CN117680536A - Stamping device is used in semiconductor part production - Google Patents
Stamping device is used in semiconductor part production Download PDFInfo
- Publication number
- CN117680536A CN117680536A CN202410094511.8A CN202410094511A CN117680536A CN 117680536 A CN117680536 A CN 117680536A CN 202410094511 A CN202410094511 A CN 202410094511A CN 117680536 A CN117680536 A CN 117680536A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000004080 punching Methods 0.000 claims description 42
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 description 8
- 238000003860 storage Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 3
- 235000017491 Bambusa tulda Nutrition 0.000 description 3
- 241001330002 Bambuseae Species 0.000 description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 3
- 239000011425 bamboo Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Punching Or Piercing (AREA)
- Press Drives And Press Lines (AREA)
Abstract
The invention relates to the field of stamping equipment and discloses a stamping device for producing semiconductor parts, which comprises a bottom plate, wherein the upper end of the bottom plate is fixedly connected with a limiting plate, a rotating frame is connected to the limiting plate, a lower gear is rotatably connected to the rotating frame, a lower roller is connected between the lower gears, a driving disc is connected to the lower roller, a tooth slot is formed in the rotating frame, the upper end of the bottom plate is connected with the limiting plate, a motor cover and a limiting pipe are connected to the limiting plate, a rotating motor is connected to the motor cover, a rotating shaft is connected to the output end of the rotating motor, and an upper gear and an upper roller are connected to the rotating shaft. The invention uses the mutual matching between the sliding cylinder and the stamping block to enable the stamping block to vertically lift up and down, ensures that the stamping surface and the stamping base plane are mutually parallel, and improves the stamping precision.
Description
Technical Field
The invention relates to the field of stamping equipment, in particular to a stamping device for semiconductor part production.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., and diodes are devices fabricated using semiconductors.
When carrying out the semiconductor part processing, in order to make the semiconductor part present the demand shape, the mode of punching press is adopted often to process the semiconductor part, in order to improve the machining efficiency of semiconductor part, can be with the raw materials of semiconductor part be rectangular form and transport processing, cut it again after punching press processing is accomplished for semiconductor part mutual separation, traditional punching press mode relies on the punching press head to accomplish the punching press, because equipment punching press head can't change, lead to the stamping equipment that the stamping processing of different semiconductor parts needs to correspond, and traditional punching press head's punching press distance is fixed, in order to improve stamping equipment's suitability, when the semiconductor raw materials and the punching press degree of depth demand to different thickness are different, need change corresponding punching press base, complex operation, and frequently change punching press base can make the base junction appear not hard up, influence punching press stability and punching press precision.
Based on this, a stamping device for semiconductor part production is proposed.
Disclosure of Invention
The invention aims at: in order to solve the above problems, a stamping device for semiconductor part production is proposed.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the stamping device for the production of the semiconductor parts comprises a bottom plate, wherein the upper end of the bottom plate is fixedly connected with a limiting plate and a rotating frame, a lower gear is rotationally connected on the rotating frame, a lower roller is connected between the lower gears, a driving disc is connected on the lower roller, a tooth slot is formed on the rotating frame, the upper end of the bottom plate is connected with the limiting plate, a motor cover and a limiting pipe are connected on the limiting plate, a rotating motor is connected on the motor cover, a rotating shaft is connected at the output end of the rotating motor, and an upper gear and an upper roller are connected on the rotating shaft;
the automatic punching machine is characterized in that the upper end of the bottom plate is connected with a punching base, the punching base is connected with a lower sliding cylinder through a second fixing frame, the lower sliding cylinder is connected with an upper sliding cylinder through a first fixing frame, a storage groove is formed in the upper sliding cylinder, a shaft tube is connected to the upper sliding cylinder, a driven plate and a rotary plate are rotatably connected to the shaft tube through two sides of the shaft tube, the driven plate is connected with a driving plate, a driving belt is connected to the driven plate, a traction shaft is connected to the rotary plate, an impact block is connected to the upper sliding cylinder in an inner connection mode, an elevating frame is connected to the upper end of the impact block, a swinging strip is connected to the elevating frame, a punching block is connected to the lower sliding cylinder, a spring block is connected to the punching block, a second sliding groove is formed in the lower sliding cylinder, a spring seat is connected between the spring seat and the spring block, and an adjusting mechanism for adjusting the lower pressure of the punching block is connected to the bottom plate.
Preferably, the upper gear and the lower gear are in meshed connection.
Preferably, a guide strip is connected to the spring seat.
Preferably, the adjusting mechanism comprises an inserting block, the upper end of the bottom plate is connected with a column base, the column base is connected with a limiting rod and a reset spring, the upper end of the reset spring is connected with a deflection hand, the inserting block is connected with one end of the deflection hand through a bolt, and a deflection piece for driving the inserting block to deflect is arranged on the other side of the inserting block.
Preferably, the deflection hand is rotatably connected to the limiting rod, and the reset spring is sleeved on the limiting rod.
Preferably, the deflection piece includes the slide, the bottom plate upper end is connected with the curb plate, the curb plate upper end is connected with the balladeur train, be connected with the overhead plate between the curb plate, sliding connection has oval piece on the balladeur train, be connected with the jacking piece between the oval piece, be connected with the transmission shaft on the jacking piece, be connected with the support frame on the overhead plate, be connected with the slide frame on the support frame, be connected with the articulated frame on the slide, be connected with the connecting block between articulated frame and the transmission shaft, the lower gear outside is connected with axle one, axle one is connected with axle two through the drive bar, be connected with the inclined plane piece on the axle two.
Preferably, the slide plate is connected with a sideslip rod, and the sideslip rod is connected to the slide rail frame in a sliding way.
Preferably, the second shaft is connected with a roller, the roller is in rolling contact with the first chute, the inclined surface block is provided with a sliding rail groove, the overhead plate is connected with a sliding rail strip, and the sliding rail groove and the sliding rail strip are mutually matched.
In summary, due to the adoption of the technical scheme, the beneficial effects of the invention are as follows:
1. this application is through adopting a smooth section of thick bamboo structure down, utilizes to mutually support between smooth section of thick bamboo down and the punching press piece for but the vertical lift about the punching press piece guarantees that punching press face and punching press base plane are parallel to each other, improves the punching press precision, because smooth section of thick bamboo down is fixed knot with the punching press base and constructs, has guaranteed that the punching press position is accurate, and punching press piece structure change is convenient simultaneously, makes the suitability of this semiconductor part stamping device good.
2. This application is through adopting the plug block structure, utilizes plug block structure pad to establish between impact block and punching press piece, has increased the distance that punching press piece height descends, can be through changing the plug block of different thickness, realizes adjusting the demand of punching press degree of depth, and the structure has the adjustability.
Drawings
Fig. 1 is a schematic view showing the overall structure of a punching device according to an embodiment of the present invention;
fig. 2 shows a schematic structural view of the other side of the whole stamping device according to the embodiment of the invention;
FIG. 3 shows a schematic view of an exploded construction of a lower roll connection provided in accordance with an embodiment of the present invention;
fig. 4 shows a schematic structural diagram of a transmission bar connection provided according to an embodiment of the present invention;
FIG. 5 illustrates an exploded view of a bevel block junction provided in accordance with an embodiment of the present invention;
fig. 6 shows a schematic diagram of an exploded structure of a connection block according to an embodiment of the present invention;
fig. 7 shows a schematic structural diagram of a pylon connection provided according to an embodiment of the present invention;
fig. 8 is a schematic view showing an exploded structure of a shaft tube joint provided according to an embodiment of the present invention;
fig. 9 shows a schematic view of an exploded structure of an impact block joint according to an embodiment of the present invention.
Legend description:
1. a bottom plate; 2. a side plate; 3. a first chute; 4. a carriage; 5. an overhead plate; 6. a slide rail; 7. a jacking block; 8. a connecting block; 9. a slideway frame; 10. a slide plate; 11. a pylon; 12. a plug block; 13. an upper slide cylinder; 14. a turntable; 15. a driven plate; 16. a transmission belt; 17. an upper roller; 18. a limiting plate; 19. a motor cover; 20. a rotating electric machine; 21. a lower roller; 22. a rotating frame; 23. a transmission bar; 24. tooth slots; 25. a limiting tube; 26. a top gear; 27. a rotation shaft; 28. a first shaft; 29. a driving disk; 30. a transmission shaft; 31. a lower gear; 32. a second shaft; 33. a roller; 34. an elliptic block; 35. a spring seat; 36. a slide rail groove; 37. a hinge bracket; 38. a support frame; 39. a side slide bar; 40. deflecting the hand; 41. a limit rod; 42. a return spring; 43. a bolt; 44. stamping a base; 45. a first fixing frame; 46. a shaft tube; 47. a lower slide cylinder; 48. a guide bar; 49. stamping blocks; 50. a second fixing frame; 51. a traction shaft; 52. a swinging bar; 53. a lifting frame; 54. an impact block; 55. a jack-up spring; 56. a spring block; 57. a second chute; 58. a storage groove; 59. and a bevel block.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-9, the present invention provides a technical solution:
the stamping device for the production of the semiconductor parts comprises a bottom plate 1, wherein a limiting plate 18 and rotating frames 22 are fixedly connected to the upper end of the bottom plate 1, a lower gear 31 is rotatably connected to the rotating frames 22, a lower roller 21 is connected between the lower gears 31, the two rotating frames 22 are arranged between the limiting plates 18, a driving disc 29 is connected to the lower roller 21, tooth grooves 24 are formed in the rotating frames 22, the tooth grooves 24 are formed to facilitate the connection between an upper gear 26 and the lower gear 31, the limiting plates 18 are connected to the upper end of the bottom plate 1, two limiting plates 18 are structurally arranged, a motor cover 19 and a limiting tube 25 are connected to the limiting plates 18, the motor cover 19 and the limiting tube 25 are respectively connected to one of the limiting plates 18, a rotating motor 20 is connected to the motor cover 19, the firmness of the connection structure of the rotating motor 20 is guaranteed by utilizing the motor cover 19, a rotating shaft 27 is connected to the output end of the rotating motor 20, an upper gear 26 and an upper roller 17 are connected to the rotating shaft 27, and the upper gear 26 is provided with two, and limiting structures are arranged at the two ends of the upper roller 17, so that the transportation position of the semiconductor raw materials cannot deviate, and the stamping precision is improved;
the upper end of the bottom plate 1 is connected with a punching base 44, the punching base 44 is of a fixed structure, the punching base 44 is connected with a lower slide cylinder 47 through a fixing frame II 50, one end of the fixing frame II 50 is fixedly connected to the bottom plate 1, the lower slide cylinder 47 is connected with an upper slide cylinder 13 through a fixing frame I45, a storage groove 58 is formed in the upper slide cylinder 13, an axle tube 46 is connected to the upper slide cylinder 13, the axle tube 46 is rotatably connected with a driven disc 15 and a rotary table 14 through two sides of the axle, the driven disc 15 is rotatably connected to the axle tube 46 through an axle, the driven disc 15 is connected with a driving disc 29 through a driving belt 16, the rotary table 14 is connected with a traction shaft 51, an impact block 54 is connected in the upper end of the impact block 54, a lifting frame 53 is connected with a swinging rod 52, the upper end and the lower end of the swinging rod 52 are respectively rotatably connected to the traction shaft 51 and the lifting frame 53, the lower slide cylinder 47 is connected with a punching block 49, a spring block 56 is connected to the punching block 49, a second chute 57 is formed in the lower slide cylinder 47, the spring block 56 is slidably connected to the lower slide cylinder 57, the spring block 57 is slidably connected to the sliding block 57 is connected to the upper slide block 57, the traction block 15 is connected to the spring seat 35, the lower spring seat 35 is connected to the spring seat 35, and the spring seat is used for adjusting the height between the upper and the upper spring seat and the spring.
Specifically, as shown in fig. 2, the upper gear 26 and the lower gear 31 are engaged with each other, and the structures are driven with each other.
Specifically, as shown in fig. 8, a guide bar 48 is connected to the spring seat 35, and the guide bar 48 guides the raw material of the semiconductor component, thereby improving the positional accuracy of the raw material during punching.
Specifically, as shown in fig. 7, the adjusting mechanism includes a plug-in block 12, the upper end of the bottom plate 1 is connected with a post 11, a limit rod 41 and a return spring 42 are connected on the post 11, the upper end of the return spring 42 is connected with a deflection hand 40, the plug-in block 12 is connected at one end of the deflection hand 40 through a bolt 43, the plug-in block 12 and one end of the deflection hand 40 adopt a detachable structure of the bolt 43, so that the plug-in block 12 structure with the corresponding thickness can be replaced according to the stamping depth, and a deflection piece for driving the plug-in block 12 to deflect is arranged at the other side of the plug-in block 12.
Specifically, as shown in fig. 7, the deflecting hand 40 is rotatably connected to the limiting rod 41, the restoring spring 42 is sleeved on the limiting rod 41, when the plug block 12 is pushed to move below the impact block 54 and is pressed down by the impact block 54, the deflecting hand 40 will descend along the height of the limiting rod 41, and the restoring spring 42 is compressed.
Specifically, as shown in fig. 5 and 6, the deflection member includes a slide 10, the upper end of the bottom plate 1 is connected with a side plate 2, the upper end of the side plate 2 is connected with a carriage 4, an overhead plate 5 is connected between the side plates 2, a passage is formed between the overhead plate 5 and the bottom plate 1, a semiconductor part which is convenient for punching is passed through, an oval block 34 is slidably connected on the carriage 4, an oval block 34 structure is arranged to enable the jacking block 7 to deflect, the jacking block 7 can only move in the vertical direction, the jacking block 7 is connected between the oval blocks 34, a transmission shaft 30 is connected on the jacking block 7, the structure of a hinge frame 37 is pushed by utilizing the transmission shaft 30 to displace by matching with the structure of the connection block 8, a support frame 38 is connected on the overhead plate 5, a slide frame 9 is connected on the slide 10, a hinge frame 37 is connected with the connection block 8 between the hinge frame 37 and the transmission shaft 30, a first shaft 28 is connected with the outer side of a lower gear 31, a second shaft 32 is connected with the first shaft 32 through a transmission bar 23, and a bevel block 59 is connected on the second shaft 32.
Specifically, as shown in fig. 6, the slide plate 10 is connected with side slide bars 39, the side slide bars 39 are slidably connected to the slide rail frame 9, and two side slide bars 39 are fixedly connected to two sides of the slide plate 10, so that the slide plate 10 is in a horizontal state when moving.
Specifically, as shown in fig. 5, the second shaft 32 is connected with a roller 33, the roller 33 is in rolling contact with the first chute 3, a sliding rail groove 36 is formed in the inclined surface block 59, the overhead plate 5 is connected with a sliding rail strip 6, the sliding rail groove 36 and the sliding rail strip 6 are mutually matched, and the inclined surface block 59 is enabled to move more stably by utilizing the structures of the sliding rail strip 6 and the sliding rail groove 36.
In summary, in the stamping device for producing semiconductor parts provided in this embodiment, when stamping operation is required, the strip-shaped raw material of the semiconductor parts is sent between the lower roller 21 and the upper roller 17, the rotating motor 20 is started, the rotating shaft 27 is driven to rotate by the rotation of the rotating motor 20, so that the upper roller 17 rotates, the lower roller 21 is driven to rotate by the engagement between the upper gear 26 and the lower gear 31, the driving disc 29 on the lower roller 21 drives the driven disc 15 to rotate by the driving disc 29 on the driving belt 16, the turntable 14 is driven to rotate by the driven disc 15, the swing bar 52 connected to the turntable 14 is pulled to move by the traction shaft 51 connected to one side of the turntable 14, the impact block 54 is pulled to lift in the upper slide cylinder 13 by the lower end of the swing bar 52, the upper slide cylinder 13 is provided with the storage groove 58, the storage groove 58 is set to avoid interfering the movement of the swing bar 52 structure, wherein the outer side of the lower gear 31 is connected with a first shaft 28 structure, a transmission bar 23 structure rotationally connected with the first shaft 28 is utilized to push a bevel block 59 to slide on the overhead plate 5, the outer side of the bevel block 59 is connected with a roller 33 structure through a second shaft 32, when the bevel block 59 moves on the overhead plate 5, the roller 33 structure moves on a first chute 3, the upper surface of the bevel block 59 is provided with an inclined bevel structure, one side of the bevel block 59 is supported by utilizing a lifting block 7 structure, the lower surface of the lifting block 7 is provided with an inclined bevel, when the lifting block 7 is subjected to the lifting action of the bevel block 59, the elliptic block 34 slides on a sliding frame 4, so as to push a sliding plate 10 to slide on a sliding frame 9 in cooperation with a connecting block 8 structure, wherein the sliding plate 10 moves horizontally, one end of the sliding plate 10 is abutted against a plug block 12, so that the plug block 12 is pushed to move below an impact block 54, at this time, when the structural height of the impact block 54 is lowered, the impact block 54 can be utilized to push the height of the plug block 12 to be lowered, and the plug block 49 is pushed to be lowered by utilizing the height of the plug block 12 to be lowered until the lower end of the impact block 49 presses the semiconductor part raw material on the impact base 44, so that the raw material presents a preset shape of the impact surface.
The previous description of the embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The utility model provides a stamping device is used in semiconductor part production, includes bottom plate (1), its characterized in that, bottom plate (1) upper end fixedly connected with limiting plate (18) and swivel mount (22), rotationally be connected with lower gear (31) on swivel mount (22), be connected with lower roller (21) between lower gear (31), be connected with driving disk (29) on lower roller (21), tooth's socket (24) have been seted up on swivel mount (22), bottom plate (1) upper end is connected with limiting plate (18), be connected with motor cover (19) and spacing pipe (25) on limiting plate (18), be connected with rotating electrical machines (20) on motor cover (19), rotating electrical machines (20) output is connected with rotation axis (27), be connected with upper gear (26) and upper roller (17) on rotation axis (27).
The upper end of the bottom plate (1) is connected with a punching base (44), the punching base (44) is connected with a lower sliding cylinder (47) through a fixing frame II (50), the lower sliding cylinder (47) is connected with an upper sliding cylinder (13) through a fixing frame I (45), a containing groove (58) is formed in the upper sliding cylinder (13), a shaft tube (46) is connected on the upper sliding cylinder (13), a driven disc (15) and a rotary disc (14) are connected on the shaft tube (46) through rotation of two sides of the shaft, the driven disc (15) is connected with a driving disc (29) through a driving belt (16), a traction shaft (51) is connected on the rotary disc (14), an impact block (54) is connected with a lifting frame (53) in the upper sliding cylinder (13), a swinging strip (52) is connected on the lifting frame (53), a punching block (49) is connected with a spring block (56) on the lower sliding cylinder (47), a spring seat (55) is connected with a spring seat (55) in the lower sliding cylinder (47), the bottom plate (1) is connected with an adjusting mechanism for adjusting the down-pressure height of the punching block (49).
2. Stamping device for semiconductor component production according to claim 1, characterized in that the upper gear (26) is in meshing connection with the lower gear (31).
3. Stamping device for semiconductor component production according to claim 1, characterized in that the spring seat (35) is connected with a guide strip (48).
4. The stamping device for semiconductor part production according to claim 1, wherein the adjusting mechanism comprises a plug-in block (12), a column base (11) is connected to the upper end of the bottom plate (1), a limit rod (41) and a return spring (42) are connected to the column base (11), a deflection hand (40) is connected to the upper end of the return spring (42), the plug-in block (12) is connected to one end of the deflection hand (40) through a bolt (43), and a deflection piece for driving the plug-in block (12) to deflect is arranged on the other side of the plug-in block (12).
5. The stamping device for semiconductor part production according to claim 4, wherein the deflection hand (40) is rotatably connected to the limit lever (41), and the return spring (42) is sleeved on the limit lever (41).
6. The stamping device for semiconductor part production according to claim 4, wherein the deflection piece comprises a sliding plate (10), a side plate (2) is connected to the upper end of the bottom plate (1), a sliding frame (4) is connected to the upper end of the side plate (2), an overhead plate (5) is connected between the side plates (2), an oval block (34) is connected to the sliding frame (4) in a sliding manner, a jacking block (7) is connected between the oval blocks (34), a transmission shaft (30) is connected to the jacking block (7), a supporting frame (38) is connected to the overhead plate (5), a slideway frame (9) is connected to the supporting frame (38), a hinge frame (37) is connected to the sliding plate (10), a connecting block (8) is connected between the hinge frame (37) and the transmission shaft (30), a first shaft (28) is connected to the outer side of the lower gear (31), a second shaft (32) is connected to the first shaft (28) through a transmission bar (23), and a bevel block (59) is connected to the second shaft (32).
7. The stamping device for semiconductor part production according to claim 6, wherein the slide plate (10) is connected with a sideslip rod (39), and the sideslip rod (39) is slidingly connected to the slide frame (9).
8. The stamping device for semiconductor part production according to claim 6, wherein the second shaft (32) is connected with a roller (33), the roller (33) is in rolling contact with the first chute (3), the inclined surface block (59) is provided with a sliding rail groove (36), the overhead plate (5) is connected with a sliding rail (6), and the sliding rail groove (36) and the sliding rail (6) are mutually matched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410094511.8A CN117680536B (en) | 2024-01-24 | 2024-01-24 | Stamping device is used in semiconductor part production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410094511.8A CN117680536B (en) | 2024-01-24 | 2024-01-24 | Stamping device is used in semiconductor part production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117680536A true CN117680536A (en) | 2024-03-12 |
| CN117680536B CN117680536B (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410094511.8A Active CN117680536B (en) | 2024-01-24 | 2024-01-24 | Stamping device is used in semiconductor part production |
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| Country | Link |
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| CN (1) | CN117680536B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209551905U (en) * | 2019-01-29 | 2019-10-29 | 浙江欧尔赛斯科技有限公司 | A kind of spacer processing device |
| CN211437695U (en) * | 2019-11-19 | 2020-09-08 | 河北联润汽车配件有限公司 | High-efficient board-type filter screen production facility |
| CN212528861U (en) * | 2020-05-30 | 2021-02-12 | 浙江驰优包装有限公司 | Manual formula packing carton punching device |
| CN112719074A (en) * | 2020-11-30 | 2021-04-30 | 柏祝美 | Continuous stamping die for metal stamping |
| CN114210867A (en) * | 2021-11-11 | 2022-03-22 | 安徽联鹏瓶盖包装有限公司 | High-precision production device for wine bottle caps |
| CN114850335A (en) * | 2022-06-16 | 2022-08-05 | 江西广信新材料股份有限公司 | High-speed blanking abnormal shape copper sheet device |
| CN114985558A (en) * | 2022-07-14 | 2022-09-02 | 诸城大舜汽车科技有限公司 | Stamping device is used in processing of car seat steel sheet |
| CN116603916A (en) * | 2023-05-30 | 2023-08-18 | 东莞太阳茂森精密金属有限公司 | Die and process for solving burrs at continuous die connecting position |
| CN219664775U (en) * | 2023-03-31 | 2023-09-12 | 江苏顺航电子科技有限公司 | Accurate positioning stamping shaper for injection molding steel sheet |
| CN117139492A (en) * | 2023-09-25 | 2023-12-01 | 济南永胜机械科技有限公司 | Stamping die convenient to change mould head |
-
2024
- 2024-01-24 CN CN202410094511.8A patent/CN117680536B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209551905U (en) * | 2019-01-29 | 2019-10-29 | 浙江欧尔赛斯科技有限公司 | A kind of spacer processing device |
| CN211437695U (en) * | 2019-11-19 | 2020-09-08 | 河北联润汽车配件有限公司 | High-efficient board-type filter screen production facility |
| CN212528861U (en) * | 2020-05-30 | 2021-02-12 | 浙江驰优包装有限公司 | Manual formula packing carton punching device |
| CN112719074A (en) * | 2020-11-30 | 2021-04-30 | 柏祝美 | Continuous stamping die for metal stamping |
| CN114210867A (en) * | 2021-11-11 | 2022-03-22 | 安徽联鹏瓶盖包装有限公司 | High-precision production device for wine bottle caps |
| CN114850335A (en) * | 2022-06-16 | 2022-08-05 | 江西广信新材料股份有限公司 | High-speed blanking abnormal shape copper sheet device |
| CN114985558A (en) * | 2022-07-14 | 2022-09-02 | 诸城大舜汽车科技有限公司 | Stamping device is used in processing of car seat steel sheet |
| CN219664775U (en) * | 2023-03-31 | 2023-09-12 | 江苏顺航电子科技有限公司 | Accurate positioning stamping shaper for injection molding steel sheet |
| CN116603916A (en) * | 2023-05-30 | 2023-08-18 | 东莞太阳茂森精密金属有限公司 | Die and process for solving burrs at continuous die connecting position |
| CN117139492A (en) * | 2023-09-25 | 2023-12-01 | 济南永胜机械科技有限公司 | Stamping die convenient to change mould head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117680536B (en) | 2024-04-19 |
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