CN117676289A

CN117676289A - Camera module and electronic equipment

Info

Publication number: CN117676289A
Application number: CN202311644101.8A
Authority: CN
Inventors: 肖青; 张海裕; 武广文; 董富伟
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2023-11-30
Filing date: 2023-11-30
Publication date: 2024-03-08

Abstract

The application provides a camera module and electronic equipment, wherein the camera module comprises at least one functional component, a circuit board and a bracket, and the circuit board is used for being electrically connected with a main board of the electronic equipment; the bracket comprises a bracket body and a first electric conductor; the support body is arranged on the circuit board, and the support body is matched with the circuit board to enclose at least one functional component in the support; the first electric conductor is arranged on the bracket body and is electrically connected with the circuit board, so that part of electric signals of the circuit board are transmitted to at least one of the functional components through the first electric conductor. The present application may replace a portion of the circuit traces on the circuit board by the first electrical conductor, in other words, the portion of the circuit traces on the circuit board may be transferred to the bracket, the circuit traces required on the circuit board may be reduced, the area of the circuit board can be reduced, and the whole volume of the camera module can be reduced, so that the occupation of the camera module to the internal space of the electronic equipment is reduced, and the electronic equipment is light and thin.

Description

Camera module and electronic equipment

Technical Field

The application relates to the field of terminal products, in particular to a camera module and electronic equipment.

Background

Terminal equipment such as smart mobile phone is the mobile communication instrument that people can't leave in daily life, and the smart mobile phone is equipped with the module of making a video recording and realize shooting function generally, because smart mobile phone shoots the convenience and easy usability of function to the continuous improvement of smart mobile phone shooting level, more and more users use smart mobile phone as the camera.

In the related art, as the shooting requirements of people on terminal equipment such as smart phones are higher, the larger the volume of a camera module used on the terminal equipment is, the larger the volume of the camera module is, the more the internal space of the terminal equipment is occupied, and the thinning of the terminal equipment is not facilitated.

Disclosure of Invention

The application provides a camera module and electronic equipment to improve among the correlation technique the camera module occupy the more problem of electronic equipment inner space.

In a first aspect, the present application provides a camera module, which is applied to an electronic device, the camera module includes:

at least one functional component;

the circuit board is used for being electrically connected with the main board of the electronic equipment; and

A stent, comprising:

the support body is arranged on the circuit board, and the support body is matched with the circuit board to enclose at least one functional component in the support; and

The first electric conductor is arranged on the bracket body and is electrically connected with the circuit board, so that part of electric signals of the circuit board are transmitted to at least one of the functional components through the first electric conductor.

In a second aspect, the application further provides an electronic device, including a housing and a camera module as described above, where the camera module is mounted on the housing.

The support of this application module of making a video recording includes support body and first electric conductor, the support body sets up in the circuit board, through setting up first electric conductor in support body and be connected with the circuit board electricity, make the partial electric signal that needs to transmit to the functional module from the circuit board, perhaps need transmit to the partial electric signal of circuit board from the functional module, can transmit through the first electric conductor on the support, that is to say, this application is through the partial circuit wiring on the first electric conductor replacement circuit board, in other words, the partial circuit wiring on the circuit board shifts to the support, so can reduce required circuit wiring on the circuit board, can reduce the area of circuit board, can reduce the whole volume of the module of making a video recording, thereby when the module of making a video recording is applied to electronic equipment, can reduce the occupation of the module of making a video recording to electronic equipment inner space, do benefit to the frivolousization of electronic equipment.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an image capturing module according to an embodiment of the present application.

Fig. 2 is an exploded view of the camera module provided in the embodiment of the present application.

Fig. 3 is a cross-sectional view of an image capturing module according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a bracket according to an embodiment of the present application.

Fig. 5 is a partial enlarged view at a in fig. 1.

Fig. 6 is a first disassembled schematic view of a bracket according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a first structure of a circuit board according to an embodiment of the present application.

Fig. 8 is a schematic diagram of a trace of a first signal line of a circuit board according to an embodiment of the present application.

Fig. 9 is a schematic diagram illustrating routing of a third signal line of the circuit board according to an embodiment of the present application.

Fig. 10 is a second exploded view of the stent according to the embodiment of the present application.

Fig. 11 is a second schematic structural diagram of a circuit board according to an embodiment of the present application.

Fig. 12 is a schematic diagram illustrating the routing of the fourth signal line and the fifth signal line of the circuit board according to the embodiment of the present application.

Fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to fig. 1 to 13 in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The application provides a camera module and electronic equipment.

Specifically, the camera module provided by the application is applied to electronic equipment to realize the shooting function of the electronic equipment. The camera module that this application provided has less volume, can improve the great problem of camera module volume among the correlation technique, when the camera module that this application provided was applied to electronic equipment, can reduce the occupation to electronic equipment inner space, does benefit to electronic equipment's frivolousization.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface, such as for example, for a cellular network, a Wireless Local Area Network (WLAN), a digital television network, such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal. A communication terminal configured to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal".

Examples of mobile terminals include, but are not limited to, satellites or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; a PDA that can include a radiotelephone, pager, internet/intranet access, web browser, organizer, calendar, and/or a Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver.

The electronic device may be a terminal product or device with shooting function, such as a mobile phone, a tablet computer, an electronic book, and the like. Hereinafter, the camera module and the electronic device will be described in detail by taking a mobile phone as an example.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a camera module provided in an embodiment of the present application, and fig. 2 is an exploded view of the camera module provided in the embodiment of the present application. The camera module 400 is used for realizing functions of photographing, video recording, face recognition unlocking or code scanning payment of the electronic equipment. Note that, the camera module 400 may be a front camera or a rear camera, which is not limited in this embodiment. The structure of the camera module 400 is specifically described below with reference to the drawings. The camera module 400 may include a lens assembly 410, at least one functional assembly 420, a circuit board 430, and a bracket 440.

Wherein the lens assembly 410 includes a lens 411. The lens 411 may be made of glass or plastic. The lens 411 may be provided with a plurality of lenses inside, and the lens 411 may collect external light and may change a propagation path of the light and may focus the light. Along the optical axis direction of the lens 411, the lens 411 includes opposite light entrance sides and light exit sides. It can be understood that the light incident side is the side where the lens 411 collects light, and the light emitting side is the side where the lens 411 images.

The functional component 420 may be configured to include functions for implementing imaging functions, anti-shake functions, etc. of the camera module 400. For example, the functional assembly 420 may include an image sensor assembly 421 to implement the imaging functionality of the camera module 400; the functional component 420 may also include an anti-shake driving component to implement the anti-shake function of the camera module 400. Illustratively, in an embodiment of the present application, the functional component 420 includes an image sensor component 421.

Referring to fig. 3, fig. 3 is a cross-sectional view of an image capturing module according to an embodiment of the present application. The image sensor assembly 421 may be disposed on the light-emitting side of the lens 411 in the optical axis direction of the lens 411, and the image sensor assembly 421 may be disposed opposite the lens 411 in the optical axis direction of the lens 411. The image sensor assembly 421 may include an image sensor 4211 and a circuit substrate 4212, and the image sensor 4211 and the circuit substrate 4212 may be stacked in a thickness direction of the image pickup module 400, that is, in an optical axis direction of the lens 411, and the lens 411 and the image sensor 4211 may be parallel to each other. The image sensor 4211 may be, but is not limited to, a charge coupled device (Charge Coupled Device, CCD) or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) type image sensor. The image sensor 4211 is mainly used for receiving light collected by the lens 411 and converting the light signal into an electrical signal, so as to achieve the imaging requirement of the camera module 400. The circuit substrate 4212 may carry the image sensor 4211 and is electrically connected to the image sensor 4211 to provide power and control signals for the image sensor 4211. Components such as the image sensor 4211 may be mounted on the circuit board 4212 by a surface mount technology (Surface Mounted Technology, SMT), die bonding (D/B), wire bonding (W/B), or the like.

The camera module 400 may further include a filter assembly 450, where the filter assembly 450 is disposed between the lens assembly 410 and the image sensor assembly 421, and light collected by the lens 411 may be transmitted to the image sensor assembly 421 through the filter assembly 450. The filter assembly 450 may include one or more layers of filters (not shown) and a filter support 440 (not shown) for supporting the filters, wherein the filters correct the filtered light so that the filters filter the stray light (e.g., infrared light) when the light passes through the filter support, thereby increasing the imaging effect of the camera module 400. Illustratively, the optical filter may be a blue glass or other optical filtering structure, and the blue glass may be fixed on the optical filter support by means of dispensing baking or the like.

The circuit board 430 may be disposed on the light emitting side of the lens 411 along the optical axis direction of the lens 411, and the circuit board 430 may be disposed on the side of the image sensor assembly 421 facing away from the lens 411. The circuit board 430 may be a printed circuit board 430 (Printed Circuit Board, PCB) or a flexible circuit board 430 (Flexible Printed Circuit, FPC) or a combination of both, on which a plurality of pads for soldering the respective electronic components and a plurality of circuit traces for electrically connecting the respective electronic components may be provided.

Wherein the image sensor assembly 421 may be connected to the circuit board 430. It will be appreciated that the circuit board 430 is used to support the image sensor assembly 421 and to provide power and control signals to the image sensor assembly 421. In addition, when the camera module 400 is applied to an electronic device, the circuit board 430 is also used for being electrically connected with a motherboard of the electronic device, so as to realize data transmission and signal control between the camera module 400 and the electronic device.

The bracket 440 is used as a main support carrier of the camera module 400 to provide support and connection for the lens assembly 410, the circuit board 430, and the like. Meanwhile, the bracket 440 may also form part of the external contour of the camera module 400, and the bracket 440 may be used to fit the lens assembly 410 and the circuit board 430 to enclose the functional assemblies 420 such as the image sensor assembly 421 inside the camera module 400, so as to seal and protect the electronic devices and the optical devices.

The camera module 400 may further include a reinforcing base 460, where the reinforcing base 460 is connected to a side of the circuit board 430 facing away from the bracket 440, and the reinforcing base 460 may enhance the overall strength of the camera module 400.

In the related art, along with the shooting requirement of people on the mobile phone camera module, the integration level of devices inside the camera module is higher and higher, and a plurality of electronic devices or optical devices need to be connected to a circuit board, so that the circuit wiring (or signal wiring) on the circuit board is very much, the design area of the circuit board is larger, the whole volume of the camera module is larger, and the camera module occupies more internal space of the electronic equipment, so that the electronic equipment is not easy to lighten.

In view of this, in order to improve the above-mentioned problems, the embodiment of the present application improves the support 440 to transfer part of the circuit traces in the camera module 400 to the support 440, so as to reduce the trace area on the circuit board 430 and reduce the area of the circuit board 430.

Referring to fig. 4 in conjunction with fig. 1 and 3, fig. 4 is a schematic structural diagram of a bracket according to an embodiment of the present application. In the present embodiment, the bracket 440 includes a bracket body 441 and a first electrical conductor 442.

In the description of the present application, it should be understood that terms such as "first," "second," and the like are used merely to distinguish between similar objects and should not be construed to indicate or imply relative importance or implying any particular order of magnitude of the technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

The bracket body 441 is disposed on the circuit board 430, and the bracket body 441 cooperates with the circuit board 430 to enclose at least one functional component 420 in the bracket 440.

It will be appreciated that the bracket body 441 may be made of an insulating material such as plastic, wood, etc. Furthermore, the bracket body 441 is made of a light-tight material, so as to prevent external light from being irradiated onto the image sensor 4211 through the bracket body 441, and avoid interference with the imaging of the camera module 400.

As shown in fig. 3, the bracket body 441 may be fixed on the circuit board 430, and a side of the bracket body 441 facing the circuit board 430 may be provided with a receiving groove 441a, and functional components such as the image sensor assembly 421 may be enclosed in the receiving groove 441a in cooperation with the circuit board 430. The holder body 441 may further be provided with a through hole 441b penetrating the holder body 441 in a thickness direction, the through hole 441b communicating with the receiving groove 441a, and the lens assembly 410 may be mounted to the through hole 441b such that external light is condensed onto the image sensor 4211 in the receiving groove 441a through the lens 411.

Please refer to fig. 5 in combination with fig. 3 and 4, fig. 5 is a partial enlarged view of fig. 1 at a. The first electrical conductor 442 is disposed on the bracket body 441, and the first electrical conductor 442 is electrically connected to the circuit board 430, so that a portion of the electrical signal of the circuit board 430 is transmitted to at least one of the functional components 420 through the first electrical conductor 442. The first electrical conductor 442 may be made of a conductive material such as metal, graphite, or conductive rubber, so as to transmit an electrical signal.

Specifically, taking the functional component 420 as the image sensor component 421 as an example, in some embodiments, the first electrical conductor 442 may have one end electrically connected to the circuit board 430 and the other end electrically connected to the image sensor component 421, so that a part of the electrical signal externally input to the circuit board 430 may be directly transmitted to the image sensor component 421 through the first electrical conductor 442, and at the same time, a part of the electrical signal output by the image sensor component 421 may also be directly transmitted to the circuit board 430 through the first electrical conductor 442 and output through the circuit board 430.

In other embodiments, the first electrical conductor 442 may be electrically connected to the circuit board 430 at two ends, for example, one end of the first electrical conductor 442 may be electrically connected to one of the electrical connections on the circuit board 430, such as the first electrical connection, and the other end of the first electrical conductor 442 may be electrically connected to the other electrical connection on the circuit board 430, such as the second electrical connection, and the image sensor assembly 421 may be electrically connected to the second electrical connection through the circuit trace on the circuit board 430, where the first electrical conductor 442 becomes a bridge circuit, so that a portion of the electrical signal externally input to the circuit board 430 may be transmitted to the image sensor assembly 421 through the first electrical conductor 442 and the circuit board 430 (circuit trace), while a portion of the electrical signal output from the image sensor assembly 421 may be transmitted to the circuit board 430 through the circuit board 430 (circuit trace). The electrical connection portion herein refers to a structure provided on the circuit board 430 for connecting other components to achieve electrical conduction with each other, and may be, for example, a pad, a pin, or the like.

Then, the bracket 440 of the camera module 400 includes a bracket body 441 and a first electrical conductor 442, where the bracket body 441 is disposed on the circuit board 430, and the first electrical conductor 442 is disposed on the bracket body 441 and electrically connected with the circuit board 430, so that a part of electrical signals to be transmitted from the circuit board 430 to the functional component 420, or a part of electrical signals to be transmitted from the functional component 420 to the circuit board 430, can be transmitted through the first electrical conductor 442 on the bracket 440, that is, the first electrical conductor 442 replaces a part of circuit traces on the circuit board 430, in other words, a part of circuit traces on the circuit board 430 are transferred to the bracket 440, so that the circuit traces required on the circuit board 430 can be reduced, the trace area of the circuit board 430 can be reduced, the overall volume of the camera module 400 can be reduced, and when the camera module 400 is applied to an electronic device, occupation of the internal space of the electronic device can be reduced, which is beneficial to light and thin of the electronic device.

The first electrical conductor 442 may be disposed inside the bracket body 441, and only the end portion is exposed for connection with the circuit board 430, or the first electrical conductor 442 may be directly disposed on the surface of the bracket body 441.

For example, please refer to fig. 6 in combination with fig. 4 and 5, fig. 6 is a first exploded view of a bracket according to an embodiment of the present application. The first electrical conductor 442 is disposed in the bracket body 441, and an end of the first electrical conductor 442 is exposed from the surface of the bracket body 441. Wherein, the end of the first electric conductor 442 is exposed from a side surface of the bracket body 441 facing the circuit board 430.

Specifically, in practical applications, the first electrical conductor 442 may be disposed within the bracket body 441 by in-mold injection molding (Insert molding). That is, the bracket 440 is integrally formed by in-mold injection molding.

The first electrical conductor 442 is disposed in the bracket body 441, the first electrical conductor 442 can be adapted to the shape of the bracket body 441 to form a frame shape, and part of the circuit wiring required by the circuit board 430 is replaced by the first electrical conductor 442, so that the circuit wiring required by the circuit board 430 can extend to the three-dimensional space on one side of the plane where the circuit board 430 is located through the first electrical conductor 442, thereby breaking the limitation of the plane area of the circuit board 430, needing no more circuit wirings disposed on the circuit board 430, reducing the area of the circuit board 430, and reducing the overall volume of the camera module 400. Also, the first electrical conductor 442 is located inside the bracket body 441 such that a "skeleton" is formed inside the bracket body 441, the overall strength of the bracket 440 can be enhanced, and the reliability and stability of use of the bracket 440 can be improved.

Alternatively, in another alternative embodiment of the present application, the first electrical conductor 442 may be formed on the surface of the bracket body 441 by a Laser-Direct-structuring technique.

The first electrical conductor 442 may be formed on the inner surface of the bracket body 441 or may be formed on the outer surface of the bracket body 441, which is not limited in this embodiment.

It can be appreciated that the image sensor 4211 is an important imaging component of the camera module 400, and the imaging quality of the camera module 400 is closely related to the quality of the image sensor 4211. In order to improve the shooting effect of the shooting module 400, the image sensor 4211 of some shooting modules 400 has larger size, and the circuit wiring connected with the image sensor 4211 is more, so that the area of the circuit board 430 needs to be designed larger. The specific connection relationship between the bracket 440 and the circuit board 430 will be described in detail below with respect to the image sensor 4211, and for convenience of description, the image sensor assembly 421 is defined herein as a first functional assembly.

Referring to fig. 7 in conjunction with fig. 2 and 3, fig. 7 is a schematic diagram of a first structure of a circuit board according to an embodiment of the present application. The circuit board 430 includes a first portion 431 and a second portion 432. The first portion 431 is electrically provided with a first functional component, the second portion 432 is enclosed by the first portion 431, and the second portion 432 includes a connection terminal 4322 for electrically connecting with a motherboard of the electronic device.

As shown in fig. 3, the first functional component, that is, the image sensor component 421, is fixed to the first portion 431, and in particular, the circuit substrate 4212 of the image sensor component 421 may be fixed to the first portion 431 and electrically connected to the first portion 431, and the image sensor component 421 may be electrically connected to the second portion 432 through the first portion 431.

The connection terminal 4322 may be electrically connected to a motherboard of the electronic device through a connection device, such as a Board-to-Board connector 470 (BTB) to realize signal control and data transmission between the camera module 400 and the motherboard. For example, the control signal sent from the motherboard may be transmitted to the circuit board 430 through the board-to-board connector 470 and the connection terminal 4322 to control the image sensor 4211, and the image data output from the image sensor 4211 to the circuit board 430 may also be transmitted to the motherboard through the connection terminal 4322 and the board-to-board connector 470 to be processed.

Since there are many circuit traces to be connected to the image sensor assembly 421, that is, a large number of signal lines are required to be disposed on the second portion 432, and these signal lines all extend to the connection end 4322 of the circuit board 430 to receive the control signal or output the image data, the second portion 432 needs to have enough trace area, resulting in a larger area of the second portion 432. In contrast, in an embodiment, please refer to fig. 8, fig. 8 is a schematic diagram illustrating a routing of a first signal line of the circuit board according to an embodiment of the present application. The second portion 432 includes a first signal line 4321a electrically connected to the first portion 431, wherein one end of the first electrical conductor 442 is electrically connected to the first signal line 4321a, and the other end is electrically connected to the connection terminal 4322, such that the connection terminal 4322 forms an electrical path with the first functional component through the first electrical conductor 442 and the first signal line 4321a, or such that a part of the electrical signal input from the connection terminal 4322 is transmitted to the first functional component through the first electrical conductor 442 and the first signal line 4321 a.

The other end of the first electrical conductor 442 may be directly electrically connected to the connection terminal 4322, or may be electrically connected to the connection terminal 4322 through another signal trace.

Specifically, a portion of the electrical signal (e.g., the control signal) sent from the motherboard to the connection terminal 4322 may be transmitted to the second portion 432 through the first electrical conductor 442, to the first portion 431 through the first signal line 4321a of the second portion 432, and to the image sensor assembly 421 via the first portion 431. Of course, it is understood that a portion of the electrical signal (e.g., image data) output from the image sensor assembly 421 may also be transmitted through the first portion 431 to the second portion 432, through the first signal line 4321a of the second portion 432 to the first electrical conductor 442, through the first electrical conductor 442 to the connection terminal 4322, and through the connection terminal 4322 to the motherboard.

Since the first electrical conductor 442 connects the connection end 4322 with the first signal line 4321a, the first signal line 4321a only needs to be designed with a short length, so that the first signal line 4321a can electrically connect the first electrical conductor 442 with the first portion 431 without extending to the connection end 4322, that is, by the arrangement, a part of the electrical signal input to the connection end 4322 is transmitted to the first signal line 4321a through the first electrical conductor 442, and the first electrical conductor 442 replaces the extending portion of the first signal line 4321a which needs to extend to the connection end 4322, thereby reducing the occupation of the first signal line 4321a to the second portion 432, reducing the routing area of the second portion 432, and reducing the area of the second portion 432, thereby reducing the overall area of the circuit board 430.

In order to ensure that the first electrical conductor 442 is firmly connected to the circuit board 430, please refer to fig. 5, 7 and 8, the second portion 432 is provided with a first pad 4323a and a second pad 4323b, the first pad 4323a is electrically connected to the first signal line 4321a, the second pad 4323b is electrically connected to the connection terminal 4322, one end of the first electrical conductor 442 is soldered to the first pad 4323a, and the other end is soldered to the second pad 4323 b.

Specifically, one end of the first electrical conductor 442 may be soldered to the first pad 4323a through solder paste, and the other end of the first electrical conductor 442 may be soldered to the second pad 4323b through solder paste.

Referring to fig. 4, a notch 441c exposing an end of the first electrical conductor 442 is disposed on a side of the bracket body 441 facing the circuit board 430, so that solder paste is placed in the notch 441c to solder and fix the first electrical conductor 442 to a pad on the circuit board 430, thereby reducing the soldering difficulty between the first electrical conductor 442 and the circuit board 430 and ensuring a stable connection therebetween.

It is understood that, to effectively reduce the routing area of the second portion 432 and greatly reduce the area of the second portion 432, the number of the first signal lines 4321a may be plural, and the first electrical conductors 442 may transmit a part of the electrical signals input to the connection terminals 4322 to the image sensor assembly 421 through the plural first signal lines 4321 a.

For example, referring to fig. 7 and 8, the number of the first pads 4323a and the second pads 4323b is plural, the first pads 4323a are disposed at intervals, each first pad 4323a is electrically connected to a first signal line 4321a, the second pads 4323b are disposed at intervals, and each second pad 4323b can be electrically connected to the connection terminal 4322 through an independent signal line such as the second signal line 4321 b.

As shown in fig. 6, the first electrical conductor 442 includes a plurality of first metal wires 4421 arranged at intervals, one end of each first metal wire 4421 is soldered to a first pad 4323a, and the other end of each first metal wire 4421 is soldered to a second pad 4323 b.

It can be appreciated that the plurality of first metal wires 4421 are arranged at intervals, the plurality of first metal wires 4421 are connected with the plurality of first pads 4323a one to one, and the plurality of first metal wires 4421 are connected with the plurality of second pads 4323b one to one, so that each metal wire can independently transmit a part of electrical signals, and signal crosstalk is avoided. An insulating portion may be further disposed between every two adjacent first metal wires 4421 to further avoid signal crosstalk. For example, the insulating portion may be formed of a structure in which the bracket body 441 is embedded in adjacent two first metal wires 4421.

It is understood that the remaining signal lines on the second portion 432 that are to be connected to the image sensor assembly 421 may extend directly to the connection terminal 4322 and be electrically connected to the connection terminal 4322.

Optionally, referring to fig. 9, fig. 9 is a schematic diagram illustrating routing of a third signal line of the circuit board according to an embodiment of the present application. The second portion 432 may further include a third signal line 4321c, one end of the third signal line 4321c is electrically connected to the first portion 431, and the other end extends toward the connection terminal 4322 and is electrically connected to the connection terminal 4322, so that a part of the electrical signal input from the connection terminal 4322 is transmitted to the first functional component through the third signal line 4321 c.

Optionally, in order to meet the requirement of the user for a higher quality shooting effect, the camera module 400 may be equipped with an optical anti-shake technology, and the optical anti-shake technology may compensate the optical path during shake by moving the lens 411 or the image sensor 4211, so as to improve the shooting effect during shake of the electronic device.

Illustratively, in one embodiment, the functional component 420 further includes a chip anti-shake component 422. The chip anti-shake assembly 422 is connected to the image sensor 4211 for driving the image sensor 4211 to move relative to the circuit board 430. In this embodiment, the chip anti-shake component 422 is defined as a second functional component.

The chip anti-shake assembly 422 may have various structural components and driving modes, which are not limited in the embodiments of the present application. For example, the chip anti-shake assembly 422 may drive the image sensor 4211 to move or rotate by generating electromagnetic force based on the principle of electromagnetic induction; the chip anti-shake component 422 can also be based on the principle of electro-deformation, and the memory metal is used to drive the image sensor 4211 to move or rotate. In an exemplary embodiment of the present application, as shown in fig. 2 and 3, the chip anti-shake assembly 422 is configured by using an electromagnetic induction principle as an example, the chip anti-shake assembly 422 includes a coil 4221 and a magnet 4222, the magnet 4222 may be fixed on an inner surface of the bracket body 441, the coil 4221 is connected with the image sensor assembly 421, and the coil 4221 is disposed opposite to the magnet 4222.

Since the image sensor assembly 421 is coupled to the first portion 431 of the circuit board 430, i.e., the first portion 431 of the circuit board 430 follows the image sensor assembly 421 and the circuit board 430 is not movable as a whole, the first portion 431 and the second portion 432 of the circuit board 430 may be elastically coupled to each other to ensure an effective electrical connection between the image sensor assembly 421 and the circuit board 430.

For example, referring to fig. 7, the circuit board 430 may further include an elastic connection portion 433, the elastic connection portion 433 electrically connects the first portion 431 and the second portion 432, and the first portion 431 is movable relative to the second portion 432 through the elastic connection portion 433.

It will be appreciated that the resilient connecting portion 433 has a certain elasticity, so that it can be elastically bent and deformed by an external force, thereby enabling the first portion 431 to be movable relative to the second portion 432.

Specifically, one end of the elastic connection part 433 is connected to the second portion 432 and may be fixed, and the other end is connected to the first portion 431 and may move following the first portion 431 by the driving force of the chip anti-shake assembly 422. The elastic connection portion 433 may provide an elastic force opposite to the movement direction of the first portion 431 to affect the movement of the first portion 431 (and thus the overall movement of the image sensor assembly 421), and the elastic force provided by the elastic connection portion 433 and the driving force provided by the chip anti-shake assembly 422 may act on the first portion 431 together, so that the first portion 431 (or the image sensor assembly 421) may stay at a certain position stably, so that the anti-shake control of the image sensor 4211 is more accurate.

It is understood that the elastic connection 433 may be made of a material having an elastic restoring force. For example, the elastic connection 433 may be a suspension wire 4331 (Trace suspention assembly, TSA).

As an example, as shown in fig. 8, the first portion 431 is generally rectangular (or rounded rectangular) in shape to fit the contour of the image sensor assembly 421, and the circuit board 430 may be provided with four elastic connection portions 433, and the four elastic connection portions 433 are respectively connected to four sides of the first portion 431. Each elastic connection 433 may be a set of suspension wires 4331, and a plurality of sets of suspension wires 4331 are uniformly distributed around the center of the circuit board 430. Each of the suspension wires 4331 constituting the elastic connection part 433 may include a plurality of suspension wires arranged side by side. The plurality of suspension wires may not only physically connect the second portion 432 and the first portion 431, but may also electrically connect the circuit structures on the second portion 432 and the first portion 431. The suspension wires in each group of suspension wire lines 4331 can be arranged at intervals, namely, circuit isolation is realized between two adjacent suspension wires at intervals, and the transmission power supply or signals of the suspension wires are not influenced.

Specifically, referring to fig. 8 and 9 in combination, the plurality of first signal lines 4321a on the second portion 432 are electrically connected one-to-one with a portion of the suspension wires 4331, such as the first suspension wires 4331a, and the plurality of third signal lines 4321c are electrically connected with another portion of the suspension wires 4331, such as the second suspension wires 4331 b. Then, a part of the electrical signal inputted from the main board to the connection terminal 4322 may be transmitted to the image sensor assembly 421 through the first electrical conductor 442, the first signal line 4321a, and the first suspension wire 4331a, and another part of the electrical signal inputted from the main board to the connection terminal 4322 may be transmitted to the image sensor assembly 421 through the second signal line 4321b and the second suspension wire 4331 b.

In general, the mounting position of the motherboard in the electronic device is spaced from the mounting position of the camera module 400, and in order to electrically connect the circuit board 430 with the motherboard, please refer to fig. 3 and 7 in combination, the second portion 432 includes a main body portion 432a and a lead portion 432b.

The main portion 432a includes a first side 4301 and a second side 4302 opposite to each other, the lead portion 432b is connected to the second side 4302 and extends out of the bracket body 441, and the lead portion 432b is provided with the connecting end 4322. The connection end 4322 may be disposed at an end of the lead-out portion 432b away from the main portion 432a, and by disposing the connection end 4322 at the lead-out portion 432b, the connection end 4322 may extend to be located outside the bracket body 441, so that when the motherboard is far from the mounting position of the camera module 400, the connection end 4322 has a sufficient distance from the main portion 432a, so that the connection end 4322 electrically connects the motherboard with the circuit board 430.

The lead-out portion 432b needs to extend out of the holder body 441, that is, the holder body 441 is mainly disposed on the main body portion 432a, and the first pad 4323a and the second pad 4323b need to be disposed on the main body portion 432a for facilitating the electrical connection between the first electrical conductor 442 and the second portion 432. Then, referring to fig. 8, the lead-out portion 432b may include a second signal line 4321b, and the second signal line 4321b electrically connects the connection terminal 4322 and the second pad 4323 b.

Note that a major portion of the second signal line 4321b is located in the region of the lead-out portion 432b, and a small portion of the second signal line 4321b, such as an end portion of the second signal line 4321b away from the connection terminal 4322, may extend to the region of the main body portion 432a to be electrically connected to the second pad 4323 b.

Since the connection end 4322 is disposed at an end of the lead-out portion 432b away from the main portion 432a, for some signal lines on the second portion 432 that are farther from the connection end 4322, the length of the extension portion that extends to the connection end 4322 is required to be longer. Referring to fig. 9, the main body portion 432a is designed to be rectangular and annular around the first portion 431, the main body portion 432a may include a top frame, a right frame, a bottom frame and a left frame, which are sequentially connected, the top frame is opposite to the bottom frame, the right frame is opposite to the left frame, the lead-out portion 432b is connected to a side edge of the bottom frame far away from the top frame, that is, the second side edge 4302, where each frame is arranged with a signal line electrically connected to the first portion 431, in a conventional case, the signal lines of the left frame, the right frame and the top frame need to extend a long distance to be electrically connected to the connection end 4322, and particularly the signal lines of the first end located on the top frame need to extend a long enough distance to be electrically connected to the connection end 4322, and need to sequentially pass through the left/right frame, the bottom frame and the lead-out portion 432b, so that the areas of the left/right frame and the bottom frame need to be designed to be large, resulting in a large area of the circuit board 430. The head end here refers to an end of the signal line connected to the first portion 431.

In this regard, in an embodiment, the first electrical conductor 442 is electrically connected to the signal line with the head end located at the top frame, that is, the first signal line 4321a of the above embodiment may be the signal line with the head end located at the top frame. For example, referring again to fig. 7, the first land 4323a is disposed adjacent the first side 4301 and the second land 4323b is disposed adjacent the second side 4302.

In this embodiment, the first bonding pad 4323a is disposed near the first side 4301, so that the first signal line 4321a is a signal line with the head end located at the top frame, and the first electrical conductor 442 is electrically connected to the first signal line 4321a with the head end located at the top frame through the first bonding pad 4323a, so that a part of the electrical signal input from the motherboard to the connection end 4322 can be transmitted to the first signal line 4321a with the head end located at the top frame through the second signal line 4321b and the first electrical conductor 442, and an extension part of the first signal line 4321a, which originally needs to extend to the connection end 4322, can be omitted, so that the length of the first signal line 4321a is reduced, and the manufacturing of the circuit board 430 is facilitated; and the first signal line 4321a does not need to pass through the left/right frame and the bottom frame, so that the occupation of the area of the signal line to the left/right frame and the bottom frame is reduced, in other words, the left/right frame and the bottom frame do not need to leave a wiring area for the first signal line 4321a to pass through, the frame widths of the left/right frame and the bottom frame can be reduced, and the area of the left/right frame and the bottom frame can be reduced, so that the area of the main body 432a can be reduced, the whole area of the circuit board 430 can be reduced, on the one hand, the four frame widths of the main body 432a are uniform, the arrangement of the internal space of the camera module 400 is facilitated, the whole volume of the camera module 400 is reduced, the occupation of the internal space of the camera module 400 to the electronic device is reduced, and the lightening and thinning of the electronic device are facilitated.

In other optional embodiments of the present application, other conductive structures, such as a second conductor, may be further disposed on the bracket body to connect signal lines with the head end located at the left frame and/or the right frame, so that a portion of the electrical signal input from the motherboard to the connection end may also be transmitted to the image sensor assembly through the second conductor.

Optionally, referring to fig. 10, fig. 10 is a second disassembled schematic view of the bracket according to the embodiment of the present application. The bracket 440 further includes a second electric conductor 443, the second electric conductor 443 is stacked and spaced apart from the first electric conductor 442 in the thickness direction of the bracket body 441, and the second electric conductor 443 is electrically connected with the circuit board 430 such that another portion of the electric signal of the circuit board 430 is transmitted to the first functional component through the second electric conductor 443.

Referring to fig. 11, fig. 11 is a schematic diagram of a second structure of a circuit board according to an embodiment of the present application. The main body 432a further includes a third side 4303 and a fourth side 4304 opposite to each other, wherein the third side 4303 is a side of the left frame away from the right frame, the fourth side 4304 is a side of the right frame away from the left frame, the main body 432a is provided with a plurality of third pads 4323c, a plurality of fourth pads 43123d and a plurality of fifth pads 4323e, the plurality of third pads 4323c are disposed adjacent to the third side 4303, the plurality of fourth pads 43123d are disposed adjacent to the fourth side 4304, and the plurality of fifth pads 4323e are disposed adjacent to the second side 4302 and are located on one side of the second pads 4323 b. Each of the fifth pads 4323e may be electrically connected to the connection terminal 4322 through a signal trace on the lead-out portion 432 b.

Referring to fig. 12, fig. 12 is a schematic diagram illustrating the routing of the fourth signal line and the fifth signal line of the circuit board according to the embodiment of the present application. The main body 432a further includes a fourth signal line 4321d, where the fourth signal line 4321d is a signal line with a head end located at the left frame, and one end of the fourth signal line 4321d is connected to the first portion 431 and the other end is electrically connected to the third pad 4323 c. The second electric conductor 443 includes a plurality of second metal wires 4431 arranged at intervals, one end of the plurality of second metal wires 4431 being one-to-one connected to the plurality of third pads 4323c, and the other end of the plurality of second metal wires 4431 being one-to-one connected to a part of the fifth pads 4323 e. Then, a portion of the electrical signal input from the motherboard to the connection terminal 4322 may be further transmitted to the image sensor assembly 421 through the second metal lead 4431 of the second electrical conductor 443 and the fourth signal line 4321d, and an extension portion of the fourth signal line 4321d that is originally required to extend to the connection terminal 4322 may be omitted, so that the left frame and the bottom frame do not need to leave a routing area for the fourth signal line 4321d to extend, and the frame widths of the left frame and the bottom frame may be further reduced, thereby reducing the overall area of the circuit board 430.

The main body 432a further includes a fifth signal line 4321e, where the fifth signal line 4321e is a signal line with a head end located at the right frame, and one end of the fifth signal line 4321e is connected to the first portion 431 and the other end is electrically connected to the fourth pad 43123 d. The second electrical conductor 443 further includes a plurality of third metal wires 4432 arranged at intervals, and the plurality of third metal wires 4432 are disposed on one side of the plurality of second metal wires 4431. One end of the plurality of third metal wires 4432 is connected one-to-one with the plurality of fourth pads 43123d, and the other end of the plurality of third metal wires 4432 is connected one-to-one with the other part of the fifth pads 4323 e. Then, a portion of the electrical signal input from the motherboard to the connection terminal 4322 may be further transmitted to the image sensor assembly 421 through the third metal lead 4432 of the second electrical conductor 443 and the fifth signal line 4321e, and an extension portion of the fifth signal line 4321e that is originally required to extend to the connection terminal 4322 may be omitted, so that the right frame and the bottom frame do not need to leave a routing area for the fifth signal line 4321e to extend, and the frame width of the right frame and the bottom frame may be further reduced, thereby reducing the overall area of the circuit board 430.

It can be appreciated that by disposing the second electric conductor 443 and the first electric conductor 442 at a lamination interval in the thickness direction of the bracket body 441 such that the second electric conductor 443 and the first electric conductor 442 are isolated from each other, the second electric conductor 443 and the first electric conductor 442 can transmit electric signals independently, respectively, so as to avoid occurrence of signal crosstalk.

That is, in this embodiment, by providing the second electrical conductor 443, the second electrical conductor 443 can electrically connect the signal lines with the first end located at the left frame and the right frame with the connection end 4322, so that a part of the electrical signal input from the motherboard to the connection end 4322 can be transmitted to the image sensor assembly 421 through the second electrical conductor 443, the routing area required by the circuit board 430 can be further reduced, the area of the circuit board 430 can be further reduced, and thus the overall volume of the camera module 400 is reduced.

Optionally, in some embodiments, the bracket 440 may further include a third electrical conductor (not shown). The third electrical conductor may be disposed within the bracket body 441 and insulated from the first electrical conductor 442. One end of the third electrical conductor may be electrically connected to the circuit board 430 and the other end may be electrically connected to another functional component such as the third functional component 423 such that a portion of the electrical signal of the circuit board 430 is transmitted to the third functional component 423 through the third electrical conductor.

The third functional component 423 may be a lens anti-shake component, and the lens anti-shake component is connected to the lens 411 for electrically driving the lens 411 to move or rotate along a direction perpendicular to an optical axis of the lens 411 to implement the lens anti-shake function of the camera module 400. Optionally, the third functional component 423 may also be a lens zooming component, where the lens zooming component is connected to the lens 411 and is used for electrically driving the lens 411 to move along the optical axis direction of the lens 411, so as to implement the zooming function of the image capturing module 400.

Through setting up third electric conductor in support body 441 and being connected circuit board 430 and third functional module 423 electricity for circuit board 430 and third functional module 423 form the electric route through the third electric conductor, can reduce even save at the inside electric connection circuit such as flexible circuit board that is used for connecting circuit board 430 and third functional module 423 of extra setting of camera module 400, can reduce the occupation to camera module 400 inner space, further reduce the whole volume of camera module 400, and do benefit to the whole assembly of camera module 400.

Referring to fig. 13, fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device 10 includes a housing 100, a display 200, a motherboard 300, and a camera module 400.

The display screen 200 is disposed on the housing 100 to form a display surface of the electronic device 10, and is used for displaying information such as images and texts. The display screen 200 may include a liquid crystal display screen 200 (Liquid Crystal Display, LCD) or an Organic Light-Emitting Diode (OLED) display screen 200, or the like.

The housing 100 is used to form the exterior contour of the electronic device 10 so as to house the electronics, functional components, etc. of the electronic device 10 while providing a seal and protection for the electronics and functional components within the electronic device 10. Electronic devices and functional components such as motherboard 300, batteries, sensors, etc. of electronic device 10 may all be disposed within housing 100. It is understood that the housing 100 may include a middle frame 110 and a rear cover 120.

The middle frame 110 may have a thin plate-like or sheet-like structure, or may have a hollow frame structure. The center 110 is used to provide support for the electronics or functional components in the electronic device 10 to mount the electronics, functional components of the electronic device 10 together. For example, the middle frame 110 may be provided with grooves, protrusions, etc. to facilitate mounting of the electronic devices or functional components of the electronic device 10. It is understood that the material of the middle frame 110 may include metal or plastic. The middle frame 110 has opposite first and second sides, and the display screen 200 and the rear cover 120 are disposed on the first and second sides of the middle frame 110, respectively.

The rear cover 120 is used to seal the electronic devices and functional components of the electronic device 10 inside the electronic device 10 together with the middle frame 110 and the display screen 200 to form a protective effect for the electronic devices and functional components of the electronic device 10. It is understood that the material of the rear cover 120 may also include metal or plastic.

The main board 300 is disposed inside the housing 100. For example, the main board 300 may be mounted on the middle frame 110 of the case 100 to be fixed, and the main board 300 is sealed inside the electronic device 10 by the rear cover 120. Wherein, one or more of the functional components of the processor, the earphone interface, the acceleration sensor, the gyroscope, the motor and the like can be integrated on the main board 300. Meanwhile, the display screen 200 may be electrically connected to the main board 300 to control the display of the display screen 200 by a processor on the main board 300.

The camera module 400 is used for realizing functions of photographing, video recording, face recognition unlocking or code scanning payment of the electronic device 10. Note that, the camera module 400 may be a front camera or a rear camera, which is not limited in this embodiment. In the electronic device 10 provided in the present application, the camera module 400 may be a camera module in the above embodiment.

In the electronic device 10 of the present application, the bracket 440 of the camera module 400 includes a bracket body 441 and a first electrical conductor 442, the bracket body 441 is disposed on the circuit board 430, and by disposing the first electrical conductor 442 on the bracket body 441 and electrically connecting with the circuit board 430, a part of electrical signals to be transmitted from the circuit board 430 to the functional component 420, or a part of electrical signals to be transmitted from the functional component 420 to the circuit board 430, can be transmitted through the first electrical conductor 442 on the bracket 440, that is, the first electrical conductor 442 replaces a part of circuit traces on the circuit board 430, in other words, a part of circuit traces on the circuit board 430 are transferred to the bracket 440, so that the required circuit traces on the circuit board 430 can be reduced, the trace area of the circuit board 430 can be reduced, the whole volume of the camera module 400 can be reduced, the occupation of the internal space of the electronic device 10 by the camera module 400 can be reduced, and the light and thin electronic device 10 can be facilitated.

The above describes the image capturing module and the electronic device provided in the embodiments of the present application in detail. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, with the description of the examples given above only to assist in understanding the present application. Meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims

1. A camera module, characterized in that is applied to electronic equipment, the camera module includes:

at least one functional component;

A stent, comprising:

2. The camera module of claim 1, wherein the functional component comprises a first functional component; the circuit board comprises a first part and a second part, the first part is provided with the first functional component, the second part is arranged around the first part, and the second part comprises a first signal wire electrically connected with the first part and a connecting end electrically connected with the main board;

one end of the first electric conductor is electrically connected with the first signal wire, and the other end of the first electric conductor is electrically connected with the connecting end, so that part of electric signals input from the connecting end are transmitted to the first functional component through the first electric conductor and the first signal wire.

3. The camera module according to claim 2, wherein the second portion is provided with a first pad and a second pad, the first pad being electrically connected to the first signal line, the second pad being electrically connected to the connection terminal;

one end of the first electric conductor is welded with the first bonding pad, and the other end of the first electric conductor is welded with the second bonding pad.

4. A camera module according to claim 3, wherein the second portion includes a main body portion including opposite first and second sides, and an extraction portion connected to the second side and extending out of the holder body, the extraction portion being provided with the connection terminal, the extraction portion including a second signal line electrically connecting the connection terminal with the second pad;

the first bonding pad is arranged on the main body part and close to the first side edge, and the second bonding pad is arranged on the main body part and close to the second side edge.

5. The camera module of claim 4, wherein the number of the first pads and the second pads are plural, the plural first pads are arranged at intervals along the first side, and the plural second pads are arranged at intervals along the second side;

The first electric conductor comprises a plurality of first metal wires which are arranged at intervals, one end of each first metal wire is welded with one first bonding pad, and the other end of each first metal wire is welded with one second bonding pad.

6. The camera module according to claim 2, wherein the second portion further includes a third signal line having one end electrically connected to the first portion and the other end extending toward and electrically connected to the connection terminal so that a part of the electrical signal inputted from the connection terminal is transmitted to the first functional component through the third signal line.

7. The camera module of claim 2 or 6, wherein the circuit board further comprises a resilient connection electrically connecting the first portion and the second portion and allowing the first portion to move relative to the second portion via the resilient connection.

8. The camera module according to any one of claims 1 to 6, wherein the first electrical conductor is disposed in the holder body by in-mold injection molding, and an end portion of the first electrical conductor is exposed from a surface of the holder body;

Alternatively, the first electrical conductor is formed on the surface of the bracket body by a laser direct structuring technology.

9. The camera module according to any one of claims 1 to 6, wherein the bracket further includes a second electric conductor which is stacked and spaced apart from the first electric conductor in a thickness direction of the bracket body, and which is electrically connected to the circuit board so that another part of the electric signal of the circuit board is transmitted to the first functional component through the second electric conductor.

10. An electronic device comprising a housing and a camera module according to any one of claims 1 to 9, the camera module being mounted to the housing.