CN117644658A - Curved surface forming device and method - Google Patents

Abstract

The present disclosure relates to a curved surface forming apparatus and method. The curved surface forming device may include: the forming device comprises a forming module, a forming pressure head and a first cavity, wherein the forming module is fixedly provided with a planar film, the first cavity is arranged opposite to the forming module and is used for forming a die joint surface with the planar film, the first cavity is provided with a first through hole, and the first through hole is used for being filled with pressure gas so that the planar film is bent and attached to the forming pressure head. According to the technical scheme provided by the disclosure, the planar film can be attached to the forming pressure head in a non-contact manner by filling pressure gas, so that uneven film thickness caused by poor hard contact extrusion is avoided, and the film attaching precision is influenced.

Description

Curved surface forming device and method

Technical Field

The disclosure relates to the technical field of workpiece forming, in particular to a curved surface forming device and method.

Background

In modern society, as the application range of curved surface workpieces becomes wider, the application scene becomes more and the curved surface forming process becomes more and more important.

In the prior art, most of the curved surface forming processes of the film are contact type extrusion forming processes, hard contact extrusion can cause poor control of uniformity of the formed film thickness, and uneven film thickness can influence the laminating precision of the later film.

Disclosure of Invention

The present disclosure provides a curved surface forming apparatus and method to at least solve the problem of uneven film thickness caused by contact extrusion in the related art. The technical scheme of the present disclosure is as follows:

according to a first aspect of an embodiment of the present disclosure, there is provided a curved surface forming apparatus including:

in one possible implementation manner, the device comprises a first cavity (2) fixed with a planar film (1), the first cavity (2) is arranged opposite to a forming module (3), a forming press head (4) used for forming a die joint surface with the planar film (1) is arranged on the forming module (3), a first through hole (5) is formed in the first cavity (2), and the first through hole (5) is used for being filled with pressure gas so that the planar film (1) is bent and attached to the forming press head (4).

In one possible implementation manner, the molding device further comprises a second cavity (6), the second cavity (6) is opposite to the first cavity (2), a first electric cylinder (7) penetrates through the second cavity (2), the first electric cylinder (7) is connected with one end, far away from the molding press head (4), of the molding module (3), the second cavity (6) is used for forming a closed space with the first cavity (2), and the first electric cylinder (7) is used for moving the molding module (3).

In one possible implementation manner, the first cavity (6) further comprises a cylinder (8), a vacuum adsorption hole (9) and a sealing ring (10), the cylinder (8) is located around the first cavity (2), the vacuum adsorption hole (9) and the sealing ring (10) are arranged on the plane where the planar film (1) is located, the cylinder (8) is used for driving an interlocking mechanism, the vacuum adsorption hole (9) is used for fixing the planar film (1), and the sealing ring (10) is used for sealing the first cavity (2) and the second cavity (6).

In one possible embodiment, the interlocking mechanism comprises a bolt (11) located in the first cavity (2) and a pull rod (12) located in the second cavity (6), and the cylinder (8) drives the bolt (11) to be fixed with the pull rod (12).

In one possible embodiment, the roughness of the die surface of the forming ram (4) is 1nm to 30nm.

In one possible embodiment, the forming module (3) further comprises a first level (13) and a second level (14), the first level (13) comprises a heating rod (15) and a thermocouple (16), the heating rod (15) is used for heating the forming press head (4), and the thermocouple (16) is used for detecting the temperature of the forming press head (4); the second step (14) is provided with a heat insulating plate.

In one possible embodiment, the device further comprises an infrared heating lamp (17), the infrared heating lamp (17) being located below the first cavity (2).

In a possible embodiment, the second cavity (6) further comprises a second through hole (18), a germanium window (19), an infrared imager (20) and an infrared sensor (21), wherein the second through hole (18) is used for vacuumizing and filling pressure gas, and the germanium window (19) is used for penetrating the infrared sensor (21) and the infrared imager (20); the infrared sensor (21) and the infrared imager (20) are fixedly arranged outside the germanium window sheet (19), the infrared sensor (21) is used for monitoring the surface temperature of the planar film (1) through the germanium window sheet (19), further controlling the infrared heating lamp (17), and the infrared imager (20) is used for monitoring the uniformity of the surface temperature of the planar film (1) through the germanium window (19) sheet.

In one possible embodiment, the device further comprises a second electrically powered cylinder (22), the second electrically powered cylinder (22) being connected to the second cavity (6) and the first electrically powered cylinder (7), the second electrically powered cylinder (22) being adapted to move the second cavity (6) and the first electrically powered cylinder (7).

According to a second aspect of embodiments of the present disclosure, there is provided a curved surface forming method for preparing the curved surface forming apparatus according to any one of claims 1 to 9, the method comprising:

placing the planar film on the first cavity, and fixedly connecting the second cavity with the first cavity; the second cavity is positioned above the first cavity, and the second cavity is arranged opposite to the first cavity;

vacuumizing the first cavity and the second cavity, and heating the planar film;

heating a forming press head, and pressing the forming press head on the planar film;

and stopping vacuumizing the first cavity and filling pressure gas to enable the planar film to be bent and attached to the forming pressure head.

In one possible embodiment, after the first cavity is stopped from being vacuumized and filled with the pressure gas, the planar film is attached to the forming press head, and the method further includes:

and the second cavity stops vacuumizing, and the forming press head sucks the planar film away.

The technical scheme provided by the embodiment of the disclosure at least brings the following beneficial effects: the curved surface forming device comprises a first cavity body, wherein the first cavity body is fixedly provided with a planar film, the first cavity body is arranged opposite to a forming module, a forming pressure head for forming a die joint surface with the planar film is arranged on the forming module, the first cavity body is provided with a first through hole, and the first through hole is used for filling pressure gas to enable the planar film to be bent and attached to the forming pressure head; the plane film is fixed on the first cavity, and pressure gas is filled from the through hole communicated with the first cavity, so that the plane film can be attached to the forming pressure head in a non-contact manner, and the film thickness is not uniform due to hard contact extrusion forming, and the film attaching precision is prevented from being influenced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure and do not constitute an undue limitation on the disclosure.

Fig. 1 is a schematic view of a portion of a curved surface forming apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a forming ram shown according to an exemplary embodiment;

FIG. 3 is an overall schematic of a second cavity shown according to an exemplary embodiment;

FIG. 4 is a schematic diagram of a first electric cylinder shown according to an exemplary embodiment;

FIG. 5 is a first cavity schematic diagram shown according to an exemplary embodiment;

FIG. 6 is a schematic view of an interlock mechanism second cavity shown without falling, according to an exemplary embodiment;

FIG. 7 is a schematic view of a second cavity of the interlock mechanism shown in accordance with an exemplary embodiment;

FIG. 8 is a schematic diagram of a molding module shown according to an exemplary embodiment;

FIG. 9 is a schematic diagram of an infrared heating lamp shown according to an exemplary embodiment;

FIG. 10 is a second cavity schematic diagram shown according to an exemplary embodiment;

FIG. 11 is a schematic view of a curved surface forming apparatus according to an exemplary embodiment;

fig. 12 is a flowchart illustrating a method of curved surface shaping according to an exemplary embodiment.

Wherein, the reference numerals in the figures are as follows: the device comprises a 1-plane film, a 2-first cavity, a 3-forming module, a 4-forming press head, a 5-first through hole, a 6-first cavity, a 7-first electric cylinder, an 8-cylinder, a 9-vacuum adsorption hole, a 10-sealing ring, an 11-bolt, a 12-pull rod, a 13-first layer, a 14-second layer, a 15-heating rod, a 16-thermocouple, a 17-infrared heating lamp, a 18-second through hole, a 19-germanium window sheet, a 20-infrared imager, a 21-infrared sensor and a 22-second electric cylinder.

Detailed Description

In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings.

It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the foregoing figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the disclosure described herein may be capable of operation in sequences other than those illustrated or described herein. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

Referring to fig. 1, fig. 1 is a schematic diagram of a curved surface forming apparatus according to an embodiment of the invention. The curved surface forming device comprises a first cavity (2) fixed with a planar film (1), the first cavity (2) is arranged opposite to a forming module (3), a forming pressure head (4) used for forming a die joint surface with the planar film (1) is arranged on the forming module (3), a first through hole (5) is formed in the first cavity (2), and the first through hole (5) is used for being filled with pressure gas so that the planar film (1) is bent and attached to the forming pressure head (4).

In the embodiment of the present specification, the planar film (1) may refer to a film that can be softened after heating, for example, a plastic film, which is not limited in this application.

In the embodiment of the present specification, the forming module (3) may refer to a device for forming a planar film, and a forming press head (4) for forming a die-bonding surface with the planar film (1) is provided on the forming module (3).

In one possible embodiment, the first cavity (2) to which the planar film (1) is fixed, the planar film (1) may be fixed to the first cavity (2) by adsorption or clamping, for example, may be fixed to the first cavity (3) by adsorption through an adsorption hole.

In the embodiment of the present specification, the first cavity (2) may be a cavity with a hollow bottom.

In the present description embodiment, the first through hole (5) may refer to a through hole for air suction as well as air inflation.

In the present description embodiment, as shown in fig. 2, fig. 2 is a schematic view of a forming ram shown according to an exemplary embodiment. The forming press head (4) can be a cylinder with one end provided with a die-closing surface, the die-closing surface can be a surface attached to the planar film (1), the forming press head can be a mirror polished high-precision curved surface, the forming press head can be made of stainless steel, the die-closing surface can comprise a plurality of round holes distributed in the circumferential direction, and the round holes can be round holes with adsorption capacity.

It should be noted that the die assembly surface of the molding press head can be set in a self-defined manner according to the required product.

In the present embodiment, the pressure in the pressure gas may refer to the pressure controlled by the proportional valve.

Through filling pressure gas from the through-hole that communicates first cavity, can make the laminating of plane film in the shaping pressure head noncontact, avoided hard contact extrusion and made the film thickness inhomogeneous, influence film laminating precision.

As shown in fig. 3 and 4, fig. 3 is a second cavity schematic diagram shown according to an exemplary embodiment, fig. 4 is a first electric cylinder schematic diagram shown according to an exemplary embodiment, and further includes a second cavity (6), the second cavity (6) is disposed opposite to the first cavity (2), a first electric cylinder (7) penetrates through the second cavity (2), the first electric cylinder (7) is connected with one end of the forming module (3) away from the forming press head (4), the second cavity (6) is used for forming a closed space with the first cavity (2), and the first electric cylinder (7) is used for moving the forming module (3).

In one possible embodiment, a first electric cylinder (7) penetrates through the second cavity (2), the first electric cylinder (7) is connected with one end, far away from the forming press head (4), of the forming module (3), the first electric cylinder (7) is connected with the forming module (3) in the second cavity (6), and the forming module (3) moves up and down through the first electric cylinder (7).

In the embodiment of the present specification, the first electric cylinder (7) may be connected to the molding module (3) through a connecting body, wherein the connecting body may be a cylinder, which is not limited in this application.

The first electric cylinder moves up and down to form the module, so that the descending and ascending of the forming module can be controlled, and the device is more flexible to operate.

As shown in fig. 5, fig. 5 is a schematic view of a first cavity shown in an exemplary embodiment, the first cavity (6) further includes a cylinder (8), a vacuum adsorption hole (9) and a sealing ring (10), the cylinder (8) is located around the first cavity (2), the vacuum adsorption hole (9) and the sealing ring (10) are disposed on a plane where the planar film (1) is located, the cylinder (8) is used for driving an interlocking mechanism, the vacuum adsorption hole (9) is used for fixing the planar film (1), and the sealing ring (10) is used for sealing the first cavity (2) and the second cavity (6).

In the present embodiment, the cylinder may direct the cylindrical metal member that guides the piston to perform a linear reciprocating motion in the cylinder, and may include, for example, a single-acting cylinder, a double-acting cylinder, a diaphragm cylinder, etc., which is not limited in this application.

The plane film is firmly fixed on the first cavity through the vacuum adsorption hole, so that the plane film is prevented from shifting when the forming press head falls down, and the sealing ring can tightly combine the first cavity with the second cavity after the second cavity falls down, so that air cannot enter and exit, and the vacuum forming press head is beneficial to the vacuum environment required by the curved surface forming.

As shown in fig. 6 and 7, fig. 6 is a non-falling schematic view of the second cavity of the interlocking mechanism according to an exemplary embodiment, and fig. 7 is a falling schematic view of the second cavity of the interlocking mechanism according to an exemplary embodiment. The interlocking mechanism comprises a bolt (11) positioned in the first cavity (2) and a pull rod (12) positioned in the second cavity (6), and the air cylinder (8) drives the bolt (11) to be fixed with the pull rod (12).

Through increasing interlocking mechanism in first cavity and second cavity, can guarantee that the device is when filling high-pressure gas, the cavity is connected more reliably stable, and pure mechanical type auto-lock simultaneously can offset inside atmospheric pressure effort not rely on external force.

The roughness of the die-bonding surface of the molding press head (4) is 1nm-30nm.

In the embodiment of the present specification, the roughness of the die surface may be any value from 1nm to 30nm, for example, 20nm,15nm or 8nm, which is not limited in this application, and may be preferably 10nm.

In one possible embodiment, the die face of the forming ram may be polished to a high precision die face by mirror polishing.

The surface formed by contact with the planar film is polished to a high-precision surface, so that the film can be formed more accurately.

As shown in fig. 8, fig. 8 is a schematic diagram of a molding module shown according to an exemplary embodiment; the forming module (3) further comprises a first layer (13) and a second layer (14), the first layer (13) comprises a heating rod (15) and a thermocouple (16), the heating rod (15) is used for heating the forming press head (4), and the thermocouple (16) is used for detecting the temperature of the forming press head (4); the second step (14) is provided with a heat insulating plate.

In one possible embodiment, the clamping surface of the forming ram (4) is provided with suction holes, which need to be connected to an internal suction opening (not shown in the figures), so that the first level may also comprise plugs, which plug the first level (13) after the punch-through.

The forming module comprises a heating rod, and the heating rod can heat the forming pressure head to keep the forming pressure head at a certain temperature, so that the forming of the planar film is facilitated.

As shown in fig. 9, fig. 9 is a schematic diagram of an infrared heating lamp shown according to an exemplary embodiment; the device further comprises an infrared heating lamp (17), the infrared heating lamp (17) being located below the first cavity (2).

In one possible embodiment, the infrared heating lamp (17) may further comprise a height adjusting knob and a spacing adjusting knob for adjusting the height and the spacing thereof.

In the present description embodiment, the infrared heating lamp (17) may be located below the first chamber (2).

The infrared heating lamp heats the planar film positioned in the first cavity, so that the planar film is softened and is easy to bend and form.

As shown in fig. 10, fig. 10 is a second cavity schematic diagram shown according to an exemplary embodiment; the second cavity (6) further comprises a second through hole (18), a germanium window sheet (19), an infrared imager (20) and an infrared sensor (21), wherein the second through hole (18) is used for vacuumizing and filling pressure gas, and the germanium window sheet (19) is used for penetrating the infrared sensor (21) and the infrared imager (20); the infrared sensor (21) and the infrared imager (20) are fixedly arranged outside the germanium window sheet (19), the infrared sensor (21) is used for monitoring the surface temperature of the planar film (1) through the germanium window sheet (19), further controlling the infrared heating lamp (17), and the infrared imager (20) is used for monitoring the uniformity of the surface temperature of the planar film (1) through the germanium window (19) sheet.

In one possible embodiment, the second cavity (6) may further comprise a viewing window for a person to view the interior of the cavity, and a connector, which may be a device for connecting a thermocouple (16) and a heating rod (15) on the first level (13) of the forming module (3).

In one possible implementation manner, the infrared sensor (21) and the infrared imager (20) are fixedly arranged outside the germanium window sheet (19), and the fixing manner can be bonding or drilling, which is not limited in the application, for example, the infrared sensor (21) and the infrared imager (20) can be fixed outside the second cavity (6) in a screw-nut manner, so that the infrared sensor and the infrared imager (20) can detect through the germanium window sheets (19) on two sides.

In one possible implementation, the temperature of the planar film (1) heated by the infrared heating lamp (17) is monitored by the infrared sensor (21), and the infrared sensor (21) can feed back the temperature of the planar film (1) to the temperature controller for temperature control. And monitoring the surface temperature uniformity of the planar film (1) through an infrared imager (20), and reporting the surface temperature uniformity data of the planar film (1).

The infrared sensor and the infrared imager cannot be used in an environment where high pressure and vacuum are high, and the first chamber and the second chamber need to be sealed. Therefore, the infrared sensor and the infrared imager are fixed outside, the detection is carried out through the germanium window sheet, the temperature and the surface temperature uniformity of the planar film are monitored through the infrared imager and the infrared sensor, and the planar film is observed and controlled in real time to reach the optimal temperature to be formed.

As shown in fig. 11, fig. 11 is a schematic view of a curved surface forming apparatus according to an exemplary embodiment; the device further comprises a second electric cylinder (22), the second electric cylinder (22) is connected with the second cavity (6) and the first electric cylinder (7), and the second electric cylinder (22) is used for moving the second cavity (6) and the first electric cylinder (7).

The second cavity and the first electric cylinder are moved by the second electric cylinder, so that the operation of the whole device can be flexibly controlled.

Fig. 12 is a flow chart illustrating a method of curved surface shaping according to an exemplary embodiment. As shown, the following steps may be included.

S1201, placing the planar film on the first cavity, and fixedly connecting the second cavity with the first cavity; the second cavity is located above the first cavity, and the second cavity is arranged opposite to the first cavity.

In the embodiment of the present specification, the planar film may refer to a film that softens when heated, and may be, for example, a plastic film.

In this embodiment of the present disclosure, the first cavity may include an air cylinder, a vacuum adsorption hole and a sealing ring, where the air cylinder is located around the first cavity, the vacuum adsorption hole and the sealing ring are disposed on a plane where the planar film is located, the air cylinder is used to drive the interlocking mechanism, the vacuum adsorption hole is used to fix the planar film, and the sealing ring is used to seal the first cavity and the second cavity.

In this embodiment of the present disclosure, the second cavity may include a second through hole, a germanium window sheet, an infrared imager, an infrared sensor, an observation window, and a connector, where the second through hole is used for vacuumizing and filling pressure gas, and the germanium window sheet is used for penetrating the infrared sensor and the infrared imager; the infrared sensor and the infrared imager are fixedly arranged outside the germanium window sheet, the infrared sensor is used for monitoring the surface temperature of the planar film through the germanium window sheet, further controlling the infrared heating lamp, the infrared imager is used for monitoring the uniformity of the surface temperature of the planar film through the germanium window sheet, the observation window is convenient for people to observe the inside of the cavity, and the connector can be a device for connecting the thermocouple and the heating rod on the first layer of the forming module.

In this description embodiment, the inside first electronic jar that runs through of second cavity, the one end that the shaping pressure head was kept away from to first electronic jar connection shaping module can include shaping pressure head, first stratum and second stratum on the shaping module, shaping pressure head can be the cylinder that one end was provided with the die face, the die face can refer to the face of laminating with the plane film, can be mirror finish's high accuracy curved surface, the material can be the stainless steel, can include a plurality of round holes of circumference distribution on the die face, a plurality of round holes can be the round hole that has adsorption capacity, including heating rod and thermocouple on the first stratum, the heating rod is used for the heating shaping pressure head, the thermocouple is used for detecting shaping pressure head temperature, the second stratum is provided with the heat insulating board, the shaping module is being connected to first electronic jar in the second cavity, first electronic jar makes the shaping module reciprocate.

In this embodiment, the second cavity and the first electrically powered cylinder may be connected to the second electrically powered cylinder, which may move the second cavity and the first electrically powered cylinder.

In one possible embodiment, the planar film is placed on the first cavity, the forming module is driven by the first electric cylinder to fall through the second cavity, and the second cavity is fixedly connected with the first cavity through the interlocking mechanism.

In one possible embodiment, the interlocking structure may include a pin located in the first cavity and a pull rod located in the second cavity, the cylinder of the first cavity may drive the pin to be fixed to the pull rod, and when the pull rod falls after the second cavity falls, the cylinder may drive the pin of the first cavity to be inserted into the pull rod to fix the first cavity and the second cavity.

In one possible embodiment, the first cavity may be sealed from the second cavity by a sealing ring on the first cavity as the second cavity falls.

And S1203, vacuumizing the first cavity and the second cavity, and heating the planar film.

In one possible embodiment, a vacuum is drawn through the first through hole of the first cavity and the second through hole of the second cavity.

In the present embodiment, the heating may be performed by a heater, for example, may include an infrared heating lamp, which is not limited in this application.

It should be noted that, be provided with infrared heating lamp and infrared imager on the second cavity, can monitor the temperature and the surface temperature homogeneity of plane film to infrared sensor can feed back to the temperature controller and carry out real-time control.

S1205, heating a forming press head, and pressing the forming press head on the plane film.

In one possible embodiment, the forming ram may be heated by a heated bar of the first stage of the forming module and the forming ram may be pressed against the planar film by controlling the first motorized cylinder to move downward.

In one possible embodiment, the forming ram may be moved by a first motorized cylinder to lower the forming ram onto the planar film.

The temperature of the molding press head can be detected by a thermocouple at the first stage of the molding module for feedback control.

And S1207, stopping vacuumizing the first cavity and filling pressure gas into the first cavity so as to enable the planar film to be bent and attached to the forming press head.

In one possible embodiment, the first through hole of the first cavity may be filled with a pressurized gas to bend the planar film to conform to the forming ram.

In one possible embodiment, the first through-hole can be filled with pressurized gas via a proportional valve.

After the forming press head falls on the planar film, the problem that the planar film is not attached to the periphery of the forming press head in the central direction can occur, and the first cavity is communicated with the first through hole, so that the planar film can be completely attached to the die assembly surface of the forming press head by filling pressure gas into the first through hole.

By filling pressure gas, the planar film is attached to the forming press head in a non-contact manner, so that the film thickness is not uniform due to poor hard contact extrusion, and the film attaching precision is prevented from being influenced.

And stopping vacuumizing the first cavity and filling pressure gas to ensure that the planar film is attached to the forming pressure head, and further comprising:

and the second cavity stops vacuumizing, and the forming press head sucks the planar film away.

In one possible embodiment, the second through hole of the second cavity stops vacuumizing, the vacuum adsorption hole of the first cavity is closed, and the round hole with adsorption capacity on the die-bonding surface of the forming press head sucks the plane film.

And stopping vacuumizing the second cavity, releasing the cavity pressure, and sucking the planar film by the forming press head for later film lamination.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

It should be noted that: the foregoing description of the embodiments of the present disclosure has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the technical improvement in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

It should be noted that: the foregoing sequence of the embodiments of the present application is only for describing, and does not represent the advantages and disadvantages of the embodiments. And the foregoing description has been directed to specific embodiments of this specification. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but rather is intended to cover any and all modifications, equivalents, alternatives, and improvements within the spirit and principles of the present application.

Claims (11)

1. The utility model provides a curved surface forming device, its characterized in that, is including being fixed with first cavity (2) of plane film (1), first cavity (2) set up with moulded die piece (3) relatively, be provided with on moulded die piece (3) be used for with the shaping pressure head (4) of plane film (1) formation die face, first cavity (2) are provided with first through-hole (5), first through-hole (5) are used for filling pressure gas so that plane film (1) crooked laminating in shaping pressure head (4).

2. The curved surface forming device according to claim 1, further comprising a second cavity (6), wherein the second cavity (6) is disposed opposite to the first cavity (2), a first electric cylinder (7) penetrates through the second cavity (2), the first electric cylinder (7) is connected with one end, far away from the forming press head (4), of the forming module (3), the second cavity (6) is used for forming a closed space with the first cavity (2), and the first electric cylinder (7) is used for moving the forming module (3).

3. The curved surface forming device according to claim 1, wherein the first cavity (6) further comprises a cylinder (8), a vacuum adsorption hole (9) and a sealing ring (10), the cylinder (8) is located around the first cavity (2), the vacuum adsorption hole (9) and the sealing ring (10) are arranged on a plane where the planar film (1) is located, the cylinder (8) is used for driving an interlocking mechanism, the vacuum adsorption hole (9) is used for fixing the planar film (1), and the sealing ring (10) is used for sealing the first cavity (2) and the second cavity (6).

4. A curved surface forming apparatus according to claim 3, wherein the interlocking mechanism comprises a pin (11) located in the first cavity (2) and a tie rod (12) located in the second cavity (6), and the cylinder (8) drives the pin (11) to be fixed to the tie rod (12).

5. A curved surface forming apparatus according to claim 1, wherein the roughness of the die-bonding surface of the forming ram (4) is 1nm to 30nm.

6. A curved surface forming apparatus according to claim 1, wherein the forming module (3) further comprises a first stage (13) and a second stage (14), the first stage (13) comprising a heating rod (15) and a thermocouple (16), the heating rod (15) being used for heating the forming ram (4), the thermocouple (16) being used for detecting the temperature of the forming ram (4); the second step (14) is provided with a heat insulating plate.

7. A curved surface forming apparatus according to claim 3, characterized in that the apparatus further comprises an infrared heating lamp (17), the infrared heating lamp (17) being located below the first cavity (2).

8. The curved surface forming device according to claim 7, wherein the second cavity (6) further comprises a second through hole (18), a germanium window (19), an infrared imager (20) and an infrared sensor (21), the second through hole (18) being used for vacuumizing and filling pressure gas, the germanium window (19) being used for penetrating the infrared sensor (21) and the infrared imager (20); the infrared sensor (21) and the infrared imager (20) are fixedly arranged outside the germanium window sheet (19), the infrared sensor (21) is used for monitoring the surface temperature of the planar film (1) through the germanium window sheet (19), further controlling the infrared heating lamp (17), and the infrared imager (20) is used for monitoring the uniformity of the surface temperature of the planar film (1) through the germanium window (19) sheet.

9. A curved surface forming device according to claim 2, characterized in that the device further comprises a second electrically powered cylinder (22), the second electrically powered cylinder (22) being connected to the second cavity (6) and the first electrically powered cylinder (7), the second electrically powered cylinder (22) being adapted to move the second cavity (6) and the first electrically powered cylinder (7).

10. A method of curved surface shaping based on the apparatus of claims 1-9, the method comprising:

placing the planar film on the first cavity, and fixedly connecting the second cavity with the first cavity; the second cavity is positioned above the first cavity, and the second cavity is arranged opposite to the first cavity;

vacuumizing the first cavity and the second cavity, and heating the planar film;

heating a forming press head, and pressing the forming press head on the planar film;

and stopping vacuumizing the first cavity and filling pressure gas to enable the planar film to be bent and attached to the forming pressure head.

11. The method of forming a curved surface according to claim 10, wherein after said evacuating said first cavity and filling said first cavity with pressurized gas to cause said planar film to adhere to said forming ram, said method further comprises:

and the second cavity stops vacuumizing, and the forming press head sucks the planar film away.