CN117650069A - Wafer detection system and method for groove type cleaning equipment - Google Patents
Wafer detection system and method for groove type cleaning equipment Download PDFInfo
- Publication number
- CN117650069A CN117650069A CN202311368090.5A CN202311368090A CN117650069A CN 117650069 A CN117650069 A CN 117650069A CN 202311368090 A CN202311368090 A CN 202311368090A CN 117650069 A CN117650069 A CN 117650069A
- Authority
- CN
- China
- Prior art keywords
- wafer
- sensor
- detected
- sensors
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 66
- 238000004140 cleaning Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 49
- 235000012431 wafers Nutrition 0.000 claims abstract description 225
- 230000008569 process Effects 0.000 claims abstract description 39
- 238000004891 communication Methods 0.000 claims abstract description 8
- 238000007689 inspection Methods 0.000 claims description 22
- 230000002159 abnormal effect Effects 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000012634 fragment Substances 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/04—Systems determining the presence of a target
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application discloses a wafer detection system and method of a groove type cleaning device, wherein the system comprises a sensor bracket; the first sensors are arranged along the extending direction of the sensor support and are used for detecting whether wafers to be detected exist in the detection range; the second sensors are arranged in a plurality of pairs along the extending direction of the sensor bracket, each pair of the second sensors is symmetrically arranged at two sides of the pre-stored wafer position, and the second sensors are used for detecting whether the wafer to be detected is inclined or not in the detection range; the control unit is in communication connection with the first sensor and the second sensor, and sends out an alarm prompt signal if no wafer to be detected exists in the detection range of the first sensor or an inclined wafer to be detected exists in the detection range of the second sensor. By adopting the scheme, the problems that the wafer falls, the wafer misplacement and the fragments cannot be detected to cause downtime and yield reduction can be solved in the operation process of the conventional groove type cleaning equipment.
Description
Technical Field
The application relates to the technical field of integrated circuit manufacturing and large silicon wafer manufacturing, in particular to a wafer detection system and method of a groove type cleaning device.
Background
In the manufacturing process of semiconductor large-size integrated circuits and large silicon wafers, the cleaning requirements are extremely high due to the process requirements, the silicon wafers are required to be cleaned to keep clean to meet the process requirements, the cleaning distribution penetrates through the whole manufacturing process, and the cleaning equipment is divided into single-wafer cleaning and groove type cleaning.
During the cleaning process of the trough type cleaning device, the batch wafers are lifted, lowered, taken out, placed and moved by the mechanical arm. The wafers are sequentially conveyed to each process tank according to the steps to carry out cleaning operation, and the wafers are orderly arranged. In the cleaning process, the number of the process grooves is more than ten, the length of the machine body is more than ten meters, and three and four mechanical arms are used for distributing and managing the wafer movement of each process groove. In the cleaning process, when the mechanical arm grabs and moves the wafer, the wafer can incline and fall due to the scouring of circulating liquid and mechanical movement (swinging) in the process tank, so that the phenomenon of taking off the tank is caused. In a transition groove (namely a groove body in which two mechanical arms are commonly inserted, namely a left mechanical arm is put in, and a right mechanical arm is taken out), wafers are exposed to dark cracks, fragments and the like caused by ultrasonic waves, liquid flushing or mechanical swinging, and abnormal phenomena such as inclination, dislocation and overlapping of the wafers in the groove occur. Therefore, detection of the above-described abnormal phenomenon is particularly important in the cleaning process. In the current detection method, the correlation type photoelectric sensors at the left end and the right end of the process groove are used for detecting whether the wafer exists or not and judging whether the mechanical arm is opened or closed or not, but the detection method can only detect whether the wafer exists or not and cannot detect whether the wafer is inclined or not, as shown in fig. 1, when the correlation type photoelectric sensor 10 tilts the wafer 20, the detection result of the wafer 20 still can be fed back, abnormal conditions of the wafer tilting cannot be found in time, and the wafer damage condition possibly occurs along with the continuous operation of the mechanical arm.
Disclosure of Invention
The application aims to solve the technical problem that a wafer detection scheme in groove type cleaning equipment in the prior art cannot accurately detect wafer inclination or is small in number.
Aiming at the technical problems, the application provides the following technical scheme:
in a first aspect, the present application provides a wafer inspection system for a tank cleaning apparatus, comprising:
the sensor bracket is fixedly connected with one gripper of the mechanical arm, and the sensor bracket is arranged above the wafer to be tested and the extending direction of the sensor bracket is parallel to the central axis of the wafer to be tested;
the first sensors are arranged along the extending direction of the sensor support, the intervals between two adjacent first sensors are matched with the intervals between adjacent wafers to be detected, and the first sensors are used for detecting whether the wafers to be detected exist in the detection range;
the second sensors are arranged in a plurality of pairs along the extending direction of the sensor bracket, each pair of the second sensors is symmetrically arranged at two sides of the pre-stored wafer position, and the second sensors are used for detecting whether the wafer to be detected is inclined or not in the detection range;
and the control unit is in communication connection with the first sensor and the second sensor, receives detection results of the first sensor and the second sensor, and sends out an alarm prompt signal if no wafer to be detected exists in the detection range of the first sensor or an inclined wafer to be detected exists in the detection range of the second sensor.
In some embodiments, the wafer inspection system of the tank cleaning apparatus, the first sensor is configured to emit a first vertical laser beam toward the wafer to be inspected, and a maximum transmission distance of the first vertical laser beam is a first preset distance; when the wafer to be detected is in the detection range of the first sensor, the first vertical laser beam is reflected by the wafer to be detected, and the first sensor detects the reflected first vertical laser beam and then judges that the wafer to be detected is present.
In some embodiments, the wafer inspection system of the tank cleaning apparatus is configured to emit a second vertical laser beam toward the wafer to be inspected, where when the second sensor detects an inclined wafer to be inspected, the second vertical laser beam is reflected by the inclined wafer to be inspected, and the second sensor determines that the inclined wafer to be inspected is present after detecting the reflected second vertical laser beam.
In some embodiments of the tank cleaning apparatus wafer inspection system, the number of the first sensors is the same as the maximum number of the wafers to be inspected; the number of pairs of the second sensors is the same as the maximum number of wafers to be tested.
In some embodiments, the wafer inspection system of the tank cleaning apparatus has a spacing between two adjacent first sensors of 5-20mm; the interval between each pair of the second sensors is matched with the thickness of the wafer to be tested.
In some aspects of the pod cleaning apparatus wafer inspection system, the spot areas of the first and second sensors are less than a set area, and the total weight of the first and second sensors is less than a set weight.
In some embodiments, the wafer inspection system of the tank cleaning apparatus is characterized in that the sensor rack is configured with a pair of fixing bars; one fixed rod is fixedly connected with the first side of one hand grip of the mechanical arm, and the other fixed rod is fixedly connected with the second side of the same hand grip of the mechanical arm.
In some embodiments, the wafer inspection system of the tank cleaning apparatus is further configured with a pair of diagonal braces; one diagonal draw bar is fixedly connected with the first side of one hand grip of the mechanical arm, and the other diagonal draw bar is fixedly connected with the second side of the same hand grip of the mechanical arm.
The pod cleaning device wafer inspection system of some aspects further comprising:
the opposite-incidence photoelectric sensors are symmetrically arranged at two sides of the process tank;
the correlation photoelectric sensor is used for detecting whether a wafer to be detected exists in the process tank;
and the control unit receives the detection result of the correlation photoelectric sensor, and controls the mechanical arm to stop running when no wafer to be detected exists in the process tank.
In a second aspect, the present application provides a method for detecting a wafer in a tank cleaning apparatus, including:
acquiring a detection result of a first sensor, and determining the number of wafers to be detected according to the detection result of the first sensor;
comparing whether the number of the wafers to be detected is the same as the number of the put wafers detected by a machine control system, and generating a first control signal if the number of the wafers to be detected is different from the number of the put wafers;
acquiring a detection result of a second sensor, and determining whether a wafer to be detected is in an inclined state according to the detection result of the second sensor;
generating a second control signal if the wafer to be tested is in an inclined state;
the first control signal is used for sending out an alarm prompt signal for prompting an abnormal state; the second control signal is used for sending an alarm prompt signal for prompting the mechanical arm to stop.
Compared with the prior art, the technical scheme of the application has the following technical effects:
according to the wafer detection system and method for the groove type cleaning equipment, the first sensor and the second sensor are arranged through the sensor support, whether the wafer to be detected is lack or not is detected through the first sensor, whether the wafer to be detected is inclined or not is detected through the second sensor, the detection results of the first sensor and the second sensor are received through the control unit, and accordingly whether the number of the wafer to be detected is lack or not and whether the wafer to be detected is inclined or not can be determined. By adopting the scheme, the problems that the wafer falls, the wafer misplacement and the fragments cannot be detected to cause downtime and yield reduction can be solved in the operation process of the conventional groove type cleaning equipment.
Drawings
The objects and advantages of the present application will be appreciated by the following detailed description of preferred embodiments thereof, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a prior art trench cleaning apparatus wafer inspection scheme;
FIG. 2 is a schematic diagram of a wafer inspection system of a tank cleaning apparatus according to one embodiment of the present application;
FIG. 3 is a schematic diagram illustrating a wafer inspection principle to be inspected according to one embodiment of the present application;
FIG. 4 is a schematic view of an assembly of a sensor holder according to one embodiment of the present disclosure;
fig. 5 is a flow chart of a method for inspecting a wafer in a tank cleaning apparatus according to one embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
In addition, the technical features described below in the different embodiments of the present application may be combined with each other as long as they do not collide with each other.
The present embodiment provides a wafer inspection system of a slot type cleaning apparatus, as shown in fig. 2 and 3, the cleaning apparatus includes a mechanical arm 11, the mechanical arm 11 is used to hold up or put down a wafer slot track 14, and a wafer 20 to be inspected is inserted into a wafer slot of the wafer slot track 14. The detection system comprises a first sensor 12, a second sensor 13 and a sensor bracket 31, wherein the sensor bracket 31 is fixedly connected with one gripper of the mechanical arm, and the sensor bracket 31 is arranged above the wafer 20 to be detected and the extending direction of the sensor bracket is parallel to the central axis of the wafer 20 to be detected; the first sensors 12 are arranged along the extending direction of the sensor support 31, the intervals between two adjacent first sensors 12 are matched with the intervals between adjacent wafers to be detected, and the first sensors 12 are used for detecting whether the wafers to be detected exist in the detection range; the second sensors 13 are arranged in a plurality of pairs along the extending direction of the sensor support 31, each pair of the second sensors 13 is symmetrically arranged at two sides of the pre-stored wafer position, and the second sensors 13 are used for detecting whether the wafer to be detected is inclined within the detection range. The system further comprises a control unit which is in communication connection with the first sensor 12 and the second sensor 13, wherein the control unit receives detection results of the first sensor 12 and the second sensor 13, and if no wafer to be detected exists in the detection range of the first sensor 12 or an inclined wafer to be detected exists in the detection range of the second sensor 13, an alarm prompt signal is sent.
The control unit can be in communication connection with a machine control module of the groove type cleaning equipment such as PLC (Programmable Logic Controller), EAP (Early Assessment Program) and MES (manufacturing execution management system), and the machine control module of the PLC, the EAP and the MES is used for realizing the on-line tracking and detecting of the state and the number of wafers to be detected in the whole process inside the machine in the machine operation process of the groove type cleaning equipment. The control unit sends detection results of whether the number of the wafers to be detected is missing or inclined to the machine station PLC and the machine station PC, transmits the detection results to the EPA, carries out information exchange confirmation with the MES through the EAP, returns to the machine station PLC, integrates the tail ends of the communication cables among the modules together, is downwards pulled and protected by the tank chain through the mechanical arm wiring, and is connected to the machine station PLC to form a communication loop.
In the above-described scheme, the first sensor 12 and the second sensor 13 may employ photoelectric detection sensors. The first sensors 12 are perpendicular to the central axis of the wafer to be measured, the number of wafers to be measured is detected, and the pitch of the adjacent first sensors 12 is adjusted in position according to the wafer groove pitch, for example, 10mm. The second sensor 13 is perpendicular to the central axis of the wafer to be tested, detects the state of the wafer to be tested, and the interval of the second sensor 13 can be adjusted according to the spacing between the wafer grooves. As shown, two adjacent pairs of second sensors may include three second sensors, i.e., when three consecutive second sensors are arranged in a row, the middle second sensor and the previous second sensor and the next second sensor form a sensor pair, respectively.
In the above-described configuration, the first sensor 12 and the second sensor 13 are disposed on the sensor holder 31, the first sensor 12 is used to detect whether the wafer 20 to be measured is absent, the second sensor 13 is used to detect whether the wafer 20 to be measured is inclined, and the control unit is used to receive the detection results of the first sensor 12 and the second sensor 13, so that it is possible to determine whether the number of wafers 20 to be measured is absent and whether the wafer 20 to be measured is inclined. The technical scheme can solve the problems of downtime and yield reduction caused by wafer falling, wafer dislocation and undetectable fragments in the operation process of the conventional groove type cleaning equipment.
As shown in fig. 3, the first sensor 12 is configured to emit a first vertical laser beam toward the direction of the wafer 20 to be measured, where a maximum transmission distance of the first vertical laser beam is a first preset distance; when the wafer 20 to be measured is located in the detection range of the first sensor 12, the first vertical laser beam is reflected by the wafer to be measured, and the first sensor 12 determines that the wafer 20 to be measured is located after detecting the reflected first vertical laser beam. Further, the second sensor 13 is configured to emit a second vertical laser beam toward the direction of the wafer 20 to be measured, where when the wafer 20 to be measured is inclined in the detection range of the second sensor 13, the second vertical laser beam is reflected by the wafer 20 to be measured, and the second sensor 13 determines that the wafer 20 to be measured is inclined after detecting the reflected second vertical laser beam.
In a specific implementation, the top of the wafer to be measured is curved, i.e. has a highest point, and the first sensor 12 is able to determine that the wafer to be measured is present when the first vertical laser beam emitted by the first sensor 12 is reflected back by the highest point. Since the detection range of the first sensor 12 is limited, if the first vertical laser beam emitted from the first sensor 12 is not reflected back within the detection range, it is indicated that there is no wafer 20 to be tested within the detection range of the first sensor 12, and the reason for this is that either the wafer to be tested is broken, such as the second wafer to be tested on the left side in fig. 2, or the wafer to be tested is not present at this position itself, whereby chipping and missing of the wafer can be detected. The thickness of the wafer 20 to be measured is smaller, a pair of second sensors 13 are respectively disposed at two sides of the wafer 20 to be measured, if the wafer 20 to be measured is not inclined, the second vertical laser beams emitted from the two second sensors 13 can be reflected back after being irradiated to the wafer groove, at this time, the transmission distance of the second vertical laser beams is longer, and if the wafer 20 to be measured is inclined, as the wafer at the rightmost edge in fig. 2 is inclined rightwards, the second vertical laser beams emitted from the second sensors at the right side are blocked by the inclined wafer to be measured and then reflected back, at this time, the stroke of the second vertical laser beams is greatly reduced, so that the inclined wafer to be measured can be accurately detected through reasonable arrangement of the second sensors 13.
In the above solution, the number of the first sensors 12 is the same as the maximum number of the wafers 20 to be tested; the number of pairs of the second sensors 13 is the same as the maximum number of the die 20 to be tested. That is, when each wafer 20 to be measured is inserted into each wafer pocket, the first sensor 12 is provided directly above each wafer 20 to be measured, and the second sensor 13 is provided directly above both sides of each wafer 20 to be measured.
As previously mentioned, the spacing between two adjacent first sensors 12 is 5-20mm, preferably 10mm; the interval between each pair of the second sensors 12 is matched with the thickness of the wafer 20 to be measured, so that a smaller redundant distance exists between the second vertical laser beam emitted by the second sensor 13 and the edge of the wafer to be measured which is normally placed vertically, that is, the inclination of the wafer 20 to be measured can be accurately detected.
Preferably, in the above aspect, the spot areas of the first sensor 12 and the second sensor 13 are smaller than a set area, and the total weight of the first sensor 12 and the second sensor 13 is smaller than a set weight. In particular, the spot areas of the first sensor 12 and the second sensor 13 are about 0.8mm×1.2mm; the detection distance of the first sensor 12 and the second sensor 13 is 250mm, the detection step is 18mm, the output form is NPN/PNP switching type, the environment illumination incandescent lamp 8000lux or less and the sunlight 8000lux or less are used, the light source type is green laser, the wavelength is 505nm, and the light source type is preferably light source grade type 1 laser product (IEC 60825-1, FDA (CDRH) Part1040.10 x 1). In the scheme of the application, the protection level of the first sensor 12 and the second sensor 13 is IP65/IP67 (IEC 60529), the environment temperature is-10 ℃ to +50 ℃ (no freezing), the environment humidity is 35-85% RH (no condensation), and the probe part material: a shell: SUS316L, lens cover: PSU, gasket: FKM (lens cap), EVM (cable portion), size of probe: 27mm long, 17mm wide and 9.4mm high; the selected materials meet the requirements of cleaning equipment and acid and alkali resistant environments. In the above scheme, the detection surface of the first sensor 12 is located at the position 100mm below the gripper of the mechanical arm after being mounted, the distance between the detection surface and the highest point of the wafer to be detected is 200mm, and the number of the first sensors 12 is 25 in one-to-one matching with the number of the wafer to be detected. After the mechanical arm grabs the wafer to be detected, the second vertical light beams emitted by the second sensor 13 are located at 7.6 degrees or 15.2 degrees on the left side or the right side of the front center point of the wafer to be detected, the specific angle can be finely adjusted according to the precision requirement of the second sensor 13, the number of the second sensors 13 is matched with the space between the wafers to be detected, and in the scheme, the number of the second sensors 13 is one more than that of the wafers to be detected 20, namely 26.
Further, the individual components of the first sensor 12 and the second sensor 13 weigh about 90 grams and the total weight is about 4590 grams. The mounting and fixing materials of the first sensor 12 and the second sensor 13 are PVDF, so that the acid-base environment requirements of the cleaning equipment are met. As shown in fig. 4, a sensor bracket 31 for mounting the first sensor 12 and the second sensor 13 is provided with a pair of fixing bars 32; one fixed rod 32 is fixedly connected with a first side 302 of one hand grip of the mechanical arm, the other fixed rod is fixedly connected with a second side 303 of the same hand grip of the mechanical arm, and the two fixed rods are 300mm long, 50mm wide, 5mm thick and 133.5 g in weight. The sensor holder 31 is further provided with a pair of diagonal braces 33; one diagonal draw bar 33 is fixedly connected with the first side 302 of one hand grip of the mechanical arm, the other diagonal draw bar 33 is fixedly connected with the second side 303 of the same hand grip of the mechanical arm, and the two diagonal draw bars are 300mm long, 50mm wide, 5mm thick and 133.5 g in weight. As shown in the figure, the mechanical arm gripper push rod 301 is used for driving the sensor support and each sensor to move, and a motor connected with the push rod 301 can meet the load requirement by increasing power.
Further preferably, as shown in fig. 2, the system further comprises an opposite-emitting photoelectric sensor 10 symmetrically arranged at two sides of the process tank; the correlation photoelectric sensor 10 is used for detecting whether a wafer 20 to be detected exists in the process tank; the control unit receives the detection result of the correlation photoelectric sensor 10, and controls the mechanical arm to stop running when the wafer 20 to be detected is not in the process tank. Through this scheme, can double assurance not have the wafer that awaits measuring when, stop operation arm. The first guarantee is to use the first sensor 12 and the second sensor 13, if the first sensor 12 detects that no wafer to be tested is detected, the second sensor 13 also detects that no wafer to be tested is inclined, and the wafer to be tested is also determined to be absent in the process tank, so that in order to improve the detection precision, the correlation photoelectric sensor 10 further determines that the misoperation of the mechanical arm is avoided.
Some embodiments of the present application further provide a method for detecting a wafer in a tank cleaning apparatus, as shown in fig. 5, including:
s10: and obtaining a detection result of the first sensor, and determining the number of wafers to be detected according to the detection result of the first sensor.
S20: comparing whether the number of the wafers to be detected is the same as the number of the put wafers detected by the machine control system, and generating a first control signal if the number of the wafers to be detected is different from the number of the put wafers. When the groove type cleaning machine is operated, after the machine scans the ID information of the wafer groove, the MES system exchanges data with the machine PLC, and the machine PLC can automatically acquire the quantity of the batch of wafers to be tested entering the machine as the quantity of the wafers to be placed.
S30: and acquiring a detection result of a second sensor, and determining whether the wafer to be detected is in an inclined state according to the detection result of the second sensor.
S40: and if the wafer to be tested is in an inclined state, generating a second control signal.
S50: the first control signal is used for sending out an alarm prompt signal for prompting an abnormal state; the second control signal is used for sending an alarm prompt signal for prompting the mechanical arm to stop.
By adopting the method, the groove type cleaning equipment tracks and detects the state and the number of wafers to be detected on line in the whole process inside the machine, is synchronous with MES, ensures that the wafers to be detected of each process groove are not abnormal before entering the machine and after entering the machine, has correct positions, monitors and detects the cleaning moving process in real time, ensures that the mechanical arm gives an alarm prompt at the first time when the wafers to be detected are in batches after entering the machine, and gives an alarm prompt for operators and equipment personnel to process in time when the mechanical arm gives an abnormality before carrying the wafers to be detected and before leaving the machine at any stage, and the alarm prompt can be an audible and visual alarm prompt. Through this scheme, avoid the mutual injury of wafer lamination that awaits measuring, the fish tail after the breakage improves the yield and avoids the loss of consumptive material to cleaning equipment's harm. The response feedback time of the equipment is improved, and the abnormality is eliminated, so that the occurrence of major downtime is avoided, the downtime is reduced, and the productivity is improved.
After the positions and the number of the wafers to be detected are accurately detected and no abnormal condition is confirmed through the scheme, the mechanical arm can convey the wafers to be detected, the wafers to be detected are released when the wafers to be detected reach the designated positions, and the wafers to be detected are placed in the process tank to start cleaning operation. After the cleaning operation is finished, the mechanical arm reaches the process tank, clamps the wafer tank track where the wafer to be tested is located, and is lifted at a low speed, after the wafer to be tested is separated from the liquid level of the process tank, the wafer to be tested is lifted to a designated height at a medium speed, the number and the positions of the wafer to be tested are repeatedly detected, and when the detection result has no abnormal condition, the wafer to be tested is conveyed to the next process tank. Because the above processes are all realized by an automatic mode, the time consumption is very short, and the conveying efficiency of the wafer to be tested is not affected. The above detection and handling process is repeated during the whole process from entering the machine to leaving the machine, and an alarm prompt or even a system is turned off as long as the wafer to be detected is found abnormal. Therefore, in the whole machine running process, each wafer to be detected is put into goods from the input and delivered, and the middle mechanical arm lifts the wafer to be detected and puts the wafer to be detected into the process groove each time, and the position and the number of the wafer to be detected and whether deviation lamination exists or not can be detected by the first sensor and the second sensor. The number of the mechanical arms in the machine is not limited, all the mechanical arms stop moving when detecting abnormality, the current position is kept, the machine program sends out instructions, and the hardware responds to the audible and visual alarm to wait for treatment. And after the equipment exception handling is completed, the alarm is reset. In addition, the number of the first sensors and the second sensors that are turned on may also be determined according to the number of the wafers to be tested, for example: although 25 wafers to be tested can be placed when the device is fully loaded, only 10 wafers to be tested are actually placed, and the wafers to be tested are placed at intervals, when the detection is executed, only the first sensor and the second sensor which correspond to the 10 wafers to be tested can be started, so that the energy consumption is saved, the operation data amount is reduced, and false alarm errors can be avoided.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While nevertheless, obvious variations or modifications are contemplated as falling within the scope of the present application.
Claims (10)
1. A pod cleaning apparatus wafer inspection system, comprising:
the sensor bracket is fixedly connected with one gripper of the mechanical arm, and the sensor bracket is arranged above the wafer to be tested and the extending direction of the sensor bracket is parallel to the central axis of the wafer to be tested;
the first sensors are arranged along the extending direction of the sensor support, the intervals between two adjacent first sensors are matched with the intervals between adjacent wafers to be detected, and the first sensors are used for detecting whether the wafers to be detected exist in the detection range;
the second sensors are arranged in a plurality of pairs along the extending direction of the sensor bracket, each pair of the second sensors is symmetrically arranged at two sides of the pre-stored wafer position, and the second sensors are used for detecting whether the wafer to be detected is inclined or not in the detection range;
and the control unit is in communication connection with the first sensor and the second sensor, receives detection results of the first sensor and the second sensor, and sends out an alarm prompt signal if no wafer to be detected exists in the detection range of the first sensor or an inclined wafer to be detected exists in the detection range of the second sensor.
2. The pod cleaning apparatus wafer inspection system of claim 1, wherein:
the first sensor is used for emitting a first vertical laser beam to the direction of the wafer to be detected, and the maximum transmission distance of the first vertical laser beam is a first preset distance; when the wafer to be detected is in the detection range of the first sensor, the first vertical laser beam is reflected by the wafer to be detected, and the first sensor detects the reflected first vertical laser beam and then judges that the wafer to be detected is present.
3. The pod cleaning apparatus wafer inspection system of claim 1, wherein:
the second sensor is used for emitting a second vertical laser beam to the direction of the wafer to be detected, when the inclined wafer to be detected exists in the detection range of the second sensor, the second vertical laser beam is reflected by the inclined wafer to be detected, and the second sensor judges that the inclined wafer to be detected exists after detecting the reflected second vertical laser beam.
4. A pod cleaning apparatus wafer inspection system according to claim 3, wherein:
the number of the first sensors is the same as the maximum number of the wafers to be tested; the number of pairs of the second sensors is the same as the maximum number of wafers to be tested.
5. The pod cleaning apparatus wafer inspection system of claim 4, wherein:
the interval between two adjacent first sensors is 5-20mm; the interval between each pair of the second sensors is matched with the thickness of the wafer to be tested.
6. The pod cleaning apparatus wafer inspection system of claim 5, wherein:
the light spot area of the first sensor and the second sensor is smaller than the set area, and the total weight of the first sensor and the second sensor is smaller than the set weight.
7. The pod cleaning apparatus wafer inspection system of claim 1, wherein:
the sensor bracket is provided with a pair of fixed rods; one fixed rod is fixedly connected with the first side of one hand grip of the mechanical arm, and the other fixed rod is fixedly connected with the second side of the same hand grip of the mechanical arm.
8. The pod cleaning apparatus wafer inspection system of claim 7, wherein:
the sensor bracket is also provided with a pair of diagonal draw bars; one diagonal draw bar is fixedly connected with the first side of one hand grip of the mechanical arm, and the other diagonal draw bar is fixedly connected with the second side of the same hand grip of the mechanical arm.
9. The pod cleaning apparatus wafer inspection system of any of claims 1-8, further comprising:
the opposite-incidence photoelectric sensors are symmetrically arranged at two sides of the process tank;
the correlation photoelectric sensor is used for detecting whether a wafer to be detected exists in the process tank;
and the control unit receives the detection result of the correlation photoelectric sensor, and controls the mechanical arm to stop running when no wafer to be detected exists in the process tank.
10. A method for inspecting a wafer in a tank cleaning apparatus, comprising:
acquiring a detection result of a first sensor, and determining the number of wafers to be detected according to the detection result of the first sensor;
comparing whether the number of the wafers to be detected is the same as the number of the put wafers detected by a machine control system, and generating a first control signal if the number of the wafers to be detected is different from the number of the put wafers;
acquiring a detection result of a second sensor, and determining whether a wafer to be detected is in an inclined state according to the detection result of the second sensor;
generating a second control signal if the wafer to be tested is in an inclined state;
the first control signal is used for sending out an alarm prompt signal for prompting an abnormal state; the second control signal is used for sending an alarm prompt signal for prompting the mechanical arm to stop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311368090.5A CN117650069A (en) | 2023-10-20 | 2023-10-20 | Wafer detection system and method for groove type cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311368090.5A CN117650069A (en) | 2023-10-20 | 2023-10-20 | Wafer detection system and method for groove type cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117650069A true CN117650069A (en) | 2024-03-05 |
Family
ID=90042269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311368090.5A Pending CN117650069A (en) | 2023-10-20 | 2023-10-20 | Wafer detection system and method for groove type cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117650069A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118571773A (en) * | 2024-08-02 | 2024-08-30 | 素珀电子科技(上海)有限公司 | Wafer state detection method, device, equipment and medium |
-
2023
- 2023-10-20 CN CN202311368090.5A patent/CN117650069A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118571773A (en) * | 2024-08-02 | 2024-08-30 | 素珀电子科技(上海)有限公司 | Wafer state detection method, device, equipment and medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5980188A (en) | Semiconductor manufacturing device including sensor for sensing mis-loading of a wafer | |
| US7933009B2 (en) | Method and apparatus for verifying proper substrate positioning | |
| CN103227129A (en) | Robot hand and robot | |
| TW201448087A (en) | Substrate transport device, substrate transport method, and storage medium | |
| WO2010127160A2 (en) | Automated substrate handling and film quality inspection in solar cell processing | |
| TWI425590B (en) | Substrate treating apparatus, and a substrate transporting method therefor | |
| CN111199899A (en) | Wafer transfer apparatus, semiconductor device and semiconductor process method | |
| CN113161254B (en) | Wafer vision detection method, detection system and method for detecting wafer damage | |
| CN111640685B (en) | Semiconductor device and workpiece state detection method | |
| TWI638400B (en) | Substrate processing device, substrate processing method, and memory medium | |
| CN103213124A (en) | Robot system | |
| CN216450598U (en) | Wafer box on-line measuring device | |
| JP2007234936A (en) | Wafer carrying arm and wafer carrying apparatus | |
| CN114597141A (en) | Batch type wet cleaning equipment and using method | |
| CN117650069A (en) | Wafer detection system and method for groove type cleaning equipment | |
| JP7246256B2 (en) | Conveying method and conveying system | |
| JPH1116989A (en) | Reactor | |
| KR20090029419A (en) | Apparatus and method for loading wafer in prober | |
| CN210467869U (en) | Silicon chip detection device and solar cell production line | |
| TW202209535A (en) | Wafer cassette device, semiconductor processing machine and wafer detecting method characterized by identifying in real time the abnormal conditions of the wafer in the wafer cassette to reduce the crash rate and greatly improving the yield of wafers | |
| KR101021473B1 (en) | A wafer align and back inspection device | |
| JPH05315309A (en) | Automatic processing equipment for semiconductor substrate | |
| CN221826075U (en) | Wafer detection device, mechanical arm and semiconductor device | |
| KR102694325B1 (en) | FOUP with end effector detection sensor and integrated data management system thereof | |
| TWI806104B (en) | Substrate processing device and substrate processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |