CN117690844B - Automatic conveying equipment for vertical furnace processing wafers - Google Patents
Automatic conveying equipment for vertical furnace processing wafers Download PDFInfo
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- CN117690844B CN117690844B CN202410145462.6A CN202410145462A CN117690844B CN 117690844 B CN117690844 B CN 117690844B CN 202410145462 A CN202410145462 A CN 202410145462A CN 117690844 B CN117690844 B CN 117690844B
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 114
- 230000007246 mechanism Effects 0.000 claims description 64
- 238000009434 installation Methods 0.000 claims 2
- 230000003028 elevating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 239000000969 carrier Substances 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of wafer conveying, in particular to automatic conveying equipment for vertical furnace processing wafers, which comprises a conveying module, wherein two circular plates are symmetrically and detachably arranged on the conveying module. When a plurality of wafers are conveyed by adopting the existing method, conveying equipment, carriers and cleaning working areas are usually required to be prepared, then the wafers are placed on proper carriers, the carriers carrying the wafers are placed on the conveying equipment, and after the wafers reach target positions, the wafers are correspondingly processed, so that the steps are simple, the wafers are not easy to place on the carriers, and the wafers are easy to collide with the carriers in the placing process of the wafers. The guiding device adopted by the invention can guide the wafer when the wafer is placed, so that collision between the wafer and equipment is avoided, the integrity of the placed wafer is ensured, the opening for the wafer to enter is enlarged by the guiding device, and the difficulty of placing the wafer is reduced.
Description
Technical Field
The invention relates to the technical field of wafer conveying, in particular to automatic conveying equipment for processing wafers by a vertical furnace.
Background
The vertical furnace is a device for semiconductor processing, which is generally used in the heat treatment and deposition processes of wafers, high-purity polysilicon is dissolved and then doped with silicon crystal seeds, then is slowly deposited and pulled out in the vertical furnace to form cylindrical monocrystalline silicon, and a silicon crystal bar is ground, polished and sliced to form silicon wafers, namely wafers.
The wafer is easy to be contaminated with impurities on the surface after slicing, the impurities can affect the performance of the wafer, and in order to ensure the performance of the wafer, the sliced wafer needs to be subjected to heat treatment, so that a plurality of wafers need to be conveyed to a vertical furnace through conveying equipment, and then the wafers need to be placed into the vertical furnace for heat treatment.
When the existing method is adopted to convey a plurality of wafers, conveying equipment, carriers and cleaning working areas are usually required to be prepared, the conveying paths are guaranteed to be clean, dust-free and impurity-free, the wafers are placed on the appropriate carriers, the carriers carrying the wafers are placed on the conveying equipment according to the conveying path setting and the production plan, and the wafers are correspondingly processed after reaching the target positions.
However, in the method, the wafer is not easy to be placed on the carrier for transportation, the phenomenon that the wafer collides with the carrier easily occurs in the placing process of the wafer, and the space between the adjacent wafers is smaller because of more wafers placed on the carrier, so that the difficulty of taking out the wafer is increased.
Disclosure of Invention
Based on the above, it is necessary to provide an automatic conveying device for vertical furnace processing wafers, which aims to solve the problems generated in the prior art when conveying the wafers.
In order to achieve the above purpose, the present invention is implemented by adopting the following technical scheme: an automatic transfer apparatus for vertical furnace processing wafers, comprising: the conveying module is characterized in that two circular ring plates are detachably arranged on the conveying module in a bilateral symmetry mode, and three rectangular through holes which are distributed uniformly in a semicircular mode are formed in the circular ring plates.
The spacing device is provided with three and is semicircle evenly distributed between two the ring board, the spacing device includes sliding connection two relative in controlling rectangular strip in the rectangle through-hole, rectangular strip is close to the one end of ring board axis and installs and place the seat, places the seat and is close to the one end of ring board axis and has seted up a plurality of evenly distributed and be used for placing the opening of placing the wafer, and two adjustment mechanism are installed to rectangular strip left and right sides both ends symmetry, and adjustment mechanism is connected with the ring board.
The guide device is provided with two guide frames which are symmetrically distributed around, the two guide devices are respectively fixedly connected with the front rectangular strips and the rear rectangular strips, the guide device comprises a limiting mechanism which is installed at one end, far away from the central axis of the circular ring plate, of the rectangular strips, a lifting mechanism is connected in the limiting mechanism, a guide frame used for guiding wafers is installed on the lifting mechanism, and a connecting mechanism is installed at the lower end of the lifting mechanism.
The jacking device is arranged on the rectangular strip at the lower side and comprises a second guide rail strip arranged at the lower end of the rectangular strip at the lower side, a sliding mechanism is sleeved on the second guide rail strip, a jacking frame with an upward opening and a U-shaped structure is arranged on the sliding mechanism in a sliding mode, a connecting spring is arranged between the upper end of the middle section of the jacking frame and the sliding mechanism, and two anti-deflection mechanisms are symmetrically arranged at the front and back ends of the upper end of the jacking frame.
According to the embodiment of the invention, the adjusting mechanism comprises a first sliding block arranged at the end part of the rectangular strip, a sliding rail rod is arranged in the middle of the first sliding block in a sliding way, the sliding rail rod is arranged at the opposite ends of the circular plate, a plurality of evenly distributed threaded holes are formed in the sliding rail rod, one end of the first sliding block, which is far away from the circular plate, is in threaded connection with a limit screw rod, and the limit screw rod is in threaded connection with any one of the threaded holes.
According to the embodiment of the invention, the limiting mechanism comprises a rectangular frame arranged at one end of the rectangular bar, which is far away from the central axis of the annular plate, a first guide rail bar is horizontally arranged in the rectangular frame, one end of the rectangular frame, which is far away from the rectangular bar, is provided with one end of a return spring, the other end of the return spring is provided with a strip-shaped plate, one end of the strip-shaped plate, which is close to the rectangular frame, is provided with a plurality of limiting columns which are uniformly distributed and are in one-to-one correspondence with the placement openings, the limiting columns penetrate through the frame wall of the rectangular frame, which is far away from the rectangular bar, in a sliding manner, and the end parts of the limiting columns are provided with hemispherical protrusions.
According to the embodiment of the invention, the lifting mechanism comprises a second sliding block sleeved on the first guide rail strip, the upper end of the second sliding block is provided with a lifting rod, the upper end of the lifting rod is provided with a mounting block, the mounting block is fixedly connected with the guide frame, and one end of the second sliding block, which is far away from the rectangular strip, is provided with a hemispherical groove.
According to the embodiment of the invention, the connecting mechanism comprises a connecting rod arranged at the lower end of the second sliding block, a first rectangular groove is formed in the lower end of the connecting rod, a lifting bar is connected in the first rectangular groove in a sliding manner, a first spring is arranged between the upper end of the lifting bar and the rectangular groove, and a connecting block is arranged at the lower end of the lifting bar.
According to the embodiment of the invention, the sliding mechanism comprises a moving bar sleeved on the second guide rail bar, two second rectangular grooves are symmetrically formed in the front end and the rear end of the moving bar, a moving rod is connected in the second rectangular grooves in a sliding mode, one end, away from the moving bar, of the moving rod is fixedly connected with the connecting block, and a second spring is arranged between the moving rod and the second rectangular grooves.
According to the embodiment of the invention, the anti-deviation mechanism comprises a rotating frame rotatably connected to the upper end of the jacking frame, the rotating frame is positioned on the outer side of the jacking frame, two limiting plates are symmetrically arranged at the end part of the rotating frame, which is positioned at the hinge position, of the rotating frame, an auxiliary roller is rotatably connected to one end of the rotating frame, which is far away from the hinge position, an auxiliary spring is arranged between the middle section of the rotating frame and the jacking frame, and a limiting block fixedly connected with the moving strip is arranged below the auxiliary roller.
According to the embodiment of the invention, the guide frame is of a U-shaped structure with an opening facing the central axis of the circular ring plate, the upper end of the guide frame is integrally formed with a horn-shaped opening, and the inside of the vertical section of the guide frame is provided with a right-angled triangle guide block.
According to the embodiment of the invention, the upper end of the jacking frame is provided with a cylindrical bulge.
In summary, the present invention includes at least one of the following beneficial technical effects: 1. the spacing device can separate the placed wafers from each other, so that collision between the wafers is avoided, the spacing device can also adjust the placement size, and the wafers with different sizes can be placed in a certain range, so that the use occasion of the equipment is increased, and the practicability of the equipment is improved.
2. The adopted guide device can guide the wafer when the wafer is placed, so that the inclination in the wafer placement process is avoided, the collision between the wafer and equipment is avoided, the integrity of the wafer after placement is ensured, the opening for the wafer to enter is further enlarged by the guide device, and the difficulty of the wafer placement is reduced.
3. The jacking device can buffer the falling of the wafer in the placing process of the wafer, so that the wafer falling speed is prevented from being too fast to collide, and the well placed wafer can be ejected by the jacking device, so that the required wafer can be conveniently taken out from the plurality of closely placed wafers, and the difficulty in taking out the wafer is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view showing an automatic vertical furnace processing wafer conveying apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view showing a removal and transfer module of an automatic transfer apparatus for processing wafers in a vertical furnace according to an embodiment of the present invention.
Fig. 3 is a front view showing an automatic vertical furnace process wafer transfer apparatus according to an embodiment of the present invention.
Fig. 4 shows a left side view of an automatic vertical furnace process wafer transfer apparatus provided according to an embodiment of the present invention.
Figure 5 shows a cross-sectional view of A-A in figure 3.
Fig. 6 shows an enlarged view of the region X in fig. 5.
Fig. 7 shows a cross-sectional view of B-B in fig. 4.
Fig. 8 shows an enlarged view of the N region in fig. 7.
Fig. 9 is a schematic structural view showing a guide device of an automatic conveying device for vertical furnace processing wafers according to an embodiment of the present invention.
Fig. 10 is a schematic structural view showing a jacking device of an automatic conveying device for vertical furnace processing wafers according to an embodiment of the invention.
Wherein the above figures include the following reference numerals: 1. a transfer module; 2. a circular plate; 21. rectangular through holes; 3. a spacing device; 31. a rectangular bar; 32. a placement seat; 322. placing the opening; 33. an adjusting mechanism; 331. a first slider; 332. a slide rail rod; 333. a threaded hole; 334. a limit screw; 4. a guide device; 41. a limiting mechanism; 411. a rectangular frame; 412. a first guide rail; 413. a return spring; 414. a strip-shaped plate; 415. a limit column; 42. a lifting mechanism; 421. a second slider; 422. a lifting rod; 423. a mounting block; 43. a guide frame; 44. a connecting mechanism; 441. a connecting rod; 442. a first spring; 443. lifting bars; 444. a connecting block; 445. a first rectangular groove; 5. a jacking device; 51. a second guide rail; 52. a sliding mechanism; 521. moving the bar; 522. a second rectangular groove; 523. a moving rod; 524. a second spring; 53. a jacking frame; 54. a connecting spring; 55. an anti-deviation mechanism; 551. a rotating frame; 552. a limiting plate; 553. an auxiliary roller; 554. an auxiliary spring; 555. and a limiting block.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
Referring to fig. 1, 2, 3 and 5, an automatic vertical furnace processing wafer conveying device comprises a conveying module 1, wherein two annular plates 2 are detachably arranged on the conveying module 1 in a bilateral symmetry manner, and three rectangular through holes 21 which are distributed uniformly in a semicircular manner are formed in the annular plates 2.
Referring to fig. 1, fig. 2, fig. 4 and fig. 7, the automatic conveying device for processing wafers in the vertical furnace further comprises a spacing device 3, the spacing device 3 is provided with three rectangular strips 31 which are uniformly distributed between the two circular plates 2 in a semicircular manner, the spacing device 3 comprises two rectangular strips 31 which are connected in a left-right opposite manner in the rectangular through holes 21, a placement seat 32 is installed at one end, close to the central axis of the circular plates 2, of each rectangular strip 31, a plurality of placement openings 322 which are uniformly distributed and are used for placing the wafers are formed at one end, close to the central axis of the circular plates 2, of each placement seat 32, two adjusting mechanisms 33 are symmetrically installed at the left end and the right end of each rectangular strip 31, and the adjusting mechanisms 33 are connected with the circular plates 2.
Referring to fig. 7 and 8, the adjusting mechanism 33 includes a first slider 331 mounted at an end of the rectangular bar 31, a sliding rail rod 332 is slidably disposed in the middle of the first slider 331, the sliding rail rod 332 is mounted at opposite ends of the circular plate 2, a plurality of evenly distributed threaded holes 333 are formed in the sliding rail rod 332, one end of the first slider 331 far away from the circular plate 2 is in threaded connection with a limit screw 334, and the limit screw 334 is in threaded connection with any one of the threaded holes 333.
Referring to fig. 2, fig. 7 and fig. 8, in specific operation, initially, the limit screw 334 and the screw hole 333 are in a separated state, according to the size of a processed wafer, three rectangular strips 31 are pushed in sequence, the rectangular strips 31 slide on two slide rails 332 through two first sliding blocks 331, meanwhile, the rectangular strips 31 drive the placement seat 32 to move, after the first sliding blocks 331 move to the screw hole 333 at the corresponding position, the limit screw 334 is connected in the screw hole 333 at the corresponding position, so that the rectangular strips 31 are limited, the placement seat 32 is further limited, the distance between the three placement seats 32 is changed, the distance between the three placement seats 32 is adjustable, the placement of wafers with different sizes can be realized, the diversity of the placeable wafers is improved, and the practicability of the device is further improved.
Referring to fig. 2, 4, 5 and 7, the automatic conveying device for processing wafers in the vertical furnace further comprises a guiding device 4, the two guiding devices 4 are arranged and are symmetrically distributed in front and back, the two guiding devices 4 are respectively and fixedly connected with the front rectangular strip 31 and the back rectangular strip 31, the guiding device 4 comprises a limiting mechanism 41 installed at one end, far away from the central axis of the circular plate 2, of the rectangular strip 31, a lifting mechanism 42 is connected in the limiting mechanism 41, a guiding frame 43 for guiding the wafers is installed on the lifting mechanism 42, and a connecting mechanism 44 is installed at the lower end of the lifting mechanism 42.
Referring to fig. 2, 5 and 7, in specific operation, the lifting mechanism 42 plays a role in connecting the guide frame 43, the guide frame 43 can move up and down through the lifting mechanism 42, and the lifting mechanism 42 drives the guide frame 43 to slide in the limiting mechanism 41, so that the position of the guide frame 43 above the placement seat 32 is changed.
Referring to fig. 5 and 6, the limiting mechanism 41 includes a rectangular frame 411 mounted at one end of the rectangular bar 31 far away from the central axis of the circular plate 2, a first guide rail bar 412 is horizontally mounted in the rectangular frame 411, one end of the rectangular frame 411 far away from the rectangular bar 31 is provided with one end of a return spring 413, the other end of the return spring 413 is provided with a bar plate 414, one end of the bar plate 414 near the rectangular frame 411 is provided with a plurality of uniformly distributed limiting columns 415 in one-to-one correspondence with the placement openings 322, the limiting columns 415 slide to penetrate through the rectangular frame 411 and far away from the frame wall of the rectangular bar 31, and hemispherical protrusions are arranged at the ends of the limiting columns 415.
Referring to fig. 5, 6 and 9, the lifting mechanism 42 includes a second slider 421 sleeved on the first guide rail 412, a lifting rod 422 is installed at the upper end of the second slider 421, a mounting block 423 is installed at the upper end of the lifting rod 422, the mounting block 423 is fixedly connected with the guide frame 43, and a hemispherical groove is formed at one end of the second slider 421 away from the rectangular bar 31.
Referring to fig. 5, the guide frame 43 has a U-shaped structure with an opening facing the central axis of the circular plate 2, a horn-shaped opening is integrally formed at the upper end of the guide frame 43, and a right triangle guide block is mounted in the vertical section of the guide frame 43.
Referring to fig. 5, 6 and 9, in specific operation, initially, the second slide 421 drives the guide frame 43 to be at one end of the first guide rail 412 through the lifting rod 422 and the mounting block 423, at this time, the lifting rod 422 is in the shortest state, the lower end of the guide frame 43 is closely attached to the upper end of the placement seat 32, the opening of the guide frame 43 is aligned with the placement opening 322 on the placement seat 32, the strip plate 414 pushes the plurality of limiting posts 415 through the return spring 413, the hemispherical protrusions on the corresponding limiting posts 415 are matched with the hemispherical grooves on the second slide 421 to limit the second slide 421, the guide frame 43 is further limited, then the wafer is clamped by the manual or existing clamping claws to pass through the two guide frames 43 in a vertical state, and enters the corresponding placement openings 322 on the front and rear placement seats 32 after passing through the two guide frames 43, the horn-shaped openings at the upper ends of the two guide frames 43 play a role in guiding and enlarging the placing space of the wafer, the situation that the placing opening 322 is too small to cause collision between the wafer and the placing seat 32 is avoided, the placing difficulty of the wafer is reduced, the wafer passing through the front and rear two placing seats 32 continuously descends and falls into the corresponding placing opening 322 on the lower placing seat 32, the clamping of the wafer is relieved, the three placing seats 32 support and limit the wafer through the three placing openings 322, then the two guide frames 43 are lifted upwards, the guide frames 43 stretch the lifting rods 422, then the guide frames 43 are transversely pushed, the guide frames 43 drive the second slide blocks 421 to move through the lifting rods 422, the hemispherical grooves on the second slide blocks 421 push hemispherical protrusions on the corresponding limiting columns 415, the limiting columns 415 are forced to drive the strip plates 414 to move, the strip plates 414 stretch the reset springs 413, then the second slide block 421 moves to the adjacent position-limiting column 415, and the adjacent position-limiting column 415 limits the second slide block 421, so that the position of the guide frame 43 above the placing seat 32 is changed, the guide frame 43 is pressed to the upper end of the placing seat 32, the previous wafer placing step is repeated, and the step of changing the position of the guide frame 43 is repeated until wafers are placed in the placing openings 322 on the placing seat 32.
Referring to fig. 5, 7 and 9, the connecting mechanism 44 includes a connecting rod 441 mounted at the lower end of the second slider 421, a first rectangular slot 445 is formed at the lower end of the connecting rod 441, a lifting bar 443 is slidably connected in the first rectangular slot 445, a first spring 442 is mounted between the upper end of the lifting bar 443 and the rectangular slot, and a connecting block 444 is mounted at the lower end of the lifting bar 443.
Referring to fig. 1, 5, 7 and 10, the automatic conveying device for processing wafers in a vertical furnace further comprises a jacking device 5, the jacking device 5 is arranged on the rectangular strip 31 positioned at the lower side, the jacking device 5 comprises a second guide rail strip 51 arranged at the lower end of the rectangular strip 31 positioned at the lower side, a sliding mechanism 52 is sleeved on the second guide rail strip 51, a jacking frame 53 with an upward opening and a U-shaped structure is arranged on the sliding mechanism 52 in a sliding manner, a connecting spring 54 is arranged between the upper end of the middle section of the jacking frame 53 and the sliding mechanism 52, two anti-deflection mechanisms 55 are symmetrically arranged front and back at the upper end of the jacking frame 53, and cylindrical protrusions are arranged at the upper end of the jacking frame 53.
Referring to fig. 5 and 10, the sliding mechanism 52 includes a moving bar 521 sleeved on the second guide rail 51, two second rectangular grooves 522 are symmetrically formed at front and rear ends of the moving bar 521, a moving rod 523 is slidably connected in the second rectangular grooves 522, one end of the moving rod 523 away from the moving bar 521 is fixedly connected with the connecting block 444, and a second spring 524 is installed between the moving rod 523 and the second rectangular grooves 522.
Referring to fig. 5, 9 and 10, in specific operation, two connection blocks 444 are fixedly connected with two movement rods 523, when two placement bases 32 distributed back and forth are subjected to position adjustment, the rectangular bars 31 distributed back and forth drive the second slide block 421 to move through the rectangular frame 411 and the first guide rail 412, the second slide block 421 drives the connection blocks 444 to move through the connection rods 441 and the lifting bars 443, the connection blocks 444 drive the movement rods 523 to slide in the second rectangular grooves 522 and pull the second springs 524, so that the function of position adjustment of the two placement bases 32 distributed back and forth is realized, when the placement bases 32 positioned below are subjected to position adjustment, the rectangular bars 31 positioned below drive the movement bars 521 to move up and down through the second guide rail 51, the movement bars 521 drive the two movement bars 523 to move up and down, the connection blocks 444 drive the lifting bars 443 to slide in the first rectangular grooves 445 and pull the first springs 442, the function of position adjustment of the placement bases 32 positioned below is realized, when the two guide frames 441 move through the two guide frames 441 drive the two lifting bars 421 to move through the two guide frames 53 to move through the two connection rods 53 and the two jack-off-up and jack mechanisms 53, the two jack-up and-down movement mechanisms 53 are correspondingly contacted with the two jack-down frames 53, the two jack frames 53 move up and the two jack frames 53 are prevented from moving up and down through the two jack frames 53, the lifting frame 53 plays a role in buffering the falling of the wafer through the connecting spring 54, so that the falling speed of the wafer is prevented from being too high, and the wafer is prevented from being damaged due to collision with the placement seat 32 positioned below, and the connecting spring 54 is a light spring and does not influence the falling of the wafer.
Referring to fig. 5 and 10, the anti-deviation mechanism 55 includes a rotating frame 551 rotatably connected to the upper end of the lifting frame 53, the rotating frame 551 is located at the outer side of the lifting frame 53, two limiting plates 552 are symmetrically installed at the end of the rotating frame 551 at the hinge, one end of the rotating frame 551 away from the hinge is rotatably connected with an auxiliary roller 553, an auxiliary spring 554 is installed between the middle section of the rotating frame 551 and the lifting frame 53, and a limiting block 555 fixedly connected with the moving bar 521 is disposed below the auxiliary roller 553.
Referring to fig. 5 and 10, in particular, during operation, in the initial state, two limiting plates 552 are in the vertical state, when the wafer continues to descend and contacts with the cylindrical protrusions at the upper end of the lifting frame 53, the wafer is located between the two limiting plates 552, the two limiting plates 552 limit in the transverse direction of the wafer, the wafer is ensured to accurately enter the corresponding placement opening 322 on the underlying placement seat 32, the wafer is prevented from tilting or colliding with in the placement process, the lifting frame 53 is pressed down on the lifting frame 53 after being contacted with the wafer, the lifting frame 53 is stressed to drive the rotating frame 551 to move downwards, the rotating frame 551 moves downwards and contacts with the limiting block 555, the limiting block 555 blocks the rotating frame 551, and meanwhile, the rotating frame 551 rotates and stretches the auxiliary springs 554, the rotating frame 551 drives the two limiting plates 552 to rotate, after the lifting frame 53 stops moving, the two limiting plates 552 are relieved, the wafer is prevented from being limited by the lifting frame 551, the wafer is prevented from being influenced by the movement of the lifting frame 53, and the wafer is conveniently lifted out of the lifting frame 53 by the lifting frame 53 when the wafer is required to be lifted by the lifting frame 53, and the wafer is conveniently lifted from the lifting frame 53.
Referring to fig. 1, 2 and 7, after a plurality of wafers are placed, two ring plates 2 are lifted by the existing lifting device, the two ring plates 2 drive the plurality of wafers to move by three placing seats 32, the lifting device lifts the two ring plates 2 onto a conveying module 1 (the conveying module 1 is the existing conveying device), and the conveying module 1 is started to drive the ring plates 2 to move, so that automatic conveying of the plurality of wafers is realized.
In the description of the embodiments of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "outer", etc., are based on those shown in the drawings, are merely for convenience of describing the embodiments of the present invention and for simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality", "a plurality of groups" is two or more.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The embodiments of the present invention are all preferred embodiments of the present invention, and are not limited in scope by the present invention, so that all equivalent changes according to the structure, shape and principle of the present invention are covered in the scope of the present invention.
Claims (9)
1. Automatic conveying equipment of vertical stove processing wafer, including conveying module (1), its characterized in that: two circular ring plates (2) are symmetrically and detachably arranged on the conveying module (1), and three rectangular through holes (21) which are uniformly distributed in a semicircular mode are formed in the circular ring plates (2);
the spacing device (3) is provided with three rectangular strips (31) which are uniformly distributed between the two circular ring plates (2) in a semicircular mode, the spacing device (3) comprises two rectangular through holes (21) which are opposite left and right in a sliding mode, a placing seat (32) is arranged at one end, close to the central axis of the circular ring plates (2), of each rectangular strip (31), a plurality of placing openings (322) which are uniformly distributed and used for placing wafers are formed in one end, close to the central axis of the circular ring plates (2), of each placing seat (32), two adjusting mechanisms (33) are symmetrically arranged at the left end and the right end of each rectangular strip (31), and the adjusting mechanisms (33) are connected with the circular ring plates (2);
the guide devices (4) are arranged in a front-back symmetrical mode, the two guide devices (4) are fixedly connected with the front rectangular strips (31) and the rear rectangular strips (31) respectively, the guide devices (4) comprise limiting mechanisms (41) arranged at one ends, far away from the central axis of the circular plate (2), of the rectangular strips (31), lifting mechanisms (42) are connected in the limiting mechanisms (41), guide frames (43) for guiding wafers are arranged on the lifting mechanisms (42), and connecting mechanisms (44) are arranged at the lower ends of the lifting mechanisms (42);
the jacking device (5) is arranged on the rectangular strip (31) located at the lower side, the jacking device (5) comprises a second guide rail strip (51) arranged at the lower end of the rectangular strip (31) located at the lower side, a sliding mechanism (52) is sleeved on the second guide rail strip (51), a jacking frame (53) with an upward opening and a U-shaped structure is arranged on the sliding mechanism (52) in a sliding mode, a connecting spring (54) is arranged between the upper end of the middle section of the jacking frame (53) and the sliding mechanism (52), and two anti-deflection mechanisms (55) are symmetrically arranged at the front and back of the upper end of the jacking frame (53).
2. An automatic vertical furnace processing wafer transfer apparatus according to claim 1, wherein: the adjusting mechanism (33) comprises a first sliding block (331) arranged at the end part of the rectangular strip (31), a sliding rail rod (332) is arranged in the middle of the first sliding block (331) in a sliding mode, the sliding rail rod (332) is arranged at the opposite ends of the circular ring plate (2), a plurality of evenly distributed threaded holes (333) are formed in the sliding rail rod (332), one end of the first sliding block (331) away from the circular ring plate (2) is in threaded connection with a limit screw (334), and the limit screw (334) is in threaded connection with any one of the threaded holes (333).
3. An automatic vertical furnace processing wafer transfer apparatus according to claim 2, wherein: stop gear (41) are including installing rectangular frame (411) of round annular plate (2) axis one end is kept away from to rectangle strip (31), first guide rail strip (412) are installed to level in rectangle frame (411), the one end of reset spring (413) is installed to one end that rectangle strip (31) was kept away from to rectangle frame (411), strip shaped plate (414) are installed to the other end of reset spring (413), a plurality of evenly distributed and with place spacing post (415) of opening (322) one-to-one are installed to the one end that strip shaped plate (414) is close to rectangle frame (411), spacing post (415) slip run through rectangle frame (411) are kept away from the frame wall of rectangle strip (31), spacing post (415) tip is provided with hemispherical protrusion.
4. A vertical furnace processing wafer automatic transfer apparatus according to claim 3, wherein: elevating system (42) are including the cover establish second slider (421) on first guide rail strip (412), lifter (422) are installed to second slider (421) upper end, and installation piece (423) are installed to lifter (422) upper end, and hemisphere groove has been seted up to one end that rectangle strip (31) was kept away from to second slider (421) and guide frame (43) fixed connection to installation piece (423).
5. An automatic transfer apparatus for vertical furnace processing wafers as set forth in claim 4 wherein: the connecting mechanism (44) comprises a connecting rod (441) arranged at the lower end of the second sliding block (421), a first rectangular groove (445) is formed in the lower end of the connecting rod (441), a lifting strip (443) is connected in a sliding mode in the first rectangular groove (445), a first spring (442) is arranged between the upper end of the lifting strip (443) and the rectangular groove, and a connecting block (444) is arranged at the lower end of the lifting strip (443).
6. An automatic transfer apparatus for vertical furnace processing wafers as set forth in claim 5 wherein: the sliding mechanism (52) comprises a moving bar (521) sleeved on the second guide rail bar (51), two second rectangular grooves (522) are symmetrically formed in the front end and the rear end of the moving bar (521), a moving rod (523) is connected in a sliding mode in the second rectangular grooves (522), one end, far away from the moving bar (521), of the moving rod (523) is fixedly connected with the connecting block (444), and a second spring (524) is installed between the moving rod (523) and the second rectangular grooves (522).
7. An automatic transfer apparatus for vertical furnace processing wafers as set forth in claim 6 wherein: the anti-deviation mechanism (55) comprises a rotating frame (551) which is rotationally connected to the upper end of the jacking frame (53), the rotating frame (551) is located on the outer side of the jacking frame (53), two limiting plates (552) are symmetrically arranged at the end part of the hinging position of the rotating frame (551), one end of the rotating frame (551) away from the hinging position is rotationally connected with an auxiliary roller (553), an auxiliary spring (554) is arranged between the middle section of the rotating frame (551) and the jacking frame (53), and a limiting block (555) fixedly connected with the movable strip (521) is arranged below the auxiliary roller (553).
8. An automatic vertical furnace processing wafer transfer apparatus according to claim 1, wherein: the guide frame (43) is of a U-shaped structure with an opening facing the central axis of the circular plate (2), a horn-shaped opening is integrally formed at the upper end of the guide frame (43), and a right triangle guide block is arranged in the vertical section of the guide frame (43).
9. An automatic vertical furnace processing wafer transfer apparatus according to claim 1, wherein: the upper end of the jacking frame (53) is provided with a cylindrical bulge.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410145462.6A CN117690844B (en) | 2024-02-02 | 2024-02-02 | Automatic conveying equipment for vertical furnace processing wafers |
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| CN202410145462.6A CN117690844B (en) | 2024-02-02 | 2024-02-02 | Automatic conveying equipment for vertical furnace processing wafers |
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| CN117690844B true CN117690844B (en) | 2024-04-05 |
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| CN117174627A (en) * | 2023-09-22 | 2023-12-05 | 上海广川科技有限公司 | Compatible wafer buffer device |
| CN117410218A (en) * | 2023-11-08 | 2024-01-16 | 浙江丽水中欣晶圆半导体科技有限公司 | Flower basket bearing wafer system of CV pretreatment cleaning machine and operation method |
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| JPH1070081A (en) * | 1996-08-28 | 1998-03-10 | Toshiba Ceramics Co Ltd | Vertical furnace for semiconductor wafer |
| JPH1140659A (en) * | 1997-07-15 | 1999-02-12 | Toshiba Ceramics Co Ltd | Heat treating vertical boat for semiconductor wafer |
| KR20120128414A (en) * | 2011-05-17 | 2012-11-27 | 주식회사 포틱스 | The wafer picker device for using solar cell wafer transfer system |
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| CN117690844A (en) | 2024-03-12 |
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