CN117630631A

CN117630631A - Electronic component testing device and electronic equipment

Info

Publication number: CN117630631A
Application number: CN202211001641.XA
Authority: CN
Inventors: 张敏; 李光磊; 刘洋; 陈号
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2024-03-01

Abstract

The application provides an electronic element testing device and electronic equipment. The electronic component testing device comprises a control structure, a processor, a testing equipment connecting structure and a temperature regulating structure. The control structure includes a circuit board perpendicular to the first direction. The processor is arranged on one surface of the circuit board and is electrically connected with the circuit board. The test equipment connecting structure is arranged on one side of the circuit board and is electrically connected with the circuit board, and is provided with a test equipment connecting port used for connecting an electronic element to be tested so as to realize the electrical connection between the electronic element to be tested and the circuit board. And the temperature regulation structure is connected with the control structure and used for controlling the temperature of the electronic element to be tested. In the first direction, the processor is isolated from the test equipment connection port by a control structure. The control structure isolates the processor from the test equipment connection port in the first direction so as to isolate the processor from the electronic component to be tested, and reduce the influence of the cooling of the processor on the heating of the electronic component to be tested.

Description

Electronic component testing device and electronic equipment

Technical Field

The application relates to the field of test equipment, in particular to an electronic element test device and electronic equipment.

Background

The sensitivity of the memory bank produced by the high-precision process to the temperature synchronously and rapidly rises along with the increase of the capacity and the miniaturization of the process. The high temperature stress is used as one of the most important process parameters for the production test of the memory bank. When testing the high temperature stress process parameters of the memory bank, it is necessary to uniformly heat the memory bank, but uniform heating of the memory bank is in conflict with cooling of the processor. The cooling of the processor often affects the heating effect of the memory strip, resulting in lower accuracy of the high temperature stress process parameters of the memory strip obtained by testing.

Disclosure of Invention

The application provides an electronic component testing device and electronic equipment, which are convenient for reducing the influence of processor cooling on heating of an electronic component to be tested.

A first aspect of embodiments of the present application provides an electronic component testing apparatus. The electronic component testing device comprises a control structure, a processor, a testing equipment connecting structure and a temperature regulating structure. The control structure includes a circuit board perpendicular to the first direction. The processor is arranged on one surface of the circuit board and is electrically connected with the circuit board. The test equipment connecting structure is arranged on one side of the circuit board and is electrically connected with the circuit board, and is provided with a test equipment connecting port used for connecting an electronic element to be tested so as to realize the electrical connection between the electronic element to be tested and the circuit board. And the temperature regulation structure is connected with the control structure and used for controlling the temperature of the electronic element to be tested. In the first direction, the processor is isolated from the test equipment connection port by a control structure.

The electronic component testing device isolates the processor and the test equipment connector in the first direction through the control structure, further isolates the processor and the electronic component to be tested in the first direction, and reduces the influence of the cooling of the processor on the heating of the electronic component to be tested. After the isolation of the control structure, the low temperature of the local space caused by the cooling of the processor is difficult to diffuse to the position of the electronic element to be tested, so that the uniformity of the temperature of the environment where the electronic element to be tested is positioned can be improved. The test equipment connection structure and the processor are arranged on the control structure, and the processor and the test equipment connection port only need to be isolated in the first direction to reduce heat transfer, so that the test equipment connection port is not required to be arranged at a place far away from the processor, the whole volume of the electronic element test device is reduced, and the data distortion risk during data transmission between the processor or the test equipment connection port and the circuit board is also reduced.

Based on the first aspect, in one possible implementation manner, the control structure further includes a partition plate. In the first direction, the processor and the test equipment connection port are isolated by the isolation plate. The division board is provided with the through-hole, and test equipment connector passes the through-hole and is located the one side of division board, and the treater is located the another side of division board.

In this possible implementation manner, the processor and the test device connection structure may be disposed on the same surface of the circuit board in the first direction, and isolation of the test device connection port from the processor is achieved by the isolation board. The method can be realized by adding the isolation board based on a circuit board with most of processor connection ports and to-be-tested equipment ports on the same surface in the prior art.

Based on the first aspect, in one possible implementation manner, the isolation board includes a board body and a sealing member, the sealing member is connected with the board body or the test equipment connection structure, and the sealing member seals a gap between the test equipment connection structure and the board body.

In this possible implementation, the clearance due to the spacer plate tolerance is reduced by the seal, further reducing the risk of heat transfer between the test equipment connection port and the processor through the clearance.

Based on the first aspect, in one possible implementation manner, the test device connection structure includes a connector and an extension piece. The connector is fixedly connected with the circuit board. The extension piece is detachably connected with the connector, and one end of the extension piece, which is far away from the circuit board, forms a test equipment connector.

In this possible implementation, the distance from the test device connection port to the processor in the first direction is increased by the extension member, so that isolation of the test device connection port from the processor by the isolation plate is facilitated.

Based on the first aspect, in one possible implementation manner, the circuit board has a first surface and a second surface opposite along a first direction, the processor is disposed on the first surface, and the test device connection structure is disposed on the second surface. In the first direction, the processor and the test equipment connection port are isolated by the circuit board.

In this possible implementation, the processor and the test device connection structure are disposed on opposite sides of the circuit board along the first direction, respectively, and isolation of the processor and the test device connection structure is achieved through the circuit board.

Based on the first aspect, in one possible implementation manner, the heat insulation layer is connected with the circuit board, and in the first direction, the heat insulation layer is located between the processor and the test device connection port.

In this possible implementation, the thermal barrier may further limit heat transfer between the location of the processor and the location of the test equipment connection port.

Based on the first aspect, in one possible implementation manner, the circuit board further includes a liquid cooling piece, the liquid cooling piece is connected with the circuit board, and one surface of the liquid cooling piece is attached to the processor.

In this possible implementation, the cooling of the processor by the liquid cooling member can limit the cooling area to the vicinity of the processor, reducing the temperature effect on the area where the test equipment connection structure is located.

Based on the first aspect, in one possible implementation manner, the temperature regulation structure includes a first heating element, a cover body, and an airflow driving element. The cover body and the control structure form a containing cavity, the containing cavity is used for containing the electronic element to be tested, and the cover body is provided with an inlet part and an outlet part which are communicated with the containing cavity. The air flow driving piece is connected with the control structure and is used for driving air flow to enter the accommodating cavity along the inflow path through the inlet part and flow to the electronic component to be tested. The first heating element is connected with the control structure and is arranged in the inflow path.

In this possible implementation manner, the first heating element in the temperature regulation structure heats the air flow driven by the air flow driving element, and the heated air flow passes through the electronic component to be tested, so that the electronic component to be tested can be heated uniformly. Compared with the mode that the electronic component to be tested is heated firstly, then the air flow driving piece takes away heat to cool, and heat balance is achieved, the direct hot air heating mode can enable the electronic component to be tested to be uniformly close to the temperature of air flow, the temperature of the air flow can be controlled through the power of the first heating piece, therefore, temperature control parameters of the electronic component to be tested are simplified, and the electronic component to be tested is convenient to uniformly heat.

Based on the first aspect, in one possible implementation manner, the circuit board includes a pulse width modulation control unit, and the first heating element is electrically connected to the pulse width modulation control unit.

In this possible implementation manner, the circuit board is electrically connected to the memory bank, so that the circuit board can read the temperature data of the memory bank, the pulse width modulation control unit controls the power of the first heating element based on the temperature data of the memory bank, and adjusts the temperature of the memory bank by controlling the heat output of the first heating element.

Based on the first aspect, in one possible implementation manner, the test device connection structure includes a plurality of test device connection portions, each test device connection portion has at least one test device connection port, and the plurality of test device connection portions are arranged along a second direction, and the second direction is perpendicular to the first direction. The cover body corresponds to the connection structure of the test equipment one by one. A mounting cavity is formed between two adjacent cover bodies, and the first heating element and the airflow driving element are arranged in the mounting cavity.

In the possible implementation manner, the number of the electronic components to be tested, which are tested simultaneously, can be increased by arranging the plurality of test equipment connecting parts, and the plurality of electronic components to be tested are partitioned by the interval arrangement of the plurality of test equipment connecting parts, so that the density of the electronic components to be tested is reduced, and the temperature uniformity of each electronic component to be tested is improved. In addition, the first heating element and the airflow driving element are arranged in the mounting cavity, so that the space in the second direction is reasonably utilized, and the whole volume of the electronic element testing device is reduced.

Based on the first aspect, in one possible implementation manner, the cover body has a first end plate and a second end plate oppositely disposed along a third direction, and the third direction is perpendicular to the first direction and the second direction. The first end plate and the second end plate are both arranged at the inlet. The cover body further comprises a top plate, the top plate and the control structure are arranged at intervals in the first direction, and a containing cavity is formed between the top plate and the isolation plate. The top plate is provided with an outlet.

In this possible implementation, the heating of the electronic component to be tested is achieved by entering gas at opposite sides along the third direction, so that the electronic component to be tested has approximately the same heating effect at both ends of the third direction.

Based on the first aspect, in one possible implementation manner, the first end plate is inclined to the third direction, and a sectional area of the accommodating cavity perpendicular to the second direction gradually increases from being close to the mounting cavity to being far away from the mounting cavity. The inlet portion includes a plurality of ports spaced apart along the direction of extension of the first end plate.

In this possible implementation, since the gas flow driving member is inclined through the first end plate and the plurality of split openings are arranged in the extending direction of the first end plate to form the inlet portion, the gas flow into the accommodating chamber can be homogenized in the second direction so that the gas flow amounts of the respective regions of the first end plate in the second direction are substantially the same.

Based on the first aspect, in one possible implementation manner, the outlet portion is located at a middle position of the top plate in the third direction.

In this possible implementation manner, after the air flow is introduced into the accommodating cavity at the inlet portions at two ends in the third direction, two parts of air are collected at the middle position of the top plate in the third direction, so that the air flow at the middle position in the third direction is larger than the air flow at two ends of the third direction, and thus the electronic component to be tested with the top plate at the middle position in the third direction is subjected to more heat exchange with the air flow. The top plate is positioned at the middle position of the third direction and is approximately aligned with the middle position of the electronic element to be tested in the third direction, so that the characteristic that the electronic device to be tested is easy to generate heat accumulation at the middle position is exactly met, if the temperature of the electronic device to be tested is higher than the temperature of air flow due to the heat accumulation at the middle position of the electronic device to be tested, the heat can be taken away through the air flow with large flow, and the middle position and the two end positions of the electronic device to be tested are kept uniform as much as possible.

Based on the first aspect, in one possible implementation manner, the test device connection structure includes a plurality of test device connection portions, each test device connection portion has at least one test device connection port, and the plurality of test device connection portions are arranged along a second direction, and the second direction is perpendicular to the first direction. The inlet and outlet portions are located at ends of the cover in the third direction. The first heating element and the airflow driving element are arranged at the end part of the test equipment connecting structure, which is positioned in the third direction, and the third direction is perpendicular to the first direction and the second direction.

In this possible implementation, the first heating element and the airflow driving element are located at the end of the third direction, and the first heating element may be disposed close to the inlet portion located at the end of the third direction, so as to reduce the flow path of the airflow after heating and flowing through the electronic component to be tested, and reduce the heat loss before the airflow contacts the electronic component to be tested.

Based on the first aspect, in one possible implementation manner, along the third direction, the first heating element is disposed on one side of the test device connection structure, and the airflow driving element is disposed on the other side of the test device connection structure. The airflow driving piece is used for driving the air in the accommodating cavity to flow out of the accommodating cavity through the outlet.

In this possible implementation, the gas flow driving member drives the negative pressure formed after the gas in the accommodating cavity flows out, so that the gas enters the accommodating cavity through the inlet part.

Based on the first aspect, in one possible implementation manner, along the third direction, the first heating element and the air flow driving element are disposed on the same side of the test device connection structure. The airflow driving piece is used for driving the air outside the accommodating cavity to flow into the accommodating cavity through the inlet part.

In this possible embodiment, the gas flow drive is driven by the compressed gas into the receiving chamber.

In one possible implementation manner, the first heating element includes a plurality of fins, and a circulation gap is formed between two adjacent fins, and the circulation gap forms a part of the inflow path.

In this possible implementation, the fins may increase the contact area of the air flow passing through the first heating member, improving the heating efficiency of the air flow.

Based on the first aspect, in one possible implementation manner, the temperature regulation structure further includes a second heating element, where the second heating element is disposed on an outer side of the test device connection structure in a second direction, and the second direction is perpendicular to the first direction.

In this possible implementation manner, the second heating member is heated by the outer side of the electronic component to be tested, so that the temperature difference between the outer side and the middle position of the electronic component to be tested can be reduced, based on that the electronic component to be tested may generate heat accumulation at the middle position.

Based on the first aspect, in one possible implementation manner, the test device connection structure includes a plurality of test device connection portions, each test device connection portion has at least one test device connection port, and the plurality of test device connection portions are arranged along a second direction, and the second direction is perpendicular to the first direction. The temperature regulation and control structure also comprises a second heating piece, and the second heating piece is arranged on the outer side of the connecting part of the testing equipment along the second direction.

In the possible implementation manner, the number of the electronic components to be tested, which are tested simultaneously, can be increased by arranging the plurality of test equipment connecting parts, and the plurality of electronic components to be tested are partitioned by the interval arrangement of the plurality of test equipment connecting parts, so that the density of the electronic components to be tested is reduced, and the temperature uniformity of each electronic component to be tested is improved. And on the basis that the electronic element to be tested possibly generates heat accumulation at the middle position, the second heating piece heats the outer side of the electronic element to be tested, so that the temperature difference between the outer side of the electronic element to be tested and the middle position, which is connected with the connecting part of each testing device, can be reduced.

Based on the first aspect, in one possible implementation manner, the circuit board includes a pulse width modulation control unit, and the second heating element is electrically connected to the pulse width modulation control unit.

In this possible implementation manner, the circuit board is electrically connected to the memory bank, so that the circuit board can read the temperature data of the memory bank, the pulse width modulation control unit controls the power of the second heating element based on the temperature data of the memory bank, and adjusts the temperature of the memory bank by controlling the heat output of the second heating element.

A second aspect of the present application provides an electronic device. Such an electronic device comprises an electronic device body and an electronic component testing apparatus in any implementation of the first aspect. The electronic equipment body is electrically connected with the circuit board.

The electronic component testing device in the electronic equipment isolates the processor from the testing equipment connector in the first direction through the control structure, so that the processor and the electronic component to be tested are isolated in the first direction, and the influence of the cooling of the processor on the heating of the electronic component to be tested is reduced. After the isolation of the control structure, the low temperature of the local space caused by the cooling of the processor is difficult to diffuse to the position of the electronic element to be tested, so that the uniformity of the temperature of the environment where the electronic element to be tested is positioned can be improved. The test equipment connection structure and the processor are arranged on the control structure, and the processor and the test equipment connection port only need to be isolated in the first direction to reduce heat transfer, so that the test equipment connection port is not required to be arranged at a place far away from the processor, the whole volume of the electronic element test device is reduced, and the data distortion risk during data transmission between the processor or the test equipment connection port and the circuit board is also reduced.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device testing apparatus according to an embodiment of the present application.

Fig. 2 is an assembly schematic diagram of an electronic device testing apparatus according to an embodiment of the present application.

Fig. 3 is a sectional view in the direction III-III in fig. 1.

Fig. 4 is a schematic structural diagram of another electronic device testing apparatus according to an embodiment of the present disclosure, where a sealing member is fixed to a board body.

Fig. 5 is a schematic structural diagram of an electronic device testing apparatus according to an embodiment of the present application, in which a cover is removed.

Fig. 6 is a schematic structural diagram of a cover according to an embodiment of the present disclosure.

Fig. 7 is a schematic structural diagram of an electronic device testing apparatus according to an embodiment of the present application, in which the cover bodies in the a region and the B region are transparent.

Fig. 8 is a schematic structural diagram of an electronic device testing apparatus according to a second embodiment of the present application, in which the cover bodies in the C region, the D region, and the E region are transparent.

Fig. 9 is a schematic structural diagram of a cover according to an embodiment of the present disclosure.

Fig. 10 is a schematic structural diagram of an electronic device testing apparatus according to a second embodiment of the present application, in which the cover bodies in the F region, the G region, and the H region are transparent.

Fig. 11 is a cross-sectional view of an electronic device testing apparatus according to a third embodiment of the present application.

Fig. 12 is an assembly schematic diagram of an electronic device testing apparatus according to a third embodiment of the present application.

Fig. 13 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.

Description of the main reference signs

Electronic device 0001

Electronic device body 003

Electronic component testing device 001

Memory bank 002

Control structure 100

Circuit board 110

First face 110a

Second face 110b

Pulse width modulation control unit 111

Separator 130

Plate body 131

Flexible region 135

Seal 133

Through hole 151

Thermal insulation layer 170

Processor 200

Test equipment connection structure 300

Test equipment connection port 300a

Test equipment connection 310

Test equipment connection assembly 311

Connector 3111

Extension 3113

Temperature control structure 400

First heating element 410

Fin 411

Cover 430

Entrance 430a

Outlet portion 430b

First end plate 431

First drainage plate 432

Second end plate 433

Second drainage plate 434

Top plate 435

Connection plate 437

Airflow driver 450

Second heating element 470

Liquid cooling member 500

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

Further advantages and effects of the present application will be readily apparent to those skilled in the art from the present disclosure, by describing embodiments of the present application with specific examples. While the description of the present application will be presented in conjunction with the preferred embodiments, it is not intended that the features of this application be limited to only this implementation. Rather, the purpose of the description presented in connection with the embodiments is to cover other alternatives or modifications, which may be extended by the claims based on the present application. The following description contains many specific details in order to provide a thorough understanding of the present application. The present application may be practiced without these specific details. Furthermore, some specific details are omitted from the description in order to avoid obscuring the focus of the application. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.

Hereinafter, the terms "first," "second," and the like, if used, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. The terms of orientation such as "upper", "lower", "left", "right", etc. are defined with respect to the orientation of the components shown in the drawings as they are schematically disposed, and it should be understood that these directional terms are relative terms that are used for descriptive and clarity with respect to each other and that may be varied accordingly with respect to the orientation of the components shown in the drawings.

In the present application, the term "coupled" should be interpreted broadly, unless explicitly stated or defined otherwise, as such, as the term "coupled" may be fixedly coupled, detachably coupled, or as a single piece; can be directly connected or indirectly connected through an intermediate medium. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In the following detailed description of the embodiments in conjunction with the drawings, which are not to scale in general, the drawings illustrating the partial structure of the device are not to scale and are merely examples, which should not limit the scope of the present application.

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

Example 1

Fig. 1 shows a schematic structural diagram of an electronic device testing apparatus 001 according to the present embodiment. Fig. 2 shows an assembly schematic diagram of an electronic component testing apparatus 001 according to the present embodiment. Fig. 3 shows a cross-sectional view in direction III-III of fig. 1.

As shown in fig. 1 and 2, such an electronic component testing apparatus 001 includes a control structure 100, a processor 200, a testing device connection structure 300, and a temperature regulation structure 400. The control structure 100 forms a base for mounting the processor 200, the test device connection structure 300, and the temperature regulation structure 400. The test equipment connection structure 300 is provided on the control structure 100 for connecting electronic components to be tested. A processor 200 is provided on the control structure 100 for processing the data stream in order to monitor the performance of the electronic components to be tested. The temperature control structure 400 is disposed on the control structure 100 for adjusting the temperature of the electronic component to be tested so as to test the performance of the electronic component to be tested at a set temperature. In the present application, the description that a first member is provided on a second member does not mean that the first member is located above the second member in a spatial direction, but means that the first member and the second member are connected. For convenience of description, the embodiment of the present application uses the electronic device to be tested as the memory bank 002. It can be understood that in other embodiments, the electronic components to be tested may also be electronic components having differences in performance at different temperatures, such as a liquid crystal display, a solid state disk, etc., and the electronic component testing device 001 of the present application is used to test the performance of the electronic components to be tested at the set temperature.

As shown in fig. 2 and 3, the control structure 100 includes a circuit board 110, where the circuit board 110 is a flat plate substantially perpendicular to the first direction X, and the circuit board 110 has a first face 110a and a second face 110b opposite to each other along the first direction X. The processor 200 is fixedly disposed on the first surface 110a, and the processor 200 is electrically connected to the circuit board 110, so that electrical signals can be transmitted between the processor 200 and the circuit board 110.

The electronic component testing structure further includes a liquid cooling member 500. The liquid cooling member 500 includes a liquid cooling pipe and a liquid cooling pump. The liquid-cooled conduit has a liquid-cooled surface that conforms to the processor 200. When the liquid cooling pump drives the cooling liquid to circulate in the liquid cooling pipeline, heat generated by the processor 200 can be transferred into the cooling liquid through the liquid cooling surface, and the heat is taken away by the flowing cooling liquid. The cooling fluid exchanges heat with the environment outside the liquid cooling pipeline at the liquid cooling pump, and the cooling fluid is recycled to the position of the liquid cooling surface after releasing the heat, so that continuous cooling of the processor 200 is realized.

The test device connection structure 300 is also disposed on the first surface 110a, and the test device connection structure extends along the first direction X and is away from the circuit board 110. A test device connection port 300a is formed at an end of the test device connection structure 300 remote from the circuit board 110. The test device connection port 300a is used for connecting the memory stick 002.

The test device connection structure 300 includes three test device connection parts 310, and the three test device connection parts 310 are disposed at intervals along the second direction Y. Each test equipment connection part 310 has at least one test equipment connection port 300a to which at least one memory stick 002 can be connected. In the present embodiment, two test device connection parts 310 are located at both sides of the second direction Y, each test device connection part 310 includes six test device connection components 311, each test device connection component 311 has one test device connection port 300a, and thus, each test device connection part 310 has six test device connection ports 300a, to which six memory chips 002 can be connected. The test device connection part 310 located in the middle of the second direction Y includes twelve test device connection assemblies 311, each test device connection assembly 311 having one test device connection port 300a, so that the test device connection part 310 has twelve test device connection ports 300a to which twelve memory sticks 002 can be connected.

The control structure 100 also includes a spacer 130. The board 131 includes a board 131, the board 131 is a flat board substantially perpendicular to the first direction X, and the board 131 and the circuit board 110 are disposed at intervals along the first direction X. The board 131 is provided with a through hole 151, and the through hole 151 is used for the test device connection structure 300 to pass through, so that the test device connection port 300a is located at one side of the board 131 away from the circuit board 110. The number of through holes 151 is also three corresponding to three test device connection parts 310, and each through hole 151 corresponds to one test device connection part 310. It will be appreciated that the through holes 151 in the plate 131 may also be configured to allow a plurality of test equipment connectors 310 to pass therethrough at the same time. The sealing member 133 is fixedly connected with the testing device connection portion 310, and the sealing member 133 is hermetically connected with one surface of the board body 131, which is close to the circuit board 110.

The test device connection port 300a is located at a side of the isolation board 130 away from the circuit board 110, and the processor 200 is located at a side of the isolation board 130 close to the circuit board 110, such that the test device connection port 300a is isolated from the processor 200 in the first direction X by the isolation board 130. The structure for cooling the processor 200 and the structure for heating the memory bank 002 may be located at opposite sides of the partition plate 130. In this embodiment, the structure for cooling the processor 200 is a liquid cooling member 500, and the liquid cooling member 500 may also be located on one side of the isolation board 130 close to the circuit board 110, so as to reduce the heat transferred from one side of the isolation board 130 far from the circuit board 110 to one side of the isolation board 130 close to the circuit board 110, and thus reduce the heat taken away by the liquid cooling member 500 from one side of the isolation board 130 far from the circuit board 110. From another perspective, the effect of the liquid cooling member 500 on the cooling of the processor 200 is reduced when heating the side of the partition 130 remote from the circuit board 110. It should be noted that isolation in this application does not mean complete isolation of heat transfer, but rather reduces heat exchange by reducing the form of airflow exchange.

The sealing member 133 is fixedly connected with the testing device connection part 310, and the sealing member 133 is hermetically connected with one side of the board 131 close to the circuit board 110, so that the sealing member 133 seals a gap between the testing device connection part 310 and the board 131. Based on tolerance considerations, the projection of the test device connection 310 is located within the projection of the through hole 151 on a projection plane perpendicular to the first direction X, thereby facilitating the passage of the test device connection 310 through the through hole 151. After the sealing member 133 seals the gap, gas exchange between the inner wall of the through hole 151 and the test device connection part 310 can be further reduced at both sides of the plate body 131 opposite to the first direction X, thereby isolating heat transfer.

It will be appreciated that in order to achieve a sealed connection of the seal 133 to the plate 131, the plate 131 may also be provided with a flexible region 135, and the flexible region 135 may be suitably deformed to match the shape of the seal 133. Specifically, the plate body 131 is provided with a rubber layer in the flexible region 135, and the rubber layer can be elastically deformed to adapt to the shape of the sealing member 133, so as to enhance the sealing effect of the sealing member 133 and the plate body 131.

The seal 133 may also fill the gap between adjacent two test equipment connection assemblies 311, further reducing gas exchange on opposite sides of the plate 131 in the first direction X, thereby isolating heat transfer.

Fig. 4 shows an assembly schematic diagram of another electronic component testing apparatus 001 according to the present embodiment, wherein a sealing member 133 is fixed to a board 131.

As can be appreciated from fig. 4, the seal 133 may also be fixedly coupled to the plate 131. The sealing member 133 is disposed in the through hole 151, the sealing member 133 is a flexible member having a through hole which can be deformed, and the testing device connection part 310 passes through the through hole so that the testing device connection port 300a is located at a side of the board body 131 away from the circuit board 110, and the sealing member 133 is adapted to the shape of the testing device connection part 310 by itself deformation, thereby sealing a gap between the testing device connection part 310 and the board body 131.

It will be appreciated that the spacer 130 may also include only the plate 131 without the seal 133, which is simpler and easier to match than the structure including the seal 133, and also reduces the heat exchange between the memory bank 002 and the processor 200 to some extent.

Referring back to fig. 2 and 3, the test equipment connection assembly 311 includes a connector 3111 and an extension 3113. The connector 3111 is disposed on the first face 110a of the circuit board 110. The connector 3111 is fixedly connected to the circuit board 110, and a connection port is formed at an end of the connector 3111 remote from the circuit board 110. The extension piece 3113 and the connector 3111 are detachably connected to the connection port, such that the extension piece 3113 is electrically connected to the connector 3111, and the extension piece 3113 is also electrically connected to the circuit board 110 through the connector 3111. The extension piece 3113 extends in the first direction X, and a test device connection port 300a is formed at an end of the extension piece 3113 remote from the connection head 3111. Such a test equipment assembly may extend the test equipment connection port 300a to a position away from the circuit board 110 by the extension 3113 when the connection head 3111 fixed on the circuit board 110 is insufficient to pass through the through-hole 151 of the isolation board 130, and thus pass through the through-hole 151 of the isolation board 130. The distance from the isolation board 130 to the circuit board 110 in the first direction X may be designed according to the processor 200 and the liquid cooling member 500, based on the fact that the processor 200 and the liquid cooling member 500 themselves are small in volume, and thus, the distance from the isolation board 130 to the circuit board 110 in the first direction X is small. The extension piece 3113 does not need to extend too much in the first direction X, so that the memory stripe 002 has less electrical signal loss when transmitting electrical signals through the extension piece 3113 and the connector 3111.

There are various ways to maintain the relative positions of the board 131 and the circuit board 110 in the first direction X. Such as: the outer circumference of the plate body 131 is fixedly connected with an extension frame, and the extension frame extends to the circuit board 110 parallel to the first direction X and contacts the circuit board 110, and passes through the extension side support plate body 131. And the following steps: after the sealing member 133 is fixedly connected to the testing device connection part 310, the plate body 131 is supported in the first direction X by the sealing member 133.

Fig. 5 shows a schematic structural diagram of an electronic device testing apparatus 001 according to the present embodiment, in which a cover 430 is removed. Fig. 6 shows a schematic structural diagram of the cover 430 provided in this embodiment. Fig. 7 shows an assembly schematic diagram of an electronic component testing apparatus 001 according to the present embodiment, wherein the cover 430 in the a region and the B region is transparent.

As shown in fig. 5 and 6, the temperature regulation structure 400 includes a cover 430, a first heating member 410, and an airflow driving member 450. The first heating element 410 and the airflow driving element 450 are electrically connected to the circuit board 110. In the present embodiment, three covers 430 correspond to three test device connection portions 310. The cover 430 is connected to the isolation board 130, and a receiving cavity is formed between the cover 430 and the isolation board 130, and when the memory stick 002 is connected to the test device connection portion 310, the memory stick 002 is located in the receiving cavity. The three covers 430 are also connected together at one end remote from the separator 130 by a connection plate 437. The connection plate 437 and the cover 430 may be integrally formed. The connection plate 437 and the separation plate 130 form therebetween a mounting chamber between the adjacent two covers 430. A first heating element 410 and an airflow driving element 450 are provided in the mounting chamber, and a heated airflow is provided to the receiving chamber through the first heating element 410 and the airflow driving element 450.

Two mounting chambers are formed between the three cover bodies 430, and a first heating member 410 and an air flow driving member 450 are disposed in each of the mounting chambers. The cover 430 includes first and second end plates 431 and 433 opposite in the third direction Z, and the first and second end plates 431 and 433 have an inlet 430a thereon. The gas flow driving part 450 drives the gas to enter the accommodating chamber through the inlet part 430a along the inflow path and contact the memory stick 002 in the accommodating chamber. The gas can flow out of the accommodating cavity along the outflow path after contacting the memory stick 002. The first heating element 410 is disposed in the inflow path such that the gas is heated by the first heating element 410 to a temperature rise before contacting the memory stick 002.

Specifically, the first heating element 410 is fixedly connected to the partition 130, and the air flow driving element 450 is fixedly connected to an end of the first heating element 410 away from the partition 130. The air inlet end of the air flow driving member 450 extends out of the connection plate 437, and the air outlet end of the air flow driving member 450 faces the first heating member 410. The driving gas of the gas flow driving member 450 flows along the inflow path. The gas passes through the first heating member 410 during the flowing along the inflow path, flows in the installation cavity after being heated by the first heating member 410, then enters the accommodating cavity through the inlet portion 430a, and then contacts the memory bank 002 and exchanges heat with the memory bank 002.

The first heating element 410 includes a plurality of fins 411, and a flow gap is formed between two adjacent fins 411, and the flow gap forms a part of the inflow path. The fins 411 may increase the contact area of the air flow passing through the first heating member 410, improving the heating efficiency of the air flow.

The first end plate 431 and the second end plate 433 are both provided with the inlet portion 430a, so that the gas in the installation cavity can enter the accommodating cavity from the two directions of the first end plate 431 and the second end plate 433, and heat exchange is performed on the two ends of the memory bank 002 in the third direction Z.

The cover 430 further includes a top plate 435, the top plate 435 being located at an end of the first end plate 431 and the second end plate 433 remote from the separator 130. A receiving cavity is formed between the top plate 435 and the partition plate 130, and when the memory stick 002 is disposed on the test equipment connection portion 310, the top plate 435 and the partition plate 130 are respectively located at two ends of the memory stick 002 in the first direction X. An outlet 430b is provided in the top plate 435, and the gas flowing through the memory stick 002 in the accommodating chamber flows out of the accommodating chamber along the outflow path through the outlet 430 b.

Referring to fig. 6 and 7, the outlet 430b is disposed at a middle position of the top plate 435 in the third direction Z. When the memory stick 002 is set on the test equipment connection portion 310, the middle position of the memory stick 002 is substantially aligned with the middle position of the top plate 435 in the third direction Z. When the gas in the installation chamber enters the accommodation chamber from the first end plate 431 and the second end plate 433 and flows through the memory bank 002, it is collected at the intermediate position of the memory bank 002 and flows out of the accommodation chamber through the outlet portion 430 b. So that the gas flow rate in the middle of the memory bar 002 in the accommodating cavity is larger than the gas flow rates at the two ends of the memory bar 002. Based on the characteristic that heat accumulation is easy to generate at the middle position of the memory bank 002 in the third direction Z when the memory bank 002 operates, the gas flow rate of the middle position of the memory bank 002 is increased, the heat exchange between the middle position of the memory bank 002 and the air flow can be accelerated, and the temperature of each position of the memory bank 002 in the third direction Z can be kept uniform.

The first end plate 431 and the second end plate 433 are inclined to the third direction Z, and the sectional area of the accommodating chamber in the direction perpendicular to the second direction Y gradually increases from near to far from the mounting chamber. The cover 430 further includes a first drainage plate 432 and a second drainage plate 434, wherein a first drainage channel is formed between the first drainage plate 432 and the first end plate 431, and a second drainage channel is formed between the second drainage plate 434 and the second end plate 433. The first drainage channel guides the gas in the installation chamber to the first end plate 431 and into the accommodation chamber via the inlet portion 430a of the first end plate 431. The second drainage channel directs the gas in the mounting chamber to the second end plate 433 and into the receiving chamber via the inlet portion 430a of the second end plate 433. Since the installation chamber and the receiving chamber are spaced apart in the second direction Y, the gas in the installation chamber can more uniformly flow to the respective regions of the first and second end plates 431 and 433. The inlet portion 430a of the first end plate 431 includes a plurality of sub-ports arranged in the extending direction of the first end plate 431, and the inlet portion 430a of the second end plate 433 also includes a plurality of sub-ports arranged in the extending direction of the second end plate 433, and by providing the first end plate 431 and the second end plate 433 obliquely to the third direction Z, the flow rate of the gas flowing into the accommodating chamber through each sub-port can be made more uniform.

The temperature regulating structure 400 further includes a second heating member 470. The second heating member 470 is disposed outside the test device connection part 310 in the second direction Y. The second heating member 470 can heat the memory bank 002 positioned at the end of the second direction Y based on the characteristic that heat accumulation is easily generated at the middle position of the second direction Y when the memory bank 002 is operated. In this embodiment, one second heating member 470 is disposed on each side of the second direction Y of each test device connection portion 310, and two second heating members 470 heat each side of each test device connection portion 310, so that the ends of the memory stripes 002 connected to each test device connection portion 310 can be compensated for heat, and the temperatures of all the memory stripes 002 connected to each test device connection portion 310 in the second direction Y are substantially uniform.

The circuit board 110 is integrated with a pulse width modulation (Pulse Width Modulation, PWM) control unit, and the first heating member 410 and the second heating member 470 are connected to the pulse width modulation control unit 111. The pwm control unit 111 calculates the amount of heat to be compensated based on the temperature of the memory bank 002, and controls the power of the first heating element 410 and the second heating element 470 according to the amount of heat, so that the heat accumulation level of the memory bank 002 at the middle position in the second direction Y is synchronized with the heat accumulation level of the second heating element 470, and the heat accumulation level of the memory bank 002 at the middle position in the third direction Z is synchronized with the heat accumulation level of the first heating element 410, thereby maintaining the uniformity of the temperature of the memory bank 002 in the second direction Y and the third direction Z.

Specifically, the circuit board 110 is electrically connected to the memory bank 002, so as to read the temperature of the memory bank 002. After the circuit board 110 reads the temperature of the memory bank 002, the power of the first heating member 410 and the second heating member 470 is regulated, so as to maintain the uniformity of the temperature of the memory bank 002 in the second direction Y and the third direction Z. The circuit board 110 can also adjust the temperature change speed of the memory stick 002 by controlling the power of the air flow driving member 450.

The electronic device test apparatus 001 can isolate the memory bank 002 from the processor 200 by the isolation board 130, and reduce the influence of the cooling of the processor 200 on the heating of the memory bank 002. After reducing the influence of the cooling of the processor 200 on the heating of the memory bank 002, the temperature of the memory bank 002 is more uniform, and the accuracy of the high-temperature stress test result of the memory bank 002 is improved. The gas heated by the first heating element 410 heats the memory bank 002, and then cools the overheated memory bank 002 by air flow exchange after heating the memory bank 002 with respect to the heat radiation, so that the uniformity of heating at each position of the memory bank 002 can be maintained, and the heating efficiency of the memory bank 002 can be improved. By controlling the first end plate 431 and the second end plate 433 to incline to the third direction Z, the plurality of memory stripes 002 arranged in the second direction Y can circulate a substantially uniform air flow, so that each memory stripe 002 generates heat exchange with the air flow as uniformly as possible. The inlet portions 430a are distributed at the first end plate 431 and the second end plate 433, and the positions of the outlet portions 430b are disposed at the intermediate positions of the top plate 435, so that the temperature of the memory bank 002 at each position in the third direction Z is more uniform. The second heating member 470 is provided such that each memory stick 002 in the second direction Y maintains a uniform temperature when a plurality of memory sticks 002 are simultaneously tested.

Example two

Fig. 8 shows a schematic structural diagram of an electronic component testing apparatus 001 according to the present embodiment, in which the cover 430 in the C region, the D region, and the E region is transparent. Fig. 9 is a schematic structural diagram of a cover 430 of the electronic device testing apparatus 001 according to the present embodiment.

As shown in fig. 8 and 9, the difference between the present embodiment and the first embodiment is only the layout of the temperature control structure 400:

the temperature regulation structure 400 includes a cover 430, a first heating member 410, and an airflow driving member 450. The first heating element 410 and the airflow driving element 450 are electrically connected to the circuit board 110. The three covers 430 correspond to the three test equipment connection portions 310. The cover 430 is connected to the isolation board 130, and a receiving cavity is formed between the cover 430 and the isolation board 130, and when the memory stick 002 is connected to the test device connection portion 310, the memory stick 002 is located in the receiving cavity. The three covers 430 are also connected together at one end remote from the separator 130 by a connection plate 437. The connection plate 437 and the cover 430 may be integrally formed. The connection plate 437 and the separation plate 130 form therebetween a mounting chamber between the adjacent two covers 430. A first heating element 410 and an airflow driving element 450 are provided in the mounting chamber, and a heated airflow is provided to the receiving chamber through the first heating element 410 and the airflow driving element 450.

The cover 430 includes a first end plate 431 and a second end plate 433 opposite in the third direction Z, the first end plate 431 having an inlet portion 430a thereon, and the second end plate 433 having an outlet portion 430b thereon. The gas flow driving part 450 drives the gas to enter the accommodating chamber through the inlet part 430a along the inflow path and contact the memory stick 002 in the accommodating chamber. The gas may flow out of the accommodating chamber through the outlet 430b along the outflow path after contacting the memory stick 002.

The first heating member 410 is fixedly coupled with the partition plate 130. In the third direction Z, the first heating element 410 is located between the first end plate 431 and the testing device connection portion 310, and after the gas enters the accommodating cavity through the inlet portion 430a of the first end plate 431, the gas flows through the first heating element 410 and then flows through the memory bank 002. It can be appreciated that the first heating element 410 may also be disposed outside the accommodating cavity, where the first heating element 410 is disposed near the first end plate 431, and the gas enters the accommodating cavity through the inlet portion 430a on the first end plate 431 after being heated by the first heating element 410, and then flows through the memory bank 002. The inflow path is a path before the gas flows through the memory bank 002, and no matter the first heating element 410 is located in the accommodating cavity or outside the accommodating cavity, as long as the first heating element 410 is located in the inflow path, so that the gas is heated by the first heating element 410 before flowing through the memory bank 002.

The air flow driving member 450 is fixedly coupled with the partition plate 130. In the third direction Z, the airflow driving member 450 is located between the second end plate 433 and the testing device connecting portion 310, the air inlet end of the airflow driving member 450 faces the testing device connecting portion 310, and the air outlet end of the airflow driving member 450 faces the outside of the accommodating cavity. After the air flow driving member 450 discharges the air in the accommodating chamber out of the accommodating chamber through the outlet portion 430b of the second end plate 433, a negative pressure is formed in the accommodating chamber, so that the air outside the accommodating chamber enters the accommodating chamber through the inlet portion 430 a.

Fig. 10 shows a schematic structural diagram of another electronic component testing apparatus 001 according to the present embodiment, in which the cover 430 of the F region, the G region, and the H region is transparent.

As shown in fig. 10, it is understood that the air flow driver 450 may also be disposed at an end of the test equipment connection portion 310 remote from the second end plate 433. Specifically, the airflow driving member 450 is located in the accommodating cavity, and the first heating member 410 is away from an end of the testing device connection portion 310. The air inlet end of the air flow driving member 450 faces the first end plate 431, and the air outlet end of the air flow driving member 450 faces the first heating member 410. The gas inlet end of the gas flow driving part 450 sucks the gas from the inlet part 430a of the first end plate 431 and drives the gas to flow toward the first heating part 410. The gas flows through the first heating element 410, and flows through the memory bank 002 after being heated by the first heating element 410. When the gas flows through the memory bank 002, heat is exchanged with the memory bank 002.

Referring back to fig. 9, the cover 430 further includes a top plate 435, the top plate 435 being located at an end of the first end plate 431 and the second end plate 433 remote from the partition 130. A receiving cavity is formed between the top plate 435 and the partition plate 130, and when the memory stick 002 is disposed on the test equipment connection portion 310, the top plate 435 and the partition plate 130 are respectively located at two ends of the memory stick 002 in the first direction X. The top plate 435 restricts the gas in the accommodating chamber from flowing out of the accommodating chamber along the first direction X, so that the gas in the accommodating chamber flows along the third direction Z, thereby realizing uniform heating for each memory bank 002.

The electronic device test apparatus 001 can isolate the memory bank 002 from the processor 200 by the isolation board 130, and reduce the influence of the cooling of the processor 200 on the heating of the memory bank 002. After reducing the influence of the cooling of the processor 200 on the heating of the memory bank 002, the temperature of the memory bank 002 is more uniform, and the accuracy of the high-temperature stress test result of the memory bank 002 is improved. The gas heated by the first heating element 410 heats the memory bank 002, and then cools the overheated memory bank 002 by air flow exchange after heating the memory bank 002 with respect to the heat radiation, so that the uniformity of heating at each position of the memory bank 002 can be maintained, and the heating efficiency of the memory bank 002 can be improved.

Example III

Fig. 11 shows a cross-sectional view of an electronic component testing apparatus 001 provided in the present embodiment. Fig. 12 shows an assembly schematic diagram of an electronic component testing apparatus 001 according to the present embodiment.

As shown in fig. 11 and 12, such an electronic component testing apparatus 001 includes a control structure 100, a processor 200, a testing device connection structure 300, and a temperature regulation structure 400. The control structure 100 forms a base for mounting the processor 200, the test device connection structure 300, and the temperature regulation structure 400. The test equipment connection structure 300 is provided on the control structure 100 for connecting electronic components to be tested. A processor 200 is provided on the control structure 100 for processing the data stream in order to monitor the performance of the electronic components to be tested. The temperature control structure 400 is disposed on the control structure 100 for adjusting the temperature of the electronic component to be tested so as to test the performance of the electronic component to be tested at a set temperature. In the present application, the description that a first member is provided on a second member does not mean that the first member is located above the second member in a spatial direction, but means that the first member and the second member are connected. For convenience of description, the embodiment of the present application uses the electronic device to be tested as the memory bank 002. It can be understood that in other embodiments, the electronic components to be tested may also be electronic components having differences in performance at different temperatures, such as a liquid crystal display, a solid state disk, etc., and the electronic component testing device 001 of the present application is used to test the performance of the electronic components to be tested at the set temperature.

The control structure 100 includes a circuit board 110, the circuit board 110 being a flat plate substantially perpendicular to a first direction X, the circuit board 110 having a first face 110a and a second face 110b opposite along the first direction X. The processor 200 is fixedly disposed on the second surface 110b, and the processor 200 is electrically connected to the circuit board 110, so that an electrical signal can be transmitted between the processor 200 and the circuit board 110.

The test device connection structure 300 is disposed on the first surface 110a, and the test device connection structure extends along the first direction X and is away from the circuit board 110. At an end of the test device connection structure 300 remote from the circuit board 110, there is a test device connection port 300a. The test device connection port 300a is used for connecting the memory stick 002. The circuit board 110 isolates the test equipment connection port 300a from the processor 200, reducing heat transfer between the test equipment connection structure 300 and the processor 200.

The control structure 100 also includes an insulating layer 170. The heat insulating layer 170 is disposed on the first surface 110a. Since the testing device connection structure 300 protrudes from the first surface 110a, the testing device connection port 300a is far away from the first surface 110a, and when the thermal insulation layer 170 is disposed on the first surface 110a, the thermal insulation layer 170 is located between the testing device connection port 300a and the processor 200 in the first direction X.

The test equipment connection assembly 311 includes a connector 3111. The connector 3111 is disposed on the first face 110a of the circuit board 110. The connector 3111 is fixedly connected to the circuit board 110, and a test device connection port 300a is formed at an end of the connector 3111 remote from the circuit board 110. It will be appreciated that the testing device connection assembly 311 may further include an extension piece 3113, where the extension piece 3113 is connected to the connector 3111 and extends along the first direction X, and an end of the extension piece 3113 away from the circuit board 110 forms the testing device connection port 300a, and the distance between the testing device connection port 300a and the circuit board 110 may be further increased by the extension piece 3113, and the thermal insulation layer 170 having a larger size in the first direction X may be disposed on the first face 110a of the circuit board 110.

It is understood that the temperature control structure 400 in this embodiment may take any of the forms of embodiment one or embodiment two. The temperature control structure 400 is disposed on the circuit board 110 or the heating layer, so as to realize temperature control of the memory bank 002.

The electronic component testing apparatus 001 can isolate the memory bank 002 from the processor 200 by the isolation board 130, and reduce the mutual influence of the cooling of the processor 200 and the heating of the memory bank 002. The gas heated by the first heating element 410 heats the memory bank 002, and then cools the overheated memory bank 002 by air flow exchange after heating the memory bank 002 with respect to the heat radiation, so that the uniformity of heating at each position of the memory bank 002 can be maintained, and the heating efficiency of the memory bank 002 can be improved. By controlling the first end plate 431 and the second end plate 433 to incline to the third direction Z, the plurality of memory stripes 002 arranged in the second direction Y can circulate a substantially uniform air flow, so that each memory stripe 002 generates heat exchange with the air flow as uniformly as possible. The inlet portions 430a are distributed at the first end plate 431 and the second end plate 433, and the positions of the outlet portions 430b are disposed at the intermediate positions of the top plate 435, so that the temperature of the memory bank 002 at each position in the third direction Z is more uniform. The second heating member 470 is provided such that each memory stick 002 in the second direction Y maintains a uniform temperature when a plurality of memory sticks 002 are simultaneously tested.

In the electronic device test apparatus 001, the memory 002 and the processor 200 are disposed on opposite sides of the circuit board 110, and the memory 002 and the processor 200 are isolated by the circuit board 110, so that the influence of the cooling of the processor 200 on the heating of the memory 002 is reduced. After reducing the influence of the cooling of the processor 200 on the heating of the memory bank 002, the temperature of the memory bank 002 is more uniform, and the accuracy of the high-temperature stress test result of the memory bank 002 is improved. The thermal insulation layer 170 is located between the testing device connection port 300a and the processor 200, so as to further limit heat transfer between the location of the processor 200 and the location of the testing device connection port 300 a.

Example IV

Fig. 13 shows a schematic structural diagram of an electronic device 0001 provided in the present embodiment.

As shown in fig. 2 and 13, the present application also provides an electronic device 0001. Such an electronic apparatus 0001 includes an electronic apparatus body 003 and an electronic component testing device 001 in the first embodiment.

The electronic device body 003 is electrically connected to the circuit board 110 of the electronic device testing apparatus 001.

The electronic device 0001 may be a IT (Internet Technology) device, specifically, a service station. The electronic device body 003 includes a body structure of a service station such as a housing, a power supply, and the like, and the processor 200 of the electronic component testing apparatus 001 can be used to execute a computer program of the service station.

It is to be understood that the electronic component testing apparatus 001 in such an electronic device 0001 may be not the first embodiment, but the electronic component testing apparatus 001 in other embodiments of the present application may be employed.

While the electronic device 0001 may be other devices as well, such as a supercomputer or the like.

The foregoing is merely a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure, especially the combination of features in the embodiments, should be covered in the scope of the disclosure of the present application.

Claims

1. An electronic component testing apparatus, comprising:

a control structure including a circuit board perpendicular to the first direction;

the processor is arranged on one surface of the circuit board and is electrically connected with the circuit board;

the test equipment connecting structure is arranged on one surface of the circuit board, is electrically connected with the circuit board and is provided with a test equipment connecting port, and the test equipment connecting port is used for connecting an electronic element to be tested so as to realize the electrical connection between the electronic element to be tested and the circuit board;

the temperature regulation structure is used for controlling the temperature of the electronic element to be tested;

In the first direction, the processor is isolated from the test equipment connection port by the control structure.

2. The electronic component testing apparatus of claim 1, wherein the control structure further comprises a spacer;

in the first direction, the processor and the test equipment connection port are isolated by the isolation plate;

the isolation board is provided with a through hole, the test equipment connection port penetrates through the through hole and is located on one face of the isolation board, and the processor is located on the other face of the isolation board.

3. The electronic component testing apparatus according to claim 2, wherein the partition board includes a board body and a sealing member, the sealing member being connected to the board body or the test device connection structure, the sealing member sealing a gap between the test device connection structure and the board body.

4. The electronic component testing apparatus of claim 1, wherein the test device connection structure comprises a connector and an extension;

the connector is fixedly connected with the circuit board;

the extension piece is detachably connected with the connector, and one end, far away from the circuit board, of the extension piece forms the test equipment connector.

5. The electronic component testing apparatus of claim 1, wherein the circuit board has a first face and a second face opposite in the first direction, the processor is disposed on the first face, and the test device connection structure is disposed on the second face;

in the first direction, the processor and the test equipment connection port are isolated by the circuit board.

6. The electronic component testing apparatus of claim 5, wherein the control structure further comprises a thermal insulating layer coupled to the circuit board, the thermal insulating layer being positioned between the processor and the test device connection port in the first direction.

7. The electronic component testing apparatus of claim 1, further comprising a liquid cooling member coupled to the circuit board, one side of the liquid cooling member being attached to the processor.

8. The electronic component testing apparatus of claim 1, wherein the temperature regulating structure comprises a first heating member, a cover, and an air flow driving member;

an accommodating cavity is formed between the cover body and the control structure and is used for accommodating the electronic element to be tested, and the cover body is provided with an inlet part and an outlet part which are communicated with the accommodating cavity;

The air flow driving piece is connected with the control structure and is used for driving air flow to enter the accommodating cavity along an inflow path through the inlet part and flow through the electronic component to be tested;

the first heating element is connected with the control structure and is arranged in the inflow path.

9. The electronic component testing device of claim 8, wherein the circuit board comprises a pulse width modulation control unit, and the first heating element is electrically connected with the pulse width modulation control unit.

10. The electronic component testing device of claim 8, wherein the test equipment connection structure comprises a plurality of test equipment connection portions, each of the test equipment connection portions having at least one test equipment connection port, the plurality of test equipment connection portions being arranged along a second direction, the second direction being perpendicular to the first direction;

the cover bodies are in one-to-one correspondence with the test equipment connecting parts;

an installation cavity is formed between two adjacent cover bodies, and the first heating piece and the airflow driving piece are arranged in the installation cavity.

11. The electronic component testing apparatus according to claim 10, wherein the cover has a first end plate and a second end plate disposed opposite to each other in a third direction, the third direction being perpendicular to the first direction and the second direction;

The first end plate and the second end plate are both provided with the inlet portion;

the cover body further comprises a top plate, the top plate and the control structure are arranged at intervals in the first direction, and the accommodating cavity is formed between the top plate and the control structure;

the top plate is provided with the outlet portion.

12. The electronic component testing apparatus according to claim 11, wherein the first end plate is inclined to the third direction;

the sectional area of the accommodating cavity in the direction perpendicular to the second direction gradually increases from being close to the mounting cavity to being far away from the mounting cavity;

the inlet portion includes a plurality of ports spaced apart along the direction in which the first end plate extends.

13. The electronic component testing device of claim 11, wherein the outlet portion is located at an intermediate position of the top plate in the third direction.

14. The electronic component testing device of claim 8, wherein the test equipment connection structure comprises a plurality of test equipment connection portions, each of the test equipment connection portions having at least one test equipment connection port, the plurality of test equipment connection portions being arranged along a second direction, the second direction being perpendicular to the first direction;

The inlet part and the outlet part are positioned at the end part of the cover body in the third direction;

the first heating element and the air flow driving element are arranged at the end part of the test equipment connecting structure, which is located in the third direction, and the third direction is perpendicular to the first direction and the second direction.

15. The electronic component testing apparatus according to claim 14, wherein the first heating member is provided on one side of the test device connection structure and the air flow driving member is provided on the other side of the test device connection structure along the third direction;

the airflow driving piece is used for driving the air in the accommodating cavity to flow out of the accommodating cavity through the outlet part.

16. The electronic component testing apparatus according to claim 14, wherein the first heating member and the air flow driving member are provided on the same side of the test device connection structure in the third direction;

the airflow driving piece is used for driving the air outside the accommodating cavity to flow into the accommodating cavity through the inlet part.

17. The electronic component testing device of claim 8, wherein the first heating member comprises a plurality of fins, and wherein a flow gap is formed between two adjacent fins, the flow gap forming a portion of the inflow path.

18. The electronic component testing apparatus according to claim 1, wherein the temperature regulating structure further comprises a second heating member provided outside the test device connection structure in a second direction perpendicular to the first direction.

19. The electronic component testing device of claim 1, wherein the test equipment connection structure comprises a plurality of test equipment connection portions, each of the test equipment connection portions having at least one test equipment connection port, the plurality of test equipment connection portions being arranged along a second direction, the second direction being perpendicular to the first direction;

the temperature regulation and control structure further comprises a second heating piece, and the second heating piece is arranged on the outer side of the test equipment connecting part along the second direction.

20. The electronic component testing device of claim 19, wherein the circuit board comprises a pulse width modulation control unit, and the second heating element is electrically connected to the pulse width modulation control unit.

21. An electronic device comprising an electronic device body and the electronic component testing apparatus according to any one of claims 1 to 20;

The electronic equipment body is electrically connected with the circuit board.