CN117692735A - Method for manufacturing protection device of optical acquisition device, the device and electronic equipment - Google Patents
Method for manufacturing protection device of optical acquisition device, the device and electronic equipment Download PDFInfo
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- CN117692735A CN117692735A CN202311581470.7A CN202311581470A CN117692735A CN 117692735 A CN117692735 A CN 117692735A CN 202311581470 A CN202311581470 A CN 202311581470A CN 117692735 A CN117692735 A CN 117692735A
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Abstract
Embodiments of the present disclosure provide a method of manufacturing a protection device for an optical pickup device, the device, and an electronic apparatus. The manufacturing method is used for a protective device of an optical acquisition device of electronic equipment, wherein the protective device contains one or more of glass and sapphire materials, and comprises the following steps of: providing separate first and second sub-components, respectively, wherein the first sub-component is for covering the optical pickup device and the second sub-component is configured with a receiving space for arranging the optical pickup device; the first sub-assembly and the second sub-assembly are joined together to form the protective device.
Description
Technical Field
The disclosure relates to a manufacturing method of a protection device of an optical acquisition device, the device and electronic equipment, in particular to a processing technology of a camera protection device and a composite structure obtained by the processing technology.
Background
This section is intended to provide background information related to understanding the various techniques described herein. As implied by the headings in this section, this is a discussion of the related art that should not be implied in any way. Accordingly, it should be understood that any statement in this section should be read from this perspective and not as an admission of prior art.
At present, cameras of mobile phones are stacked under a metal or plastic support structure, the outer surface of the cameras is protected by a piece of protective glass or sapphire, and the surface glass or the sapphire plays a role in protection, and meanwhile, images cannot be influenced, so that two key parameters of transmittance and optical interference can be controlled. In order to pursue the best of products, the prior art needs to omit a metal or plastic structure device, which requires to perform groove processing on glass, but the groove processing mode cannot adopt engraving processing, and optical interference may seriously affect the image function.
Disclosure of Invention
According to an aspect of the present disclosure, there is provided:
a method of manufacturing a protective device for an optical acquisition device of an electronic device, wherein the protective device comprises one or more of glass, sapphire material, the method comprising the steps of:
providing separate first and second sub-components, respectively, wherein the first sub-component is for covering the optical pickup device and the second sub-component is configured with a receiving space for arranging the optical pickup device;
the first sub-assembly and the second sub-assembly are joined together to form the protective device.
According to one embodiment of the present disclosure, in the preparing step, the first sub-member is configured in a disc shape, and the second sub-member is configured in a circular ring disc shape.
According to one embodiment of the present disclosure, the first and second sub-components are adhesively connected together.
According to one embodiment of the present disclosure, the preparing of the first sub-component includes: grinding a first end surface of the first sub-component to adjust the thickness of the first sub-component and/or the surface quality of the first end surface; cutting and/or grinding a first sidewall of the first sub-component to adjust an outer dimension of the first sub-component and/or a surface quality of the first sidewall.
According to one embodiment of the present disclosure, in the preparing step, ink is applied to the first end face of the first sub-component to form a first ink zone for defining an optical collection range of the optical collection device and limiting visibility of the optical collection device.
According to one embodiment of the present disclosure, the preparing of the second sub-component includes: grinding a second end surface of the second sub-component to adjust the thickness of the second sub-component and/or the surface quality of the second end surface; cutting the second sub-component to create the receiving space; cutting and/or grinding a second sidewall of the second sub-component to adjust an outer dimension of the second sub-component and/or a surface quality of the second sidewall.
According to one embodiment of the present disclosure, after the first and second sub-components are connected together, the first and second sidewalls of the first and second sub-components are ground to adjust the outer dimensions of the first and second sub-components.
According to one embodiment of the present disclosure, after the first and second sub-members are joined together, ink is applied to the second end face of the second sub-member to form a second ink region that overlaps the first ink region in the thickness direction of the protective device.
According to another aspect of the present disclosure, there is provided a protection device for an optical pickup device of an electronic apparatus, wherein the protection device is manufactured by any one of the manufacturing methods described above.
According to still another aspect of the present disclosure, there is provided an electronic apparatus, wherein the electronic apparatus includes the above-mentioned protection device and an optical pickup device disposed in the accommodation space, the protection device being disposed on a housing of the electronic apparatus.
According to one embodiment of the disclosure, the electronic device is a mobile phone or a tablet computer, and the optical acquisition device is a rear camera.
Drawings
The above and other features of the present disclosure will become apparent with reference to the drawings, in which,
FIG. 1 illustrates a flow diagram of a method of manufacturing according to an embodiment of the present disclosure;
FIG. 2 shows a schematic diagram of a first sub-component as a raw material in accordance with an embodiment of the present disclosure;
FIG. 3 illustrates a schematic view of a first sub-assembly with excess portions to be cut away according to an embodiment of the present disclosure;
FIG. 4 illustrates a schematic view of a grinding wheel batch grinding of a first sub-assembly according to an embodiment of the present disclosure;
FIG. 5 illustrates a state diagram of a first sub-assembly after printing ink in accordance with an embodiment of the present disclosure;
FIG. 6 illustrates a state diagram of a second sub-assembly after forming an internal bore according to an embodiment of the present disclosure;
FIG. 7 illustrates a schematic view of a grinding wheel grinding an inner wall of a second sub-assembly according to an embodiment of the present disclosure;
FIG. 8 illustrates a schematic view of a second sub-assembly with excess portions to be cut away according to an embodiment of the present disclosure;
FIG. 9 illustrates a schematic diagram of a flat grinder batch grinding protection device according to an embodiment of the present disclosure;
fig. 10 shows a schematic structural view of a protection device according to an embodiment of the present disclosure;
FIG. 11 illustrates a block diagram of a protection device according to an embodiment of the present disclosure; and
fig. 12 shows a combined schematic of a protection device and an optical acquisition device according to an embodiment of the present disclosure.
Detailed Description
It is to be readily understood that, in accordance with the teachings of the present disclosure, those skilled in the art may devise various arrangements and implementations that may be interchanged without departing from the true spirit of the present disclosure. Accordingly, the following detailed description and drawings are merely illustrative of the presently disclosed technology and are not to be considered as an all-or-as-limited or restrictive of the presently disclosed technology.
Terms of orientation such as up, down, left, right, front, rear, front, back, top, bottom, etc. mentioned or possible to be mentioned in the present specification are defined with respect to the configurations shown in the drawings, which are relative concepts, and thus may be changed according to different positions and different use states thereof. These and other directional terms should not be construed as limiting terms. Furthermore, the terms "first," "second," "third," and the like are used for descriptive and distinguishing purposes only and are not to be construed as indicating or implying a relative importance of the corresponding components.
It should also be noted that the naming of the various method steps herein is merely for convenience of distinction and reference, and does not represent a necessarily sequential order of the method steps (unless explicitly stated), which may be performed in a manner that adjusts the order of implementation or even simultaneously.
Referring to fig. 1 to 5, which respectively show flow diagrams of a manufacturing method according to an embodiment of the present disclosure; a schematic illustration of a first sub-component as a raw material according to an embodiment of the present disclosure; a schematic illustration of a first sub-assembly with excess portions to be cut away according to an embodiment of the present disclosure; schematic of batch grinding of a first sub-component with a grinding wheel according to an embodiment of the present disclosure; and a state diagram of a first sub-assembly after printing ink according to an embodiment of the present disclosure.
The manufacturing method is used for the protection device 1 of the optical acquisition device 2 of the electronic equipment, wherein the protection device 1 contains one or more of glass and sapphire materials, and comprises the following steps:
s1: preparing separate first and second sub-components 11, 12, respectively, wherein the first sub-component 11 is for covering the optical pickup device 2 and the second sub-component 12 is configured with a receiving space 121 for arranging the optical pickup device 2;
s2: the first sub-part 11 and the second sub-part 12 are connected together to form the protection device 1.
Those skilled in the art will appreciate that references to sapphire are exemplary of the generic name for corundum stones other than ruby, with the main constituent being alumina (Al 2 O 3 ) There may be pink, yellow, green, white, etc. colors, even in the same stone, where blue sapphire is due to a small amount of titanium (Ti) and iron (Fe) impurities mixed therein.
It should also be understood that the covering of the first sub-component with respect to the optical acquisition device means that the "front side" of the device (i.e. the optical acquisition face) is covered by the first sub-component to provide a protective effect. Optionally, the second sub-component can also play a role in protecting the optical collection device on the side and the front of the device while accommodating the optical collection device, so that the function of the protection device is fully exerted. In the technical scheme, the technical conception that the first sub-component and the second sub-component are manufactured independently and then are connected to form the protection device is adopted, the two components can be designed and processed more pertinently and independently, subsequent operations such as transportation, maintenance and assembly can be performed, and the cost is more controllable. In addition, a large number of first sub-components and second sub-components can be prepared simultaneously, and the first sub-components or the second sub-components can be processed simultaneously in the preparation process, so that a plurality of protection devices are finally formed. The present disclosure may thus also support mass production, improving efficiency and reducing costs. In addition, the glass adopted by the technical scheme has the advantages that: is firm and durable; transparent and bright; the cleaning is easy; chemically stable. Advantages of sapphire include: the hardness is high; the stability is good; the mechanical strength is high; high transparency. Compared with the metal or plastic commonly used in the prior art.
It is possible that in the preparation step there is a step S11: the first sub-part 11 is configured in the shape of a disk, and the second sub-part 12 is configured in the shape of a circular disk. A "disc-shaped" is generally understood to mean a round (cylindrical) body with an outer diameter substantially greater than the thickness, which form of sub-parts is easier to manufacture and assemble on the one hand, and on the other hand also to match the structural shape of a conventional optical acquisition device and is capable of providing a certain aesthetic appearance. Of course, although not described in detail in this disclosure, other shapes of the sub-components may be used if desired, such as square or irregular shapes, etc., and particularly may be adapted to take into account the shape of the optical acquisition device to be mated.
Regarding the manner of connection of the two sub-components, step S21 is designed in some embodiments of the present disclosure: the first sub-part 11 and the second sub-part 12 are joined together by means of gluing (the formed adhesive layer 13 is shown in fig. 11). The benefits of gluing include: the adhesive force is strong; is convenient and easy to use; the support for various materials to be connected is strong. In particular, UV glue (UV curable glue) can be used to connect the two, which has advantages including safety and environmental protection in addition to the general advantages of gluing as previously described; the curing speed is high; high transparency, and the like. If such means are used, it should be specifically noted that the UV glue line for joining the two sub-members is made to be completely closed (when not dispensing the glue completely, the glue line may be broken and not closed, so that the two sub-members may be dislocated when being joined).
In some embodiments of the present disclosure, the preparation of the first sub-component 11 includes: step S12: grinding the first end face 111 of the first sub-part 11 to adjust the thickness of the first sub-part 11 and/or the surface quality of the first end face 111; the first side wall 112 of the first sub-part 11 is cut and/or ground to adjust the outer dimensions of the first sub-part 11 and/or the surface quality of the first side wall 112.
It will be appreciated that in the case where the respective sub-components are circular, the outer dimension is the outer diameter; in the case of a flat sub-part, the end faces are generally understood to be the upper and lower faces, the side walls being peripheral faces. The grinding can be realized by adopting a flat grinder, and the method has the advantages of high precision, high efficiency, high degree of automation, wide application range and the like. In addition, while the thickness (or outer dimension) and surface quality adjustments described herein may all be achieved by the same process (e.g., grinding), it is not necessarily meant to be accomplished in the same process step, nor is it necessarily meant that the thickness (or outer dimension) and surface quality are accomplished in the same process step all together, but may be accomplished in multiple sub-steps or multiple grinding machines, it being understood that the order of operation may be reversed, e.g., the order of sidewall and end face treatments may be reversed. The specific operation mode is flexible, and the flexibility can be set according to actual needs.
By way of example only, the raw material of the first sub-component (which may be rough, for example by physical grinding to a predetermined size, thickness, with some margin for subsequent re-processing) is first obtained and subjected to double-sided grinding by a flat grinder for 40 minutes such that its overall thickness is reduced by 0.1mm. The laser cutting mode is adopted to cut off the redundant part, namely the part 113 (figure 3) of the outer edge, so as to obtain the advantages of high cutting precision, saving of die investment, high cutting speed, low later maintenance cost and the like. Further, the outer sidewall was polished off a single side 0.1mm (i.e., reduced in diameter by 0.2 mm) using a 400 mesh grinding wheel, and laser cut burrs were removed, wherein mesh refers to the number of holes per inch of screen, 400 mesh refers to having 400 mesh numbers 1 in an area of 1 inch by 1 inch, and it is used to represent the particle size of particles passing through the screen in addition to the holes representing the screen, the higher the mesh number, the smaller the particle size, and the better the quality. Still further, the first sub-member is double-sided refined for 20 minutes using a flat grinder to remove surface-related residues and appearance defects such as scratches (so-called scratches may include point-like stabs, dent points) and the like. It follows that in this example the first sub-part thickness and surface quality are twice flat ground (rough and fine ground) and the outer wall is also twice treated (laser cut and grinding wheel ground) in order to obtain a first sub-part with accurate dimensional control and better surface quality. In addition, the laser cutting or rough machining can be replaced by CNC (computer numerical control, numerical control machining) to perform machining, and the method is high in automation degree, precision, production efficiency and machining capacity.
In addition, as previously mentioned, various sub-components may be processed in batches. As can be seen in fig. 4, which schematically depicts the grinding wheel 3, the first set of sub-components 100, which is stacked from the first sub-components 11, and the glue stick 4. The first sub-assembly is disposed between the grinding wheel and the glue stick for batch grinding thereof. The glue stick 4 serves to locate and prevent movement of the workpiece. When the workpiece is machined on the flat grinder, the rubber rod can be used as a positioning element to fix the workpiece on a workbench of the flat grinder, so that the workpiece is prevented from moving in the machining process. Meanwhile, the rubber rod can play a role in vibration reduction, and vibration and impact generated in the processing process of the workpiece are reduced. Since the structure of the machine itself is not the focus of this disclosure, it will not be described in detail here.
Further, in the preparation step, there is provided a step S13 of: ink is applied to the first end face 111 of the first sub-assembly 11 to form a first ink zone 1111 for defining the optical collection range of the optical collection device 2 and limiting the visibility of the optical collection device 2. That is, the printing ink serves to form a window/boundary of the optical pickup device and to block the structure of the optical pickup device from being externally visible to a user or a photographed person, thereby enabling to provide a certain aesthetic degree. Of course, in some special applications, it is also conceivable to cancel the setting of the ink zone in order to maximize the imaging range of the optical pickup device.
Referring to fig. 6-8, a state diagram of a second sub-assembly after forming an internal bore is shown, respectively, in accordance with an embodiment of the present disclosure; a schematic diagram of grinding an inner wall of a second sub-assembly with a grinding wheel according to an embodiment of the present disclosure; and a second sub-assembly with a schematic view of the excess portion to be cut away according to an embodiment of the present disclosure.
The preparation of the second sub-assembly 12 includes: step S14: grinding the second end face 122 of the second sub-component 12 to adjust the thickness of the second sub-component 12 and/or the surface quality of the second end face 122; cutting the second sub-assembly 12 to manufacture the receiving space 121; cutting and/or grinding the second side wall 123 of the second sub-part 12 to adjust the outer dimension of the second sub-part 12 and/or the surface quality of the second side wall 123. The implementation manner and technical effects of the steps can be read with respect to the first sub-component, and are not repeated.
Also, as just one example, a sapphire raw material (which may be rough) is first obtained, subjected to double-sided grinding by a flat grinder for 40min so that the entire thickness is thinned by 0.1mm, an inner hole is formed by laser cutting, an inner wall is CNC finished (fig. 7, the inner wall of the second sub-component is ground by using the CNC grinding wheel bar 5), and an unnecessary portion, namely, an outer wall edge portion 124 (fig. 8) is cut by laser. Thereafter, the outer side wall of the second sub-assembly was polished off the single side 0.1mm using a 400 mesh grinding wheel to remove laser cut burrs. If necessary, it is also possible to obtain a greater size and surface quality in a manner similar to the previously refined end faces.
Referring to fig. 9 to 12, schematic diagrams of a batch grinding protection device of a flat grinder according to an embodiment of the present disclosure are respectively shown; a schematic structural view of a protection device according to an embodiment of the present disclosure; a block diagram of a protection device according to an embodiment of the present disclosure; and a combined schematic of a protection device and an optical acquisition device according to embodiments of the present disclosure. It should be noted that the block diagram of fig. 11 is a schematic cross-sectional view (not shown in cross-section line), that is, the second sub-component 12 is represented by two blocks in the figure, but actually corresponds to two portions of the same second sub-component.
As can be seen, after the first sub-part 11 and the second sub-part 12 are connected together, a step S3 is provided: the first side wall 112 of the first sub-part 11 and the second side wall 123 of the second sub-part 12 are ground to adjust the outer dimensions of the first sub-part 11 and the second sub-part 12. This is to ensure that the amount of misalignment that may occur when connecting the two sub-components together is eliminated. It should be noted here that the final outer dimensions of the two sub-components may be adjusted to be identical or to be different, depending on the actual design.
Furthermore, after the first sub-part 11 and the second sub-part 12 are connected together, a step S4 is provided: the second end face 122 of the second sub-member 12 is applied with ink to form a second ink region which overlaps the first ink region 1111 in the thickness direction of the protection device 1 so as to ensure that the limits of the two ink regions on the range and visibility of the optical pickup device are uniform and also to exert a technical effect of light leakage prevention. Of course, in the case where there is no first ink region, it is also conceivable to cancel the setting of the second ink region; or the layout position or size and shape of the second ink area is different from that of the first ink area.
Illustratively, one specific example of the present disclosure employs the following manner to manufacture the overall structure of the protective device: dispensing UV glue on the back side of the first sub-part (i.e. the end surface to be connected with the second sub-part) by a dispenser, bonding the two sub-parts by an automatic alignment machine (the outer diameters of the two sub-parts can be consistent in the preparation step), and adopting 3000mJ/cm 2 The energy UV light is irradiated and solidified for 10 seconds, the outer side wall of each sub-component is ground to form 0.1-0.15mm on one side (so as to prevent dislocation), the outer side walls are ground to be uniform and consistent, no break difference is guaranteed, the outer side wall is further polished finely (figure 9), and the back surface (the surface close to the shell of the electronic equipment in use) of the second sub-component is sprayed with ink. Optionally, the protection device is subjected to surface treatment, wherein the surface treatment comprises AF (Anti-Fingerprint) Anti-Fingerprint treatment, and finally a finished product is formed.
It should be noted that, the protection device or its sub-components are usually "small pieces", and the side wall of the protection device is not polished by the conventional process, but a special jig is required to be driven by rotation to achieve uniform polishing. Polishing the sub-components individually and then bonding may have the risk of experiencing a gap such that the bonding cannot coincide by 100%.
A batch polishing method for the protector is exemplarily shown in fig. 9, and includes a brush 6, a protector group 200 composed of a plurality of protectors 1, a jig (or referred to as a jig) 7, and a grinding disc 8. In use, the brush rotates clockwise with the abrasive disc on the machine (not shown), while the underlying jig rotates counter-clockwise with the set of protective devices. When the machine runs, the hairbrush is tightly pressed on the side wall of the protection device group, and the hairbrush rubs against the side wall in the bidirectional rotation mode, so that the whole side surface can be polished, and an ideal polishing effect is achieved. Since the structure of the machine itself is not the focus of this disclosure, it will not be described in detail here.
According to other aspects of the present disclosure, the present disclosure also relates to a protection device 1 for an optical pickup device 2 of an electronic apparatus, wherein the protection device 1 is manufactured by any one of the manufacturing methods described above; and an electronic device, wherein the electronic device comprises the protection device 1 and the optical collection device 2 arranged (e.g. clamped) in the accommodating space 121, and the protection device 1 is arranged on a shell of the electronic device.
For the specific embodiments of the protection device and the electronic apparatus and the technical effects that can be achieved, please refer to the above explanation about the manufacturing method for explanation, and the description is omitted here. However, it should be understood that the electronic device is a mobile phone or a tablet computer, and the optical pickup device 2 is a rear camera, and in this case, the housing of the electronic device is a rear housing. Thereby, the protection device protrudes outwardly from the rear case. The technical scheme disclosed by the invention is suitable for common camera configuration in the market.
In summary, the present disclosure provides a protection device formed by connecting a first sub-component and a second sub-component, which may be a double-layer structure, and is formed by a novel processing technology, and when the protection device is applied to a rear camera of a mobile phone, a traditional metal or plastic decoration can be omitted from the rear camera structure of the mobile phone. The technology can well solve the contradiction mentioned in the background technology, the transmittance of the finished product is more than 90, the PV value is less than 0.6λ (under the condition of the wavelength of 632.5 nm), and the technology achieves the control standard of light interference. The PV value can be understood as a peak-valley value, which reflects the processing quality of the current optical surface, and is a common indicator of the surface shape quality of the optical surface. In addition, the technical effects that can also realize are: the visual impact is more remarkable, no boundary effect is presented, and the whole appearance is more round; the whole protection device is made of sapphire or glass materials, has strong scratch resistance and scratch resistance, and can not generate plating layer falling phenomena along with long service time.
It should be understood that all of the above preferred embodiments are exemplary and not limiting, and that various modifications or variations to the specific embodiments described above, which would be within the spirit of the present disclosure, would be within the legal scope of the present disclosure by those skilled in the art.
Claims (11)
1. A method of manufacturing a protective device for an optical acquisition device of an electronic device, the protective device comprising one or more of glass, sapphire material, the method comprising the steps of:
providing separate first and second sub-components, respectively, wherein the first sub-component is for covering the optical pickup device and the second sub-component is configured with a receiving space for arranging the optical pickup device;
the first sub-assembly and the second sub-assembly are joined together to form the protective device.
2. The manufacturing method according to claim 1, wherein in the preparation step, the first sub-member is configured in a disc shape, and the second sub-member is configured in a circular disc shape.
3. A method of manufacturing according to claim 1 or 2, characterized in that the first and second sub-parts are connected together by means of gluing.
4. The manufacturing method according to claim 1 or 2, wherein the preparation of the first sub-component comprises: grinding a first end surface of the first sub-component to adjust the thickness of the first sub-component and/or the surface quality of the first end surface; cutting and/or grinding a first sidewall of the first sub-component to adjust an outer dimension of the first sub-component and/or a surface quality of the first sidewall.
5. A method of manufacturing according to claim 1 or 2, wherein in the preparing step ink is applied to the first end face of the first sub-component to form a first ink zone for defining the optical collection range of the optical collection device and limiting the visibility of the optical collection device.
6. The manufacturing method according to claim 1 or 2, wherein the preparation of the second sub-component comprises: grinding a second end surface of the second sub-component to adjust the thickness of the second sub-component and/or the surface quality of the second end surface; cutting the second sub-component to create the receiving space; cutting and/or grinding a second sidewall of the second sub-component to adjust an outer dimension of the second sub-component and/or a surface quality of the second sidewall.
7. The method of manufacturing according to claim 1 or 2, wherein after the first and second sub-parts are joined together, the first and second side walls of the first and second sub-parts are ground to adjust the outer dimensions of the first and second sub-parts.
8. The method of manufacturing according to claim 5, wherein after the first sub-component and the second sub-component are joined together, ink is applied to the second end face of the second sub-component to form a second ink region, the second ink region overlapping the first ink region in a thickness direction of the protective device.
9. A protection device for an optical pickup device of an electronic apparatus, characterized in that the protection device is manufactured by the manufacturing method according to any one of claims 1 to 8.
10. An electronic device, characterized in that it comprises a protection device according to claim 9 and an optical pickup device arranged in the accommodation space, the protection device being arranged on a housing of the electronic device.
11. The electronic device of claim 10, wherein the electronic device is a cell phone or tablet computer and the optical acquisition device is a rear camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311581470.7A CN117692735A (en) | 2023-11-23 | 2023-11-23 | Method for manufacturing protection device of optical acquisition device, the device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311581470.7A CN117692735A (en) | 2023-11-23 | 2023-11-23 | Method for manufacturing protection device of optical acquisition device, the device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117692735A true CN117692735A (en) | 2024-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311581470.7A Pending CN117692735A (en) | 2023-11-23 | 2023-11-23 | Method for manufacturing protection device of optical acquisition device, the device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117692735A (en) |
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2023
- 2023-11-23 CN CN202311581470.7A patent/CN117692735A/en active Pending
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