CN117650078B - Wafer chip mounter for manufacturing silicon parts - Google Patents
Wafer chip mounter for manufacturing silicon parts Download PDFInfo
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- CN117650078B CN117650078B CN202311545888.2A CN202311545888A CN117650078B CN 117650078 B CN117650078 B CN 117650078B CN 202311545888 A CN202311545888 A CN 202311545888A CN 117650078 B CN117650078 B CN 117650078B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 238000001914 filtration Methods 0.000 claims abstract description 49
- 239000012535 impurity Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- 238000011084 recovery Methods 0.000 claims description 26
- 238000005406 washing Methods 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 14
- 238000000227 grinding Methods 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 230000001788 irregular Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000005096 rolling process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to the technical field of chip manufacturing, and discloses a wafer chip mounter for manufacturing a silicon part, wherein a vacuum pump is used for sucking gas, so that the gas forms a rapid airflow flowing state, the air flows through fan blades, a driving gear I is driven to rotate through a connecting rod, so that the driving gear I is meshed with a receiving tooth I on a filter ring plate, the filter ring plate is rotated, only a part of the filter ring plate is in direct contact with the flowing air flow in a short time, the contacted part is in a continuously changed state, the filter ring plate disperses the capability of filtering the gas, the time interval of blocking the filter ring plate is prolonged, in the rotating process of the filter ring plate, the outer filter hole collides and rubs with an irregular protrusion on a separation plate, and the filter ring plate is enabled to shake up and down rapidly under the action of elasticity of a spring, so that impurities adsorbed on the filter ring plate are removed.
Description
Technical Field
The application relates to the technical field of chip manufacturing, in particular to a wafer chip mounter for manufacturing silicon parts.
Background
In the chip manufacturing production line, chips are required to be sent to corresponding positions of a substrate through a chip mounter, the chip mounter mainly sucks air through a vacuum suction nozzle, and the chips are moved onto the substrate under the control of an intelligent program to reciprocate until the chips on the substrate are attached.
In the process of the patch, because the vacuum suction nozzle sucks the gas near the suction nozzle through the vacuum pump to form negative pressure, a gas filtering device is required to be arranged in front of the vacuum pump, impurities (dust in the air, impurities falling from chips and substrates, abrasion falling from the suction nozzle in the moving process and the like) contained in the sucked gas are filtered, the existing filtering device mostly adopts a mode of overlapping a plurality of layers of filter plates to filter, the filter plates on the first layer are in contact with the gas at the first time, most of the impurities are intercepted by the first layer of filter plates, the first layer of filter plates are easy to block, at the moment, the filter plates on the later layers have strong filtering capacity, but the suction force of the vacuum pump is weakened due to the filter plates on the first layer of blocking, so that the suction force of the suction nozzle on the chips is weakened, the chip position deviation and falling easily occur, the patch effect of the patch machine is influenced, at the moment, shutdown treatment is required, the filter devices are cleaned and replaced, and the operation efficiency of the patch machine is influenced.
Disclosure of Invention
The application provides a wafer chip mounter for manufacturing silicon parts, which has the advantages that an air flow sucked by a vacuum pump impacts fan blades to drive a driving gear I to rotate, the driving gear I is meshed with a receiving tooth I to enable a filter ring plate to rotate, the direct contact part between the rotating filter ring plate and the air flow is continuously changed, the filtering time of the filter ring plate is prolonged, the rotating filter ring plate contacts with protrusions on a separation plate to shake, the shake filter ring plate shakes out adsorbed impurities, the impurities float upwards and are blocked by a sponge layer, the sponge layer enters cleaning water and is rolled by a rolling and washing roller to remove the impurities, and the sponge layer is rolled by a drying roller to remove water to form an empty state.
In order to achieve the above purpose, the application adopts the following technical scheme: the wafer chip mounter for manufacturing the silicon parts comprises a pneumatic seat and a filtering seat, wherein one side of the pneumatic seat is connected with the filtering seat through a bolt, a power chamber is arranged in the pneumatic seat, and a transmission device is arranged in the power chamber; the driving device comprises a positioning seat, a connecting rod and a driving gear I, wherein the positioning seat is connected in a power chamber through a bolt, a groove is formed in the connecting rod, the middle part of the positioning seat is in a ring shape and sleeved on the groove of the connecting rod, the driving gear I is connected to one end of the connecting rod, and fan blades which are uniformly distributed are arranged at the other end of the connecting rod and used for receiving the power of air flow to drive the driving gear I to rotate; the filter seat is internally provided with a movable chamber, an exhaust port and a cleaning chamber, the exhaust port is communicated with the top of the movable chamber and is used for discharging air flow in the movable chamber, an annular filter ring plate is sleeved in the movable chamber, the inner side wall of the filter ring plate is circumferentially provided with uniformly distributed receiving teeth I, the receiving teeth I are meshed with a driving gear I and are used for driving the filter ring plate to continuously rotate, and the contact position of the filter ring plate and the air flow is changed; the cleaning chamber is located below the movable chamber, and a cleaning system is arranged between the movable chamber and the cleaning chamber and used for cleaning impurities adsorbed on the filtering ring plate.
Preferably, a suction nozzle is arranged at the bottom of the pneumatic seat, an air flow channel is arranged in the pneumatic seat, and the suction nozzle is communicated with the power chamber through the air flow channel and is used for forming a negative pressure adsorption chip at the suction nozzle.
Preferably, the cross section of the movable chamber is circular, a port communicated with the movable chamber is arranged on one side of the power chamber away from the airflow channel, and the port is positioned on the inner side of the filter ring plate and used for introducing airflow into the inner side range of the filter ring plate so as to promote the airflow to pass through the filter ring plate to be discharged out of the movable chamber.
Preferably, the movable chamber is provided with a semi-annular supporting ring on the side wall far away from the pneumatic seat, and the inner side wall of the filtering ring plate is attached to the outer side of the supporting ring for maintaining the height position of the filtering ring plate in the rotation process.
Preferably, the filter ring plate is divided into a semicircular filter plate I and a semicircular filter plate II, the sections of the semicircular filter plate I and the semicircular filter plate II are annular, the joint of the semicircular filter plate I and the semicircular filter plate II is in a staggered lamination ladder shape, and the joint is provided with uniformly distributed springs for providing resetting power for relative movement of the semicircular filter plate I and the semicircular filter plate II.
Preferably, the bottom of the movable chamber is provided with an arc-shaped bouncing groove, a partition between the cleaning chamber and the bouncing groove forms a partition plate, the partition plate is provided with rough and uneven protrusions right against the wall of the movable chamber and used for rubbing the filter holes on the outer side wall of the filter ring plate, and the elastic action of the semicircular filter plate I and the semicircular filter plate II is formed by matching with a spring.
Preferably, the bottom of the filter seat is provided with a water inlet pipe and a water outlet pipe, and one ends of the water inlet pipe and the water outlet pipe are communicated with the cleaning chamber and are used for forming a flowing water environment in the cleaning chamber.
Preferably, the cleaning system comprises a recovery cylinder, a sponge layer, uniformly distributed receiving teeth II, uniformly distributed grinding and washing rollers, uniformly distributed drying rollers, a power motor and a driving gear II, wherein the sponge layer is adhered to the inner side wall of the recovery cylinder, the receiving teeth II are uniformly distributed in the center of the outer side wall of the recovery cylinder, the driving gear II is meshed with the receiving teeth II, the output end of the power motor is fixedly connected with the driving gear II and used for driving the recovery cylinder to continuously rotate, and the recovery cylinder penetrates through the inner side bottom of the filtering annular plate and the cleaning chamber and is used for absorbing impurities in the moving chamber and bringing the impurities into water in the cleaning chamber.
Preferably, the rolling and washing rollers are circumferentially and uniformly distributed in the cleaning chamber, two ends of the rolling and washing rollers are inserted into two end side walls of the cleaning chamber, which are the same as the recovery cylinder in the axial direction, the drying rollers are movably sleeved in the filtering seat, and the rolling and washing rollers and the drying rollers are uniformly pressed on the sponge layer and used for rolling the sponge layer to remove impurities and moisture on the sponge layer.
Preferably, a rotary groove for the movement of the recovery cylinder is formed in the filter seat, and a space for the movement of the driving gear II and the receiving gear II is formed in the filter seat.
The application has the following beneficial effects:
according to the wafer chip mounter for manufacturing the silicon parts, the vacuum pump is used for sucking gas, so that the gas forms a rapid airflow flowing state, the air flows through the fan blades, the driving gear I is driven to rotate through the connecting rod, the driving gear I is meshed with the receiving teeth I on the filter ring plate, the filter ring plate is rotated, only a part of the filter ring plate is in direct contact with the flowing air flow in a short time, the contacted part is in a continuously changed state, the filter ring plate disperses the capacity of filtering the gas, and the time interval that the filter ring plate is blocked is prolonged.
Meanwhile, the filtering ring plate rotates to the semicircular filter plate I above the isolation plate (taking the semicircular filter plate I as an example and the semicircular filter plate II as the same) in the rotating process, the filtering holes on the outer side collide and rub with irregular protrusions on the isolation plate, and the elastic force of the springs is matched, so that the semicircular filter plate I can shake up and down rapidly, the impurities adsorbed on the inner side of the semicircular filter plate I are separated under shaking and the suction force of the vacuum pump, float in the movable chamber and flow upwards under the suction force of the vacuum pump (the inner side surface of the filtering ring plate is firstly contacted with gas, and the impurities are mainly positioned at the position of the filtering ring plate close to the inner side surface), thereby cleaning the impurities adsorbed on the filtering ring plate.
Simultaneously, the impurity that upwards flows in the activity room, the majority will be absorbed by the sponge layer of semicircle filter plate I top, a small part will cross the recovery section of thick bamboo, be absorbed by semicircle filter plate II more the top, and the recovery section of thick bamboo will drive the sponge layer and rotate, make the sponge layer that has impurity rotate to the cleaning chamber, submerge in the flowing water, along with the rotation of sponge layer, make the roll wash the roller roll the sponge layer, cause the impurity in the sponge layer to break away from the sponge layer, taken away by flowing water, after the sponge layer takes off the washing water, can receive the roll of dry roller again, cause the moisture in the sponge layer to be discharged, after the sponge layer gets into the activity is indoor, be in the idle state again, carry out high-efficient absorption to the impurity in the activity room, thereby accomplish the clearance to the impurity on the filtration ring board, further extension filtration ring board's effective filtration time.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
The application may be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic diagram showing the distribution of the internal structure of the present invention;
FIG. 3 is a schematic view of the internal structure of the pneumatic seat of the present invention;
FIG. 4 is a schematic view of the internal structure of the filter base of the present invention;
FIG. 5 is a schematic view of a filter base according to the present invention;
FIG. 6 is a schematic diagram showing the structural distribution of the cleaning system according to the present invention;
FIG. 7 is a schematic view of the position of a filter ring plate according to the present invention;
FIG. 8 is a schematic view of a connecting rod structure according to the present invention;
FIG. 9 is a schematic view of the structure of the filter ring plate of the present invention.
Reference numerals:
1. a pneumatic seat; 2. a suction nozzle; 3. an air flow channel; 4. a power chamber; 5. a positioning seat; 6. a connecting rod; 7. a driving gear I; 8. a filter base; 9. a movable chamber; 91. a spring groove; 10. an exhaust port; 11. a cleaning chamber; 12. a support ring; 13. a partition plate; 14. semicircular filter plates I; 15. a semicircular filter plate II; 16. a spring; 17. receiving teeth I; 18. a recovery cylinder; 19. a sponge layer; 20. receiving tooth II; 21. a milling roller; 22. a drying roller; 23. a rotating groove; 24. a power motor; 25. a driving gear II; 26. a water inlet pipe; 27. and (5) a water drain pipe.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Example 1
Referring to fig. 1 to 3 and fig. 6, a wafer chip mounter for manufacturing silicon parts includes a pneumatic base 1, a vacuum pump (existing device) for exhausting air, and a water circulation device (existing device), wherein an air flow channel 3 is provided in the pneumatic base 1, a suction nozzle 2 is fixedly connected to the bottom end of the pneumatic base 1, a power chamber 4 is provided at the top of the pneumatic base 1, the suction nozzle 2 is connected with the power chamber 4 through the air flow channel 3, so that suction force provided by the vacuum pump can enable air flow to enter the air flow channel 3 through the suction nozzle 2, and negative pressure is formed in the suction nozzle 2, so that the suction nozzle 2 can suck chips below.
Referring to fig. 2, 6-8, a positioning seat 5 is fixedly connected in a power chamber 4 through bolts, the middle part of the positioning seat 5 is annular, a connecting rod 6 is movably sleeved at the center of the positioning seat 5, an annular groove is formed in the connecting rod 6, the positioning seat 5 is sleeved in the groove of the connecting rod 6, the axial position of the connecting rod 6 is fixed by the positioning seat 5, fan blades uniformly distributed are arranged on one side, opposite to an air flow channel 3, of the connecting rod 6, one end, far away from the air flow channel 3, of the connecting rod 6 is fixedly connected with a driving gear I7 through bolts, when air flows through the power chamber 4, the fan blades are impacted, the fan blades drive the connecting rod 6 to rotate, so that the driving gear I7 is driven to rotate, a port communicated with the outside is formed in one side, far away from the air flow channel 3, of the power chamber 4, and the driving gear I7 protrudes out of the port.
Referring to fig. 4 to 5, one end of the pneumatic seat 1 far away from the air flow channel 3 is fixedly connected with a filter seat 8 through a bolt, a movable chamber 9, an exhaust port 10 and a cleaning chamber 11 are arranged in the filter seat 8, the section of the movable chamber 9 is circular, the movable chamber 9 is communicated with the power chamber 4 through a port formed in the power chamber 4, a driving gear I7 stretches into the movable chamber 9, so that air flow enters the movable chamber 9 from the power chamber 4, and filtering of a filter ring plate is waited.
Referring to fig. 2, fig. 4 to fig. 7, the side wall of the movable chamber 9 far away from the pneumatic seat 1 is fixedly connected with a semi-annular supporting ring 12, an annular filtering ring plate is movably sleeved in the movable chamber 9, the thickness of the filtering ring plate can be changed according to actual demands, the two axial sides of the filtering ring plate are attached to the two side walls of the movable chamber 9, so that gas entering the movable chamber 9 can leave the movable chamber 9 only through the filtration of the filtering ring plate, the inner side wall of the filtering ring plate is attached to the outer side of the supporting ring 12, the supporting ring 12 is matched with the inner side wall of the movable chamber 9 and the driving gear I7, the filtering ring plate is supported, the center position of the filtering ring plate is kept unchanged in the rotation process, receiving teeth I17 uniformly distributed are fixedly connected to one side of the inner side wall of the filtering ring plate close to the power chamber 4, the receiving teeth I17 are meshed with the driving gear I7, after the gas flow in the power chamber 4 enters the movable chamber 9 through a port, the inner side space of the filtering ring plate is enabled to be meshed with the receiving teeth I17 on the filtering ring plate, the filtering ring plate is enabled to rotate, the filtering ring plate is enabled to be enabled to rotate, the filtering ring plate is enabled to keep in a direct contact with the filtering ring position in a short time, and the filtering ring is enabled to be blocked, and the filtering ring is enabled to be in a contact position is not to be changed, and the filtering position is enabled to be in a contact with the filtering ring position is directly, and the filtering ring is not blocked.
Referring to fig. 5, the exhaust port 10 is connected to the top of the movable chamber 9, the exhaust port 10 is connected to the vacuum pump, so that the gas in the movable chamber 9 can flow upward and be discharged through the exhaust port 10, and in this process, the flowing gas flow is directly contacted with the part of the filter ring plate below the exhaust port 10 for filtering.
Example two
Referring to fig. 2, 4, 7 and 9, based on the first embodiment, the filter ring plate is divided into a semicircular filter plate i 14 and a semicircular filter plate ii 15, the sections of the semicircular filter plate i 14 and the semicircular filter plate ii 15 are all annular, the joint of the semicircular filter plate i 14 and the semicircular filter plate ii 15 is in a staggered and laminated ladder shape, and springs 16 are fixedly connected to the joint, so that the semicircular filter plate i 14 and the semicircular filter plate ii 15 can move up and down relatively, the springs 16 provide power for resetting the semicircular filter plate i 14 and the semicircular filter plate ii 15, the edge of the joint of the semicircular filter plate i 14 and the semicircular filter plate ii 15 is arranged in an arc shape (the edge is rounded), and the problem that the edge of the joint is blocked due to collision when the semicircular filter plate i 14 and the semicircular filter plate ii 15 move up and down is avoided.
Referring to fig. 4 to 5, fig. 7, the cleaning chamber 11 is located below the movable chamber 9, an arc-shaped spring groove 91 is formed at the bottom of the movable chamber 9, a partition between the cleaning chamber 11 and the spring groove 91 forms a partition plate 13, the partition plate 13 is opposite to a wall of the movable chamber 9 and is provided with rough protrusions, so that the filter ring plate rotates to a semicircular filter plate i 14 above the partition plate 13 (taking the semicircular filter plate i 14 as an example and the semicircular filter plate ii 15 as well) in the rotating process, the filter holes on the outer side collide and rub with the irregular protrusions on the partition plate 13, and the semicircular filter plate i 14 is rapidly vibrated up and down under the action of the elasticity of the springs 16, so that impurities adsorbed on the inner side of the semicircular filter plate i 14 are separated under the vibration and the suction force of the vacuum pump, float in the movable chamber 9, and flow upward under the vacuum pump (the inner side of the filter ring plate contacts gas first, and the impurities are mainly located at the position of the filter ring plate near the inner side), so that impurities adsorbed on the filter ring plate are cleaned.
Example III
Referring to fig. 1 to 2 and fig. 6 to 7, on the basis of the second embodiment, a water inlet pipe 26 and a water outlet pipe 27 are fixedly connected to the bottom of the filter seat 8, one ends of the water inlet pipe 26 and the water outlet pipe 27 are connected to the cleaning chamber 11, and the other ends of the water inlet pipe 26 and the water outlet pipe 27 are connected to a water circulation device, so that water flows in the cleaning chamber 11, and impurities in the cleaning chamber 11 are taken away.
Referring to fig. 2, 4 and 6-7, a rotary groove 23 is formed in the bottoms of the pneumatic seat 1 and the filter seat 8, a recovery cylinder 18 is movably sleeved in the rotary groove 23, the recovery cylinder 18 is hollow cylindrical, the recovery cylinder 18 penetrates through the inner bottom of the filter ring plate and the cleaning chamber 11, a sponge layer 19 is fixedly connected to the inner side wall of the recovery cylinder 18, so that most of impurities floating in the movable chamber 9 can be blocked by the sponge layer 19, and a small amount of floating impurities can flow upwards and be re-absorbed by the part of the filter ring plate above.
Referring to fig. 2, fig. 4, fig. 6 to fig. 7, the circumferentially uniformly distributed grinding and washing rollers 21 are movably sleeved in the cleaning chamber 11, two ends of the grinding and washing rollers 21 are inserted into side walls of two ends of the cleaning chamber 11, which are the same as the axial direction of the recovery cylinder 18, so that two ends of the grinding and washing rollers 21 are supported, the positions of the grinding and washing rollers are fixed during rotation, the circumferentially distributed drying rollers 22 are movably sleeved in the filter seat 8, the circumferentially distributed grinding and washing rollers 21 and the drying rollers 22 are concentric with the recovery cylinder 18, the grinding and washing rollers 21 and the drying rollers 22 are uniformly pressed on the sponge layer 19, the recovery cylinder 18 rotates the sponge layer 19 with impurities, the sponge layer 19 with impurities is rotated into the cleaning chamber, the sponge layer 19 is immersed into flowing water, the sponge layer 19 passes through the grinding and washing rollers 21 along with the rotation of the sponge layer 19, the sponge layer 19 is rolled and crushed by the grinding rollers 21, the impurities in the sponge layer 19 are separated from the sponge layer, the flowing water is taken away by the drying rollers 22, the positions of the drying rollers 22 are higher than the liquid level in the cleaning chamber 11, the sponge layer 19 is cleaned, the sponge layer 19 is continuously rotated upwards, the sponge layer 19 is continuously rolled up, and the sponge layer 19 is in a state when the sponge layer 19 is rolled up again, and the sponge layer is in a state of being rolled again, and the sponge layer is in a state again in a state is rolled up, and the sponge layer is in the state is in a state continuously rolled.
Referring to fig. 1, 6 to 7, a receiving gear ii 20 circumferentially distributed is fixedly connected to the center of the outer side wall of the recovery cylinder 18, one end of the filter seat 8 is fixedly connected with a power motor 24, the output end of the power motor 24 is fixedly connected with a driving gear ii 25, the driving gear ii 25 is meshed with the receiving gear ii 20, a space for the driving gear ii 25 and the receiving gear ii 20 to move is formed in the filter seat 8, so that the power motor 24 can drive the recovery cylinder 18 to continuously rotate through the driving gear ii 25 and the receiving gear ii 20, and the steps of absorbing impurities, discharging impurities and drying of the sponge layer 19 are completed.
Claims (10)
1. The wafer chip mounter for manufacturing the silicon parts is characterized by comprising a pneumatic seat (1) and a filter seat (8) connected with one side of the pneumatic seat (1) through bolts, wherein a power chamber (4) is arranged in the pneumatic seat (1), and a transmission device is arranged in the power chamber (4);
The transmission device comprises a positioning seat (5), a connecting rod (6) and a driving gear I (7), wherein the positioning seat (5) is connected in a power chamber (4) through a bolt, a groove is formed in the connecting rod (6), the middle part of the positioning seat (5) is sleeved on the groove of the connecting rod (6) in a ring shape, the driving gear I (7) is connected to one end of the connecting rod (6), and fan blades which are uniformly distributed are arranged at the other end of the connecting rod (6) and used for receiving the power of air flow to drive the driving gear I (7) to rotate;
The filter seat (8) is internally provided with a movable chamber (9), an exhaust port (10) and a cleaning chamber (11), the exhaust port (10) is communicated with the top of the movable chamber (9) and is used for discharging air flow in the movable chamber (9), an annular filter ring plate is sleeved in the movable chamber (9), the inner side wall of the filter ring plate is circumferentially provided with uniformly distributed receiving teeth I (17), and the receiving teeth I (17) are meshed with the driving gear I (7) and are used for driving the filter ring plate to continuously rotate so as to change the contact position of the filter ring plate and the air flow;
the cleaning chamber (11) is located below the movable chamber (9), and a cleaning system is arranged between the movable chamber (9) and the cleaning chamber (11) and used for cleaning impurities adsorbed on the filtering ring plate.
2. The wafer chip mounter for manufacturing silicon parts according to claim 1, wherein a suction nozzle (2) is arranged at the bottom of the pneumatic seat (1), an air flow channel (3) is arranged in the pneumatic seat (1), and the suction nozzle (2) is communicated with the power chamber (4) through the air flow channel (3) for forming a negative pressure adsorption chip at the suction nozzle (2).
3. Wafer placement machine for manufacturing silicon components according to claim 1, characterized in that the movable chamber (9) has a circular cross section, the side of the power chamber (4) facing away from the air flow channel (3) is provided with a port communicating with the movable chamber (9), which port is located inside the filter ring plate for introducing the air flow into the inner area of the filter ring plate, forcing the air flow to have to pass the filter ring plate for the air flow to exit the movable chamber (9).
4. A wafer placement machine for manufacturing silicon components according to claim 3, characterized in that a semi-annular supporting ring (12) is arranged on the side wall of the movable chamber (9) far away from the pneumatic seat (1), and the inner side wall of the filtering ring plate is attached to the outer side of the supporting ring (12) for maintaining the height position of the filtering ring plate in the rotation process.
5. The wafer chip mounter for manufacturing silicon parts according to claim 1, wherein the filter ring plate is divided into a semicircular filter plate I (14) and a semicircular filter plate II (15), the sections of the semicircular filter plate I (14) and the semicircular filter plate II (15) are all annular, the joint of the semicircular filter plate I (14) and the semicircular filter plate II (15) is in a staggered lamination step shape, and the joint is provided with uniformly distributed springs (16) for providing resetting power for relative movement of the semicircular filter plate I (14) and the semicircular filter plate II (15).
6. The wafer chip mounter for manufacturing silicon parts according to claim 5, wherein an arc-shaped bouncing groove (91) is formed at the bottom of the movable chamber (9), a partition between the cleaning chamber (11) and the bouncing groove (91) forms a partition plate (13), rough protrusions are arranged on the wall, opposite to the movable chamber (9), of the partition plate (13) for rubbing the filtering holes on the outer side wall of the filtering ring plate, and the elastic action of the semicircular filter plates I (14) and II (15) is formed by matching with springs (16).
7. Wafer placement machine for manufacturing silicon components according to claim 1, characterized in that the bottom of the filter holder (8) is provided with a water inlet pipe (26) and a water outlet pipe (27), one end of both the water inlet pipe (26) and the water outlet pipe (27) being connected to the cleaning chamber (11) for creating a flowing water environment in the cleaning chamber (11).
8. The wafer chip mounter for manufacturing silicon parts according to claim 1, wherein the cleaning system comprises a recovery cylinder (18), a sponge layer (19), uniformly distributed receiving teeth II (20), uniformly distributed grinding and washing rollers (21), uniformly distributed drying rollers (22), a power motor (24) and a driving gear II (25), wherein the sponge layer (19) is adhered to the inner side wall of the recovery cylinder (18), the receiving teeth II (20) are uniformly distributed in the center of the outer side wall of the recovery cylinder (18), the driving gear II (25) is meshed with the receiving teeth II (20), the output end of the power motor (24) is fixedly connected with the driving gear II (25) and used for driving the recovery cylinder (18) to continuously rotate, and the recovery cylinder (18) penetrates through the inner bottom of the filtering ring plate and the cleaning chamber (11) and is used for absorbing impurities in a movable chamber and bringing the impurities into water in the cleaning chamber (11).
9. The wafer chip mounter for manufacturing silicon parts according to claim 8, wherein the grinding and washing rollers (21) are circumferentially and uniformly distributed in the cleaning chamber (11), two ends of the grinding and washing rollers (21) are inserted into two end side walls of the cleaning chamber (11) which are the same as the axial direction of the recovery cylinder (18), the drying roller (22) is movably sleeved in the filter seat (8), the grinding and washing rollers (21) and the drying roller (22) are uniformly pressed on the sponge layer (19), and impurities and moisture on the sponge layer (19) are removed by the grinding and washing rollers (21).
10. The wafer placement machine for manufacturing silicon parts according to claim 9, wherein a rotating groove (23) for the movement of the recovery cylinder (18) is formed in the filter base (8), and a space for the movement of the driving gear ii (25) and the receiving gear ii (20) is formed in the filter base (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311545888.2A CN117650078B (en) | 2023-11-20 | 2023-11-20 | Wafer chip mounter for manufacturing silicon parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311545888.2A CN117650078B (en) | 2023-11-20 | 2023-11-20 | Wafer chip mounter for manufacturing silicon parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117650078A CN117650078A (en) | 2024-03-05 |
| CN117650078B true CN117650078B (en) | 2024-05-14 |
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| CN202311545888.2A Active CN117650078B (en) | 2023-11-20 | 2023-11-20 | Wafer chip mounter for manufacturing silicon parts |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200193019Y1 (en) * | 1999-12-04 | 2000-09-01 | 유시흥 | An apparatus for filtering gas |
| KR20040088961A (en) * | 2003-04-14 | 2004-10-20 | 엘지전자 주식회사 | Upright cleaner |
| JP2012199461A (en) * | 2011-03-23 | 2012-10-18 | Hitachi High-Tech Instruments Co Ltd | Die bonder |
| CN209105551U (en) * | 2018-08-31 | 2019-07-12 | 鑫创鑫自动化设备科技（漳州）有限公司 | A kind of chip mounter suction nozzle with dredge blockage impurity |
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2023
- 2023-11-20 CN CN202311545888.2A patent/CN117650078B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200193019Y1 (en) * | 1999-12-04 | 2000-09-01 | 유시흥 | An apparatus for filtering gas |
| KR20040088961A (en) * | 2003-04-14 | 2004-10-20 | 엘지전자 주식회사 | Upright cleaner |
| JP2012199461A (en) * | 2011-03-23 | 2012-10-18 | Hitachi High-Tech Instruments Co Ltd | Die bonder |
| CN209105551U (en) * | 2018-08-31 | 2019-07-12 | 鑫创鑫自动化设备科技（漳州）有限公司 | A kind of chip mounter suction nozzle with dredge blockage impurity |
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| CN117650078A (en) | 2024-03-05 |
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