CN117673692A - Millimeter wave transmission structure, millimeter wave package antenna and manufacturing method thereof - Google Patents
Millimeter wave transmission structure, millimeter wave package antenna and manufacturing method thereof Download PDFInfo
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Abstract
The application discloses a millimeter wave transmission structure, a millimeter wave package antenna and a manufacturing method thereof, and relates to the technical field of communication. The millimeter wave transmission structure includes: an organic substrate comprising: a first surface having a first metal layer disposed thereon; a second surface having a second metal layer disposed thereon; a coupling groove perpendicular to the first surface and penetrating the organic substrate, wherein the side wall of the coupling groove is plated with copper and filled with a dielectric material; the first laminated substrate is arranged on the first metal layer, and a first coupling microstrip line is arranged on the surface of one side of the first laminated substrate, which is far away from the first metal layer; the second laminated substrate is arranged on the second metal layer, and a second coupling microstrip line is arranged on the surface of one side of the second laminated substrate, which is far away from the second metal layer; the first coupling microstrip line and the second coupling microstrip line are coupled through a coupling slot. The vertical slotting structure adopted by the application has the advantages of high working frequency, wide bandwidth and low loss, and is beneficial to breaking through the bottleneck that the feeding interconnection of the packaging antenna of the organic substrate is difficult to design when the feeding interconnection exceeds 100 GHz.
Description
Technical Field
The application relates to the technical field of communication, in particular to a millimeter wave transmission structure, a millimeter wave package antenna and a manufacturing method thereof.
Background
With the progress of electronic communication and system integration technology in recent years, millimeter wave application is becoming popular, and wide application is obtained in the fields of automotive radar, 5G and 6G data communication, robot and industrial automation, medical treatment, security inspection and the like. The antenna is an important component in a wireless system, and the millimeter wave antenna has the characteristics of small size, high manufacturing precision requirement, high design cost of a matching interface and the like. The package antenna integrates the antenna and the millimeter wave chip in the same package, and the interconnection from the antenna to the chip is formed in the package, so that the package antenna has the advantage of high integration level, does not need discrete elements such as waveguide, coaxial line and the like, has small parasitic effect, improves the system performance and reduces the manufacturing cost.
Chip-to-antenna interconnects in packaged antennas include wire bonding, flip-chip bumps, and fan-out packages. The chip bonding pad and the antenna are connected through the lead wire by the lead wire bonding, so that low-cost system integration can be realized, the defects of large parasitic inductance and narrow bandwidth are overcome, and more complex matching design is needed in application. Flip bumps typically flip the chip onto the antenna substrate, the chip being connected to the antenna pattern by solder balls. Parasitic parameters such as capacitance exist due to the influence of the bonding pad, so that the bandwidth is influenced, but the bonding pad can be used for millimeter wave packaging, and the bandwidth is superior to wire bonding. The fan-out type package realizes the lead-out of the chip bonding pad through the fan-out wiring layer, has the advantages of small interconnection size and low parasitic effect, and is very suitable for the application of millimeter wave package antennas.
The substrates for packaging antennas include molding compounds, glass, ceramics, organic substrates, etc., where molding compounds and glass are inconvenient in packaging antenna applications because they are not conventional substrate materials for antenna design. The organic substrate is a conventional material for antenna design, has the advantages of rich varieties, complete performance parameters and mature manufacturing process, the chip embedding technology of the fan-out organic substrate is used for pasting chips into the grooves of the substrate, the surface is used for manufacturing a fan-out wiring layer to lead out a chip bonding pad, and the fan-out wiring layer is combined with the organic substrate, so that the fan-out organic substrate chip embedding technology is suitable for packaging antenna design. For the multi-layer organic substrate process, the manufacturing cost generally increases rapidly with the number of substrate layers, and at present, more than 6 layers of organic substrates are difficult to manufacture, so that a relatively small substrate layer is a practical consideration for obtaining application of the system in the design of the packaged antenna. The multilayer organic substrate needs a vertical interconnection structure of signals, at present, the domestic and foreign packaging antennas are all interconnected by adopting traditional through holes, parasitic inductance and pad capacitance exist in the through holes, the multilayer organic substrate can be used below 100GHz in the millimeter wave packaging antenna, and the defects of high transmission loss and difficult matching exist for the application exceeding 100 GHz.
Disclosure of Invention
In order to solve the problems existing in the prior art, in a first aspect, the present application provides a millimeter wave transmission structure, including:
an organic substrate comprising:
a first surface having a first metal layer disposed thereon;
a second surface opposite to the first surface, on which a second metal layer is provided;
a coupling groove perpendicular to the first surface and penetrating through the organic substrate, wherein a third metal layer is electroplated on the side wall of the coupling groove and is filled with a dielectric material;
the first laminated substrate is arranged on the first metal layer, and a first coupling microstrip line is arranged on the surface of one side of the first laminated substrate, which is far away from the first metal layer;
the second laminated substrate is arranged on the second metal layer, and a second coupling microstrip line is arranged on the surface of one side of the second laminated substrate, which is far away from the second metal layer;
the first coupling microstrip line and the second coupling microstrip line are coupled through the coupling slot.
In one embodiment, the coupling groove is U-shaped;
the first coupling microstrip line is a single microstrip line, one end of the first coupling microstrip line is a millimeter wave input end, and the other end of the first coupling microstrip line crosses the coupling groove to form a matching branch;
the second coupling microstrip line is T-shaped, wherein two ends in the direction perpendicular to the first coupling microstrip line are millimeter wave output ends, and one end in the direction parallel to the first coupling microstrip line forms a matching branch.
In one embodiment, the coupling groove is H-shaped;
the first coupling microstrip line is a single microstrip line, one end of the first coupling microstrip line is a millimeter wave input end, and the other end of the first coupling microstrip line crosses the coupling groove in a fork-shaped structure to form a matching branch;
the second coupling microstrip line is a differential microstrip line, one end of each microstrip line in the differential microstrip line is a millimeter wave output end, and the other end of each microstrip line passes through the coupling groove to form a matching branch.
In a second aspect, the present application provides a millimeter wave package antenna comprising: chip, antenna and any millimeter wave transmission structure provided by the application;
the chip is connected with the millimeter wave input end of the first coupling microstrip line and is used for providing millimeter wave signals;
the millimeter wave transmission structure is used for transmitting millimeter wave signals provided by the chip from the first coupling microstrip line to the second coupling microstrip line;
the antenna is arranged on the second laminated substrate, connected with the second coupling microstrip line and used for receiving millimeter wave signals.
In an embodiment, the millimeter wave package antenna further comprises a coplanar stripline conversion structure connecting the antenna and the second coupling microstrip line;
the output end of the second coupling microstrip line passes through the coplanar stripline conversion structure to form a matching branch;
the coplanar stripline transition structure forms a feed to the antenna.
In an embodiment, the coplanar stripline conversion structure and the second metal layer are disposed on the same plane.
In one embodiment, the first laminate substrate has a fan-out wiring layer disposed thereon;
the chip is fixedly arranged in the first laminated substrate, and the chip is connected with the first coupling microstrip line through fan-out wiring of the fan-out wiring layer.
In an embodiment, the chip is connected to the first coupling microstrip line through a bump.
In a third aspect, the present application provides a method for manufacturing a millimeter wave transmission structure, for manufacturing any one of the millimeter wave transmission structures provided in the present application, including:
a coupling groove is formed in the organic substrate;
a first metal layer and a second metal layer are respectively arranged on the first surface and the second surface of the organic substrate perpendicular to the coupling groove, and a third metal layer is electroplated on the side wall of the coupling groove;
filling a dielectric material in the coupling groove, flattening the dielectric material by adopting a flattening process, and patterning the first metal layer and the second metal layer by adopting a photoetching process;
laminating a first laminate substrate and a second laminate substrate on the first metal layer and the second metal layer, respectively;
and arranging a first coupling microstrip line on the first laminated substrate and arranging a second coupling microstrip line on the second laminated substrate.
Compared with the through hole interconnection, the vertical slotting structure adopted by the millimeter wave transmission structure has the advantages of high working frequency, wide bandwidth and low loss, and is beneficial to breaking through the bottleneck that the feed interconnection of the organic substrate packaging antenna is difficult to design when the feed interconnection exceeds 100 GHz.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. In the drawings:
fig. 1 is a schematic diagram of a millimeter wave transmission structure provided in the present application.
Fig. 2A and 2B are schematic diagrams of a first example of the millimeter wave transmission structure provided in the present application.
Fig. 3A and 3B are schematic diagrams of a second example of the millimeter wave transmission structure provided in the present application.
Fig. 4A and 4B are schematic diagrams of a third example of the millimeter wave transmission structure provided in the present application.
Fig. 5A and 5B are schematic diagrams of a millimeter wave transmission antenna provided in the present application.
Fig. 6A and fig. 6B are schematic diagrams of a coupling microstrip line and coplanar strip line conversion structure provided in the present application.
Fig. 7 is a schematic diagram of a method for manufacturing a millimeter wave transmission structure provided in the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings. The exemplary embodiments of the present invention and their descriptions herein are for the purpose of explaining the present invention, but are not to be construed as limiting the invention.
The following provides many different embodiments, or examples, of the different components used to implement embodiments of the present invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to limit embodiments of the present invention. For example, references to a first element being formed on a second element may include embodiments in which the first and second elements are formed in direct contact, and may include embodiments in which additional elements are formed between the first and second elements such that the first and second elements are not in direct contact. In addition, the present invention may repeat reference numerals and/or letters in the various examples. Such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Furthermore, in some embodiments of the invention, terms such as "connected," "interconnected," and the like, with respect to joined, connected, and the like, may refer to two structures being in direct contact, or may refer to two structures not being in direct contact, with other structures being disposed between the two structures, unless otherwise specified.
Moreover, spatially relative terms such as "below" …, "" below, "" above "…," "over" and the like may be used herein to describe various elements or components and relationships between one element or component and another as illustrated. These spatial terms are intended to encompass different orientations of the device in use or operation, as well as orientations depicted in the figures. As used herein, the spatially relative terms are intended to be interpreted as relative to a rotated orientation when the device is rotated to another orientation (90 or other orientation).
The terms "about", "approximately" and "approximately" as used herein generally mean within + -20%, preferably + -10%, and more preferably + -5%, or + -3%, or + -2%, or + -1%, or 0.5% of a given value. Where a given value is about, that is, where "about", "approximately" or "approximately" is not specifically recited, the given value may still be implied by the meaning of "about", "approximately" or "approximately".
Embodiments of the invention are described below that may provide additional steps before, during, and/or after the various stages described in these embodiments. Additional components may be added to the semiconductor device structure. Some of the described components may be replaced or omitted in different embodiments. Although some of the embodiments discussed are performed in a specific order of steps, these steps may be performed in another logical order.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be appreciated that terms, such as those defined in a general dictionary, should be construed to have meanings consistent with the background or context of the present invention and should not be construed in an idealized or overly formal manner unless expressly so defined herein.
In a first aspect, the present application provides a millimeter wave transmission structure, and fig. 1 is a schematic diagram of the millimeter wave transmission structure provided in the present application.
As shown in fig. 1, the millimeter wave transmission structure includes an organic substrate 1, a first laminate substrate 2, and a second laminate substrate 3.
Specifically, the organic substrate 1 includes a first surface 11 and a second surface 12 opposite to each other, the first surface 11 having a first metal layer 41 provided thereon, and the second surface 12 having a second metal layer 42 provided thereon. The organic substrate 1 is provided with a coupling groove 13 perpendicular to the first surface 11 and the second surface 12. The coupling groove 13 sidewall is plated with a relatively smooth third metal layer 43 to reduce loss of skin effect. The coupling groove 13 is filled with the dielectric material 6, and upper and lower surfaces of the dielectric material 6 are flush with the first metal layer 41 and the second metal layer 42, respectively. The dielectric material 6 has a low loss tangent in the millimeter wave band, and its thermal expansion coefficient is compatible with the material of the organic substrate 1, curing temperature, etc. and the process temperature of the organic substrate 1. The material of the dielectric material 6 includes, but is not limited to, air, polyimide PI, polytetrafluoroethylene PTFE, liquid crystal LCP, benzocyclobutene BCB, and the like. In practice, a dielectric material having an appropriate dielectric constant may be selected to achieve a suitable coupling slot size.
The first laminated substrate 2 is disposed on the upper surface of the first metal layer 41, and the lower surface of the first laminated substrate 2 is in contact with the first metal layer 41, and the upper surface of the first laminated substrate 2 is provided with a first coupling microstrip line 51.
The second laminated substrate 3 is disposed on the lower surface of the second metal layer 42, and the upper surface of the second laminated substrate 3 contacts the second metal layer 42, and the lower surface of the second laminated substrate 3 is provided with a second coupling microstrip line 52.
The first coupling microstrip line 51 and the second coupling microstrip line 52 are both open-circuited at one end, and one end of the open circuit passes through the coupling slot 13 to form a matching branch, so that impedance matching is realized. The first metal layer 41 is a ground plane corresponding to the first coupling microstrip line 51, and the second metal layer 42 is a ground plane corresponding to the second coupling microstrip line 52. The first coupling microstrip line 51 and the second coupling microstrip line 52 are coupled through the coupling slot 13. When a millimeter wave signal is input from the first coupling microstrip line 51, the millimeter wave signal is coupled to the second coupling microstrip line 52 through the coupling slot 13, and transmission between the first coupling microstrip line 51 and the second coupling microstrip line 52 is realized. The second coupling microstrip line 52 may be connected with other devices to realize further transmission of millimeter wave signals.
In the present application, the organic substrate 1 may be directly formed by laminating a single-layer core board or a multi-layer core board, and the wiring pattern may be provided in the organic substrate 1 according to actual demands. The materials of the organic substrate 1, the first laminate substrate 2 and the second laminate substrate 3 include, but are not limited to, BT resin, polytetrafluoroethylene PTFE, liquid crystal LCP, FR4, and the like. The materials of the first metal layer 41, the second metal layer 42 and the third metal layer 43 include, but are not limited to, copper, and the first metal layer 41 and the second metal layer 42 can be patterned into a desired wiring pattern according to actual requirements.
The structures of the first coupling microstrip line 51, the second coupling microstrip line 52, the coupling slot 13, and the like in the present application will be described in more detail by way of specific embodiments.
In one embodiment, as shown in fig. 2A and 2B, the coupling groove 13 is U-shaped;
the first coupling microstrip line 51 is a single microstrip line, one end 511 of the first coupling microstrip line is a millimeter wave input end, the other end 512 is open-circuited and passes through the coupling groove 13 to form a matching branch so as to realize impedance matching;
the second coupling microstrip line 52 is also a single microstrip line, one end 521 of which is a millimeter wave output end, and the other end 522 of which is open-circuited and passes through the coupling slot 13 to form a matching branch so as to realize impedance matching;
the first metal layer 41 and the second metal layer 42 are ground planes of the first coupling microstrip line 51 and the second coupling microstrip line 52, respectively.
In this embodiment, millimeter wave signals are input single-ended and output single-ended.
In another embodiment, as shown in fig. 3A and 3B, the coupling groove 13 is U-shaped;
the first coupling microstrip line 51 is a single microstrip line, one end 511 of which is a millimeter wave input end (single-ended input), and the other end 512 is open-circuited and passes through the coupling slot 13 to form a matching branch so as to realize impedance matching;
the second coupling microstrip line 52 is T-shaped in which both ends 521 and 522 located in a direction perpendicular to the first coupling microstrip line 51 are millimeter wave output ends (both end outputs), and one end 523 located in a direction parallel to the first coupling microstrip line 51 is open-circuited to form a matching stub, realizing impedance matching.
In this embodiment, the millimeter wave signal is input through a single end, and the in-phase output is formed through the first end 521 and the second end 522 of the second coupling microstrip line 52, so as to drive the subsequent device (such as an antenna array structure).
In another embodiment, as shown in fig. 4A and 4B, the coupling groove 13 is H-shaped;
the first coupling microstrip line 51 is a single microstrip line, one end 511 of which is a millimeter wave input end, the other end 512 of which is in a fork structure, and the two branches 5121 and 5122 are open and cross the coupling groove to form a matching branch, so as to realize impedance matching. The fork structure is adopted at the coupling position, so that the coupling performance can be enhanced.
The second coupling microstrip line 52 is a differential microstrip line, and the differential microstrip line includes a first microstrip line 53 and a second microstrip line 54, where one end 531 of the first microstrip line 53 is open-circuited and forms a matching stub beyond the coupling slot 13, and the other end 532 extends along a first direction (a direction indicated by an arrow in fig. 4A) as a first output end; one end 541 of the second microstrip line 54 is open-circuited and forms a matching stub across the coupling slot 13, and the other end 542 extends in a second direction opposite to the first direction as a second output.
In this embodiment, the millimeter wave signal is input in a single end, and the first microstrip line 53 and the second microstrip line 54 in the differential microstrip line form an inverted output to drive the subsequent device (such as an antenna array structure).
The coupling in this embodiment uses an H-shaped slot instead of a U-shaped slot, which can achieve a better symmetrical structure and reduce slot radiation leakage.
The millimeter wave transmission structure of the application adopts the vertical slotting structure to replace the traditional via interconnection structure, has the advantages of high working frequency, wide bandwidth and low loss, and is beneficial to breaking through the bottleneck that the feed interconnection of the organic substrate packaging antenna is difficult to design when exceeding 100 GHz.
In a second aspect, the present application provides a millimeter wave package antenna, as shown in fig. 5A, comprising: the chip 7, the antenna 8, and any millimeter wave transmission structure provided in the present application, the specific structure of which is referred to any one of fig. 1 to 4B, and the present embodiment will be described taking the millimeter wave transmission structure shown in fig. 2A and 2B as an example.
The chip 7 is connected with the millimeter wave input end of the first coupling microstrip line 51 and is used for providing millimeter wave signals;
the millimeter wave transmission structure is used for transmitting millimeter wave signals provided by the chip 7 from the first coupling microstrip line 51 to the second coupling microstrip line 52;
an antenna 8 is disposed on the second laminate substrate 3 and connected to the second coupling microstrip line 52 for receiving millimeter wave signals. The antenna 8 may have the ground plane inside the substrate as its reflecting ground plane.
The chip 7 and the first coupling microstrip line 51 may be connected by flip-chip bump, fan-out wiring, or the like. The chip 7 shown in fig. 5A is connected to the first coupling microstrip line 51 by bumps. Fig. 5B is a fan-out wiring connection. Specifically, as shown in fig. 5B, a fan-out wiring layer 9 is provided on the first laminate substrate 2, and the chip 7 is fixedly provided in a slot of the millimeter wave transmission structure with the front face facing upward, and the chip 7 is connected with the first coupling microstrip line 51 through the fan-out wiring in the fan-out wiring layer 9.
The antennas in fig. 5A and 5B may be directly connected to the second coupling microstrip line to transmit millimeter wave signals; the millimeter wave signal transmission can also be realized by a coupling mode. Accordingly, in one embodiment, the present application provides a structure that serves as an intermediary for millimeter wave signal transmission between an antenna and a second coupled microstrip line through a coplanar stripline transition structure. Fig. 6A and 6B show only a partial structure diagram including a coplanar stripline conversion structure and one output end of a second coupling microstrip line, and the structures of a coupling slot, a first coupling microstrip line, a chip, an antenna, and the like are not shown.
As shown in fig. 6A and 6B, the millimeter wave package antenna further includes a coplanar stripline conversion structure 10 connecting the antenna and the second coupling microstrip line 52; the coplanar stripline switching structure 10 is composed of two differential conductors. The coplanar stripline conversion structure 10 is disposed on a horizontal plane that does not intersect the plane of the second coupling microstrip line 52, and is perpendicular to the second coupling microstrip line 52. The output 521 of the second coupling microstrip line 52 is open-circuited and forms a matching stub across the gap of the two differential conductors of the coplanar strip line transition structure 10.
Meanwhile, the coplanar stripline switching structure output end forms a feed to the antenna 8 in fig. 5A and 5B by direct connection or coupling.
In this embodiment, the millimeter wave signal provided by the chip is first transmitted to the second coupling microstrip line 52 through the first coupling microstrip line and the coupling slot, and then is fed and transmitted to the antenna, specifically, the differential input terminal of the antenna through the coplanar stripline switching structure 10.
The antenna and the second coupling microstrip line are arranged on the same plane, the coplanar strip line conversion structure and the second metal layer are arranged on the same plane, and the coplanar strip line conversion structure is used as an antenna feeder line and can share the ground plane with the antenna radiation unit, so that the substrate level is reduced, and the cost is reduced.
The millimeter wave transmission antenna is a packaging antenna structure based on an organic substrate, and is beneficial to promoting the application of millimeter wave radars and sensors in the higher frequency band of 100-300GHz, such as the D band or higher frequency band possibly adopted by the 6G technology. The increase of the communication frequency is helpful for improving the radar resolution and increasing the data transmission bandwidth.
For convenience of explanation, only one chip is integrated in the millimeter wave transmission antenna provided by the application, and according to practical situations, a plurality of chips can be integrated to drive a plurality of antenna units to form array distribution, and each feed channel is respectively manufactured into a slotted coupling structure. The wiring levels are not limited to those shown in fig. 5A and 5B, and metal levels and vias may be added to improve the heat conductive properties of the substrate or to achieve a desired antenna structure.
In a third aspect, the present application provides a method for manufacturing a millimeter wave transmission structure, for manufacturing any one of the millimeter wave transmission structures provided in the present application, as shown in fig. 7, the method includes:
s1, a coupling groove is formed in an organic substrate; grooving means include, but are not limited to, mechanical milling, mechanical drilling, laser drilling, or plasma etching, among others.
S2, respectively manufacturing a first metal layer and a second metal layer on the first surface and the second surface of the organic substrate perpendicular to the coupling groove, and electroplating a third metal layer on the side wall of the coupling groove; in practical application, copper films can be manufactured on the first surface and the second surface of the organic substrate, and then the coupling groove is formed.
And S3, filling a dielectric material in the coupling groove, flattening the dielectric material by adopting a flattening process after the dielectric material is solidified, and patterning the first metal layer and the second metal layer by adopting a photoetching process. Wherein, the planarization can adopt physical grinding, chemical mechanical polishing, etching and other methods.
S4, respectively laminating a first laminated substrate and a second laminated substrate on the first metal layer and the second metal layer;
s5, arranging a first coupling microstrip line on the first laminated substrate and arranging a second coupling microstrip line on the second laminated substrate.
The millimeter wave transmission structure can be manufactured through the steps. The manufacturing method of the millimeter wave package antenna is to further integrate and manufacture the chip and the antenna on the basis of the manufacturing method of the millimeter wave transmission structure, and the millimeter wave package antenna shown in fig. 5A or 5B is obtained.
In summary, the millimeter wave transmission structure of the present application adopts slotted electroplating to realize vertical coupling of two-sided transmission lines, replaces common via connection, can be used for millimeter wave package antenna system integration, has the advantage of low transmission loss, and can be used for millimeter wave high frequency bands such as package antennas above 200GHz to form broadband interconnection, which cannot be realized by common vias. When a via structure is used, the loss increases with the length of the via, and the matching worsens with the length. The slot coupling can then employ a relatively thick substrate while maintaining low transmission loss and good bandwidth. The thick substrate has low process requirements, is easy to manufacture and has high yield. In the millimeter wave transmission antenna, the chip and the antenna (radiating unit) are respectively arranged on two sides of the ground plane, and are isolated through the ground plane in the substrate, so that a three-dimensional stacked structure is formed, the packaging size is reduced, the feeding distance from the chip to the antenna is reduced, the antenna area is increased, the antenna gain is improved, meanwhile, the antenna has the advantage of fewer layers of the substrate, and the manufacturing cost can be reduced.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present specification.
In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction. The foregoing is merely an example of an embodiment of the present disclosure and is not intended to limit the embodiment of the present disclosure. Various modifications and variations of the illustrative embodiments will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, or the like, which is within the spirit and principles of the embodiments of the present specification, should be included in the scope of the claims of the embodiments of the present specification.
Claims (9)
1. A millimeter wave transmission structure, characterized by comprising:
an organic substrate comprising:
a first surface having a first metal layer disposed thereon;
a second surface opposite to the first surface, on which a second metal layer is provided;
a coupling groove perpendicular to the first surface and penetrating through the organic substrate, wherein a third metal layer is electroplated on the side wall of the coupling groove and is filled with a dielectric material;
the first laminated substrate is arranged on the first metal layer, and a first coupling microstrip line is arranged on the surface of one side of the first laminated substrate, which is far away from the first metal layer;
the second laminated substrate is arranged on the second metal layer, and a second coupling microstrip line is arranged on the surface of one side of the second laminated substrate, which is far away from the second metal layer;
the first coupling microstrip line and the second coupling microstrip line are coupled through the coupling slot.
2. The millimeter wave transmission structure according to claim 1, wherein said coupling groove is U-shaped;
the first coupling microstrip line is a single microstrip line, one end of the first coupling microstrip line is a millimeter wave input end, and the other end of the first coupling microstrip line crosses the coupling groove to form a matching branch;
the second coupling microstrip line is T-shaped, wherein two ends in the direction perpendicular to the first coupling microstrip line are millimeter wave output ends, and one end in the direction parallel to the first coupling microstrip line forms a matching branch.
3. The millimeter wave transmission structure according to claim 1, wherein said coupling groove is H-shaped;
the first coupling microstrip line is a single microstrip line, one end of the first coupling microstrip line is a millimeter wave input end, and the other end of the first coupling microstrip line crosses the coupling groove in a fork-shaped structure to form a matching branch;
the second coupling microstrip line is a differential microstrip line, one end of each microstrip line in the differential microstrip line is a millimeter wave output end, and the other end of each microstrip line passes through the coupling groove to form a matching branch.
4. A millimeter wave package antenna, comprising: a chip, an antenna, and the millimeter wave transmission structure of claim 1;
the chip is connected with the millimeter wave input end of the first coupling microstrip line and is used for providing millimeter wave signals;
the millimeter wave transmission structure is used for transmitting millimeter wave signals provided by the chip from the first coupling microstrip line to the second coupling microstrip line;
the antenna is arranged on the second laminated substrate, connected with the second coupling microstrip line and used for receiving millimeter wave signals.
5. The millimeter-wave package antenna of claim 4, further comprising a coplanar stripline switching structure connecting the antenna and the second coupling microstrip line;
the output end of the second coupling microstrip line passes through the coplanar stripline conversion structure to form a matching branch;
the coplanar stripline transition structure forms a feed to the antenna.
6. The millimeter-wave package antenna of claim 5, wherein said coplanar stripline switching structure is disposed in a same plane as said second metal layer.
7. The millimeter wave package antenna according to any one of claims 4 to 6, wherein a fan-out wiring layer is provided on the first laminate substrate;
the chip is fixedly arranged in the first laminated substrate, and the chip is connected with the first coupling microstrip line through fan-out wiring of the fan-out wiring layer.
8. The millimeter wave package antenna according to any one of claims 4 to 6, wherein said chip is connected to said first coupling microstrip line by bumps.
9. A method of manufacturing the millimeter wave transmission structure as set forth in claim 1, comprising:
a coupling groove is formed in the organic substrate;
a first metal layer and a second metal layer are respectively arranged on the first surface and the second surface of the organic substrate perpendicular to the coupling groove, and a third metal layer is electroplated on the side wall of the coupling groove;
filling a dielectric material in the coupling groove, flattening the dielectric material by adopting a flattening process, and patterning the first metal layer and the second metal layer by adopting a photoetching process;
laminating a first laminate substrate and a second laminate substrate on the first metal layer and the second metal layer, respectively;
and arranging a first coupling microstrip line on the first laminated substrate and arranging a second coupling microstrip line on the second laminated substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211011677.6A CN117673692A (en) | 2022-08-23 | 2022-08-23 | Millimeter wave transmission structure, millimeter wave package antenna and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211011677.6A CN117673692A (en) | 2022-08-23 | 2022-08-23 | Millimeter wave transmission structure, millimeter wave package antenna and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN117673692A true CN117673692A (en) | 2024-03-08 |
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| CN202211011677.6A Pending CN117673692A (en) | 2022-08-23 | 2022-08-23 | Millimeter wave transmission structure, millimeter wave package antenna and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN117673692A (en) |
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