CN117660938A - Adjustment method of thermal resistance type heating wire device - Google Patents

Abstract

The invention discloses an adjusting method of a thermal resistance type heating wire device, which comprises the steps of dividing the temperature requirement of the thermal resistance type heating wire device, obtaining a height parameter reference and a heating wire three-region parameter reference, obtaining a height adjustment data set, and obtaining a height change thermal area diagram through calculation; acquiring a heating wire three-region adjustment data set, and calculating to obtain a heating wire three-region change thermal area diagram; and on the basis of the uniform temperature matching of the height adjusting structure and the three-region adjusting structure of the heating wire, determining respective threshold values of the matched height adjusting structure and the three-region adjusting structure of the heating wire and judging. According to the method, two adjustment objects of each adjustment structure are calculated respectively, discrete comparison is carried out according to respective calculation results, whether the adjustment structure has a large error or not is judged according to the discrete comparison results, and data adjusted by the adjustment structure are removed in advance, so that errors of subsequent calculation are reduced, and the accuracy of a final analysis result is guaranteed.

Description

Adjustment method of thermal resistance type heating wire device

Technical Field

The invention relates to the field of control of whole silicon carbide epitaxial films, in particular to an adjusting method of a thermal resistance type heating wire device.

Background

The existing silicon carbide epitaxial wafer equipment is an organic metal vapor deposition (MOCVD) technology using device, can be deposited in a vertical airflow mode and a horizontal airflow mode, and the heating temperature rise of the two deposition modes can be a thermal resistance heating wire (Heater).

When the epitaxial wafer substrate is deposited in a high-temperature furnace, silicon carbide deposition can be carried out on a high-temperature furnace cavity by a graphite carrying disc, and a certain interval exists between the graphite carrying disc and the heating wire (Heater) when the silicon carbide film is epitaxial, and the existing heating wire is of a fixed design and cannot be adjusted; and heating the heating wire, conducting heat conduction to the epitaxial wafer substrate through the graphite carrying disc, and forming the silicon carbide epitaxial film according to a deposition process. The uniformity of the film thickness of the silicon carbide epitaxial film is greatly affected by temperature, and when the temperature uniformity between the heating wire and the graphite carrier disc is better, the uniformity of the epitaxial film is better.

Therefore, the invention provides an adjusting method of a thermal resistance type heating wire device, which is used for adjusting the uniformity of the temperature during the growth of the silicon carbide epitaxial film and increasing the yield.

Disclosure of Invention

The invention aims to provide an adjusting method of a thermal resistance type heating wire device, which is characterized in that two adjusting objects of each adjusting structure are calculated respectively, discrete comparison is carried out according to respective calculation results, whether the adjusting structure has a larger error or not is judged according to the discrete comparison results, and data adjusted by the adjusting structure are removed in advance so as to reduce the error of subsequent calculation, thereby ensuring the accuracy of a final analysis result.

Embodiments of the present invention are implemented as follows:

in terms of height, the method for adjusting the thermal resistance type heating wire device comprises the following steps: dividing the temperature requirement of the thermal resistance type heating wire device to obtain a height parameter reference and a heating wire three-region parameter reference, wherein the height parameter reference is used for adjusting the height of a hole slot of the thermal resistance type heating wire device, and the heating wire three-region parameter reference is used for adjusting the three regions of the hole slot heating wire of the thermal resistance type heating wire device; acquiring all height adjustment structures in a height parameter reference, determining adjustment data of all the height adjustment structures to form a height adjustment data set, calculating a threshold value of each adjustment data in the height adjustment data set, and obtaining a height change thermal area diagram; acquiring all the three-region adjustment structures of the heating wire in the three-region parameter standard of the heating wire, determining adjustment data of all the three-region adjustment structures of the heating wire to form a three-region adjustment data set of the heating wire, calculating the threshold value of each adjustment data in the three-region adjustment data set of the heating wire, and obtaining a three-region change thermal area diagram of the heating wire; based on the temperature uniformity, the height adjusting structure and the three-region adjusting structure of the heating wire are matched, and the matched height adjusting structure and the three-region adjusting structure of the heating wire are used for determining respective threshold values and judging; and if the time node of the threshold value of the height adjusting structure in the height changing thermal area diagram is consistent with the time node of the threshold value of the three-area adjusting structure of the heating wire in the three-area changing thermal area diagram of the heating wire, taking the height adjusting structure and the three-area adjusting structure of the heating wire as the data compliance adjusting range.

In an alternative embodiment, calibrating a height adjustment structure serving as a data compliance point as a height target adjustment structure, establishing a height epitaxial film uniformity change curve based on all the height adjustment structures, determining a height association adjustment range of the height target adjustment structure based on the height epitaxial film uniformity change curve, carrying out similarity comparison on all the height association adjustment ranges and data adjusted by the height target adjustment structure, and judging whether the height target adjustment structure is used as the data compliance adjustment range according to the comparison result; and/or calibrating the three-region adjusting structure of the heating wire serving as a data compliance point as a three-region target adjusting structure of the heating wire, and establishing a three-region epitaxial film uniformity change curve of the heating wire based on all the three-region adjusting structures of the heating wire;

determining a three-region association adjusting range of the heating wire of the three-region target adjusting structure of the heating wire based on a three-region epitaxial film uniformity change curve of the heating wire; and carrying out similarity comparison on all the three-region related adjustment ranges of the heating wire and the data adjusted by the three-region target adjustment structure of the heating wire, and judging whether the three-region target adjustment structure of the heating wire is used as a data compliance adjustment range according to the comparison result.

In an alternative embodiment, the similarity comparison comprises the steps of: determining an acquisition means of the adjustment data, wherein the acquisition means includes chemical adjustment, physical adjustment, and biological adjustment; determining the specific gravity among the sub-items in the acquisition means, calculating the distance coefficient of the specific gravity of each sub-item in the corresponding association adjustment range acquisition means and the specific gravity of each sub-item in the corresponding target adjustment structure acquisition means, obtaining the concentrated trend of all the distance coefficients, and calculating the similarity comparison result between the corresponding association adjustment range and the corresponding target adjustment structure based on the concentrated trend.

In an alternative embodiment, the method further comprises the following steps before obtaining the central tendency of all the distance coefficients: arranging all the distance coefficients to obtain a height sequence; and giving a basic value to each sub item in the height sequence, giving a correction value on each basic value based on a corresponding epitaxial film uniformity change curve to obtain a plurality of correction results, determining a distance coefficient corresponding to the previous DS correction results in the plurality of correction results, and carrying out the subsequent steps, wherein DS is a positive integer.

In an optional embodiment, correction results corresponding to the abnormal distance coefficients are supplemented when determining the DS correction results, wherein the abnormal distance coefficients are obtained by fitting according to all the distance coefficients.

In an alternative embodiment, the method further comprises the following steps after determining the height-related adjustment range of the height target adjustment structure based on the height epitaxial film uniformity variation curve: obtaining relative hole and slot parameters between a height target adjusting structure and a height association adjusting range;

and eliminating the height-related adjustment range of which the relative hole and groove parameters exceed the height preset value.

In an alternative embodiment, the removing the height-related adjustment range having the relative hole and slot parameter exceeding the height preset value further includes the steps of: and determining the number of nodes between the eliminated height-associated adjustment range and the height target adjustment structure based on the height epitaxial film uniformity change curve, and supplementing the eliminated height-associated adjustment range as a basis for comparison with the height target adjustment structure if the number of nodes is greater than or equal to the preset value of the three areas of the heating wire.

In an alternative embodiment, the supplemented height-related adjustment range is assigned to a temperature distribution coefficient, which serves as a calculation basis for substituting the height-related adjustment range for similarity comparison.

In the aspect of three areas of the heating wire, a method for adjusting a thermal resistance type heating wire device comprises the following steps:

the height clustering assembly is used for dividing the temperature requirement of the thermal resistance type heating wire device to obtain a height parameter reference and a heating wire three-region parameter reference, wherein the height parameter reference is used for adjusting the height of a hole groove of the thermal resistance type heating wire device, and the heating wire three-region parameter reference is used for adjusting the three regions of the hole groove heating wire of the thermal resistance type heating wire device;

the height change thermodynamic region diagram acquisition component is used for acquiring all height adjustment structures in the height parameter reference, determining adjustment data of all the height adjustment structures, forming a height adjustment data set, calculating the threshold value of each adjustment data in the height adjustment data set and acquiring a height change thermodynamic region diagram;

the heating wire three-region change thermal area diagram is used for acquiring all heating wire three-region adjustment structures in a heating wire three-region parameter standard, determining adjustment data of all the heating wire three-region adjustment structures, forming a heating wire three-region adjustment data set, calculating the threshold value of each adjustment data in the heating wire three-region adjustment data set, and obtaining the heating wire three-region change thermal area diagram;

the height matching component is used for matching the height adjusting structure with the three-region adjusting structure of the heating wire based on the temperature uniformity, determining the respective threshold value of the matched height adjusting structure and the three-region adjusting structure of the heating wire and judging;

a height analysis component for determining: and if the time node of the threshold value of the height adjusting structure in the height changing thermal area diagram is consistent with the time node of the threshold value of the three-area adjusting structure of the heating wire in the three-area changing thermal area diagram of the heating wire, taking the height adjusting structure and the three-area adjusting structure of the heating wire as the data compliance adjusting range.

In an optional embodiment, the device further comprises a heating wire three-zone judging component, wherein the heating wire three-zone judging component is used for calibrating a height adjusting structure serving as a data compliance point into a height target adjusting structure, establishing a height epitaxial film uniformity change curve based on all the height adjusting structures, determining a height association adjusting range of the height target adjusting structure based on the height epitaxial film uniformity change curve, carrying out similarity comparison on all the height association adjusting ranges and data adjusted by the height target adjusting structure, and judging whether the height target adjusting structure is used as the data compliance adjusting range according to the comparison result; and/or calibrating a three-region adjusting structure of the heating wire serving as a data compliance point as a three-region target adjusting structure of the heating wire, and establishing a three-region epitaxial film uniformity change curve of the heating wire based on all the three-region adjusting structures of the heating wire; determining a three-region association adjusting range of the heating wire of the three-region target adjusting structure of the heating wire based on the three-region epitaxial film uniformity change curve of the heating wire; and carrying out similarity comparison on all the three-region association adjustment ranges of the heating wires and the data adjusted by the three-region target adjustment structure of the heating wires, and judging whether the three-region target adjustment structure of the heating wires is used as a data compliance adjustment range according to the comparison result.

The embodiment of the invention has the beneficial effects that:

according to the adjustment method of the thermal resistance type heating wire device, the adjustment structures corresponding to various types of adjustment data of the thermal resistance type heating wire device are divided, for example, main hole groove height and three-region data of the hole groove heating wire are formed, a height parameter standard and a three-region parameter standard of the heating wire are respectively subjected to longitudinal comparison analysis relative to each type of adjustment data, the height adjustment structures corresponding to the matching region positions and the three-region adjustment structures of the heating wire are finally matched in a longitudinal comparison mode, whether the abnormal degrees of the two are consistent or tend to be consistent is determined to judge whether the adjustment structure data adjustment function is normal, the accuracy of a final calculation result is guaranteed, the uniformity of temperature during growth of a silicon carbide epitaxial film is guaranteed, and the product yield is increased.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a flow chart of the method of the present invention.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

As shown in fig. 1, the adjustment method of the thermal resistance type heating wire device provided in this embodiment includes the following steps:

x1: dividing the temperature requirement of the thermal resistance type heating wire device to obtain a height parameter reference and a heating wire three-region parameter reference, wherein the height parameter reference is used for adjusting the height of a hole slot of the thermal resistance type heating wire device, and the heating wire three-region parameter reference is used for adjusting the three regions of the hole slot heating wire of the thermal resistance type heating wire device; the step represents determining a thermal resistance type heating wire device, wherein the thermal resistance type heating wire device is mainly provided with two adjusting functions of a three-region hole-slot heating wire and a three-region hole-slot height, the two adjusting functions are realized by a plurality of adjusting structures arranged in the thermal resistance type heating wire device, and each adjusting structure can synchronously adjust the three-region hole-slot heating wire and the three-region hole-slot height at corresponding points. Considering that the probability that the three-region adjustment of the hole slot heating wire and the hole slot height adjustment are normal or abnormal is larger at the same adjustment structure, the probability that only one of the three-region adjustment and the hole slot height adjustment is abnormal is smaller, so that adjustment data of two functions corresponding to each adjustment structure are independently extracted for longitudinal comparison, and whether the adjustment structure has abnormal adjustment possibility can be further judged. The temperature requirement of the thermal resistance type heating wire device is divided into a height parameter reference and a heating wire three-region parameter reference so as to facilitate the subsequent longitudinal comparison.

X2: and acquiring all height adjustment structures in the height parameter standard, determining adjustment data of all the height adjustment structures to form a height adjustment data set, calculating the threshold value of each adjustment data in the height adjustment data set, and obtaining a height change thermal area diagram. This step represents the use of the threshold value of the adjustment data to achieve the above-mentioned longitudinal contrast, and since it is not clear in this step whether there is a possibility of abnormal adjustment of the adjustment structure, it is necessary to present and analyze the adjustment data of all height adjustment structures. Likewise, the same treatment measures are taken for the three-zone adjustment structure of the heating wire, namely, step X3 is performed: acquiring all the three-region adjustment structures of the heating wire in the three-region parameter reference of the heating wire, determining adjustment data of all the three-region adjustment structures of the heating wire to form a three-region adjustment data set of the heating wire, calculating the threshold value of each adjustment data in the three-region adjustment data set of the heating wire, and obtaining a three-region change thermal area diagram of the heating wire; and presenting and analyzing the adjustment data of all the three-region adjustment structures of the heating wires.

In the step X2 and the step X3, through the presentation of the height-changing thermal area diagram and the three-area-changing thermal area diagram of the heating wire, the comparison condition of the data of the two functions of the same adjusting structure and the data of the two functions of the rest adjusting structures can be found, if the two function adjusting data of the same adjusting structure are identical in the change folding line, the adjusting data of the two functions are accurate or correct in the view angle of the adjusting structure, and the step X4 can be performed: based on the temperature uniformity, the height adjusting structure and the heating wire three-region adjusting structure are matched, and the matched height adjusting structure and the heating wire three-region adjusting structure are used for determining respective threshold values and judging; the uniformity of temperature here mainly refers to the situation that belongs to the same configuration branch pipe main body, because in practice, the three-zone adjustment of the hole and slot height and the hole and slot heating wire may be performed in different adjustment ranges, but the different adjustment ranges all belong to the same main body supervision and are responsible, and the corresponding separated height adjustment structure and the three-zone adjustment structure of the heating wire need to be combined to perform the above-mentioned longitudinal comparison, especially according to the self threshold value and to perform the judgment.

X5: when the time node of the threshold value of the height adjusting structure in the height change thermal area diagram is consistent with the time node of the threshold value of the heating wire three-area adjusting structure in the heating wire three-area change thermal area diagram, the height adjusting structure and the heating wire three-area adjusting structure are used as data compliance adjusting ranges; if the height adjusting structure and the heating wire three-area adjusting structure are matched to be the same adjusting range, the changing folding lines in the respective changing thermal area diagrams are consistent or approximately consistent, the point positions which are primarily judged to be possible to belong to normal and accurate adjusting data can be determined, the point positions which are far away from the respective changing folding lines can be judged to be abnormal adjusting range positions, and the uploaded data are removed, so that the aim of further reducing data errors is achieved.

Through the technical scheme, only the adjustment data with the temperature requirement abnormal possible adjustment range position is removed from the angle of primary screening, and the reserved adjustment range position can be abnormally adjusted, but compared with the mode of applying the adjustment data with all the adjustment range positions in a mean value, the error is smaller, and the data acquisition is more reliable. In some embodiments, the reserved adjustment range bit is further analyzed to further determine whether the adjustment range bit is abnormal. The analysis method provided by the embodiment further includes the step of finding the association adjustment range by establishing the topological graph structure to perform similarity comparison so as to realize further screening of the height adjustment structure and the three-region adjustment structure of the heating wire, and specifically: calibrating a height adjusting structure serving as a data compliance point as a height target adjusting structure, establishing a height epitaxial film uniformity change curve based on all the height adjusting structures, determining a height association adjusting range of the height target adjusting structure based on the height epitaxial film uniformity change curve, carrying out similarity comparison on all the height association adjusting ranges and data adjusted by the height target adjusting structure, and judging whether the height target adjusting structure is used as the data compliance adjusting range according to the comparison result; and/or calibrating a three-region adjusting structure of the heating wire serving as a data compliance point as a three-region target adjusting structure of the heating wire, and establishing a three-region epitaxial film uniformity change curve of the heating wire based on all the three-region adjusting structures of the heating wire; determining a three-region association adjusting range of the heating wire of the three-region target adjusting structure of the heating wire based on the three-region epitaxial film uniformity change curve of the heating wire; and carrying out similarity comparison on all the three-region association adjustment ranges of the heating wires and the data adjusted by the three-region target adjustment structure of the heating wires, and judging whether the three-region target adjustment structure of the heating wires is used as a data compliance adjustment range according to the comparison result.

The corresponding adjustment structure which can be used as the data compliance point and obtained through the step X5 may have the condition that two adjustment functions are normal or abnormal at the same time, and a further longitudinal comparison mode is adopted for further screening. Taking a height adjusting structure as a data compliance point as an example, calibrating the height adjusting structure as a height target adjusting structure, establishing a topological relation between the height target adjusting structure and other height adjusting structures to obtain a height epitaxial film uniformity change curve, finding the other height adjusting structures directly related to the height target adjusting structure based on the height epitaxial film uniformity change curve and taking the other height adjusting structures as a height association adjusting range, carrying out similarity comparison on hole and slot height data of one or more height association adjusting ranges and hole and slot height data of the height target adjusting structure, carrying out data comparison by utilizing two adjusting range positions which are directly related, namely directly communicated in an actual underground environment, and further screening whether the data adjustment of the height target adjusting structure is normal or not according to the principle that the connectivity principle Kong Caogao data is kept consistent in theory. The three-region target adjustment structure of the heating wire is treated in the same way, and is not described in detail herein.

By performing the data longitudinal comparison of the height target adjusting structure or the three-area target adjusting structure of the heating wire independently or simultaneously, whether the height target adjusting structure or the three-area target adjusting structure of the heating wire is abnormal or not can be further screened, so that whether the height target adjusting structure or the three-area target adjusting structure of the heating wire can be used as a data compliance adjusting range or not is judged, for example, if the similarity of the data of one height target adjusting structure and a plurality of height associated adjusting ranges is found to be lower, the adjusting data of the height target adjusting structure is eliminated, and further reliability of the data source analyzed later is ensured.

In this embodiment, the similarity comparison is mainly performed by performing differential analysis by using smaller or finer indexes, and the similarity comparison includes the following steps:

determining an acquisition means of adjustment data; this step represents a manner of determining the corresponding association adjustment range (height association adjustment range or heating wire three-zone association adjustment range) and the corresponding target adjustment structure (height target adjustment structure or heating wire three-zone target adjustment structure) adjustment data.

Determining the specific gravity among the sub-items in the acquisition means, and calculating the distance coefficient of the specific gravity of the sub-items in the corresponding association adjustment range acquisition means and the specific gravity of the sub-items in the corresponding target adjustment structure acquisition means; the step represents that the adjustment data sub-items between the corresponding association adjustment range and the corresponding target adjustment structure are utilized for comparison, and the index comparison condition of specific similarity adjustment is further found, wherein the principle of expressing the similarity in the form of the separation distance between the corresponding data is utilized, so that the judgment result of whether the corresponding target adjustment structure has abnormal adjustment or not is further obtained.

And obtaining the concentrated trend of all the distance coefficients, and calculating the similarity comparison result between the corresponding association adjustment range and the corresponding target adjustment structure based on the concentrated trend. The step of observing and analyzing all distance coefficients, selecting the number by using the concentration degree condition, and judging the similarity based on the selected number of the concentration degree, wherein for example, if the distance coefficient represented by the number is larger than 0.05, the similarity is not high, otherwise, the similarity degree is acceptable, so that the corresponding target adjustment structure is used as a data compliance point.

On the basis of the technical proposal, the method also comprises the following steps before the concentrated trend of all the distance coefficients is obtained

Arranging all the distance coefficients to obtain a height sequence; and giving a basic value to each sub item in the height sequence, and giving a correction value on each basic value based on a corresponding epitaxial film uniformity change curve, namely, comprehensively assigning values to the distance between nodes of the epitaxial film uniformity change curve to obtain a plurality of correction results, determining the distance coefficient corresponding to the previous DS correction results in the correction results, and carrying out the subsequent steps, wherein DS is a positive integer. The step shows that when the distance coefficient concentration is calculated, the number of nodes between the corresponding associated adjustment range and the target adjustment structure needs to be considered, the number of the nodes is obtained through the corresponding epitaxial film uniformity change curve, if the number of the nodes is larger, the correction value difference is combined on the basic value, and therefore the obtained correction result is closer to the actual situation. The relation between the correction value and the basic value can be obtained through a theoretical model formed based on historical data, or can be endowed through experience, but when the distance coefficient is larger in the finally obtained correction result, the correction result is used as an abnormal point to be removed, so that the calculation accuracy of the concentration degree is higher. That is, the DS value is mainly determined by the abnormal condition of the distance coefficient, and the distance coefficient having a variance larger than a predetermined value may be removed.

On the basis of the above scheme, the situation that true and correct distance coefficients possibly exist in the eliminated abnormal distance coefficients needs to be fed into a concentration measuring and calculating process to obtain a more objective and reasonable foundation for constructing data comparison, namely, correction results corresponding to the supplemented abnormal distance coefficients are obtained by fitting all the distance coefficients when the DS correction results are determined, the numerical value of the distance coefficients is used as an abscissa and the distance positions of corresponding nodes are used as an ordinate to be fitted in a mode of fitting all the distance coefficients, the abnormal distance coefficients are found, if the value of the abnormal distance coefficients is larger, but the distance between the coordinates of the nodes and corresponding target adjusting structures is close, and the node positions can be used as supplementing objects by determining the node positions through a fitting curve.

In the actual similarity comparison calculation, the situation that the adjacent nodes have different basic environments exists, particularly the hole and slot height data and Kong Caogao data cannot calculate the similarity of adjustment data through a connectivity principle exists. In this case, the method further includes the following steps after determining the height-related adjustment range of the height target adjustment structure based on the height epitaxial film uniformity variation curve: obtaining relative hole and slot parameters between a height target adjusting structure and a height association adjusting range; and eliminating the height-related adjustment range of which the relative hole and groove parameters exceed the height preset value. The step represents that the height-related adjustment range with relatively larger height adjustment between the height-related adjustment range and the height target adjustment structure is removed, the height-related adjustment range is not used as a basis for subsequent similarity comparison, the compliance of data analysis is ensured, the height preset value is predetermined, and the value can be sufficiently small under the condition of ensuring the calculation accuracy.

On the basis of the technical scheme, the situation that samples of the height association adjustment range are too few is considered once all the height association adjustment ranges exceed the height preset value, so that more reasonable data similarity comparison results are not easy to comprehensively obtain.

Namely, the height-related adjustment range which possibly causes larger adjustment data errors due to height adjustment is eliminated, and the rest is supplemented. Then, eliminating the height-related adjustment range in which the relative hole and slot parameters exceed the height preset value further comprises the following steps: and determining the number of nodes between the eliminated height-associated adjustment range and the height target adjustment structure based on the height epitaxial film uniformity change curve, and supplementing the eliminated height-associated adjustment range as a basis for comparison with the height target adjustment structure if the number of nodes is smaller than or equal to the preset value of the three areas of the heating wire.

The step shows that the node is far, but the height-related adjustment range with reasonable height adjustment is supplemented, and the height-related adjustment range with relatively close node but serious height adjustment is kept removed. The preset value of the three areas of the heating wire is also predetermined, and the preset value can be large enough under the condition of ensuring that the calculation accords with the limit. On the basis of the scheme, in order to further obtain a more accurate data calculation basis, the supplemented height-associated adjustment range is endowed with a temperature distribution coefficient, and the temperature distribution coefficient is used as a calculation basis for substituting the height-associated adjustment range to carry out similarity comparison. That is, a reasonable height adjustment (for example, a relative height adjustment caused by a difference between terrains) is represented, and a temperature distribution coefficient is converted and substituted as a weight and added to a distance coefficient so as to provide a more reliable and reasonable data calculation basis when a similarity comparison calculation is performed.

The embodiment also provides a method for adjusting the thermal resistance type heating wire device, which is mainly used for dividing functional components of the method for adjusting the thermal resistance type heating wire device according to the embodiment of the method. For example, each functional component may be divided, or two or more functions may be integrated in one processing component. The above-described integrated components may be implemented in hardware or in software functional components. It should be noted that, the division of the components in the present invention is illustrative, only one logic function division, and there may be another division manner in actual implementation. For example, in the case of dividing each functional component by adopting a corresponding function, the adjusting method of the thermal resistance type heating wire device may include a height clustering component, a height change thermal area diagram obtaining component, a heating wire three-area change thermal area diagram, a height matching component and a height analyzing component. The functions of the respective unit components are explained below.

The height clustering assembly is used for dividing the temperature requirement of the thermal resistance type heating wire device to obtain a height parameter reference and a heating wire three-region parameter reference, wherein the height parameter reference is used for adjusting the height of a hole groove of the thermal resistance type heating wire device, and the heating wire three-region parameter reference is used for adjusting the three regions of the hole groove heating wire of the thermal resistance type heating wire device; the height change thermodynamic region diagram acquisition component is used for acquiring all height adjustment structures in the height parameter reference, determining adjustment data of all the height adjustment structures, forming a height adjustment data set, calculating the threshold value of each adjustment data in the height adjustment data set and acquiring a height change thermodynamic region diagram; the heating wire three-region change thermal area diagram is used for acquiring all heating wire three-region adjustment structures in the heating wire three-region parameter standard, determining adjustment data of all the heating wire three-region adjustment structures, forming a heating wire three-region adjustment data set, calculating the threshold value of each adjustment data in the heating wire three-region adjustment data set, and obtaining the heating wire three-region change thermal area diagram; the height matching component is used for matching the height adjusting structure with the three-region adjusting structure of the heating wire based on the temperature uniformity, determining respective threshold values of the matched height adjusting structure and the three-region adjusting structure of the heating wire and judging; and the height analysis component is used for taking the height adjusting structure and the three-region adjusting structure of the heating wire as the data compliance adjusting range when the time node of the threshold value of the height adjusting structure in the height change thermal region diagram is consistent with the time node of the threshold value of the three-region adjusting structure of the heating wire in the three-region change thermal region diagram of the heating wire.

In some embodiments, the adjusting method of the thermal resistance type heating wire device further includes a heating wire three-zone judging component, which is used for calibrating a height adjusting structure serving as a data compliance point to be a height target adjusting structure, establishing a height epitaxial film uniformity change curve based on all the height adjusting structures, determining a height associated adjusting range of the height target adjusting structure based on the height epitaxial film uniformity change curve, performing similarity comparison on all the height associated adjusting ranges and data adjusted by the height target adjusting structure, and judging whether the height target adjusting structure is used as the data compliance adjusting range according to the comparison result; and/or calibrating a three-region adjusting structure of the heating wire serving as a data compliance point as a three-region target adjusting structure of the heating wire, and establishing a three-region epitaxial film uniformity change curve of the heating wire based on all the three-region adjusting structures of the heating wire; determining a three-region association adjusting range of the heating wire of the three-region target adjusting structure of the heating wire based on the three-region epitaxial film uniformity change curve of the heating wire; and carrying out similarity comparison on all the three-region association adjustment ranges of the heating wires and the data adjusted by the three-region target adjustment structure of the heating wires, and judging whether the three-region target adjustment structure of the heating wires is used as a data compliance adjustment range according to the comparison result.

In some embodiments, the heating wire three-zone determination component is further configured to determine an acquisition means of adjustment data, wherein the acquisition means includes chemical adjustment, physical adjustment, and biological adjustment; determining the specific gravity among the sub-items in the acquisition means, and calculating the distance coefficient of the specific gravity of the sub-items in the corresponding association adjustment range acquisition means and the specific gravity of the sub-items in the corresponding target adjustment structure acquisition means; arranging all the distance coefficients to obtain a height sequence; giving basic values to each sub item in the height sequence, giving correction values on each basic value based on a corresponding epitaxial film uniformity change curve to obtain a plurality of correction results, and determining distance coefficients corresponding to the first DS correction results in the plurality of correction results to carry out subsequent steps; and obtaining the concentrated trend of all the distance coefficients, and calculating the similarity comparison result between the corresponding association adjustment range and the corresponding target adjustment structure based on the concentrated trend. Obtaining relative hole and slot parameters between the height target adjusting structure and the height association adjusting range; and eliminating the height-related adjustment range of which the relative hole and groove parameters exceed the height preset value.

It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to encompass such modifications and variations.

Claims (7)

1. The method for adjusting the heat resistance type heating wire device is characterized by comprising the following steps of:

dividing the temperature requirement of the thermal resistance type heating wire device to obtain a height parameter reference and a heating wire three-region parameter reference, wherein the height parameter reference is used for adjusting the height of a hole slot of the thermal resistance type heating wire device, and the heating wire three-region parameter reference is used for adjusting the three regions of the hole slot heating wire of the thermal resistance type heating wire device;

acquiring all height adjustment structures in the height parameter reference, determining adjustment data of all the height adjustment structures to form a height adjustment data set, calculating a threshold value of each adjustment data in the height adjustment data set, and obtaining a height change thermal area diagram;

acquiring all the three-region adjustment structures of the heating wire in the three-region parameter reference of the heating wire, determining adjustment data of all the three-region adjustment structures of the heating wire to form a three-region adjustment data set of the heating wire, calculating the threshold value of each adjustment data in the three-region adjustment data set of the heating wire, and obtaining a three-region change thermal area diagram of the heating wire;

based on the temperature uniformity, the height adjusting structure and the heating wire three-region adjusting structure are matched, and the matched height adjusting structure and the heating wire three-region adjusting structure are used for determining respective threshold values and judging;

and when the time node of the threshold value of the height adjusting structure in the height change thermal area diagram is consistent with the time node of the threshold value of the heating wire three-area adjusting structure in the heating wire three-area change thermal area diagram, taking the height adjusting structure and the heating wire three-area adjusting structure as a data compliance adjusting range.

2. A method for adjusting a heat resistance type heating wire device according to claim 1, wherein,

calibrating a height adjusting structure serving as a data compliance point as a height target adjusting structure, establishing a height epitaxial film uniformity change curve based on all the height adjusting structures, determining a height association adjusting range of the height target adjusting structure based on the height epitaxial film uniformity change curve, carrying out similarity comparison on all the height association adjusting ranges and data adjusted by the height target adjusting structure, and judging whether the height target adjusting structure is used as the data compliance adjusting range according to the comparison result;

calibrating a three-region heating wire adjusting structure serving as a data compliance point as a three-region heating wire target adjusting structure, and establishing a three-region heating wire epitaxial film uniformity change curve based on all the three-region heating wire adjusting structures; determining a three-region association adjusting range of the heating wire of the three-region target adjusting structure of the heating wire based on the three-region epitaxial film uniformity change curve of the heating wire; and carrying out similarity comparison on all the three-region association adjustment ranges of the heating wires and the data adjusted by the three-region target adjustment structure of the heating wires, and judging whether the three-region target adjustment structure of the heating wires is used as a data compliance adjustment range according to the comparison result.

3. The method of adjusting a resistive heating wire apparatus of claim 2, further comprising the steps of, after determining the height-associated adjustment range of the height target adjustment structure based on the height epitaxial film uniformity profile:

obtaining relative hole and slot parameters between the height target adjusting structure and the height association adjusting range; and eliminating the height-related adjustment range of which the relative hole and groove parameters exceed the height preset value.

4. A method of adjusting a heat resistance type heater wire apparatus as set forth in claim 3, wherein said removing the height-related adjustment range in which the relative hole and slot parameters exceed the height preset value further comprises the steps of: and determining the number of nodes between the eliminated height-associated adjustment range and the height target adjustment structure based on the height epitaxial film uniformity change curve, and supplementing the eliminated height-associated adjustment range as a basis for comparison with the height target adjustment structure if the number of nodes is greater than or equal to a preset value of three areas of the heating wire.

5. The method of adjusting a heat resistance type heating wire device according to claim 4, wherein the fed-in height-related adjustment range is given a temperature distribution coefficient as a calculation basis for similarity comparison by substituting the height-related adjustment range.

6. A method of adjusting a heat resistance type heating wire apparatus according to any one of claims 1 to 5, comprising:

the height clustering assembly is used for dividing the temperature requirement of the thermal resistance type heating wire device to obtain a height parameter reference and a heating wire three-region parameter reference, wherein the height parameter reference is used for adjusting the height of a hole groove of the thermal resistance type heating wire device, and the heating wire three-region parameter reference is used for adjusting the three regions of the hole groove heating wire of the thermal resistance type heating wire device;

the height change thermodynamic region diagram acquisition component is used for acquiring all height adjustment structures in the height parameter reference, determining adjustment data of all the height adjustment structures, forming a height adjustment data set, calculating the threshold value of each adjustment data in the height adjustment data set and acquiring a height change thermodynamic region diagram;

the heating wire three-region change thermal area diagram is used for acquiring all heating wire three-region adjustment structures in the heating wire three-region parameter standard, determining adjustment data of all the heating wire three-region adjustment structures, forming a heating wire three-region adjustment data set, calculating the threshold value of each adjustment data in the heating wire three-region adjustment data set, and obtaining the heating wire three-region change thermal area diagram;

the height matching component is used for matching the height adjusting structure with the three-region adjusting structure of the heating wire based on the temperature uniformity, determining respective threshold values of the matched height adjusting structure and the three-region adjusting structure of the heating wire and judging;

a height analysis component for determining: and when the time node of the threshold value of the height adjusting structure in the height change thermal area diagram is consistent with the time node of the threshold value of the heating wire three-area adjusting structure in the heating wire three-area change thermal area diagram, taking the height adjusting structure and the heating wire three-area adjusting structure as a data compliance adjusting range.

7. The method of claim 6, further comprising a three-zone heater wire determining assembly for:

calibrating a height adjusting structure serving as a data compliance point as a height target adjusting structure, establishing a height epitaxial film uniformity change curve based on all the height adjusting structures, determining a height association adjusting range of the height target adjusting structure based on the height epitaxial film uniformity change curve, carrying out similarity comparison on all the height association adjusting ranges and data adjusted by the height target adjusting structure, and judging whether the height target adjusting structure is used as the data compliance adjusting range according to the comparison result;

calibrating a three-region heating wire adjusting structure serving as a data compliance point as a three-region heating wire target adjusting structure, and establishing a three-region heating wire epitaxial film uniformity change curve based on all the three-region heating wire adjusting structures; determining a three-region association adjusting range of the heating wire of the three-region target adjusting structure of the heating wire based on the three-region epitaxial film uniformity change curve of the heating wire; and carrying out similarity comparison on all the three-region association adjustment ranges of the heating wires and the data adjusted by the three-region target adjustment structure of the heating wires, and judging whether the three-region target adjustment structure of the heating wires is used as a data compliance adjustment range according to the comparison result.