CN117659891A - Electromagnetic shielding splicing adhesive tape and production method thereof - Google Patents
Electromagnetic shielding splicing adhesive tape and production method thereof Download PDFInfo
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- CN117659891A CN117659891A CN202311690824.1A CN202311690824A CN117659891A CN 117659891 A CN117659891 A CN 117659891A CN 202311690824 A CN202311690824 A CN 202311690824A CN 117659891 A CN117659891 A CN 117659891A
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- adhesive
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- melt pressure
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- copper foil
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 claims abstract description 49
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 42
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000011889 copper foil Substances 0.000 claims abstract description 32
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 30
- 239000012943 hotmelt Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 27
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 14
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 10
- 239000003431 cross linking reagent Substances 0.000 claims description 10
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 10
- 239000003999 initiator Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 6
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 6
- 239000004831 Hot glue Substances 0.000 claims description 4
- 238000013329 compounding Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000007888 film coating Substances 0.000 claims description 3
- 238000009501 film coating Methods 0.000 claims description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims 1
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims 1
- 230000004075 alteration Effects 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 230000037303 wrinkles Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 10
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 6
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 239000004342 Benzoyl peroxide Substances 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical group C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- DEQJNIVTRAWAMD-UHFFFAOYSA-N 1,1,2,4,4,4-hexafluorobutyl prop-2-enoate Chemical compound FC(F)(F)CC(F)C(F)(F)OC(=O)C=C DEQJNIVTRAWAMD-UHFFFAOYSA-N 0.000 description 2
- ZNJXRXXJPIFFAO-UHFFFAOYSA-N 2,2,3,3,4,4,5,5-octafluoropentyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)C(F)(F)C(F)(F)C(F)F ZNJXRXXJPIFFAO-UHFFFAOYSA-N 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
Abstract
The invention discloses an electromagnetic shielding splicing adhesive tape and a production method thereof, which belong to the technical field of splicing adhesive tapes, and the splicing adhesive tape comprises a PET (polyethylene terephthalate) substrate, a hot-melt pressure-sensitive adhesive, a conductive copper foil, a conductive adhesive and a release film layer arranged below the PET substrate which are sequentially overlapped, wherein the splicing adhesive tape is ultrathin and soft as a whole, good in conductivity, high in shielding efficiency, free from burrs, easy to process and excellent in appearance; the adhesive has the advantages of neat appearance, no wrinkles, scratches, chromatic aberration, concave-convex points, good adhesive strength and good adhesion, is coated with conductive adhesive and hot-melt pressure-sensitive adhesive, and can be applied to parts needing electromagnetic shielding, such as notebook computers, LCD displays, copiers and the like. And eliminating electromagnetic interference (EMI), isolating the harm of electromagnetic wave to human body, and applying to manufacture of computer peripheral wires, computer displays and transformers.
Description
Technical Field
The invention belongs to the technical field of splicing tapes, and particularly relates to an electromagnetic shielding splicing tape and a production method thereof.
Background
Electronic product manufacturers are continuously pursuing faster operation speed, higher resolution and more functions of products, and meanwhile, products are required to be lighter and thinner, especially designs of handheld portable products, such as smart phones, tablet computers and the like. This has led to many high-speed components being assembled on smaller circuit boards, and the problem of electromagnetic interference in more and more confined spaces. Electromagnetic radiation interference on electronic products is mostly electromagnetic interference of hundreds of megahertz or even more than gigahertz, and good conductors can be used for shielding an electric field and a magnetic field. CN202210321318.4 discloses an electromagnetic shielding tape, which comprises a PET film layer, an electromagnetic shielding layer and a release film layer which are sequentially arranged from bottom to top, but is not easy to process and difficult to release. As a person skilled in the art, development of a novel electromagnetic shielding splicing tape and a production method thereof is needed.
Disclosure of Invention
The invention aims at solving the existing problems and provides an electromagnetic shielding splicing adhesive tape and a production method thereof.
The invention is realized by the following technical scheme:
an electromagnetic shielding splicing adhesive tape comprises a PET (polyethylene terephthalate) base material, a hot-melt pressure-sensitive adhesive, a conductive copper foil, a conductive adhesive and a release film layer arranged below the PET base material in a sequential overlapping manner; the production method of the electromagnetic shielding release film adhesive tape comprises the following steps: the method comprises the steps of firstly, melting and coating a hot-melt pressure-sensitive adhesive on a conductive copper foil to adhere to form a coated single-sided conductive copper foil; secondly, coating conductive adhesive on the other surface of the coated single-sided conductive copper foil to obtain double-sided adhesive conductive copper foil; thirdly, coating a release film layer below the PET substrate, then uniformly coating the adhesive on the PET substrate by extruding the hot-melt pressure-sensitive adhesive prepared in the adhesive storage tank and flowing out through a die head of equipment; fourthly, compound rewinding and slitting: and compounding one side of the PET substrate coated with the hot-melt pressure-sensitive adhesive surface of the double-sided adhesive conductive copper foil, rewinding into small rolls on a blank paper tube through a rewinding machine, and cutting the rewound small rolls.
Further, in the first step, the thickness of the PET base material is 23-27 mu m, the thickness of the hot melt adhesive is 6-8 mu m, the thickness of the conductive copper foil is 25-45 mu m, the thickness of the conductive adhesive is 23-27 mu m, and the thickness of the release layer is 10-15 mu m.
Further, the hot-melt pressure-sensitive adhesive is SIS hot-melt pressure-sensitive adhesive of styrene-isoprene-styrene triblock copolymer or SBS hot-melt pressure-sensitive adhesive of styrene-butadiene-styrene triblock copolymer.
Further, the conductive adhesive is an organosilicon pressure-sensitive conductive adhesive added with 70-75% of silver-plated copper powder by mass.
The conductive copper foil or radiation-proof cloth is woven by metal fibers formed by coating copper, nickel and other metals on the surfaces of nylon or polyester fibers.
The release film coating layer coated below the PET substrate is prepared by coating and curing release agents comprising, by weight, 5-7 parts of 120# solvent gasoline, 3-5 parts of acetone, 0.2-0.5 part of isooctyl acrylate, 0.5-1 part of ethyl methacrylate, 1.5-2 parts of fluorine-containing acrylate, 0.05-0.1 part of a cross-linking agent and 0.02-0.04 part of an initiator.
The further fluorine-containing acrylic ester is one of RFZ-06 hexafluorobutyl acrylate and RFZ-18 octafluoropentyl methacrylate. The cross-linking agent is trimethylolpropane triacrylate, and the initiator is benzoyl peroxide.
Further, a release film layer is coated under the PET substrate, and the method comprises the following steps: the adhesive is prepared by coating and curing a release agent of 1.5 to 2 parts of 120# solvent gasoline, 1.5 to 0.1 part of acetone, isooctyl acrylate, ethyl methacrylate, fluorine-containing acrylic ester, 0.02 to 0.04 part of cross-linking agent and 0.02 to 0.04 part of initiator.
The invention has the beneficial effects that:
the electromagnetic shielding splicing adhesive tape and the production method thereof disclosed by the invention adopt a PET (polyethylene terephthalate) substrate, a hot-melt pressure-sensitive adhesive, a conductive copper foil, a conductive adhesive and a release film layer arranged below the PET substrate which are sequentially overlapped, and the splicing adhesive tape is ultrathin and soft as a whole, good in conductivity, high in shielding efficiency, free from burrs, easy to process and excellent in appearance; the adhesive has the advantages of neat appearance, no wrinkles, scratches, chromatic aberration, concave-convex points, good adhesive strength and good adhesion, is coated with conductive adhesive and hot-melt pressure-sensitive adhesive, and can be applied to parts needing electromagnetic shielding, such as notebook computers, LCD displays, copiers and the like. And eliminating electromagnetic interference (EMI), isolating the harm of electromagnetic wave to human body, and applying to manufacture of computer peripheral wires, computer displays and transformers.
Detailed Description
The invention is illustrated, but not limited, by the following specific examples.
Example 1
Raw materials and equipment: FTB-F of the precise double-shaft slitting machine; CQD-A automatic roll cutting machine; OCA coater 1300; rewinder HCH-B1600; slitting machine FJ-1600; and a precise metering pump DJ-L. The SIS hot-melt pressure-sensitive adhesive is solid-state 3301A of a styrene-isoprene-styrene triblock copolymer, and has a softening point of 72 ℃ and a melt viscosity of 1000cps at 180 ℃; the conductive copper foil conductive adhesive is a silver-plated copper powder PSA6090 organosilicon pressure-sensitive conductive adhesive with the resistivity of 0.6mΩ & cm and the average grain diameter of 40 μm, which is added with 70% of cis Kang Ge SC40S20SZ silver-plated copper powder. The thickness of the PET base material is 27 mu m, the thickness of the hot melt adhesive is 8 mu m, the thickness of the conductive copper foil is 45 mu m, the thickness of the conductive adhesive is 27 mu m, and the thickness of the release layer is 15 mu m.
The release film coating layer coated below the PET substrate is prepared by coating and curing release agents comprising 5 parts by weight of 120# solvent gasoline, 3 parts by weight of acetone, 0.2 part by weight of isooctyl acrylate, 0.5 part by weight of ethyl methacrylate, 1.5 parts by weight of fluorine-containing acrylic ester, 0.05 part by weight of cross-linking agent and 0.02 part by weight of initiator. The fluorine-containing acrylic ester is RFZ-06 hexafluorobutyl acrylate, the crosslinking agent is trimethylolpropane triacrylate, and the initiator is benzoyl peroxide. The PET substrate is coated with a release film layer, and the method comprises the following steps: the adhesive is prepared by coating and curing a parting agent of 1.5 parts of D80 solvent, acetone, isooctyl acrylate, ethyl methacrylate, fluorine-containing acrylic ester, 0.05 part of cross-linking agent and 0.02 part of initiator.
The electromagnetic shielding splicing adhesive tape comprises a PET (polyethylene terephthalate) base material, a hot-melt pressure-sensitive adhesive, a conductive copper foil, a conductive adhesive and a release film layer arranged below the PET base material in a sequential overlapping manner; the production method of the electromagnetic shielding release film adhesive tape comprises the following steps: the method comprises the steps of firstly, melting and coating a hot-melt pressure-sensitive adhesive on a conductive copper foil to adhere to form a coated single-sided conductive copper foil; secondly, coating conductive adhesive on the other surface of the coated single-sided conductive copper foil to obtain double-sided adhesive conductive copper foil; thirdly, coating a release film layer below the PET substrate, then uniformly coating the adhesive on the PET substrate by extruding the hot-melt pressure-sensitive adhesive prepared in the adhesive storage tank and flowing out through a die head of equipment; fourthly, compound rewinding and slitting: and compounding one side of the PET substrate coated with the hot-melt pressure-sensitive adhesive surface of the double-sided adhesive conductive copper foil, rewinding into small rolls on a blank paper tube through a rewinding machine, and cutting the rewound small rolls.
The product performance: the surface is clean and smooth, and no wrinkling phenomenon exists; the surface is smooth, no obvious edge warping, greasy dirt, wrinkling, impression and lace are caused, and the section is smooth; initial adhesion type No. 16 steel ball; the adhesive has no displacement after being held at 230 ℃ for 3 hours, and no residue exists after hot stripping and cold stripping after 30 minutes at the heat resistance of 230 ℃; peel strength 8N; adhesive force 304 stainless steel 1500gf/25mm; the shielding effectiveness is 700dB.
Example 2
Raw materials and equipment: FTB-F of the precise double-shaft slitting machine; CQD-A automatic roll cutting machine; OCA coater 1300; rewinder HCH-B1600; slitting machine FJ-1600; and a precise metering pump DJ-L. The SBS hot-melt pressure-sensitive adhesive is 3-5D of the company of the universal adhesive materials of styrene-butadiene-styrene triblock copolymer, and has a softening point of 80 ℃ and a melt viscosity of 8 Pa.s at 180 ℃; the conductive adhesive is PSA6080 organosilicon pressure-sensitive conductive adhesive added with silver-plated copper powder with the mass fraction of 75 percent along Kang Ge SC40S20KL resistivity of 0.6mΩ & cm and the average grain diameter of 40 mu m. The thickness of the PET base material is 23 mu m, the thickness of the hot melt adhesive is 6 mu m, the thickness of the conductive copper foil is 25 mu m, the thickness of the conductive adhesive is 23 mu m, and the thickness of the release layer is 10 mu m.
The release film layer coated below the PET substrate is prepared by coating and curing release agents comprising 7 parts by weight of 120# solvent gasoline, 5 parts by weight of acetone, 0.5 part by weight of isooctyl acrylate, 1 part by weight of ethyl methacrylate, 2 parts by weight of fluorine-containing acrylic ester, 0.1 part by weight of cross-linking agent and 0.04 part by weight of initiator. The fluorine-containing acrylic ester is the octafluoropentyl methacrylate of Rafenflurochemistry RFZ-18, the cross-linking agent is trimethylolpropane triacrylate, and the initiator is benzoyl peroxide. The PET substrate is coated with a release film layer, and the method comprises the following steps: and coating and curing the release agent of the D80 solvent, acetone, isooctyl acrylate, ethyl methacrylate, fluorine-containing acrylic ester, a cross-linking agent and an initiator.
The electromagnetic shielding splicing adhesive tape comprises a PET (polyethylene terephthalate) base material, a hot-melt pressure-sensitive adhesive, a conductive copper foil, a conductive adhesive and a release film layer arranged below the PET base material in a sequential overlapping manner; the production method of the electromagnetic shielding release film adhesive tape comprises the following steps: the method comprises the steps of firstly, melting and coating a hot-melt pressure-sensitive adhesive on a conductive copper foil to adhere to form a coated single-sided conductive copper foil; secondly, coating conductive adhesive on the other surface of the coated single-sided conductive copper foil to obtain double-sided adhesive conductive copper foil; thirdly, coating a release film layer below the PET substrate, then uniformly coating the adhesive on the PET substrate by extruding the hot-melt pressure-sensitive adhesive prepared in the adhesive storage tank and flowing out through a die head of equipment; fourthly, compound rewinding and slitting: and compounding one side of the PET substrate coated with the hot-melt pressure-sensitive adhesive surface of the double-sided adhesive conductive copper foil, rewinding into small rolls on a blank paper tube through a rewinding machine, and cutting the rewound small rolls. Further, the main machine rotating speed of the rewinding machine is 1500r/min, the winding tension is 0.5Mpa, and the unreeling tension is 1.0Mpa.
The product performance: the surface is clean and smooth, and no wrinkling phenomenon exists; the surface is smooth, no obvious edge warping, greasy dirt, wrinkling, impression and lace are caused, and the section is smooth; initial adhesion 19# steel ball; the adhesive has no displacement after being held at 230 ℃ for 3 hours, and no residue exists after hot stripping and cold stripping after 30 minutes at the heat resistance of 230 ℃; peel strength 10N; adhesive force 304 stainless steel 1500gf/25mm; the shielding effectiveness is 650dB.
Note that: the test methods for total thickness and adhesive layer thickness and base layer thickness were performed as specified in astm d 3652. Peel strength 180 degree peel strength test methods were performed in accordance with astm d3330 specifications. The initial viscosity is carried out according to the method A in GB/T4852 and the inclined plane ball method, and an instrument of model CNS-11888 is selected; the holding adhesion was carried out as specified in GB/T4851 method A, the holding adhesion test method of the adhesive tape and the vertical standard steel plate. The adhesive tape is stuck on a steel plate, a rubber press roller with 2kg force (according to the requirement of a 5.3.4 motorized or manual press roller in GB/T2792 standard) is used for rolling back and forth for 5 times, and then the steel plate stuck with the adhesive tape is put into a baking oven with specified temperature and baked for 30 minutes; shielding effectiveness was performed as specified in SJ 20672-1998.
Claims (5)
1. An electromagnetic shielding splicing adhesive tape is characterized by comprising a PET (polyethylene terephthalate) substrate, a hot melt pressure sensitive adhesive, a conductive copper foil, a conductive adhesive and a release film layer arranged below the PET substrate in a sequential overlapping manner; the production method of the electromagnetic shielding release film adhesive tape comprises the following steps: the method comprises the steps of firstly, melting and coating a hot-melt pressure-sensitive adhesive on a conductive copper foil to adhere to form a coated single-sided conductive copper foil; secondly, coating conductive adhesive on the other surface of the coated single-sided conductive copper foil to obtain double-sided adhesive conductive copper foil; thirdly, coating a release film layer below the PET substrate, then using a hot-melt pressure-sensitive adhesive, extruding, and flowing out through a die head of equipment to uniformly coat the hot-melt pressure-sensitive adhesive on the PET substrate; fourthly, compound rewinding and slitting: and compounding one side of the PET substrate coated with the hot-melt pressure-sensitive adhesive surface of the double-sided adhesive conductive copper foil, rewinding the PET substrate into small rolls on a blank paper tube through a rewinding machine, and cutting the small rolls after rewinding.
2. The electromagnetic shielding splicing tape and the production method thereof according to claim 1, wherein the thickness of the PET substrate is 23-27 μm in the first step; the thickness of the hot melt adhesive is 6-8 mu m; the thickness of the conductive copper foil is 25-45 mu m; the thickness of the conductive adhesive is 23-27 mu m; the thickness of the release layer is 10-15 mu m.
3. The electromagnetic shielding splicing tape and the production method thereof according to claim 1, wherein the hot-melt pressure-sensitive adhesive is an SIS hot-melt pressure-sensitive adhesive of a styrene-isoprene-styrene triblock copolymer or an SBS hot-melt pressure-sensitive adhesive of a styrene-butadiene-styrene triblock copolymer or an ethylene-vinyl acetate hot-melt pressure-sensitive adhesive.
4. The electromagnetic shielding splicing tape and the production method thereof according to claim 1, wherein the conductive adhesive is an organosilicon pressure-sensitive conductive adhesive added with 70-75% of silver-plated copper powder by mass.
5. The electromagnetic shielding splicing adhesive tape and the production method thereof according to claim 1, wherein the release film coating under the PET substrate is prepared by coating and curing release agents comprising, by weight, 5-7 parts of solvent oil, 3-5 parts of acetone, 0.5-2 parts of isopropanol, 1.5-2 parts of fluorine-containing acrylic ester, 0.05-0.1 part of a cross-linking agent and 0.02-0.04 part of an initiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311690824.1A CN117659891A (en) | 2023-12-11 | 2023-12-11 | Electromagnetic shielding splicing adhesive tape and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311690824.1A CN117659891A (en) | 2023-12-11 | 2023-12-11 | Electromagnetic shielding splicing adhesive tape and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117659891A true CN117659891A (en) | 2024-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311690824.1A Pending CN117659891A (en) | 2023-12-11 | 2023-12-11 | Electromagnetic shielding splicing adhesive tape and production method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106833061A (en) * | 2016-12-23 | 2017-06-13 | 张家港康得新光电材料有限公司 | Mould release and mould release membrance |
| CN111607335A (en) * | 2020-05-26 | 2020-09-01 | 苏州德佑胶带技术有限公司 | Electromagnetic shielding adhesive tape |
| CN111704841A (en) * | 2020-06-24 | 2020-09-25 | 东莞市惟实电子材料科技有限公司 | Fluorosilicone modified acrylate release agent and preparation method and application thereof |
| CN217103687U (en) * | 2022-04-02 | 2022-08-02 | 宁波启合新材料科技有限公司 | High-transmittance electromagnetic shielding adhesive tape |
| WO2023130609A1 (en) * | 2022-01-07 | 2023-07-13 | 广州鹿山新材料股份有限公司 | Water-resistant and sweat-resistant hot-melt pressure-sensitive adhesive, and preparation method therefor and use thereof |
-
2023
- 2023-12-11 CN CN202311690824.1A patent/CN117659891A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106833061A (en) * | 2016-12-23 | 2017-06-13 | 张家港康得新光电材料有限公司 | Mould release and mould release membrance |
| CN111607335A (en) * | 2020-05-26 | 2020-09-01 | 苏州德佑胶带技术有限公司 | Electromagnetic shielding adhesive tape |
| CN111704841A (en) * | 2020-06-24 | 2020-09-25 | 东莞市惟实电子材料科技有限公司 | Fluorosilicone modified acrylate release agent and preparation method and application thereof |
| WO2023130609A1 (en) * | 2022-01-07 | 2023-07-13 | 广州鹿山新材料股份有限公司 | Water-resistant and sweat-resistant hot-melt pressure-sensitive adhesive, and preparation method therefor and use thereof |
| CN217103687U (en) * | 2022-04-02 | 2022-08-02 | 宁波启合新材料科技有限公司 | High-transmittance electromagnetic shielding adhesive tape |
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