CN117683490A - Adhesive composition, adhesive layer, optical film with adhesive layer, and display device - Google Patents
Adhesive composition, adhesive layer, optical film with adhesive layer, and display device Download PDFInfo
- Publication number
- CN117683490A CN117683490A CN202311103086.6A CN202311103086A CN117683490A CN 117683490 A CN117683490 A CN 117683490A CN 202311103086 A CN202311103086 A CN 202311103086A CN 117683490 A CN117683490 A CN 117683490A
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- Prior art keywords
- meth
- parts
- mass
- acrylic polymer
- adhesive composition
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 94
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 94
- 239000000203 mixture Substances 0.000 title claims abstract description 94
- 239000012790 adhesive layer Substances 0.000 title claims abstract description 85
- 239000012788 optical film Substances 0.000 title claims abstract description 12
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 95
- 239000002216 antistatic agent Substances 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims abstract description 22
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 14
- 239000000178 monomer Substances 0.000 claims description 98
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 87
- -1 isocyanate compound Chemical class 0.000 claims description 35
- 239000000470 constituent Substances 0.000 claims description 28
- 125000000217 alkyl group Chemical group 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 18
- 125000002947 alkylene group Chemical group 0.000 claims description 16
- 125000000524 functional group Chemical group 0.000 claims description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 14
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 239000013522 chelant Substances 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 239000002585 base Substances 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 38
- 238000011156 evaluation Methods 0.000 description 27
- 239000011521 glass Substances 0.000 description 27
- 239000000758 substrate Substances 0.000 description 20
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 18
- 238000005187 foaming Methods 0.000 description 16
- 238000012360 testing method Methods 0.000 description 15
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000009472 formulation Methods 0.000 description 11
- 239000002994 raw material Substances 0.000 description 11
- 239000003505 polymerization initiator Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 239000004480 active ingredient Substances 0.000 description 8
- 239000012986 chain transfer agent Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 6
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 230000000379 polymerizing effect Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- XALVHDZWUBSWES-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;tributyl(methyl)azanium Chemical class CCCC[N+](C)(CCCC)CCCC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F XALVHDZWUBSWES-UHFFFAOYSA-N 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 210000002858 crystal cell Anatomy 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 2
- 238000010557 suspension polymerization reaction Methods 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- ZICNIEOYWVIEQJ-UHFFFAOYSA-N (2-methylbenzoyl) 2-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1C ZICNIEOYWVIEQJ-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- IAMASUILMZETHW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCC(O)OC1=CC=CC=C1 IAMASUILMZETHW-UHFFFAOYSA-N 0.000 description 1
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- COORVRSSRBIIFJ-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCOCCO COORVRSSRBIIFJ-UHFFFAOYSA-N 0.000 description 1
- ZHCHRKVXJJJZFX-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-phenoxyethanol Chemical compound OCCOCCOCC(O)OC1=CC=CC=C1 ZHCHRKVXJJJZFX-UHFFFAOYSA-N 0.000 description 1
- IPVAVWWFUTUCQX-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCCOCC(O)OC1=CC=CC=C1 IPVAVWWFUTUCQX-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- ZCRUJAKCJLCJCP-UHFFFAOYSA-N 3-[methoxy(dimethyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(C)CCCOC(=O)C=C ZCRUJAKCJLCJCP-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- RTANHMOFHGSZQO-UHFFFAOYSA-N 4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)C#N RTANHMOFHGSZQO-UHFFFAOYSA-N 0.000 description 1
- RRBONVXWAGQXDJ-UHFFFAOYSA-N 4-methoxybutyl 2-sulfanylacetate Chemical compound COCCCCOC(=O)CS RRBONVXWAGQXDJ-UHFFFAOYSA-N 0.000 description 1
- VIQGKXOVPDLASV-UHFFFAOYSA-N 4-methoxybutyl 2-sulfanylpropanoate Chemical compound COCCCCOC(=O)C(C)S VIQGKXOVPDLASV-UHFFFAOYSA-N 0.000 description 1
- JOVCTEPPTIOAPX-UHFFFAOYSA-N 8-trimethoxysilyloctyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C=C JOVCTEPPTIOAPX-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 1
- 239000004985 Discotic Liquid Crystal Substance Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- INLLPKCGLOXCIV-UHFFFAOYSA-N bromoethene Chemical compound BrC=C INLLPKCGLOXCIV-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical class C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- MADOXCFISYCULS-UHFFFAOYSA-N octyl 2-sulfanylacetate Chemical compound CCCCCCCCOC(=O)CS MADOXCFISYCULS-UHFFFAOYSA-N 0.000 description 1
- SFHANYOFMGEJCT-UHFFFAOYSA-N octyl 2-sulfanylpropanoate Chemical compound CCCCCCCCOC(=O)C(C)S SFHANYOFMGEJCT-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001909 styrene-acrylic polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/285—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
- C08F220/286—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
Abstract
The invention relates to an adhesive composition, an adhesive layer, an optical film with the adhesive layer and a display device. An adhesive composition which has improved durability and antistatic properties in a high-temperature environment. Provided is an adhesive composition containing a 1 st (meth) acrylic polymer (A), a 2 nd (meth) acrylic polymer (B), a crosslinking agent (C), and an antistatic agent (D). The adhesive composition is relative to the firstThe 2 nd (meth) acrylic polymer (B) is contained in an amount of 1 to 50 parts by mass based on 100 parts by mass of the 1 (meth) acrylic polymer (a). The surface resistivity of the layer formed by the adhesive composition is less than 8.0X10 8 Ω/□。
Description
Technical Field
The invention relates to an adhesive composition, an adhesive layer, an optical film with the adhesive layer and a display device.
Background
In recent years, liquid crystal display devices have been used in a wide variety of applications such as in-vehicle applications, outdoor equipment, and personal computers. An adhesive layer formed of the adhesive composition adheres the polarizing plate to a liquid crystal cell (glass substrate) of a liquid crystal display device. However, since the polarizing plate has a property of stretching in a high-temperature environment, the polarizing plate may be peeled off from the glass substrate. In addition, if the release film that is not attached to the polarizing plate side is peeled off in order to attach the polarizing plate to the glass substrate, static electricity is generated. The generated static electricity may adversely affect, for example, a liquid crystal layer and a capacitance sensor of a liquid crystal display device.
In view of the above problems, patent document 1 proposes an optical pressure-sensitive adhesive composition comprising an adhesive modifier formed of an acrylic/silicone graft copolymer having a hydrolyzable silyl group, in order to impart moderate peelability and long-term stability of adhesive strength. Patent document 2 proposes an adhesive composition in which an alkoxysilyl group-containing acrylic polymer and a crosslinkable acrylic polymer are used together so as not to increase the relative dielectric constant when forming an adhesive layer. Patent document 3 proposes an optically functional film formed from an adhesive composition containing a (meth) acrylic oligomer having a hydrolyzable silyl group in order to improve durability under high-temperature and high-humidity conditions. Patent document 4 proposes an adhesive sheet containing an acrylic copolymer containing an alkylene oxide group-containing monomer as a monomer component in order to achieve antistatic performance and durability under severe environmental conditions.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2014-037502
Patent document 2: japanese patent application laid-open No. 2019-014778
Patent document 3: japanese patent laid-open No. 2008-101168
Patent document 4: japanese patent laid-open No. 2020-002225
Disclosure of Invention
Problems to be solved by the invention
However, the polymer of patent document 1 does not have sufficient durability because phase separation from the acrylic polymer occurs under a high temperature environment. In addition, the acrylic oligomer of patent document 2 has a weight average molecular weight (Mw) of 400 to 5000, and the acrylic polymer has little interaction with the acrylic polymer having a hydrolyzed alkoxysilyl group, and does not have sufficient durability in a high-temperature environment. The optically functional film of patent document 3 does not have sufficient durability even in a high-temperature environment. The adhesive sheet of patent document 4 has the following problems: if the adhesive composition contains a large amount of antistatic agent in order to improve antistatic properties, durability under high temperature environment may be reduced.
Accordingly, an object of the present invention is to provide an adhesive composition which improves durability and antistatic properties under high temperature environments.
Solution for solving the problem
According to the present invention, there is provided an adhesive composition comprising a1 st (meth) acrylic polymer (a) comprising 50 parts by mass or more and 99 parts by mass or less of an alkyl (meth) acrylate monomer (a 1), 1 parts by mass or more and 50 parts by mass or less of an alkylene oxide-containing monomer (a 2), and 0.01 part by mass or more and 5 parts by mass or less of a (meth) acrylic monomer (a 3) having a reactive functional group per 100 parts by mass of the total amount of the alkyl (meth) acrylate monomer (a 1) and the alkylene oxide-containing monomer (a 2) as constituent units, a2 nd (meth) acrylic polymer (a) comprising 50 parts by mass or more and 99 parts by mass or less of an alkyl (meth) acrylate monomer (a 1), 1 part by mass or more and 50 parts by mass or less of an alkylene oxide-containing monomer (a 2), and an aromatic monomer (a 3) having a reactive functional group of 0.01 part by mass or more and 5 parts by mass or less of an alkyl (meth) acrylate monomer (a 2) having a weight of 0 part by mass or more and 0 part by mass or less of an aromatic monomer (B) in the 2 (meth) acrylic polymer (B) as constituent units of the total amount of 100 parts by mass or more, and 15 to 70 parts by mass of an alkoxysilyl group-containing monomer (B3) as a constituent unit, wherein the weight average molecular weight of the 2 nd (meth) acrylic polymer (B) is 3 to 40 ten thousand inclusive, and the polymer (B) is a polymer obtained by polymerizing The adhesive composition contains the 2 nd (meth) acrylic polymer (B) in an amount of 1 to 50 parts by mass based on 100 parts by mass of the 1 st (meth) acrylic polymer (A), and the surface resistivity of a layer formed from the adhesive composition is less than 8.0X10 8 Ω/□。
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, an adhesive composition having improved durability and antistatic properties in a high-temperature environment can be provided.
Detailed Description
Hereinafter, embodiments will be described in detail. The following embodiments are not limited to the invention as claimed in the claims, and all combinations of the features described in the embodiments are not essential to the invention. Two or more of the features described in the embodiments may be combined arbitrarily.
< adhesive composition >
The adhesive composition of the present invention contains a 1 st (meth) acrylic polymer (A), a 2 nd (meth) acrylic polymer (B), a crosslinking agent (C), and an antistatic agent (D).
The adhesive composition according to one embodiment contains the 2 nd (meth) acrylic polymer (B) in an amount of 1 to 50 parts by mass, preferably 2 to 25 parts by mass, based on 100 parts by mass of the 1 st (meth) acrylic polymer (a).
(1 (meth) acrylic Polymer (A))
The 1 st (meth) acrylic polymer (a) according to one embodiment contains, as constituent units, 50 to 99 parts by mass of the (meth) acrylic acid alkyl ester monomer (a 1), 1 to 50 parts by mass of the (meth) acrylic acid alkyl ester monomer (a 2), and 0.01 to 5 parts by mass of the (meth) acrylic acid ester monomer (a 3) having a reactive functional group relative to 100 parts by mass of the total amount of the (meth) acrylic acid alkyl ester monomer (a 1) and the (meth) acrylic acid alkyl ester monomer (a 2).
The "1 st (meth) acrylic polymer (a)" in the present specification refers to a polymer obtained by polymerizing a monomer component containing at least (meth) acrylic acid ester as a polymerizable monomer, and has at least a structural unit derived from (meth) acrylic acid ester. In the present specification and the like, the term "(meth) acrylic" means a term including both "acrylic" and "methacrylic". Similarly, the term "(meth) acrylate" refers to a term including both "acrylate" and "methacrylate".
Examples of the (meth) acrylic acid ester include alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate, aralkyl (meth) acrylate, aryl (meth) acrylate, and other (meth) acrylic acid esters other than these. The (meth) acrylic acid ester is used singly in an amount of 1 or 2 or more of the above.
((meth) acrylic acid alkyl ester monomer (a 1))
The 1 st (meth) acrylic polymer (a) contains 50 to 99 parts by mass of the alkyl (meth) acrylate monomer (a 1) as a constituent unit. When the 1 st (meth) acrylic polymer (a) contains less than 50 parts by mass of the alkyl (meth) acrylate monomer (a 1) as a constituent unit, the adhesion of the adhesive layer to the substrate and the flexibility of the adhesive layer are reduced. Further, the pressure-sensitive adhesive layer is peeled off and lifted off from the substrate, and thus sufficient durability cannot be obtained. On the other hand, in the case where the 1 st (meth) acrylic polymer (a) contains more than 99 parts by mass of the alkyl (meth) acrylate monomer (a 1) as a constituent unit, the adhesion of the adhesive layer to the substrate is insufficient. Further, foaming of the adhesive layer occurs under a high temperature environment, and the antistatic property of the adhesive layer is lowered.
The alkyl group of the alkyl (meth) acrylate monomer (a 1) of one embodiment is C1 or more and C14 or less.
The alkyl (meth) acrylate monomer (a 1) includes, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, isobornyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, and the like. The alkyl (meth) acrylate monomer (a 1) may be used alone of 1 or 2 or more of the above.
(alkylene oxide-containing monomer (a 2))
The 1 st (meth) acrylic polymer (a) contains 1 to 50 parts by mass, preferably 5 to 40 parts by mass of the alkylene oxide group-containing monomer (a 2) as a constituent unit. By containing the epoxy group-containing monomer (a 2) as a constituent unit in the range of the above mass parts of the 1 st (meth) acrylic polymer (a), it is possible to impart durability in a high-temperature environment and excellent antistatic performance to an adhesive layer obtained by using the antistatic agent (D) described later in combination. On the other hand, when the 1 st (meth) acrylic polymer (a) contains the alkylene oxide group-containing monomer (a 2) as a constituent unit outside the above-mentioned mass part range, it is difficult to achieve both excellent antistatic performance and durability under severe conditions in the formed adhesive layer.
The alkylene oxide group-containing monomer (a 2) is represented by the following general formula (1).
(in the general formula (1), R 1 Is a hydrogen atom or methyl group, R 2 Is any one of a hydrogen atom, an alkyl group, an aralkyl group or an aryl group, and n=an integer of 2 to 9. )
The alkylene oxide group-containing monomer (a 2) includes, for example, phenoxydiglycol acrylate, methoxytriethylene glycol acrylate, methoxypolyethylene glycol #400 methacrylate, phenoxytriethylene glycol acrylate, nonylphenoxypolyethylene glycol acrylate, and the like. The alkylene oxide group-containing monomer (a 2) is used alone in an amount of 1 or more than 2 kinds.
((meth) acrylate monomer (a 3) having a reactive functional group)
The 1 st (meth) acrylic polymer (a) contains, as a constituent unit, 0.01 to 5 parts by mass, preferably 0.01 to 3 parts by mass of a (meth) acrylate monomer (a 3) having a reactive functional group, based on 100 parts by mass of the total amount of the alkyl (meth) acrylate monomer (a 1) and the alkylene oxide-containing monomer (a 2). By containing the (meth) acrylic acid ester monomer (a 3) having a reactive functional group which reacts with the crosslinking agent (C) described later as a constituent unit in the above-described range of parts by mass of the (meth) acrylic polymer (a), an adhesive layer excellent in durability under a high-temperature environment can be formed.
On the other hand, when the 1 st (meth) acrylic polymer (a) contains the (meth) acrylate monomer (a 3) having a reactive functional group as a constituent unit in a smaller amount than the above-mentioned range by mass, the cohesive force of the adhesive layer is reduced, and the adhesive layer foams in a high-temperature environment. In addition, when the 1 st (meth) acrylic polymer (a) contains a (meth) acrylate monomer (a 3) having a reactive functional group in an amount larger than the above-mentioned range of parts by mass as a constituent unit, there is a concern that the adhesion of the adhesive layer to the substrate is impaired and peeling may occur, which is not preferable.
The reactive functional group of the (meth) acrylate monomer (a 3) having a reactive functional group of one embodiment is at least any one of a hydroxyl group, an epoxy group, and a nitrogen-containing group.
Here, a transparent conductive layer (a thin film layer (such as an ITO layer) formed of an oxide semiconductor) may be formed on a glass substrate of a liquid crystal panel. The transparent conductive layer has a function as an antistatic layer for preventing malfunction caused by static electricity and a function as a sensor electrode of the capacitive touch screen. When the 1 st (meth) acrylic polymer (a) contains the (meth) acrylate monomer (a 3) having a carboxyl group as a constituent unit, the transparent conductive layer may be corroded or damaged by the adhesive composition. Therefore, the 1 st (meth) acrylic polymer (a) may be selected according to the use of the adhesive composition, as long as it contains the (meth) acrylate monomer (a 3) having a carboxyl group as a constituent unit.
The (meth) acrylate monomer (a 3) having a reactive functional group includes, for example: hydroxy-containing (meth) acrylate monomers such as 2-hydroxyethyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate, carboxyl-containing monomers such as (meth) acrylic acid and beta-carboxyethyl (meth) acrylate, epoxy-containing monomers such as glycidyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate glycidyl ether, and amide-based monomers such as (meth) acrylamide and dimethylaminopropyl (meth) acrylamide. The (meth) acrylate monomer (a 3) having a reactive functional group is used alone in an amount of 1 or more than 2 kinds of the above.
(physical Properties)
The weight average molecular weight (GPC measurement, standard polystyrene conversion) of the 1 st (meth) acrylic polymer (a) of one embodiment is 30 to 350 ten thousand, preferably 120 to 250 ten thousand. When the weight average molecular weight of the 1 st (meth) acrylic polymer (a) is less than 30 ten thousand, sufficient durability cannot be imparted to the adhesive layer. On the other hand, when the weight average molecular weight of the 1 st (meth) acrylic polymer (a) exceeds 350 ten thousand, the viscosity of the 1 st (meth) acrylic polymer (a) becomes very high, and thus the coatability of the adhesive composition is deteriorated.
The 1 st (meth) acrylic polymer (a) can be produced by usual solution polymerization, bulk polymerization, emulsion polymerization, suspension polymerization, and the like. It is particularly preferable to produce the 1 st (meth) acrylic polymer (a) by solution polymerization using the 1 st (meth) acrylic polymer (a) which can be obtained in the form of a solution. Thus, the 1 st (meth) acrylic polymer (a) in a solution state can be directly used for producing the adhesive composition of the present invention. The solvent used for the solution polymerization includes, for example, organic solvents such as ethyl acetate, toluene, n-hexane, acetone, methyl ethyl ketone, and the like.
(polymerization initiator)
The polymerization initiator used in polymerizing the above-mentioned (a 1) to (a 3) includes: for example, oil-soluble organic peroxides such as 2, 4-dichlorobenzoyl peroxide, t-butyl peroxypivalate, benzoyl peroxide, o-methylbenzoyl peroxide, bis-3, 5-trimethylhexanoyl peroxide, octanoyl peroxide, t-butyl peroxy-2-ethylhexanoate, cyclohexanone peroxide, methyl ethyl ketone peroxide, dicumyl peroxide, lauroyl peroxide, dicumyl peroxide, t-butylhydroperoxide, and t-butylperoxide, and oil-soluble azo compounds such as 2,2' -azobisisobutyronitrile, 2' -azobis (2, 4-dimethylvaleronitrile), 2' - (2, 4-dimethyl-4-methoxypentanenitrile, and the like. The oil-soluble polymerization initiator is preferably an oil-soluble azo compound. The oil-soluble polymerization initiator may be used singly of 1 or 2 or more of the above.
(chain transfer agent)
In order to adjust the molecular weight of the 1 st (meth) acrylic polymer (a), a chain transfer agent may be suitably used. The chain transfer agent includes, for example, thiols such as octyl mercaptoacetate, methoxybutyl mercaptoacetate, octyl mercaptopropionate, methoxybutyl mercaptopropionate, stearyl mercaptan, and lauryl mercaptan, and α -methylstyrene dimer, and one or more of the above may be used. On the other hand, the (meth) acrylic polymer (a) may be produced without using a conventionally known chain transfer agent.
(2 (meth) acrylic Polymer (B))
The 2 nd (meth) acrylic polymer (B) according to one embodiment contains, as constituent units, from 0 to 85 parts by mass of the alkyl (meth) acrylate monomer (B1), from 0 to 50 parts by mass of the (meth) acrylate monomer (B2) having an aromatic group, and from 15 to 70 parts by mass of the monomer (B3) having an alkoxysilyl group, in 100 parts by mass of the 2 nd (meth) acrylic polymer (B).
The "2 nd (meth) acrylic polymer (B)" in the present specification refers to a polymer obtained by polymerizing a monomer component containing at least (meth) acrylic acid ester as a polymerizable monomer, and has at least a structural unit derived from (meth) acrylic acid ester. In the present specification and the like, the term "(meth) acrylic" means a term including both "acrylic" and "methacrylic". Similarly, the term "(meth) acrylate" means a term including both "acrylate" and "methacrylate".
Examples of the (meth) acrylic acid ester include alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate, aralkyl (meth) acrylate, aryl (meth) acrylate, and other (meth) acrylic acid esters other than these. The (meth) acrylic acid ester may be used singly in an amount of 1 or 2 or more.
((meth) acrylic acid alkyl ester monomer (b 1))
The 2 nd (meth) acrylic polymer (B) of one embodiment contains, as a constituent unit, 0 to 85 parts by mass, preferably 15 to 70 parts by mass of the alkyl (meth) acrylate monomer (B1).
The alkyl group of the alkyl (meth) acrylate monomer (b 1) of one embodiment is C1 or more and C14 or less.
The alkyl (meth) acrylate monomer (b 1) includes, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, isobornyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, and the like. The alkyl (meth) acrylate monomer (a 1) may be used alone of 1 or 2 or more of the above.
(aromatic group-containing (meth) acrylate monomer (b 2))
The 2 nd (meth) acrylic polymer (B) of one embodiment contains, as a constituent unit, 0 to 50 parts by mass, preferably 0 to 40 parts by mass of a (meth) acrylate monomer (B2) having an aromatic group.
The (meth) acrylate monomer (b 2) having an aromatic group includes, for example, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxytriethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, and the like. The (meth) acrylate monomer (b 2) having an aromatic group may be used singly in an amount of 1 or 2 or more of the above.
(monomer having alkoxysilyl group (b 3))
The 2 nd (meth) acrylic polymer (B) of one embodiment contains 15 to 70 parts by mass of the monomer (B3) having an alkoxysilyl group as a constituent unit.
The monomer (b 3) having an alkoxysilyl group includes, for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (. Beta. -methoxyethoxy) silane, 3- (meth) acryloxypropyl trimethoxysilane, 3- (meth) acryloxypropyl methyldimethoxysilane, 3- (meth) acryloxypropyl dimethylmethoxysilane, 3- (meth) acryloxypropyl triethoxysilane, 3- (meth) acryloxyoctyl trimethoxysilane, and the like. The monomer (b 3) having an alkoxysilyl group may be used singly or in combination of 1 or 2 or more of the above.
(other monomers)
The 2 nd (meth) acrylic polymer (B) may contain a vinyl monomer as a constituent unit in addition to (B1) to (B3). The 2 nd (meth) acrylic polymer (B) according to one embodiment contains 0 to 50 parts by mass, preferably 0 to 40 parts by mass of a vinyl monomer as a constituent unit.
Examples of the vinyl monomer include: conjugated diene monomers such as styrene, α -methylstyrene, vinyltoluene, vinylpyridine, vinylpyrrolidone, vinylcarbazole, divinylbenzene, vinyl acetate, and acrylonitrile, butadiene, isoprene, and chloroprene, vinyl halides such as vinyl chloride and vinyl bromide, vinylidene halides such as vinylidene chloride, and the like.
(physical Properties)
The weight average molecular weight (GPC measurement, standard polystyrene conversion) of the 2 nd (meth) acrylic polymer (B) of one embodiment is 3 to 40 ten thousand, preferably 3 to 36 ten thousand.
The 2 nd (meth) acrylic polymer (B) can be produced by usual solution polymerization, bulk polymerization, emulsion polymerization, suspension polymerization, and the like. It is particularly preferable to produce the 2 (meth) acrylic polymer (B) by solution polymerization using the 2 (meth) acrylic polymer (B) which can be obtained in the form of a solution. Thus, the 2 nd (meth) acrylic polymer (B) in a solution state can be directly used for producing the adhesive composition of the present invention. The solvent used for the solution polymerization includes, for example, organic solvents such as ethyl acetate, toluene, n-hexane, acetone, methyl ethyl ketone, and the like.
(polymerization initiator)
The polymerization initiator used for polymerizing the above (b 1) to (b 3) and other monomers includes conventionally known oil-soluble organic peroxides, oil-soluble azo compounds, and the like, similarly to the case of producing the 1 st (meth) acrylic polymer (a). The oil-soluble polymerization initiator is preferably an oil-soluble azo compound. The oil-soluble polymerization initiator may be used singly or in an amount of 1 or more than 2.
(chain transfer agent)
In order to adjust the molecular weight of the 2 nd (meth) acrylic polymer (B), a conventionally known chain transfer agent may be suitably used in the same manner as in the production of the 1 st (meth) acrylic polymer (a). The chain transfer agent includes thiols, alpha-methylstyrene dimer, etc., and 1 or 2 or more of the above may be used. On the other hand, the 2 nd (meth) acrylic polymer (B) may be produced without using a conventionally known chain transfer agent.
(crosslinking agent (C))
The adhesive composition according to one embodiment contains the crosslinking agent (C) in an amount of 0.01 to 10 parts by mass, preferably 0.01 to 4 parts by mass, relative to 100 parts by mass of the 1 st (meth) acrylic polymer (a).
The crosslinking agent (C) according to one embodiment contains at least one of an isocyanate compound, a metal chelate compound, an epoxy compound, an aziridine compound, and a melamine compound. That is, the crosslinking agent (C) may be used alone in an amount of 1 or 2 or more.
The amount of the crosslinking agent (C) contained in the adhesive composition may be determined according to the amount and type of the (meth) acrylate monomer having a reactive functional group. When the blending amount of the crosslinking agent (C) is less than the range of the above parts by mass, there is a concern that the cohesive force of the adhesive layer is reduced and the adhesive layer foams under the high temperature durability condition. On the other hand, when the blending amount of the crosslinking agent (C) exceeds the above range of parts by mass, there is a possibility that the cohesive force of the adhesive composition is excessive and the adhesive composition may cause peeling of the adhered optical film, which is not preferable.
The isocyanate compound is a polyisocyanate compound having 2 or more isocyanate groups in 1 molecule. The polyisocyanate compound includes, for example, an adduct of pentamethylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, toluene diisocyanate, isophorone diisocyanate, etc. with trimethylolpropane, etc., an isocyanurate compound, a biuret compound, etc. The polyisocyanate compound is preferably a compound of toluene diisocyanate and xylylene diisocyanate.
The metal chelate compound includes, for example, metal chelate compounds such as aluminum chelate compounds, zirconium chelate compounds, titanium chelate compounds, and the like.
The epoxy compound includes epoxy resins having 2 or more epoxy groups in the molecule, in addition to bisphenol compounds, aliphatic glycidyl ether compounds, and biphenyl compounds.
(antistatic agent (D))
The adhesive composition according to one embodiment contains the antistatic agent (D) in an amount of 1 to 25 parts by mass, preferably 5 to 25 parts by mass, per 100 parts by mass of the 1 (meth) acrylic polymer (a).
By containing the antistatic agent (D) in the above-described range of parts by mass of the adhesive composition, an adhesive layer that combines excellent antistatic performance with durability in a high-temperature environment can be realized. When the pressure-sensitive adhesive composition contains the antistatic agent (D) in a smaller amount than the above-mentioned range, excellent antistatic performance cannot be imparted to the pressure-sensitive adhesive layer, which is not preferable. On the other hand, when the pressure-sensitive adhesive composition contains more antistatic agent (D) than the above-mentioned range of parts by mass, the cohesive force of the pressure-sensitive adhesive layer may be reduced, and the durability may be affected, which is not preferable.
The antistatic agent (D) of one embodiment is a compound containing either fluorine or silicon (wherein M is an alkali metal and is excluded + [(FSO 2 ) 2 N] - The case of the indicated compounds).
The antistatic agent (D) includes, for example, ethylmethylimidazolium bis (trifluoromethanesulfonyl) imide salt, ethylmethylimidazolium bis (fluorosulfonyl) imide salt, 4-methyl-1-hexylpyridinium bis (trifluoromethanesulfonyl) imide salt, 4-methyl-1-octylpyridinium bis (fluorosulfonyl) imide salt, tributylmethylammonium bis (trifluoromethanesulfonyl) imide salt, tributylmethylammonium bis (fluorosulfonyl) imide salt, tributylbenzylammonium bis (fluorosulfonyl) imide salt, lauryltrimethylammonium bis (fluorosulfonyl) imide salt, 1-octyl-4-methylpyridinium hexafluorophosphate and the like. The antistatic agent (D) may be used singly in an amount of 1 or 2 or more of the above.
(other additives)
The adhesive composition may further contain a silane coupling agent (E). On the other hand, the adhesive composition may not contain the silane coupling agent (E). The silane coupling agent (E) may be a known silane coupling agent. The adhesive composition according to one embodiment contains the silane coupling agent (E) in an amount of 0.01 to 3.0 parts by mass, preferably 0.01 to 1.5 parts by mass, based on 100 parts by mass of the 1 st acrylic copolymer (a).
The silane coupling agent (E) includes, for example: epoxy group-containing silane coupling agents such as gamma-glycidoxypropyl trimethoxysilane, gamma-glycidoxypropyl triethoxysilane, gamma-glycidoxypropyl methyldimethoxysilane, gamma-glycidoxypropyl methyldiethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, and epoxy group-containing alkoxysilane oligomer, gamma-mercaptopropyl trimethoxysilane, gamma-mercaptopropyl triethoxysilane, gamma-mercaptopropyl methyldimethoxysilane, gamma-mercaptopropyl methyldiethoxysilane, and mercapto-containing alkoxysilane oligomer, amino group-containing silane coupling agents such as gamma-aminopropyl trimethoxysilane, gamma-aminopropyl triethoxysilane, N-beta- (aminoethyl) -gamma-aminopropyl trimethoxysilane, N-beta- (aminoethyl) -gamma-aminopropyl triethoxysilane, N-beta- (aminoethyl) -gamma-aminopropyl methyldimethoxysilane, N-phenyl-gamma-aminopropyl trimethoxysilane, and isocyanate group-containing silane coupling agents such as gamma-isocyanatopropyl trimethoxysilane and gamma-isocyanatopropyl triethoxysilane. The silane coupling agent (E) may be used singly or in combination of 1 or more than 2 kinds.
The adhesive composition may further contain various additives according to the required properties required for adjusting the adhesive force and the like. Examples of the additives include terpene-based, terpene-phenol-based, coumarone indene-based, styrene-based, rosin-based, xylene-based, phenol-based, petroleum-based and other tackifying resins, antioxidants, ultraviolet absorbers, fillers, pigments and the like. The additive may be used singly or in combination of 1 or more than 2 kinds.
(surface resistivity of adhesive layer)
The adhesive layer formed from the adhesive composition of one embodiment has a surface resistivity of less than 8.0X10 8 Ω/≡, preferably less than 7.5X10 8 Ω/□。
The adhesive layer formed from the conventional adhesive composition is formed such that the surface resistivity of the adhesive layer is less than 8.0X10 8 Omega/≡and contains a large amount of antistatic agent (D). However, there is a problem in that the cohesive force of the adhesive layer is lowered and the durability of the adhesive layer is lowered in a high temperature (105 ℃ or 115 ℃) or high temperature and high humidity environment.
In contrast, in the adhesive layer formed from the adhesive composition of the present invention, by using the monomer (B3) component having an alkoxysilyl group as the monomer composition of the 2 nd (meth) acrylic polymer (B), even when a large amount of the antistatic agent (D) is contained, the durability of the adhesive layer is not lowered. However, it has been found that even in the case of an adhesive layer comprising: in the case of the 2 nd (meth) acrylic polymer (B) containing the monomer (B3) having an alkoxysilyl group and a large amount of the antistatic agent (D), the low surface resistivity (i.e., high antistatic property) of the adhesive layer cannot be achieved.
Accordingly, the inventors of the present invention found that, in the adhesive layer, it contains: in the case of the 2 nd (meth) acrylic polymer (B) containing the monomer (B3) having an alkoxysilyl group, the 1 st (meth) acrylic polymer (a) containing the monomer (a 2) containing an alkylene oxide, and a large amount of the antistatic agent (D), a low surface resistivity of the adhesive layer can be achieved. That is, in order to achieve low surface resistivity of the adhesive layer, it is important to include the antistatic agent (D) in the adhesive composition in consideration of the balance of the compounding amounts of the antistatic agent (D) and the alkoxysilyl group-containing monomer (b 3) and the alkylene oxide group-containing monomer (a 2).
According to the adhesive composition in which the balance of the blending amounts of the above components is taken into consideration, even under the severe durability conditions, an adhesive layer which does not foam from the substrate can be realized. In addition, the pressure-sensitive adhesive layer has an excellent effect of suppressing static electricity generated when peeling off a release paper or the like of the pressure-sensitive adhesive sheet and reducing the influence of static electricity on a polarizing film or the like.
The surface resistivity of the adhesive layer was measured using a high resistivity meter (trade name: hibeta-UX MCP-HT 450) manufactured by Mitsubishi Chemical Analytech Co., ltd. Specifically, an adhesive layer having a thickness of 20 μm was formed on a release film to prepare an evaluation sample. After the evaluation sample was cut into a measurement size, the release film was peeled off. Then, the evaluation sample was stored in a constant temperature and humidity chamber having a temperature of 23.+ -. 2 ℃ and a humidity of 50.+ -. 5% RH. The surface resistivity of the sample was evaluated by measurement using a high resistivity meter at high temperature and high humidity.
< adhesive layer >
The adhesive layer formed from the adhesive composition of the present invention is obtained by applying a predetermined amount of the adhesive composition onto a release film, and curing and drying the adhesive composition. The thickness of the adhesive layer of one embodiment is preferably 10 to 50 μm, more preferably 10 to 25 μm. When the thickness of the pressure-sensitive adhesive layer is within the above range, a pressure-sensitive adhesive sheet having excellent durability and antistatic properties, which will be described later, can be formed. Then, the adhesive sheet of the present invention is used to adhere a polarizing plate to a glass substrate of a liquid crystal display device, for example, whereby the glass substrate and the polarizing plate can be firmly adhered. The pressure-sensitive adhesive layer can bond the adherend formed of any organic material, the adherend formed of any inorganic material, or the adherend formed of any organic material to the adherend formed of any inorganic material.
< adhesive sheet >
An adhesive sheet having an adhesive layer formed of the adhesive composition of one embodiment adheres a polarizing plate to an adherend (e.g., glass). The adhesive sheet has a release film and an adhesive layer formed on the release film. One surface of the adhesive layer is adhered to the polarizing plate, and the other adhesive surface is adhered to a release film or the like. When the release film or the like attached to the other adhesive surface of the adhesive layer is peeled off, the adhesive sheet of the present invention is excellent in antistatic performance, and therefore, static electricity generated when the release film is peeled off from the adhesive surface can be suppressed. Then, after the release film or the like is peeled off, the other adhesive surface of the adhesive layer is bonded to, for example, the outer surface of the glass substrate. Thus, adverse effects on components (e.g., liquid crystal layer, capacitive sensor) of the liquid crystal display device caused by the generation of static electricity can be reduced.
Further, the adhesive sheet of the present invention has the above-described excellent antistatic property and also has an effect of excellent durability under severe environmental conditions. For example, in a severe environment at high temperature (105 ℃ C. Or 115 ℃) or high temperature and high humidity, the polarizing plate bonded to the glass substrate using the adhesive sheet does not peel from the glass substrate, and the adhesive layer does not foam. The polarizing plate to which the adhesive sheet of the present invention can be applied is a conventionally known polarizing plate. Examples of the polarizing plate include a polarizing plate using an untreated TAC film, a polarizing plate coated or uncoated with discotic liquid crystal, a polarizing plate using a stretched film (for example, a stretched triacetyl cellulose film, a stretched polycycloolefin film or a stretched cellulose acetate propionate film) as a base material, and the like.
The pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed on a release film or the like can be produced by the following steps. A release film such as a polyethylene terephthalate film (PET film) having a release agent such as a silicone resin applied to the surface thereof is coated with a predetermined amount of the adhesive composition by using a general coating apparatus (for example, a roll coating apparatus) and dried. Thus, an adhesive sheet having an adhesive layer formed on the release film can be obtained. The polarizing plate may be directly bonded to the surface of the pressure-sensitive adhesive layer on the side not in contact with the release film. Alternatively, the pressure-sensitive adhesive sheet may be stored in a state where release films are present on both sides of the pressure-sensitive adhesive layer, and the release films may be peeled off and the pressure-sensitive adhesive layer may be bonded to the polarizing plate as needed. In addition, depending on the constituent material of the adhesive composition, the adhesive layer may be formed on the release film by heat crosslinking or photo-curing with ultraviolet rays or the like.
< optical film with adhesive layer >
The optical film with an adhesive layer of the present invention comprises an adhesive layer on at least one surface of the optical film. The optical film according to one embodiment includes, for example, a plastic film such as polystyrene, a styrene-acrylic copolymer, an acrylic resin, polyethylene terephthalate, polycarbonate, polyether ether ketone, or triacetyl cellulose, an antireflection film, an electromagnetic shielding film, and the like.
< display device >
The display device of the present invention includes the optical film with an adhesive layer described above, and is, for example, a liquid crystal display device or an organic EL display. The liquid crystal display device is formed by adhering a polarizing plate, a laminate of a polarizing plate and a phase difference plate, or the like to an outer surface of a glass substrate of a liquid crystal cell (formed by sandwiching a liquid crystal component aligned in a predetermined direction with 2 glass substrates) via an adhesive layer formed of an adhesive composition. The organic EL display includes a transparent substrate (glass) on which a plurality of organic EL elements are arranged in a matrix.
< production of adhesive composition >
Table 1 shows an explanation of abbreviations of tables 2 to 9. Table 2 shows the raw material formulations of the 1 st (meth) acrylic polymers (a) of examples 1 to 20 and comparative examples 1 to 10. Table 3 shows the raw material formulations of the 2 nd (meth) acrylic polymer (B) of examples 1 to 20. Table 4 shows the raw material formulations of the 2 nd (meth) acrylic polymer (B) of comparative examples 1 to 10. Table 5 shows the raw material formulations of the adhesive compositions of examples 1 to 7. Table 6 shows the raw material formulations of the adhesive compositions of examples 8 to 14. Table 7 shows the raw material formulations of the adhesive compositions of examples 15 to 20. Table 8 shows the raw material formulations of the adhesive compositions of comparative examples 1 to 5. Table 9 shows the raw material formulations of the adhesive compositions of comparative examples 6 to 10.
TABLE 1
TABLE 2
The numerical values in the table indicate the parts by mass of the active ingredient.
TABLE 3
The numerical values in the table indicate the parts by mass of the active ingredient.
TABLE 4
The numerical values in the table indicate the parts by mass of the active ingredient.
TABLE 5
The numerical values in the table indicate the parts by mass of the active ingredient.
TABLE 6
The numerical values in the table indicate the parts by mass of the active ingredient.
TABLE 7
The numerical values in the table indicate the parts by mass of the active ingredient.
TABLE 8
The numerical values in the table indicate the parts by mass of the active ingredient.
TABLE 9
The numerical values in the table indicate the parts by mass of the active ingredient.
Example 1
[ production of the 1 st (meth) acrylic Polymer (A) ]
Based on the raw material formulation of production example 1 of table 2, 140 parts of ethyl acetate, 70 parts of n-butyl acrylate, 10 parts of methyl acrylate, 20 parts of phenoxydiethylene glycol acrylate, 2 parts of hydroxyethyl acrylate and 0.05 part of a polymerization initiator (2, 2' -azobisisobutyronitrile) were added after filling a reaction apparatus equipped with a stirrer, a thermometer, a reflux condenser and a nitrogen inlet tube with nitrogen gas. They were reacted at 55℃for 7 hours under a nitrogen stream while stirring them. After the completion of the reaction, the mixture was diluted with ethyl acetate to obtain A1 st (meth) acrylic polymer (A) solution A1 having a solid content of 15.0% by mass and a weight average molecular weight of 200 ten thousand.
[ production of the 2 nd (meth) acrylic Polymer (B) ]
Based on the raw material formulation of production example 1 in table 3, 80 parts of toluene, 20 parts of methyl ethyl ketone, and 0.3 part of a polymerization initiator (2, 2' -azobisisobutyronitrile) were added after filling nitrogen gas into a reaction apparatus equipped with a stirrer, a thermometer, a sequential dropping apparatus, a reflux condenser, and a nitrogen gas introduction pipe. On the other hand, a monomer mixture formed of 35 parts of n-butyl acrylate, 20 parts of methyl acrylate, 15 parts of phenoxyethyl acrylate, 15 parts of 3-methacryloxypropyl trimethoxysilane, and 15 parts of 3-methacryloxypropyl methyl dimethoxy silane was prepared in another vessel. The above reaction apparatus was warmed to 90℃in a nitrogen stream, and the weighed monomer mixture in another vessel was added dropwise over 120 minutes, and polymerization was carried out at 90℃for 7 hours. After the completion of the reaction, the mixture was cooled and diluted with toluene to obtain a 2 nd (meth) acrylic polymer (B) solution B1 having a solid content of 50% by mass and a weight average molecular weight of 72,000.
9.0 parts by solid content of the 2 nd (meth) acrylic polymer (B) solution B1 and 0.45 parts by solid content of the same trade name as the crosslinking agent (C) were added to 100 parts by solid content of the 1 st (meth) acrylic polymer (a) solution A1 obtained as described above: TAKENATE D-204, and 18.5 parts of tributylmethylammonium bis (trifluoromethylsulfonyl) imide salt as an antistatic agent, and 0.75 part of a silane coupling agent (E) manufactured by Xinyue chemical Co., ltd., trade name: x-41-1810, and thoroughly mixing to obtain an adhesive composition of example 1.
The adhesive compositions of examples 2 to 20 and comparative examples 1 to 10 were obtained in the same manner as in example 1 based on the raw material formulations of tables 2 to 9.
< test method >
The following test examples 1 to 6 were conducted using the adhesive compositions of examples 1 to 20 and comparative examples 1 to 10, respectively, to evaluate the performance.
(test preparation for polarizing plate production)
After the adhesive composition was coated on a silicone resin-coated PET film (release substrate), the solvent was removed by drying at 90 ℃ to form an adhesive layer having a thickness of 20 μm. After a polarizing film having a thickness of 110 μm was bonded to the surface on which the pressure-sensitive adhesive layer was formed, the film was cured at 23℃under an atmosphere of 50% RH for 7 days, thereby producing a sample for evaluation having a size of 80 mm. Times.150 mm.
Test example 1 evaluation of durability at 105 ℃ C
The PET film of the sample for evaluation (i.e., polarizing plate) was peeled off to expose the adhesive layer, and after the adhesive layer was adhered to glass, the film was left to stand under an atmosphere of 105 ℃ (drying) for 500 hours, and then the foaming and peeling of the sample for evaluation were visually confirmed, and durability was evaluated based on the following evaluation criteria.
[ evaluation criteria ]
(1) Foaming
O: no foaming was confirmed on the polarizing plate.
Delta: only slight foaming was confirmed on the polarizing plate.
X: foaming was confirmed on the polarizing plate.
(2) Stripping off
O: no peeling was observed on the polarizing plate.
Delta: only slight peeling was confirmed on the polarizing plate.
X: peeling was confirmed on the polarizing plate.
Test example 2 evaluation of durability at 115 ℃C
The PET film of the sample for evaluation (i.e., polarizing plate) was peeled off to expose the adhesive layer, and after the adhesive layer was adhered to glass, the film was left to stand under an atmosphere of 115 ℃ (drying) for 500 hours, and then the foaming and peeling of the sample for evaluation were visually confirmed, and durability was evaluated based on the following evaluation criteria.
[ evaluation criteria ]
(1) Foaming
O: no foaming was confirmed on the polarizing plate.
Delta: only slight foaming was confirmed on the polarizing plate.
X: foaming was confirmed on the polarizing plate.
(2) Stripping off
O: no peeling was observed on the polarizing plate.
Delta: only slight peeling was confirmed on the polarizing plate.
X: peeling was confirmed on the polarizing plate.
Test example 3 evaluation of durability at 85% RH at 85 ℃C
The PET film of the sample for evaluation (i.e., polarizing plate) was peeled off to expose the adhesive layer, and after the adhesive layer was adhered to glass, the film was left to stand under an atmosphere of 85% rh at 85 ℃ for 500 hours, and then the foaming and peeling of the sample for evaluation were visually confirmed, and durability was evaluated based on the following evaluation criteria.
[ evaluation criteria ]
(1) Foaming
O: no foaming was confirmed on the polarizing plate.
Delta: only slight foaming was confirmed on the polarizing plate.
X: foaming was confirmed on the polarizing plate.
(2) Stripping off
O: no peeling was observed on the polarizing plate.
Delta: only slight peeling was confirmed on the polarizing plate.
X: peeling was confirmed on the polarizing plate.
Test example 4 evaluation of reworkability
The PET film of the sample for evaluation (i.e., polarizing plate) was peeled off to expose the adhesive layer, and after the adhesive layer was adhered to glass, the glass was left for 30 days in an atmosphere of 50% RH at 23℃to visually confirm the residual state of the adhesive layer on the glass when the sample for evaluation was peeled off from the glass, and reworkability was evaluated based on the following evaluation criteria. Here, reworkability refers to the following characteristics: the polarizing plate can be peeled off from the glass even after the polarizing plate is adhered to the glass and a long time has elapsed, and the adhesive layer does not remain on the glass when the polarizing plate is peeled off from the glass.
[ evaluation criteria ]
O: there was no adhesive layer remaining on the glass.
Delta: a portion of the adhesive layer remained on the glass.
X: most of the adhesive layer remained on the glass.
Test example 5 measurement of surface resistivity
The separator of the sample for evaluation (i.e., polarizing plate) was peeled off to expose the adhesive layer, and the surface resistivity (Ω/∈mj.) of the adhesive layer was measured using a high resistivity meter (trade name: hiresta-UX MCP-HT 450) manufactured by ltd. And a measuring electrode at room temperature of 23 ℃ at 50% rh.
Test example 6 evaluation of adhesion to a substrate
The adhesive layer of the sample for evaluation (i.e., polarizing plate) was rubbed with a finger, and the number of times until the adhesive layer was peeled off from the polarizing film was counted, to evaluate the adhesion between the adhesive layer and the substrate (polarizing film).
[ description of test results ]
1 to 9: the adhesive layer is peeled off from the polarizing film under finger rubbing 1 to 9 times.
Not less than 10: even if rubbing with a finger is performed 10 times or more, the adhesive layer does not come off from the polarizing film.
< test results >
Table 10 shows the test results of examples 1 to 7. Table 11 shows the test results of examples 8 to 14. Table 12 shows the test results of examples 15 to 20. Table 13 shows the test results of comparative examples 1 to 5. Table 14 shows the test results of comparative examples 6 to 10.
TABLE 10
TABLE 11
TABLE 12
TABLE 13
TABLE 14
As shown in the results of tables 10 to 14, the adhesive layers formed from the adhesive compositions of examples 1 to 20 achieved improved durability in a high temperature environment (105 ℃ C. Or 115 ℃ C.) and a high temperature and high humidity environment (85% RH) and low surface resistivity (less than 8.0X10) 8 Ω/≡). The reason for this is presumed that the adhesive compositions of examples 1 to 20 consider the antistatic agent (D) and the 2 nd (meth) acrylic polymer containing the alkoxysilyl group-containing monomer (b 3) as a constituent unit (B) And the 1 st (meth) acrylic polymer (A) containing the alkylene oxide group-containing monomer (a 2) as a constituent unit.
On the other hand, the adhesive layers formed from the adhesive compositions of comparative examples 1 to 10 failed to achieve improvement in durability and low surface resistivity (less than 8.0X10 8 Ω/□)。
Further, since the adhesive layers of examples 1 to 20 have high adhesion to the polarizing film as an example of the base material, degradation of the display quality of the display device can be suppressed.
As described above, the adhesive composition of the present invention has a remarkable effect of improving durability and antistatic properties under high temperature environments.
The present invention is not limited to the above embodiments, and various modifications and changes can be made within the scope of the gist of the present invention.
Claims (10)
1. An adhesive composition comprising a base and an adhesive,
the adhesive composition contains a1 st (meth) acrylic polymer (A), a2 nd (meth) acrylic polymer (B), a crosslinking agent (C) and an antistatic agent (D),
the 1 st (meth) acrylic polymer (A) contains, as constituent units, 50 to 99 parts by mass of a (meth) acrylic acid alkyl ester monomer (a 1), 1 to 50 parts by mass of an alkylene oxide-containing monomer (a 2), and 0.01 to 5 parts by mass of a (meth) acrylic acid ester monomer (a 3) having a reactive functional group relative to 100 parts by mass of the total amount of the (meth) acrylic acid alkyl ester monomer (a 1) and the alkylene oxide-containing monomer (a 2),
The weight average molecular weight of the 1 st (meth) acrylic polymer (A) is 30 to 350 ten thousand,
the 2 nd (meth) acrylic polymer (B) contains, as constituent units, from 0 to 85 parts by mass of an alkyl (meth) acrylate monomer (B1), from 0 to 50 parts by mass of an aromatic group-containing (meth) acrylate monomer (B2), and from 15 to 70 parts by mass of an alkoxysilyl group-containing monomer (B3) in 100 parts by mass of the 2 nd (meth) acrylic polymer (B),
the weight average molecular weight of the 2 nd (meth) acrylic polymer (B) is 3 to 40 ten thousand,
the adhesive composition contains the 2 nd (meth) acrylic polymer (B) in an amount of 1 to 50 parts by mass based on 100 parts by mass of the 1 st (meth) acrylic polymer (A),
the layer formed from the adhesive composition has a surface resistivity of less than 8.0X10 8 Ω/□。
2. The adhesive composition of claim 1, wherein,
the alkyl (meth) acrylate monomer (a 1) contained in the 1 st (meth) acrylic polymer (a) and the alkyl (meth) acrylate monomer (B1) contained in the 2 nd (meth) acrylic polymer (B) have an alkyl group of not less than C1 and not more than C14.
3. The adhesive composition of claim 1, wherein,
the reactive functional group of the (meth) acrylate monomer (a 3) having a reactive functional group is at least one of a hydroxyl group, an epoxy group, and a nitrogen-containing group.
4. The adhesive composition of claim 1, wherein,
the adhesive composition contains a crosslinking agent (C) in an amount of 0.01 to 10 parts by mass based on 100 parts by mass of the 1 st (meth) acrylic polymer (A),
the crosslinking agent (C) contains at least one of an isocyanate compound, a metal chelate compound, an epoxy compound, an aziridine compound, and a melamine compound.
5. The adhesive composition of claim 1, wherein,
the adhesive composition contains an antistatic agent (D) in an amount of 1 to 25 parts by mass based on 100 parts by mass of the 1 st (meth) acrylic polymer (A),
the antistatic agent (D) is a compound containing either fluorine or silicon, wherein M is an alkali metal, and M is excluded + [(FSO 2 ) 2 N]-the case of the compounds represented.
6. The adhesive composition of claim 1, wherein,
the adhesive composition contains a silane coupling agent (E) in an amount of 0.01 to 3.0 parts by mass based on 100 parts by mass of the 1 st (meth) acrylic polymer (A).
7. The adhesive composition of claim 1, wherein,
the 2 nd (meth) acrylic polymer (B) contains, as a constituent unit, 0 to 50 parts by mass of a vinyl monomer in 100 parts by mass of the 2 nd (meth) acrylic polymer (B).
8. An adhesive layer comprising the adhesive composition of any one of claims 1-7.
9. An optical film with an adhesive layer comprising the adhesive layer of claim 8 on at least one side.
10. A display device provided with the optical film with an adhesive layer according to claim 9.
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JP2022143894A JP7178034B1 (en) | 2022-09-09 | 2022-09-09 | Adhesive composition, adhesive layer, optical film with adhesive layer, and display device |
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JP4072309B2 (en) * | 2000-10-13 | 2008-04-09 | 日本カーバイド工業株式会社 | Adhesive composition for polarizing film and polarizing film |
KR100932887B1 (en) * | 2005-12-14 | 2009-12-21 | 주식회사 엘지화학 | Acrylic pressure-sensitive adhesive composition |
KR100932888B1 (en) * | 2006-07-21 | 2009-12-21 | 주식회사 엘지화학 | Optically compensated acrylic pressure sensitive adhesive composition, polarizing plate and liquid crystal display device comprising the same |
KR100903273B1 (en) | 2007-05-16 | 2009-06-17 | 주식회사 동부하이텍 | Voltage switch circuit of semiconductor device |
KR100947970B1 (en) * | 2007-12-11 | 2010-03-15 | 주식회사 에이스 디지텍 | Acrylic adhesive composition |
TWI381033B (en) * | 2009-10-09 | 2013-01-01 | Nanya Plastics Corp | An adhesive composition for use in a conformable polarizing plate |
JP5765303B2 (en) | 2012-08-20 | 2015-08-19 | 信越化学工業株式会社 | Optical pressure-sensitive adhesive composition |
KR101988117B1 (en) | 2017-08-03 | 2019-06-11 | 민후 오 | Non-inverter type portable cooking and heating |
KR20200002225A (en) | 2018-06-29 | 2020-01-08 | 한국전력공사 | Scheduling method for driving appliance |
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