CN117634200A - Reliability index calculation system of aerospace electronic product based on digital model - Google Patents
Reliability index calculation system of aerospace electronic product based on digital model Download PDFInfo
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Abstract
The invention discloses a reliability index calculation system of a space electronic product based on a digital model, which comprises the following components: the product digitizing module is used for acquiring the fault information of the same aerospace electronic product through a big data platform based on the Internet of things, and constructing a fault digitizing model of the aerospace electronic product based on the corresponding relation between the fault mode and the product component; the probability analysis module is used for analyzing the fault digital model, determining the respective fault probability of each electronic element and generating an element fault probability sequence; and the calculation and analysis module is used for calculating the reliability index of the aerospace electronic product according to the element fault probability sequence. The invention fully considers the condition that the components are crossed in different functions or packaged circuits, simplifies the order of magnitude of calculation as much as possible through the membership of the components, and can rapidly obtain a reliability index relative to the function layer and the packaged circuit layer aiming at the different function layers and the packaged circuit layer.
Description
Technical Field
The invention belongs to the technical field of electronic product detection, and particularly relates to a reliability index computing system of a space electronic product based on a digital model.
Background
Reliability refers to the ability of a product to perform a specified function under specified conditions and for a specified period of time. Reliability can generally be divided into two levels, first the so-called component reliability (Reliability of component). That is, the product is disassembled into a plurality of different parts or components, the reliability of the components is studied first, and then the whole system and the whole reliability of the whole product, that is, the system reliability (Reliability of system) are studied. The component reliability analysis method is statistical analysis, so that the system reliability analysis is complex and more methods are available.
The traditional medium-and-long-term reliability evaluation describes the reliability of the element based on the statistical average value, does not consider the influence of the running state of the system such as line power flow and the like on the reliability level of the element, simultaneously ignores the influence of the real-time change of the load on the reliability of the system, and has limited guiding value on the running of the system and risk prevention and control. The reliability evaluation of the operation focuses on the reliability level of the system in the operation process, can sense and quantify the influence of the internal and external environment change on the reliability of the element, evaluates the reliability level of the system in real time and guides the development of a risk pre-control strategy. However, electronic components in aerospace electronic products are various, coupling relations are complex, the problem of multi-structure coupling association optimization is involved in the reliability evaluation process, and the computational complexity is greatly increased. In addition, the time-varying characteristic of the element reliability parameter and the uncertainty caused by multiple types of loads further increase the calculation burden, so that how to effectively accelerate the operation reliability evaluation of the space electronic product, and the design of the operation reliability evaluation method of the space electronic product meeting the time-varying and aiming at the functional reliability requirements becomes a problem to be solved urgently.
Disclosure of Invention
Therefore, the invention aims to provide a satellite 5G terminal initial synchronization method, which fully considers the situation that components are crossed in different functions or packaging circuits, simplifies the order of magnitude of calculation as much as possible through the membership of the components, and can quickly obtain a reliability index relative to the function level and the packaging circuit level for different function levels and packaging circuit levels.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the invention provides a reliability index calculation system of a space electronic product based on a digital model, which comprises the following components:
the product digitizing module is used for acquiring the fault information of the same aerospace electronic product through a big data platform based on the Internet of things, and constructing a fault digitizing model of the aerospace electronic product based on the corresponding relation between the fault mode and the product component;
the probability analysis module is used for analyzing the fault digital model, determining the respective fault probability of each electronic element and generating an element fault probability sequence;
and the calculation and analysis module is used for calculating the reliability index of the aerospace electronic product according to the element fault probability sequence.
Preferably, the product digitizing module comprises:
the data acquisition unit is used for determining the model information of the aerospace electronic products needing to be subjected to reliability index calculation and acquiring fault information corresponding to all aerospace electronic products of the same model on the large data platform based on the model information;
the grading unit is used for dividing the aerospace electronic product into three grades, namely a functional structure grade, a packaging part grade and an electronic element grade in advance according to the functions of the aerospace electronic product;
the data processing unit is used for analyzing fault information corresponding to any space electronic product according to the grading result, constructing a fault information membership matrix based on the electronic element level under the fault generating component, and constructing a secondary fault digital model of multi-level cross correlation by utilizing a plurality of fault information membership matrices;
and the data summarizing unit is used for summarizing all secondary fault digital models corresponding to the same aerospace electronic product to obtain the fault digital model of the aerospace electronic product.
Preferably, the data processing unit performs operations comprising:
determining a functional structure level set with faults according to fault information corresponding to any space electronic productAnd a functional structure level set without fault +.>The method comprises the steps of carrying out a first treatment on the surface of the Where K represents the total number of functional structural levels of the aerospace electronics, n represents the total number of functional structural levels where a fault exists,functional structural level indicating that the ith fault exists, < +.>Indicating that the jth functional fabric level is not faulty,
functional structure level for j-th fault-freeDetermining the corresponding packaging component level set +.>；
Determining a set of package component levels corresponding to all functional structure levels without faults：
Functional architecture level with fault for ithDetermining the corresponding packaging component level set +.>；
For package component level assemblyAll package parts in it are respectively recorded to the first set +.>Second set->Wherein:
during the recording of the package levels within all the functional structure levels that have failed, determining that any package level is recorded into the second setAnd taking the total times of the package component level as a weight multiplying power coefficient;
determining membership states of respective corresponding electronic element levels under the packaging component level, and constructing a fault information membership matrix of the electronic element level based on the packaging component level to which the electronic element level belongs;
and constructing a secondary fault digital model of the multi-level cross-correlation of the aerospace electronic product by utilizing a plurality of fault information membership matrixes and weight multiplying power coefficients of the packaging component levels to which the corresponding electronic element levels belong.
Preferably, the constructing the secondary fault digitizing model of the aerospace electronic product by using a plurality of fault information membership matrixes and weight multiplying power coefficients of the packaging component levels to which the corresponding electronic element levels belong includes:
determining membership conditions of the corresponding electronic element level to all packaging component levels according to the fault information membership matrix;
when the electronic component level is subordinate to the packaging component level setWhen any package component level is in, determining that the fault probability of the electronic element level is zero;
determining a failure probability coefficient of the electronic element level based on membership of the electronic element level to all package component levels and the weight multiplying power coefficient of each package component level:
in the method, in the process of the invention,representing the failure probability coefficient of the electronic component level, +.>Representing the total number of package levels to which the electronic component level belongs, < >>Weight ratio coefficient indicating the x-th package component level to which the electronic component level belongs,/->For the predetermined x-th package component level to fail, the conditional probability of failure of the electronic component level,/for the predetermined x-th package component level to fail>Indicating the probability of failure at the x-th package level,/->Representing the probability of simultaneous failure of the xth package level and the electronic component level, +.>For the total number of corresponding electronic component levels within the x-th package level, +.>A correction coefficient representing the electronic component level;
and constructing a secondary fault digital model based on fault information membership matrixes corresponding to all electronic element levels in the aerospace electronic product and fault probability coefficients corresponding to the electronic element levels.
Preferably, the probability analysis module performs the steps comprising:
determining a fault information membership matrix corresponding to each of all electronic elements in the space electronic product according to a fault digital model of the space electronic product;
based on the failure function of the space electronic product, carrying out classification statistics, obtaining respective failure information of electronic elements corresponding to any function of the space electronic product under the failure condition through a failure information membership matrix, and counting the failure probability of each electronic element under the failure condition;
and generating a sequence of the failure probability of each electronic element from large to small when the function fails as an element failure probability sequence.
Preferably, the computational analysis module performs the steps comprising:
acquiring a preset function weight table of the space electronic product, and determining influence weights on the reliability index calculation result of the space electronic product when any function fails based on the function weight table;
determining the fault probability corresponding to each electronic element with any function based on the element fault probability sequence;
the reliability index of the aerospace electronic product is calculated based on the following formula:
wherein,indicating the reliability index of the aerospace electronic product, < >>Indicating the influence weight of the e-th functional failure on the reliability index calculation result of the aerospace electronic product, < ->Representing the total number of functions designed based on the reliability index calculation,/->Representing the total number of statistics corresponding to the e-th function,/->Representing the number of failures of the e-th function in the statistics over the design lifetime,/for>Representing the electronic component calculating the correction factor,/->Representing the failure probability of the f-th electronic component corresponding to the e-th function, +.>Representing the failure probability coefficient of the f-th electronic component corresponding to the e-th function,>representing the total number of electronic components corresponding to the e-th function.
The invention has at least the following beneficial effects:
1. the reliability of the space electronic product can be analyzed in a multi-level manner, the cross structure of components of the electronic product is simplified, meanwhile, the reliability analysis method of element level is realized, the final calculation result is more accurate compared with the reliability index calculation method under the condition of utilizing the whole failure state of the space electronic product, the aimed calculation targets (such as a functional layer, a packaging circuit layer and a component layer) are more accurate, considered factors are more comprehensive, and compared with the method for calculating the reliability of the space electronic product by utilizing each electronic component.
2. The method fully considers the condition that components exist in different functions or packaging circuits in a crossing manner in the calculation process, simplifies the order of magnitude of calculation as much as possible through the membership of the components, and can rapidly obtain a reliability index relative to the functional layer and the packaging circuit layer aiming at the different functional layers and the packaging circuit layer.
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In order to make the objects, technical solutions and advantageous effects of the present invention more clear, the present invention provides the following drawings for description:
FIG. 1 is a schematic diagram of a reliability index computing system for a space electronic product based on a digital model in an embodiment of the invention;
fig. 2 is a schematic diagram of grading of an aerospace electronic product according to an embodiment of the invention.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
The invention provides the following technical scheme for achieving the purpose:
the invention provides a reliability index calculation system of a space electronic product based on a digital model, which referring to fig. 1, comprises:
the product digitizing module is used for acquiring the fault information of the same aerospace electronic product through a big data platform based on the Internet of things, and constructing a fault digitizing model of the aerospace electronic product based on the corresponding relation between the fault mode and the product component;
the probability analysis module is used for analyzing the fault digital model, determining the respective fault probability of each electronic element and generating an element fault probability sequence;
and the calculation and analysis module is used for calculating the reliability index of the aerospace electronic product according to the element fault probability sequence.
The working principle and beneficial effects of the technical scheme are as follows: the method comprises the steps of acquiring fault information of the same aerospace electronic product through a big data platform based on the Internet of things, constructing a fault digital model of the aerospace electronic product based on a corresponding relation between a fault mode and a product component, analyzing the fault digital model through a probability analysis module, determining respective fault probability of each electronic element and generating an element fault probability sequence, and finally calculating reliability indexes of the aerospace electronic product according to the element fault probability sequence through a calculation analysis module. The reliability analysis method of the space electronic product can be used for carrying out multi-level analysis on the reliability of the space electronic product, simplifying the cross structure of components of the electronic product and realizing the reliability analysis method of element level at the same time, and the final calculation result is more accurate compared with the reliability index calculation method under the whole failure state of the space electronic product, aiming at calculation targets (such as a functional layer, a packaging circuit layer and a component layer), the considered factors are more comprehensive, and compared with the method for calculating the reliability of the space electronic product by utilizing each electronic component, the method fully considers the cross existence condition of the components in different functions or packaging circuits in the calculation process, simplifies the calculation order of magnitude as far as possible through the membership condition of the components, and can rapidly obtain the reliability index relative to the functional layer and the packaging circuit layer aiming at different functional layers and packaging circuit layers.
In a preferred embodiment, referring to fig. 1 and 2, the product digitizing module comprises:
the data acquisition unit is used for determining the model information of the aerospace electronic products needing to be subjected to reliability index calculation and acquiring fault information corresponding to all aerospace electronic products of the same model on the large data platform based on the model information;
the grading unit is used for dividing the aerospace electronic product into three grades, namely a functional structure grade, a packaging part grade and an electronic element grade in advance according to the functions of the aerospace electronic product;
the data processing unit is used for analyzing fault information corresponding to any space electronic product according to the grading result, constructing a fault information membership matrix based on the electronic element level under the fault generating component, and constructing a secondary fault digital model of multi-level cross correlation by utilizing a plurality of fault information membership matrices;
and the data summarizing unit is used for summarizing all secondary fault digital models corresponding to the same aerospace electronic product to obtain the fault digital model of the aerospace electronic product.
The working principle and beneficial effects of the technical scheme are as follows: determining model information of the aerospace electronic products needing reliability index calculation through a data acquisition unit, acquiring fault information corresponding to all aerospace electronic products of the same model on a large data platform based on the model information, and acquiring large data of the fault information of the aerospace electronic products; the space electronic product is divided into three grades, namely a functional structure grade, a packaging component grade and an electronic element grade according to the functions of the space electronic product through the grading unit, so that a fault information membership matrix of the electronic element grade is conveniently constructed; analyzing fault information corresponding to any space electronic product according to a grading result through a data processing unit, constructing a fault information membership matrix based on the electronic element level under a fault generating component, and constructing a secondary fault digital model of multi-level cross correlation by utilizing a plurality of fault information membership matrices; and summarizing all secondary fault digital models corresponding to the same aerospace electronic product through a data summarizing unit to obtain the fault digital model of the aerospace electronic product. Therefore, construction work of an internal structure of the space electronic product is realized, a correlation relation among the functional structure, the packaging part and the electronic element is established, a fault information membership matrix of the electronic element is determined, a multistage cross-correlation secondary fault digital model in a single space electronic product is constructed based on the fault information membership matrix of a plurality of electronic elements, the fault digital model of the space electronic product is constructed by utilizing the secondary fault digital model in the plurality of space electronic products, the fault mechanism of the space electronic product can be rapidly summarized through the fault digital model, the function, the packaging part and the electronic element of fault frequent occurrence are determined, and the correlation mechanism of the fault is determined.
In a preferred embodiment, the data processing unit performs operations comprising:
determining a functional structure level set with faults according to fault information corresponding to any space electronic productAnd a functional structure level set without fault +.>The method comprises the steps of carrying out a first treatment on the surface of the Where K represents the total number of functional structural levels of the aerospace electronics, n represents the total number of functional structural levels where a fault exists,functional structural level indicating that the ith fault exists, < +.>Indicating that the jth functional fabric level is not faulty,
functional structure level for j-th fault-freeDetermining the corresponding packaging component level set +.>；
Determining a set of package component levels corresponding to all functional structure levels without faults：
Functional architecture level with fault for ithDetermining the corresponding packaging component level set +.>；
For package component level assemblyAll package parts in it are respectively recorded to the first set +.>Second set->Wherein:
during the recording of the package levels within all the functional structure levels that have failed, determining that any package level is recorded into the second setAnd taking the total times of the package component level as a weight multiplying power coefficient;
determining membership states of respective corresponding electronic element levels under the packaging component level, and constructing a fault information membership matrix of the electronic element level based on the packaging component level to which the electronic element level belongs;
and constructing a secondary fault digital model of the multi-level cross-correlation of the aerospace electronic product by utilizing a plurality of fault information membership matrixes and weight multiplying power coefficients of the packaging component levels to which the corresponding electronic element levels belong.
The working principle and beneficial effects of the technical scheme are as follows: through constructing the membership between the functional structure level and the packaging component level, the rapid fault location detection of the structure of the packaging component level according to the failure condition of the functional structure is realized, and for the functions without faults or failure conditions, the packaging component level of the beverage to which the functional structure level belongs is determined to have no faults and is received into the first set, so that the magnitude of fault screening can be effectively reduced, and the working efficiency is improved. For the packaging component level suspected to have faults, the packaging component level is received into a second set, the total times of the packaging component level received into the second set when the functions are screened are recorded, the crossing condition of the packaging component level in the functional structure level with the faults is reflected according to the total times, for example, the packaging component A is in the functions 1,2 and 3, the packaging component A can be described as long as any function is not failed, but if the functional structure level 1,2 and 3 where the packaging component A is located is failed, the packaging component A has high possibility of faults, and the more serious the crossing condition of the functional structure level corresponding to the packaging component is, the more the fault probability of the packaging component A can be determined, and the higher the corresponding weight multiplying power coefficient is. And then constructing a fault information membership matrix of the electronic element level based on the membership state of the electronic element level under the packaging component level, constructing a membership between the electronic element level and the packaging component level, constructing a fault information membership matrix of the electronic element level based on the membership and the membership between the functional structure level constructed in the past and the packaging component level, and finally constructing a secondary fault digitization model of the multi-level cross-correlation of the space electronic product by utilizing a plurality of fault information membership matrices and the weight multiplying power coefficient of the packaging component level to which the corresponding electronic element level belongs. Therefore, the construction of the secondary fault digital model of the multi-level cross correlation of the aerospace electronic product is realized, and the digital model capable of reflecting the internal membership and the unit weight is obtained.
In a preferred embodiment, the constructing the secondary fault digitizing model of the aerospace electronic product multi-stage cross-correlation by using a plurality of fault information membership matrixes and weight multiplying power coefficients of the package component levels to which the corresponding electronic component levels belong includes:
determining membership conditions of the corresponding electronic element level to all packaging component levels according to the fault information membership matrix;
when the electronic component level is subordinate to the packaging component level setWhen any package component level is in, determining that the fault probability of the electronic element level is zero;
determining a failure probability coefficient of the electronic element level based on membership of the electronic element level to all package component levels and the weight multiplying power coefficient of each package component level:
in the method, in the process of the invention,representing the failure probability coefficient of the electronic component level, +.>Representing the total number of package levels to which the electronic component level belongs, < >>Weight ratio coefficient indicating the x-th package component level to which the electronic component level belongs,/->For the predetermined x-th package component level to fail, the conditional probability of failure of the electronic component level,/for the predetermined x-th package component level to fail>Indicating the probability of failure at the x-th package level,/->Representing the probability of simultaneous failure of the xth package level and the electronic component level, +.>For the total number of corresponding electronic component levels within the x-th package level, +.>A correction coefficient representing the electronic component level;
and constructing a secondary fault digital model based on fault information membership matrixes corresponding to all electronic element levels in the aerospace electronic product and fault probability coefficients corresponding to the electronic element levels.
The working principle and beneficial effects of the technical scheme are as follows: and determining the membership of the corresponding electronic element level to all packaging component levels through the fault information membership matrix, rapidly screening out electronic elements without faults according to the membership, calculating and determining the fault probability coefficient of the electronic element level based on the membership of the electronic element level to all packaging component levels and the weight multiplying power coefficient of each packaging component level, and finally constructing a secondary fault digital model through the fault information membership matrix corresponding to each of all the electronic element levels in the aerospace electronic product and the fault probability coefficient corresponding to each of the electronic element levels. The calculation of the fault probability coefficient of the electronic element level is realized, and the pertinence and the accuracy of the reliability index calculation system to the electronic element are improved.
In a preferred embodiment, the probability analysis module performs the steps comprising:
determining a fault information membership matrix corresponding to each of all electronic elements in the space electronic product according to a fault digital model of the space electronic product;
based on the failure function of the space electronic product, carrying out classification statistics, obtaining respective failure information of electronic elements corresponding to any function of the space electronic product under the failure condition through a failure information membership matrix, and counting the failure probability of each electronic element under the failure condition;
and generating a sequence of the failure probability of each electronic element from large to small when the function fails as an element failure probability sequence.
The working principle and beneficial effects of the technical scheme are as follows: after a fault digital model based on big data is generated, determining a fault information membership matrix corresponding to each electronic element in the space electronic product based on the fault digital model, then carrying out classification statistics based on the failed function of the space electronic product, obtaining the respective fault information of the electronic element corresponding to any function of the space electronic product under the failure condition through the fault information membership matrix, counting the fault probability of each electronic element when the function fails, determining the fault distribution state of the electronic element level based on the counted fault probability, and generating a sequence of the fault probability of each electronic element from big to small when the function fails according to the fault probability as an element fault probability sequence. The direct relation between the electronic element level and the functional structure level can be established through the element fault probability sequence, so that the reliability index relative to the functional layer level can be conveniently and rapidly obtained according to the fault probability of the electronic element level, and the rapid and targeted calculation of the reliability index of the functional layer level can be realized, such as the calculation of the reliability index of the display function, the calculation of the reliability index of the measurement function, the calculation of the reliability index of the self-checking function and the like.
In a preferred embodiment, the computational analysis module performs operations comprising:
acquiring a preset function weight table of the space electronic product, and determining influence weights on the reliability index calculation result of the space electronic product when any function fails based on the function weight table;
determining the fault probability corresponding to each electronic element with any function based on the element fault probability sequence;
the reliability index of the aerospace electronic product is calculated based on the following formula:
wherein,indicating the reliability index of the aerospace electronic product, < >>Indicating the influence weight of the e-th functional failure on the reliability index calculation result of the aerospace electronic product, < ->Representing the total number of functions designed based on the reliability index calculation,/->Representing the total number of statistics corresponding to the e-th function,/->Representing the number of failures of the e-th function in the statistics over the design lifetime,/for>Representing the electronic component calculating the correction factor,/->Representing the failure probability of the f-th electronic component corresponding to the e-th function, +.>Representing the failure probability coefficient of the f-th electronic component corresponding to the e-th function,>representing the total number of electronic components corresponding to the e-th function.
The working principle and beneficial effects of the technical scheme are as follows: the calculation analysis module obtains a preset function weight table of the space electronic product, and determines influence weight on a reliability index calculation result of the space electronic product when any function fails based on the function weight table; determining the fault probability corresponding to each electronic element with any function based on the element fault probability sequence; based on the fault information of big data, such as the failure probability of the function in the design life, the reliability index of the aerospace electronic product is calculated by the following formula, so that the reliability index is calculated finally.
Finally, it is noted that the above-mentioned preferred embodiments are only intended to illustrate rather than limit the invention, and that, although the invention has been described in detail by means of the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention as defined by the appended claims.
Claims (6)
1. A reliability index computing system for a space electronics product based on a digitized model, comprising:
the product digitizing module is used for acquiring the fault information of the same aerospace electronic product through a big data platform based on the Internet of things, and constructing a fault digitizing model of the aerospace electronic product based on the corresponding relation between the fault mode and the product component;
the probability analysis module is used for analyzing the fault digital model, determining the respective fault probability of each electronic element and generating an element fault probability sequence;
and the calculation and analysis module is used for calculating the reliability index of the aerospace electronic product according to the element fault probability sequence.
2. The reliability index computing system of a space electronics product based on a digitized model of claim 1 wherein said product digitizing module comprises:
the data acquisition unit is used for determining the model information of the aerospace electronic products needing to be subjected to reliability index calculation and acquiring fault information corresponding to all aerospace electronic products of the same model on the large data platform based on the model information;
the grading unit is used for dividing the aerospace electronic product into three grades, namely a functional structure grade, a packaging part grade and an electronic element grade in advance according to the functions of the aerospace electronic product;
the data processing unit is used for analyzing fault information corresponding to any space electronic product according to the grading result, constructing a fault information membership matrix based on the electronic element level under the fault generating component, and constructing a secondary fault digital model of multi-level cross correlation by utilizing a plurality of fault information membership matrices;
and the data summarizing unit is used for summarizing all secondary fault digital models corresponding to the same kind of aerospace electronic products to obtain the fault digital models of the same kind of aerospace electronic products.
3. The reliability index computing system of a space electronics product based on a digitized model of claim 2, wherein the data processing unit execution comprises:
determining a functional structure level set with faults according to fault information corresponding to any space electronic productAnd a functional structure level set without fault +.>The method comprises the steps of carrying out a first treatment on the surface of the Where K represents the total number of functional structural levels of the aerospace electronics, n represents the total number of functional structural levels where a fault exists,functional structural level indicating that the ith fault exists, < +.>Indicating that the jth functional fabric level is not faulty,
functional structure level for j-th fault-freeDetermining the corresponding packaging component level set +.>；
Determining a set of package component levels corresponding to all functional structure levels without faults：
Functional architecture level with fault for ithDetermining the corresponding packaging component level set +.>；
For package component level assemblyAll package parts in it are respectively recorded to the first set +.>Second set->Wherein:
during the recording of the package levels within all the functional structure levels that have failed, determining that any package level is recorded into the second setAnd taking the total times of the package component level as a weight multiplying power coefficient;
determining membership states of respective corresponding electronic element levels under the packaging component level, and constructing a fault information membership matrix of the electronic element level based on the packaging component level to which the electronic element level belongs;
and constructing a secondary fault digital model of the multi-level cross-correlation of the aerospace electronic product by utilizing a plurality of fault information membership matrixes and weight multiplying power coefficients of the packaging component levels to which the corresponding electronic element levels belong.
4. The reliability index computing system of a space electronic product based on a digital model according to claim 3, wherein constructing the secondary fault digital model of the space electronic product with multilevel cross-correlation by using a plurality of fault information membership matrices and weight multiplying power coefficients of package component levels to which corresponding electronic component levels belong comprises:
determining membership conditions of the corresponding electronic element level to all packaging component levels according to the fault information membership matrix;
when the electronic component level is subordinate to the packaging component level setWhen any package component level is in, determining that the fault probability of the electronic element level is zero;
determining a failure probability coefficient of the electronic element level based on membership of the electronic element level to all package component levels and the weight multiplying power coefficient of each package component level:
in the method, in the process of the invention,representing the failure probability coefficient of the electronic component level, +.>Representing the total number of package levels to which the electronic component level belongs, < >>Weight ratio coefficient indicating the x-th package component level to which the electronic component level belongs,/->For the predetermined x-th package component level to fail, the conditional probability of failure of the electronic component level,/for the predetermined x-th package component level to fail>Indicating the probability of failure at the x-th package level,/->Representing the probability of simultaneous failure of the xth package level and the electronic component level, +.>For the total number of corresponding electronic component levels within the x-th package level, +.>A correction coefficient representing the electronic component level;
and constructing a secondary fault digital model based on fault information membership matrixes corresponding to all electronic element levels in the aerospace electronic product and fault probability coefficients corresponding to the electronic element levels.
5. The reliability index computing system of a space electronics product based on a digitized model of claim 1, wherein the probability analysis module performs the steps comprising:
determining a fault information membership matrix corresponding to each of all electronic elements in the space electronic product according to a fault digital model of the space electronic product;
based on the failure function of the space electronic product, carrying out classification statistics, obtaining respective failure information of electronic elements corresponding to any function of the space electronic product under the failure condition through a failure information membership matrix, and counting the failure probability of each electronic element under the failure condition;
and generating a sequence of the failure probability of each electronic element from large to small when the function fails as an element failure probability sequence.
6. The reliability index computing system of a space electronics product based on a digitized model of claim 1, wherein the computational analysis module performs the steps of:
acquiring a preset function weight table of the space electronic product, and determining influence weights on the reliability index calculation result of the space electronic product when any function fails based on the function weight table;
determining the fault probability corresponding to each electronic element with any function based on the element fault probability sequence;
the reliability index of the aerospace electronic product is calculated based on the following formula:
wherein,indicating the reliability index of the aerospace electronic product, < >>Indicating the influence weight of the e-th functional failure on the reliability index calculation result of the aerospace electronic product, < ->Representing the total number of functions designed based on the reliability index calculation,representing statistics corresponding to the e-th functionTotal number of->Representing the number of failures of the e-th function in the statistics over the design lifetime,/for>Representing the electronic component calculating the correction factor,/->Representing the failure probability of the f-th electronic component corresponding to the e-th function, +.>Representing the failure probability coefficient of the f-th electronic component corresponding to the e-th function,>representing the total number of electronic components corresponding to the e-th function.
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