CN117631269A - Optical focusing system and method based on coaxial imaging - Google Patents
Optical focusing system and method based on coaxial imaging Download PDFInfo
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- CN117631269A CN117631269A CN202311626417.4A CN202311626417A CN117631269A CN 117631269 A CN117631269 A CN 117631269A CN 202311626417 A CN202311626417 A CN 202311626417A CN 117631269 A CN117631269 A CN 117631269A
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- 239000011521 glass Substances 0.000 claims description 3
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- 238000005520 cutting process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 35
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Abstract
The invention discloses an optical focusing system and method based on coaxial imaging, wherein the system comprises an infrared skin second laser, a point light source, a cross reticle, an imaging cylindrical lens, a visible light CCD and a near infrared achromatic objective, the point light source emits visible light to irradiate the cross reticle, the cross reticle and an edge reticle arranged on the cross reticle are projected in the imaging cylindrical lens through the visible light irradiation, the infrared skin second laser is horizontally arranged, the infrared skin second laser emits laser to enter the imaging cylindrical lens, the imaging cylindrical lens comprises an aspheric lens, a reflecting mirror, a half reflecting mirror and a dichroic mirror, the cross reticle is arranged in parallel with the aspheric lens, the aspheric lens is used for light path collimation, the dichroic mirror is positioned above the near infrared achromatic objective, the laser is coupled into the near infrared achromatic objective through the dichroic mirror in a reflecting way and is focused on the surface of a wafer, and the visible light CCD is arranged above the imaging cylindrical lens and is used for receiving real images, so that the problem that the laser cannot be rapidly and accurately focused in the wafer hidden cutting process is solved.
Description
Technical Field
The invention relates to the technical field of optical focusing, in particular to an optical focusing system and method based on coaxial imaging.
Background
The wafer dicing process is a process for dicing round wafers in the semiconductor industry, in which ultra-fast lasers are typically used for dicing, and laser focusing is used to ensure that the laser is able to accurately dice the wafer and maintain a high quality dicing section, which requires precise focusing of the laser to ensure dicing accuracy and efficiency.
The patent with the publication number of CN215869329U proposes a wafer automatic focusing device, which comprises a driving workbench, a laser focusing sensing structure and an optical reflection structure, wherein the laser focusing sensing structure emits laser, the laser is focused and projected on a wafer by a spectroscope and an objective lens to form light spots, the laser focusing sensing structure obtains the defocusing amount of the wafer under the current optical field according to the reflected light spots, and the wafer is subjected to correction movement along the vertical direction by the driving workbench, so that the problem that the reflected light spots are required to be repeatedly compared in the focusing process exists in the scheme, and meanwhile, excellent laser beam quality is required.
In the patent with publication number CN115488495a, a laser focusing method, a laser focusing system and a laser cutting machine are proposed, firstly, a laser head is controlled to sequentially print a plurality of first mark patterns at intervals on a mark plate, each first mark pattern on the mark plate is obtained, each first mark pattern is compared, a difference value between the current position of the laser head and the height position corresponding to the first mark pattern with the smallest line width is determined, a moving mechanism is controlled to drive the laser head to move so as to compensate the difference value, and the optimal focusing position can be determined by comparing the actual laser processing line width on the mark plate in the focusing process.
Disclosure of Invention
In order to achieve the above object, the system comprises an infrared skin second laser, a point light source, a cross reticle, an imaging cylindrical lens, a visible light CCD and a near infrared achromatic objective, wherein the point light source projects a cross reticle and an edge reticle arranged on the cross reticle into the imaging cylindrical lens, after an optical path is collimated in the imaging cylindrical lens, the infrared skin second laser emits laser into the imaging cylindrical lens, the laser is reflected and coupled by a dichroic mirror and enters the near infrared achromatic objective, the laser is focused on the surface of a wafer, a real image is formed on the surface of the wafer below the near infrared achromatic objective, and meanwhile, the real image is imaged on the target surface of the visible light CCD by the near infrared achromatic objective and the double cemented lens, so that the cross reticle and the edge reticle in an imaging field are clearly visible, the coincidence of a laser focus and the surface of the wafer is judged by comparing the imaging sharpness, and the problem that the laser cannot be focused quickly and accurately in the wafer hidden cutting process is solved.
As one aspect of the present invention, the present invention provides an optical focusing system based on coaxial imaging, including an infrared second laser, a point light source, a cross reticle, an imaging barrel lens, a visible light CCD, and a near infrared achromatic objective, wherein the point light source emits visible light to irradiate the cross reticle, a cross reticle and an edge reticle are disposed on the cross reticle, and the cross reticle and the edge reticle are projected into the imaging barrel lens through the visible light irradiation; the red skin second laser device level sets up, red skin second laser device sends laser and gets into imaging barrel mirror, imaging barrel mirror includes aspheric lens, speculum, half mirror, dichroic mirror, cross reticle with aspheric lens parallel arrangement, aspheric lens is used for the light path collimation, the dichroic mirror set up in near-infrared achromatic objective top, laser by dichroic mirror reflection coupling gets into in the near-infrared achromatic objective and focuses on the wafer surface, visible light CCD set up in imaging barrel mirror top for receive real image.
Further, the cross reticle includes a body surface, the cross score line is disposed at a central location on the body surface, and the edge score line is disposed around the cross score line.
Further, the imaging barrel lens comprises a reflecting mirror, a half reflecting mirror and a dichroic mirror, the double-cemented lens is arranged in parallel, the reflecting mirror, the half reflecting mirror and the dichroic mirror are all fixed by adopting 45-degree inclination, and laser irradiates the dichroic mirror and is reflected into the near infrared achromatic objective lens; the reflecting mirror and the half reflecting mirror are positioned at the same horizontal height, the dichroic mirror is positioned below the half reflecting mirror, the double-cemented lens is horizontally arranged above the half reflecting mirror, and the light path is emitted from the imaging barrel mirror after passing through the double-cemented lens and focused on the visible light CCD.
Further, the wafer processing device comprises a vacuum chuck and an electric control displacement table, wherein the vacuum chuck is used for supporting and fixing the wafer, the vacuum chuck is fixed on the electric control displacement table, and the electric control displacement table is used for adjusting the height positions of the vacuum chuck and the wafer.
Further, the base material of the cross reticle is K9 glass, and the imaging narrow side of the cross reticle is 1:25 to 1:20 in ratio.
Further, the reflecting mirror is plated with a visible light high-reflection film, the reflecting surface of the dichroic mirror is plated with a 1064nm high-reflection film, and the transmitting surface of the dichroic mirror is plated with a visible light antireflection film.
Further, the aspherical lens comprises a first mirror surface and a second mirror surface, the first mirror surface and the second mirror surface are respectively the upper surface and the lower surface of the aspherical lens, and the first mirror surface and the second mirror surface are both coated with a visible light antireflection film.
According to another aspect of the present invention, there is provided an optical focusing method based on coaxial imaging, comprising the steps of:
s100, imaging a cross reticle, starting the point light source, enabling the point light source to emit visible light to irradiate the cross reticle, projecting the cross reticle and an edge reticle into the imaging barrel lens, collimating an optical path through the aspheric lens, and then coupling the optical path into an infrared achromatic objective lens sequentially through the reflecting mirror, the half reflecting mirror and the dichroic mirror, so that a clear real image is formed on the surface of the wafer;
s200, starting the infrared skin second laser, reflecting and coupling emitted laser into the near infrared achromatic objective lens through the dichroic mirror in the imaging barrel lens, and focusing on the surface of the wafer;
s300, imaging real images of the cross score line and the edge score line on the visible light CCD target surface by the near infrared achromatic objective lens and the double cemented lens, so that the cross score line and the edge score line are clearly visible in an imaging view field;
s400, comparing the definition of the cross score line to judge that the laser focus is precisely overlapped with the surface of the wafer, and realizing optical positioning focusing.
In general, the above technical solutions conceived by the present invention, compared with the prior art, enable the following beneficial effects to be obtained:
1. the invention provides an optical focusing system based on coaxial imaging, which comprises an infrared skin second laser, a point light source, a cross reticle, an imaging cylindrical lens, a visible light CCD and a near infrared achromatic objective, wherein the point light source projects a cross reticle and an edge reticle arranged on the cross reticle into the imaging cylindrical lens, after an optical path is collimated in the imaging cylindrical lens, the infrared skin second laser emits laser into the imaging cylindrical lens, the laser is reflected and coupled into the near infrared achromatic objective by a dichroic mirror, focused on the surface of a wafer, a real image is formed on the surface of the wafer below the near infrared achromatic objective, and meanwhile, the real image is imaged on a target surface of the visible light CCD by the near infrared achromatic objective and a double-cemented lens, so that the cross reticle and the edge reticle in an imaging view field are clearly visible, and the coincidence of a laser focus and the surface of the wafer is judged by comparing the imaging definition, so that the laser can not be focused rapidly and accurately in the wafer hidden cutting process is solved.
2. The invention provides an optical focusing method based on coaxial imaging, which is characterized in that a cross reticle and an edge reticle are arranged on a cross reticle, and the wafer surface is determined to be positioned at the focus of an objective lens by referring to contrast of imaging definition of the reticle, so that compared with the method for realizing laser focusing by comparing the laser beam waist size with the wafer surface definition, the method has the advantages of small depth of field, high resolution and quick and accurate focusing.
Drawings
Fig. 1 is a schematic structural diagram of an optical focusing system based on coaxial imaging according to an embodiment of the present invention;
FIG. 2 is a top view of a middle cross reticle of an optical focusing system based on-axis imaging according to an embodiment of the present invention;
FIG. 3 is a side view of a middle cross reticle of an optical focusing system based on-axis imaging according to an embodiment of the present invention;
fig. 4 is a flowchart of an optical focusing process based on coaxial imaging according to an embodiment of the present invention.
Like reference numerals denote like technical features throughout the drawings, in particular: 1-red skin second laser, 2-point light source, 3-cross reticle, 4-imaging cylinder lens, 5-visible light CCD, 6-near infrared achromatic objective lens, 7-wafer, 8-vacuum chuck, 9-electric control displacement table, 31-plate surface, 32-cross reticle, 33-edge reticle, 41-aspheric lens, 42-reflecting mirror, 43-half reflecting mirror, 44-dichroic mirror, 45-double-cemented lens, 411-first mirror, 412-second mirror.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
An optical focusing system based on coaxial imaging as shown in fig. 1 comprises an infrared second laser 1, a point light source 2, a cross reticle 3, an imaging cylindrical lens 4, a visible light CCD5 and a near infrared achromatic object lens 6, wherein the point light source 2 emits visible light to irradiate the cross reticle 3, a cross reticle 32 and an edge reticle 33 arranged on the cross reticle 3 are projected in the imaging cylindrical lens 4, after an optical path is collimated in the imaging cylindrical lens 4, the infrared second laser 1 emits laser into the imaging cylindrical lens 4, the laser is reflected and coupled by a dichroic mirror 44 into the near infrared achromatic object lens 6, the laser is focused on the surface of a wafer 7, a real image of the cross reticle 32 and the edge reticle 33 is formed on the surface of the wafer 7 below the near infrared achromatic object lens 6, meanwhile, the real image is imaged on a target surface of the visible light CCD5 (Charge Coupled Device, namely a charge coupling element) by the near infrared achromatic object lens 6 and a double-cemented lens 45, a reticle in an imaging field is projected in the imaging field, the laser is precisely coincident with the surface of the wafer through comparing the real image, and the precise focusing process of the laser cannot be precisely resolved.
Further, as shown in fig. 2, the cross reticle 3 includes a plate surface 31, a cross scribe line 32 and an edge scribe line 33, the cross scribe line 32 is disposed at a central position on the plate surface 31, the edge scribe line 33 is disposed around the cross scribe line 32, and the height position of the cross reticle 3 needs to be precisely adjusted, and the size of the cross scribe line 32 and the edge scribe line 33 need to satisfy better definition and contrast after imaging due to different field sizes formed by different objective lenses.
Further, as shown in fig. 1, the imaging barrel lens 4 includes an aspheric lens 41, a reflecting mirror 42, a half reflecting mirror 43, a dichroic mirror 44 and a double-cemented lens 45, the mirrors are fixedly arranged in the imaging barrel lens 4, the cross reticle 3 and the aspheric lens 41 are arranged in parallel, a cross reticle 32 and an edge reticle 33 are arranged on a plate surface 31 of the cross reticle 3, after the point light source 2 irradiates the cross reticle 3, an optical path enters the aspheric lens 41 for collimation, then visible light is coupled into the infrared achromatic objective 6 by the reflecting mirror 42, the half reflecting mirror 43 and the dichroic mirror 44 in sequence, preferably, the reflecting mirror 42, the half reflecting mirror 43 and the dichroic mirror 44 are arranged in parallel and are all fixed by adopting 45-degree inclination, the infrared second laser 1 is horizontally arranged, and laser irradiates on the dichroic mirror 44 and is reflected into the near infrared achromatic objective 6; the reflecting mirror 42 and the half reflecting mirror 43 are positioned at the same horizontal height, the dichroic mirror 44 is positioned below the half reflecting mirror 43, the double-cemented lens 45 is horizontally arranged above the half reflecting mirror 43, the light path is emitted from the imaging barrel lens 4 after passing through the double-cemented lens 45, and finally, the light path is focused on the visible light CCD5 above the imaging barrel lens 4, and the imaging barrel lens 4 structure adopted by the system has the advantages of compact overall structure, small depth of field, high resolution and stable performance.
Further, the system further comprises a vacuum chuck 8 and an electric control displacement table 9, wherein the vacuum chuck 8 is used for supporting and fixing the wafer 7, the vacuum chuck 8 is fixed on the electric control displacement table 9, and the electric control displacement table 9 is used for adjusting the height positions of the vacuum chuck 8 and the wafer 7 so as to realize quick and accurate focusing.
Further, as shown in fig. 1 and 2, an embodiment of an optical focusing system based on coaxial imaging is provided: the center wavelength of the infrared skin second laser 1 is 1064nm, the repetition frequency is 100kHz, the pulse width is less than 100ps, and the center wavelength of the point light source 2 is 532nm; the base material of the cross reticle 3 is K9 glass, the diameter is 18mm, and the thickness is 2mm; the line width of the cross score line 32 is 15-25 μm, the size is 100-120 μm, the imaging narrow side of the cross score line 32 accounts for 1/25-1/20, and the imaging size is 32 μm x 24 μm; the line width of the edge score line 33 is 5-15 mu m, the size is 40-70 mu m, and the score depths of the cross score line 32 and the edge score line 33 are both more than 80 mu m; the imaging cylindrical lens is composed of an f=16 mm aspheric lens 41, a 45 DEG reflecting mirror 42, a 45 DEG half reflecting mirror 43, a 45 DEG dichroic mirror 44 and an f=200 mm double-cemented lens 45, and the sizes are all 1 inch, the reflecting mirror 42 is plated with a visible light high reflection film, the reflecting surface of the dichroic mirror 44 is plated with a 1064nm high reflection film, and the transmitting surface thereof is plated with a visible light antireflection film.
Further, the aspherical lens 41 includes a first mirror 411 and a second mirror 412, which are an upper surface and a lower surface of the aspherical lens 41, respectively, and the curvatures of the first mirror 411 and the second mirror 412 are different, and are coated with a visible light antireflection film; the distance between the first mirror 411 and the plate surface 31 needs to be adjusted in the range of 6.8 to 8.2 mm.
Further, the target surface of the visible light CCD5 is 0.5 inches, and the pixel size is 5.2×5.2 μm; the magnification of the infrared achromatic object 6 lens is 100 times, the numerical aperture is 0.7, the working distance is 10mm, and the focal length is 2mm; the wafer 7 is fixed on the vacuum chuck 8, and the height adjustment is realized through the electric control displacement table 9, the adjustment precision of the electric control displacement table 9 is 1 mu m, and the depth of field of the imaging system is smaller than 1 mu m.
As another aspect of the present invention, the present invention also provides an optical focusing method based on coaxial imaging, the method comprising the steps of:
s100, cross reticle imaging, a point light source 2 is started, a point light source 2 emits visible light to irradiate a cross reticle 3, a cross reticle 32 and an edge reticle 33 are projected into an imaging barrel lens 4, an optical path is collimated by an aspheric lens 41, then the optical path is coupled into an infrared achromatic objective 6 sequentially through a reflecting mirror 42, a half reflecting mirror 43 and a dichroic mirror 44, and a clear real image is formed on the surface of a wafer 7;
s200, starting the red skin second laser 1, reflecting and coupling the emitted laser into the near infrared achromatic objective 6 through the dichroic mirror 44 in the imaging barrel lens 4, and focusing on the surface of the wafer 7;
s300, real images of the cross score line 32 and the edge score line 33 are imaged on the target surface of the visible light CCD5 by the near infrared achromatic objective lens 6 and the double cemented lens 45, so that the cross score line 32 and the edge score line 33 in an imaging view field are clearly visible;
s400, comparing the definition of the cross score line 32 to judge that the laser focus is precisely overlapped with the surface of the wafer 7, and realizing optical rapid positioning focusing.
By adopting the focusing method, the cross reticle is arranged on the cross reticle, and the wafer surface is determined to be positioned at the focus of the objective lens by referring to contrast of imaging definition of the cross reticle, so that compared with the method for realizing laser focusing by comparing the laser beam waist size with the wafer surface definition, the focusing method has the advantages of small depth of field, high resolution and rapidness and accuracy in focusing.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (8)
1. An optical focusing system based on coaxial imaging is characterized by comprising an infrared second laser (1), a point light source (2), a cross reticle (3), an imaging barrel lens (4), a visible light CCD (5) and a near infrared achromatic objective lens (6), wherein the point light source (2) emits visible light to irradiate the cross reticle (3), a cross reticle (32) and an edge reticle (33) are arranged on the cross reticle (3), and the cross reticle (32) and the edge reticle (33) are projected in the imaging barrel lens (4) under the irradiation of the visible light; the infrared skin second laser (1) level sets up, infrared skin second laser (1) sends out the laser and gets into imaging barrel mirror (4), imaging barrel mirror (4) include aspheric lens (41), speculum (42), half mirror (43) and dichroscope (44), cross reticle (3) with aspheric lens (41) parallel arrangement, aspheric lens (41) are used for the light path collimation, imaging barrel mirror (4) internal fixation sets up dichroscope (44), dichroscope (44) set up in near-infrared achromatic objective (6) top, laser by dichroscope (44) reflection coupling get into in near-infrared achromatic objective (6) and focus on wafer (7) surface, visible light CCD (5) set up in imaging barrel mirror (4) top for receive real image.
2. An optical focusing system based on coaxial imaging according to claim 1, characterized in that the cross reticle (3) comprises a plate body surface (31), the cross scribe line (32) is arranged at a central position on the plate body surface (31), and the edge scribe line (33) is arranged around the cross scribe line (32).
3. An optical focusing system based on coaxial imaging according to claim 1, characterized in that the imaging cylinder (4) comprises a mirror (42), a half mirror (43) and a double cemented lens (45), the mirror (42), the half mirror (43) and the dichroic mirror (44) are arranged in parallel, all fixed with a 45 ° tilt, the laser irradiates the dichroic mirror (44) and reflects into the near infrared achromatic objective (6); the reflecting mirror (42) and the half reflecting mirror (43) are located at the same horizontal height, the dichroic mirror (44) is located below the half reflecting mirror (43), the double-cemented lens (45) is horizontally arranged above the half reflecting mirror (43), and an optical path is emitted from the imaging barrel mirror (4) after passing through the double-cemented lens (45) and focused on the visible light CCD (5).
4. An optical focusing system based on coaxial imaging according to claim 1, characterized by comprising a vacuum chuck (8) and an electrically controlled displacement table (9), said vacuum chuck (8) being used for holding and fixing said wafer (7), said vacuum chuck (8) being fixed on said electrically controlled displacement table (9), said electrically controlled displacement table (9) being used for adjusting the height position of said vacuum chuck (8) and said wafer (7).
5. An optical focusing system based on coaxial imaging according to claim 1, characterized in that the base material of the cross reticle (3) is K9 glass, and the imaging narrow side ratio of the cross reticle (32) is 1:25 to 1:20.
6. An optical focusing system based on coaxial imaging according to claim 3, characterized in that said reflecting mirror (42) is coated with a visible light highly reflective film, the reflecting surface of said dichroic mirror (44) is coated with a 1064nm highly reflective film, and the transmitting surface thereof is coated with a visible light antireflection film.
7. An optical focusing system based on coaxial imaging according to any one of claims 1-6, characterized in that said aspherical lens (41) comprises a first mirror (411) and a second mirror (412), which are the upper and lower surfaces of said aspherical lens (41), respectively, both the first mirror (411) and the second mirror (412) being coated with a visible light antireflection film.
8. An optical focusing method based on coaxial imaging, characterized in that an optical focusing system based on coaxial imaging as claimed in any one of claims 1-7 is applied, comprising the steps of:
s100, imaging a cross reticle, starting the point light source (2), enabling the point light source (2) to emit visible light to irradiate the cross reticle (3), projecting the cross reticle (32) and an edge reticle (33) into the imaging cylindrical lens (4), collimating an optical path through the aspheric lens (41), and then coupling the projected optical path into the infrared achromatic objective lens (6) through the reflecting mirror (42), the half reflecting mirror (43) and the dichroic mirror (44) in sequence, so that a clear real image is formed on the surface of the wafer (7);
s200, starting the infrared skin second laser (1), reflecting and coupling emitted laser into the near infrared achromatic objective lens (6) through the dichroic mirror (44) in the imaging cylindrical lens (4), and focusing on the surface of the wafer (7);
s300, imaging real images of the cross score line (32) and the edge score line (33) on the target surface of the visible light CCD (5) by the near infrared achromatic objective (6) and the double-cemented lens (45) to enable the cross score line (32) in an imaging view field to be clearly visible;
s400, comparing the definition of the cross score line (32) with the definition of the edge score line (33) to judge that the laser focus is precisely overlapped with the surface of the wafer (7), and realizing optical positioning focusing.
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| CN202311626417.4A CN117631269A (en) | 2023-11-30 | 2023-11-30 | Optical focusing system and method based on coaxial imaging |
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| CN202311626417.4A CN117631269A (en) | 2023-11-30 | 2023-11-30 | Optical focusing system and method based on coaxial imaging |
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| CN202311626417.4A Pending CN117631269A (en) | 2023-11-30 | 2023-11-30 | Optical focusing system and method based on coaxial imaging |
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