CN117651441A

CN117651441A - Display panel, preparation method thereof and display device

Info

Publication number: CN117651441A
Application number: CN202311676791.5A
Authority: CN
Inventors: 李振; 毛宁; 杨鸣
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2023-12-07
Filing date: 2023-12-07
Publication date: 2024-03-05

Abstract

The invention provides a display panel, a preparation method thereof and a display device, relates to the technical field of display, and aims to solve the problem of non-uniform light emission of the display panel. The display panel includes: a substrate; the packaging structure is arranged on one side of the substrate; the packaging structure comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked along the direction far away from the substrate; the first insulating layer is arranged on one side of the packaging structure far away from the substrate; the first insulating layer is provided with a plurality of first openings; the black matrix layer is arranged on one side of the first insulating layer, which is far away from the substrate; the black matrix layer is provided with a plurality of second openings, and one second opening is communicated with one first opening; the color filter layer comprises a plurality of color filter parts, each color filter part is filled in the first opening and the second opening which are communicated with each other, and the color filter part is positioned in the boundary of one end of the second opening far away from the substrate. The display panel is used for displaying images.

Description

Display panel, preparation method thereof and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.

Background

An Organic Light-Emitting Diode (OLED) display panel has the advantages of self-luminescence, no backlight source, high contrast, thin thickness, wide viewing angle, high reaction speed, wide application temperature range, simple structure and manufacturing process and the like, can be used for a flexible panel, gradually becomes one of main products in the display field, and can be widely applied to terminal products such as smart phones, tablet computers, televisions, wearable equipment (such as watches and the like. How to avoid the problem of non-uniform light emission of the display panel is a technical problem to be solved in the display panel.

Disclosure of Invention

An object of an embodiment of the present disclosure is to provide a display panel for improving uniformity of light emission luminance of the display panel.

In order to achieve the above object, the embodiments of the present disclosure provide the following technical solutions:

in one aspect, a display panel is provided that includes a substrate, a package structure, a first insulating layer, a black matrix layer, and a color filter layer.

The packaging structure is arranged on one side of the substrate; the packaging structure comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked along a direction away from the substrate. The first insulating layer is arranged on one side of the packaging structure far away from the substrate; the first insulating layer is provided with a plurality of first openings. The black matrix layer is arranged on one side of the first insulating layer, which is far away from the substrate; the black matrix layer is provided with a plurality of second openings, and one second opening is communicated with one first opening. The color filter layer comprises a plurality of color filter parts, each color filter part is filled in the first opening and the second opening which are communicated with each other, and the color filter part is positioned in the boundary of one end of the second opening far away from the substrate.

It can be understood that the thickness of the organic encapsulation layer of the encapsulation structure is gradually reduced in the peripheral region, forming a gentle slope. The color filter layer formed on the package structure has fluidity, and thus tends to flow toward a low topography region (i.e., a peripheral region) in an edge region of the display region (i.e., a region adjacent to the peripheral region in the display region, hereinafter referred to as an edge display region).

In the display panel, the first opening is formed in the first insulating layer between the packaging structure and the color film structure (the film layer structure formed by the color filter layer and the black matrix layer), the first opening is communicated with the second opening of the black matrix layer, each color filter part is filled in the first opening and the second opening which are communicated with each other, and the first opening and the second opening are commonly used for limiting the color filter part. In this way, compared with the method that the color filter is limited only by the second opening of the black matrix layer, the formed opening structure with the first opening and the second opening communicated is deeper in overall depth, the color filter can be completely limited in the first opening and the second opening, the edge of the color filter cannot overflow the second opening and then is lapped on the black matrix layer around the second opening, and the color filter is located in the boundary of one end of the second opening far away from the substrate. In this way, in the edge display area of the display area, the color filtering part does not flow to the area with lower topography (namely the peripheral area), so that the thickness of the color filtering layer of the center display area (namely the part surrounded by the edge display area in the display area) of the display area is kept consistent with that of the color filtering layer of the edge display area, the problem that the brightness of the center display area and the brightness of the edge display area are inconsistent due to the fact that the color filtering part flows to the area with lower topography is avoided, and the uniformity of the brightness of the center display area and the brightness of the edge display area of the display panel is improved.

In some embodiments, a surface of the color filter away from the substrate is flush with a surface of the black matrix layer away from the substrate; or, the surface of the color filter part far away from the substrate is lower than the surface of the black matrix layer far away from the substrate.

In some embodiments, the first opening penetrates through the first insulating layer, or the first opening is a groove opened at a surface of the first insulating layer away from the substrate.

In some embodiments, in the first opening and the second opening, a sidewall of the first insulating layer, an edge portion of the first insulating layer away from a surface of the substrate, and a sidewall of the black matrix layer form a step surface, and in an orthographic projection to the substrate, the sidewall of the first insulating layer is located within a sidewall range of the black matrix layer.

In some embodiments, the sidewall of the first insulating layer and/or the sidewall of the black matrix layer has a stepped surface within the first opening and the second opening.

In some embodiments, the display panel includes a central display area, and an edge display area surrounding the central display area; the difference between the thickness of the color filter layer in the center display area and the thickness of the color filter layer in the edge display area is less than or equal to 0.5 μm.

In some embodiments, the first opening is located within the second opening in orthographic projection onto the substrate.

In some embodiments, the display panel further comprises a pixel defining layer disposed between the substrate and the package structure, the pixel defining layer having a plurality of third openings, and a plurality of light emitting devices, one of the light emitting devices being located within each of the third openings; in an orthographic projection onto the substrate, the third opening is located within the second opening.

In some embodiments, the third opening is located within the first opening in orthographic projection onto the substrate.

In some embodiments, the distance between the third opening and the second opening is in the range of-2 μm to 10 μm.

In some embodiments, the display panel further comprises a touch structure between the packaging structure and the first insulating layer, wherein the touch structure comprises at least one conductive layer, and the conductive layer is a grid structure formed by interweaving metal wires; the first insulating layer comprises a first insulating strip surrounding the plurality of first openings, and the first insulating strip coats the metal wire.

In some embodiments, a shortest distance between a boundary of the first insulating strip and a boundary of the metal line is greater than or equal to 0.5 μm.

In some embodiments, the first insulating layer includes a first insulating strip surrounding the plurality of first openings, the first insulating strip having a thickness of 0.1 μm to 50.0 μm.

In another aspect, a display device is provided. The display panel according to any one of the embodiments, and a cover plate disposed on a light emitting side of the display panel.

In some embodiments, the cover plate is in contact with the black matrix layer and the color filter layer in the display panel.

In still another aspect, a method for manufacturing a display device is provided, including:

forming a packaging structure on one side of a substrate;

forming a first insulating layer on one side of the packaging structure far away from the substrate, wherein the first insulating layer is provided with a plurality of first openings;

forming a black matrix layer on one side of the first insulating layer far away from the substrate, wherein the black matrix layer is provided with a plurality of second openings, and one second opening is communicated with one first opening;

and forming a color filter layer, wherein the color filter layer comprises a plurality of color filter parts, each color filter part is filled in the first opening and the second opening which are communicated with each other, and the boundary of one end, far away from the substrate, of the color filter part and the boundary of one end, far away from the substrate, of the second opening are inside.

The beneficial effects achieved by the display device and the preparation method of the display panel are the same as those achieved by the display panel, and are not repeated here.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a block diagram of a display device according to some embodiments;

FIG. 2 is a top view of a display panel according to some embodiments;

FIG. 3 is a cross-sectional view of a partial structure of the display panel of FIG. 2 along the AA direction;

fig. 4 is a sectional view of a partial structure of the display panel of fig. 2 in the BB direction;

FIG. 5 is a display diagram of a display device in a light-emitting state according to some embodiments;

fig. 6 is a topography after forming an array substrate and a package structure on a substrate, respectively, according to some embodiments of the present disclosure;

FIG. 7 is a block diagram of a display panel provided in some embodiments of the present disclosure;

FIG. 8 is a block diagram of a display panel provided by other embodiments of the present disclosure;

FIG. 9 is a block diagram of a display panel provided by other embodiments of the present disclosure;

FIG. 10 is a block diagram of a display panel provided by other embodiments of the present disclosure;

FIG. 11 is a block diagram of a display panel provided by other embodiments of the present disclosure;

FIG. 12 is a block diagram of a display panel provided by other embodiments of the present disclosure;

FIG. 13 is a block diagram of a display panel provided by other embodiments of the present disclosure;

FIG. 14 is a block diagram of a display panel provided by other embodiments of the present disclosure;

fig. 15 is a schematic flow chart of a method for manufacturing a display panel according to some embodiments of the present disclosure;

fig. 16-22 are process diagrams illustrating a method for manufacturing a display panel according to some embodiments of the present disclosure;

fig. 23 is a block diagram of a display device according to some embodiments of the present disclosure.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, the term "comprising" is to be interpreted as an open, inclusive meaning, i.e. "comprising, but not limited to, unless the context requires otherwise. In the description of the present specification, the terms "one embodiment," "some embodiments," "example embodiments," "examples," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C," both include the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

In addition, the use of "based on" is intended to be open and inclusive in that a process, step, calculation, or other action "based on" one or more of the stated conditions or values may be based on additional conditions or beyond the stated values in practice.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

As used herein, "parallel", "perpendicular", "equal" includes the stated case as well as the case that approximates the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be deviations within 5 °, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present between the layer or element and the other layer or substrate.

Exemplary embodiments are described herein with reference to cross-sectional and/or plan views as idealized exemplary figures. In the drawings, the thickness of layers and the area of regions are exaggerated for clarity. Thus, variations from the shape of the drawings due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.

Referring to fig. 1, an embodiment of the present disclosure provides a display device 1000, the display device 1000 being a product having an image display function. By way of example, the display device 1000 may be any device that displays both motion (e.g., video) and stationary (e.g., still image) and text or images.

By way of example, the display 1000 may be any product or component having display functionality, such as a television, a notebook, a tablet, a personal digital assistant (Personal Digital Assistant; PDA), a mobile phone (cell phone), a watch, a clock, a calculator, a GPS receiver/navigator, a camera, a display for a camera view (e.g., a display for a rear-view camera in a vehicle), a wearable device, an augmented Reality (Augmented Reality; AR) device, a Virtual Reality (VR) device, an in-vehicle display, a flight display, etc. For example, as shown in fig. 1, the display device 1000 may be a mobile phone.

The display device 1000 may be an OLED display device, a quantum dot electroluminescent display device (Quantum Dot Light Emitting Diodes; QLED) or a micro light emitting diode (Mini/Micro Light Emitting Display; MLED) as viewed from the light emitting type of the display device 1000. In terms of the form of the display device 1000, the display device 1000 may be a flat display device, a curved display device, a foldable display device, or the like. The display device 1000 may be rectangular, circular, or the like in shape as viewed from the display device 1000. The embodiments of the present disclosure are not particularly limited thereto. Some embodiments of the present disclosure will be schematically described below taking an organic light emitting diode display device, which is rectangular and planar, as an example, but the embodiments of the present disclosure are not limited thereto, and any other display device may be considered as long as the same technical ideas are applied.

The display device 1000 includes a display panel, and in the case where the display device 1000 is an OLED display device, the display panel is an OLED display panel. In some embodiments, the display device 1000 further includes a cover plate, where the cover plate is disposed on a light emitting side of the display panel, and the cover plate plays a supporting role for protecting the display panel, and ensures that the display panel can still maintain a good display effect when being impacted or scratched.

Illustratively, the cover plate may include a glass cover plate, a ceramic cover plate, a plastic cover plate, and an optical composite cover plate.

The structure of the display panel will be described in detail below.

Referring to fig. 2, some embodiments of the present disclosure provide a display panel 1001. The display panel 1001 has a display area Q1 and a peripheral area Q2 adjacent to the display area. The peripheral region Q2 may be disposed one turn around the display region Q1, or the peripheral region Q2 may partially surround the display region Q1.

The display region Q1 is a region for displaying an image on the display panel 1001, the display region Q1 includes a center display region Q11 and an edge display region Q12 surrounding the center display region Q11, the edge display region Q12 is located between the center display region Q11 and the peripheral region Q2, the edge display region Q12 can be regarded as a portion of the display region Q1 adjacent to the peripheral region Q2, the center display region Q11 is surrounded by the edge display region Q12, and the portion of the display region Q1 other than the edge display region Q12 can be regarded as a portion. The edge display region Q12 and the center display region Q11 are each provided with a subpixel P, and thus can emit light to support image display.

The edge display area Q12 and the peripheral area Q2 are not limited in physical sense, and the division of the display area Q1 into the edge display area Q12 and the central display area Q11 is only for the sake of clarity of description of the technical problem and the technical solution of the embodiment of the present application, and it is considered that the area in the display area Q1 where the color filter layer flows to the peripheral area Q2 and the phenomenon that the color filter layer is thinned is caused is the edge display area Q12. The area ratio of the edge display region Q12 in the entire display region Q1 is smaller than the area ratio of the center display region Q11 in the entire display region Q1, even much smaller than the area ratio of the center display region Q11 in the entire display region Q1, for example, the area ratio of the edge display region Q12 in the entire display region Q1 is 1/10 to 1/1000.

The peripheral region Q2 may be used, for example, to provide a gate driving circuit (Gate driver on Array, simply referred to as GOA), a control signal line (e.g., a clock signal line, a power supply voltage signal line, etc.), and the like. The peripheral region Q2 is not provided with the sub-pixel P, and thus the peripheral region Q2 is not used for image display.

In some embodiments, referring to fig. 3 and 4 in combination, fig. 3 is a cross-sectional view of a partial structure of the display panel in fig. 2 along AA direction, and fig. 4 is a cross-sectional view of a partial structure of the display panel in fig. 2 along BB direction; the display panel 1001 includes an array substrate 100, a light emitting device 200, a package structure 300, a buffer layer 400, a touch structure 500, an interlayer insulating layer 600, a color film structure 700, and a top planarization layer 800, which are stacked.

The array substrate 100 includes a substrate 110 and a plurality of pixel circuits disposed on the substrate 110. One pixel circuit is connected to one light emitting device 200 and configured to drive the light emitting device 200 to emit light. The substrate 110 may be a rigid substrate, the material of which includes glass, for example. Alternatively, the substrate 110 may be a flexible substrate, and a material of the flexible substrate may include any one of Polyimide (abbreviated as PI), polycarbonate (abbreviated as PC), and polyvinyl chloride (Polyvinyl chloride) (abbreviated as PVC), for example.

The array substrate 100 may include a plurality of conductive layers configured to form a plurality of pixel circuits and a plurality of signal lines for driving the pixel circuits. The plurality of conductive layers may include, for example, a first semiconductor layer ACT1, a first gate conductive layer GT1, a second gate conductive layer GT2, a second semiconductor layer ACT2, a third gate conductive layer GT3, a first source-drain conductive layer SD1, and a second source-drain conductive layer SD2, which are sequentially disposed in a direction perpendicular to the substrate 110 and away from the substrate 110. Of course, the array substrate may further include other conductive layers, for example, a third source-drain conductive layer, which is not specifically limited herein.

The plurality of conductive layers form a plurality of thin film transistors TFT and a plurality of storage capacitors Cst, and the plurality of thin film transistors TFT and the plurality of storage capacitors Cst are connected to each other to form the plurality of pixel circuits. Among them, the thin film transistor TFT may include a semiconductor pattern 101 at the first semiconductor layer ACT1, a gate electrode 102 at the first gate conductive layer GT1, and source and drain electrodes 103 and 104 at the first source and drain conductive layer SD 1. The storage capacitor Cst may include a first plate C1 located at the first gate conductive layer GT1 and a second plate C2 located at the second gate conductive layer GT 2.

The array substrate 100 may further include an insulating layer between adjacent conductive layers, for example, the array substrate 100 may include a first gate insulating layer GI1 between the first semiconductor layer ACT1 and the first gate conductive layer GT1, a second gate insulating layer GI2 between the first gate conductive layer GT1 and the second gate conductive layer GT2, a first interlayer dielectric layer ILD1 between the second gate conductive layer GT2 and the second semiconductor layer ACT2, a second gate insulating layer GI3 between the second semiconductor layer ACT2 and the third gate conductive layer GT3, a second interlayer dielectric layer ILD2 between the third gate conductive layer GT3 and the first source drain conductive layer SD1, and a first planarization layer PLN1 between the first source drain conductive layer SD1 and the second source drain conductive layer SD2, and a second planarization layer PLN2 between the second source drain conductive layer SD2 and the light emitting device 200. Of course, the array substrate 100 may further include other insulating film layers, which are not described herein.

The light emitting device 200 includes an anode 201, a light emitting functional layer 202, and a cathode layer 203, which are sequentially stacked in a direction away from the substrate 110. The cathode layers 203 of the plurality of light emitting devices 200 are connected to each other to form a continuous overall layer structure. The display panel 1001 may further include a pixel defining layer PDL disposed on a side of the anode 201 remote from the array substrate 100, and the pixel defining layer PDL includes a plurality of openings, at least a portion of each light emitting function layer 202 being located in one of the openings.

The package structure 300 is configured to reduce the risk of moisture and oxygen in the external environment entering the light emitting device 200, thereby improving the service life of the display panel 1001. As shown in fig. 3, the encapsulation structure 300 may be an encapsulation film, and in this case, the encapsulation structure 300 may include a first inorganic encapsulation layer 301, an organic encapsulation layer 302, and a second inorganic encapsulation layer 303, which are sequentially stacked.

Illustratively, the material of the first inorganic encapsulation layer 301 includes one or more combinations of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). The first inorganic encapsulation layer 301 is formed using a chemical vapor deposition (Chemical Vapor Deposition, abbreviated as CVD) process.

Illustratively, the material of the organic encapsulation layer 302 includes one or more of an acrylic-based polymer, a silicon-based polymer, and an epoxy-based polymer (polymer), and is fabricated on the first inorganic encapsulation layer 301 by an Ink Jet Printing (IJP) method, and is subjected to Ultraviolet (UV) curing to form the organic encapsulation layer 302.

Illustratively, the material of the second inorganic encapsulation layer 303 includes one or more combinations of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON). The second inorganic encapsulation layer 303 is formed using a chemical vapor deposition (Chemical Vapor Deposition, abbreviated as CVD) process.

As shown in fig. 4, the touch structure 500 includes a first conductive layer 501, a second conductive layer 502, and a touch insulating layer 503 between the first conductive layer 501 and the second conductive layer 502, where the first conductive layer 501 and the second conductive layer 502 are all Mesh structures (Metal Mesh) formed by interlacing Metal wires. The touch structure 500 is used for realizing a touch function.

The interlayer insulating layer 600 is used for isolating the touch structure 500 and the color film structure 700, and protecting the first conductive layer 501 and the second conductive layer 502 in the touch structure 500.

As shown in fig. 3 and 4, the color film structure 700 includes a black matrix layer 701 and a color filter layer 702, the black matrix layer 701 is provided with a plurality of black matrix openings, the color filter layer 702 includes a plurality of color filter portions, and one color filter portion is disposed in one black matrix opening. The color filter parts comprise color filter parts with various colors, and the colors of the color filter parts are the same as the colors of the light emitted by the corresponding light emitting devices, so that the reflectivity of the display panel to the outside environment light can be effectively reduced by using the black matrix layer 701, and adverse effects of the black matrix layer 701 on the normal light emission of the display panel can be avoided.

As shown in fig. 4, the display panel 1001 further includes: a barrier structure Dam disposed on the substrate. The blocking structure Dam is disposed around the plurality of light emitting devices 200 and located at the peripheral region Q2, and may block the ink material forming the organic encapsulation layer 302 from overflowing beyond the region surrounded by the blocking structure Dam during the formation of the organic encapsulation layer 302, thereby being beneficial to ensuring the encapsulation reliability.

Illustratively, the barrier structure Dam may include a first barrier Dam1 and a second barrier Dam2, with a gap (e.g., a gap of 30 μm to 50 μm) between the first barrier Dam1 and the second barrier Dam2, the first and second inorganic encapsulation layers 301 and 303 in the encapsulation structure 300 cover the first and second barrier dams Dam1 and Dam2 at the same time, which is advantageous for improving the encapsulation reliability.

As shown in fig. 4, the display panel 1001 further includes: the third flat layer PLN3 disposed on the substrate 110, where the third flat layer PLN3 is disposed on the peripheral region Q2 and is located outside the periphery of the touch structure 500. The edge of the color film structure 700 extends above the third flat layer PLN3, and the top flat layer 800 covers the upper surface of the color film structure 700 and the third flat layer PLN3. By the above arrangement, the edge of the display panel 1001 is made flat, so that a cover plate subsequently provided on the display panel 1001 can be closely attached to the display panel 1001.

How to improve the uniformity of the light emission luminance of the display panel is a problem that has been studied in the field. The inventors of the present disclosure have studied to find that the non-uniformity in thickness of the color filter layer 702 in the center display region Q11 and the color filter layer 702 in the edge display region Q12 is one of the causes of non-uniformity in light emission luminance.

Specifically, referring to table 1, the data in table 1 includes thicknesses of the black matrix layer 701 and the color filter layer 702 in the color film structure 700 in the center display region Q11 and the edge display region Q12, respectively, and the color filter layer 702 includes a blue color filter portion, a green color filter portion, and a red color filter portion.

TABLE 1

As shown in table 1 above, the thickness of the organic encapsulation layer 302 in the center display region Q11 was 9.82 μm, the thickness of the organic encapsulation layer 302 in the edge display region Q12 was 7.87 μm, and the thickness of the organic encapsulation layer 302 in the center display region Q11 was 1.95 μm thicker than the thickness of the organic encapsulation layer 302 in the edge display region Q12. The thickness of the blue color filter in the center display area Q11 is 2.9 μm, the thickness of the blue color filter in the edge display area Q12 is 2.4 μm, and the thickness of the blue color filter in the center display area Q11 is 0.5 μm thicker than the thickness of the blue color filter in the edge display area Q12. The thickness of the green color filter portion in the center display area Q11 is 2.9 μm, the thickness of the green color filter portion in the edge display area Q12 is 2.5 μm, and the thickness of the green color filter portion in the center display area Q11 is 0.4 μm thicker than the thickness of the green color filter portion in the edge display area Q12. The thickness of the green color filter portion in the center display area Q11 is 2.8 μm, the thickness of the green color filter portion in the edge display area Q12 is 2.3 μm, and the thickness of the green color filter portion in the center display area Q11 is 0.5 μm thicker than the thickness of the green color filter portion in the edge display area Q12.

It can be found that the thicknesses of the red, blue and green color filters of the edge display area Q12 are smaller than those of the red, blue and green color filters of the central display area Q11, which causes that the light transmittance of the color filters of the edge display area Q12 is greater than that of the color filters of the central display area Q11, so that the display panel is bright, and the display panel is poor in brightness in a dark state, resulting in a problem that the brightness of the display panel is not uniform. As shown in fig. 5, a bright spot exists in the area outlined by the white dotted frame S.

In the process of manufacturing the package structure 300 in the display panel 1001, referring to fig. 6, fig. 6 is a topography after forming the array substrate 100 and the package structure 300 on the substrate 110, respectively; the origin position of the ordinate in fig. 6 represents the substrate, the origin position of the abscissa in fig. 6 represents the edge of the display panel, the units of the abscissa and the ordinate are μm, curve 1 is the topography of the device surface after the pixel circuit is formed on the substrate (i.e., after the preparation of the array substrate 100 is completed), curve 2 is the topography of the device surface after the formation of the package structure 300, the topography substantially corresponds to the peripheral region Q2 in the range of 0 to 1000 μm on the abscissa, the topography substantially corresponds to the edge display region Q12 in the range of 1000 μm to 1600 μm on the abscissa, and the topography substantially corresponds to the center display region Q11 in the range of 1600 μm to 7000 μm on the abscissa.

The organic encapsulation layer 302 is formed by using an inkjet printing method to make organic material ink on the first inorganic encapsulation layer 301 and performing ultraviolet curing, and the thickness of the organic encapsulation layer 302 in the peripheral area Q2 is gradually reduced to form a gentle slope. As can be seen from curve 2, the topography of the device surface gradually decreases in thickness at the peripheral region Q2.

The color filter layer 702 of the color film structure 700 formed on the package structure 300 has fluidity, so that the color filter layer 702 in the edge display region Q12 of the display region Q1 tends to flow toward the lower topography region (i.e., the peripheral region Q2, i.e., the gentle slope region of the organic package layer 302). In addition, the third flat layer PLN3 outside the periphery of the touch structure 500 is generally low in topography, which can increase the flow of the color filter layer 702 in the edge display area Q12 to the low topography area. For the above reasons, the thickness of the color filter layer 702 in the edge display area Q12 is smaller than that of the color filter layer 702 in the center display area Q11, which eventually results in a problem of non-uniform light emission brightness of the display panel.

Referring to fig. 7, in some embodiments, a display panel 1002 is provided. The display panel 1002 includes: a substrate 110, a package structure 300, a first insulating layer 60, a black matrix layer 71, and a color filter layer 72.

The package structure 300 is disposed on one side of the substrate 110. The specific structure and function of the package structure 300 may be referred to the corresponding description above, and will not be repeated here.

The first insulating layer 60 is disposed on a side of the package structure 300 away from the substrate 110; the first insulating layer 60 is provided with a plurality of first openings k1. The material of the first insulating layer 60 comprises an acrylate or epoxy, and in other embodiments, the material of the first insulating layer 60 may also comprise one or more of other thermally curable or photo-curable organic materials.

A black matrix layer 71 disposed on a side of the first insulating layer 60 away from the substrate 110; the black matrix layer 71 is provided with a plurality of second openings k2, and one second opening k2 communicates with one first opening k1.

The color filter layer 72 includes a plurality of color filter portions 720, each color filter portion 720 is filled in the first opening k1 and the second opening k2, and the color filter portion 720 is located in a boundary of an end of the second opening k2 away from the substrate 110.

The color filter layer 72 and the black matrix layer 71 form a color film structure 70. The color film structure 70 may be used as described above, and will not be described again.

In the display panel 1002 provided in the embodiment of the present disclosure, by disposing the first opening k1 in the first insulating layer 60 between the package structure 300 and the color film structure 70 and making the first opening k1 communicate with the second opening k2 of the black matrix layer 71, each color filter 720 is filled in the first opening k1 and the second opening k2 that communicate with each other, and the first opening k1 and the second opening k2 are commonly used for limiting the color filter 720. In this way, compared with the case where the color filter 720 is limited only by the second opening k2 of the black matrix layer 71, the color filter 720 can be limited entirely to the first opening k1 and the second opening k2 by the depth of the entire opening structure formed by the penetration of the first opening k1 and the second opening k2 being deeper, and the edge of the color filter 720 does not overflow the second opening k2 and overlap the black matrix layer 71 around the second opening k2, so that the color filter 720 is located within the boundary of the end of the second opening k2 away from the substrate 110 (i.e., the boundary of the upper surface). In this way, in the edge display area Q12 and the peripheral area Q2 of the display area Q1, the color filter 720 does not flow to the area with lower topography, so that the thicknesses of the color filter 72 of the center display area Q11 of the display area Q1 and the edge display area Q12 of the display area are kept consistent, the problem that the brightness of the center display area Q11 and the edge display area Q12 of the display area Q1 is inconsistent due to the thickness thinning of the color filter 720 of the edge display area Q12 caused by the flow of the color filter 720 to the area with lower topography is avoided, the problem that the bright state edge is bright, and the problem that the bright state is poor is solved, and the uniformity of the luminous brightness of the center display area Q11 and the edge display area Q12 of the display area Q1 of the display panel 1002 is improved.

In addition, in the related art, the edge of the color filter portion of the color filter layer is overlapped above the black matrix layer, and the opening of the black matrix layer is limited by the color filter portion due to design consideration of the color filter layer, so that the opening of the black matrix layer cannot be made larger. In the embodiment of the disclosure, the color filter portion 720 is limited in the first opening k1 of the first insulating layer 60 and the second opening k2 of the black matrix layer 71, and the edge of the color filter portion 720 does not overlap the black matrix layer 71, so that the size design of the second opening k2 of the black matrix layer 71 is not limited by the color filter portion any more, the process window of the size design of the second opening k2 is enlarged, and a higher light transmittance can be obtained by increasing the size of the second opening k2, thereby increasing the brightness of the display panel and reducing the power consumption of the display panel.

In some embodiments, as shown in fig. 7, the surface of the color filter 720 remote from the substrate 110 is flush with the surface of the black matrix layer 71 remote from the substrate 110. This is advantageous in that the thicknesses of the color filter layers in the center display region and the edge regions of the display region of the display panel 1002 are kept uniform, and the uniformity of the light emission luminance in the center display region and the edge regions of the display region of the display panel 1002 is improved. And the flatness of the surface of the color film structure 70, which is remote from the substrate 110, formed by the color filter layer 72 and the black matrix layer 71 can be ensured.

In some embodiments, as shown in fig. 8, the surface of the color filter 720 away from the substrate 110 is lower than the surface of the black matrix layer 61 away from the substrate 110. This is advantageous in that the color filter 720 is completely limited in the first opening k1 and the second opening k2, and the edge of the color filter 720 does not overflow the second opening k2 and is overlapped on the black matrix layer 71 around the second opening k2, so that the color filter 720 is further ensured to be located within the boundary (i.e., the boundary of the upper surface) of the end of the second opening k2 away from the substrate 110.

In some embodiments, as shown in fig. 7, the first opening k1 penetrates through the first insulating layer 60, so that the overall depth of the opening structure formed by the first opening k1 and the second opening k2 penetrating through each other can be increased, and the color filtering portion 720 is more effectively prevented from overflowing and flowing to the area with lower topography.

In other embodiments, referring to fig. 9, the first opening k1 is a groove formed on a surface of the first insulating layer 60 away from the substrate 110, so that a surface of the touch structure 500 away from the substrate 110 is covered with the first insulating layer 60, and the first insulating layer 60 can better protect the touch structure 500.

In some embodiments, referring to fig. 10, in the through first opening k1 and second opening k2, a sidewall 601 of the first insulating layer 60, an edge portion 602 of a surface of the first insulating layer 60 away from the substrate 110, and a sidewall 710 of the black matrix layer 71 form a step surface J1. And in the orthographic projection onto the substrate 110, the sidewall 601 of the first insulating layer 60 is located within the sidewall 710 of the black matrix layer 71, for example, the size of the first opening k1 may be smaller than the size of the second opening k2, so that the sidewall 601 of the first insulating layer 60 is located within the sidewall 710 of the black matrix layer 71. Thus, the step surface J1 increases the contact area between the color filter portion 720 and the first insulating layer 60, which is advantageous in preventing the color filter portion 720 from falling off.

In some embodiments, the sidewall 601 of the first insulating layer 60 and/or the sidewall 710 of the black matrix layer 71 have a stepped surface within the through-first opening k1 and the second opening k 2.

Illustratively, referring to fig. 11, in the first opening k1 and the second opening k2, the sidewall of the first insulating layer 60 has a plurality of step surfaces J2, and the step surfaces J2 of the sidewall of the first insulating layer 60 are beneficial to increasing the contact area between the color filter 720 and the first insulating layer 60 and preventing the color filter 720 from falling off. Taking the number of step surfaces J2 as one example in fig. 13, in other embodiments, the number of step surfaces J2 may be plural.

Illustratively, referring to fig. 12, in the first opening k1 and the second opening k2, the sidewall of the black matrix layer 71 has a step surface J3, and the number of step surfaces J3 of the sidewall of the black matrix layer 71 may be several, which step surface J3 is beneficial to increasing the contact area between the color filter 720 and the black matrix layer 71 and preventing the color filter 720 from falling off. Taking the number of step surfaces J3 as one example in fig. 12, in other embodiments, the number of step surfaces J3 may be plural.

Illustratively, referring to fig. 13, in the first opening k1 and the second opening k2, the sidewall of the first insulating layer 60 and the sidewall of the black matrix layer 71 each have a step surface J4, and the step surface J4 is beneficial to increasing the contact area of the color filter 720 and the first insulating layer 60 and the contact area of the color filter 720 and the black matrix layer 71, and preventing the color filter 720 from falling off. In fig. 13, the number of step surfaces J4 is taken as two as an example, and in other embodiments, the number of step surfaces J4 may be plural.

The display panel 1002 also includes an intermediate display area and an edge display area surrounding the intermediate display area, and the relevant arrangement of the intermediate display area and the edge display area may be referred to the above description, and will not be repeated here. In some embodiments, by utilizing the first opening k1 in the first insulating layer 60 and the second opening k2 in the black matrix layer 71 together for restricting the color filter 720, the difference between the thickness of the color filter 72 located in the intermediate display region and the thickness of the color filter 72 located in the edge display region may be made smaller than or equal to 0.5 μm, such as 0, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, or 0.5 μm. That is, the difference between the thicknesses is small and even can reach 0, which is beneficial to making the thicknesses of the color filter layers of the center display area and the edge area of the display panel 1002 to be consistent, and improving the uniformity of the light-emitting brightness of the center display area and the edge area of the display panel.

In some embodiments, with continued reference to fig. 7, in the front projection onto the substrate 110, the first opening k1 is located within the range of the second opening k2, which may increase the light output of the side view of the light emitting device 200, which is beneficial to improving the side view brightness of the display panel 1002.

In other embodiments, the first opening k1 coincides with the second opening k2 in an orthographic projection onto the substrate 110, i.e., the first opening k1 and the second opening k2 are equal in size.

In other embodiments, referring to fig. 14, in the front projection to the substrate 110, the second opening k2 is located within the first opening k1, in which case the black matrix layer 71 covers the sidewall of the first insulating layer 60 facing the first opening k 1.

In some embodiments, with continued reference to FIG. 7, the display panel 1002 further includes a pixel defining layer PDL disposed between the substrate 110 and the package structure 300, the pixel defining layer PDL having a plurality of third openings k3, and a plurality of light emitting devices 200 disposed within one of the third openings k 3. In an orthographic projection onto the substrate 110, the third opening k3 is located within the range of the second opening k 2. The third opening k3 is located within the range of the second opening k2, which is advantageous to increase the light output of the side view angle of the light emitting device 200, thereby improving the side view angle brightness of the display panel 1002. In other embodiments, the third opening k3 coincides with the second opening k2 in an orthographic projection onto the substrate 110, i.e. the third opening k3 is equal in size to the second opening k 2.

In other embodiments, the second opening k2 is located within the third opening k3 in front projection to the substrate 110.

Based on the above, in the front projection to the substrate 110, the distance L2 between the third opening k3 and the second opening k2 ranges from-2 μm to 10 μm, for example, -2 μm, -1 μm, 0, 1 μm, 3 μm, 6 μm, 8 μm, 10 μm. When L2 is negative, it represents that the second opening k2 is located within the range of the third opening k 3; when L2 is positive, it represents that the third opening k3 is located within the range of the second opening k 2; when L2 is 0, it represents that the third opening k3 coincides with the second opening k 2.

In some embodiments, the third opening k3 is located within the first opening k1 in the front projection to the substrate 110, which is advantageous in increasing the light output of the side view of the light emitting device 200. On this basis, in the case where the first opening k1 is located within the second opening k2, the dimensions of the third opening k3, the first opening k1, and the second opening k2 are gradually increased in a direction perpendicular to the substrate 110 and away from the substrate 110, so that the light output amount of the side view angle of the light emitting device 200 can be increased to a greater extent, and the side view angle brightness of the display panel 1002 can be improved.

In other embodiments, the third opening k3 coincides with the first opening k1 in an orthographic projection onto the substrate 110.

In other embodiments, the first opening k1 is located within the third opening k3 in front projection to the substrate 110.

In some embodiments, with continued reference to FIG. 7, the display panel 1002 further includes a touch structure 500 between the package structure 300 and the first insulating layer 60, the touch structure 500 including at least one conductive layer, the conductive layer being a mesh structure formed by interlacing metal lines. The first insulating layer 60 includes a first insulating stripe 6 surrounding a plurality of first openings k1, and the first insulating stripe 6 wraps the metal line. The first insulating layer 60 is used for insulating and protecting the touch structure 500.

Illustratively, with continued reference to fig. 7, the touch structure 500 includes a first conductive layer 501, a second conductive layer 502, and an insulating layer 503 between the first conductive layer 501 and the second conductive layer 502, where the first conductive layer 501 and the second conductive layer 502 are each a mesh structure formed by interlacing metal wires 5. The first conductive layer 501 and the second conductive layer 502 are connected by a via hole on the insulating layer 503. The thickness of the second conductive layer 502 may be 10nm-500nm.

The shortest distance L1 between the boundary of the first insulating strip 6 of the first insulating layer 60 and the boundary of the metal line 5 is greater than or equal to 0.5 μm. Within this range, the shortest distance L1 between the boundary of the first insulating strip 6 and the boundary of the metal wire 5 can improve the protective insulating effect of the first insulating strip 6 on the metal wire 5.

In some embodiments, with continued reference to fig. 7, the first insulating layer 60 includes a first insulating strip 6 surrounding a plurality of first openings k1, the first insulating strip 6 having a thickness of 0.1 μm to 50.0 μm, such as 0.1 μm, 1 μm, 10.0 μm, 20.0 μm, 30.0 μm, 45.0 μm, 50.0 μm. If the thickness of the first insulating strip is less than 0.1 μm, the depth of the k1 of the enclosed first opening is too small, and the color filter 720 may not be effectively limited to the first opening k1 and the second opening k2 that are communicated with each other; if the thickness of the first insulating strip is greater than 50.0 μm, the technical trend of thinning the display panel is not satisfied.

In some embodiments, the material of the first insulating layer 60 includes an acrylate or epoxy; in other embodiments, the material of the first insulating layer may also include one or more other thermally or photo-curable organic materials.

In some embodiments, the display panel 1002 further includes: and a spacer layer PS disposed on a surface of a portion of the pixel defining layer PDL, which is far from the substrate 110, and used for supporting the mask plate when the light emitting functional layer 202 is formed by vapor deposition.

The embodiment of the disclosure also provides a method for manufacturing a display panel, referring to fig. 15, including the following steps:

Step S1: forming a packaging structure on one side of a substrate;

step S2: forming a first insulating layer on one side of the packaging structure far away from the substrate, wherein the first insulating layer is provided with a plurality of first openings;

step S3: forming a black matrix layer on one side of the first insulating layer away from the substrate, wherein the black matrix layer is provided with a plurality of second openings, and one second opening is communicated with one first opening;

step S4: and forming a color filter layer, wherein the color filter layer comprises a plurality of color filter parts, each color filter part is filled in the first opening and the second opening which are communicated with each other, and the boundary of one end of the color filter part, which is far away from the substrate, and the boundary of one end of the second opening, which is far away from the substrate, are inside.

In the method for manufacturing the display panel, the formed first insulating layer is provided with a plurality of first openings, the formed black matrix layer is provided with a plurality of second openings, and one second opening is communicated with one first opening; because each color filtering part is filled in the first opening and the second opening which are communicated with each other in the process of forming the color filtering layer, the first opening and the second opening can not only prevent materials forming the color filtering part from flowing, but also prevent the color filtering part from falling off, and the color filtering part is positioned in the boundary of one end of the second opening far away from the substrate.

And the size design of the second opening of the black matrix layer is not limited by the color filtering part any more, so that a process window of the size design of the second opening is enlarged, and higher light transmittance can be obtained by increasing the size of the second opening, thereby increasing the brightness of the display panel and reducing the power consumption of the display panel.

The following describes in detail a method of manufacturing a display panel provided in an embodiment of the present disclosure with reference to fig. 16 to 22.

Referring to fig. 16, an array substrate 100 is formed. The step of forming the array substrate 100 includes: a plurality of thin film transistors and a plurality of storage capacitors are formed. The process for forming the array substrate comprises the following steps: in the processes of exposure, development, magnetron sputtering, dry etching and wet etching, the metal layer, the organic layer and the inorganic film layer are patterned to form the thin film transistor with current-voltage regulation function in the process of forming the thin film transistor and the storage capacitor.

With continued reference to fig. 16, an anode layer 201 is formed on the side of the array substrate 100 remote from the substrate 110.

In some embodiments, the step of forming the anode layer 201 includes forming an initial anode layer by using magnetron sputtering, forming a first photoresist layer on a surface of the initial anode layer, which is far away from the substrate 110, sequentially exposing and developing the first photoresist layer to form a first photoresist pattern layer, etching the initial anode layer by using the first photoresist pattern layer as a mask to form the anode layer, wherein the anode layer includes a plurality of anodes disposed independently of each other, and removing the first photoresist pattern layer.

In some embodiments, the material forming anode layer 201 is an alloy or stack including silver (Ag), gold (Au), palladium (Pd), or platinum (Pt), or is indium tin oxide (itto); in other embodiments, the material forming the anode layer may also include other high reflectivity metals, or alloys or laminates of such metals, and may also be composite film layers of other metal reflective layers.

With continued reference to fig. 16, a pixel defining layer PDL is formed on a side of the anode layer 201 remote from the substrate 110, the pixel defining layer PDL comprising a plurality of third openings k3, each third opening k3 exposing a surface of one of the anodes in the anode layer 201. The step of forming the pixel defining layer PDL includes: an initial pixel defining layer is formed on a side surface of the anode layer 201 away from the substrate 110, then a second photoresist layer is formed on a side surface of the initial pixel defining layer away from the substrate, the second photoresist layer is sequentially exposed and developed to form a second photoresist pattern layer, the initial pixel defining layer is etched with the second photoresist pattern layer as a mask to form a pixel defining layer PDL including a plurality of third openings k3, and then the second photoresist pattern layer is removed. The second photoresist pattern layer may be a transparent material or a black opaque material.

In some embodiments, the second photoresist layer has a thickness of 0.5 μm to 1.5 μm.

With continued reference to fig. 16, a light-emitting functional layer 202 is formed in a region between the pixel defining layers PDL.

Illustratively, the process of forming the light emitting functional layer 202 includes vacuum high temperature evaporation, inkjet printing, or transfer printing processes.

Illustratively, the light emitting functional layer 202 includes at least light emitting layers, each of which is located within one of the third openings k 3. The light emitting functional layer 202 may further include at least one of a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer.

With continued reference to fig. 16, after the light emitting function layer 202 is formed in the region between the pixel defining layers PDL, a cathode layer 203 is formed which covers the light emitting function layer 202, the pixel defining layers PDL, and the spacer layer PS.

In some embodiments, the process of forming the cathode layer 203 includes an evaporation process.

Illustratively, the material of the cathode layer 203 includes silver (Ag), magnesium (Mg), aluminum (Al), or an oxide including silver (Ag), magnesium (Mg), aluminum (Al); other metals or metal oxides may also be included in other embodiments.

Illustratively, the cathode layer 203 has a thickness of 1nm to 30nm. The cathode layer 203 cooperates with the anode layer 201 to cause the light-emitting functional layer 202 to emit light.

With continued reference to fig. 16, a package structure 300 is formed on one side of the substrate 110. Specifically, the package structure 300 is formed on a side of the cathode layer 203 away from the substrate 110, and the step of forming the package structure 300 includes forming a first inorganic package layer 301, an organic package layer 302, and a second inorganic package layer 303, which are sequentially stacked.

Illustratively, the first inorganic encapsulation layer 301 has a thickness of 0.1 μm to 5.0 μm, the organic encapsulation layer 302 has a thickness of 0.1 μm to 50.0 μm, and the second inorganic encapsulation layer 303 has a thickness of 0.1 μm to 2.0 μm.

Illustratively, the material of the organic encapsulation layer 302 includes one or more of an acrylic-based polymer, a silicon-based polymer, and an epoxy-based polymer (polymer), and is fabricated on the first inorganic encapsulation layer 301 by inkjet Printing (IJP) and Ultraviolet (UV) cured to form the organic encapsulation layer 32.

Illustratively, the material of the second inorganic encapsulation layer 302 includes one or more combinations of silicon nitride (SiNx), silicon dioxide (SiOx), silicon oxynitride (SiON). The second inorganic encapsulation layer 302 is formed using a chemical vapor deposition (Chemical Vapor Deposition, abbreviated as CVD) process.

With continued reference to fig. 16, a touch structure 500 is formed on a side of the package structure 300 remote from the substrate 110.

The step of forming the touch structure 500 includes: the first conductive layer 501, the second conductive layer 502, and the insulating layer 503 between the first conductive layer 501 and the second conductive layer 502 are formed, the first conductive layer 501 and the second conductive layer 502 are all mesh structures formed by interlacing metal wires, and the first conductive layer 501 and the second conductive layer 502 are connected through vias on the insulating layer 503.

Illustratively, the insulating layer 503 is formed by a process including a plasma enhanced chemical vapor deposition process (Plasma Enhanced Chemical Vapor Deposition, abbreviated as PECVD), a chemical vapor deposition process (Chemical Vapor Deposition, abbreviated as CVD), a silicone encapsulation process (HDMSO), a coating or printing process.

Illustratively, the material of the insulating layer 503 includes a stack and a mixture of one or more of organic materials SiOxNy, siNx, siOx, alOx, acrylic, epoxy, and the like.

Illustratively, the material of the first conductive layer 501 includes a stack of layers formed from one or more of silver (Ag), gold (Au), palladium (Pd), platinum (Pt), or Indium Tin Oxide (ITO) metal oxides.

Illustratively, the material of the second conductive layer 502 includes a stack of layers formed from one or more of silver (Ag), gold (Au), palladium (Pd), platinum (Pt), or Indium Tin Oxide (ITO) metal oxides.

In some embodiments, with continued reference to fig. 16, after forming the package structure 300 on one side of the substrate 110, before forming the touch structure 500 on one side of the substrate 110, further includes: a buffer layer 400 is formed on a surface of the package structure 300 remote from the substrate 110.

Illustratively, the process of forming the buffer layer 400 includes a plasma enhanced chemical vapor deposition process (Plasma Enhanced Chemical Vapor Deposition, abbreviated as PECVD), a chemical vapor deposition process (Chemical Vapor Deposition, abbreviated as CVD), a silicone encapsulation process (HDMSO), a coating or printing process.

In some embodiments, the thickness of the buffer layer 400 is 0.1 μm to 5.0 μm, for example 2.0 μm or 4.5 μm.

In some embodiments, the material of the buffer layer 400 includes a stack and mix of one or more organic materials of SiOxNy, siNx, siOx, alOx, acrylic and epoxy.

In other embodiments, when forming the second inorganic encapsulation layer 303, the thickness of the second inorganic encapsulation layer 303 may be made thick, so as to serve as a buffer layer, which may simplify the process and reduce the production cost.

Referring to fig. 16 and 17 in combination, a first insulating layer 60 is formed on a side of the touch structure 500 away from the substrate 110, and the first insulating layer 60 is provided with a plurality of first openings k1. The step of forming the first insulating layer 60 includes: an initial first insulating layer 603 is formed on a side of the touch structure 500 away from the substrate 110, a third photoresist layer is formed on a surface of the side of the initial first insulating layer 603 away from the substrate 110, the third photoresist layer is sequentially exposed and developed to form a third photoresist pattern layer, the initial first insulating layer 603 is etched by using the third photoresist pattern layer as a mask to form a first insulating layer 60 on the initial first insulating layer 603, and then the third photoresist pattern layer is removed.

Referring to fig. 18 and 19 in combination, a black matrix layer 71 is formed on a side of the first insulating layer 60 remote from the substrate 110, and the black matrix layer 71 is provided with a plurality of second openings k2, one second opening k2 being communicated with one first opening k1. Specifically, an initial black matrix layer 711 is formed on a side of the first insulating layer 60 away from the substrate 110, the initial black matrix layer 711 further fills the first opening k1, a fourth photoresist layer is formed on a surface of the side of the initial black matrix layer 711 away from the substrate 110, the fourth photoresist layer is sequentially exposed and developed to form a fourth photoresist pattern layer, the initial black matrix layer 711 is etched with the fourth photoresist pattern layer as a mask to form a black matrix layer 71, and then the fourth photoresist pattern layer is removed.

Illustratively, the fourth photoresist layer includes a negative photoresist layer.

Referring to fig. 20, 21 and 22 in combination, a color filter layer 72 is formed, the color filter layer 72 includes a plurality of color filter portions 720, each color filter portion 720 is filled in a first opening k1 and a second opening k2 which are communicated with each other, and a boundary of an end of the color filter portion 720 away from the substrate and a boundary of an end of the second opening k2 away from the substrate 110 are within. Here, the plurality of color filters 720 include color filters of a plurality of colors, and the color of the color filters 720 is the same as the color of the light emitted from the corresponding light emitting device. In the case where the plurality of color filter portions 720 includes a red color filter portion, a blue color filter portion, and a green color filter portion, the color filter portions of different colors are formed in different process steps, fig. 20, 21, and 22 illustrate the formation of the red color filter portion, the blue color filter portion, and the green color filter portion, respectively.

Referring to fig. 23, the embodiment of the disclosure further provides a display device 1000, including the display panel 1002 disclosed in the above embodiment, and the cover plate 1003 disposed on the light emitting side of the display panel 1002.

In some embodiments, the cover plate 1003 contacts the black matrix layer 71 and the color filter layer 72 in the display panel 1002.

Since the thickness of the color filter layer 72 in the center display area and the thickness of the color filter layer in the edge display area are consistent, the surface of the color film structure 70 formed by the black matrix layer 71 and the color filter layer 72, which is far away from the substrate 110, is relatively flat, i.e., the upper surface of the display panel 1002, so that there is no need to additionally add a flat layer (such as the top flat layer 800 in fig. 3 and 4) on the surface of the black matrix layer 71 and the color filter layer 72, which is far away from the substrate 110, and the cover plate 1003 can be directly disposed on the surface of the black matrix layer 71 and the color filter layer 72, which is far away from the substrate 110, to contact the black matrix layer 71 and the color filter layer 72, thereby reducing the thickness of the display device 1000. And because there is no need to add an additional top flat layer, a mask process for preparing the top flat layer is not needed in preparing the display panel 1002, and the cost is saved and the preparation process of the display panel 1002 is simplified.

In some embodiments, a camera is also provided in the display panel 1002, and the camera is disposed within the mounting hole by forming a mounting hole in the display panel 1002. The packaging structure is also required to be packaged around the mounting hole, so that the organic packaging layer of the packaging structure also has a gentle slope with a certain distance around the mounting hole. Based on the technical ideas disclosed by the disclosure, the thickness of the color filter layer in the area around the mounting hole is kept consistent with the thickness of the color filter layer in the central display area of the display area, so that when the cover plate is attached, the problem that attaching bubbles are generated due to the fact that the area around the mounting hole has a height difference is avoided, and the reliability of the display device is improved.

The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display panel, comprising:

a substrate;

the packaging structure is arranged on one side of the substrate; the packaging structure comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially stacked along a direction far away from the substrate;

The first insulating layer is arranged on one side of the packaging structure far away from the substrate; the first insulating layer is provided with a plurality of first openings;

the black matrix layer is arranged on one side of the first insulating layer, which is far away from the substrate; the black matrix layer is provided with a plurality of second openings, and one second opening is communicated with one first opening;

the color filter layer comprises a plurality of color filter parts, each color filter part is filled in the first opening and the second opening which are communicated with each other, and the color filter part is positioned in the boundary of one end of the second opening, which is far away from the substrate.

2. The display panel according to claim 1, wherein a surface of the color filter portion away from the substrate is flush with a surface of the black matrix layer away from the substrate; or, the surface of the color filter part far away from the substrate is lower than the surface of the black matrix layer far away from the substrate.

3. The display panel of claim 1, wherein the first opening penetrates the first insulating layer or the first opening is a groove opened in a surface of the first insulating layer away from the substrate.

4. The display panel according to claim 1, wherein a side wall of the first insulating layer, an edge portion of the first insulating layer away from a surface of the substrate, and a side wall of the black matrix layer form a stepped surface in intersecting relation with the first opening and the second opening, and the side wall of the first insulating layer is located within a side wall range of the black matrix layer in orthographic projection to the substrate.

5. The display panel according to claim 1, wherein a sidewall of the first insulating layer and/or a sidewall of the black matrix layer has a stepped surface in the first opening and the second opening.

6. The display panel according to any one of claims 1 to 5, wherein the display panel includes a center display area, and an edge display area surrounding the center display area;

the difference between the thickness of the color filter layer in the center display area and the thickness of the color filter layer in the edge display area is less than or equal to 0.5 μm.

7. The display panel according to any one of claims 1 to 5, wherein the first opening is located within the range of the second opening in orthographic projection to the substrate.

8. The display panel of claim 7, further comprising a pixel defining layer disposed between the substrate and the package structure, the pixel defining layer having a plurality of third openings, and a plurality of light emitting devices, one of the light emitting devices being located within each of the third openings;

in an orthographic projection onto the substrate, the third opening is located within the second opening.

9. The display panel of claim 8, wherein the third opening is located within the first opening in front projection to the substrate.

10. The display panel according to any one of claims 1 to 5, further comprising: the touch structure is positioned between the packaging structure and the first insulating layer and comprises at least one conductive layer, and the conductive layer is a grid structure formed by interweaving metal wires; the first insulating layer comprises a first insulating strip surrounding the plurality of first openings, and the first insulating strip coats the metal wire.

11. The display panel according to claim 10, wherein a shortest distance between a boundary of the first insulating stripe and a boundary of the metal line is greater than or equal to 0.5 μm.

12. The display panel according to any one of claims 1 to 5, wherein the first insulating layer includes a first insulating stripe surrounding the plurality of first openings, and wherein a thickness of the first insulating stripe is 0.1 μm to 50.0 μm.

13. A display device comprising the display panel according to any one of claims 1 to 12, and a cover plate provided on a light emitting side of the display panel.

14. The display device according to claim 13, wherein the cover plate is in contact with a black matrix layer and a color filter layer in the display panel.

15. A method for manufacturing a display panel, comprising:

forming a packaging structure on one side of a substrate;