CN117690851A - Silicon chip absorbing and transferring mechanism - Google Patents
Silicon chip absorbing and transferring mechanism Download PDFInfo
- Publication number
- CN117690851A CN117690851A CN202410156492.7A CN202410156492A CN117690851A CN 117690851 A CN117690851 A CN 117690851A CN 202410156492 A CN202410156492 A CN 202410156492A CN 117690851 A CN117690851 A CN 117690851A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 28
- 239000010703 silicon Substances 0.000 title claims abstract description 28
- 210000001503 joint Anatomy 0.000 claims abstract description 158
- 230000000903 blocking effect Effects 0.000 claims abstract description 38
- 238000003032 molecular docking Methods 0.000 claims description 131
- 238000003860 storage Methods 0.000 claims description 20
- 230000033001 locomotion Effects 0.000 claims description 8
- 241000628997 Flos Species 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a silicon wafer absorbing and transferring mechanism which comprises a moving track, a moving sleeve, a bearing assembly and a placing seat, wherein the moving sleeve is arranged on the moving track; a butt joint frame and an assembly frame are arranged below the bearing assembly, a sucker assembly is arranged below the assembly frame, an air tap is arranged at the corner of the sucker assembly, and the bearing frame is arranged on the edge surface of the placing seat; and a first butt joint module and a second butt joint module are arranged between the butt joint frame and the assembly frame, and the first butt joint module is assembled on the side surface of the butt joint frame. The blocking seat which is symmetrically distributed is pressed by the lower half section of the first butt joint seat, so that the blocking seat linkage seat which is symmetrically distributed rotates, the lower half section of the first butt joint seat can be assisted to continuously descend by means of the occlusion relation between the second tooth grain and the first tooth grain, the blocking seat limits the linkage seat when the butt joint seat descends to the appointed position, and the first butt joint seat can be prevented from being separated from or loosened in the second butt joint chamber under the action of one layer by utilizing the occlusion transmission relation between the second tooth grain and the first tooth grain.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a silicon wafer sucking and transferring mechanism.
Background
The silicon wafer is a semiconductor material made of monocrystalline silicon, has very stable chemical properties, is difficult to react with other substances except hydrogen fluoride at normal temperature, and has better conductivity as the higher the purity is, so that the silicon wafer is widely applied in the electronic field and is often used as a basic carrier for running circuits in the manufacture of semiconductor devices, new energy batteries and semiconductor computers;
then the sucking disc for sucking the silicon chip needs to be overhauled and maintained after long time, therefore, the sucking disc needs to be disassembled and installed, then the sucking disc needs to be in certain precision (the air cock needs to be aligned with the silicon chip) when being installed, so as to prevent the nozzle installation deviation from influencing the stability of the silicon chip after sucking, further debugging is required to be carried out after the sucking disc is installed, the steps are integrated, the overall working efficiency is greatly influenced, and the sucking disc bracket for sucking the silicon chip is only dependent on the installation mode of the screw in the working process, after long-time vibration occurs, the sucking disc is loosened, and even the silicon chip is caused to fall off in the transferring process, thereby influencing the sucking effect of the silicon chip.
Disclosure of Invention
This section is intended to outline some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the description summary and in the title of the application, to avoid obscuring the purpose of this section, the description summary and the title of the invention, which should not be used to limit the scope of the invention.
In order to solve the technical problems, the invention provides the following technical scheme: a silicon slice absorbing and transferring mechanism comprises a moving track, a moving sleeve, a bearing assembly and a placing seat;
a butt joint frame and an assembly frame are arranged below the bearing assembly, a sucker assembly is arranged below the assembly frame, an air tap is arranged at the corner of the sucker assembly, and the bearing frame is arranged on the edge surface of the placing seat;
a first butt joint module and a second butt joint module are arranged between the first butt joint frame and the assembly frame, the first butt joint module is assembled on the side surface of the first butt joint frame, the second butt joint module is assembled on the upper surface of the assembly frame, the first butt joint module mainly comprises a first butt joint seat and a connecting piece, the connecting piece is positioned on the upper surface of the first butt joint seat, the connecting piece and the first butt joint seat are fixedly connected, and the connecting piece and the first butt joint frame are in butt joint by means of a fastener;
the second docking module mainly comprises a second docking seat and a docking channel, the docking channel is milled on the surface of the second docking seat, the docking channel is used as a docking piece of the second docking seat and the component frame, a first docking chamber is reserved on the surface of the second docking seat, a second docking chamber is reserved in the middle of the second docking seat, the first docking chamber and the second docking chamber are in a through connection relationship, and the left and right intervals of the first docking chamber are matched with the distance between the left and right two polar ends of the first dental floss;
and a linkage seat is arranged in the second butt joint chamber, second dents are distributed on the peripheral wall of the upper half section of the linkage seat in an array mode, and the second dents are distributed in a fan shape.
As a preferred technical scheme of the silicon wafer sucking and transferring mechanism, a first dental floss is symmetrically distributed on the side of the middle section of the first butt joint seat, a butt joint cavity is symmetrically distributed on the surface of the middle section of the first butt joint seat, the butt joint cavity is positioned above the first dental floss, the left side, the right side, the upper side and the lower side of the inside of the butt joint cavity are provided with sides with the same gradient, and the embedded inlet of the butt joint cavity and the first dental floss are distributed on the same side.
As a preferred technical scheme of the silicon wafer sucking and transferring mechanism, a guide seat is arranged on the side edge of the first butt joint seat, the surface of the guide seat on the first butt joint seat is in adjacent side relation with the surface of the first butt joint cavity and the surface of the first tooth pattern on the first butt joint seat, a guide channel is milled on the side surface of the first butt joint chamber, the size of the guide channel is matched with that of the guide seat, and the guide channel is simultaneously and prolonged to be communicated with the side surface of the second butt joint chamber.
As a preferable technical scheme of the silicon wafer sucking and transferring mechanism, a linkage cylinder is hinged at the central shaft of the upper half section of the linkage seat, the linkage cylinder is positioned at the rotary shaft of the second tooth pattern, and the linkage cylinder is hinged with the side of the second butt joint chamber.
As a preferable technical scheme of the silicon wafer sucking and transferring mechanism, a traction channel is reserved on the side surface of the second butt joint chamber.
As a preferred technical scheme of the silicon wafer sucking and transferring mechanism, a pushing and blocking module is arranged in the middle of the second butt joint chamber, the pushing and blocking module mainly comprises a blocking seat and a first reset assembly which are symmetrically distributed, one side of the blocking seat with a gradient faces the first butt joint seat, one vertical side of the blocking seat faces the surface of the bottom edge of the second butt joint chamber, one side of the blocking seat is in butt joint with one end of the first reset assembly, and the other end of the first reset assembly is in butt joint with the side surface of the second butt joint chamber.
As an optimized technical scheme of the silicon wafer sucking and transferring mechanism, a traction seat is arranged on the lateral side of the blocking seat, and the traction seat can stretch and retract in a traction channel.
As a preferred technical scheme of a silicon chip absorbing and transferring mechanism, a storage chamber is reserved on the side surface of the first butt joint chamber, the opening size of the storage chamber is smaller than the distance between the middle parts of the storage chambers, a jogging seat is arranged in the middle part of the storage chamber in a telescopic motion mode, a second reset assembly is arranged between the jogging seat and the storage chamber, and two ends of the second reset assembly are fixedly connected with the surfaces of the storage chamber and the jogging seat respectively.
As a preferable technical scheme of the silicon wafer sucking and transferring mechanism, an internal thread cavity is reserved on the side edge of the first butt joint seat far away from the guide seat, an internal thread channel is reserved on the side edge surface of the second butt joint seat, the internal thread cavity corresponds to the position of the internal thread channel, and screws are commonly butt-jointed in the internal thread cavity and the internal thread channel.
The invention has the beneficial effects that:
1. the blocking seat which is symmetrically distributed is pressed by the lower half section of the first butt joint seat, so that the blocking seat which is symmetrically distributed is linked with the linkage seat to rotate, the lower half section of the first butt joint seat can be assisted to continuously descend by virtue of the occlusion relation between the second tooth pattern and the first tooth pattern, the blocking seat limits the linkage seat when the butt joint seat descends to a designated position, and the first butt joint seat can be prevented from being separated from or loosened in the second butt joint chamber under the action of one layer by utilizing the occlusion transmission relation between the second tooth pattern and the first tooth pattern;
when the first butt joint seat is just embedded into the butt joint chamber, the bottom of the first butt joint seat is pressed with the slope side of the first butt joint seat, so that the first butt joint seat is pressed into the second reset component, when the first butt joint seat descends to a designated position, the first butt joint seat corresponds to the position of the butt joint cavity, the second reset component can eject the first butt joint seat under the action force of no pressing, the tip end of the first butt joint seat is embedded into the butt joint cavity, the position of the first butt joint seat can be limited by the other layer under the butt joint relation of the first butt joint seat and the butt joint cavity, the stability of butt joint of the first butt joint module and the second butt joint module is further achieved, and loosening can be avoided;
when the first butt joint seat is completely butted in the second butt joint chamber, the screw is screwed into the internal thread cavity, one of the screw and the second butt joint chamber can prevent the first butt joint module from loosening when the first butt joint module and the second butt joint module are butted, the first butt joint seat can be prevented from shifting, and meanwhile, under the action of the meshing relationship between the second tooth pattern and the first tooth pattern and the butt joint relationship between the embedded seat and the butt joint cavity, the screw can be accurately butted into the internal thread cavity, so that the butt joint efficiency of the assembly frame is improved;
when the assembly frame needs to be disassembled, the screw is screwed out of the internal thread cavity for a certain distance, the first butt joint seat is telescopically moved along the residual gap position of the butt joint chamber, the left side and the right side of the embedded seat are pressed with the left side and the right side of the butt joint chamber, the embedded seat can be pressed into the storage chamber, when the first butt joint seat is telescopically moved to a designated position, the first tooth pattern and the second tooth pattern are not engaged any more, and at the moment, the second butt joint module can be directly pulled downwards, so that the first tooth pattern and the second tooth pattern are conveniently disassembled.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is an enlarged schematic view of fig. 1 a according to the present invention.
Fig. 3 is a schematic diagram of a first docking module and a second docking module according to the present invention.
Fig. 4 is a schematic diagram showing a first docking module and a second docking module in a cross-section.
Fig. 5 is a schematic diagram of a docking module according to the first embodiment of the invention.
Fig. 6 is a schematic diagram of a docking module according to a second embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a docking station according to the present invention.
Fig. 8 is a schematic view of a fitting seat according to the present invention.
Reference numerals: 100. a motion track; 101. a movement sleeve; 102. a carrier assembly; 103. a butt joint frame; 104. an assembly frame; 105. a suction cup assembly; 106. an air tap; 200. placing a seat; 201. a carrier; 300. a first butt joint module; 310. a first butt joint seat; 311. first tooth pattern; 312. a butt joint cavity; 313. a guide seat; 320. a linking member; 400. a second butt joint module; 410. a second butt joint seat; 411. a first butt joint chamber; 415. a guide channel; 412. a second butt joint chamber; 413. traction ditch; 414. a storage chamber; 420. a docking channel; 500. a linkage seat; 501. second tooth patterns; 502. a linkage cylinder; 600. a blocking seat; 601. a traction seat; 700. resetting the first component; 800. a jogging seat; 801. resetting the second component; 900. an internal thread cavity; 901. an internally threaded passage; 902. and (5) a screw.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
Further, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic can be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Further, in describing the embodiments of the present invention in detail, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of description, and the schematic is only an example, which should not limit the scope of protection of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
Example 1: referring to fig. 1 to 7, a first embodiment of the present invention provides a silicon wafer sucking and transferring mechanism, which includes a moving track 100, a moving sleeve 101, a bearing assembly 102 and a placing seat 200;
a butt joint frame 103 and an assembly frame 104 are arranged below the bearing assembly 102, a sucker assembly 105 is arranged below the assembly frame 104, an air tap 106 is arranged at a corner of the sucker assembly 105, the air tap 106 is connected with an air pipe for sucking a silicon wafer, a bearing frame 201 is arranged on the edge surface of the placing seat 200, a plurality of bearing frames 201 are used for bearing the silicon wafer and facilitating the sucking of the silicon wafer, and a moving track 100 and a moving sleeve 101 facilitate the telescopic movement of the bearing assembly 102 so as to suck the silicon wafer to a designated position;
a first docking module 300 and a second docking module 400 are arranged between the docking frame 103 and the component frame 104, the first docking module 300 is assembled on the side surface of the docking frame 103, the second docking module 400 is assembled on the upper surface of the component frame 104, the first docking module 300 mainly comprises a first docking seat 310 and a connecting piece 320, the connecting piece 320 is positioned on the upper surface of the first docking seat 310, the connection relation between the first docking seat and the second docking seat is fixedly connected, and the connecting piece 320 and the docking frame 103 are docked by means of a fastener;
the second docking module 400 mainly comprises a second docking seat 410 and a docking channel 420, the docking channel 420 is milled on the surface of the second docking seat 410, the docking channel 420 is used as a docking piece of the second docking seat 410 and the component frame 104, and the component frame 104 and the bearing component 102 can be precisely docked by virtue of the first docking seat 310 and the second docking seat 410, so that the suction efficiency of the suction disc component 105 on the silicon wafer is prevented from being influenced by the deviation of the component frame 104 and the bearing component 102 during docking;
the second butt joint chamber 412 is internally provided with a linkage seat 500, when the first butt joint seat 310 is just embedded into the second butt joint chamber 412, the linkage seat 500 and the first butt joint seat 310 are distributed in parallel, the outer peripheral wall of the upper half section of the linkage seat 500 is distributed with second teeth 501 in an array mode, and the second teeth 501 are distributed in a fan shape;
specifically, a first tooth pattern 311 which is symmetrically distributed is arranged on the side of the middle section of the first butt joint seat 310, a second butt joint cavity 312 which is symmetrically distributed is reserved on the surface of the middle section of the first butt joint seat 310, the butt joint cavity 312 is positioned above the first tooth pattern 311, the left side, the right side, the upper side and the lower side of the inside of the butt joint cavity 312 are provided with sides with the same gradient, and the embedded inlet of the butt joint cavity 312 and the first tooth pattern 311 are distributed on the same side;
specifically, the side edge of the first docking seat 310 is provided with a guide seat 313, the surface of the guide seat 313 on the first docking seat 310 is in adjacent side relation with the surface of the docking cavity 312 and the first tooth pattern 311 on the first docking seat 310, the side surface of the first docking chamber 411 is milled with a guide channel 415, the size of the guide channel 415 is matched with the size of the guide seat 313, the guide channel 415 has a traction guiding effect, the guide channel 415 is also prolonged and communicated with the side surface of the second docking chamber 412, and the first docking seat 310 is not easy to shift in position when being docked with the second docking seat 410 by virtue of the guide channel 415 and the guide seat 313, so that the docking accuracy is ensured;
specifically, a first docking chamber 411 is reserved on the surface of the second docking station 410, a second docking chamber 412 is reserved in the middle of the second docking station 410, the first docking chamber 411 and the second docking chamber 412 are in a through connection relationship, the first docking chamber 411 is a preliminary channel for the first docking station 310 to be embedded into the second docking chamber 412, and the left-right spacing of the first docking chamber 411 is matched with the distance between the left-right ends of the first tooth pattern 311, so that the first docking station 310 can be conveniently embedded into the second docking chamber 412 smoothly;
specifically, the central shaft of the upper half section of the linkage seat 500 is hinged with a linkage cylinder 502, so that the center of gravity of the linkage seat 500 is in a falling state before being linked, the linkage cylinder 502 is positioned at the rotating shaft of the second tooth grain 501, the linkage cylinder 502 is hinged with the side of the second butt joint chamber 412, the linkage seat 500 can be controlled to rotate, when the first butt joint seat 310 is embedded into the second butt joint chamber 412, the meshing relationship between the second tooth grain 501 and the first tooth grain 311 is utilized, and when the first butt joint seat 310 is completely butted in the second butt joint chamber 412, the effect of one heavy constraint can be achieved, and the first butt joint seat 310 and the second butt joint seat 410 are prevented from falling off and loosening after being butted;
specifically, a traction channel 413 is reserved on the side surface of the second docking chamber 412, a push-resistance module is arranged in the middle of the second docking chamber 412, the push-resistance module mainly comprises a blocking seat 600 and a first reset component 700 which are symmetrically distributed, the blocking seat 600 is in a trapezoid shape with one side in a vertical state, one side of the blocking seat 600 having a slope faces the first docking seat 310, the vertical side of the blocking seat 600 is abutted against the surface of the bottom edge of the second docking chamber 412, one side of the blocking seat 600 is in butt joint with one end of the first reset component 700, the other end of the first reset component 700 is in butt joint with the side surface of the second docking chamber 412, the tips of the blocking seat 600 which are symmetrically distributed are in butt joint with each other in a state that the first docking seat 310 is not pressed, a traction seat 601 is arranged on the lateral side of the blocking seat 600, and the traction seat 601 can perform telescopic motion in the traction channel 413, so that the blocking seat 600 can only perform telescopic motion along parallel lines, and stability of the first reset component 700 when the blocking seat 600 is in a linkage state is ensured;
the implementation of the embodiment can be realized: before the first butt seat 310 is not embedded into the second butt chamber 412, at this time, under the action of the first reset component 700, the tips of the symmetrical blocking seats 600 are attached, when the first tooth pattern 311 and the second tooth pattern 501 just touch, at this time, the lower half section of the first butt seat 310 presses one side of the blocking seat 600 with a gradient, under the action of the wedge mechanism, the blocking seat 600 stretches out and draws back, and simultaneously drives the linkage seat 500 to rotate, when the linkage seat 500 rotates, the lower half section of the first butt seat 310 can be assisted to continuously descend by virtue of the meshing relationship between the second tooth pattern 501 and the first tooth pattern 311, when the lower half section of the first butt seat 310 descends to a specified position, at this time, the first butt seat 310 can be prevented from being separated from or loosened into the second butt chamber 412 under the action of one layer by virtue of the meshing transmission relationship between the second tooth pattern 501 and the first tooth pattern 311, the docking module I300 is stretched and retracted along the transverse direction of the docking module II 400, the teeth between the first tooth pattern 311 and the second tooth pattern 501 are distributed in a staggered manner, so that the docking seat I310 can be stretched and retracted transversely, when the docking seat I310 stretches and retracts transversely to a designated position, the second tooth pattern 501 and the first tooth pattern 311 are not meshed, at the moment, under the action of the first reset component 700, the symmetrical blocking seat 600 can be attached again, the bottom end of the linkage seat 500 is positioned on one side of the blocking seat 600, thereby facilitating the blocking seat 600 to be capable of being linked with the linkage seat 500 to rotate when stretching and retracting, and under the influence of the gravity center of the linkage seat 500, when the linkage seat 500 is reset, the side of the linkage seat 500 can be rotated to the side of the blocking seat 600, so as to facilitate the subsequent use, the transverse distance of the blocking seat 600 is matched with the transverse distance in the docking chamber II 412, so that the docking seat I310 can be ensured to move along the transverse position, the lower half section of the first butt joint seat 310 continuously presses the blocking seat 600 to ensure the stability of the occlusion structure and the whole butt joint;
example 2: referring to fig. 3, 4, 5, 6 and 8, a second embodiment of the present invention is shown, which differs from the previous embodiment in that: a storage chamber 414 is reserved on the side surface of the first butt joint chamber 411, the opening size of the storage chamber 414 is smaller than the interval between the middle parts of the storage chamber 414, a jogged seat 800 is arranged in the middle part of the storage chamber 414 in a telescopic motion, a second reset component 801 is arranged between the jogged seat 800 and the storage chamber 414, two ends of the second reset component 801 are fixedly connected with the surfaces of the storage chamber 414 and the jogged seat 800 respectively, two groups of sides which are vertically and symmetrically distributed in a left-right mode are cut on the surface of the tip end of the jogged seat 800, and each side with a gradient is in parallel distribution with each inner side of the butt joint chamber 312;
specifically, an internal thread cavity 900 is reserved on the side edge of the first docking seat 310 away from the guide seat 313, an internal thread channel 901 is reserved on the side edge surface of the second docking seat 410, the internal thread cavity 900 corresponds to the internal thread channel 901, a screw 902 is commonly docked with the internal thread cavity 900 and the internal thread channel 901, when the first docking seat 310 is completely docked in the second docking chamber 412, the screw 902 is screwed into the internal thread cavity 900, the first docking module 300 and the second docking module 400 can be prevented from loosening during docking, the first docking seat 310 can be prevented from being offset, when the first docking module 300 and the second docking module 400 are detached, the screw 902 is screwed out of the internal thread cavity 900 for a distance, and at the moment, the first docking seat 310 can move in a telescopic way towards a gap of the first docking chamber 411;
the implementation of the embodiment can be realized: when the first docking seat 310 is embedded into the first docking chamber 411 and the second docking chamber 412, the bottom of the first docking seat 310 is firstly pressed with the slope side of the second docking seat 800, so that the second docking seat 800 is pressed into the second reset component 801, at this time, the lower half section of the first docking seat 310 can continuously descend, when the lower half section of the first docking seat 310 stretches and moves to completely press the blocking seat 600, at this time, the positions of the second docking seat 800 and the second docking chamber 312 correspond, the second reset component 801 can eject the second docking seat 800 under the action force of no pressing, and the tip end of the second docking seat 800 is embedded into the second docking chamber 312; at this time, under the engagement relationship between the first tooth pattern 501 and the first tooth pattern 311, the first position of the first docking seat 310 can be limited, and under the docking relationship between the fitting seat 800 and the docking cavity 312, the second position of the first docking seat 310 can be limited, so as to achieve the stability of docking the first docking module 300 and the second docking module 400, and avoid loosening; the first docking station 310 is moved to stretch along the remaining gap of the first docking chamber 411, and the left and right sides of the fitting station 800 and the left and right sides of the docking chamber 312 are pressed, so that the fitting station 800 is pressed into the receiving chamber 414, and when the first docking station 310 is moved to the designated position, the first and second threads 311 and 501 are not engaged, and at this time, the second docking module 400 can be pulled downward directly, so that the two modules are convenient to detach.
It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.
It should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered in the scope of the claims of the present invention.
Claims (9)
1. The utility model provides a silicon chip absorbs and moves mechanism of carrying which characterized in that: comprises a moving track (100), a moving sleeve (101), a bearing component (102) and a placing seat (200);
a butt joint frame (103) and an assembly frame (104) are arranged below the bearing assembly (102), a sucker assembly (105) is arranged below the assembly frame (104), an air tap (106) is arranged at the corner of the sucker assembly (105), and a bearing frame (201) is arranged on the edge surface of the placing seat (200);
a first butt joint module (300) and a second butt joint module (400) are arranged between the butt joint frame (103) and the component frame (104), the first butt joint module (300) is assembled on the side surface of the butt joint frame (103), the second butt joint module (400) is assembled on the upper surface of the component frame (104), the first butt joint module (300) mainly comprises a first butt joint seat (310) and a connecting piece (320), the connecting piece (320) is positioned on the upper surface of the first butt joint seat (310), the connecting relation between the first butt joint module and the second butt joint module is fixedly connected, and the connecting piece (320) and the butt joint frame (103) are in butt joint by means of a fastener;
the second docking module (400) mainly comprises a second docking seat (410) and a docking channel (420), the docking channel (420) is milled on the surface of the second docking seat (410), the docking channel (420) is used as a docking piece of the second docking seat (410) and the component rack (104), a first docking chamber (411) is reserved on the surface of the second docking seat (410), a second docking chamber (412) is reserved in the middle of the second docking seat (410), the first docking chamber (411) and the second docking chamber (412) are in a through connection relationship, and the left and right intervals of the first docking chamber (411) are matched with the distance between the left and right ends of the first dental floss (311);
the second butt joint chamber (412) is internally provided with a linkage seat (500), the outer peripheral wall of the upper half section of the linkage seat (500) is provided with second dents (501) in an array mode, and the second dents (501) are in fan-shaped distribution.
2. The wafer sucking and transferring mechanism as claimed in claim 1, wherein: the novel tooth butt joint device is characterized in that a first tooth grain (311) which is symmetrically distributed is arranged on the side of the middle section of the first butt joint seat (310), a butt joint cavity (312) which is symmetrically distributed is reserved on the surface of the middle section of the first butt joint seat (310), the butt joint cavity (312) is located above the first tooth grain (311), the left side, the right side, the upper side and the lower side of the inside of the butt joint cavity (312) are provided with edges with the same gradient, and an embedded port of the butt joint cavity (312) and the first tooth grain (311) are distributed on the same edge.
3. The wafer sucking and transferring mechanism as claimed in claim 1, wherein: the side of butt joint seat one (310) is settled there is guide holder (313), the surface that guide holder (313) was located on butt joint seat one (310) is adjacent limit relation with the surface that butt joint chamber (312) and tooth line one (311) were located on butt joint seat one (310), the avris surface of butt joint room one (411) mills and is equipped with guide channel (415), the size of guide channel (415) matches with the size of guide holder (313), guide channel (415) are still prolonged the intercommunication simultaneously and are distributed in the side surface of butt joint room two (412).
4. The wafer sucking and transferring mechanism as claimed in claim 1, wherein: the upper half section center shaft of the linkage seat (500) is hinged with a linkage cylinder (502), the linkage cylinder (502) is positioned at the rotation shaft of the second tooth pattern (501), and the linkage cylinder (502) is hinged with the side of the second butt joint chamber (412).
5. The wafer sucking and transferring mechanism as claimed in claim 1, wherein: and a traction channel (413) is reserved on the side surface of the second butt joint chamber (412).
6. The wafer sucking and transferring mechanism as claimed in claim 1, wherein: the middle part of the butt joint chamber II (412) is provided with a pushing resistance module, the pushing resistance module mainly comprises a blocking seat (600) and a reset assembly I (700) which are symmetrically distributed, one side of the blocking seat (600) with a gradient faces the butt joint seat I (310), the vertical side of the blocking seat (600) is attached to the surface of the bottom edge of the butt joint chamber II (412), one side of the blocking seat (600) is in butt joint with one end of the reset assembly I (700), and the other end of the reset assembly I (700) is in butt joint with the side surface of the butt joint chamber II (412).
7. The wafer sucking and transferring mechanism as claimed in claim 6, wherein: a traction seat (601) is arranged on the lateral side of the blocking seat (600), and the traction seat (601) can perform telescopic movement in the traction channel (413).
8. The wafer sucking and transferring mechanism as claimed in claim 1, wherein: the side surface of the first butt joint chamber (411) is reserved with a storage chamber (414), the opening size of the storage chamber (414) is smaller than the interval between the middle parts of the storage chamber (414), the middle parts of the storage chamber (414) move in a telescopic mode to form a jogged seat (800), a second reset assembly (801) is arranged between the jogged seat (800) and the storage chamber (414), and two ends of the second reset assembly (801) are fixedly connected with the surfaces of the storage chamber (414) and the jogged seat (800) respectively.
9. The wafer sucking and transferring mechanism as claimed in claim 1, wherein: an inner thread cavity (900) is reserved on the side edge, far away from the guide seat (313), of the first butt joint seat (310), an inner thread channel (901) is reserved on the side edge surface of the second butt joint seat (410), the inner thread cavity (900) corresponds to the inner thread channel (901), and a screw (902) is commonly butted with the inner thread cavity (900) and the inner thread channel (901).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410156492.7A CN117690851B (en) | 2024-02-04 | 2024-02-04 | Silicon chip absorbing and transferring mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410156492.7A CN117690851B (en) | 2024-02-04 | 2024-02-04 | Silicon chip absorbing and transferring mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN117690851A true CN117690851A (en) | 2024-03-12 |
| CN117690851B CN117690851B (en) | 2024-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410156492.7A Active CN117690851B (en) | 2024-02-04 | 2024-02-04 | Silicon chip absorbing and transferring mechanism |
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| Country | Link |
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| CN (1) | CN117690851B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531678A (en) * | 2017-01-05 | 2017-03-22 | 江西比太科技有限公司 | Silicon wafer gripping device and solar cell production equipment of using same |
| CN109841706A (en) * | 2019-03-23 | 2019-06-04 | 东莞市科隆威自动化设备有限公司 | Solar silicon wafers tear piece laminating method and imbrication general assembly line open |
| CN219106108U (en) * | 2023-02-13 | 2023-05-30 | 无锡江松科技股份有限公司 | Sucker carrying device |
| CN116534572A (en) * | 2023-04-13 | 2023-08-04 | 深圳泰德半导体装备有限公司 | Material taking mechanism and transfer device |
-
2024
- 2024-02-04 CN CN202410156492.7A patent/CN117690851B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531678A (en) * | 2017-01-05 | 2017-03-22 | 江西比太科技有限公司 | Silicon wafer gripping device and solar cell production equipment of using same |
| CN109841706A (en) * | 2019-03-23 | 2019-06-04 | 东莞市科隆威自动化设备有限公司 | Solar silicon wafers tear piece laminating method and imbrication general assembly line open |
| CN219106108U (en) * | 2023-02-13 | 2023-05-30 | 无锡江松科技股份有限公司 | Sucker carrying device |
| CN116534572A (en) * | 2023-04-13 | 2023-08-04 | 深圳泰德半导体装备有限公司 | Material taking mechanism and transfer device |
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| Publication number | Publication date |
|---|---|
| CN117690851B (en) | 2024-04-09 |
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