CN117690939A - Flexible flicker screen, preparation method thereof and radiographic image sensor - Google Patents
Flexible flicker screen, preparation method thereof and radiographic image sensor Download PDFInfo
- Publication number
- CN117690939A CN117690939A CN202311608354.XA CN202311608354A CN117690939A CN 117690939 A CN117690939 A CN 117690939A CN 202311608354 A CN202311608354 A CN 202311608354A CN 117690939 A CN117690939 A CN 117690939A
- Authority
- CN
- China
- Prior art keywords
- layer
- flexible
- scintillator
- substrate
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 326
- 239000000758 substrate Substances 0.000 claims abstract description 150
- 239000011241 protective layer Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000005855 radiation Effects 0.000 claims abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims description 27
- 239000002131 composite material Substances 0.000 claims description 22
- 239000011888 foil Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 abstract description 9
- 238000002834 transmittance Methods 0.000 abstract description 5
- 230000032900 absorption of visible light Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 210000000438 stratum basale Anatomy 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- MCVAAHQLXUXWLC-UHFFFAOYSA-N [O-2].[O-2].[S-2].[Gd+3].[Gd+3] Chemical compound [O-2].[O-2].[S-2].[Gd+3].[Gd+3] MCVAAHQLXUXWLC-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001748 luminescence spectrum Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
Landscapes
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Molecular Biology (AREA)
- High Energy & Nuclear Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measurement Of Radiation (AREA)
Abstract
The invention discloses a flexible scintillation screen, a preparation method thereof and a radiation image sensor. And stripping the flexible substrate layer, and forming a protective layer on the surface of the scintillator layer and the surface of the flexible support layer exposed after stripping the flexible substrate layer. The flexible substrate layer is removed after the rigid substrate is peeled off, and the flexible support layer which is tightly combined with the scintillator layer is adopted as a support structure of the scintillator layer, so that the phenomenon of separation or layering in the subsequent process due to poor adhesion between the flexible substrate layer and the scintillator layer is avoided, and the yield of products is influenced. The flexible substrate layer is removed, so that the absorption of visible light emitted by the scintillator layer by the flexible substrate layer can be avoided. The transmittance of visible light can be greatly improved, and the overall performance of the detector is further improved.
Description
Technical Field
The invention relates to the technical field of X-ray flat panel detectors, in particular to a flexible scintillation screen, a preparation method thereof and a radiation image sensor.
Background
With the rapid development of flat panel detectors, the demand for curved panel detectors is also increasing. In the X-ray flat panel detector industry, cesium iodide scintillation screens have low dosage, high resolution and high image quality, and become a mainstream product developed in the industry.
The scintillation screen is a component for converting X-rays into visible light in the X-ray flat panel detector, and can be converted into visible light photons when being excited by X-ray photons, and the visible light photons are further received by the photoelectric conversion panel to be converted into electron vacancy pairs, so that the electron vacancy pairs are read by a peripheral circuit to generate an image. Common scintillators are cesium iodide scintillators and gadolinium oxysulfide scintillators. The common substrates of the cesium iodide scintillation screen are a carbon substrate and an Al substrate, the substrate is generally a hard substrate which is inflexible and does not deform, and although vapor deposition is easy, the bending radian of the two substrates cannot be too large to adapt to the requirements of a curved surface detector, so that the requirements of the flexible cesium iodide scintillation screen are met.
However, in the existing preparation process of the flexible cesium iodide, if the cesium iodide scintillator is prepared on the flexible substrate, the problem of easy layering due to insufficient adhesion between the flexible substrate and the cesium iodide scintillator is unavoidable, which is unfavorable for the reliability of the scintillation screen, and also seriously affects the application scene of the detector in the market.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a flexible scintillator panel, a method for manufacturing the same, and a radiation image sensor, so as to improve the production yield of the flexible scintillator panel.
To achieve the above and other related objects, the present invention provides a method for manufacturing a flexible scintillator panel, including:
providing a rigid substrate, and forming a flexible substrate layer on the rigid substrate;
forming a scintillator layer on the flexible substrate layer;
forming a flexible support layer over the scintillator layer;
separating the flexible substrate layer from the rigid substrate by taking the flexible supporting layer as the substrate;
and stripping the flexible substrate layer, and forming a protective layer on the surface of the scintillator layer exposed after stripping the flexible substrate layer.
Optionally, after forming the flexible substrate layer on the rigid substrate, further comprising:
dividing the edge area of the flexible substrate layer from the central area, forming a coating area in the central area, forming a packaging area in the edge area, and forming a scintillator layer on the coating area of the flexible substrate layer.
Optionally, the step of forming a flexible support layer over the scintillator layer includes:
providing a flexible supporting layer;
coating an adhesive layer on the flexible supporting layer;
and attaching a flexible supporting layer with the adhesive layer on the surface of the scintillator layer. .
Optionally, the adhesive layer includes dispersed reflective particles therein.
Optionally, in the step of separating the flexible substrate layer from the rigid substrate, comprising:
a laser lift-off process is used to separate the flexible substrate layer from the rigid substrate.
Optionally, the step of peeling the flexible substrate layer comprises:
and sequentially stripping the coating area and the packaging area of the flexible substrate layer based on the cutting path between the coating area and the packaging area.
Optionally, the flexible support layer is a metal foil layer.
Optionally, the protective layer is a parylene layer.
According to another aspect of the present invention, there is also provided a flexible scintillation screen comprising:
a first protective layer including a central region and an edge region surrounding the central region;
a scintillator layer disposed on the central region of the protective layer;
the flexible supporting layer is arranged above the scintillator layer and completely covers the exposed surface of the scintillator layer and the edge area of the first protective layer;
the second protective layer is arranged on the surface of the flexible supporting layer.
Optionally, the flexible scintillation screen further comprises:
the adhesive layer is arranged on the surface of the scintillator layer and the edge area of the first protective layer, and the flexible supporting layer is arranged on the adhesive layer.
Optionally, reflective particles are dispersed in the adhesive layer.
Optionally, the flexible supporting layer is a metal foil layer, an organic film layer, and a composite film layer formed by compositing the metal foil and the organic film.
Optionally, the flexible supporting layer is a PET-Al composite film layer, and the thickness of the composite film layer is 20-150 mu m.
Optionally, the protective layer is a parylene layer, and the thickness of the parylene layer is 1-10 μm.
According to still another aspect of the present invention, there is also provided a radiation image sensor including:
the flexible scintillation screen is prepared by the preparation method of the flexible scintillation screen;
and the sensor array corresponds to the flexible flicker screen and is positioned on one side of the first protective layer close to the flexible flicker screen and used for converting the received visible light of the flexible flicker screen into an electric signal.
Compared with the prior art, the flexible scintillation screen and the preparation method thereof and the radiographic image sensor have at least the following beneficial effects:
the preparation method of the flexible scintillation screen comprises the steps of providing a rigid substrate, sequentially forming a flexible substrate layer, a scintillator layer and a flexible supporting layer on the rigid substrate, taking the flexible supporting layer as the substrate, and separating the flexible substrate layer from the rigid substrate. And stripping the flexible substrate layer, and forming a protective layer on the surface of the scintillator layer and the surface of the flexible support layer exposed after stripping the flexible substrate layer. In the preparation method of the flexible scintillation screen, the flexible substrate layer is removed after the rigid substrate is peeled off, and the flexible support layer which is tightly combined with the scintillator layer is adopted as the support structure of the scintillator layer, so that the phenomenon of separation or layering in the subsequent process due to poor adhesive force between the flexible substrate layer and the scintillator layer is avoided, and the yield of products is influenced. Meanwhile, the flexible substrate layer is removed, so that the absorption of visible light emitted by the scintillator layer by the flexible substrate layer can be avoided. A thin transparent protective layer is formed on the exposed scintillator layer, and compared with the flexible substrate layer, the visible light transmittance can be greatly improved, and the overall performance of the detector is further improved.
In addition, the flexible supporting layer is a composite film layer formed by compounding the metal foil layer, the organic film layer, the metal foil and the organic film, the flexible supporting layer and the scintillator layer made of the material can form better adhesive force, can bend along with the scintillator layer in a larger range, can not cause separation between the flexible supporting layer and the scintillator layer, and improves the application range of the flexible scintillation screen. The protective layer and the flexible supporting layer which form the surface of the scintillator layer have higher adhesive force with the scintillator layer, so that the scintillator layer can be effectively protected from internal cracking caused by bending, the reliability of weather resistance test can be improved, and the market application range is widened.
The flexible scintillation screen is formed by the preparation method of the flexible scintillation screen, and the radiation image sensor comprises the flexible scintillation screen and also has the technical effects.
Drawings
FIG. 1 is a flow chart of steps of a method for manufacturing a flexible flashing screen according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a structure after forming a flexible substrate layer on a rigid substrate in accordance with an embodiment of the present invention;
FIG. 3 is a schematic view of a structure of the flexible substrate layer after dividing the central region and the edge region according to an embodiment of the present invention;
FIG. 4 is a schematic view of a structure after forming a scintillator layer in a central area of a flexible substrate layer according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a structure of a scintillator layer with an adhesive layer and a flexible support layer formed on the surface of the scintillator layer according to an embodiment of the present invention;
FIG. 6 is a schematic illustration of the structure of the rigid substrate separated from the flexible substrate layer according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a structure of an embodiment of the present invention after separating a flexible substrate layer from a scintillator layer;
fig. 8 is a schematic structural diagram of an embodiment of the present invention after a protective layer is formed on the exposed scintillator layer surface.
List of reference numerals:
1. rigid substrate
2. Flexible substrate layer
21. Packaging region
22. Coating area
3. Scintillator layer
4. Adhesive layer
5. Flexible support layer
6. Protective layer
61. First protective layer
62. A second protective layer
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples. The invention may be practiced or carried out in other embodiments and details within the scope and range of equivalents of the specific embodiments and ranges of equivalents, and modifications and variations may be made in the practice of the invention without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
It should be noted that the illustrations provided in the embodiments of the invention are merely schematic illustrations of the basic concepts of the invention, and only the components related to the invention are shown in the illustrations, rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated. The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and should not be construed as limiting the scope of the invention, since any modification, variation in proportions, or adjustment of the structures, proportions, etc. which would otherwise be used by those skilled in the art, should not be construed as limiting the scope of the invention, which is otherwise, used by the claims, without affecting the efficacy of the invention or the objects obtained.
Current flexible scintillator screens typically have a scintillator layer fabricated on a flexible substrate layer, with the subsequent flexible substrate layer being able to serve as a support structure for the scintillator layer and becoming an integral part of the flexible scintillator screen. Wherein the material of the flexible base layer is typically some organic substrate, such as a polyimide substrate. In the research process of the inventor, the adhesive force between the flexible scintillator layer and the flexible substrate layer is poor, the product yield of the scintillator screen is seriously affected, and the application scene of the flexible scintillator screen is also limited.
Specifically, the flexible substrate layer is generally formed on the glass substrate, the flexible substrate layer is reserved to serve as a support substrate of the scintillator layer, however, the adhesion between the flexible substrate layer and the scintillator layer is poor, when the flexible substrate layer and the rigid substrate are separated by a laser stripping process, the binding force between the flexible substrate layer and the scintillator layer can be influenced by the laser stripping process or the subsequent process of coupling the scintillator screen and the sensor, so that abnormal defects such as partial separation or bubbles occur between the flexible substrate layer and the scintillator layer, product scrapping is caused, and the yield of the product is influenced. On the other hand, because the adhesion between the flexible substrate layer and the scintillator layer is poor, when weather resistance verification is carried out on the product, the verification condition can also influence the adhesion between the flexible substrate layer and the scintillator layer, so that the flexible substrate layer and the scintillator layer are separated, the application environment of the detector is influenced, and the application scene of the detector in the market is limited. And, the adhesion of flexible stratum basale and scintillator layer is relatively poor also can restrict the radian of buckling of whole scintillation screen, when the radian of buckling is great, because the combination nature of the adhesion of flexible stratum basale and scintillator layer is poor, also can lead to flexible stratum basale and scintillator layer to produce the separation, influences the yield of product. In yet another aspect, the visible light transmittance of the flexible substrate layer is about 90% and about 10% of the light is absorbed, which affects the light extraction efficiency of the scintillation screen and thus results in reduced performance of the detector. The above problems affect the product yield of the flexible flicker screen and limit the performance and the use scene.
In order to solve the technical problems in the background art and the prior art, the invention provides a flexible scintillation screen, a preparation method thereof and a radiographic image sensor, so as to solve the technical problems.
Example 1
The embodiment provides a method for preparing a flexible scintillation screen, referring to fig. 1, the method for preparing the flexible scintillation screen includes:
s1: providing a rigid substrate, and forming a flexible substrate layer on the rigid substrate;
in particular, referring to fig. 2, a rigid substrate 1 is provided, the rigid substrate 1 acting as a support structure in the preparation of a flexible scintillation screen. The rigid substrate 1 may be a glass substrate, an aluminum substrate, or the like. In this embodiment, the rigid substrate 1 is a glass substrate. A flexible substrate layer 2 is prepared on the rigid substrate 1. Alternatively, the material of the flexible substrate layer 2 may be one or more polymeric materials, such as polyimide, polycarbonate, polyethylene terephthalate or polyethylene naphthalate. The method of making a flexible substrate includes: any one of the materials such as liquid PET (polyethylene terephthalate), PI (polyimide) and the like is prepared on the surface of the rigid substrate through coating (such as spin coating), sputtering, spraying and screen printing, and the liquid flexible film is solidified into a solid flexible film through thermal curing, wherein the solidifying temperature range comprises 100-200 ℃ and the solidifying time is 50-80 min. In this embodiment, the flexible substrate layer 2 is formed by spin coating, which is suitable for small-sized film growth, and has simple equipment and low cost. The flexible substrate layer 2 is made of polyimide, the thickness of the flexible substrate layer is between 1 μm and 30 μm, and the light transmittance of the flexible substrate layer 2 is between 70% and 90%.
Referring to fig. 2 and 3, after the formation of the flexible base layer 2, the flexible base layer 2 is cut into a plated region 22 and a package region 21 according to the size of the plated region 22 of the subsequent scintillator layer 3, the plated region 22 being a central region of the flexible base layer 2, and the package region 21 being an edge region surrounding the central region (plated region 22). When cutting the flexible substrate layer 2, the flexible substrate layer 2 may be cut by laser to separate the coating region 22 and the encapsulation region 21 of the flexible substrate layer 2. In this embodiment, before the evaporation of the scintillator layer 3, the flexible substrate layer 2 is cut and distinguished between the coating region 22 and the encapsulation region 21, so as to facilitate the separation of the coating region 22 of the flexible substrate layer 2 from the scintillator layer 3 at the subsequent self-dicing channel.
S2: forming a scintillator layer on the flexible substrate layer;
referring to fig. 4, a scintillator layer 3 is formed on the plating region 22 of the flexible substrate layer 2 produced in step S1. The scintillator layer 3 is used to convert incident radiation it receives into visible light. Specifically, the material of the scintillator layer 3 includes thallium doped cesium iodide or doped cesium iodide, and the selection of thallium or sodium doped can provide a impurity level to improve the luminescence spectrum. The thickness of the scintillator layer 3 formed in this embodiment is 200 to 800 μm, for example, 600 μm. The scintillator layer 3 may be formed on the surface of the flexible base layer 2 by thermal vapor deposition.
S3: forming a flexible support layer over the scintillator layer;
referring to fig. 5, a flexible support layer 5 is formed over the scintillator layer 3 manufactured in step S2. The flexible support layer 5 can prevent scratches and moisture from invading the scintillator layer 3, and can be used as a support layer of the scintillator layer 3, so as to ensure the transportation, installation and the like of the scintillator layer 3. The flexible supporting layer 5 can be a composite film layer formed by compositing a metal foil layer, an organic film layer, a metal foil layer and an organic film, and the material can be tightly attached to the scintillator layer 3 and has certain flexibility, so that the defects of layering or separating and the like of the scintillator layer 3 and the flexible supporting layer 5 in the subsequent process can be avoided, and meanwhile, the problem of yield can not occur when the bending degree is larger. Further, since the flexible support layer 5 is formed on the X-ray incident surface of the scintillator layer, the visible light converted by the X-rays on the exit surface is not absorbed, and the image quality of the product can be improved. Optionally, the material of the organic film layer may be PET or PP, the metal foil layer may be an aluminum foil layer, and the composite film layer may be a PET composite aluminum foil layer or a PP composite aluminum foil layer. In this embodiment, the material of the flexible supporting layer 5 is a PET composite aluminum foil layer, and the flexible supporting layer 5 is attached to the scintillator layer 3 through the adhesive layer, so that a strong adhesive force can be formed. Alternatively, the thickness of the flexible support layer 5 is between 20 μm and 150 μm.
In the step of forming the flexible supporting layer 5 above the scintillator layer 3, the embodiment includes providing a flexible supporting layer 5, coating an adhesive layer 4 on the flexible supporting layer 5, and attaching the flexible supporting layer 5 with the adhesive layer 4 on the surface of the scintillator layer 3. The adhesive layer 4 may be a pressure sensitive adhesive or may be a reflective adhesive layer having a reflective function. For example, the reflective adhesive layer is composed of a thermosetting substrate and reflective particles (such as titanium oxide particles) dispersed in the substrate. The reflectivity range of the reflecting glue layer to visible light is 90% -99.5%, so that the image quality of the product can be greatly improved, and the competitiveness of the product can be improved.
S4: separating the flexible substrate layer from the rigid substrate by taking the flexible supporting layer as the substrate;
referring to fig. 6, after step S3, the flexible substrate layer 2 is separated from the rigid substrate with the flexible support layer 5 as a support substrate. Specifically, a Laser lift-off (LLO) flexible substrate layer 2 may be separated from the rigid substrate using a Laser lift-off process to lift off the rigid substrate.
In this embodiment, the flexible supporting layer 5 is formed on the side of the scintillator layer 3 far away from the flexible substrate layer 2, the adhesion force between the flexible supporting layer 5 and the scintillator layer 3 is strong, and defects such as separation or delamination between the flexible supporting layer 5 and the scintillator layer 3 cannot occur in the laser stripping process, which is beneficial to the yield of products.
S5: and stripping the flexible substrate layer, and forming a protective layer on the surface of the scintillator layer exposed after stripping the flexible substrate layer.
Referring to fig. 7, after step S4, the scintillator layer 3 is peeled off from the flexible base layer 2. Specifically, due to the poor adhesion between the flexible substrate layer 2 and the scintillator layer 3, the film-coated region 22 of the flexible substrate layer 2 can be gradually separated from the scintillator layer 3 by using an air gun blowing method from the dicing channel region between the film-coated region 22 and the encapsulation region 21 of the flexible substrate layer 2. Subsequently, the encapsulation area 21 of the flexible substrate layer 2 may be slowly peeled away from the adhesive layer 4.
In order to prevent the exposed scintillator layer 3 from being scratched and absorbing moisture in the subsequent process, after the flexible substrate layer 2 is peeled off completely, a protective layer 6 is evaporated on the scintillator screen structure after the flexible substrate layer 2 is peeled off, and the protective layer 6 includes a first protective layer 61 covering the scintillator layer 3 and a second protective layer 62 covering the flexible support layer 5. The first protective layer 61 and the second protective layer 62 may be formed by the same step or may be formed stepwise. In the present embodiment, the first protective layer 61 and the second protective layer 62 are formed based on the same step, and are both the high-transmission waterproof protective layer 6. The first protective layer 61 and the second protective layer 62 may be parylene transparent films of C/N/D/F/HT, and the thickness is 1 μm-10 μm. For example, it may be 3 μm to 5. Mu.m. The protective layer and the flexible supporting layer which form the surface of the scintillator layer have higher adhesive force with the scintillator layer, so that the scintillator layer can be effectively protected from internal cracking caused by bending, the reliability of weather resistance test can be improved, and the market application range is widened.
Referring to fig. 8, when the flexible scintillation screen in the present embodiment is used to convert incident X-rays into visible light, the X-rays are directed to the side of the flexible scintillation screen having the flexible supporting layer 5, the reflective particles in the flexible supporting layer 5 and the adhesive layer 4 reflect the visible light incident in the environment, and the X-rays are incident on the scintillator layer 3 and are converted into visible light, and are emitted from the side of the first protective layer 61. Because the emergent end is not provided with the flexible substrate layer, the converted visible light can not be absorbed, and the image conversion quality of the product can be improved.
Example 2
The present embodiment provides a flexible scintillator panel, which includes a first protective layer 61, a scintillator layer 3, a flexible support layer 5, and a second protective layer 62, with reference to fig. 8. Wherein the first protective layer 61 includes a central region and an edge region surrounding the central region. The scintillator layer 3 is disposed on the central area of the protective layer 6, and the flexible support layer 5 is disposed above the scintillator layer 3 and completely covers the exposed surface of the scintillator layer 3 and the edge area of the first protective layer 61. The second protective layer 62 is disposed on the surface of the flexible supporting layer 5.
In order to enhance the adhesion between the flexible support layer 5 and the scintillator layer 3, an adhesive layer 4 is also formed between the flexible support layer 5 and the scintillator layer 3. The adhesive layer 4 is disposed on the surface of the scintillator layer 3 and the edge region of the first protective layer 61, and the flexible supporting layer 5 is disposed on the adhesive layer 4. Alternatively, the adhesive layer 4 is formed as a reflective adhesive layer, for example, the reflective adhesive layer is composed of a thermosetting substrate and reflective particles (such as titanium oxide particles) dispersed in the substrate. The reflectivity range of the reflecting glue layer to visible light is 90% -99.5%, so that the image quality of the product can be greatly improved, and the competitiveness of the product can be improved.
The first protective layer 61 and the second protective layer 62 are made of the same material, and are all parylene layers with the thickness of 1-10 μm. The flexible supporting layer 5 can be a metal foil layer, an organic film layer, and a composite film layer formed by compositing a metal foil and an organic film. In this embodiment, the flexible support layer 5 is made of a PET composite aluminum foil layer with a thickness of 20 μm to 150 μm. Because the composite film layer and the scintillator layer 3 can have better adhesive force, the composite film layer material can not be separated and layered with the scintillator layer 3 in the following processes of laser peeling of the rigid substrate 1, weather resistance verification and the like. In addition, the composite film layer can also have a larger curvature, so that the application of the scintillator layer 3 in terms of curvature is not limited. When the metal foil in the composite film layer is metal aluminum, visible light can be reflected, and the image quality of the product is improved.
Example 3
The present embodiment also provides a radiation image sensor including a flexible scintillator panel and a sensor array. The flexible scintillation screen is prepared by the preparation method of the flexible scintillation screen in the embodiment 1. The sensor array corresponds to the flexible scintillation screen and is positioned on one side of the first protective layer close to the flexible scintillation screen and used for converting visible light generated by the flexible scintillation screen received by the sensor array into an electric signal. Wherein the sensor array comprises one of a flat panel detector and an image pickup element.
In summary, in the preparation method of the flexible scintillation screen, the flexible substrate layer is removed after the rigid substrate is peeled off, and the flexible support layer which is tightly combined with the scintillator layer is adopted as the support structure of the scintillator layer, so that the phenomenon of separation or layering in the subsequent process due to poor adhesive force between the flexible substrate layer and the scintillator layer is avoided, and the yield of products is influenced. Meanwhile, the flexible substrate layer is removed, so that the absorption of visible light emitted by the scintillator layer by the flexible substrate layer can be avoided. A thin transparent protective layer is formed on the exposed scintillator layer, and compared with the flexible substrate layer, the visible light transmittance can be greatly improved, and the overall performance of the detector is further improved.
In addition, the flexible supporting layer is a composite film layer formed by compounding a metal foil layer, an organic film layer, a metal foil and an organic film, preferably a composite film layer, and the composite film layer and the scintillator layer can form good adhesive force, can bend along with the scintillator layer in a large range, can not cause separation between the composite film layer and the scintillator layer, and improves the application range of the flexible scintillation screen. The protective layer and the flexible supporting layer which form the surface of the scintillator layer have higher adhesive force with the scintillator layer, so that the scintillator layer can be effectively protected from internal cracking caused by bending, the reliability of weather resistance test can be improved, and the market application range is widened.
The flexible scintillation screen is formed by the preparation method of the flexible scintillation screen, and the radiation image sensor comprises the flexible scintillation screen and also has the technical effects.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (15)
1. A method of manufacturing a flexible scintillation screen, the method comprising:
providing a rigid substrate, and forming a flexible substrate layer on the rigid substrate;
forming a scintillator layer on the flexible substrate layer;
forming a flexible support layer over the scintillator layer;
separating the flexible substrate layer from the rigid substrate with the flexible support layer as a substrate;
and stripping the flexible substrate layer, and forming a protective layer on the surface of the scintillator layer and the surface of the flexible support layer, which are exposed after stripping the flexible substrate layer.
2. The method of manufacturing a flexible scintillation screen of claim 1, further comprising, after forming a flexible substrate layer on the rigid substrate:
dividing an edge region and a central region of the flexible substrate layer, wherein the central region is formed into a coating region, the edge region forms a packaging region, and the scintillator layer is formed on the coating region of the flexible substrate layer.
3. The method of manufacturing a flexible scintillator panel according to claim 1, wherein the step of forming a flexible support layer over the scintillator layer comprises:
providing a flexible supporting layer;
coating an adhesive layer on the flexible supporting layer;
and attaching the flexible supporting layer with the adhesive layer to the surface of the scintillator layer.
4. A method of manufacturing a flexible scintillation screen as recited in claim 3, wherein the adhesive layer includes dispersed reflective particles therein.
5. The method of manufacturing a flexible scintillation screen of claim 1, wherein in the step of separating the flexible substrate layer from the rigid substrate, comprising:
the flexible substrate layer is separated from the rigid substrate using a laser lift-off process.
6. The method of manufacturing a flexible scintillation screen of claim 2, wherein the step of peeling off the flexible substrate layer comprises:
and sequentially stripping the coating area and the packaging area of the flexible substrate layer based on the cutting path between the coating area and the packaging area.
7. The method for manufacturing a flexible screen according to claim 1, wherein the flexible supporting layer is a metal foil layer, an organic film layer, a composite film layer formed by compositing a metal foil and an organic film.
8. The method for manufacturing a flexible scintillation screen as recited in claim 1, wherein the protective layer is a parylene layer.
9. A flexible flicker screen, comprising:
a first protective layer including a central region and an edge region surrounding the central region;
a scintillator layer disposed on a central region of the protective layer;
the flexible supporting layer is arranged above the scintillator layer and completely covers the exposed surface of the scintillator layer and the edge area of the first protective layer;
the second protective layer is arranged on the surface of the flexible supporting layer.
10. The flexible scintillation screen of claim 9, wherein the flexible scintillation screen further comprises:
the flexible support layer is arranged on the adhesive layer.
11. The flexible scintillation screen of claim 10, wherein the adhesive layer has reflective particles dispersed therein.
12. The flexible scintillation screen of claim 9, wherein the flexible support layer is a metal foil layer, an organic film layer, a composite film layer formed by compositing a metal foil and an organic film.
13. The flexible scintillation screen of claim 9, wherein the flexible support layer is a PET-Al composite film layer having a thickness of between 20 μιη and 150 μιη.
14. The flexible scintillation screen of claim 9, wherein the protective layer is a parylene layer having a thickness of between 1 μιη and 10 μιη.
15. A radiation image sensor, characterized by comprising:
a flexible flashing screen manufactured by the manufacturing method of the flexible flashing screen according to any one of claims 1 to 8;
and the sensor array corresponds to the flexible scintillation screen and is positioned on one side of the first protective layer close to the flexible scintillation screen and used for converting the received visible light of the flexible scintillation screen into an electric signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311608354.XA CN117690939A (en) | 2023-11-28 | 2023-11-28 | Flexible flicker screen, preparation method thereof and radiographic image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311608354.XA CN117690939A (en) | 2023-11-28 | 2023-11-28 | Flexible flicker screen, preparation method thereof and radiographic image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117690939A true CN117690939A (en) | 2024-03-12 |
Family
ID=90125617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311608354.XA Pending CN117690939A (en) | 2023-11-28 | 2023-11-28 | Flexible flicker screen, preparation method thereof and radiographic image sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117690939A (en) |
-
2023
- 2023-11-28 CN CN202311608354.XA patent/CN117690939A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100564519B1 (en) | Radiation detecting device and method of manufacturing the same | |
| RU2408901C1 (en) | Radiation detecting device and system | |
| US8895932B2 (en) | Scintillator plate and radiation detection panel | |
| US9269741B2 (en) | Production method of radiation image detector and radiation image detector | |
| TWI518352B (en) | Radiation detector and manufacturing method thereof | |
| JP5343970B2 (en) | Radiation image detection device | |
| JP5499706B2 (en) | Scintillator panel | |
| US8973245B2 (en) | Method of manufacturing flat panel detector | |
| US20110147602A1 (en) | Radiographic imaging apparatus, radiographic imaging system, and method of producing radiographic imaging apparatus | |
| US7663118B2 (en) | Scintillator panel | |
| US8354646B2 (en) | Scintillator plate, scintillator panel and flat panel radiation detector by use thereof | |
| JP2008209195A (en) | Scintillator panel and flat panel radiation detector | |
| JP2008185393A (en) | Scintillator panel | |
| US20100116992A1 (en) | Scintillator panel and radiation flat panel detector | |
| JP4057316B2 (en) | Scintillator panel and manufacturing method thereof | |
| JPWO2008090796A1 (en) | Scintillator panel and radiation flat panel detector | |
| JP2019060821A (en) | Panel for x-ray talbot imaging | |
| CN117690939A (en) | Flexible flicker screen, preparation method thereof and radiographic image sensor | |
| JP2003262678A (en) | Scintillator panel for radiation detector, and manufacturing method thereof | |
| JP5365725B2 (en) | Manufacturing method of scintillator panel | |
| JP2011022068A (en) | Scintillator panel | |
| JP2009025075A (en) | Radiation scintillator panel and flat panel detector | |
| US20160172400A1 (en) | Photo detector and method for fabricating the same | |
| JP2009002776A (en) | Scintillator panel and radiation flat panel detector | |
| JP2008111698A (en) | Scintillator plate, scintillator panel, and radiation flat-panel detector using them |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |