the substrate transport mechanism described later. The substrate placement unit 20 is fixed to the X drive unit 30 via the support column 201, and can place the substrate 5 thereon. The X driving unit 30 is driven in the X direction by a linear motor or the like, not shown, on the Y driving unit 50 via an X air bearing 30 a. The Y driving unit 50 is driven in the Y direction on the Y guide 60 by a linear motor or the like, not shown, via a Y air bearing 50 a. The drive control unit 80 controls the driving of each part of the substrate table 6 including the substrate conveying mechanism. The X-bar mirror 90 reflects light from an interferometer, not shown, and is used for positioning the X-coordinate of the substrate 5. The substrate stage 6 has a Y-shaped mirror (not shown), which reflects light from an interferometer (not shown) and is used for positioning the Y-coordinate of the substrate 5.
The conveyance guide 401 is a guide for the substrate conveyance mechanism to move in the Y direction, and is disposed on the upper surface of the X driving section 30, and the conveyance moving section 402 moves along the conveyance guide 401 in the Y direction. The Z guide 403 is a guide that is used when a part of the substrate transfer mechanism moves in the Z direction, and is connected to the transfer moving unit 402. The Z moving unit 470 is coupled to the base 404, and moves the base 404 in the Z direction by moving in the Z direction along the Z guide 403. The 1 st guide 410a, the 2 nd guide 410b, the 3 rd guide 410c, the 4 th guide 410d, the 5 th guide 410e and the 6 th guide 410f described later are guide rails having a sliding surface along which each cam follower moves. The holding unit 430 is disposed on the base 404, and holds the substrate 5 when the substrate 5 is conveyed by the substrate conveying mechanism. Further, since the substrate conveyance mechanism moves at a high acceleration in the Y direction, it is preferable that the surface of the holding portion 430 holding the substrate 5 generates a high friction force with the substrate 5 in order to suppress the substrate 5 from falling down.
Fig. 3 is a diagram illustrating the detailed configuration of the 1 st cam follower 420a and the 2 nd cam follower 420 b. As shown in fig. 3 (a), the base 404 is provided with a 1 st Z guide 421, a 1 st Z moving part 422, a 1 st spring 423, and a 1 st mechanical stopper 424. The 1 st avoidance Z guide 421, the 1 st avoidance Z moving section 422, the 1 st avoidance spring 423, and the 1 st mechanical stopper 424 are arranged to move the 1 st cam follower 420a in the Z direction. In the present embodiment, the 1 st cam follower 420a is configured to be driven in the Z direction, but is not limited to this example. For example, the 2 nd cam follower 420b may be driven in the Z direction according to the shapes of the 1 st guide 410a, the 2 nd guide 410b, the 3 rd guide 410c, and the 4 th guide 410d. Alternatively, both the 1 st cam follower 420a and the 2 nd cam follower 420b may be driven in the Z direction.
The 1 st avoidance Z-guide 421 is fixed to the base 404, and the 1 st avoidance Z-moving section 422 moves in the Z-direction along the 1 st avoidance Z-guide 421. In order to reduce the load on the 1 st avoidance Z-guide 421, it is preferable that the center position of the 1 st cam follower 420a in the Y direction coincides with the Y coordinate of the center position of the 1 st avoidance Z-guide 421 in the Y direction.
The 1 st cam follower 420a is coupled to the 1 st avoidance Z-moving section 422, and the 2 nd cam follower 420b is integrated with the base 404. The +z direction end of the 1 st avoidance spring 423 is connected to the base 404, and the-Z direction end is connected to the 1 st avoidance Z movement section 422. The spring constant of the 1 st avoidance spring 423 is set such that the tension of the 1 st avoidance spring 423 is greater than the force in the-Z direction due to the gravity of the 1 st avoidance Z moving section 422 and the 1 st cam follower 420 a.
The 1 st mechanical stopper 424 is integrated with the base 404, and a part of the-Z direction surface of the 1 st avoidance Z movement section 422 is arranged to contact a part of the +z direction surface of the 1 st mechanical stopper 424. Further, the 1 st mechanical stopper 424 is brought into contact with the 1 st avoidance Z moving section 422, whereby the 1 st avoidance spring 423 is restricted from being extended in the-Z direction. Here, the surface of the 1 st mechanical stopper 424 in contact with the 1 st avoidance Z moving section 422 is preferably spherical, and by providing the contact surface with a spherical shape, the state of the 1 st mechanical stopper 424 in contact with the 1 st avoidance Z moving section 422 is substantially similar in each contact. In the present embodiment, the 1 st mechanical stopper 424 has been described as an example in which the surface in contact with the 1 st avoidance Z moving section 422 is spherical, but the surface in contact with the 1 st mechanical stopper 424 of the 1 st avoidance Z moving section 422 may be spherical.
When an external force equal to or greater than a predetermined value in the +z direction is applied to the 1 st cam follower 420a, as shown in fig. 3 (b), the 1 st avoidance spring 423 is contracted, and the 1 st cam follower 420a and the 1 st avoidance Z moving section 422 move in the +z direction along the 1 st avoidance Z guide 421. When the external force is less than the predetermined value, the 1 st escape spring 423 is extended, and the 1 st cam follower 420a and the 1 st escape Z moving part 422 move in the-Z direction along the 1 st escape Z guide 421. As shown in fig. 3 (a), the 1 st cam follower 420a and the 1 st avoidance Z moving section 422 are stationary at a position where the 1 st mechanical stopper 424 contacts the 1 st avoidance Z moving section 422.
Fig. 4 is a diagram illustrating the detailed configuration of the 3 rd cam follower 420c and the 4 th cam follower 420d. As shown in fig. 4 (a), the base 404 is provided with a 2 nd avoidance Z guide 425, a 2 nd avoidance Z moving section 426, a 2 nd avoidance spring 427, and a 2 nd mechanical stopper 428. The 2 nd avoidance Z guide 425, the 2 nd avoidance Z moving section 426, the 2 nd avoidance spring 427, and the 2 nd mechanical stopper 428 are arranged to move the 4 th cam follower 420d in the Z direction. In the present embodiment, the 4 th cam follower 420d is configured to be driven in the Z direction, but is not limited to this example. For example, the 3 rd cam follower 420c may be driven in the Z direction according to the shapes of the 1 st guide 410a, the 2 nd guide 410b, the 3 rd guide 410c, and the 4 th guide 410d. Alternatively, both the 3 rd cam follower 420c and the 4 th cam follower 420d may be driven in the Z direction.
The 2 nd avoidance Z-guide 425 is fixed to the base 404, and the 2 nd avoidance Z-moving section 426 moves in the Z-direction along the 2 nd avoidance Z-guide 425. In order to reduce the load on the 2 nd avoidance Z-guide 425, it is preferable that the center position of the 4 th cam follower 420d in the Y direction coincides with the Y coordinate of the center position of the 2 nd avoidance Z-guide 425 in the Y direction.
The 4 th cam follower 420d is coupled to the 2 nd avoidance Z-moving section 426, and the 3 rd cam follower 420c is integrated with the base 404. The +z direction end of the 2 nd avoidance spring 427 is connected to the base 404, and the-Z direction end is connected to the 2 nd avoidance Z movement section 426. The spring constant of the 2 nd escape spring 427 is set so that the tension of the 2 nd escape spring 427 is larger than the force in the-Z direction due to the gravity of the 2 nd escape Z moving part 426 and the 4 th cam follower 420d.
The 2 nd mechanical stopper 428 is integrated with the base 404, and a part of the +z direction surface of the 2 nd avoidance Z movement portion 426 is arranged to contact a part of the-Z direction surface of the 2 nd mechanical stopper 428. Further, the 2 nd mechanical stopper 428 is in contact with the 2 nd avoidance Z movement portion 426, thereby restricting contraction of the 2 nd avoidance spring 427 in the +z direction. Here, the surface of the 2 nd mechanical stopper 428 that contacts the 2 nd avoidance Z moving section 426 is preferably spherical, and by setting the contact surface to be spherical, the state of the 2 nd mechanical stopper 428 when it contacts the 2 nd avoidance Z moving section 426 is substantially similar each time it contacts. In the present embodiment, the 2 nd mechanical stopper 428 is described as an example in which the surface in contact with the 2 nd Z movement part 426 is spherical, but the surface in contact with the 2 nd mechanical stopper 428 of the 2 nd Z movement part 426 may be spherical.
When an external force equal to or greater than a predetermined value in the-Z direction is applied to the 4 th cam follower 420d, the 2 nd escape spring 427 is extended as shown in fig. 4 (b), and the 4 th cam follower 420d and the 2 nd escape Z moving part 426 move in the-Z direction along the 2 nd escape Z guide 425. When the external force is less than the predetermined value, the 2 nd escape spring 427 contracts, and the 4 th cam follower 420d and the 2 nd escape Z moving part 426 move in the +z direction along the 2 nd escape Z guide 425. As shown in fig. 4 (a), the 4 th cam follower 420d and the 2 nd avoidance Z moving section 426 are stationary at a position where the 2 nd mechanical stopper 428 and the 2 nd avoidance Z moving section 426 are in contact with each other.
Fig. 5 is a view of the substrate transfer mechanism and the substrate support section 70 viewed from the +z direction. In addition, fig. 5 shows the positional relationship of the 3 rd cam follower 420c, the 4 th cam follower 420d, the 3 rd guide 410c, the 4 th guide 410d, the 5 th guide 410e, and the 6 th guide 410f in the X direction. The substrate support 70 is a table on which the substrate 5 conveyed from the substrate conveying mechanism is placed, and supports the substrate 5 by a plurality of pins provided on the table.
The 3 rd cam follower 420c and the 4 th cam follower 420d are disposed at positions offset in the X direction, and the 3 rd cam follower 420c is disposed on the-X direction side of the 4 th cam follower 420d. The 3 rd guide 410c has a sliding surface at a position where it contacts only the 3 rd cam follower 420 c. The 4 th guide 410d has a sliding surface that is wide in the X direction so as to guide both the 3 rd cam follower 420c and the 4 th cam follower 420d. The 5 th guide 410e and the 6 th guide 410f are provided on the substrate support portion 70, and have sliding surfaces at positions where they contact only the 4 th cam follower 420d.
Fig. 6 is a diagram showing a substrate conveying operation according to the present embodiment. As shown in fig. 6 (a), the substrate transport mechanism stands by so that the holding portion 430 is positioned lower than the substrate placement portion 20.
Then, the substrate transfer operation is started, and as shown in fig. 6 (b), the transfer moving unit 402 moves in the-Y direction along the transfer guide 401. Thereby, the whole substrate conveying mechanism moves in the-Y direction. When moving in the-Y direction in this way, the 1 st cam follower 420a moves along the sliding surface of the 1 st guide 410a, and the 4 th cam follower 420d moves along the sliding surface of the 4 th guide 410d. Here, when the 1 st cam follower 420a moves along the 1 st guide 410a, the compression coil spring 460 is extended in the +z direction at the inclined portion of the 1 st guide 410a provided on the +y direction side. By the extension of the compression coil spring 460, the Z moving portion 470 moves in the +z direction along the Z guide 403, and the base 404 moves in the +z direction. The holding portion 430 receives (acquires) the substrate 5 from the substrate mounting portion 20 by moving the susceptor 404 in the +z direction.
Here, by setting the inclination angle of the 1 st guide 410a in the +y direction and the inclination angle of the 4 th guide 410d to be the same, the substrate holding surface of the substrate conveying mechanism can acquire the substrate 5 in a horizontal state when the substrate conveying mechanism receives (acquires) the substrate 5 from the substrate mounting portion 20. That is, the guide is disposed such that 2 or more inclined portions among the inclined portions of the guide provided with the plurality of inclined portions are at the same angle.
Thereby, positional displacement of the substrate 5 in the horizontal direction can be suppressed. Here, the inclination angle of the 1 st guide 410a and the inclination angle of the 4 th guide 410d are set so that the holding portion 430 is located closer to the +z direction side than the substrate placement portion 20 when the substrate 5 is held. Further, the substrate carrying mechanism is set to a position where the substrate carrying portion 20 does not contact the substrate 5 even when the substrate 5 is deflected in the-Z direction by the self weight during the substrate carrying mechanism carries the substrate 5.
When the substrate conveyance mechanism moves further in the-Y direction, the substrate conveyance mechanism is tilted due to a difference between the tilt length of the 1 st guide 410a on the +y direction side and the tilt length of the 4 th guide 410d, as shown in fig. 6 (c). The 1 st guide 410a is disposed such that the inclined length of the 1 st guide 410a on the +y direction side is longer than the inclined length of the 4 th guide 410d. That is, the guide is arranged such that the 1 st inclined portion (the inclined portion on the +y direction side of the 1 st guide 410 a) and the 2 nd inclined portion (the inclined portion of the 4 th guide 410 d) which are different from the 1 st inclined portion are different in length from each other among the inclined portions of the guide provided with the plurality of inclined portions.
With this arrangement, as shown in fig. 6 (c), the base 404 is inclined, and the holding portion 430 is also inclined, so that the substrate 5 can be held by the substrate conveyance mechanism in an inclined manner. The shapes of the 1 st guide 410a and the 4 th guide 410d are determined and arranged so that the height of the substrate 5 on the conveyance direction side is lower than the height of the substrate 5 on the opposite side to the conveyance direction. In the present embodiment, when the substrate 5 is conveyed by the substrate conveying mechanism, the substrate 5 is held by friction between the holding portion 430 and the substrate 5 and air resistance against the surface of the substrate 5, which is obtained by moving the substrate 5 in the Y direction while holding the substrate obliquely, without performing holding by suction or the like. By adopting such a configuration, there is no need to provide a mechanism for adsorbing the substrate 5 in the substrate conveying mechanism (conveying section), and the apparatus can be simplified. The tilt length of the 1 st guide 410a and the tilt length of the 4 th guide 410d are set so that the conveyance direction side (-Y direction side) of the substrate 5 receives the lift force in the +z direction, without being vibrated when the substrate 5 is conveyed.
When the substrate conveying mechanism moves further in the-Y direction, as shown in fig. 6 (d), the 4 th guide 410d and the 5 th guide 410e have discontinuous sliding surfaces, and therefore, the 4 th cam follower 420d is separated from the 4 th guide 410d sliding surface. At this time, the 3 rd cam follower 420c contacts the sliding surface of the 4 th guide 410d, and supports the substrate conveyance mechanism. Here, if the cam follower in contact with the 4 th guide 410d changes from the 4 th cam follower 420d to the 3 rd cam follower 420c, the angle of the holding base plate 5 changes. In order to suppress the change in the angle, a height difference may be provided between the sliding surface of the 4 th guide 410d contacting the 4 th cam follower 420d and the sliding surface of the 4 th guide 410d contacting the 3 rd cam follower 420 c.
When the substrate conveying mechanism moves further in the-Y direction, the slide surface of the 5 th guide 410e contacts the 4 th cam follower 420d as shown in fig. 6 (e). Here, the distance between the 3 rd cam follower 420c and the 4 th cam follower 420d is set to be equal to or greater than the distance between the end of the 4 th guide 410d on the-Y direction side and the end of the 5 th guide 410e on the +y direction side.
When the substrate conveying mechanism moves further in the-Y direction, as shown in fig. 6 (f), the compression coil spring 460 is contracted in the-Z direction at the inclined portion of the 1 st guide 410a provided on the-Y direction side. By the contraction of the compression coil spring 460, the Z moving portion 470 moves in the-Z direction along the Z guide 403, and the base 404 moves in the-Z direction accordingly. Here, by setting the inclination angle of the inclined portion provided on the-Y direction side of the 1 st guide 410a to be the same as the inclination angle of the inclined portion provided on the 5 th guide 410e, the susceptor 404 becomes horizontal and holds the substrate 5 horizontally before the substrate 5 comes into contact with the substrate support portion 70. In addition, when the substrate transport mechanism moves in the-Y direction while holding the substrate 5 horizontally, the holding force of the holding portion 430 due to the air resistance received by the surface of the substrate 5 is reduced, so that the acceleration in the-Y direction at this time is set so that the substrate 5 does not shift in the horizontal direction. Then, the substrate 5 is transferred to the substrate support portion 70 by the holding portion 430 by moving the substrate transfer mechanism in the-Y direction and the-Z direction along the 1 st guide 410a and the 5 th guide 410e in a state where the substrate 5 is held horizontally.
When the substrate conveying mechanism moves further in the-Y direction, as shown in fig. 6 (g), the compression coil spring 460 is contracted in the-Z direction at the inclined portion of the 1 st guide 410a provided on the-Y direction side.
And, the 4 th cam follower 420d contacts the 6 th guide 410 f.
Next, as shown in fig. 6 (h), the conveyance moving unit 402 moves in the +y direction along the conveyance guide 401. Thereby, the entire substrate transfer mechanism moves in the +y direction. When moved in the +y direction in this way, the 1 st cam follower 420a and the 2 nd cam follower 420b move along the sliding surface of the 2 nd guide 410b, and the 4 th cam follower 420d moves along the sliding surface of the 6 th guide 410 f. In addition, the distance between the lowermost position of the 5 th guide 410e and the uppermost position of the 6 th guide 410f is configured to be larger than the outermost diameter of the 4 th cam follower 420d so as not to interfere with the +y direction movement of the 4 th cam follower 420d. And, the 3 rd cam follower 420c contacts the sliding surface of the 3 rd guide 410c before the 4 th cam follower 420d is separated from the sliding surface of the 6 th guide 410 f.
When the substrate conveying mechanism moves further in the +y direction, as shown in fig. 6 (i), the 3 rd cam follower 420c moves in the +z direction at the inclined portion of the 3 rd guide 410 c. Accordingly, the compression coil spring 460 is extended in the +z direction. By the extension of the compression coil spring 460, the Z moving portion 470 moves in the +z direction along the Z guide 403, and the base 404 moves in the +z direction. Here, the lower surface of the 4 th guide 410d contacts the 4 th cam follower 420d to interfere. However, the 2 nd avoidance Z guide 425, the 2 nd avoidance Z moving section 426, the 2 nd avoidance spring 427, and the 2 nd mechanical stopper 428 move in the-Z direction as described above, and the 4 th cam follower 420d is prevented from interfering with the movement of the substrate conveying mechanism.
When the substrate conveying mechanism moves further in the +y direction, as shown in fig. 6 (j), the 2 nd cam follower 420b contacts the 1 st guide 410a, and the compression coil spring 460 expands in the +z direction. Since the lower surface of the 4 th guide 410d is not in contact with the 4 th cam follower 420d, the 4 th cam follower 420d moves in the +z direction and returns to the original position. Then, the substrate conveying mechanism is moved in the-Y direction, and returns to the initial position shown in fig. 6 (a).
According to the present embodiment, by tilting the portion of the substrate carrying mechanism that holds the substrate 5, the substrate carrying mechanism can hold the substrate 5 by using the air resistance applied to the surface of the substrate 5 and the frictional force of the holding portion 430 that holds the substrate 5. Therefore, the substrate conveying mechanism does not need to provide a mechanism for sucking and holding the substrate 5 in the conveying section, and the apparatus can be simplified. The inclination of the substrate holding surface (holding portion 430) of the substrate conveying mechanism and the movement in the Z direction for acquiring or placing the substrate 5 may be appropriately performed according to the inclination length or inclination angle of the inclination portion provided in the guide. That is, the substrate transfer mechanism of the present embodiment does not need to provide a mounting portion for moving in the Z direction. Thus, not only can the device be simplified, but also the risk of dusting can be reduced.
< embodiment 2 >
In this embodiment, in addition to the features of embodiment 1, the present invention is characterized in that: a fall prevention member for the substrate 5 is provided. Fig. 7 is a diagram showing a structure of the base 500 according to the present embodiment. The susceptor 500 of the present embodiment includes a drop preventing member 510 for preventing the substrate 5 from dropping at each of the +y direction and-Y direction ends.
According to the present embodiment, when the holding force of the holding portion 430 to the substrate 5 is insufficient and the substrate 5 falls, the falling of the substrate 5 can be suppressed by the falling preventing member 510.
< embodiment 3 >
The present embodiment is characterized in that: articles are manufactured by the substrate conveying mechanism described in embodiment 1 and embodiment 2.
Fig. 8 is a flowchart of a method for manufacturing an article according to the present embodiment. A forming step (S510) of forming a pattern on a substrate is performed, and a conveying step (S520) of conveying the substrate on which the pattern is formed by the forming step by the substrate conveying mechanism described in embodiment 1 or embodiment 2 is performed. Then, a manufacturing process of manufacturing the article from the substrate, which is patterned by the forming process and conveyed by the conveying process, is performed (S530).
Here, although an example in which the transfer step is performed after the formation step is shown in the flowchart of fig. 8, the formation step may be performed after the transfer step in which the substrate is transferred by the substrate transfer mechanism described in embodiment 1 or embodiment 2.
The articles manufactured by the manufacturing method are, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, and the like. In the forming step, for example, a substrate (silicon wafer, glass plate, or the like) having a photosensitive material applied to a pattern material is exposed by an exposure device (photolithography device), and a latent image pattern is formed on the photosensitive material of the substrate.
The manufacturing process includes, for example, development of a substrate (photosensitive material) including a latent image pattern formed thereon, etching of a pattern material of the substrate after development, photoresist stripping, and the like, and implementation of a post-process (including dicing, bonding, packaging, and the like). According to the present manufacturing method, articles can be manufactured with a higher productivity per unit time than in the conventional method.
The disclosure of the present specification includes the following substrate conveyance mechanism, lithographic apparatus, guide manufacturing method, and article manufacturing method.
(item 1)
A substrate conveying mechanism is characterized in that,
the substrate conveying mechanism comprises:
a holding portion for holding the substrate;
a moving part for moving the holding part; and
a guide for guiding the movement of the moving part,
the guide is configured such that the angle of the holding portion is changed by the movement of the moving portion along the guide, and the holding portion moves by the moving portion while holding the substrate in an inclined state.
(item 2)
The substrate transport mechanism according to item 1, wherein the guide is arranged so as to hold the substrate horizontally when the substrate is transferred.
(item 3)
The substrate transport mechanism according to item 1 or 2, wherein the moving portion is inclined so that a height of the substrate on a transport direction side is lower than a height of the substrate on an opposite side to the transport direction.
(item 4)
The substrate transport mechanism according to any one of claims 1 to 3, wherein a plurality of the guides are provided, and an inclined portion is provided in at least 1 of the plurality of the guides.
(item 5)
The substrate transport mechanism according to item 4, wherein the plurality of guides includes a plurality of guides provided with the inclined portions,
2 or more inclined portions among the inclined portions of the plurality of guides provided with the inclined portions are at the same angle.
(item 6)
The substrate transport mechanism according to item 4 or 5, wherein the plurality of guides includes a plurality of guides provided with the inclined portions,
the 1 st inclined part and the 2 nd inclined part different from the 1 st inclined part of the plurality of guiding members provided with the inclined parts are different in length.
(item 7)
The substrate transport mechanism according to any one of items 1 to 6, wherein the holding portion is formed of a material that generates friction between the holding portion and the substrate.
(item 8)
The substrate transport mechanism according to any one of items 1 to 7, wherein the moving section has a member for preventing the substrate from falling down.
(item 9)
A lithographic apparatus, characterized in that,
the lithographic apparatus includes:
a substrate conveying mechanism according to any one of items 1 to 8 for conveying a substrate; and
and a pattern forming part for forming a pattern on the substrate.
(item 10)
A method for manufacturing a guide for guiding movement of a moving part for moving a holding part for holding a substrate, characterized by comprising the steps of,
the method for manufacturing the guide member comprises the following steps:
a design step of designing a length or an angle of inclination of the inclined portion of the guide based on 1 or more elements selected from among a speed of conveying the substrate, a shape of the substrate, and a thickness of the substrate, so that the angle of the holding portion is changed by moving the moving portion along the guide, and the holding portion moves by the moving portion while holding the substrate in an inclined state; and
and a manufacturing step of manufacturing the guide including the inclined portion designed in the design step.
(item 11)
A method for manufacturing an article, characterized in that,
the method for manufacturing the article comprises the following steps:
a forming step of forming a pattern on a substrate;
a conveying step of conveying a substrate by the substrate conveying mechanism according to any one of items 1 to 8; and
and a manufacturing step of manufacturing an article from the substrate subjected to the forming step and the conveying step.
The present invention is not limited to the above embodiments, and various changes and modifications may be made without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.
While the invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
The present application claims the benefit of japanese patent application No. 2022-145605 filed on day 2022, month 09, and 13, which is incorporated herein by reference in its entirety.
Claims (12)
1. A substrate conveying mechanism is characterized in that,
the substrate conveying mechanism comprises:
a holding portion including a surface for holding the substrate;
a moving part for moving the holding part; and
a guide for guiding the movement of the moving part,
the guide has a shape in which the angle of the surface is changed by the movement of the moving portion along the guide, and the holding portion moves by the moving portion while holding the substrate in a state in which the surface is inclined.
2. The substrate transport mechanism according to claim 1, wherein,
the guide is disposed so as to keep the substrate horizontal when the substrate is transferred.
3. The substrate transport mechanism according to claim 1, wherein,
the moving section is inclined such that the height of the substrate on the side in the conveyance direction is lower than the height of the substrate on the side opposite to the conveyance direction.
4. The substrate transport mechanism according to claim 1, wherein,
the substrate conveying mechanism has a spring that expands and contracts in accordance with the shape of the guide.
5. The substrate transport mechanism according to claim 1, wherein,
the plurality of guides are arranged, and at least 1 of the plurality of guides is provided with an inclined portion.
6. The substrate transport mechanism according to claim 5, wherein,
the plurality of guides includes a plurality of guides provided with the inclined portions,
2 or more inclined portions among the inclined portions of the plurality of guides provided with the inclined portions are at the same angle.
7. The substrate transport mechanism according to claim 5, wherein,
the plurality of guides includes a plurality of guides provided with the inclined portions,
the 1 st inclined part and the 2 nd inclined part different from the 1 st inclined part of the plurality of guiding members provided with the inclined parts are different in length.
8. The substrate transport mechanism according to claim 1, wherein,
the surface is formed of a material that generates friction between the surface and the substrate.
9. The substrate transport mechanism according to claim 1, wherein,
the moving part has a member for preventing the substrate from falling.
10. A lithographic apparatus, characterized in that,
the lithographic apparatus includes:
a substrate conveying mechanism according to any one of claims 1 to 9 that conveys a substrate; and
and a pattern forming part for forming a pattern on the substrate.
11. A method for manufacturing a guide for guiding movement of a moving part for moving a holding part for holding a substrate, characterized by comprising the steps of,
the method for manufacturing the guide member comprises the following steps:
a design step of designing a length or an angle of inclination of the inclined portion of the guide based on 1 or more elements selected from among a speed of conveying the substrate, a shape of the substrate, and a thickness of the substrate, so that the angle of a surface of the substrate held by the holding portion varies by the moving portion when the moving portion moves along the guide, and the holding portion moves by the moving portion while holding the substrate in a state in which the surface is inclined; and
and a manufacturing step of manufacturing the guide including the inclined portion designed in the design step.
12. A method for manufacturing an article, characterized in that,
the method for manufacturing the article comprises
A forming step of forming a pattern on a substrate;
a conveying step of conveying the substrate in an inclined state; and
a step of manufacturing an article from the substrate which has been subjected to the forming step and the carrying step,
in the conveying step, the substrate is tilted according to a shape of a guide guiding the conveyance of the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022145605A JP2024040937A (en) | 2022-09-13 | 2022-09-13 | Substrate transport mechanism, lithography apparatus, and article manufacturing method |
| JP2022-145605 | 2022-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117706874A true CN117706874A (en) | 2024-03-15 |
Family
ID=90157680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310835958.1A Pending CN117706874A (en) | 2022-09-13 | 2023-07-07 | Substrate conveying mechanism, lithographic apparatus, and method for manufacturing article |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2024040937A (en) |
| KR (1) | KR20240036462A (en) |
| CN (1) | CN117706874A (en) |
-
2022
- 2022-09-13 JP JP2022145605A patent/JP2024040937A/en active Pending
-
2023
- 2023-07-07 CN CN202310835958.1A patent/CN117706874A/en active Pending
- 2023-08-31 KR KR1020230115104A patent/KR20240036462A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024040937A (en) | 2024-03-26 |
| KR20240036462A (en) | 2024-03-20 |
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