CN117634455A - Guidance file generation method, computer device, and storage medium - Google Patents

Abstract

The application provides a guide file generation method, a computer device and a storage medium, wherein the method is applied to electronic equipment and comprises the following steps: determining a first equipment mainboard and a second equipment mainboard of target equipment; comparing the knowledge graph of the first equipment main board with the knowledge graph of the second equipment main board to obtain an alignment result; generating a first test frame corresponding to the first equipment mainboard based on a first detection object corresponding to the first equipment mainboard and a detection operation step corresponding to the first equipment mainboard; according to the alignment result, replacing the first detection object in the first test frame with a second detection object in a second equipment main board to obtain a second test frame; and generating a test instruction file corresponding to the second equipment mainboard according to the second test frame. The method can automatically generate the test instruction file for the second equipment mainboard based on the detection operation step of the first equipment mainboard, and improves the efficiency of the test instruction file.

Description

Guidance file generation method, computer device, and storage medium

Technical Field

The present disclosure relates to the field of device testing, and in particular, to a method for generating a guide file, a computer device, and a storage medium.

Background

A device motherboard is a core component of an electronic device, also known as a system board. The system is used as the basis of various electronic devices such as a computer, a mobile phone, a tablet personal computer and the like, and bears various core functions of the electronic devices and connection and coordination work with other hardware components. There are many important components on the device motherboard including a processor (Central Processing Unit, CPU), a Memory (Random Access Memory, RAM), a Memory chip (ROM), a graphics processor (Graphics Processing UnitGPU), a wireless communication chip, an audio chip, a power management chip, and the like. These components work cooperatively to ensure that the electronic device is able to function properly and perform a variety of tasks. The components are connected with each other through the lead and the metal tracking to form a complete circuit, so that the high integration and the functions of the mobile phone are realized.

The equipment main board fault point detection is to analyze and detect the faults of equipment when the equipment main board cannot normally run due to a certain fault, and finally determine the specific electronic component causing the fault. In order to guide maintenance staff to detect the equipment main board, the public will provide test guidance files for the maintenance staff. However, the current test instruction files are all written manually, and the workload is large, so that the efficiency of generating the test instruction files is poor. Moreover, the device motherboard of the electronic device is frequently updated, and each new device motherboard needs to be rewritten with a test instruction file.

Disclosure of Invention

The embodiment of the application discloses a method for generating a guide file, computer equipment and a storage medium, which solve the technical problem that the efficiency of generating the test guide file is poor because the test guide file cannot be automatically generated.

The application provides a guide file generation method, which is applied to electronic equipment, and comprises the following steps: determining a first equipment mainboard and a second equipment mainboard of target equipment; comparing the knowledge graph of the first equipment main board with the knowledge graph of the second equipment main board to obtain an alignment result; generating a first test frame corresponding to the first equipment mainboard based on a first detection object corresponding to the first equipment mainboard and a detection operation step corresponding to the first equipment mainboard; according to the alignment result, replacing the first detection object in the first test frame with a second detection object in the second equipment main board to obtain a second test frame; and generating a test instruction file corresponding to the second equipment mainboard according to the second test frame.

In some optional embodiments, before the generating the first test frame corresponding to the first device motherboard based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard, the method further includes: determining a plurality of first detection steps based on the detection operation steps of the first device motherboard; and determining a plurality of first detection objects according to the plurality of first detection steps.

In some optional embodiments, the generating, based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard, a first test frame corresponding to the first device motherboard includes: determining an unstructured detection step corresponding to the first equipment mainboard based on the detection operation step corresponding to the first equipment mainboard; and generating the first test frame corresponding to the first equipment mainboard based on the first detection object, the first detection step and the unstructured detection step.

In some optional embodiments, the determining a plurality of the first detection objects according to the first detection step includes: if the detection type corresponding to any one of the plurality of first detection steps is a visual detection type, determining a component entity in any one of the plurality of first detection steps as the first detection object; or if the detection type corresponding to any one of the plurality of first detection steps is a numerical detection type, determining a combination of the component entity in any one of the first detection steps and the circuit entity corresponding to the component entity as the first detection object.

In some optional embodiments, the first test object includes a first component entity and a first circuit entity corresponding to the first component entity, and the generating the first test frame based on the first test object includes: determining a target line entity corresponding to the first component entity based on a knowledge reasoning algorithm; comparing the target circuit entity with the first circuit entity to determine whether the first circuit entity has a defect; if the first circuit entity is missing, updating the first detection object according to the target circuit entity; and generating the first test framework based on the updated first detection object.

In some optional embodiments, the alignment result includes a component alignment result and a line alignment result, and the comparing the knowledge graph of the first device motherboard with the knowledge graph of the second device motherboard to obtain the alignment result includes: calculating similarity based on names, categories and functions of components in the first equipment main board and the second equipment main board, and obtaining an alignment result of the components based on the calculated similarity; modeling a main board structure of the first equipment main board based on a knowledge graph of the first equipment main board to obtain a first connection relation, wherein the first connection relation is used for representing the connection relation between components and circuits in the first equipment main board; modeling a main board structure of the second equipment main board based on the knowledge graph of the second equipment main board to obtain a second connection relationship, wherein the second connection relationship is used for representing the connection relationship between components and circuits in the second equipment main board; and obtaining the line alignment result according to the component alignment result, the first connection relation and the second connection relation.

In some optional embodiments, the generating, according to the second test frame, a test instruction file corresponding to the second device motherboard includes: determining a second detection step corresponding to the second detection object according to the first detection step of the first detection object corresponding to the second detection object; and sequencing the second detection steps based on the sequence of the second detection objects in the second test framework to obtain a test instruction file.

In some optional embodiments, the sorting the second detection steps based on the order of the second detection objects in the second test frame, to obtain a test instruction file includes: if the second detection object corresponding to any second detection step is a circuit entity, determining whether the circuit entity meets the condition of measurement detection; and if the condition for measuring and detecting is determined to be met, adding a target measuring step corresponding to the circuit entity in the second detecting step.

The application also provides a computer device comprising a processor and a memory, the processor being configured to execute a computer program stored in the memory to implement the guidance file generation method.

The present application also provides a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the guidance file generation method.

In the guide file generation method provided by the application, the alignment result can be obtained by comparing the knowledge graph of the first equipment main board of the target equipment with the knowledge graph of the second equipment main board; generating a first test frame corresponding to the first equipment mainboard based on a first detection object corresponding to the first equipment mainboard and a detection operation step corresponding to the first equipment mainboard; according to the alignment result, a second detection object corresponding to the first detection object can be determined in a second equipment main board, so that the first detection object in the first test frame can be replaced by the second detection object in the second equipment main board, and a second test frame is obtained; and finally, generating a test guidance file corresponding to the second equipment mainboard according to the second test framework, so that the test guidance file of the new version equipment is automatically generated based on the detection operation step of the old version equipment mainboard, and the writing efficiency of the test guidance file is improved.

Drawings

Fig. 1 is a schematic flow chart of a method for generating a guide file according to an embodiment of the present application.

Fig. 2 is a flowchart of a knowledge graph generation method provided in an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a computer device according to an embodiment of the present application.

Detailed Description

For ease of understanding, a description of some of the concepts related to the embodiments of the present application are given by way of example for reference.

It should be noted that "at least one" in this application means one or more, and "a plurality" means two or more. "and/or", describes an association relationship of an association object, and the representation may have three relationships, for example, a and/or B may represent: a alone, a and B together, and B alone, wherein a, B may be singular or plural. The terms "first," "second," "third," "fourth" and the like in the description and in the claims and drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

A device motherboard is a core component of an electronic device, also known as a system board. The equipment main board fault point detection is to analyze and detect the faults of equipment when the equipment main board cannot normally run due to a certain fault, and finally determine the specific electronic component causing the fault. In order to guide maintenance staff to detect the equipment main board, the public will provide test guidance files for the maintenance staff. However, the current test instruction files are all written manually, and the workload is large, so that the efficiency of generating the test instruction files is poor. Moreover, the device main board of the electronic device is frequently updated, and the test instruction file needs to be rewritten every time when a new device main board is used, so that great manpower is required to be consumed.

In order to solve the technical problem that the efficiency of generating test guidance files is poor due to the fact that the test guidance files cannot be automatically generated, the application provides a guidance file generation method, electronic equipment and a storage medium, and an alignment result can be obtained by comparing a knowledge graph of a first equipment main board of target equipment with a knowledge graph of a second equipment main board; generating a first test frame corresponding to the first equipment mainboard based on a first detection object corresponding to the first equipment mainboard and a detection operation step corresponding to the first equipment mainboard; according to the alignment result, a second detection object corresponding to the first detection object can be determined in a second equipment main board, so that the first detection object in the first test frame can be replaced by the second detection object in the second equipment main board, and a second test frame is obtained; and finally, generating a test guidance file corresponding to the second equipment mainboard according to the second test framework, so that the test guidance file of the new version equipment is automatically generated based on the detection operation step of the old version equipment mainboard, and the writing efficiency of the test guidance file is improved.

The instruction file generation method provided by the embodiment of the application is applied to electronic equipment. By way of example, the electronic device in the embodiments of the present application may be a mobile phone, tablet computer, desktop computer, laptop computer, handheld computer, notebook computer, ultra-mobile personal computer (UMPC), or the like.

In order to better understand the guidance file generation method, the electronic device and the storage medium provided in the embodiments of the present application, the guidance file generation method of the present application is described below with reference to the accompanying drawings.

Fig. 1 is a flowchart of a method for generating a guide file according to an embodiment of the present application. The guide file generation method is applied to the electronic equipment. The order of the steps in the flowchart may be changed and some steps may be omitted according to various needs.

Step S100, determining a first device motherboard and a second device motherboard of a target device.

The target device may be a cell phone, tablet computer, desktop computer, laptop computer, handheld computer, notebook computer, ultra-mobile personal computer (UMPC), etc.

The second device motherboard is a motherboard of the target device, which is currently required to generate an operation instruction book. The first device motherboard is a history motherboard before the second device motherboard. For example, the second device motherboard is the current device motherboard of the target device, and the first device motherboard may be the device motherboard of the previous generation of the target device. If the second device motherboard is the device motherboard of the 7 th generation of the target device, the first device motherboard is the device motherboard of the 6 th generation of the target device.

Step S101, comparing the knowledge graph of the first device motherboard with the knowledge graph of the second device motherboard to obtain an alignment result.

In an embodiment of the present application, after receiving the instruction for generating the instruction file, the user may compare the knowledge graph of the first device motherboard of the target device with the knowledge graph of the second device motherboard. The instruction file generation instruction is used for controlling the electronic equipment to generate a test instruction file corresponding to the target equipment. In an embodiment of the present application, a knowledge graph of a device motherboard may be constructed according to a component list and a component connection relationship of the device motherboard. For some embodiments of constructing a knowledge-graph, reference may be made to the relevant description of fig. 2 below.

In an embodiment of the present application, a knowledge fusion correlation algorithm may be used to find a correspondence between a component, a line, a command, and a phenomenon in a knowledge graph of a first device motherboard and a knowledge graph of a second device motherboard, so as to obtain an alignment result. The alignment results may include component alignment results, line alignment results, command alignment results, and phenomenon alignment results.

The component alignment results may include alignment results of functional components on a device motherboard. Functional components are components that can individually perform a particular function, such as Integrated Circuits (ICs), capacitors, resistors, crystal oscillators, sensors, and the like. The functional components can be connected to the device motherboard by welding or inserting. In an embodiment of the present application, an alignment algorithm used for knowledge fusion of component alignment may perform similarity calculation according to names, categories and functions of components in the first device motherboard and the second device motherboard, and finally perform weighted calculation on a result of the similarity calculation, to finally obtain an alignment result of the components. For example, the similarity may be calculated based on names, categories, and functions of components in the first device motherboard and the second device motherboard, and the component alignment result may be obtained based on the calculated similarity. A similarity threshold may be preset, and when the similarity of the two components is greater than or equal to the similarity threshold, it is determined that the two components are aligned; when the similarity of the two components is less than the similarity threshold, it is determined that the two components are not aligned. The similarity of the components in the first device motherboard to each component in the second device motherboard may be calculated in turn based on the name, category, and function.

The line alignment results may include alignment results of lines on a device motherboard. In an embodiment of the present application, the alignment operation may be performed on the circuit according to the component alignment result, to obtain the circuit alignment result. For example, modeling a main board structure of a first equipment main board based on a knowledge graph of the first equipment main board to obtain a first connection relationship; and modeling the main board structure of the second equipment main board based on the knowledge graph of the second equipment main board to obtain a second connection relation. The first connection relationship is used to represent a connection relationship between a component and a circuit in the first device motherboard, and may include each circuit connected to the component. The second connection relationship is used to represent a connection relationship between the component and the circuit in the second device motherboard, and may include each circuit connected to the component. And obtaining a line alignment result based on the first connection relationship, the second connection relationship and the component alignment result. For example, component a and component B in the first device motherboard are connected by line C, component D and component E in the second device motherboard are connected by line F, component a is aligned with component D, component B is aligned with component E, and line C is determined to be aligned with line F.

In an embodiment of the present application, a target alignment line may be obtained based on the connection relationship and the component alignment result; and obtaining a line alignment result based on the target alignment line and the functional information of the line. For example, based on the connection relation and the component alignment result, a target alignment line is obtained: line C is aligned with line F. And determining whether the circuit is aligned in the target alignment circuit based on the circuit functional information, and obtaining a circuit alignment result. If the functions of the circuits in the target alignment circuit are the same, determining the circuit alignment in the target alignment circuit; if the functions of the lines in the target alignment line are different, determining that the lines in the target alignment line cannot be aligned. For example, if the function of line C is the same as that of line F, determining that line C is aligned with line F; if the functions of the line C and the line F are different, it is determined that the line C and the line F cannot be aligned.

The command alignment results may include alignment results of test commands in a test log. In an embodiment of the present application, a test command alignment may be performed on a first test log of a first device motherboard and a second test log of a second device motherboard, to obtain a command alignment result. The test log is a log file recorded when the test machine detects the assembly according to the test file, and is used for acquiring related information such as a test command, a test standard return value and the like required during testing. In an embodiment of the present application, the device motherboard performs a test after production is completed, and generates a test log. The first test log and the second test log may be subject to a test command alignment based on a content matching method. In an embodiment of the present application, if the first test log and the second test log are the same workstation, the first test log and the second test log are subjected to test command alignment, so as to obtain a command alignment result. If the first test log and the second test log are not the same workstation, the first test log and the second test log are not aligned with the test command. The identical test command function in the test logs under the same workstation is highly likely to be identical, and the identical test command functions in the test logs under different workstations are likely to be different.

The phenomenon alignment result may include an alignment result of an adverse phenomenon, such as an alignment effect including functional related adverse information. The adverse phenomenon is abnormal information to be detected. Bad information, such as no signal, bad signal, no resistance value, may be preset. In an embodiment of the present application, a phenomenon alignment result of the knowledge graph of the first device motherboard and the knowledge graph of the second device motherboard may be determined based on a similarity algorithm of the word vectors. And calculating the similarity of the first adverse phenomenon in the first equipment main board and the second adverse phenomenon in the second equipment main board based on a similarity algorithm of the word vectors. If the similarity is greater than a preset similarity threshold, determining that the first adverse phenomenon is aligned with the second adverse phenomenon; if the similarity is less than or equal to the similarity threshold, determining that the first adverse phenomenon is not aligned with the second adverse phenomenon. The similarity threshold may be set according to the actual situation. For example, the similarity threshold is 0.8, the similarity between the first adverse event "no signal" and the second adverse event "no signal" is 0.92, the similarity is greater than the similarity threshold, and the first adverse event "no signal" is determined to be aligned with the second adverse event "no signal".

Step S102, generating a first test frame corresponding to the first device motherboard based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard.

The detecting operation step may be a manual writing operation step for guiding the detection of the first device motherboard. For example, it may be an operation step written by a manufacturer of the device motherboard.

The first detection object is an object corresponding to a detection step related to the main board structure. The first detection object may correspond to one or more components in the first device motherboard. The first test framework may include a detection order corresponding to all the detection objects in the first device motherboard, for example, may include a detection order of each detection object in the first detection objects. In an embodiment of the present application, the first test frame includes a first test object, and a test sequence corresponding to each test object in the first test object. The detection sequence is used for indicating the detection sequence, for example, the detection sequence of a detection object is 1, which indicates the first detection of the detection object; for another example, a detection sequence of 7 for a detection object indicates a seventh detection of the detection object.

In an embodiment of the present application, the first detection object may be determined in a knowledge graph of the first device motherboard based on a knowledge reasoning algorithm. The measurement module to be measured can be determined based on the adverse phenomenon to be detected of the first equipment motherboard. The measuring module is a module which needs to be detected. One metrology module may correspond to one or more components. And determining the function corresponding to the measurement module based on a knowledge reasoning algorithm, determining a component corresponding to the function as a component corresponding to the measurement module in a knowledge graph of the first equipment main board, and determining the component corresponding to the measurement module as a first detection object.

In an embodiment of the present application, before the generating the first test frame corresponding to the first device motherboard based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard, the method includes: determining a plurality of first detection steps based on the detection operation steps of the first equipment main board; and determining a plurality of first detection objects according to the plurality of first detection steps.

The first detection step is a detection step related to the main board structure, and may include a visual inspection step, a diode measurement step, a voltage measurement step, and the like. When the detection operation step of the first device main board includes a plurality of first detection steps, a plurality of first detection objects can be determined. In an embodiment of the present application, based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard, generating a first test frame corresponding to the first device motherboard includes: and generating a first test frame corresponding to the first equipment mainboard based on the first detection object and the first detection step. The first test frame comprises a mapping relation between the first detection object and the first detection step.

The detecting operation includes the components to be measured. The first detection object may be obtained by extracting the component in the first detection step. In an embodiment of the present application, the manner in which the component in the first detection step is extracted may be determined based on the detection type of the first detection step. Different detection types may correspond to different extraction modes.

In an embodiment of the present application, determining the first detection object according to the first detection step includes: if the detection type corresponding to any one of the first detection steps is a visual inspection type, determining the component entity in any one of the first detection steps as the first detection object; or if the detection type corresponding to any first detection step is a numerical detection type, determining the component entity in any first detection step and the circuit entity corresponding to the component entity as the first detection object. In an embodiment of the present application, the content identification may be performed in the first detection step, so as to obtain the component entity and the line entity.

The visual inspection type can be used for determining whether the component exists or not, and can be directly judged by human eyes without measuring the component. The numerical detection type can be used for determining whether the component is normal or not, and the detection type cannot be directly judged by human eyes, so that the component needs to be measured.

In the step of detecting the visual inspection type, only the components are required to be detected, so that the step of detecting the visual inspection type only needs to extract the components in the description. When detecting the components in the numerical detection type, the corresponding circuit entities are also required to be detected. The detection type corresponding to the first detection step is a numerical detection type, and the combination of the component entity and the circuit entity corresponding to the component entity in any one of the first detection steps needs to be determined as a first detection object, that is, the component entity and the circuit entity corresponding to the component entity are both determined as the first detection object. The above embodiment can improve the accuracy of determining the first detection object.

When the components in the two first detection steps are identical, if the target detection intentions corresponding to the two first detection steps are different, the first detection objects corresponding to the two first detection steps are also different. In some embodiments of the present application, the target detection intent corresponding to the first detection step of the detection type of the numerical detection type may be determined based on semantic analysis; based on the target detection intention, a first detection object is determined in the first detection step. In some embodiments of the present application, detection content corresponding to different detection intents may be preset, and the detection content corresponding to the first detection step is determined based on semantic analysis. And when the detection content corresponding to the first detection step is the same as the detection content of the detection intention, determining the detection intention as the target detection intention. For example, a diode is included in both first detection steps; however, the target detection intention of the first detection step a is to judge the working condition of a certain line through the two-level body value, and the target detection intention of the first detection step B is to judge the connectivity of two ends of any component through the difference of the diode values. The first detection objects corresponding to the first detection step A are all diodes on the line; the first detection object corresponding to the first detection step B is a diode at two ends of any component.

The detection operation step is a step written manually, and part of the content in the step may be omitted, so that the step corresponding to the component may be omitted in the detection step of the numerical detection type, and an engineer may delete some circuits with lower occurrence rate in the detection operation step according to experience, which may cause the circuit entity corresponding to the component entity in the first detection step to have a missing circuit, so that the circuit in the functional module needs to be completed according to the physical structure of the first component entity. In an embodiment of the present application, the first detection object includes a first component entity and a first circuit entity corresponding to the first component entity, and the generating the first test frame based on the first detection object includes: determining a target line entity corresponding to the first component entity based on a knowledge reasoning algorithm; comparing the target circuit entity with the first circuit entity to determine whether the first circuit entity has a defect; if the first circuit entity is missing, updating the first detection object according to the target circuit entity; and generating the first test framework based on the updated first detection object.

The knowledge reasoning algorithm may be pre-trained based on the physical structure corresponding to the component, such that the trained knowledge reasoning algorithm may determine its corresponding target line entity to be detected based on the first component entity. For example, any one of the first component entities has three Pin angles, and based on a knowledge reasoning algorithm, the target line entity of the first component entity is determined to be the line entity corresponding to the three Pin angles; the first detection step only comprises the circuit entities corresponding to the two Pin angles in the first component entity, so that the circuit entities corresponding to the first component entity are determined to have the missing; and updating the first detection object according to the target line entity, so that the first component entity corresponds to the line entity corresponding to the three Pin angles. According to the embodiment, the occurrence of the condition that the generated first test frame lacks necessary circuit entities due to the fact that the detection operation step of the first equipment main board lacks can be avoided.

In an embodiment of the present application, if a circuit has a component entity exceeding a preset threshold, performing visual inspection and not performing any measurement step; the line may be determined as a first line entity.

The detecting operation step may further include a detecting step independent of the structure of the motherboard, i.e., a non-structural detecting step, such as a step of confirming a failure, a step of sending a command, a step of querying a test record, and the like, in addition to the first detecting step. The non-structural detection steps, which are independent of the motherboard structure, do not change between different device motherboards. In an embodiment of the present application, the generating, based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard, a first test frame corresponding to the first device motherboard includes: determining an unstructured detection step corresponding to the first equipment mainboard based on the detection operation step corresponding to the first equipment mainboard; and generating a first test frame corresponding to the first equipment mainboard based on the first detection object, the first detection step and the unstructured detection step. In an embodiment of the present application, the first detection object and the non-structural detection step may be respectively disposed in different areas in the first test frame, so as to facilitate the subsequent replacement of the first detection object in the first test frame.

Step S103, replacing the first detection object in the first test frame with a second detection object in the second device motherboard according to the alignment result, so as to obtain a second test frame.

In an embodiment of the present application, according to the alignment result, replacing the first detection object in the first test frame with a second detection object in the second device motherboard to obtain a second test frame includes: determining the second detection object in the second equipment main board based on the alignment result and the first detection object; and replacing the first detection object in the first test frame with the second detection object to obtain the second test frame. For example, the first detection object is a component a, and a component D in the second device motherboard corresponding to the component a may be determined according to the alignment result, and the component D may be determined as the second detection object. For another example, the first detection object is a line C, and the line F in the second device motherboard corresponding to the line C may be determined according to the alignment result, and the line F may be determined as the second detection object. After a corresponding second detection object of the first detection object in the second equipment main board is determined, the first detection object in the first test frame is replaced by the second detection object in the second equipment main board, and a second test frame is obtained.

In an embodiment of the present application, the first test frame further includes an unstructured detection step. And determining a second command (second poor information) corresponding to the first command (first poor information) in the unstructured detection step on the second device main board based on the command alignment result and/or the phenomenon alignment result in the alignment result, and replacing the first command (first poor information) in the unstructured detection step with the second command (second poor information) to obtain a second test frame. It will be appreciated that in this embodiment, prior to the second test frame being obtained, the method further comprises: and replacing the first detection object in the first test frame with a second detection object.

Step S104, generating a test instruction file corresponding to the second equipment mainboard according to the second test frame.

In an embodiment of the present application, the first detecting step may be performed according to a first detection object corresponding to the second detection object; determining a second detection step corresponding to the second detection object; and sequencing the second detection steps based on the sequence of the second detection objects in the second test framework to obtain a test instruction file. After the first detection step is determined, the first detection object in the first detection step can be replaced by a corresponding second detection object based on the comparison result, so that a second detection step is obtained. The ordering of the second detection steps is the same as the ordering of the second detection objects in the second test frame. Each first detection object has a uniquely corresponding first detection step.

In an embodiment of the present application, based on the order of the second detection objects in the second test frame, the second detection steps are ordered to obtain a test instruction file, including: if the second detection object corresponding to any second detection step is a circuit entity, determining whether the circuit entity meets the condition of measurement detection; and if the condition for measuring and detecting is determined to be met, adding a target measuring step corresponding to the circuit entity in the second detecting step. In an embodiment of the present application, it may be determined whether the circuit entity meets a condition for performing measurement and detection according to a connection structure and a circuit structure of the circuit entity. For example, whether the circuit entity has an exposed measuring point can be determined according to the connection structure and the circuit structure of the circuit entity; if the circuit entity has an exposed measuring point, determining that the circuit entity needs to carry out a measuring step, and meeting the condition of carrying out measuring detection; if the circuit entity does not have the exposed measuring point, determining that the circuit entity does not need to carry out the measuring step, and not meeting the condition of carrying out the measuring detection. The connection structure and the circuit structure of the circuit entity can be determined based on the knowledge graph of the second equipment main board; or the connection structure and the circuit structure of the circuit entity can be obtained by carrying out image recognition on the main board image of the main board of the second equipment. In another embodiment of the present application, it may be determined whether the line entity can perform measurement detection according to the failure occurrence rate of the line entity. For example, if the failure occurrence rate of a circuit entity is greater than a preset failure rate threshold, determining that the circuit entity needs to perform a measurement step, and meeting the condition of performing measurement and detection; if the fault occurrence rate of the circuit entity is smaller than or equal to the fault rate threshold value, determining that the circuit entity does not need to carry out the measuring step, and not meeting the condition of carrying out the measuring detection.

In an embodiment of the present application, before the adding the target measurement step corresponding to the line entity in the second detection step, the method includes: and generating a target measurement step corresponding to the circuit entity according to the circuit type, the circuit position and the circuit connection condition corresponding to the circuit entity. The mapping relationship between the line type, the line position, the line connection condition and the measurement step can be preset, and the measurement step corresponding to the line type, the line position and the line connection condition can be determined as the target measurement step based on the mapping relationship. Alternatively, the model may be generated based on a pre-training step of line type, line location, and line connection conditions. The step generation model may be used to output a target metrology step based on inputs of line type, line location, and line connection conditions. In an embodiment of the present application, the line types may include a signal line type and a power supply line type. The power supply line type needs to consider whether the power supply voltage is stable, whether short circuit occurs or not and the like, and the signal line type needs to consider whether the working condition of the signal emitting component is normal or not. The emphasis points of the two measurements are different, so in an embodiment of the present application, different measurement modes can be set for the two types of lines, i.e. the signal line type and the power supply line type.

In an embodiment of the present application, if it is detected that the number of target components in the second device motherboard exceeds a preset threshold, a motherboard layering step is added to the test instruction file. The target component can be set according to actual conditions and can be a battery, a chip and the like. The main board layering step is used for layering the second equipment main board, so that the second equipment main board can be subjected to upper and lower layering detection.

According to the guide file generation method provided by the embodiment, the knowledge graph of the first equipment main board of the target equipment is compared with the knowledge graph of the second equipment main board, so that an alignment result is obtained; generating a first test frame corresponding to the first equipment mainboard based on a first detection object corresponding to the first equipment mainboard and a detection operation step corresponding to the first equipment mainboard; according to the alignment result, a second detection object corresponding to the first detection object can be determined in a second equipment main board, so that the first detection object in the first test frame can be replaced by the second detection object in the second equipment main board, and a second test frame is obtained; and finally, generating a test guidance file corresponding to the second equipment mainboard according to the second test framework, so that the test guidance file of the new version equipment mainboard is automatically generated based on the detection operation step of the old version equipment mainboard, and the writing efficiency of the test guidance file is improved.

In an embodiment of the present application, before the comparing the first device motherboard with the second device motherboard to obtain an alignment result, the method further includes: and constructing a knowledge graph of the first equipment main board and a knowledge graph of the second equipment main board. Fig. 2 is a knowledge graph generating method according to an embodiment of the present application. The method for constructing the knowledge graph of the first device motherboard and the knowledge graph of the second device motherboard are the same, and a process for constructing the knowledge graph of the device motherboard is described below based on the method described in fig. 2. The knowledge graph generation method is applied to the electronic equipment. The order of the steps in the flowchart may be changed and some steps may be omitted according to various needs.

S201, determining a component list and a component connection relation corresponding to the first device motherboard.

The component list includes all the component components in the first device motherboard. In an embodiment of the present application, the component corresponding to the first device motherboard may be determined based on the component list of the first device motherboard. In some embodiments, the component list may further include one or more of material code information, name information, and specification information corresponding to the constituent components. Different constituent components can be conveniently distinguished according to component information.

The component connection relationship is used to describe the connection relationship between the constituent components. For example, it may be determined that the constituent component a is connected with the constituent component B and the constituent component C, respectively, according to the component connection relationship.

S202, determining a component entity and a line entity according to the component list and the component connection relation.

The component list may include components that perform functions individually and components that together form a circuit with other components. For example, components such as an Integrated Circuit (IC), a capacitor, a resistor, a crystal oscillator, a sensor, etc. can perform functions independently, and can be connected to a device motherboard by welding or inserting, etc.; the components of the wire, the bonding pad, the resistor, the capacitor, the crystal and the like can together form a circuit. In the embodiment of the application, the component which performs the function independently in the component list is determined as a component entity, and the component which forms the line together with other components in the component list is determined as a line entity. For example, components of an Integrated Circuit (IC), a capacitor, a resistor, a crystal oscillator, a sensor, etc. may be determined as component entities, one for each component. One line entity may correspond to one or more components. If a plurality of components form a line, the plurality of components are determined as a line entity. For example, if a wire and two resistors form a line, the three components are defined as a line entity.

And S203, generating a knowledge graph of the first equipment main board according to the component entity and the circuit entity.

In an embodiment of the present application, a knowledge graph of the first device motherboard may be constructed based on a connection relationship between the component entity and the circuit entity. The knowledge graph comprises a connection relation between a component entity and a circuit entity. In some embodiments, attributes corresponding to the component entity and the line entity are also recorded in the knowledge graph. The attributes may include sequential attribute values. The order attribute value corresponding to each component entity and line entity may be determined based on the order in which the components and lines appear in the component manifest. And the sequence attribute value is added in the knowledge graph, so that a maintenance engineer can conveniently detect the knowledge graph according to the sequence, and repeated operation is reduced.

The knowledge graph generation provided by the embodiment can acquire the components, the circuits and the related attributes thereof by analyzing the bill of materials of the equipment main board, and instantiate the components and the circuit entities in the knowledge graph; and acquiring the association relation between the component entity and the circuit entity by analyzing the component connection relation of the equipment main board, and obtaining the knowledge graph of the equipment main board. By constructing the knowledge graph, the utilization of historical data is improved.

Another embodiment of the present application also provides a computer device. Fig. 3 is a schematic structural diagram of a computer device provided in an embodiment of the present application, as shown in fig. 3, in an embodiment of the present application, the computer device 10 may be a tablet computer, an Augmented Reality (AR)/Virtual Reality (VR) device, a notebook computer, a netbook, or other devices, and the embodiment of the present application does not limit specific types of the computer device 10.

As shown in fig. 3, the computer device 10 may include, but is not limited to, a communication module 1001, a memory 1002, a processor 1003, an Input/Output (I/O) interface 1004, and a bus 1005. The processor 1003 is coupled to the communication module 1001, the memory 1002, and the I/O interface 1004 by a bus 1005, respectively.

It will be appreciated by those skilled in the art that the schematic diagram is merely an example of the computer device 10 and is not limiting of the computer device 10, and may include more or fewer components than shown, or may combine certain components, or different components, e.g., the computer device 10 may also include a network access device, etc.

The communications module 1001 may include a wired communications module and/or a wireless communications module. The wired communication module may provide one or more of a universal serial bus (Universal Serial Bus, USB), controller area network bus (CAN, controller Area Network), etc. wired communication solution. The wireless communication module may provide one or more of wireless communication solutions such as wireless fidelity (Wireless Fidelity, wi-Fi), bluetooth (BT), mobile communication networks, frequency modulation (Frequency Modulation, FM), near field wireless communication technology (near field communication, NFC), infrared (IR) technology, and the like.

The memory 1002 may be used to store computer readable instructions and/or modules, and the processor 1003 implements various functions of the computer device 10 by executing or executing the computer readable instructions and/or modules stored within the memory 1002 and invoking data stored within the memory 1002. The memory 1002 may mainly include a storage program area that may store an operating system, application programs required for at least one function (such as a sound playing function, an image playing function, etc.), and a storage data area; the storage data area may store data created according to the use of the computer device 10, or the like. Memory 1002 may include non-volatile and volatile memory, such as: a hard disk, memory, plug-in hard disk, smart Media Card (SMC), secure Digital (SD) Card, flash Card (Flash Card), at least one disk storage device, flash memory device, or other storage device.

Memory 1002 may be external memory and/or internal memory to computer device 10. Further, the memory 1002 may be a physical memory, such as a memory bank, a TF Card (Trans-flash Card), and the like.

The processor 1003 may be a central processing unit (Central Processing Unit, CPU), as well as other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), field programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like, and the processor 1003 is an operation core and a control center of the computer device 10, connects various parts of the entire computer device 10 using various interfaces and lines, and executes an operating system of the computer device 10 and various types of application programs, program codes, and the like installed.

For example, computer readable instructions may be partitioned into one or more modules/sub-modules/units that are stored in memory 1002 and executed by processor 1003 to complete the present application. One or more of the modules/sub-modules/units may be a series of computer readable instructions capable of performing a particular function, the computer readable instructions describing a process of execution of the computer readable instructions in the computer device 10.

The modules/units integrated by the computer device 10 may be stored in a computer readable storage medium if implemented in the form of software functional units and sold or used as a stand alone product. Based on such understanding, the present application implements all or part of the flow of the method of the above-described embodiments, and may also be implemented by means of computer readable instructions to instruct related hardware, where the computer readable instructions may be stored in a computer readable storage medium, where the computer readable instructions, when executed by a processor, implement the steps of the method embodiments described above.

The computer readable instructions include computer readable instruction code, which may be in the form of source code, object code, executable files, or some intermediate form, etc. The computer readable medium may include: any entity or device capable of carrying computer readable instruction code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory).

The memory 1002 in the computer device 10 stores computer-readable instructions, and the processor 1003 can execute the computer-readable instructions stored in the memory 1002 to implement the guidance file generation method shown in fig. 1 or the knowledge graph generation method shown in fig. 2.

In particular, the specific implementation method of the processor 1003 on the computer readable instructions may refer to the descriptions of the relevant steps in the corresponding embodiments of fig. 1 to 2, which are not repeated herein.

The I/O interface 1004 is used to provide a channel for user input or output, e.g., the I/O interface 1004 may be used to connect various input/output devices, e.g., a mouse, keyboard, touch device, display screen, etc., so that a user may enter information, or visualize information.

The bus 1005 is used at least to provide a pathway for communication between the communication module 1001, the memory 1002, the processor 1003, and the I/O interface 1004 in the computer device 10.

In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of modules is merely a logical function division, and other manners of division may be implemented in practice.

The modules illustrated as separate components may or may not be physically separate, and components shown as modules may or may not be physical units, may be located in one place, or may be distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional module in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units can be realized in a form of hardware or a form of hardware and a form of software functional modules.

The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.

Furthermore, it is evident that the word "comprising" does not exclude other elements or steps, and that the singular does not exclude a plurality. Also, the plurality of units or means of (a) may be implemented by one unit or means by software or hardware. The terms first, second, etc. are used to denote a name, but not any particular order.

Finally, it should be noted that the above embodiments are merely for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.

Claims (10)

1. A method for generating a guide file, applied to an electronic device, the method comprising:

determining a first equipment mainboard and a second equipment mainboard of target equipment; comparing the knowledge graph of the first equipment main board with the knowledge graph of the second equipment main board to obtain an alignment result;

generating a first test frame corresponding to the first equipment mainboard based on a first detection object corresponding to the first equipment mainboard and a detection operation step corresponding to the first equipment mainboard;

according to the alignment result, replacing the first detection object in the first test frame with a second detection object in the second equipment main board to obtain a second test frame;

and generating a test instruction file corresponding to the second equipment mainboard according to the second test frame.

2. The method for generating an instruction file according to claim 1, wherein before the generating the first test frame corresponding to the first device motherboard based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard, the method further includes:

determining a plurality of first detection steps based on the detection operation steps of the first device motherboard;

And determining a plurality of first detection objects according to the plurality of first detection steps.

3. The method for generating an instruction file according to claim 2, wherein the generating a first test frame corresponding to the first device motherboard based on the first detection object corresponding to the first device motherboard and the detection operation step corresponding to the first device motherboard includes:

determining an unstructured detection step corresponding to the first equipment mainboard based on the detection operation step corresponding to the first equipment mainboard;

and generating the first test frame corresponding to the first equipment mainboard based on the first detection object, the first detection step and the unstructured detection step.

4. The guidance file generation method according to claim 2, wherein the determining a plurality of the first detection objects according to the plurality of the first detection steps includes:

if the detection type corresponding to any one of the plurality of first detection steps is a visual detection type, determining a component entity in any one of the plurality of first detection steps as the first detection object; or,

and if the detection type corresponding to any one of the plurality of first detection steps is a numerical detection type, determining the combination of the component entity and the circuit entity corresponding to the component entity in any one of the first detection steps as the first detection object.

5. The method for generating an instruction file according to claim 2, wherein the first detection object includes a first component entity and a first circuit entity corresponding to the first component entity, and the generating the first test frame based on the first detection object includes:

determining a target line entity corresponding to the first component entity based on a knowledge reasoning algorithm;

comparing the target circuit entity with the first circuit entity to determine whether the first circuit entity has a defect;

if the first circuit entity is missing, updating the first detection object according to the target circuit entity;

and generating the first test framework based on the updated first detection object.

6. The method for generating an instruction file according to claim 1, wherein the alignment result includes a component alignment result and a line alignment result, and the comparing the knowledge graph of the first device motherboard with the knowledge graph of the second device motherboard to obtain the alignment result includes:

calculating similarity based on names, categories and functions of components in the first equipment main board and the second equipment main board, and obtaining an alignment result of the components based on the calculated similarity;

Modeling a main board structure of the first equipment main board based on a knowledge graph of the first equipment main board to obtain a first connection relation, wherein the first connection relation is used for representing the connection relation between the component and the circuit in the first equipment main board;

modeling a main board structure of the second equipment main board based on the knowledge graph of the second equipment main board to obtain a second connection relationship, wherein the second connection relationship is used for representing the connection relationship between the components and the circuit in the second equipment main board;

and obtaining the line alignment result according to the component alignment result, the first connection relation and the second connection relation.

7. The method for generating a test instruction file according to claim 1, wherein the generating, according to the second test frame, the test instruction file corresponding to the second device motherboard includes:

determining a second detection step corresponding to the second detection object according to the first detection step of the first detection object corresponding to the second detection object;

and sequencing the second detection steps based on the sequence of the second detection objects in the second test framework to obtain the test instruction file.

8. The method of generating a guide file according to claim 7, wherein said sorting the second detection steps based on the order of the second detection objects in the second test frame to obtain the test guide file includes:

if the second detection object corresponding to any second detection step is a circuit entity, determining whether the circuit entity meets the condition of measurement detection;

and if the condition for carrying out the measurement detection is determined to be met, adding a target measurement step corresponding to the circuit entity in the second detection step.

9. A computer device comprising a processor and a memory, the processor being configured to execute a computer program stored in the memory to implement the guidance file generation method of any of claims 1-8.

10. A computer readable storage medium storing at least one instruction which when executed by a processor implements the guidance file generation method of any of claims 1 to 8.