CN117677235A - Display assembly, manufacturing method thereof and electronic equipment - Google Patents

Display assembly, manufacturing method thereof and electronic equipment Download PDF

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Publication number
CN117677235A
CN117677235A CN202210979292.2A CN202210979292A CN117677235A CN 117677235 A CN117677235 A CN 117677235A CN 202210979292 A CN202210979292 A CN 202210979292A CN 117677235 A CN117677235 A CN 117677235A
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China
Prior art keywords
light
conductive layer
layer
electronic component
emitting layer
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CN202210979292.2A
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Chinese (zh)
Inventor
胡鄢浩
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Hangzhou Douku Software Technology Co Ltd
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Hangzhou Douku Software Technology Co Ltd
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Priority to CN202210979292.2A priority Critical patent/CN117677235A/en
Publication of CN117677235A publication Critical patent/CN117677235A/en
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Abstract

The application provides a display assembly, a preparation method thereof and electronic equipment. The display component comprises a light-transmitting substrate, a light-emitting layer, a conductive layer and at least one electronic component. The light-emitting layer, the conductive layer and at least one electronic component are arranged on the same side of the light-transmitting substrate, and light rays emitted by the light-emitting layer can pass through the light-transmitting substrate; at least one electronic component is far away from the light-transmitting substrate compared with the light-emitting layer and the conductive layer, and the at least one electronic component is electrically connected with the conductive layer. The light-emitting layer, the conductive layer and at least one electronic component are arranged on the same side of the light-transmitting substrate, so that the conductive layer is directly and electrically connected with the electronic component, the light-transmitting substrate is not required to be bent, the space utilization rate of the light-transmitting substrate is improved, and the display area of the display assembly is increased.

Description

Display assembly, manufacturing method thereof and electronic equipment
Technical Field
The application belongs to the technical field of display, and particularly relates to a display assembly, a preparation method thereof and electronic equipment.
Background
In the present display assembly, a conductive layer and a light emitting layer are generally disposed on one side of a substrate, and an electronic component is disposed on the other side of the substrate. This arrangement requires bending of the substrate to electrically connect the conductive layer to the electronic component, thus resulting in a reduced area of the display area in the display assembly.
Disclosure of Invention
In view of this, a first aspect of the present application provides a display assembly, including a light-transmitting substrate, a light-emitting layer, a conductive layer, and at least one electronic component, where the light-emitting layer, the conductive layer, and the at least one electronic component are disposed on the same side of the light-transmitting substrate, and light emitted by the light-emitting layer can pass through the light-transmitting substrate; the at least one electronic component is far away from the light-transmitting substrate compared with the light-emitting layer and the conductive layer, and the at least one electronic component is electrically connected with the conductive layer.
The application provides a display module through locating luminous layer, conducting layer and electronic components with the same one side of printing opacity basement, makes the conducting layer can direct electrical connection locate the electronic components with one side to control display module and give out light. And the light emitted by the light-emitting layer can pass through the light-transmitting substrate, so that the display component can display pictures and prompt information.
Compared with the display assembly in which the conductive layer and the electronic component are arranged on the two opposite sides of the substrate respectively in the related art, the display assembly of the application enables the conductive layer to be directly and electrically connected with the electronic component by arranging the light-emitting layer, the conductive layer and the electronic component on the same side of the light-transmitting substrate, and the conductive layer and the electronic component are not required to be electrically connected in a bending substrate mode. In other words, the light-transmitting substrate of the present application does not have a bending region, which reduces the area of the non-display region, i.e., increases the area of the display region. Therefore, the light-transmitting substrate does not need to be bent, so that the space utilization rate of the light-transmitting substrate is improved, and the display area of the display assembly is further increased.
The second aspect of the application provides an electronic device, which comprises a shell, a battery and a display assembly provided in the first aspect of the application, wherein the display assembly is arranged on the shell, the shell is provided with an accommodating space, and the battery is arranged in the accommodating space and is electrically connected with the display assembly.
The second aspect of the application provides an electronic device, through adopting the display module that this application provided in the first aspect, set up luminescent layer, conducting layer and at least one electronic components in the same side of printing opacity basement, make conducting layer direct electricity connect electronic components to make the printing opacity basement need not to buckle, and then improved the space utilization of printing opacity basement, increased display module's display area.
A third aspect of the present application provides a method for manufacturing a display assembly, the method comprising:
providing a light-transmitting substrate;
forming a light-emitting layer and a conductive layer which are arranged on the same side of the light-transmitting substrate, wherein light rays emitted by the light-emitting layer can pass through the light-transmitting substrate;
providing at least one electronic component, enabling the at least one electronic component to be arranged on the same side of the transparent substrate, enabling the at least one electronic component to be far away from the transparent substrate compared with the light-emitting layer and the conductive layer, and enabling the at least one electronic component to be electrically connected with the conductive layer.
A third aspect of the present application provides a method for manufacturing a display assembly, where the manufacturing method has a simple process and high operability. The light-emitting layer, the conductive layer and at least one electronic component are arranged on the same side of the light-transmitting substrate, so that the conductive layer is directly and electrically connected with the electronic component, the light-transmitting substrate is not required to be bent, the space utilization rate of the light-transmitting substrate is improved, and the display area of the display assembly is increased.
Drawings
In order to more clearly describe the technical solutions in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.
Fig. 1 is a schematic structural diagram of a display assembly according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a display assembly according to another embodiment of the present application.
Fig. 3 is a schematic structural diagram of a display assembly according to another embodiment of the present application.
Fig. 4 is a schematic structural diagram of a display assembly according to another embodiment of the present application.
Fig. 5 is a schematic structural view of a light emitting layer according to another embodiment of the present application.
Fig. 6 is a schematic structural diagram of a display assembly according to another embodiment of the present application.
Fig. 7 is a schematic structural diagram of a display assembly according to another embodiment of the present application.
Fig. 8 is a schematic structural diagram of a display assembly according to another embodiment of the present application.
Fig. 9 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 10 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 11 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 12 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 13 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 14 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 15 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 16 is a schematic structural view of a display assembly according to another embodiment of the present application.
Fig. 17 is a process flow diagram of a method of manufacturing a display assembly according to an embodiment of the present application.
Description of the reference numerals:
the display module comprises a display component-1, a light-transmitting substrate-10, a light-emitting layer-11, a sub light-emitting layer-111, a light-emitting unit-112, an isolation layer-113, a light-transmitting bonding layer-114, a conductive layer-12, an electronic component-13, an insulating layer-14 and a circuit board-15.
Detailed Description
The following are preferred embodiments of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application and are intended to be within the scope of the present application.
Before the technical scheme of the application is described, the technical problems in the related art are described in detail.
In the present display assembly, a conductive layer and a light emitting layer are generally disposed on one side of a substrate, and an electronic component is disposed on the other side of the substrate. For example, a conductive layer is disposed on the substrate on the display side, and then a light emitting layer is disposed on the side of the conductive layer away from the substrate, but other electronic components are disposed on the back of the substrate, i.e., on the other side of the substrate.
Such an arrangement requires bending of the substrate; or the flexible circuit board is connected in a switching way, so that the flexible circuit board is bent to be respectively connected with the conductive layer and the electronic component, and the conductive layer is led to the back of the substrate, so that the conductive layer and the electronic component are electrically connected. Therefore, the bending area exists in the substrate or the flexible circuit board of the display assembly, and occupies the space of the display assembly, so that the display area of the display assembly is reduced, and the aesthetic degree of the product is even affected. It should be noted that the bending area refers to a bending portion of the substrate or the flexible circuit board, and occupies a space of the display assembly, so that an area of the display area in the display assembly is reduced.
In view of this, in order to solve the above-described problems, the present application provides a display assembly. Referring to fig. 1-2 together, fig. 1 is a schematic structural diagram of a display assembly according to an embodiment of the present application. Fig. 2 is a schematic structural diagram of a display assembly according to another embodiment of the present application.
The present embodiment provides a display assembly 1 including a light-transmitting substrate 10, a light-emitting layer 11, a conductive layer 12, and at least one electronic component 13. The light-emitting layer 11, the conductive layer 12, and the at least one electronic component 13 are disposed on the same side of the transparent substrate 10, and the light emitted from the light-emitting layer 11 can pass through the transparent substrate 10. The at least one electronic component 13 is further away from the light-transmitting substrate 10 than the light-emitting layer 11 and the conductive layer 12, and the at least one electronic component 13 is electrically connected to the conductive layer 12.
Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between different objects and not for describing a particular sequential order.
The display unit 1 according to the present embodiment has other functional components such as a display screen and a presentation information. The present embodiment will be schematically described only with the display module 1 applied to an electronic device. However, this does not represent that the display module 1 of the present embodiment is necessarily applied to an electronic device. It should be noted that, the electronic device provided in this embodiment includes, but is not limited to, mobile terminals such as a mobile phone and a tablet computer. The present embodiment is not limited in the type of electronic device. The Display device 1 provided in this embodiment may be a liquid crystal Display device (Liquid Crystal Display, LCD), an Organic Light-Emitting Display device (OLED), or the like. The type of the display module 1 according to the present embodiment is not limited.
The display assembly 1 provided in this embodiment includes a light-transmitting substrate 10, which is configured to transmit light of the light-emitting layer 11, so that the display assembly 1 can display a picture and prompt information for a user to accept information. The shape and thickness of the light-transmitting substrate 10 are not limited in this embodiment, and the light-transmitting substrate 10 may be used only to transmit light. Alternatively, the material of the light-transmitting substrate 10 includes, but is not limited to, polyimide, polyamide-imide, polyether imide, and the like. As shown in fig. 1, the direction of light emitted from the light emitting layer 11 is shown as D1. Alternatively, the light-transmitting substrate 10 is capable of transmitting light, and the transmittance T of light transmitted through the light-transmitting substrate 10 satisfies the following condition: t is more than or equal to 30% and less than or equal to 100%.
Alternatively, as shown in fig. 2, in the arrangement direction of the light-transmitting substrate 10 and the conductive layer 12 (as shown in the direction D2 in fig. 2), the thickness H of the light-transmitting substrate 10 satisfies the following condition: h is more than or equal to 0.1nm and less than or equal to 3mm; further alternatively, the thickness H of the light-transmitting substrate 10 satisfies the following condition: h is more than or equal to 0.5nm and less than or equal to 2.5mm; still further alternatively, the thickness H of the light-transmitting substrate 10 satisfies the following condition: h is more than or equal to 1nm and less than or equal to 2mm.
By setting the thickness of the light-transmitting substrate 10 to 0.1nm to 3mm, not only the thickness of the light-transmitting substrate 10 but also the thickness of the display module 1 can be reduced; and the cost can be reduced. If the thickness of the transparent substrate 10 is less than 0.1nm, the difficulty of preparing the transparent substrate 10 increases and the cost increases due to the excessive thinness of the transparent substrate 10; if the thickness of the light-transmitting substrate 10 is greater than 3mm, the light-transmitting substrate 10 is excessively thick, resulting in an increase in the thickness of the display assembly 1. Therefore, with the light-transmitting substrate 10 having a thickness of 0.1nm to 3mm, not only the thickness of the light-transmitting substrate 10 can be reduced, thereby reducing the thickness of the display module 1; and the cost can be reduced.
The display assembly 1 provided in this embodiment further includes a light emitting layer 11 for emitting light, so that the display assembly 1 can display a picture and prompt information for a user to accept information. The shape and thickness of the light-emitting layer 11 are not limited in this embodiment, and the light-emitting layer 11 may be capable of emitting light. Alternatively, the light emitting layer 11 may be a single sheet or may be distributed in a multi-point discrete manner.
Alternatively, the material of the light emitting layer 11 includes, but is not limited to, 8-hydroxyquinoline aluminum (AlQ 3), 2- (4-biphenyl) -5-Phenyloxadiazole (PBD), poly-p-phenylene vinylene (PPV), and the like. Optionally, the material of the electroluminescent layer 11 is vacuum plated on the transparent substrate. Alternatively, the light emitting layer 11 receives at least one voltage to place the light emitting layer 11 in an excited state. When the light emitting layer 11 is in an excited state, the light emitting layer 11 is capable of emitting light of at least one wavelength. For example, when at least one voltage excites the light emitting layer 11, the light emitting layer 11 is capable of emitting light of one wavelength, i.e. the light emitting layer 11 emits light of one color. When the light emitting layer 11 is excited by various voltages, the light emitting layer 11 can emit light of various wavelengths, that is, the light emitting layer 11 emits light of various colors.
The display assembly 1 provided in this embodiment further includes a conductive layer 12 for conducting electricity and connecting other components. The shape and thickness of the conductive layer 12 are not limited in this embodiment, and the conductive layer 12 may be conductive. Optionally, the material of the conductive layer 12 includes, but is not limited to, metal or metal oxide. Examples of metals are copper, iron, tin, aluminum, etc. The metal oxide may be Indium Tin Oxide (ITO). The conductive layer 12 is disposed on one side of the light emitting layer 11 and is electrically connected to at least one electronic component 13. Optionally, a conductive layer 12 is provided on the light emitting layer 11 using a vacuum plating, shadow exposure, selective etching process. Optionally, the conductive layer 12 includes at least one conductive line. Alternatively, the light emitted from the light emitting layer 11 can pass through the conductive layer 12.
The display assembly 1 provided in this embodiment further comprises at least one electronic component 13 for electrically connecting the conductive layer 12. The electronic component 13 can control the light emitting layer 11 to emit light through the conductive layer 12, thereby controlling the display assembly 1 to emit light. The shape and number of the conductive layers 12 are not limited in this embodiment, and the electronic component 13 may be electrically connected to the conductive layers 12 to control the light emission of the light emitting layer 11.
Specifically, in the display module 1 provided in this embodiment, first, the light emitting layer 11, the conductive layer 12, and the electronic component 13 are disposed on the same side of the light-transmitting substrate 10, so that the conductive layer 12 disposed on the same side can be directly electrically connected to the electronic component 13 disposed on the same side, thereby controlling the light emission of the display module 1. Secondly, the light emitted by the light emitting layer 11 can pass through the light-transmitting substrate 10, so that the display component 1 can display pictures and prompt messages.
Compared with the display assembly 1 in which the conductive layer 12 and the electronic component 13 are disposed on opposite sides of the substrate in the related art, the display assembly 1 of the present embodiment has the light emitting layer 11, the conductive layer 12, and the electronic component 13 disposed on the same side of the transparent substrate 10, so that the conductive layer 12 is directly electrically connected to the electronic component 13, and the conductive layer 12 and the electronic component 13 do not need to be electrically connected by bending the substrate. In other words, the light-transmitting substrate 10 of the present embodiment does not have a bending region. Therefore, the light-transmitting substrate 10 of the present embodiment does not need to be bent, and the area of the non-display area is reduced, that is, the area of the display area is increased, so that the space utilization of the light-transmitting substrate 10 is improved, and the display area of the display assembly 1 is further increased.
In other words, in the related art, in order to electrically connect the wires in the conductive layer 12 with the electronic component 13 provided on the other side of the substrate, it is necessary that the wires pass around the side of the substrate, that is, pass from the edge of the bent region of the substrate. However, in the present embodiment, since the light-emitting layer 11, the conductive layer 12, and at least one electronic component 13 are provided on the same side of the light-transmitting substrate 10, the region where the electric wire of the conductive layer 12 and the electronic component 13 are electrically connected may be provided at the edge of the light-transmitting substrate 10 or at any place of the light-transmitting substrate 10. Therefore, the display assembly 1 of the embodiment can improve the space utilization rate of the light-transmitting substrate 10, has no frame width requirement, and can realize a borderless design, thereby increasing the display area of the display assembly 1. It should be noted that, the frame corresponds to a bending region in the related art, and the substrate corresponding to the bending region is a non-display region in the display assembly.
In the present embodiment, the light emitting layer 11, the conductive layer 12, and at least one electronic component 13 are disposed on the same side of the transparent substrate 10, so that the wiring of the conductive layer 12 is not required to be led from the front surface of the substrate to the rear surface of the substrate, thereby improving the space utilization rate of the transparent substrate 10, increasing the duty ratio of the display Area (Active Area, AA), reducing the cost, and saving social resources. Here, the AA area refers to a touchable area in the display screen, that is, an area on which a user can perform an operation.
Referring to fig. 1 and 2 again, in one embodiment, the light emitting layer 11 is closer to the light-transmitting substrate 10 than the conductive layer 12; or the conductive layer 12 is closer to the light-transmitting substrate 10 than the light-emitting layer 11, and the conductive layer 12 further penetrates the light-emitting layer 11, so that the conductive layer 12 is electrically connected with the at least one electronic component 13.
The display assembly 1 in the present embodiment has two arrangement forms, as shown in fig. 1, in one arrangement form: the light emitting layer 11, the conductive layer 12, and at least one electronic component 13 in the display assembly 1 are sequentially stacked on the same side of the light transmissive substrate 10. At this time, the light-emitting layer 11 is closer to the light-transmitting substrate 10 than the conductive layer 12, so that the light-transmitting substrate 10 has higher transmittance for the light emitted from the light-emitting layer 11. Meanwhile, since the conductive layer 12 and at least one electronic component are disposed on the same side of the transparent substrate 10, the transparent substrate 10 of the present embodiment does not need to be bent, which improves the space utilization of the transparent substrate 10 and further increases the display area of the display assembly 1.
As shown in fig. 2, in another arrangement, the conductive layer 12, the light emitting layer 11, and at least one electronic component 13 in the display assembly 1 are sequentially stacked on the same side of the light transmissive substrate 10. The light-transmitting substrate 10 of the present embodiment does not need to be bent, so that the space utilization rate of the light-transmitting substrate 10 is improved, and the display area of the display assembly 1 is further increased. Optionally, the conductive layer 12 is further provided on the peripheral side of the light emitting layer 11 and electrically connected to the electronic component 13. Optionally, the conductive layer 12 penetrates the light emitting layer 11, so that the conductive layer 12 is electrically connected to the electronic component 13. Optionally, the light emitting layer 11 includes a plurality of light emitting units 112 disposed at intervals, and a portion of the conductive layer 12 is disposed between two adjacent light emitting units 112, so that the conductive layer 12 is electrically connected to the electronic component 13.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display assembly according to another embodiment of the present application. In one embodiment, the light emitting layer 11 includes at least one sub light emitting layer 111, and the at least one sub light emitting layer 111 is stacked along the alignment direction (as shown in the direction D2 in fig. 3) of the light transmissive substrate 10 and the conductive layer 12.
The light-emitting layer 11 provided in this embodiment includes at least one sub-light-emitting layer 111 for emitting light, so that the display component 1 can display a picture and prompt information for a user to accept information. The shape, thickness, distribution, and number of the sub-light-emitting layers 111 are not limited in this embodiment, and only the sub-light-emitting layers 111 may emit light.
For example, when the sub light emitting layer 111 is one, the user can see that the sub light emitting layer 111 emits light of one wavelength. When the plurality of sub-light emitting layers 111 are provided and the plurality of sub-light emitting layers 111 are stacked, a user can see light in which the plurality of sub-light emitting layers 111 emit light of a plurality of wavelengths after being stacked. When the sub light emitting layers 111 are plural and the plural sub light emitting layers 111 are arranged at intervals, the user can also see that the plural sub light emitting layers 111 emit light of plural wavelengths.
The sub-light emitting layer 111 of the present embodiment can be set according to the needs of the user, so that the display assembly 1 can display different pictures and prompt messages, thereby increasing the application range of the display assembly 1.
Referring to fig. 4-5 together, fig. 4 is a schematic structural diagram of a display assembly according to another embodiment of the present application. Fig. 5 is a schematic structural view of a light emitting layer according to another embodiment of the present application. In one embodiment, each of the sub-light emitting layers 111 includes a plurality of light emitting units 112 disposed at intervals, and when the light emitting layer 11 includes a plurality of the sub-light emitting layers 111, front projections of the plurality of light emitting units 112 of the plurality of sub-light emitting layers 111 on the light transmissive substrate 10 are disposed at intervals.
In this embodiment, the front projections of the light emitting units 112 of the different sub-light emitting layers 111 on the light-transmitting substrate 10 are all arranged at intervals. In other words, the plurality of light emitting units 112 have a pitch between the orthographic projections on the light transmissive substrate 10, and do not overlap each other. This arrangement enables the user to receive one or more types of light emitted by the plurality of light emitting units 112. Alternatively, a manner of disposing through holes on the sub-light emitting layers 111 may be adopted to achieve orthographic projection interval arrangement of the plurality of light emitting units 112 of different sub-light emitting layers 111 on the light transmissive substrate 10.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a display assembly according to another embodiment of the present application. In one embodiment, the display assembly 1 further includes a spacer layer 113, and the spacer layer 113 is disposed between any two adjacent sub-light emitting layers 111.
The display assembly 1 provided in this embodiment further includes an isolation layer 113 for isolating water, oxygen, and the like to protect the light emitting layer 11. The shape, thickness, distribution, and number of the barrier layers 113 are not limited in this embodiment, and the barrier layers 113 may be used to separate water from oxygen. Wherein light emitted from the light emitting layer 11 can pass through the isolation layer 113. Alternatively, the material of the isolation layer 113 includes, but is not limited to, an inorganic compound containing silicon ions, an inorganic compound containing aluminum ions, and the like.
In this embodiment, the isolation layer 113 is added between the adjacent sub-light emitting layers 111 to isolate substances such as external water and oxygen, so as to reduce the damage probability of the sub-light emitting layers 111, further reduce the damage probability of the light emitting layers 11, and further improve the reliability of the display assembly 1.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a display assembly according to another embodiment of the present application. In one embodiment, the display assembly 1 further comprises a light transmissive adhesive layer 114, the light transmissive adhesive layer 114 being bonded between the light emitting layer 11 and the light transmissive substrate 10; and/or the light-transmitting adhesive layer 114 is adhered between the light-emitting layer 11 and the conductive layer 12.
The display assembly 1 provided in this embodiment further includes a light-transmitting adhesive layer 114 adhered between the light-emitting layer 11 and the light-transmitting substrate 10; and/or between the light emitting layer 11 and the conductive layer 12. The light-transmitting adhesive layer 114 also has a function of blocking water, oxygen, and the like to protect the light-emitting layer 11. In addition, the shape, thickness, distribution, and number of the light-transmitting adhesive layers 114 are not limited in this embodiment, and only the light-transmitting adhesive layers 114 need to be able to adhere between the light-emitting layer 11 and the light-transmitting substrate 10; and/or between the light-emitting layer 11 and the conductive layer 12, and water and oxygen may be isolated. Wherein, the light emitted by the light emitting layer 11 can pass through the light transmitting adhesive layer 114. Alternatively, the material of the light-transmitting adhesive layer 114 includes, but is not limited to, an inorganic compound containing silicon ions, an inorganic compound containing aluminum ions, and the like.
The present embodiment is achieved by being between the light emitting layer 11 and the light transmitting substrate 10; and/or add the light-transmitting tie coat 114 between luminescent layer 11 and conductive layer 12, isolate external water, oxygen, etc., thus reduce the probability of luminescent layer 11 damaging, further improve the reliability of the display module 1.
Referring to fig. 8-10 together, fig. 8 is a schematic structural diagram of a display assembly according to another embodiment of the present application. Fig. 9 is a schematic structural view of a display assembly according to another embodiment of the present application. Fig. 10 is a schematic structural view of a display assembly according to another embodiment of the present application. In one embodiment, the display assembly 1 further includes an insulating layer 14, the insulating layer 14 is disposed between the conductive layer 12 and the electronic component 13, and the conductive layer 12 is further disposed on a peripheral side of the insulating layer 14 and electrically connected to the electronic component 13.
The display assembly 1 according to the present embodiment further includes an insulating layer 14, where the insulating layer 14 is used to separate two components or layer structures, and has insulation and protection functions. The shape and thickness of the insulating layer 14 are not limited in this embodiment, and the insulating layer 14 may be insulating. Optionally, the material of the insulating layer 14 includes, but is not limited to, inorganic compounds composed of silicon, boron, aluminum, and various metal oxides, and the like. Optionally, the insulating layer 14 is capable of transmitting light. Alternatively, the process of forming the insulating layer 14 includes, but is not limited to, plating, printing, pasting, and the like.
As shown in fig. 8, in one embodiment, the light-emitting layer 11 is closer to the light-transmitting substrate 10 than the conductive layer 12, in other words, the light-emitting layer 11, the conductive layer 12, the insulating layer 14, and the electronic component 13 are stacked on the same side of the light-transmitting substrate 10. At this time, the conductive layer 12 is also provided on the peripheral side of the insulating layer 14 so that the conductive layer 12 and the electronic component 13 are electrically connected. The arrangement is simple and convenient, the insulating layer 14 can separate the conductive layer 12 from the electronic component 13, the protection effect is achieved, and the direct electrical connection between the conductive layer 12 and the electronic component 13 can be realized. And, this arrangement also reduces the influence on the light emitting layer 11 and the light transmitting substrate 10, improving the stability of the display module 1.
In another embodiment, the conductive layer 12 is closer to the light-transmitting substrate 10 than the light-emitting layer 11. First, as shown in fig. 9, the first arrangement form: the conductive layer 12, the light emitting layer 11, the insulating layer 14, and the electronic component 13 of the display module 1 are stacked on the same side of the light-transmitting substrate 10. At this time, the conductive layer 12 is also provided on the peripheral side of the insulating layer 14 so that the conductive layer 12 and the electronic component 13 are electrically connected. The arrangement is simple and convenient, the insulating layer 14 can separate the luminous layer 11 from the electronic component 13, the protection effect is achieved, and the direct electric connection between the conductive layer 12 and the electronic component 13 can be realized. Optionally, the conductive layer 12 also penetrates the light emitting layer 11; or the conductive layer 12 is also provided on the peripheral side of the light emitting layer 11.
Next, as shown in fig. 10, the second arrangement form: the conductive layer 12, the insulating layer 14, the light emitting layer 11, and the electronic component 13 of the display module 1 are stacked on the same side of the light-transmitting substrate 10. At this time, the conductive layer 12 is also provided on the peripheral side of the insulating layer 14 so that the conductive layer 12 and the electronic component 13 are electrically connected. The arrangement is simple and convenient, the insulating layer 14 can separate the conductive layer 12 from the light-emitting layer 11, the protection effect is achieved, and the direct electrical connection between the conductive layer 12 and the electronic component 13 can be realized. Optionally, the conductive layer 12 also penetrates the light emitting layer 11; or the conductive layer 12 is also provided on the peripheral side of the light emitting layer 11. The conductive layer 12 is electrically connected to the light emitting layer 11.
Referring to fig. 11-13 together, fig. 11 is a schematic structural diagram of a display assembly according to another embodiment of the present application. Fig. 12 is a schematic structural view of a display assembly according to another embodiment of the present application. Fig. 13 is a schematic structural diagram of a display assembly according to another embodiment of the present application, in one embodiment, the display assembly 1 further includes an insulating layer 14, the insulating layer 14 is disposed between the conductive layer 12 and the electronic component 13, and the conductive layer 12 penetrates through the insulating layer 14 and is electrically connected to the electronic component 13.
The insulating layer 14 is described in detail above and will not be described again here. As shown in fig. 11, in one embodiment, the light-emitting layer 11 is closer to the light-transmitting substrate 10 than the conductive layer 12, in other words, the light-emitting layer 11, the conductive layer 12, the insulating layer 14, and the electronic component 13 are stacked on the same side of the light-transmitting substrate 10. At this time, the conductive layer 12 also penetrates through the insulating layer 14, so that the conductive layer 12 and the electronic component 13 are electrically connected. The arrangement is simple and convenient, the insulating layer 14 can separate the conductive layer 12 from the electronic component 13, the protection effect is achieved, and the direct electrical connection between the conductive layer 12 and the electronic component 13 can be realized. And, this arrangement also reduces the influence on the light emitting layer 11 and the light transmitting substrate 10, improving the stability of the display module 1. The conductive layer 12 penetrates through the insulating layer 14, and it is also understood that the insulating layer 14 is provided with at least one through hole, and the conductive layer 12 is further disposed in the through hole, so that the conductive layer 12 is electrically connected with the electronic component 13.
In another embodiment, the conductive layer 12 is closer to the light-transmitting substrate 10 than the light-emitting layer 11. First, as shown in fig. 12, the first arrangement form: the conductive layer 12, the light emitting layer 11, the insulating layer 14, and the electronic component 13 of the display module 1 are stacked on the same side of the light-transmitting substrate 10. At this time, the conductive layer 12 also penetrates through the insulating layer 14, so that the conductive layer 12 and the electronic component 13 are electrically connected. The arrangement is simple and convenient, the insulating layer 14 can separate the luminous layer 11 from the electronic component 13, the protection effect is achieved, and the direct electric connection between the conductive layer 12 and the electronic component 13 can be realized. Optionally, the conductive layer 12 also penetrates the light emitting layer 11; or the conductive layer 12 is also provided on the peripheral side of the light emitting layer 11.
Next, as shown in fig. 13, the second arrangement form: the conductive layer 12, the insulating layer 14, the light emitting layer 11, and the electronic component 13 of the display module 1 are stacked on the same side of the light-transmitting substrate 10. At this time, the conductive layer 12 also penetrates through the insulating layer 14, so that the conductive layer 12 and the electronic component 13 are electrically connected. The arrangement is simple and convenient, the insulating layer 14 can separate the conductive layer 12 from the light-emitting layer 11, the protection effect is achieved, and the direct electrical connection between the conductive layer 12 and the electronic component 13 can be realized. Optionally, the conductive layer 12 also penetrates the light emitting layer 11; or the conductive layer 12 is also provided on the peripheral side of the light emitting layer 11. The conductive layer 12 is electrically connected to the light emitting layer 11.
Optionally, referring to fig. 14, fig. 14 is a schematic structural diagram of a display assembly according to another embodiment of the present application. In one embodiment, the display assembly 1 further includes an insulating layer 14, the insulating layer 14 is disposed between the light emitting layer 11 and the conductive layer 12, and the light emitting layer 11 is closer to the light transmitting substrate 10 than the conductive layer 12. Optionally, the conductive layer 12 also extends through the insulating layer 14; or the conductive layer 12 is further provided on the peripheral side of the insulating layer 14 so that the conductive layer 12 is electrically connected to the light emitting layer 11. In other words, the light emitting layer 11, the insulating layer 14, the conductive layer 12, and the electronic component 13 of the display assembly 1 are stacked on the same side of the light-transmitting substrate 10. The arrangement is simple and convenient, the insulating layer 14 can separate the conductive layer 12 from the light-emitting layer 11, the protection effect is achieved, and the direct electrical connection between the conductive layer 12 and the electronic component 13 can be realized.
Referring to fig. 15-16, fig. 15 is a schematic structural diagram of a display assembly according to another embodiment of the present application. Fig. 16 is a schematic structural view of a display assembly according to another embodiment of the present application.
In one embodiment, the display assembly 1 further includes a circuit board 15 disposed on the same side of the transparent substrate 10, the circuit board 15 is further away from the transparent substrate 10 than the light-emitting layer 11 and the conductive layer 12, the at least one electronic component 13 is disposed on the circuit board 15, and the conductive layer 12 is electrically connected to the circuit board 15.
The display assembly 1 provided in this embodiment further comprises a circuit board 15 for connecting the various components or layers by means of electrical circuits. The shape and thickness of the circuit board 15 are not limited in this embodiment, and the circuit board 15 may be used only to connect the respective components or the layer structure.
In the display assembly 1 in this embodiment, by adding the circuit board 15, the electronic component 13 is mounted on the circuit board 15, and then the conductive layer 12 is electrically connected with the circuit board 15, so that the electrical connection between the conductive layer 12 and at least one electronic component 13 is realized, the assembly difficulty of the conductive layer 12 in directly and electrically connecting with at least one electronic component 13 is reduced, and the reliability of the conductive layer 12 in electrically connecting with the electronic component 13 is further improved due to the at least one circuit of the circuit board 15, so that the reliability of the display assembly 1 is further improved.
The application also provides electronic equipment, including casing, battery and as the above-mentioned display module 1 that provides of this application, display module 1 install in on the casing, the casing has accommodation space, the battery is located in the accommodation space and the electricity is connected display module 1.
By adopting the display assembly 1 provided by the embodiment, the light emitting layer 11, the conductive layer 12 and at least one electronic component 13 are arranged on the same side of the light-transmitting substrate 10, so that the conductive layer 12 is directly and electrically connected with the electronic component 13, the light-transmitting substrate 10 is not required to be bent, the space utilization rate of the light-transmitting substrate 10 is improved, and the display area of the display assembly 1 is increased. The electronic device, the case, and the battery are not shown in the drawings.
The present application further provides a method for manufacturing the display device 1, please refer to fig. 1-2 again, and fig. 17, fig. 17 is a process flow chart of the method for manufacturing the display device according to an embodiment of the present application. The method comprises S100, S200, S300. Among them, S100, S200, S300 are described in detail as follows.
S100, providing a light-transmitting substrate 10.
S200, forming a light-emitting layer 11 and a conductive layer 12 on the same side of the transparent substrate 10, wherein the light emitted by the light-emitting layer 11 can pass through the transparent substrate 10.
S300, providing at least one electronic component 13, enabling the at least one electronic component 13 to be arranged on the same side of the transparent substrate 10, enabling the at least one electronic component 13 to be far away from the transparent substrate 10 compared with the luminous layer 11 and the conductive layer 12, and enabling the at least one electronic component 13 to be electrically connected with the conductive layer 12.
As shown in fig. 1, in one embodiment, a light transmissive substrate 10 is provided. A light emitting layer 11 is formed on one side of the light transmitting substrate 10, and light emitted from the light emitting layer 11 can pass through the light transmitting substrate 10. A conductive layer 12 is formed on the side of the light-emitting layer 11 facing away from the light-transmitting substrate 10. At least one electronic component 13 is provided, the at least one electronic component 13 is arranged on the side of the conductive layer 12 facing away from the light-emitting layer 11, and the at least one electronic component 13 is electrically connected to the conductive layer 12.
In another embodiment, as shown in fig. 2, a conductive layer 12 is formed on one side of the light-transmitting substrate 10, and a light-emitting layer 11 is formed on the side of the conductive layer 12 facing away from the light-transmitting substrate 10. And the light emitted from the light emitting layer 11 can pass through the light-transmitting substrate 10. At least one electronic component 13 is provided, the at least one electronic component 13 is arranged on the side of the light-emitting layer 11 facing away from the conductive layer 12, and the at least one electronic component 13 is electrically connected to the conductive layer 12.
The light-transmitting substrate 10, the light-emitting layer 11, the conductive layer 12, and the electronic component 13 of the display assembly 1 are described in detail above, and are not described here again. The present embodiment provides a manufacturing method of the display module 1, which has a simple process and strong operability. By arranging the light-emitting layer 11, the conductive layer 12 and at least one electronic component 13 on the same side of the light-transmitting substrate 10, the conductive layer 12 is directly and electrically connected with the electronic component 13, so that the light-transmitting substrate 10 does not need to be bent, the space utilization rate of the light-transmitting substrate 10 is improved, and the display area of the display assembly 1 is increased.
Compared with the preparation method of the display component 1 in the related art, the preparation method of the display component 1 provided by the application changes the sequence of the laminated structure of the display screen, and the light-emitting layer 11, the conductive layer 12 and at least one electronic component 13 are arranged on the same side of the light-transmitting substrate 10, so that the wiring of the conductive layer 12 is not required to be led to the back of the substrate from the front of the substrate, and the flexible circuit board is arranged behind the substrate.
The foregoing has outlined rather broadly the more detailed description of the embodiments of the present application in order that the principles and embodiments of the present application may be explained and illustrated herein, the above description being provided for the purpose of facilitating the understanding of the method and core concepts of the present application; meanwhile, as those skilled in the art will have modifications in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims (11)

1. The display component is characterized by comprising a light-transmitting substrate, a light-emitting layer, a conducting layer and at least one electronic component, wherein the light-emitting layer, the conducting layer and the at least one electronic component are arranged on the same side of the light-transmitting substrate, and light rays emitted by the light-emitting layer can pass through the light-transmitting substrate; the at least one electronic component is far away from the light-transmitting substrate compared with the light-emitting layer and the conductive layer, and the at least one electronic component is electrically connected with the conductive layer.
2. The display assembly of claim 1, wherein the light emitting layer is closer to the light transmissive substrate than the conductive layer; or (b)
The conductive layer is closer to the light-transmitting substrate than the light-emitting layer, and penetrates through the light-emitting layer, so that the conductive layer is electrically connected with the at least one electronic component.
3. The display assembly of claim 2, wherein the light emitting layer comprises at least one sub-light emitting layer disposed in a stacked arrangement along the light transmissive substrate and the conductive layer.
4. A display assembly as claimed in claim 3 wherein each of the sub-emissive layers comprises a plurality of light-emitting cells arranged at intervals, and when the emissive layer comprises a plurality of the sub-emissive layers, the orthographic projections of the plurality of light-emitting cells of the plurality of sub-emissive layers on the light transmissive substrate are all arranged at intervals.
5. A display assembly according to claim 3, further comprising a spacer layer disposed between any adjacent two of the sub-emissive layers.
6. The display assembly of claim 3, further comprising a light transmissive adhesive layer bonded between the light emitting layer and the light transmissive substrate; and/or the light-transmitting adhesive layer is adhered between the light-emitting layer and the conductive layer.
7. The display assembly of claim 1, further comprising an insulating layer disposed between the conductive layer and the electronic component, the conductive layer further disposed on a peripheral side of the insulating layer and electrically connected to the electronic component.
8. The display assembly of claim 1, further comprising an insulating layer disposed between the conductive layer and the electronic component, the conductive layer extending through the insulating layer and electrically connecting the electronic component.
9. The display assembly of claim 1, further comprising a circuit board disposed on a same side of the light transmissive substrate, the circuit board being spaced apart from the light transmissive substrate as compared to the light emitting layer and the conductive layer, the at least one electronic component being disposed on the circuit board, the conductive layer being electrically connected to the circuit board.
10. An electronic device, comprising a housing, a battery, and a display assembly according to any one of claims 1-9, wherein the display assembly is mounted on the housing, the housing has a receiving space, and the battery is disposed in the receiving space and electrically connected to the display assembly.
11. A method of manufacturing a display assembly, the method comprising:
providing a light-transmitting substrate;
forming a light-emitting layer and a conductive layer which are arranged on the same side of the light-transmitting substrate, wherein light rays emitted by the light-emitting layer can pass through the light-transmitting substrate;
providing at least one electronic component, enabling the at least one electronic component to be arranged on the same side of the transparent substrate, enabling the at least one electronic component to be far away from the transparent substrate compared with the light-emitting layer and the conductive layer, and enabling the at least one electronic component to be electrically connected with the conductive layer.
CN202210979292.2A 2022-08-16 2022-08-16 Display assembly, manufacturing method thereof and electronic equipment Pending CN117677235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210979292.2A CN117677235A (en) 2022-08-16 2022-08-16 Display assembly, manufacturing method thereof and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210979292.2A CN117677235A (en) 2022-08-16 2022-08-16 Display assembly, manufacturing method thereof and electronic equipment

Publications (1)

Publication Number Publication Date
CN117677235A true CN117677235A (en) 2024-03-08

Family

ID=90066610

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210979292.2A Pending CN117677235A (en) 2022-08-16 2022-08-16 Display assembly, manufacturing method thereof and electronic equipment

Country Status (1)

Country Link
CN (1) CN117677235A (en)

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