CN117706337A - A fault location location method and system based on HALT and HIL - Google Patents

Abstract

The invention provides a fault location locating method and system based on HALT and HIL, which relates to the technical field of fault detection; the method includes: building a fault locating test platform, the fault locating test platform includes a HALT box and a HIL test component; the system includes: building a test platform module, HALT detection module and HIL fault location module. The present invention builds a fault location test platform based on the combination of HALT box and HIL test components. The HALT box applies stress to the component under test to expose defects, and then utilizes the powerful signal generation and reception processing functions of the HIL test component. Quickly locate the fault location of the device under test instead of completely locating the fault location, thus greatly shortening the time for hardware development and upgrades and improving work efficiency.

Description

A fault location location method and system based on HALT and HIL

Technical field

The present invention mainly relates to the technical field of fault detection, and specifically relates to a fault location locating method and system based on HALT and HIL.

Background technique

At present, all walks of life are developing in the direction of mechanization, automation and intelligence. Especially in extreme and dangerous environments with high temperatures, low temperatures and high vibration acceleration, it is a general trend to use robots to replace manual operations. Therefore, the requirements for the ultimate stress tolerance of the components under test (such as chips and circuit boards) are getting higher and higher, and accordingly the requirements for stress testing of chips and circuit boards are also getting higher and higher. The current mainstream hardware testing method is to verify and improve the performance of circuit boards through HALT highly accelerated life testing. However, this equipment can only apply stress, and functional testing requires additional circuits and signal generation detection equipment. The existing method is to write a test program in the controller so that the controller sends out signals continuously. This method can only test in real time whether the chip of the controller output module is working normally, and cannot fully cover the controller functions. There are Certain limitations.

Contents of the invention

The technical problem to be solved by the present invention is to provide a fault location locating method and system based on HALT and HIL in view of the shortcomings of the existing technology.

The technical solution of the present invention to solve the above technical problems is as follows: a fault location locating method based on HALT and HIL, including:

Build a fault location test platform, which includes a HALT box and HIL test components;

The HALT box applies stress to the component under test placed in the HALT box in advance. If a fault occurs, a fault location detection signal is generated based on the fault phenomenon;

When the HIL test component receives the fault location detection signal, the HIL test component establishes a connection with the device under test, and performs CAN communication module detection on the device under test through the HIL test component. If CAN If there is no fault in the communication module, component fault detection will be performed on the component under test based on the detection items in the preset HIL detection list, the fault location location information of the component under test will be obtained, and the fault location location information will be displayed.

The beneficial effects of the present invention are: building a fault location test platform based on the combination of HALT box and HIL test components, applying stress to the tested component through the HALT box to expose defects, and then utilizing the powerful signal generation and The function of receiving and processing can quickly locate the fault location of the device under test without having to completely locate the fault location. Therefore, it can greatly shorten the time of hardware development and upgrade and improve work efficiency.

On the basis of the above technical solution, the present invention can also make the following improvements.

Further, the step of establishing connection between the HIL test component and the device under test includes:

Import the preset HIL detection list and the pin information of the device under test. The preset HIL detection list includes detection items of multiple components and the detection parameters corresponding to each detection item. Based on the preset HIL detection list and the device under test The pin information is used to build a simulink vehicle model, and the connection between the HIL test component and the device under test is established through the simulink vehicle model.

Further, the step of testing the CAN communication module of the device under test through the HIL test component includes:

Use the HIL test component to detect whether the CAN signal of the device under test is received. If the CAN signal of the device under test is received, enter the step of detecting component failure of the device under test;

If the CAN signal of the device under test is not received, the power module of the device under test is powered on and detected. If the information that the power module is faulty is obtained, the fault location is located as the power module of the device under test is faulty. If the power module is detected, If the information is normal, the fault location is located as there is a fault in CAN communication.

Further, the step of detecting component faults on the device under test according to the detection items in the preset HIL detection list includes:

Use the simulink vehicle model to perform resistance component fault detection on the device under test. If the vehicle fuel level model reading shows abnormality, and the vehicle fuel level model reading shows a different resistance value that is not input by the HIL test component. If the signal changes, the fault location is located as a resistive component fault.

Further, the step of detecting component faults on the device under test according to the detection items in the preset HIL detection list also includes:

Use the simulink vehicle model to perform speed acquisition chip fault detection on the tested part. If the vehicle drum speed module reading shows abnormality, and the vehicle drum speed module reading does not change with the different PWM signals input by the HIL test component, Then the fault location is located as the fault of the speed acquisition chip.

Further, the step of detecting component faults on the device under test according to the detection items in the preset HIL detection list also includes:

Use the simulink vehicle model to perform voltage acquisition chip fault detection on the device under test. If the vehicle handle voltage reading shows abnormality, and the vehicle handle voltage reading does not change with the different voltage signals input by the HIL test component, then there is a fault. The location is located as a voltage acquisition chip failure.

Further, in the step of applying stress to the component under test pre-placed in the HALT box through the HALT box, and if a fault occurs, generating a fault location detection signal according to the fault phenomenon, it also includes:

Use the HALT box to perform a highly accelerated life aging test on the tested part to verify whether the vibration limit and high and low temperature limits of the tested part reach or exceed the required values. If the required values are reached and there are no faults, the test is passed; If the device under test fails before meeting the requirements, a fault location detection signal is generated based on the fault phenomenon.

Another technical solution of the present invention to solve the above technical problems is as follows: a fault location positioning system based on HALT and HIL, including:

A test platform building module is used to build a fault location test platform, which includes a HALT box and HIL test components;

A HALT detection module, used to apply stress to the tested component pre-placed in the HALT box through the HALT box, and if a fault occurs, generate a fault location detection signal based on the fault phenomenon;

A HIL fault location module, configured to establish a connection between the HIL test component and the device under test when the HIL test component receives the fault location detection signal, and to conduct testing on the device under test through the HIL test component. CAN communication module detection, if there is no fault in the CAN communication module, the component fault detection is performed on the component under test according to the detection items in the preset HIL detection list, the fault location information of the component under test is obtained, and the fault location is obtained Location information is displayed.

Description of the drawings

Figure 1 is one of the flow diagrams of a fault location locating method provided by an embodiment of the present invention;

Figure 2 is a second schematic flowchart of a fault location locating method provided by an embodiment of the present invention;

Figure 3 is a functional module block diagram of a fault location locating device provided by an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, rather than all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Therefore, the following detailed description of the embodiments of the invention provided in the appended drawings is not intended to limit the scope of the claimed invention, but rather to represent selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.

In the description of the present invention, it should also be noted that, unless otherwise clearly stated and limited, if the terms "set", "installation", "connected" and "connected" appear, they should be understood in a broad sense. For example, they can be fixed The connection may be a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium; it may be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

As shown in Figures 1 and 2, a fault location locating method based on HALT and HIL provided by an embodiment of the present invention includes:

Build a fault location test platform, which includes a HALT box and HIL test components.

The HALT box applies stress to the component under test placed in the HALT box in advance. If a fault occurs, a fault location detection signal is generated according to the fault phenomenon; specifically, the component under test is placed in the HALT box and fixed, and the component under test is fixed through the HALT box. The function of the box itself is to apply stresses such as temperature and acceleration, or to provide various signals such as resistance, voltage, current, frequency, etc., to test the performance of the device under test (such as a controller), causing the entire circuit board to function abnormally and exposing hardware defects. It can also monitor the device under test (such as a controller). Various output signals of the test piece. It should be understood that fault phenomena include virtual connections falling off, internal failures, etc.

When the HIL test component receives the fault location detection signal, the HIL test component establishes a connection with the device under test, and performs CAN communication module detection on the device under test through the HIL test component. If CAN If there is no fault in the communication module, component fault detection will be performed on the component under test based on the detection items in the preset HIL detection list, the fault location location information of the component under test will be obtained, and the fault location location information will be displayed.

In this embodiment, a fault location test platform is built based on the combination of HALT box and HIL test components. The HALT box applies stress to the component under test to expose defects and discover fault phenomena, and then uses the powerful signal of the HIL test component. The functions of generating and receiving processing can quickly locate the specific fault location of the device under test without having to completely locate the fault location. Therefore, it can greatly shorten the time of hardware development and upgrade and improve work efficiency.

Specifically, in the step of applying stress to the component under test pre-placed in the HALT box through the HALT box, and if a fault occurs, generating a fault location detection signal according to the fault phenomenon, it also includes:

Use the HALT box to perform a highly accelerated life aging test on the tested part to verify whether the vibration limit and high and low temperature limits of the tested part reach or exceed the required values. If the required values are reached and there are no faults, the test is passed; If the device under test fails before meeting the requirements, a fault location detection signal is generated based on the fault phenomenon.

In this embodiment, if the external stress exceeds the HALT box specification and there is still no failure, the device under test passes the test.

Specifically, the step of establishing a connection between the HIL test component and the device under test includes:

Import the preset HIL detection list and the pin information of the device under test. The preset HIL detection list includes detection items of multiple components and the detection parameters corresponding to each detection item. Based on the preset HIL detection list and the device under test The pin information is used to build a simulink vehicle model, and the connection between the HIL test component and the device under test is established through the simulink vehicle model.

It should be understood that the simulink model is built according to the program and pin definition of the device under test. Use HIL's ConfigurationDesk to establish a connection between the controller under test (i.e. the device under test) and the HIL bench (i.e. HIL test component) through the built simulink vehicle model.

ConfigerationDesk is a tool of HIL. You can use it to set the PWM, current, resistance, voltage, CAN and other input and output interfaces required by various controllers under test. You can also receive feedback signals from the controller under test through these interfaces (for example: CAN message, PWM, voltage, etc.), at the same time, build a simulink vehicle model that adapts to this, and connect the controller to be tested and the HIL bench through these interfaces, so that any required controller to be tested can be sent signal and monitor the feedback data of the controller under test in real time; through the logic calculation of the simulink vehicle model, the feedback results of the controller under test are displayed in the parameter display area of the HIL bench to achieve real-time monitoring of the controller under test during the HALT test. status.

In order to improve the readability of the collected signals and facilitate better display in the ControlDesk console, the detection parameters need to be configured. Logical processing of current, resistance, voltage and other signals can be performed. For example, the unit of voltage collected is V, but the reading is very small. You can multiply the output value by 1000 in the simulink vehicle model and convert it into mV, for example, 0.01V is converted into 10mV. Improve readability and make it less error-prone.

In this embodiment, the HIL test component is connected to the device under test by building a simulink vehicle model, and fault detection and location of the device under test are performed through the simulink vehicle model.

Specifically, the step of testing the CAN communication module of the device under test through the HIL test component includes:

Use the HIL test component to detect whether the CAN signal of the device under test is received. If the CAN signal of the device under test is received, enter the step of detecting component failure of the device under test;

If the CAN signal of the device under test is not received, the power module of the device under test is powered on and detected. If the information that the power module is faulty is obtained, the fault location is located as the power module of the device under test is faulty. If the power module is detected, If the information is normal, the fault location is located as there is a fault in CAN communication.

It should be understood that during the HALT test, it was found that all CAN signals are no longer updated and CAN cannot be used to send instructions. However, all hard-wired signals and other non-CAN signals are not affected. For example, when the handle is pushed to the forward position, the forward solenoid valve signal will If there is an output, it means that a certain chip or component of the CAN module is faulty.

In this embodiment, the controller to be tested (i.e., the device under test) is connected to the HIL bench (i.e., the HIL test component), placed in the HALT box and fixed, and the controller to be tested is verified to function normally, and then the HALT test is performed. After a fault occurs, the fault location is located on the controller under test through the HIL bench.

As shown in Figure 2, the following example illustrates the process of data analysis of component failures of the device under test in the HIL test component:

One of the fault types, resistor component failure:

Use the simulink vehicle model to perform resistance component fault detection on the device under test. If the vehicle fuel level model reading shows abnormality, and the vehicle fuel level model reading shows a different resistance value that is not input by the HIL test component. If the signal changes, the fault location is located as a resistive component fault.

It should be understood that if the controller power module and CAN communication module work normally: If the vehicle fuel level model reading shows abnormality, and the reading does not change with the change of the HIL input resistance signal, the controller fuel level resistance calculation chip or Resistor failure.

For example, if the oil quantity signal does not change with the input, it is determined that the oil quantity module is faulty.

Fault type two, speed acquisition chip failure:

Use the simulink vehicle model to perform speed acquisition chip fault detection on the tested part. If the vehicle drum speed module reading shows abnormality, and the vehicle drum speed module reading does not change with the different PWM signals input by the HIL test component, Then the fault location is located as the fault of the speed acquisition chip.

It should be understood that if the controller power module and CAN communication module work normally: If the vehicle drum speed module reading shows abnormality and the reading does not change with the change of the HIL input PWM signal, the controller speed acquisition pin or speed logic processing chip is faulty. .

For example, if the drum speed display is wrong, it is determined that the speed processing chip is faulty.

The speed unit collected in the controller is generally rpm/s, while the displayed speed unit of the vehicle is rpm/min. In order to improve the readability of the test, such signals need to be logically processed in the model. The collected speed signal is multiplied by 60 and displayed, and the output signal is divided by 60 and sent to the controller.

Fault type three, voltage acquisition chip failure:

Use the simulink vehicle model to perform voltage acquisition chip fault detection on the device under test. If the vehicle handle voltage reading shows abnormality, and the vehicle handle voltage reading does not change with the different voltage signals input by the HIL test component, then there is a fault. The location is located as a voltage acquisition chip failure.

It should be understood that if the controller power module and CAN communication module work normally: if the vehicle handle voltage reading shows abnormality and the reading does not change with the change of the HIL input voltage signal, the controller voltage signal acquisition pin or voltage processing chip is faulty.

For example, if the voltage display of the handle is wrong, it is determined that the voltage acquisition chip is faulty.

It should be understood that there are many types of faults and are not limited to the above examples.

In the above-mentioned embodiments, all faults can be received based on the feedback information of the device under test based on the built fault location test platform, and directly and accurately determine which module has failed. Further, the preset HIL detection list can be queried through the simulink model. The detection project corresponding to the fault phenomenon is implemented on the tested part to locate the fault, shortening the time spent on troubleshooting and locating the fault location, and improving work efficiency. At the same time, HIL's powerful signal generation and reception processing functions can be used to achieve full functional coverage monitoring HALT The status of the device under test during the test is something that currently cannot be achieved by flashing test programs on the device under test (such as PCB board).

As shown in Figure 3, an embodiment of the present invention provides a fault location locating system based on HALT and HIL, including:

A test platform building module is used to build a fault location test platform, which includes a HALT box and HIL test components;

A HALT detection module, used to apply stress to the tested component pre-placed in the HALT box through the HALT box, and if a fault occurs, generate a fault location detection signal based on the fault phenomenon;

A HIL fault location module, configured to establish a connection between the HIL test component and the device under test when the HIL test component receives the fault location detection signal, and to conduct testing on the device under test through the HIL test component. CAN communication module detection, if there is no fault in the CAN communication module, the component fault detection is performed on the component under test according to the detection items in the preset HIL detection list, the fault location information of the component under test is obtained, and the fault location is obtained Location information is displayed.

Specifically, in the HIL fault location module, the HIL test component is connected to the device under test, specifically as follows:

Import the preset HIL detection list and the pin information of the device under test. The preset HIL detection list includes detection items of multiple components and the detection parameters corresponding to each detection item. Based on the preset HIL detection list and the device under test The pin information is used to build a simulink vehicle model, and the connection between the HIL test component and the device under test is established through the simulink vehicle model.

Specifically, in the HIL fault location module, the CAN communication module detection of the device under test is performed through the HIL test component, specifically as follows:

Use the HIL test component to detect whether the CAN signal of the device under test is received. If the CAN signal of the device under test is received, enter the step of detecting component failure of the device under test;

If the CAN signal of the device under test is not received, the power module of the device under test is powered on and detected. If the information that the power module is faulty is obtained, the fault location is located as the power module of the device under test is faulty. If the power module is detected, If the information is normal, the fault location is located as there is a fault in CAN communication.

The present invention uses HIL bench modeling to connect with the controller, which can provide all types of input signals of the device under test and monitor all output signals of the device under test. It not only truly realizes 100% of the functions of testing the device under test, but also avoids neglecting the HALT test. It exposes obscure and difficult-to-find faults, and can interact with the device under test in real time, accurately locate the fault location based on monitoring data, narrow the scope of troubleshooting, greatly shorten the time spent on troubleshooting, and improve the development efficiency of circuit PCB boards.

In comparison, burning a special test program on the PCB board during the HALT test not only fails to achieve 100% functional coverage of the device under test, that is, it cannot avoid ignoring hard-to-find faults; it also cannot interact with the device under test in real time. Then to locate the fault location, we can only determine whether the component under test is still working normally.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations are mutually exclusive. any such actual relationship or sequence exists between them. Furthermore, the terms "comprises," "comprises," or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment.

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. A fault location method based on HALT and HIL, comprising:

building a fault positioning test platform, wherein the fault positioning test platform comprises a HALT box and an HIL test assembly;

applying stress to a detected piece which is placed in the HALT box in advance through the HALT box, and generating a fault position detection signal according to a fault phenomenon if a fault occurs;

when the HIL test assembly receives the fault position detection signal, the HIL test assembly is connected with the tested piece, the tested piece is detected through the HIL test assembly by a CAN communication module, if the CAN communication module has no fault, component fault detection is carried out on the tested piece according to detection items in a preset HIL detection list, fault position positioning information of the tested piece is obtained, and the fault position positioning information is displayed.

2. The fault location method of claim 1, wherein the step of establishing a connection between the HIL test assembly and the test object comprises:

and importing a preset HIL detection list and pin information of the detected piece, wherein the preset HIL detection list comprises detection items of a plurality of components and detection parameters corresponding to the detection items, a simulink whole vehicle model is built based on the preset HIL detection list and the pin information of the detected piece, and connection between the HIL test assembly and the detected piece is built through the simulink whole vehicle model.

3. The fault location method according to claim 2, wherein the step of performing CAN communication module detection on the object to be detected by the HIL test assembly includes:

detecting whether a CAN signal of a detected piece is received or not through the HIL test assembly, and if the CAN signal of the detected piece is received, entering a step of detecting the fault of a component of the detected piece;

if the CAN signal of the tested piece is not received, the power module of the tested piece is electrified and detected, if the information of the fault of the power module is obtained, the fault position is positioned as the fault of the power module of the tested piece, and if the information of the normal power module is obtained, the fault position is positioned as the fault of CAN communication.

4. The fault location method according to claim 2, wherein the step of performing component fault detection on the test piece according to a detection item in a preset HIL detection list includes:

and detecting the faults of the resistance type components of the tested piece through the simulink whole car model, and if the readings of the whole car fuel oil level model are abnormal and the readings of the whole car fuel oil level model are not changed along with different resistance value signals input by the HIL test assembly, locating the fault position as the faults of the resistance type components.

5. The fault location method according to claim 2, wherein in the step of performing component fault detection on the tested piece according to the detection items in the preset HIL detection list, the method further comprises:

and detecting faults of the rotating speed acquisition chip on the detected piece through the simulink whole car model, and if the readings of the whole car roller rotating speed module are abnormal and the readings of the whole car roller rotating speed module are not changed along with different PWM signals input by the HIL test assembly, positioning the fault position as the faults of the rotating speed acquisition chip.

6. The fault location method according to claim 2, wherein in the step of performing component fault detection on the tested piece according to the detection items in the preset HIL detection list, the method further comprises:

and performing voltage acquisition chip fault detection on the tested piece through the simulink whole vehicle model, and if the voltage reading of the whole vehicle handle is abnormal and the voltage reading of the whole vehicle handle is not changed along with different voltage signals input by the HIL test assembly, positioning the fault position as a voltage acquisition chip fault.

7. The fault location method according to any one of claims 1 to 6, wherein in the step of applying stress to the test piece previously placed in the HALT box through the HALT box, if a fault occurs, generating a fault location detection signal according to a fault phenomenon, further comprising:

the HALT box is used for carrying out high-acceleration life aging detection on the detected piece, verifying whether the vibration limit and the high-temperature limit and the low-temperature limit of the detected piece reach or exceed required values, and if the vibration limit and the high-temperature limit and the low-temperature limit reach the required values and have no faults, detecting the vibration limit and the high-temperature limit and the low-temperature limit of the detected piece pass; if the tested piece fails before meeting the requirement, generating a failure position detection signal according to the failure phenomenon.

8. A HALT and HIL-based fault location system comprising:

the test platform building module is used for building a fault location test platform, and the fault location test platform comprises a HALT box and an HIL test assembly;

the HALT detection module is used for applying stress to a detected piece which is placed in the HALT box in advance through the HALT box, and if the detected piece fails, a failure position detection signal is generated according to a failure phenomenon;

and the HIL fault positioning module is used for establishing connection between the HIL test assembly and the tested piece when the HIL test assembly receives the fault position detection signal, detecting the tested piece through the HIL test assembly by using the CAN communication module, if the CAN communication module has no fault, detecting the fault of the tested piece by using the components according to the detection items in the preset HIL detection list, obtaining the fault position positioning information of the tested piece, and displaying the fault position positioning information.

9. The fault location system according to claim 8, wherein in the HIL fault location module, the HIL test component is connected to the tested piece, specifically:

and importing a preset HIL detection list and pin information of the detected piece, wherein the preset HIL detection list comprises detection items of a plurality of components and detection parameters corresponding to the detection items, a simulink whole vehicle model is built based on the preset HIL detection list and the pin information of the detected piece, and connection between the HIL test assembly and the detected piece is built through the simulink whole vehicle model.

10. The fault location system according to claim 9, wherein in the HIL fault location module, the detection of the CAN communication module on the tested piece by the HIL test component is specifically:

detecting whether a CAN signal of a detected piece is received or not through the HIL test assembly, and if the CAN signal of the detected piece is received, entering a step of detecting the fault of a component of the detected piece;

if the CAN signal of the tested piece is not received, the power module of the tested piece is electrified and detected, if the information of the fault of the power module is obtained, the fault position is positioned as the fault of the power module of the tested piece, and if the information of the normal power module is obtained, the fault position is positioned as the fault of CAN communication.