CN117637788A - Image sensing module, image sensing device and electronic equipment - Google Patents

Abstract

The application relates to the technical field of display, and embodiments of the application provide an image sensing module, an image sensing device and electronic equipment. In this application embodiment, through setting up limit light structure on the printing opacity piece, and the orthographic projection of bonding piece at the first surface of sensing piece is located limit light structure in the orthographic projection of first surface for limit light structure and bonding piece can be roughly corresponding, light can pass through limit light structure earlier before light gets into the bonding piece, limit light structure can inject the propagation area of light, and then can improve because of the encapsulation has first bonding pad in the bonding piece and lead to light to get into the bonding piece and produce the condition of reflection on first bonding pad, thereby improved the reliability of acquireing the image, improved the imaging quality.

Description

Image sensing module, image sensing device and electronic equipment

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to an image sensing module, an image sensing device, and an electronic device.

Background

Image sensing devices are widely used in electronic devices such as computer cameras, digital cameras, mobile phones, video phones, PDAs (Personal Digital Assistant, palmtop computers), monitoring systems, digital video cameras, and the like. In the related art, the reliability of the image acquired by the image sensing device is not high, so that the imaging quality is affected.

Disclosure of Invention

Accordingly, it is necessary to provide an image sensing module, an image sensing device and an electronic device to improve the reliability of capturing images and further improve the imaging quality.

According to an aspect of the present application, an embodiment of the present application provides an image sensor module, including:

a sensing member having a first surface; the first surface includes a sensing region and an edge region disposed about the sensing region;

the first bonding pad and the bonding piece are arranged in the edge area of the first surface; the first bonding pad is encapsulated in the bonding piece;

the light transmission piece is fixed with the sensing piece by means of the bonding piece; and

The light limiting structure is arranged on the light transmitting piece and used for limiting a light transmission area;

the bonding piece is positioned in the orthographic projection of the light limiting structure on the first surface.

In one embodiment, the light limiting structure is configured to allow light propagating in a first direction to enter and to block light propagating in a predetermined direction from entering the adhesive;

the first direction is perpendicular to the first surface, and the preset direction and the first direction are arranged at an angle.

In one embodiment, the light limiting structure is configured to change a propagation path of light propagating along the preset direction so as to block light propagating along the preset direction from being incident on the adhesive member.

In one embodiment, the light transmissive member has a second surface facing the sensing member and a third surface facing away from the sensing member;

the light limiting structure comprises a first film layer arranged on the second surface and a second film layer arranged on the third surface; the orthographic projection of the first film layer on the first surface and the orthographic projection of the second film layer on the first surface are overlapped with each other;

the second film layer is configured as a semi-transparent and semi-reflective film, and one side of the first film layer and the second film layer opposite to each other can reflect light incident through the second film layer to an area outside the sensing area;

the bonding element is in front projection of the first surface, in front projection of the first film layer on the first surface, and in front projection of the second film layer on the first surface.

In one embodiment, the first film layer and/or the second film layer is configured as a single layer film or a multilayer film; and/or

The first film layer and/or the second film layer are manufactured through a sputtering process, an evaporation process or a spraying process; and/or

The dimension of the first film layer along the first direction and/or the dimension of the second film layer along the first direction is greater than 5 microns and less than 200 microns; and/or

The reflectivity of the first film layer is more than 90%; and/or

Under the condition that the wavelength of light is 420-680 nanometers, the transmittance of the second film layer is more than or equal to 80%; and/or

The first film layer is made of aluminum, silver, copper, chromium or platinum; and/or

The second film layer is made of polycarbonate, polymethyl methacrylate, thermoplastic polyester or glass.

In one embodiment, the light transmissive member has a second surface facing the sensing member;

the light limiting structure comprises a plurality of convex parts arranged on the second surface, and the convex parts limit the grating structure.

In one embodiment, a gap is defined between two adjacent convex parts;

the size of the gap gradually increases along the direction away from the light-transmitting piece; the direction away from the light-transmitting member and the first direction are parallel to each other.

In one embodiment, a plane passing through the plurality of protrusions and parallel to the first direction is defined as a reference plane;

the convex part and the reference surface intersect at a first intersection line and a second intersection line; the first intersecting line and the second intersecting line are straight lines and are arranged at an angle with the first direction.

In one embodiment, the first intersecting line is disposed at a first preset angle with the first direction, and the second intersecting line is disposed at a second preset angle with the first direction;

the first preset angle is equal to the second preset angle.

In one embodiment, the first preset angle and the second preset angle are both greater than 0 degrees and less than or equal to 40 degrees.

In one embodiment, a gap is defined between two adjacent convex parts;

the size of the gap is constant along the first direction.

In one embodiment, the protrusion has a first end connected to the optically transparent member and a second end remote from the optically transparent member; the dimension between the first ends of two adjacent convex parts is a first dimension, and the dimension between the second ends of two adjacent convex parts is a second dimension; the first dimension is from 0.05 microns to 10 microns and the second dimension is from 0.05 microns to 100 microns; and/or

The dimension of the convex portion in the first direction is 0.05 micrometers to 5 micrometers.

In one embodiment, the light confining structure is configured as a single layer film or as a multilayer film; and/or

The light limiting structure is manufactured through a sputtering process, an evaporation process or a spraying process; and/or

The penetration of the light limiting structure is more than 30%; and/or

The light limiting structure is made of acrylic plastic, epoxy resin or photoresist.

In one embodiment, a side of the light transmitting member, which is away from the sensing member, is used for arranging a lens, an optical axis of the lens and a central axis of the sensing region coincide with each other, a focal point of the lens is located in the sensing region, the lens is used for converging light to the sensing region so as to form a light converging region, and the light converging region is provided with a converging end located on the lens;

the light limiting structure comprises a light limiting part which selectively allows light to pass through, and the light limiting part is provided with an alignment area which is arranged opposite to the sensing area along the first direction and a non-alignment area which is not opposite to the sensing area; the alignment region has a first edge proximate the central axis and a second edge facing away from the central axis; the non-alignment region has a third edge coincident with the second edge and a fourth edge facing away from the alignment region; the adhesive layer has a fifth edge proximate the central axis and connected to the sensing element;

Defining an intersection point of the converging end and a reference surface as a first reference point, wherein the intersection point of the first edge and the reference surface is a second reference point, the intersection point of the second edge and the reference surface is a third reference point, and the intersection point of the fifth edge and the reference surface is a fourth reference point;

the connecting line of the first reference point and the fourth reference point which are positioned on different sides of the central axis is a first connecting line, and the connecting line of the second reference point and the fourth reference point which are positioned on the same side of the central axis and the part of the first connecting line where the fourth reference point is positioned are overlapped with each other; the first reference point, the third reference point and the fourth reference point which are positioned on the same side of the central axis are positioned on a second connecting line; the connecting line of the fourth reference point and the optical center of the lens is a third connecting line;

wherein the first connecting line and the second connecting line with the same fourth reference point form a first reference angle theta ₁ Setting the first reference angle theta ₁ The method meets the following conditions:

tanθ ₁ ＝(2d ₀ +h)/f；

the first connecting line and the third connecting line with the same fourth reference point form a second reference angle theta ₂ Setting the second reference angle theta ₂ The method meets the following conditions:

tanθ ₂ ＝f/(d ₀ +h)；

the distance between the first edge and the third edge along the second direction is a first distance g ₁ The distance between the third edge and the fourth edge along the second direction is a second distance g ₂ The size of the light limiting structure along the second direction is a width w, and the width w satisfies:

w＝g ₁ +g ₂ ＝g ₂ +[(h+2d ₀ )/f)]×k；

f is the focal length of the lens, h is the dimension of the sensing region along the second direction, d ₀ K is the dimension of the bonding element and the sensing area along the second direction, and k is the dimension of the bonding element along the first direction;

the second direction is perpendicular to the first direction and parallel to the reference plane; the reference plane is a plane passing through the optical center of the lens and the focal point of the lens, and the reference plane and the first direction are parallel to each other.

According to another aspect of the present application, an embodiment of the present application provides an image sensing device, including:

a substrate having a mounting surface with a second bonding pad disposed thereon; and

The image sensing module according to any one of the above embodiments, wherein the sensing element of the image sensing module is disposed on the mounting surface;

wherein the first bonding pad and the second bonding pad are connected by a wire, and a part of the wire is positioned in the bonding piece.

According to still another aspect of the present application, an embodiment of the present application provides an electronic device, including the image sensing module set described in any one of the above embodiments; or alternatively

The image sensor device according to any one of the above embodiments is included.

In the image sensing module, the image sensing device and the electronic equipment, the image sensing module at least comprises a sensing piece, a first bonding pad, a bonding piece, a light transmitting piece and a light limiting structure. Through setting up limit light structure on the printing opacity piece, and the orthographic projection of bonding piece at the first surface of sensing piece is located limit light structure in the orthographic projection of first surface for limit light structure and bonding piece can be roughly corresponding, light can pass through limit light structure earlier before light gets into the bonding piece, limit light structure can inject the propagation area of light, and then can improve because of the encapsulation has first bonding pad in the bonding piece and lead to light to get into the bonding piece and produce the condition of reflection on first bonding pad, thereby improved the reliability of acquireing the image, improved the imaging quality.

Additional aspects and advantages of embodiments of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the application.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the accompanying drawings. In the drawings:

FIG. 1 is a schematic cross-sectional view of an image sensor according to an embodiment of the related art;

FIG. 2 is a schematic cross-sectional view of an image sensor according to another embodiment of the related art;

FIG. 3 is a schematic cross-sectional view of an image sensor module according to an embodiment of the disclosure;

FIG. 4 is a schematic structural diagram of the light-transmitting member and the light-limiting structure of the image sensor module shown in FIG. 3;

FIG. 5 is a schematic diagram of a light path of light in the light confinement structure of the image sensor module shown in FIG. 3;

FIG. 6 is a schematic cross-sectional view of an image sensor module according to another embodiment of the disclosure;

FIG. 7 is a schematic diagram illustrating a configuration of the light-transmitting member and the light-limiting structure of the image sensor module shown in FIG. 6;

FIG. 8 is a schematic diagram of a light transmitting member, a light limiting structure and a reference surface in the image sensor module shown in FIG. 6;

FIG. 9 is a schematic diagram of the image sensor module shown in FIG. 3 and a lens;

FIG. 10 is a schematic diagram of the image sensor module, the lens, and the first and second light beams shown in FIG. 9;

FIG. 11 is a schematic view of the structure between the structure illustrated in FIG. 10 and a reference plane;

FIG. 12 is a schematic diagram of the image sensor module shown in FIG. 6 and a lens;

FIG. 13 is a schematic diagram of the image sensor module, the lens, and the first and second light beams shown in FIG. 12;

FIG. 14 is a schematic view of the structure between the structure illustrated in FIG. 13 and a reference plane;

FIG. 15 is a schematic view of a partially enlarged structure at C in FIG. 9;

FIG. 16 is a schematic view of a partially enlarged structure at D in FIG. 12;

FIG. 17 is a schematic diagram of an image sensor device according to an embodiment of the disclosure;

fig. 18 is a schematic structural diagram of an image sensor device according to another embodiment of the present application.

Reference numerals illustrate:

the image sensor 10, the carrier plate 11, the sensing chip 12, the sensing area 12a, the rubber frame 13, the glass plate 14, the first welding pad 15, the second welding pad 16, the metal wire 17, the ink layer 18, the solder ball B, the incident light p1 and the reflected light p2;

an image sensor device 100;

the image sensor module 110, the sensor 111, the central axis a1, the first surface b1, the sensor region z1, the edge region z2, the first bonding pad 112, the bonding element 113, the fifth edge t5, the sixth edge t6, the light transmitting element 114, the second surface b2, the third surface b3, the light limiting structure 115, the first film 115a, the first filmTwo layers 115b, a convex portion 115c, a first end e1, a second end e2, a first intersection j1, a first predetermined angle α ₁ A second intersection j2, a second preset angle alpha ₂ Gap i, alignment region z3, first edge t1, second edge t2, non-alignment region z4, third edge t3, fourth edge t4;

a substrate 120 having a mounting surface m1 and a mounting back surface m2;

a second pad 130, a wire L;

a package structure 140;

a solder ball 150;

the lens S, the optical axis a2, the focal length f, the optical center O, the first light converging area q1, the second light converging area q2, the first converging end q11 and the second converging end q21;

the first incident light v1, the first reflected light v2, the second incident light v3, the third incident light v4, the first light ray P1, the second light ray P2;

a first reference point n1, a second reference point n2, a third reference point n3, and a fourth reference point n4;

a first connection u1, a second connection u2, and a third connection u3;

first thickness d ₁ Second thickness d ₂ Third thickness d ₃ Gap dimension x, first dimension x1, second dimension x2, dimension d ₀ K, width w, first reference angle θ ₁ Second reference angle theta ₂ First distance g ₁ Second distance g ₂ ；

The device comprises a first direction F1, a second direction F2, a first preset direction Y1, a second preset direction Y2, a reference surface R and a reference surface E.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

In order to facilitate understanding of the technical solutions of the embodiments of the present application, before describing the specific implementation manner of the embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong will be first briefly described.

CMOS (Complementary Metal Oxide Semiconductor ) refers to a technology used for manufacturing large scale integrated circuit chips or chips manufactured by such technology.

A CCD (Charge Coupled Device ) is a device that changes light into electric charge, stores and transfers the electric charge, and also takes out the stored electric charge to change the voltage.

Image sensors typically include a CCD device, a CMOS device. The CMOS image sensor is fabricated by using a Complementary Metal Oxide Semiconductor (CMOS) process. Since the cmos image sensor is low in manufacturing cost, consumes low power, and is easily integrated with other logic circuits on the same chip, conventional CCD devices are being replaced in many fields. CMOS image sensors are widely used in electronic devices such as computer cameras, digital cameras, mobile phones, video phones, PDAs (Personal Digital Assistant, palmtop computers), monitoring systems, digital video cameras, and the like. Image sensors used in the vehicle market mostly adopt a packaging technology of gap ball grid array package (interstitial Ball Grid Array, igga).

FIG. 1 is a schematic diagram showing a cross-sectional structure of an image sensor 10 according to an embodiment of the related art; for convenience of explanation, only the contents related to the related art embodiment are shown.

Referring to fig. 1, an image sensor 10 is provided in an embodiment of the related art, and includes a carrier 11, a sensor chip 12, a frame 13, a glass plate 14, a first bonding pad 15 and a second bonding pad 16. One side of the carrier plate 11 is provided with a sensing chip 12, and the other side is provided with a solder ball B. The sensor chip 12 is provided with a sensor area 12a, and a rubber frame 13 is arranged on the sensor chip 12 around the sensor area 12a, and the glass plate 14 is connected with the sensor chip 12 by means of the rubber frame 13. The sensor chip 12 is provided with a first bonding pad 15, the carrier 11 is provided with a second bonding pad 16, and the first bonding pad 15 is electrically connected with the second bonding pad 16 by means of a metal wire 17. The first welding point and part of the wire 17 are located in the frame 13. The glass plate 14 can protect the sensing area 12a of the sensing element and increase the penetrability of an external light source, and light enters the sensing area 12a of the sensing element through the glass plate 14 so that the sensing area 12a acquires a corresponding image.

In the above structure, when a plurality of external light sources enter the glass plate 14 in a specific or non-specific direction, the bonding pad or the wire 17 will cause reflection, refraction or scattering of the plurality of external light sources, so that the sensing area 12a of the sensing element is disturbed when capturing images. As shown in fig. 1, after the incident light p1 is incident on the first bonding pad 15, a reflected light p2 is formed, and the reflected light p2 will cause ghost images or flare of the image of the sensing area 12a. Therefore, the image sensor has low reliability of acquiring images, and further influences imaging quality.

Fig. 2 is a schematic cross-sectional view of an image sensor 10 according to another embodiment of the related art; for convenience of explanation, only the contents related to the related art embodiment are shown.

Referring to fig. 2, another embodiment of the related art provides an image sensor 10, which is compared with the image sensor 10 shown in fig. 1, the image sensor 10 shown in fig. 2 has an ink layer 18 with a predetermined width disposed on a side of a glass plate 14 corresponding to a frame 13 to block light from entering a first bonding pad 15. However, to meet the use requirements, the sensing area 12a of the sensing chip 12 needs to be increased, which in turn results in a limited width of the ink layer 18. In the case where the width of the ink layer 18 is limited, not only the effect of blocking light is affected, but also a part of the light entering the sensing region 12a is blocked by the ink layer 18 due to the tolerance generated when the glass plate 14 is attached to the frame 13 and the ink is applied.

Based on this, in order to solve at least part of the above problems, the embodiments of the present application improve the reliability of acquiring the image by improving the related structure of the image sensor, thereby improving the imaging quality.

FIG. 3 is a schematic diagram illustrating a cross-sectional structure of the image sensor module 110 according to an embodiment of the disclosure; for ease of illustration, only matters relevant to the embodiments of the present application are shown.

Referring to fig. 3, an embodiment of the present application provides an image sensor module 110, which includes a sensor 111, a first bonding pad 112, an adhesive 113, a light transmitting member 114, and a light limiting structure 115.

The sensor 111 is a member for acquiring an image. The sensor 111 has a first surface b1, and the first surface b1 includes a sensing region z1 and an edge region z2 disposed around the sensing region z 1. The sensing region is a region where pixels are provided on the sensing member 111, and the edge region z2 is a region where no pixels are provided on the sensing member 111. The sensor region may be arranged protruding from the edge region z2. The sensing region may be generally rectangular in configuration (e.g., square or rectangular), and the central axis of the sensing region and the central axis of the sensing member 111 may coincide with each other about the central axis a1. The edge region z2 may be disposed in a square ring shape, and the width of the edge region z2 is substantially the same throughout. Of course, the shape of the sensing area and the shape of the edge area can be adjusted according to the actual requirement, and the shape is not particularly limited herein.

The first pad 112 and the adhesive member 113 are both provided at the edge region z2 of the first surface b 1. The first bonding pad 112 is encapsulated in the adhesive 113. The first pads 112 may be electrically connected with corresponding components (such as the second pads 130 illustrated later) by means of wires L. The wires L may be connected to the first pads 112 and the corresponding components in a reverse bond (reverse bond) manner, so that the wires L may form a desired preset angle, which may be less than or equal to 45 degrees, so that the vertex of each wire L may be located at a lower height. The adhesive member 113 may protect the first pad 112 and the connection of the wire L with the first pad 112. The adhesive member 113 may be configured in a square ring structure, or may be configured in a circular ring structure, or may be configured in any other desired structure, which is not particularly limited in the embodiment of the present application.

The light transmitting member 114 is fixed to the sensing member 111 by means of the adhesive member 113. Due to the adhesive member 113, the transparent member 114 and the sensing member 111 form a space therebetween, so that the sensing region of the sensing member 111 can be conveniently sensed while protecting the sensing region of the sensing member 111. The light-transmitting member 114 may be a glass plate or other plate-like member capable of transmitting light, which is not particularly limited in the embodiment of the present application.

The light limiting structure 115 is disposed on the light transmitting member 114 for limiting a light propagation area. Specifically, the front projection of the bonding element 113 on the first surface b1 is located in the front projection of the light limiting structure 115 on the first surface b 1. That is, the specific arrangement and configuration of the light limiting structure 115 may be provided depending on the arrangement and configuration of the bonding member 113, so long as it can cover the bonding member 113 and define the propagation region of the light, and is not particularly limited herein.

Therefore, by disposing the light limiting structure 115 on the light transmitting member 114, and the orthographic projection of the bonding member 113 on the first surface b1 of the sensing member 111 is located in the orthographic projection of the light limiting structure 115 on the first surface b1, the light limiting structure 115 and the bonding member 113 can be substantially corresponding, before the light enters the bonding member 113, the light will pass through the light limiting structure 115, the light limiting structure 115 can limit the light propagation area, and thus the situation that the light enters the bonding member 113 and is reflected on the first bonding pad 112 due to the first bonding pad 112 being packaged in the bonding member 113 can be improved, thereby improving the reliability of acquiring images and improving the imaging quality.

In some embodiments, referring to fig. 3, the light limiting structure 115 is configured to allow light propagating along the first direction F1 to enter, and to block light propagating along the predetermined direction from entering the bonding element 113. The first direction F1 is perpendicular to the first surface b1, and the preset direction is disposed at an angle to the first direction F1. It should be noted that, the preset direction is not the only determined direction, and the preset direction refers to a direction that is disposed at an angle to the first direction F1. That is, only light rays traveling in the first direction F1 can pass through the light-limiting structure 115, and light rays traveling in the predetermined direction (and not the first direction F1) can be blocked by the light-limiting structure 115.

Thus, by means of the light limiting structure 115, not only the imaging light source can enter the sensing area along the first direction F1, but also oblique light can be blocked from illuminating the bonding element 113, and the situation that light rays near the sensing area enter the bonding element 113 is improved.

In some embodiments, referring to fig. 3, the light limiting structure 115 is configured to change a propagation path of the light propagating along the preset direction so as to block the light propagating along the preset direction from entering the bonding element 113.

Thus, light that is incident on the adhesive member 113 may be guided to a desired area (e.g., the outside of the image sensor module 110) by changing a propagation path of light propagating along a predetermined direction.

Fig. 4 is a schematic structural diagram illustrating the cooperation between the light-transmitting member 114 and the light-limiting structure 115 in the image sensor module 110 illustrated in fig. 3; FIG. 5 is a schematic diagram illustrating the light path of the light in the light confinement structure 115 of the image sensor module 110 shown in FIG. 3; for ease of illustration, only matters relevant to the embodiments of the present application are shown. In fig. 5, only the first film layer 115a and the second film layer 115b in the light confinement structure 115 are shown for convenience in illustrating the optical path of light.

In some embodiments, please continue to refer to fig. 3 in combination with fig. 4, the transparent member 114 has a second surface b2 facing the sensing member 111 and a third surface b3 facing away from the sensing member 111. The light limiting structure 115 includes a first film layer 115a disposed on the second surface b2 and a second film layer 115b disposed on the third surface b3. The front projection of the first film layer 115a on the first surface b1 and the front projection of the second film layer 115b on the first surface b1 coincide with each other. The second film layer 115b is configured as a semi-transparent and semi-reflective film, and one side of the first film layer 115a and the second film layer 115b opposite to each other can reflect the light incident through the second film layer 115b to an area other than the sensing area z 1. The bonding element 113 is in front projection of the first surface b1, in front projection of the first film layer 115a on the first surface b1, and in front projection of the second film layer 115b on the first surface b 1. That is, the first film layer 115a is a reflective film, and the second film layer 115b is a semi-transmissive reflective film. The second film layer 115b may partially reflect and partially transmit incident light incident to the second film layer 115b. It will be appreciated that only a portion of the light incident on the second film 115b is incident, and the light incident through the second film 115b is reflected multiple times between the first film 115a and the second film 115b.

Referring to fig. 5 in combination, taking the preset direction as the first preset direction Y1 as an example, a portion of the first incident light v1 incident on the second film layer 115b along the first preset direction Y1 passes through the second film layer 115b, and forms the first reflected light v2 between the first film layer 115a and the second film layer 115b, it can be seen that the first reflected light v2 is emitted to an area other than the sensing area z1 after multiple reflections.

In this way, by the interaction between the first film layer 115a and the second film layer 115b, the situation that the light enters the bonding member 113 and is reflected on the first bonding pad 112 due to the first bonding pad 112 being packaged in the bonding member 113 can be improved.

In some embodiments, referring to fig. 3 and 4, the first film layer 115a and/or the second film layer 115b are configured as a single film or as a multilayer film. That is, the first film layer 115a may be a single-layer film or a multi-layer film, and the second film layer 115b may be a single-layer film or a multi-layer film.

In this way, the number of layers of the first film layer 115a and the second film layer 115b can be flexibly set according to the actual use situation, so long as the corresponding use requirement can be achieved, and no specific limitation is imposed herein.

In some embodiments, referring to fig. 3 and 4, the first film layer 115a and/or the second film layer 115b are manufactured by a sputtering process, an evaporation process, or a spraying process.

In this way, the manufacturing process of the first film layer 115a and the manufacturing process of the second film layer 115b can be flexibly selected according to actual use conditions, so long as corresponding use requirements can be achieved, and no specific limitation is imposed herein.

In some embodiments, referring to fig. 3 and 4, the dimension of the first film layer 115a along the first direction F1 and/or the dimension of the second film layer 115b along the first direction F1 is greater than 5 microns and less than 200 microns. That is, the first film layer 115a has a first thickness d along the first direction F1 ₁ First thickness d ₁ Greater than 5 microns and less than 200 microns. The second film 115b has a second thickness d along the first direction F1 ₂ Second thickness d ₂ Greater than 5 microns and less than 200 microns.

In this way, the thickness of the first film layer 115a and the thickness of the second film layer 115b can be flexibly selected according to the actual use situation, so long as the corresponding use requirement can be achieved, and the method is not particularly limited herein.

In some embodiments, referring to fig. 3 and 4, the reflectivity of the first film layer 115a is greater than 90%.

Thus, the first film layer 115a is made to be a highly reflective film layer, so as to be beneficial to reflecting the light incident into the first film layer 115 a.

In some embodiments, please continue to refer to fig. 3 and 4, the transmittance of the second film layer 115b is 80% or more when the wavelength of the light is 420 nm to 680 nm.

In this manner, the second film layer 115b having a desired transmittance may be selected according to the use requirement to satisfy the limitation and change of the light path.

In some embodiments, referring to fig. 3 and 4, the first film 115a is made of aluminum, silver, copper, chromium, or platinum; and/or the second film layer 115b is made of polycarbonate, polymethyl methacrylate, thermoplastic polyester, or glass.

In this way, the material of the first film layer 115a and the material of the second film layer 115b can be flexibly selected according to the use requirement, so long as the reflection effect of the first film layer 115a and the half-through reaction effect of the second film layer 115b can be satisfied, and the method is not particularly limited.

FIG. 6 is a schematic diagram illustrating a cross-sectional structure of an image sensor module 110 according to another embodiment of the disclosure; fig. 7 is a schematic structural diagram of the light-transmitting member 114 and the light-limiting structure 115 of the image sensor module 110 shown in fig. 6; for ease of illustration, only matters relevant to the embodiments of the present application are shown.

In some embodiments, referring to fig. 6, the light-transmitting member 114 has a second surface b2 facing the sensor member 111. The light limiting structure 115 includes a plurality of protrusions 115c disposed on the second surface b2, the plurality of protrusions 115c defining a grating structure. Referring to fig. 7 in combination, a gap i is defined between two adjacent projections 115 c. The second incident light v3 incident in the first direction F1 can enter through the light confinement structure 115. In the case where the preset direction is the second preset direction Y2, the third incident light v4 along how the second preset direction Y2 is blocked by the convex portion 115 c.

In this way, the plurality of convex portions 115c can be used to form a grating structure, so as to limit the incident light angle, and further block the light blocking that can enter the bonding element 113 to affect the sensing process.

Fig. 8 is a schematic diagram showing the light transmitting member 114, the light limiting structure 115 and the reference plane R in the image sensor module 110 shown in fig. 6; for ease of illustration, only matters relevant to the embodiments of the present application are shown.

In some embodiments, please continue to refer to fig. 6 and 7, and refer to fig. 8, the size of the gap i gradually increases along a direction away from the light-transmitting member 114. The direction away from the light transmissive member 114 and the first direction F1 are parallel to each other. That is, the size of the gap i is the size of the gap i, which gradually increases in the first direction F1. Thus, the blocking of light by the outer wall of the convex portion 115c is more advantageous.

In some embodiments, please continue to refer to fig. 6-8, a plane passing through the plurality of protrusions 115c and parallel to the first direction F1 is defined as a reference plane R. The convex portion 115c intersects the reference plane R at a first intersection line j1 and a second intersection line j2, the first intersection lineThe line j1 and the second intersecting line j2 are both straight lines and are both disposed at an angle to the first direction F1. That is, the cross section of the convex portion 115c can be regarded as a trapezoid in general. Specifically, the first intersection line j1 forms a first predetermined angle α with the first direction F1 ₁ Setting the second intersection line j2 to form a second preset angle alpha with the first direction F1 ₂ And (5) setting. A first preset angle alpha ₁ With a second preset angle alpha ₂ Equal. For example, a first preset angle alpha ₁ And a second preset angle alpha ₂ All greater than 0 degrees and less than or equal to 40 degrees.

In this way, the first preset angle alpha can be flexibly set according to the use requirement ₁ And a second preset angle alpha ₂ And the cross-sectional shape of the convex portion 115c, the light directed to the adhesive member 113 can be blocked while facilitating the incidence of the light in the first direction F1.

Of course, in other embodiments, a gap i is defined between two adjacent protrusions 115 c. The size of the gap i is unchanged along the first direction F1. The setting may be made according to actual use conditions, and is not limited herein.

In some embodiments, referring to fig. 6 to 8, the protrusion 115c has a first end e1 connected to the light-transmitting member 114 and a second end e2 far from the light-transmitting member 114; the dimension between the first ends e1 of the adjacent two convex portions 115c is a first dimension x1, and the dimension between the second ends e2 of the adjacent two convex portions 115c is a second dimension x2. The first dimension x1 is from 0.05 microns to 10 microns and the second dimension x2 is from 0.05 microns to 100 microns. In this way, the sizes of the required first dimension x1 and the second dimension x2 can be determined according to the trend of the variation of the required gap i.

In some embodiments, please continue with fig. 6-8, the dimension of the convex portion 115c along the first direction F1 is 0.05 micrometers to 5 micrometers. That is, the dimension of the convex portion 115c along the first direction F1 is the third thickness d ₃ Third thickness d ₃ From 0.05 microns to 5 microns. In this manner, the thickness of the protruding portion 115c required can be set according to the manufacturing process and the related use requirements.

In some embodiments, referring to fig. 6-8, the light limiting structure 115 is configured as a single layer film or as a multilayer film. In this way, the number of layers of the light limiting structure 115 can be flexibly set according to the actual use situation, so long as the corresponding use requirement can be achieved, and no specific limitation is made here.

In some embodiments, please continue to refer to fig. 6-8, the light limiting structure 115 is manufactured through a sputtering process, an evaporation process, or a spraying process. In this way, the manufacturing process of the light limiting structure 115 can be flexibly selected according to the actual use situation, so long as the corresponding use requirement can be achieved, and no specific limitation is made herein.

In some embodiments, please continue to refer to fig. 6-8, the light-confining structure 115 has a transmittance of greater than 30%. Thus, the light limiting structure 115 with a desired transmittance may be selected according to the requirements of the application to satisfy the limitation of the light path.

In some embodiments, referring to fig. 6 to 8, the light limiting structure 115 is made of acrylic plastic, epoxy or photoresist. In this way, the material of the light limiting structure 115 can be flexibly selected according to the use requirement, so long as the blocking effect and the partial penetrating effect of the light limiting structure 115 can be satisfied, and the material is not particularly limited herein.

Fig. 9 is a schematic diagram showing a configuration of the image sensor module 110 shown in fig. 3 mated with the lens S; fig. 10 is a schematic diagram illustrating a structure of the image sensor module 110, the lens S, and the first light P1 and the second light P2 illustrated in fig. 9; fig. 11 shows a schematic structural diagram between the structure shown in fig. 10 and a reference plane E; fig. 12 is a schematic structural diagram of the image sensor module 110 shown in fig. 6 mated with the lens S; fig. 13 is a schematic diagram illustrating a structure of the image sensor module 110, the lens S, and the first light P1 and the second light P2 illustrated in fig. 12; fig. 14 shows a schematic structural diagram between the structure shown in fig. 13 and a reference plane E; for ease of illustration, only matters relevant to the embodiments of the present application are shown. The paths and areas formed by the first light ray P1 and the second light ray P2 after passing through the lens S are shown in fig. 10, 11, 13 and 14 with different marks. Meanwhile, for convenience of illustrating the related structure, only the second film layer 115b of the light limiting structure 115 is illustrated in fig. 9. It will be appreciated that since fig. 10 and 13 are both cross-sectional views, the relevant boundary line in fig. 10 and 13 illustrates a single point.

In some embodiments, referring to fig. 9 to 14, and referring to fig. 3 to 8 in combination, a side of the light transmitting member 114 facing away from the sensing member 111 is used for disposing a lens S, an optical axis a2 of the lens S and a central axis a1 of the sensing region coincide with each other, a focal point (not labeled in the drawing) of the lens S is located in the sensing region z1, a focal length of the lens S is a focal length f, and the lens S is used for converging light onto the sensing region z1 to form a light converging region, and the light converging region has a converging end located on the lens S. The first light P1 forms a first light converging area q1, and the second light P2 forms a second light converging area q2. It can be understood that the light converging area is an area between the lens S and the image sensor module 110. The converging end of the first light converging area q1 is a first converging end q11, the converging end of the second light converging area q2 is a second converging end q21, and the first converging end q11 and the second converging end q21 are overlapped with each other. The first light P1 is a light incident along the first direction F1, and the specific direction of the second light P2 can be determined according to the specific usage scenario. That is, the direction of the second light ray P2 is the most extreme one of the preset directions in some embodiments.

The light confinement structure 115 includes a light confinement portion selectively allowing light to pass therethrough, the light confinement portion having an alignment region z3 disposed opposite the sensing region z1 along the first direction F1, and a non-alignment region z4 not opposite the sensing region z 1. Taking fig. 9 to 11 as an example, the light limiting portion is a second film layer 115b, and taking fig. 12 to 14 as an example, the light limiting portion is a plurality of convex portions 115c forming a grating structure.

Referring to fig. 10 and 13 in combination, the alignment region z3 has a first edge t1 proximate the central axis a1 and a second edge t2 facing away from the central axis a 1; the non-alignment region z4 has a third edge t3 coinciding with the second edge t2, and a fourth edge t4 facing away from the alignment region z 3; the adhesive layer has a fifth edge t5 adjacent the central axis a1 and connected to the sensor element 111, and a sixth edge t6 facing away from the central axis a1 and connected to the sensor element 111.

Referring to fig. 10 and 11, and fig. 13 and 14, an intersection point of the convergence end and the reference plane E is defined as a first reference point n1, an intersection point of the first edge t1 and the reference plane E is defined as a second reference point n2, an intersection point of the second edge t2 and the reference plane E is defined as a third reference point n3, and an intersection point of the fifth edge t5 and the reference plane E is defined as a fourth reference point n4.

With continued reference to fig. 10 and 11, and fig. 13 and 14, the line connecting the first reference point n1 and the fourth reference point n4 located on different sides of the central axis a1 is a first line u1, and the line connecting the second reference point n2 and the fourth reference point n4 located on the same side of the central axis a1 and the portion of the first line u1 where the fourth reference point n4 is located coincide with each other; the first reference point n1, the third reference point n3 and the fourth reference point n4 which are positioned on the same side of the central axis a1 are positioned on the second connecting line u 2; the line between the fourth reference point n4 and the optical center O of the lens S is a third line u3. For convenience of illustration, an extension line of the third connection line u3 is illustrated in fig. 11 and 14, and the third connection line u3 is illustrated with an extension line of the third connection line u3.

With continued reference to fig. 9-14, the first and second lines u1 and u2 having the same fourth reference point n4 form a first reference angle θ ₁ Setting a first reference angle theta ₁ The method meets the following conditions: tan theta ₁ ＝(2d ₀ +h)/f. The first connecting line u1 and the third connecting line u3 with the same fourth reference point n4 form a second reference angle theta ₂ Setting a second reference angle theta ₂ The method meets the following conditions: tan theta ₂ ＝f/(d ₀ +h). The distance between the first edge t1 and the third edge t3 along the second direction F2 is the first distance g ₁ The distance between the third edge t3 and the fourth edge t4 along the second direction F2 is the second distance g ₂ The light limiting structure 115 has a dimension along the second direction F2 of a width w, where the width w satisfies: w=g ₁ +g ₂ ＝g ₂ +[(h+2d ₀ )/f)]×k。

Where F is the focal length of the lens S, h is the dimension of the sensing region z1 along the second direction F2, and referring to FIG. 15 and FIG. 16 in combination, FIG. 15 shows a schematic view of the partial enlargement at C in FIG. 9, FIG. 16 shows a schematic view of the partial enlargement at D in FIG. 12, and D ₀ The dimensions of the bonding element 113 and the sensing region z1 along the second direction F2, i.e. dimension d ₀ For bondingThe spacing between the member 113 and the sensing region z 1. k is the dimension of the bonding member 113 in the first direction F1, that is, the dimension k is the thickness dimension of the bonding member 113. The second direction F2 is perpendicular to the first direction F1 and parallel to the reference plane E; the reference plane E is a plane passing through the optical center O of the lens S and the focal point F of the lens S, and is parallel to the first direction F1.

Thus, by defining the first reference angle theta ₁ Second reference angle theta ₂ The relation between the width w of the light limiting structure 115 and the corresponding relevant dimension can further facilitate the light limiting effect of the light limiting structure 115.

Fig. 17 is a schematic structural diagram of an image sensor device 100 according to an embodiment of the disclosure; fig. 18 is a schematic structural diagram of an image sensor device 100 according to another embodiment of the present disclosure; for ease of illustration, only matters relevant to the embodiments of the present application are shown.

Based on the same inventive concept, please refer to fig. 17 and 18, the embodiment of the present application further provides an image sensor device 100, which includes a substrate 120, a second pad 130, and the image sensor module 110 in any of the above embodiments. Fig. 17 illustrates an image sensor device 100 fabricated by using the image sensor module 110 illustrated in fig. 3, and fig. 18 illustrates an image sensor device 100 fabricated by using the image sensor module 110 illustrated in fig. 6.

Further, the substrate 120 has a mounting surface m1, the second pad 130 is disposed on the mounting surface m1, and the sensor 111 of the image sensor module 110 is disposed on the mounting surface m1. The first pad 112 and the second pad 130 are connected by a wire L, a portion of which is located in the adhesive member 113.

The substrate 120 is a member for carrying relevant components in the image sensor device 100. The substrate 120 may be a plastic substrate, a ceramic substrate, a lead frame (lead frame), or other plate-like member, which is not particularly limited in the embodiments of the present application. The substrate 120 has a mounting surface m1 and a mounting back surface m2 disposed opposite to each other in the first direction F1. The first pad 112 is electrically connected to the second pad 130 by a wire L. The wire L may be connected to the first pad 112 and the second pad 130 in a reverse bond (reverse bond) manner.

The advantages of the image sensor module 110 and the related embodiments in the above embodiments are similar to those of the image sensor device 100, and may be implemented in the same way, which is not described herein again.

It should be noted that, as shown in fig. 17 to 18, the image sensor device 100 may further include a package structure 140. The encapsulation structure 140 is a hollow structure and may be made of a thermosetting encapsulant material. The thermosetting sealing material can be epoxy resin, phenolic resin, catalyst or silicon micropowder, and the embodiment of the application is not particularly limited. The side surfaces of the sensing element 111, the adhesive element 113 and the light-transmitting element 114 are attached to the inner wall of the package structure 140150. That is, the sensing element 111 and the bonding element 113 are encapsulated in the encapsulation structure 140, and the third surface b3 of the light-transmitting element 114 is substantially flush with the encapsulation structure 140. In addition, the wire L and the second pad 130 are also encapsulated in the encapsulation structure 140 to avoid the bonding wire L and the second pad 130 from being exposed to the outside. A plurality of pads (not shown) may be provided on the mounting back surface m2 of the substrate 120, and a plurality of solder balls 150 may be soldered and fixed by means of the plurality of pads. That is, the substrate 120 may have a Ball Grid Array (BGA) configuration, but the embodiment of the present application is not limited thereto.

Based on the same inventive concept, the embodiments of the present application further provide an electronic device, including the image sensing module 110 in any of the above embodiments; alternatively, the image sensor device 100 in any of the above embodiments.

The advantages of the image sensor module 110 and the related embodiments in the above embodiments are similar to those of the electronic device, and may be implemented in the same way, which is not described herein again.

It should be understood that the image sensing module 110 and the image sensing apparatus 100 provided in the above embodiments may be applied to the fields of mobile phone terminals, bionic electronics, electronic skins, wearable devices, vehicle-mounted devices, internet of things devices, artificial intelligence devices, and the like. For example, the electronic device may be an in-vehicle electronic device, an unmanned aerial vehicle, a sweeping robot, a barcode recognition device, a face/biometric recognition device, an intelligent education device, or the like. The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (16)

1. An image sensor module, comprising:

a sensing member having a first surface; the first surface includes a sensing region and an edge region disposed about the sensing region;

the first bonding pad and the bonding piece are arranged in the edge area of the first surface; the first bonding pad is encapsulated in the bonding piece;

the light transmission piece is fixed with the sensing piece by means of the bonding piece; and

The light limiting structure is arranged on the light transmitting piece and used for limiting a light transmission area;

the bonding piece is positioned in the orthographic projection of the light limiting structure on the first surface.

2. The image sensor module of claim 1, wherein the light confining structure is configured to allow light propagating in a first direction to enter and to block light propagating in a predetermined direction from entering the adhesive member;

The first direction is perpendicular to the first surface, and the preset direction and the first direction are arranged at an angle.

3. The image sensor module of claim 2, wherein the light limiting structure is configured to change a propagation path of light propagating along the predetermined direction to block light propagating along the predetermined direction from entering the adhesive member.

4. The image sensor module of claim 3, wherein the light transmissive member has a second surface facing the sensor member and a third surface facing away from the sensor member;

the light limiting structure comprises a first film layer arranged on the second surface and a second film layer arranged on the third surface; the orthographic projection of the first film layer on the first surface and the orthographic projection of the second film layer on the first surface are overlapped with each other;

the second film layer is configured as a semi-transparent and semi-reflective film, and one side of the first film layer and the second film layer opposite to each other can reflect light incident through the second film layer to an area outside the sensing area;

the bonding element is in front projection of the first surface, in front projection of the first film layer on the first surface, and in front projection of the second film layer on the first surface.

5. The image sensor module of claim 4, wherein the first film layer and/or the second film layer is configured as a single-layer film or a multi-layer film; and/or

The first film layer and/or the second film layer are manufactured through a sputtering process, an evaporation process or a spraying process; and/or

The dimension of the first film layer along the first direction and/or the dimension of the second film layer along the first direction is greater than 5 microns and less than 200 microns; and/or

The reflectivity of the first film layer is more than 90%; and/or

Under the condition that the wavelength of light is 420-680 nanometers, the transmittance of the second film layer is more than or equal to 80%; and/or

The first film layer is made of aluminum, silver, copper, chromium or platinum; and/or

The second film layer is made of polycarbonate, polymethyl methacrylate, thermoplastic polyester or glass.

6. The image sensor module of claim 2, wherein the light transmissive member has a second surface facing the sensor member;

the light limiting structure comprises a plurality of convex parts arranged on the second surface, and the convex parts limit the grating structure.

7. The image sensor module of claim 6, wherein a gap is defined between two adjacent protrusions;

The size of the gap gradually increases along the direction away from the light-transmitting piece; the direction away from the light-transmitting member and the first direction are parallel to each other.

8. The image sensor module of claim 7, wherein a plane passing through the plurality of protrusions and parallel to the first direction is defined as a reference plane;

the convex part and the reference surface intersect at a first intersection line and a second intersection line; the first intersecting line and the second intersecting line are straight lines and are arranged at an angle with the first direction.

9. The image sensor module of claim 8, wherein the first intersection line is disposed at a first predetermined angle with respect to the first direction, and the second intersection line is disposed at a second predetermined angle with respect to the first direction;

the first preset angle is equal to the second preset angle.

10. The image sensor module of claim 9, wherein the first predetermined angle and the second predetermined angle are both greater than 0 degrees and less than or equal to 40 degrees.

11. The image sensor module of claim 6, wherein a gap is defined between two adjacent protrusions;

the size of the gap is constant along the first direction.

12. The image sensor module of claim 6, wherein the protrusion has a first end connected to the light transmissive member and a second end remote from the light transmissive member; the dimension between the first ends of two adjacent convex parts is a first dimension, and the dimension between the second ends of two adjacent convex parts is a second dimension; the first dimension is from 0.05 microns to 10 microns and the second dimension is from 0.05 microns to 100 microns; and/or

The dimension of the convex portion in the first direction is 0.05 micrometers to 5 micrometers.

13. The image sensor module of claim 6, wherein the light confining structure is configured as a single layer film or a multi-layer film; and/or

The light limiting structure is manufactured through a sputtering process, an evaporation process or a spraying process; and/or

The penetration of the light limiting structure is more than 30%; and/or

The light limiting structure is made of acrylic plastic, epoxy resin or photoresist.

14. The image sensing module according to any one of claims 1-13, wherein a side of the light transmitting member facing away from the sensing member is configured to be provided with a lens, an optical axis of the lens and a central axis of the sensing region coincide with each other, a focal point of the lens is located in the sensing region, the lens is configured to focus light on the sensing region to form a light-focusing region, and the light-focusing region has a focusing end located on the lens;

The light limiting structure comprises a light limiting part which selectively allows light to pass through, and the light limiting part is provided with an alignment area which is arranged opposite to the sensing area along the first direction and a non-alignment area which is not opposite to the sensing area; the alignment region has a first edge proximate the central axis and a second edge facing away from the central axis; the non-alignment region has a third edge coincident with the second edge and a fourth edge facing away from the alignment region; the adhesive layer has a fifth edge proximate the central axis and connected to the sensing element;

defining an intersection point of the converging end and a reference surface as a first reference point, wherein the intersection point of the first edge and the reference surface is a second reference point, the intersection point of the second edge and the reference surface is a third reference point, and the intersection point of the fifth edge and the reference surface is a fourth reference point;

the connecting line of the first reference point and the fourth reference point which are positioned on different sides of the central axis is a first connecting line, and the connecting line of the second reference point and the fourth reference point which are positioned on the same side of the central axis and the first connecting line part where the fourth reference point is positioned are overlapped with each other; the first reference point, the third reference point and the fourth reference point which are positioned on the same side of the central axis are positioned on a second connecting line; the connecting line of the fourth reference point and the optical center of the lens is a third connecting line;

Wherein the first connecting line and the second connecting line with the same fourth reference point form a first reference angle theta ₁ Setting the first reference angle theta ₁ The method meets the following conditions:

tanθ ₁ ＝(2d ₀ +h)/f；

the first connecting line and the third connecting line with the same fourth reference point form a second reference angle theta ₂ Setting the second reference angle theta ₂ The method meets the following conditions:

tanθ ₂ ＝f/(d ₀ +h)；

the distance between the first edge and the third edge along the second direction is a first distance g ₁ The distance between the third edge and the fourth edge along the second direction is a second distance g ₂ Ruler of the light limiting structure along the second directionThe dimensions are width w, which satisfies:

w＝g ₁ +g ₂ ＝g ₂ +[(h+2d ₀ )/f)]×k；

f is the focal length of the lens, h is the dimension of the sensing region along the second direction, d ₀ K is the dimension of the bonding element and the sensing area along the second direction, and k is the dimension of the bonding element along the first direction;

the second direction is perpendicular to the first direction and parallel to the reference plane; the reference plane is a plane passing through the optical center of the lens and the focal point of the lens, and the reference plane and the first direction are parallel to each other.

15. An image sensor device, comprising:

A substrate having a mounting surface;

the second bonding pad is arranged on the mounting surface; and

The image sensor module of any one of claims 1-14, wherein the sensor element of the image sensor module is disposed on the mounting surface;

wherein the first bonding pad and the second bonding pad are connected by a wire, and a part of the wire is positioned in the bonding piece.

16. An electronic device, comprising the image sensing module of any one of claims 1-14; or alternatively

An image sensing apparatus comprising the device of claim 15.