CN117664349A - High-speed circuit testing device of infrared detector - Google Patents
High-speed circuit testing device of infrared detector Download PDFInfo
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- CN117664349A CN117664349A CN202311463776.2A CN202311463776A CN117664349A CN 117664349 A CN117664349 A CN 117664349A CN 202311463776 A CN202311463776 A CN 202311463776A CN 117664349 A CN117664349 A CN 117664349A
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- infrared detector
- speed
- shell
- cavity
- speed signal
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- 238000012360 testing method Methods 0.000 title claims abstract description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims description 28
- 230000003287 optical effect Effects 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 abstract description 12
- 230000008054 signal transmission Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- MCMSPRNYOJJPIZ-UHFFFAOYSA-N cadmium;mercury;tellurium Chemical compound [Cd]=[Te]=[Hg] MCMSPRNYOJJPIZ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
The invention relates to the technical field of infrared detectors and provides an infrared detector high-speed circuit testing device which comprises a shell, wherein a vacuum cavity can be formed in the inner cavity of the shell, an infrared detector assembly is arranged in the vacuum cavity and is electrically connected with a high-speed signal cable, the high-speed signal cable is electrically connected with a high-speed connector, and a connecting port of the high-speed connector is embedded in the side wall of the shell; the vacuum cavity is internally provided with a cold cavity for refrigerating the infrared detector assembly by liquid nitrogen, and the cold cavity extends from the shell to the vacuum cavity. The invention adopts the high-speed signal cable and the high-speed connector, can ensure the lossless transmission of high-speed signals in the reading circuit, and has more stable and higher-speed signal transmission capability.
Description
Technical Field
The invention relates to the technical field of infrared detectors, in particular to a high-speed circuit testing device of an infrared detector.
Background
The infrared detector technology is widely applied to the fields of astronomical observation and the like by passive detection, high-precision detection and strong environmental adaptability. Along with the continuous development of the infrared detector readout circuit to the digitization and high-speed, the requirements of the testing device on high-speed signal transmission are increasingly increased.
Currently, the transmission rate of high-speed readout circuits has reached 640MHz, and possibly 1GHz in the future. In the high-speed signal transmission process, the problem of mutual interference among signals is increasingly remarkable, so that the output signal of a circuit becomes unstable, and the lossless transmission of the high-speed signal in a read-out circuit cannot be ensured.
Existing test devices have failed to meet the transmission requirements of such high speed signals. To address this problem, new test devices are being developed to provide more stable, higher speed signal transmission capabilities to ensure proper operation of the infrared detector readout circuitry.
Disclosure of Invention
In order to overcome the defects of the testing device, the technical problem to be solved by the invention is to provide the infrared detector high-speed circuit testing device with more stable and higher-speed signal transmission capability.
The invention provides an infrared detector high-speed circuit testing device for solving the technical problems, which comprises:
a housing, the housing cavity being capable of forming a vacuum chamber,
an infrared detector assembly is arranged in the vacuum cavity, the infrared detector assembly is electrically connected with a high-speed signal cable, the high-speed signal cable is electrically connected with a high-speed connector, and a connecting port of the high-speed connector is embedded in the side wall of the shell;
the vacuum cavity is internally provided with a cold cavity for refrigerating the infrared detector assembly by liquid nitrogen, and the cold cavity extends from the shell to the vacuum cavity.
Compared with the related art, the invention adopts the high-speed signal cable and the high-speed connector, can ensure the lossless transmission of the high-speed signal in the reading circuit, and has more stable and higher-speed signal transmission capability.
As an improvement of the infrared detector high-speed circuit testing device, the high-speed signal cables are provided with a plurality of wires,
each high-speed signal cable comprises two sub-transmission lines which are arranged in parallel, and shielding wires are wrapped on the outer sides of the two sub-transmission lines;
the two sub-transmission lines are used for transmitting a pair of differential signals, and the shielding lines are used for shielding signal interference caused by other high-speed signal cables.
Compared with the prior art, the invention adopts the high-speed signal cable, the capacitance of a pair of high-speed signal transmission paths is the same, the shielding wire blocks signal interference caused by other differential signals, the crosstalk of the high-speed differential signals during transmission is reduced, the electric fields are mutually coupled, the impedance between the differential signals is ensured to be consistent, and the lossless transmission of the high-speed signals in the reading circuit can be ensured.
As an improvement of the infrared detector high-speed circuit testing device, the impedance of the two sub-transmission lines of each high-speed signal cable is equal.
As an improvement of the infrared detector high-speed circuit testing device, the lengths of the two sub-transmission lines of each high-speed signal cable are equal, and the diameters of the two sub-transmission lines of each high-speed signal cable are equal.
As the improvement of infrared detector high-speed circuit testing arrangement, the infrared detector subassembly includes the infrared detector chip, infrared detector chip fixed connection is on ceramic frame, be equipped with differential signal line in the ceramic frame, differential signal line with infrared detector chip electricity is connected.
As an improvement of the infrared detector high-speed circuit testing device, the vacuum cavity is provided with an optical window opening, an optical window sheet in sealing connection with the shell is arranged in the optical window opening, and the optical window sheet is used for protecting and isolating the infrared detector chip.
As an improvement of the infrared detector high-speed circuit testing device, one end of the cold cavity, which is close to the infrared detector assembly, is fixedly connected with a cold table, and the ceramic frame is fixedly connected to the surface of the cold table.
As the improvement of infrared detector high-speed circuit testing arrangement, the material of cold platform is kovar material, cold platform surface is provided with the screw hole, ceramic frame pass through the screw with ceramic frame can dismantle the connection.
As the improvement of infrared detector high-speed circuit testing arrangement, the shell includes the first casing of lid column structure, first casing can be dismantled and be connected with tubular structure's second casing, the open end of second casing principle first casing can be dismantled and be connected with the third casing, third casing middle part is provided with the liquid nitrogen mouth, liquid nitrogen mouth edge extends to being close to the direction of first casing to the vacuum intracavity.
As an improvement of the infrared detector high-speed circuit testing device, an exhaust port is arranged on the side wall of the shell, and the exhaust port is connected with an exhaust pipe and a vacuum pump.
Drawings
FIG. 1 is a perspective view of an infrared detector high-speed circuit testing apparatus according to an embodiment of the present invention;
FIG. 2 is a block diagram of an infrared detector high-speed circuit testing apparatus according to an embodiment of the present invention;
fig. 3 is a cross-sectional structural view of a high-speed signal cable 800 according to an embodiment of the present invention;
reference numerals:
a first housing 101; a second housing 102; a third housing 103; an optical window 2; an exhaust pipe 3; a cold chamber 4; a cooling table 5; a ceramic frame 6; an infrared detector chip 7; a high-speed signal cable 800; a sub-transmission line 801; a shield line 802; a high-speed connector 9.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description of the present invention is given with reference to the accompanying drawings and preferred embodiments.
The infrared detector high-speed circuit testing device is equipment for testing an infrared detector, can cool the detector to liquid nitrogen temperature (-196 ℃/77K), and transmits an electrical signal to electrical measuring equipment through an electrical connector. Such devices are commonly used to cool scientific grade detectors such as infrared, temperature radiation, CCD, mercury cadmium telluride, and the like.
FIG. 1 is a perspective view of an infrared detector high-speed circuit testing device according to an embodiment of the present invention, as shown in FIG. 1, where the infrared detector high-speed circuit testing device according to the embodiment of the present invention includes a housing, and the housing is used to form a vacuum chamber, and vacuum is formed in the vacuum chamber, so that surface frosting of an infrared detector disposed in the vacuum chamber can be prevented when the infrared detector works in a 77k environment; the influence of outside vapor, particulate matters and the like on the detector is prevented, so that the cleanness and the normal operation of the detector are maintained. The housing comprises a first housing 101, a second housing 102 and a third housing 103 which are detachably connected.
The first casing 101 is configured into a cover-shaped structure, a concave cavity is concavely arranged in the middle of the first casing 101 towards a direction far away from the second casing 102, the concave cavity is used for accommodating the infrared detector assembly, an optical window opening is formed in the bottom of the concave cavity, an optical window sheet 2 in sealing connection with the first casing 101 is arranged in the optical window opening, and the optical window sheet 2 is used for protecting and isolating an internal detector.
The second casing 102 is configured as a cylindrical structure with two open ends, the two ends are respectively connected with the first casing 101 and the third casing 103 in a sealing way, an exhaust port is arranged on the side wall of the second casing 102, the exhaust port is connected with an exhaust pipe 3 and a vacuum pump, and a vacuum cavity is formed in the inner cavity of the casing through the vacuum pump.
The middle part of the third shell 103 is provided with a liquid nitrogen port for adding liquid nitrogen, the edge part of the liquid nitrogen port extends to the concave cavity in the direction close to the first shell 101 to form a cold cavity 4, and the liquid nitrogen is added into the cold cavity 4 through the liquid nitrogen port, so that the infrared detector is cooled, and the test is performed.
Referring to fig. 2, fig. 2 is a structural diagram of a high-speed circuit testing device of an infrared detector according to an embodiment of the present invention, as shown in the drawing, one end of a cold cavity 4, which is far away from a third housing 103, is fixedly connected with a cold stand 5, and the cold stand 5 is used for refrigerating an infrared detector chip 7; in order to ensure that the cold energy in the cold cavity 4 can be conducted to the surface of the cold table 5, the infrared detector core is effectively cooled, and the cold table 5 is welded with the cold cavity 4 by adopting kovar materials; specifically, the cold cavity 4 and the cold table 5 are connected by adopting a brazing process, so that the connection strength is ensured at a low temperature of 77K, and the situation of disconnection is prevented.
The middle part of the cooling table 5 is provided with a ceramic frame 6, the ceramic frame 6 can support the detector, has higher insulating property and mechanical strength, and is used as a connecting medium between the detector and an external circuit to transmit an electric signal generated by the detector to the external circuit for processing and analysis. Through gilding conduction band, the inside electronic component of detector connects, in the signal transmission outside circuit that produces the detector, also can transmit outside signal transmission to the detector inside simultaneously, controls the detector and reads data. By using a combination of ceramic frame 6 and gold plated conduction band, a stable, reliable electrical connection between the detector and external circuitry can be achieved, enabling the detector's data to be accurately read and processed.
Screw holes are machined in the surface of the cooling table 5, the ceramic frame 6 is detachably connected with the cooling table 5 through screws, the ceramic frame 6 is convenient to replace, and the process efficiency is improved. The cold table 5 of the kovar material is easier to process, and fracture or crack and other phenomena are not easy to occur in the processing process.
Specifically, differential signal lines are arranged in the ceramic frame 6, the infrared detector chip 7 is electrically connected with the ceramic frame, the differential pair signals in the ceramic frame 6 are designed to be equal in length and equal in distance, the differential pair signal lines counteract magnetic field interference of other high-speed signals, electric fields are mutually coupled, and the distance between the differential pair signals is equal to the line width of the wiring. And a group of ground wires are arranged on two sides of the differential signal wire, so that the magnetic field interference of other high-speed signals is reduced.
The ceramic frame 6 is electrically connected with a high-speed signal cable 800, the high-speed signal cable 800 is electrically connected with a high-speed connector 9, and a connection port of the high-speed connector 9 is embedded on the side wall of the second shell 102 and is connected in a sealing manner. Specifically, the high-speed connector 9 and the vacuum cavity adopt an adhesion process, so that the air tightness is ensured.
Referring to fig. 3, fig. 3 is a cross-sectional structure diagram of a high-speed signal cable according to an embodiment of the present invention, as shown in the drawing, each high-speed signal cable 800 includes two sub-transmission lines 801 arranged in parallel, and shielding lines are wrapped around the two sub-transmission lines 801. Specifically, the high-speed signal cable 800 is two pure copper cables of equal length and fixed at a certain distance, and the cable outer side is wrapped with a shielding wire 802. One end of the high-speed signal cable 800 is welded with the high-speed connector 9, the other end is welded with the ceramic frame 6, the high-speed transmission cable passes through two equidistant copper wires, the capacitance of a pair of high-speed signal transmission paths is the same, the shielding wires 802 on the outer side can block signal interference caused by other differential signals, the circuit signals are led out to the high-speed plug-in pads one by the high-speed cables, crosstalk of the high-speed differential signals during transmission is reduced, electric fields are mutually coupled, and the impedance between the differential signals is ensured to be consistent.
During welding, two pure copper cables at one end of the high-speed cable are welded with differential signal wire tube pins in the high-speed ceramic frame 6, the shielding wire 802 is connected with an electrical ground wire, the other end of the shielding wire is connected with the high-speed plug-in unit, the high-speed signal cable 800 is soldered to the position of a welding pin of the high-speed plug-in unit through tin soldering, and the welding solder reduces resistance and ensures the reliability of electrical connection while guaranteeing the welding strength by using lead-tin solder.
In the specific implementation process, after the ceramic frame 6, the high-speed signal cable 800 and the high-speed plug-in are electrically connected, the ceramic frame 6, the high-speed signal cable 800 and the high-speed plug-in are integrally installed in the vacuum cavity, the ceramic frame 6 and the cold table 5 are fixedly bonded with an adhesive, and the strength is ensured at a low temperature and meanwhile the high heat conductivity is ensured; after the first shell 101, the second shell 102 and the third shell 103 are sealed by screw rubber rings, the first shell is connected with an exhaust port by a vacuum pump, and the vacuum degree in the cavity is up to 10 -3 Pa, after reaching vacuum, pouring liquid nitrogen into the cold cavity 4, cooling the infrared detector, and testing.
The infrared detector high-speed circuit testing device provided by the embodiment of the invention adopts the high-speed transmission cable, the capacitance of a pair of high-speed signal transmission paths is the same through the two equidistant copper wires, the shielding wires 802 on the outer side can block signal interference caused by other differential signals, the circuit signals are led out to the high-speed plug-in pads one by the high-speed cables, the crosstalk of the high-speed differential signals during transmission is reduced, the mutual coupling of electric fields is realized, the impedance between the differential signals is ensured to be consistent, the lossless transmission of the high-speed signals in a reading circuit can be ensured, the problem that the conventional testing device cannot test the high-speed reading circuit is solved, and the device has more stable and higher-speed signal transmission capability.
In addition, the infrared detector high-speed circuit testing device provided by the embodiment of the invention adopts the threaded holes processed on the surface of the cooling table 5, so that the ceramic frame 6 is convenient to replace, and the process efficiency is improved. When the ceramic frame is needed to be replaced, the shell can be conveniently disassembled, and the ceramic frame 6 is replaced and then is in sealing connection with the shell assembly again, and a vacuum cavity is formed through the vacuum pump.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that these drawings are included in the spirit and scope of the invention, it is not to be limited thereto.
Claims (10)
1. An infrared detector high-speed circuit testing device, comprising:
a housing, the housing cavity being capable of forming a vacuum chamber,
an infrared detector assembly is arranged in the vacuum cavity, the infrared detector assembly is electrically connected with a high-speed signal cable, the high-speed signal cable is electrically connected with a high-speed connector, and a connecting port of the high-speed connector is embedded in the side wall of the shell;
the vacuum cavity is internally provided with a cold cavity for refrigerating the infrared detector assembly by liquid nitrogen, and the cold cavity extends from the shell to the vacuum cavity.
2. The infrared detector high-speed circuit testing apparatus according to claim 1, wherein,
the high-speed signal cable has a plurality of,
each high-speed signal cable comprises two sub-transmission lines which are arranged in parallel, and shielding wires are wrapped on the outer sides of the two sub-transmission lines;
the two sub-transmission lines are used for transmitting a pair of differential signals, and the shielding lines are used for shielding signal interference caused by other high-speed signal cables.
3. The infrared detector high-speed circuit testing apparatus according to claim 2, wherein the two sub-transmission lines of each of the high-speed signal cables have equal impedance.
4. The infrared detector high-speed circuit testing apparatus according to claim 2, wherein,
the lengths of the two sub-transmission lines of each high-speed signal cable are equal, and the diameters of the two sub-transmission lines of each high-speed signal cable are equal.
5. The infrared detector high-speed circuit testing apparatus according to claim 1, wherein,
the infrared detector assembly comprises an infrared detector chip which is fixedly connected to a ceramic frame, a differential signal wire is arranged in the ceramic frame, and the differential signal wire is electrically connected with the infrared detector chip.
6. The device for testing the high-speed circuit of the infrared detector according to claim 5, wherein the vacuum cavity is provided with an optical window opening, and an optical window sheet is arranged in the optical window opening and is in sealing connection with the shell, and the optical window sheet is used for protecting and isolating the infrared detector chip.
7. The infrared detector high-speed circuit testing apparatus of claim 5, wherein,
one end of the cold cavity, which is close to the infrared detector component, is fixedly connected with a cold table, and the ceramic frame is fixedly connected with the surface of the cold table.
8. The infrared detector high-speed circuit testing device according to claim 7, wherein the cold table is made of kovar material, threaded holes are formed in the surface of the cold table, and the ceramic frame is detachably connected with the ceramic frame through screws.
9. The infrared detector high-speed circuit testing device according to claim 1, wherein the housing comprises a first shell of a cover-shaped structure, the first shell is detachably connected with a second shell of a cylindrical structure, an opening end of the second shell is detachably connected with a third shell, a liquid nitrogen port is arranged in the middle of the third shell, and the edge of the liquid nitrogen port extends into the vacuum cavity in a direction approaching the first shell.
10. The device for testing the high-speed circuit of the infrared detector according to claim 9, wherein an exhaust port is arranged on the side wall of the shell, and the exhaust port is connected with an exhaust pipe and a vacuum pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311463776.2A CN117664349A (en) | 2023-11-06 | 2023-11-06 | High-speed circuit testing device of infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311463776.2A CN117664349A (en) | 2023-11-06 | 2023-11-06 | High-speed circuit testing device of infrared detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117664349A true CN117664349A (en) | 2024-03-08 |
Family
ID=90083495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311463776.2A Pending CN117664349A (en) | 2023-11-06 | 2023-11-06 | High-speed circuit testing device of infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117664349A (en) |
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2023
- 2023-11-06 CN CN202311463776.2A patent/CN117664349A/en active Pending
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