CN117641823A - Heat dissipation system - Google Patents
Heat dissipation system Download PDFInfo
- Publication number
- CN117641823A CN117641823A CN202210976860.3A CN202210976860A CN117641823A CN 117641823 A CN117641823 A CN 117641823A CN 202210976860 A CN202210976860 A CN 202210976860A CN 117641823 A CN117641823 A CN 117641823A
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- Prior art keywords
- tank
- zone
- cooling fluid
- heat exchanger
- heat
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 39
- 239000012809 cooling fluid Substances 0.000 claims abstract description 87
- 239000012530 fluid Substances 0.000 claims abstract description 29
- 238000004891 communication Methods 0.000 claims description 24
- 238000005192 partition Methods 0.000 claims description 11
- 238000001816 cooling Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation system suitable for dissipating heat of an electronic device, which comprises a tank body, a first heat exchanger and a fluid conveying device. The tank body comprises a first area and a second area. The electronic device is suitable for being arranged in the first area and immersed in the cooling fluid. The first heat exchanger is arranged at the juncture of the first zone and the second zone and used for reducing the temperature of the cooling fluid. The fluid conveying device enables the cooling fluid to flow from the first area to the second area, wherein the cooling fluid is suitable for entering the first area after passing through the first heat exchanger from the second area so as to dissipate heat of the electronic device, and then flows to the second area through the fluid conveying device so as to form circulation.
Description
Technical Field
The present invention relates to a heat dissipation system, and more particularly, to a heat dissipation system providing fluid circulation.
Background
Currently, electronic devices (such as servers) that emit high heat can dissipate the heat by connecting cooling pipes. However, the arrangement of the cooling line is limited by the space, and the complicated piping is also caused by the heat source position of the electronic device. Furthermore, the junction of the cooling lines runs the risk of leakage of the cooling fluid and complex cooling lines are difficult to repair or replace.
Disclosure of Invention
The present invention provides a heat dissipation system in which cooling fluid flows directly in different regions of the tank to form a circulation of cooling fluid without a complicated cooling line configuration.
The invention discloses a heat dissipation system suitable for an electronic device to dissipate heat, which comprises a tank body, a first heat exchanger and a fluid conveying device. The tank body comprises a first area and a second area. The electronic device is suitable for being arranged in the first area and immersed in the cooling fluid. The first heat exchanger is arranged at the juncture of the first zone and the second zone and used for reducing the temperature of the cooling fluid. The fluid conveying device enables the cooling fluid to flow from the first area to the second area, wherein the cooling fluid is suitable for entering the first area after passing through the first heat exchanger from the second area so as to dissipate heat of the electronic device, and then flows to the second area through the fluid conveying device so as to form circulation.
In an embodiment of the invention, the tank body includes an inner partition board and a communication port near the bottom of the tank, the inner partition board separates the tank body into a main tank and an auxiliary tank, the main tank is communicated with the auxiliary tank through the communication port, and the electronic device is disposed in the main tank.
In an embodiment of the invention, the first heat exchanger is disposed in the main tank, the first area covers a portion of the main tank, and the second area covers another portion of the main tank and the auxiliary tank.
In an embodiment of the invention, a level of the cooling fluid in the auxiliary tank is higher than a level of the cooling fluid in the main tank, so that the cooling fluid in the auxiliary tank flows to the main tank through the communication port and passes through the first heat exchanger.
In an embodiment of the invention, the first heat exchanger is disposed in the secondary tank, the first area covers a portion of the primary tank and the secondary tank, and the second area covers another portion of the secondary tank.
In an embodiment of the present invention, a level of the cooling fluid in the second area is higher than a level of the cooling fluid in the main tank, and the cooling fluid in the second area flows through the first heat exchanger and the communication port to the main tank.
In an embodiment of the invention, the heat dissipation system further includes a flow equalizing plate disposed at a position of the main groove near the communication port.
In an embodiment of the invention, the cavity includes a third region, the heat dissipation system further includes a second heat exchanger disposed at a boundary between the second region and the third region, wherein the fluid conveying device conveys the cooling fluid from the first region to the third region, the cooling fluid enters the second region after passing through the second heat exchanger from the third region, enters the first region after passing through the first heat exchanger, and dissipates heat of the electronic device, and is conveyed to the third region by the fluid conveying device to form a circulation.
In an embodiment of the invention, the tank body includes an inner partition board and a communication port at a bottom of the tank, the inner partition board separates the tank body into a main tank and an auxiliary tank, the main tank is communicated with the auxiliary tank through the communication port, the electronic device is arranged in the main tank, the first heat exchanger is arranged in the main tank, and the second heat exchanger is arranged in the auxiliary tank.
In an embodiment of the invention, the first area covers a portion of the main groove, the second area covers another portion of the main groove and a portion of the auxiliary groove, and the third area covers another portion of the auxiliary groove.
In an embodiment of the present invention, the level of the cooling fluid in the third zone is higher than the level of the cooling fluid in the main tank, and the cooling fluid flows from the third zone to the second zone through the second heat exchanger, flows to the main tank through the communication port, and flows to the first zone through the first heat exchange zone.
Based on the above, the heat dissipation system of the present invention sets the first heat exchanger at the boundary between the first region and the second region of the tank body, so as to reduce the temperature of the cooling fluid entering the first region. The electronic device can be arranged in the first area to achieve the effect of heat dissipation. The warmed cooling fluid is caused to flow from the first zone to the second zone by the fluid transfer device. In the heat dissipation system of the present invention, the cooling fluid is adapted to enter the first region after passing through the first heat exchanger from the second region, so as to dissipate heat of the electronic device immersed in the cooling fluid in the first region, and the cooling fluid flows to the second region through the fluid conveying device, thereby forming a circulation. Therefore, the heat dissipation system of the invention does not need a complex cooling pipeline, and the whole structure is quite simple.
The invention will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the invention thereto.
Drawings
Fig. 1 is a schematic diagram of a heat dissipation system according to an embodiment of the invention.
Fig. 2 to 4 are schematic views of a heat dissipation system according to another embodiment of the present invention from different viewing angles.
Fig. 5 to 6 are schematic views of a heat dissipation system according to another embodiment of the present invention from different viewing angles.
Wherein, the reference numerals:
s1, S2: liquid level
10: electronic device
100. 100a, 100b: heat dissipation system
110: groove body
111. 111a, 111b: first zone
112. 112a, 112b: second zone
113: third zone
114: inner partition board
115: communication port
116: main groove
117: auxiliary groove
118: high-level pool
119: pump pool
120. 120a, 120b: first heat exchanger
122: cooling liquid inlet and outlet pipe
130: fluid delivery device
140: flow equalizing plate
150: second heat exchanger
Detailed Description
Fig. 1 is a schematic diagram of a heat dissipation system according to an embodiment of the invention. Referring to fig. 1, the heat dissipation system 100 of the present embodiment is suitable for dissipating heat of an electronic device 10, and the electronic device 10 is, for example, a server, but the type of the electronic device 10 is not limited thereto.
The heat dissipation system 100 includes a tank 110, a first heat exchanger 120, and a fluid delivery device 130. The tank 110 includes an inner partition 114 and a communication port 115 near the bottom of the tank, and the inner partition 114 divides the tank 110 into a main tank 116 and a sub tank 117. The volume of the primary slot 116 is greater than the volume of the secondary slot 117. The main tank 116 communicates with the sub tank 117 through the communication port 115, and the electronic device 10 is disposed in the main tank 116.
On the other hand, in the present embodiment, the tank 110 includes a first region 111 and a second region 112, and the first heat exchanger 120 is disposed at the boundary between the first region 111 and the second region 112. That is, the first region 111 and the second region 112 are defined by the position of the first heat exchanger 120 at the tank 110.
As can be seen from fig. 1, in the present embodiment, the first heat exchanger 120 is disposed in the main tank 116, and the first region 111 covers a portion of the main tank 116 (a portion above the first heat exchanger 120 in the main tank 116). The second zone 112 encompasses another portion of the primary tank 116 (the portion of the primary tank 116 below the first heat exchanger 120) and the secondary tank 117.
A cooling fluid is disposed in the first region 111 and the second region 112, and the electronic device 10 is adapted to be disposed in the first region 111 and immersed in the cooling fluid for heat exchange with the cooling fluid. The first heat exchanger 120 is used to reduce the temperature of the cooling fluid passing therethrough. Accordingly, the cooling fluid is adapted to enter the first region 111 at a lower temperature after passing through the first heat exchanger 120 from the second region 112, thereby dissipating heat from the electronic device 10.
Since the electronic device 10 generates heat during operation, the temperature of the cooling fluid in the first region 111 increases. In this embodiment, the fluid delivery device 130 (e.g. a pump, but not limited thereto) may enable the cooling fluid to flow from the first region 111 to the second region 112, then cool by the first heat exchanger 120, and enter the first region 111 to form a circulation of the cooling fluid.
In the present embodiment, the first heat exchanger 120 includes a plurality of fins, for example, and the cooling liquid inlet/outlet pipe 122 is disposed through the fins to cool the fins. In other embodiments, the type of the first heat exchanger 120 is not limited thereto. The heat dissipation area of the first heat exchanger 120 may be increased by other structures, as long as the first heat exchanger 120 has channels or through holes for the cooling fluid to pass through.
It should be noted that, in the present embodiment, the cooling system 100 passes the cooling fluid through the first heat exchanger 120, for example, by adjusting the pumping rate or pumping amount of the cooling fluid by the fluid conveying device 130, or/and matching the channel size of the first heat exchanger 120 (for example, the channel size between the fins), so that the level S2 of the cooling fluid in the auxiliary tank 117 is higher than the level S1 of the cooling fluid in the main tank 116.
For example, if the rate or amount of extraction of cooling fluid by the fluid delivery device 130 is greater than the rate of flow of cooling fluid from the second zone 112 to the first zone 111, the level S2 of cooling fluid in the secondary tank 117 may be higher than the level S1 of cooling fluid in the primary tank 116.
As can be seen from fig. 1, in the present embodiment, since the level S2 of the cooling fluid in the sub tank 117 is higher than the level S1 of the cooling fluid in the main tank 116, the level difference causes the cooling fluid in the sub tank 117 to have a large hydraulic pressure and automatically flow to the main tank 116 through the communication port 115 and through the first heat exchanger 120. That is, the heat dissipation system 100 helps to improve the circulation of the cooling fluid by forming the level difference.
The design can make the heat dissipation system 100 not need to provide a mechanism for flowing cooling fluid inside the tank 110, and the fluid conveying device 130 is arranged outside the tank 110 and not need to be installed between sealing pipelines. Thus, the fluid delivery device 130 is easy to install and replace without having to consider a shaft seal for sealing, and without having to use special pumps (e.g., magnetic drive pumps) that are expensive and less efficient, which is relatively cost effective and convenient to maintain.
Of course, in other embodiments, the heat dissipation system 100 may also be configured to provide a mechanism for flowing the cooling fluid in the tank 110, instead of passing the cooling fluid through the first heat exchanger 120 by means of a high-low liquid level difference.
Compared to the prior art, the cooling fluid flows in the cooling pipes, which are complicated, space-consuming and risky. The cooling fluid of the heat dissipation system 100 of the present embodiment flows between different areas in the tank 110, and the tank 110 itself has no high-strength sealing requirement, no complicated piping configuration, and simple overall structure and convenient maintenance.
Fig. 2 to 4 are schematic views of a heat dissipation system according to another embodiment of the present invention from different viewing angles. In fig. 2, the tank 110 is seen through. In fig. 4, the tank 110 and the midplane are seen through and the fluid delivery device 130 is hidden. The cooling fluid is hidden in fig. 2 and 4.
Referring to fig. 2 to 3, the heat dissipation system 100a of fig. 2 is different from the heat dissipation system 100 of fig. 1 mainly in the location of the first heat exchanger 120a, and the heat dissipation system 100a further optionally includes a flow equalizing plate 140.
Specifically, as can be seen from fig. 3, in the present embodiment, the first heat exchanger 120a is provided in the sub-tank 117. Thus, the first zone 111a covers a portion of the primary tank 116 and the secondary tank 117 (the left portion of the first heat exchanger 120 a), and the second zone 112a covers another portion of the secondary tank 117 (the right portion of the first heat exchanger 120 a).
In the present embodiment, the level S2 of the cooling fluid in the second zone 112a is higher than the level S1 of the cooling fluid in the main tank 116. The difference in liquid level allows the cooling fluid in the second region 112a to have a large hydraulic pressure, and the cooling fluid in the second region 112a flows through the first heat exchanger 120a and to the main tank 116 through the communication port 115.
In addition, in the present embodiment, the main groove 116 is provided with a flow equalizing plate 140 near the communication port 115. The flow equalizing plate 140 has through holes so that the cooling fluid uniformly flows in the main groove 116. Of course, in other embodiments, the flow equalization plate 140 may be omitted, or more flow equalization plates 140 may be provided.
In addition, in the present embodiment, as can be seen in fig. 2, the fluid delivery device 130 is disposed above the secondary tank 117. In fig. 4, a high-level tank 118 and a pump tank 119 are provided above the sub tank 117. The higher tank 118 communicates with the sub tank 117 and is part of the second zone 112a (fig. 3). The cooling fluid in the main tank 116 overflows to a pump sump 119 as shown by the arrows in fig. 4 and is pumped by a fluid delivery device 130 (e.g., a pump) to the higher level sump 118 and into the second zone 112a. Of course, the basin 118 may also be provided with an overflow pipe to avoid too much cooling fluid to fill.
Fig. 5 to 6 are schematic views of a heat dissipation system according to another embodiment of the present invention from different viewing angles. In fig. 5, the tank 110 is seen through and conceals the cooling fluid. Referring to fig. 5 to 6, the main difference between the heat dissipation system 100b of fig. 5 and the heat dissipation system 100 of fig. 1 is that, in the present embodiment, the heat dissipation system 100b further includes a second heat exchanger 150.
As shown in fig. 6, the first heat exchanger 120b is disposed in the main tank 116, and the second heat exchanger 150 is disposed in the sub-tank 117. The cavity includes a third region 113, and the second heat exchanger 150 is disposed at the boundary between the second region 112b and the third region 113.
In the present embodiment, the first zone 111b covers a portion of the main tank 116 (above the first heat exchanger 120 b), the second zone 112b covers another portion of the main tank 116 (below the first heat exchanger 120 b) and a portion of the sub tank 117 (to the left of the second heat exchanger 150), and the third zone 113 covers another portion of the sub tank 117 (to the right of the second heat exchanger 150).
The fluid conveying device 130 (fig. 5) conveys the cooling fluid from the first region 111b to the third region 113, the level S2 of the cooling fluid in the third region 113 is higher than the level S1 of the cooling fluid in the main tank 116, the level difference is that the cooling fluid enters the second region 112b after passing through the second heat exchanger 150 from the third region 113, flows to the main tank 116 through the communication port 115, then enters the first region 111b after passing through the first heat exchanger 120b, so as to dissipate heat of the electronic device 10, and is conveyed to the third region 113 by the fluid conveying device 130, so as to form a circulation.
In summary, in the heat dissipating system of the present invention, the first heat exchanger is disposed at the boundary between the first region and the second region of the tank body, so as to reduce the temperature of the cooling fluid entering the first region. The electronic device can be arranged in the first area to achieve the effect of heat dissipation. The warmed cooling fluid is caused to flow from the first zone to the second zone by the fluid transfer device. In the heat dissipation system of the present invention, the cooling fluid is adapted to enter the first region after passing through the first heat exchanger from the second region, so as to dissipate heat of the electronic device immersed in the cooling fluid in the first region, and the cooling fluid flows to the second region through the fluid conveying device, thereby forming a circulation. Therefore, the heat dissipation system of the invention does not need a complex cooling pipeline, and the whole structure is quite simple.
Of course, the present invention is capable of other various embodiments and its several details are capable of modification and variation in light of the present invention by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (11)
1. A heat dissipation system adapted for dissipating heat from an electronic device, comprising:
the electronic device is suitable for being arranged in the first area and immersed in the cooling fluid;
a first heat exchanger arranged at the juncture of the first zone and the second zone for reducing the temperature of the cooling fluid; and
and a fluid conveying device for enabling the cooling fluid to flow from the first zone to the second zone, wherein the cooling fluid is suitable for entering the first zone after passing through the first heat exchanger from the second zone so as to dissipate heat of the electronic device, and then flows to the second zone through the fluid conveying device so as to form circulation.
2. The heat dissipating system of claim 1, wherein the tank comprises an inner partition and a communication port near the bottom of the tank, the inner partition separates the tank into a main tank and an auxiliary tank, the main tank is communicated with the auxiliary tank through the communication port, and the electronic device is disposed in the main tank.
3. The heat dissipating system of claim 2, wherein the first heat exchanger is disposed in the main tank, the first region covers a portion of the main tank, and the second region covers another portion of the main tank and the auxiliary tank.
4. A heat dissipating system according to claim 3, wherein the level of the cooling fluid in the sub-tank is higher than the level of the cooling fluid in the main tank, so that the cooling fluid in the sub-tank flows to the main tank through the communication port and passes through the first heat exchanger.
5. The heat dissipating system of claim 2, wherein the first heat exchanger is disposed in the secondary tank, the first region covers a portion of the primary tank and the secondary tank, and the second region covers another portion of the secondary tank.
6. The heat dissipating system of claim 5, wherein the level of the cooling fluid in the second zone is higher than the level of the cooling fluid in the main tank, the cooling fluid in the second zone passing through the first heat exchanger and through the communication port to the main tank.
7. The heat dissipating system of claim 2, further comprising a flow equalizing plate disposed in the main channel near the communication port.
8. The heat dissipation system of claim 1, wherein the cavity comprises a third region, the heat dissipation system further comprising:
the second heat exchanger is arranged at the juncture of the second zone and the third zone, wherein the fluid conveying device conveys the cooling fluid from the first zone to the third zone, the cooling fluid enters the second zone after passing through the second heat exchanger from the third zone, then enters the first zone after passing through the first heat exchanger, so as to dissipate heat of the electronic device, and the cooling fluid is conveyed to the third zone by the fluid conveying device, so that circulation is formed.
9. The heat dissipating system of claim 8 wherein the tank comprises an inner partition and a communication port at the bottom of the tank, the inner partition separating the tank into a main tank and an auxiliary tank, the main tank being in communication with the auxiliary tank through the communication port, the electronic device being disposed in the main tank, the first heat exchanger being disposed in the main tank, the second heat exchanger being disposed in the auxiliary tank.
10. The heat dissipating system of claim 9, wherein the first region covers a portion of the primary slot, the second region covers another portion of the primary slot and a portion of the secondary slot, and the third region covers another portion of the secondary slot.
11. The heat removal system of claim 8, wherein the level of the cooling fluid in the third zone is higher than the level of the cooling fluid in the main tank, the cooling fluid flowing from within the third zone through the second heat exchanger to the second zone, through the communication port to the main tank, through the first heat exchange zone to the first zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210976860.3A CN117641823A (en) | 2022-08-15 | 2022-08-15 | Heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210976860.3A CN117641823A (en) | 2022-08-15 | 2022-08-15 | Heat dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117641823A true CN117641823A (en) | 2024-03-01 |
Family
ID=90018654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210976860.3A Pending CN117641823A (en) | 2022-08-15 | 2022-08-15 | Heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117641823A (en) |
-
2022
- 2022-08-15 CN CN202210976860.3A patent/CN117641823A/en active Pending
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