CN117629440A - Temperature measuring device and measuring method - Google Patents

Temperature measuring device and measuring method Download PDF

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Publication number
CN117629440A
CN117629440A CN202311581615.3A CN202311581615A CN117629440A CN 117629440 A CN117629440 A CN 117629440A CN 202311581615 A CN202311581615 A CN 202311581615A CN 117629440 A CN117629440 A CN 117629440A
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China
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layer
measuring
pipeline
temperature
flexible
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Inventor
王瑞奇
陈朝旭
刘子平
庞杰
黄崇海
李勇
肖颀
柯汉兵
孙衢骎
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719th Research Institute Of China State Shipbuilding Corp
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719th Research Institute Of China State Shipbuilding Corp
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Abstract

The invention discloses a temperature measuring device and a measuring method, wherein the temperature measuring device comprises: each temperature measurement module comprises a flexible heat insulation structure layer, a high-heat-conductivity flexible supporting layer, a flexible electric heating layer and a measurement layer, wherein the high-heat-conductivity flexible supporting layer is arranged on one side of the flexible heat insulation structure layer in the thickness direction, and the flexible electric heating layer and the measurement layer are arranged in the high-heat-conductivity flexible supporting layer; the monitoring instrument is arranged at one end of the temperature measuring device along the length direction, the monitoring instrument is connected with the flexible electric heating layer in the temperature measuring module, and the monitoring instrument is connected with the measuring layer in the temperature measuring module. The invention greatly improves the measuring response speed, greatly improves the measuring precision relative to the patch type thermocouple outside the pipeline, and has simple and reliable measuring process. In addition, the invention adopts a non-invasive measurement mode, does not need to damage a solid pipeline, and has no interference and pollution.

Description

Temperature measuring device and measuring method
Technical Field
The invention relates to the technical field of temperature measurement, in particular to a temperature measurement device and a temperature measurement method.
Background
The temperature measurement is an important monitoring index for control and management in the modern industrial production process, and the accuracy and the rapidness of the temperature measurement are very beneficial to the actual industrial production measurement and other processes.
Temperature measurement of fluid in a pipeline is an extremely common practical scenario of temperature measurement, and the most common mode of temperature measurement of fluid in a pipeline is an invasive temperature measurement mode. For example, temperature measuring elements such as inserted thermocouples and thermal resistors are arranged in the pipeline to realize temperature measurement, and the temperature measuring device in the pipeline has the advantages of high measurement accuracy, quick response, small measurement error and the like, but fluid flow resistance can be introduced when the temperature measuring elements are arranged in an intervening manner, and the fluid can generate vibration interference on the temperature measuring elements, such as poor vibration control, so that the temperature measuring elements can be damaged for a long time. Meanwhile, for some industrial production scenes with high requirements on sanitation, such as food, pharmacy and the like, or scenes with high temperature and pressure of flowing media, the intervention type temperature measurement can damage the original sanitary conditions or damage the sealing boundary of a pipeline.
The existing non-intervention type temperature measurement, such as a patch type thermocouple or a thermal resistor, has larger deviation between the obtained temperature and the actual fluid temperature and has slower response speed.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to some extent. The object of the invention is to provide a temperature measuring device and a measuring method. The invention greatly improves the measuring response speed, greatly improves the measuring precision relative to the patch type thermocouple outside the pipeline, and has simple and reliable measuring process. In addition, the invention adopts a non-invasive measurement mode, does not need to damage a solid pipeline, and has no interference and pollution.
In a first aspect of the invention, the invention proposes a temperature measuring device. According to an embodiment of the present invention, the temperature measuring device includes:
the temperature measuring device comprises at least two temperature measuring modules, wherein the at least two temperature measuring modules are sequentially arranged along the length direction of the temperature measuring device, each temperature measuring module comprises a flexible heat insulation structural layer, a high heat conductivity flexible supporting layer, a flexible electric heating layer and a measuring layer, the high heat conductivity flexible supporting layer is arranged on one side of the flexible heat insulation structural layer along the thickness direction, the flexible electric heating layer and the measuring layer are both arranged in the high heat conductivity flexible supporting layer, and both extend along the length direction of the high heat conductivity flexible supporting layer, and the flexible electric heating layer is arranged between the measuring layer and the flexible heat insulation structural layer; the flexible heat insulation structure layers in the adjacent temperature measurement modules are directly connected, gaps are arranged between the flexible supporting layers with high heat conductivity in the adjacent temperature measurement modules, the flexible electric heating layers in the adjacent temperature measurement modules are connected through first power supply lines, and the measuring layers in the adjacent temperature measurement modules are connected through first signal lines;
the monitoring instrument is arranged at one end of the temperature measuring device in the length direction, the monitoring instrument is connected with the flexible electric heating layer in the temperature measuring module adjacent to the monitoring instrument through a second power supply line, and the monitoring instrument is connected with the measuring layer in the temperature measuring module adjacent to the monitoring instrument through a second signal line.
According to the temperature measuring device provided by the embodiment of the invention, the dimension of the three-dimensional heat transfer process is reduced to one-dimensional heat transfer process through surface heat transfer, the one-dimensional form structure is simple, the active heating mode is adopted, the environmental adaptability is good, and the whole measuring process is simple and reliable. Meanwhile, the flexible electric heating layer, the measuring layer and the monitoring instrument are matched, the temperature of the fluid in the pipeline is calculated according to the inverse thrust of dynamic process data based on the Fourier heat conduction law, the measuring response speed is greatly improved, and the measuring precision is also greatly improved compared with a patch thermocouple outside the pipeline. In addition, the temperature measuring device adopts a non-invasive measuring mode, does not need to damage a solid pipeline, and has no interference and no pollution.
In addition, the temperature measuring device according to the above embodiment of the present invention may have the following additional technical features:
in some embodiments of the invention, the flexible thermally insulating structural layer comprises a woven plastic layer and a thermally insulating material attached to the woven plastic layer.
In some embodiments of the invention, the high thermal conductivity flexible support layer has a thermal conductivity of 4000W/(m) 2 C) The method comprises the steps of carrying out a first treatment on the surface of the And/or, the high thermal conductivity flexible support layer comprises graphene.
In some embodiments of the invention, the flexible electrical heating layer comprises a plastic substrate layer and a conductive film layer with a heating circuit disposed on the plastic substrate layer.
In some embodiments of the present invention, the measuring layer includes a plastic film layer, a first thermocouple string and a second thermocouple string, the first thermocouple string and the second thermocouple string being disposed on both sides of the plastic film layer in a thickness direction, respectively; and/or a thermocouple is arranged on one side of the measuring layer far away from the flexible heat insulation structure layer and used for measuring the temperature of one side of the measuring layer far away from the flexible heat insulation structure layer.
In some embodiments of the invention, the high thermal conductivity flexible support layer has a thickness of no greater than 0.5mm; and/or the thickness of the flexible electrical heating layer is not greater than 0.25mm; and/or the thickness of the measuring layer is not more than 0.2mm.
In some embodiments of the invention, further comprising a fixed structure disposed on a side of the temperature measurement module proximate to the monitoring instrument; and/or the number of the temperature measuring modules is 4-15, preferably 8-12.
In a second aspect of the invention, the invention provides a method of measuring the temperature of a fluid in a pipe using the temperature measuring device described in the above embodiments. According to an embodiment of the invention, the method comprises:
(1) Surrounding a temperature measuring device on a pipeline along the circumferential direction of the pipeline, wherein the high-heat-conductivity flexible supporting layer is attached to the outer wall of the pipeline, and the pipeline is provided with fluid;
(2) According to the measurement requirement, the measurement and control instrument periodically supplies power to the flexible electric heating layer through the second power supply line and the first power supply line so as to provide heat flow for the temperature measurement device through the flexible electric heating layer;
(3) Collecting the voltage difference of the two sides of the measuring layer along the thickness direction and the temperature T of one side of the measuring layer close to the pipeline by the measuring and controlling instrument Measuring layer pipeline side
(4) According to the voltage difference of the two sides of the measuring layer along the thickness direction, calculating the current heat flow density q of the measuring layer 1
(5) According to the heat flow density q 1 And T Measuring layer pipeline side Calculating the temperature T of the fluid in the pipeline Fluid in pipeline
According to the method for measuring the temperature of the fluid in the pipeline, disclosed by the embodiment of the invention, the three-dimensional heat transfer process is reduced to be a one-dimensional heat transfer process through surface heat transfer, and the active heating mode is good in environmental adaptability, and the whole measuring process is simple and reliable. Meanwhile, the method is matched with the flexible electric heating layer, the measuring layer and the monitoring instrument, based on the Fourier heat conduction law, the temperature of the surface of the pipeline is calculated according to the data of the dynamic process by measuring the temperature of the surface of the pipeline under certain heat pulse, the measuring response speed is greatly improved, and the measuring precision is also greatly improved compared with a patch thermocouple outside the pipeline. In addition, the method adopts a non-invasive measurement mode, does not need to damage a solid pipeline, and has no interference and pollution.
In addition, the method according to the above embodiment of the present invention may further have the following additional technical features:
in some embodiments of the invention, step (4) comprises: calculating the temperature difference delta T of the measuring layer along the thickness direction according to the voltage difference of the measuring layer along the thickness direction 1 Then according to the formulaCalculating the heat flux density q of the current measuring layer 1 Wherein k is 1 Represent the thermal conductivity of the measuring layer, delta x 1 Representing the thickness of the measurement layer.
In some embodiments of the invention, step (5) comprises: if the heat transfer resistance of the high-heat-conductivity flexible supporting layer is neglected, the heat transfer process is that heat flow starts from the flexible electric heating layer, passes through the measuring layer, passes through the wall surface of the pipeline, is conducted to the fluid in the pipeline, and then passes through the heat flow density q of the measuring layer 1 Equal to the heat flux q through the wall of the pipeline 2 The method comprises the steps of carrying out a first treatment on the surface of the And the temperature of the inner wall of the pipeline is equal to the temperature T of the fluid in the pipeline Fluid in pipeline The heat flux density is thus transferred to the fluid through the pipe wall by:
then->Wherein R is Pipeline Represents the thermal resistance, k, of the wall surface of the pipeline Pipeline Represents the heat conductivity coefficient of the wall surface of the pipeline, delta x Pipeline Representing the thickness of the wall of the pipe;
and/or in the step (1), cleaning the surface of the pipeline in advance, then surrounding the temperature measuring device on the pipeline along the circumferential direction of the pipeline, and enabling one end of the temperature measuring device, which is far away from the measurement and control instrument, to pass through a fixing structure so as to be fixed.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic illustration of a temperature measurement device wrapped around a pipe according to an embodiment of the present invention;
FIG. 2 is an expanded schematic view of a temperature measurement device according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a method of calculating a heat flux density of a measurement layer according to an embodiment of the present invention.
The drawings are marked:
1-flexible thermal insulation structure layer, 2-high thermal conductivity flexible supporting layer, 3-flexible electric heating layer, 4-measuring layer, 4-1-plastic film layer, 4-2-first thermocouple string, 4-3-second thermocouple string, 5-first power supply line, 6-first signal line, 7-gap, 8-monitoring instrument, 9-second power supply line, 10-second signal line, 11-fixed structure, 12-pipeline, 13-fluid.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, terms such as "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly attached, detachably attached, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In one aspect of the present invention, the present invention provides a temperature measuring device, referring to fig. 1 and 2, the temperature measuring device includes: the temperature measuring device comprises at least two temperature measuring modules, wherein the at least two temperature measuring modules are sequentially arranged along the length direction (namely the X direction) of the temperature measuring device, each temperature measuring module comprises a flexible heat insulation structural layer 1, a high heat conductivity flexible supporting layer 2, a flexible electric heating layer 3 and a measuring layer 4, the high heat conductivity flexible supporting layer 2 is arranged on one side of the flexible heat insulation structural layer 1 along the thickness direction, the flexible electric heating layer 3 and the measuring layer 4 are arranged in the high heat conductivity flexible supporting layer 2, and extend along the length direction (namely the X direction) of the high heat conductivity flexible supporting layer 2, and the flexible electric heating layer 3 is arranged between the measuring layer 4 and the flexible heat insulation structural layer 1; the flexible heat insulation structure layers 1 in the adjacent temperature measurement modules are directly connected, a gap 7 is arranged between the high heat conductivity flexible supporting layers 2 in the adjacent temperature measurement modules, the flexible electric heating layers 3 in the adjacent temperature measurement modules are connected through a first power supply line 5, and the measuring layers 4 in the adjacent temperature measurement modules are connected through a first signal line 6; the monitoring instrument 8, the monitoring instrument 8 sets up in the one end of temperature measuring device along length direction, and the monitoring instrument 8 is connected with the flexible electric heating layer 3 in the temperature measurement module adjacent to the monitoring instrument 8 through second power supply line 9, and the monitoring instrument 8 is connected with the measuring layer 4 in the temperature measurement module adjacent to the monitoring instrument 8 through second signal line 10. Therefore, the temperature measuring device reduces the dimension of the three-dimensional heat transfer process into the one-dimensional heat transfer process through the surface heat transfer, has a one-dimensional form structure, is in an active heating mode, has good environmental adaptability, and has simple and reliable whole measuring process. Meanwhile, the flexible electric heating layer 3, the measuring layer 4 and the monitoring instrument 8 are matched, the temperature of the fluid in the pipe is calculated according to the data back-pushing of the dynamic process based on the Fourier heat conduction law, the measuring response speed is greatly improved, and the measuring precision is also greatly improved compared with a patch thermocouple outside the pipe. In addition, the temperature measuring device adopts a non-invasive measuring mode, does not need to damage a solid pipeline, and has no interference and no pollution.
The principle that the temperature measuring device provided by the invention can realize the beneficial effects is described in detail as follows:
in the related art, the non-invasive temperature measurement, such as a patch thermocouple or a thermal resistor, has larger deviation between the obtained temperature and the actual fluid temperature, and has slower response speed.
In order to solve the technical problems, the invention provides a novel temperature measuring device, and referring to fig. 1 and 2, the temperature measuring device comprises at least two temperature measuring modules, the at least two temperature measuring modules are sequentially arranged along the length direction of the temperature measuring device, and each temperature measuring module comprises a flexible heat insulation structural layer 1, a high heat conductivity flexible supporting layer 2, a flexible electric heating layer 3 and a measuring layer 4. The flexible heat insulation structure layer 1 can be bent to be tightly attached to the curved wall surface of the pipeline to be measured, has higher strength and toughness, and is a main stress structure of the temperature measuring device; and the flexible heat insulation structure layer 1 has good heat insulation performance, and can avoid heat generated by the flexible electric heating layer 3 from being dissipated from one side of the flexible heat insulation structure layer 1. The high thermal conductivity flexible support layer 2 is a high thermal conductivity flexible support layer, and the thermal resistance is very small and can be almost ignored. The flexible supporting layer 2 with high thermal conductivity is provided with the flexible electric heating layer 3 and the measuring layer 4, and the measuring and controlling instrument periodically supplies power to the flexible electric heating layer 3 through the second power supply line 9 and the first power supply line 5 according to the measurement requirement so as to provide heat flow with known size for the temperature measuring device through the flexible electric heating layer 3. The measuring layer 4 comprises a plastic film layer 4-1 with known thermal resistance, a first thermocouple string 4-2 and a second thermocouple string 4-3, wherein the first thermocouple string 4-2 and the second thermocouple string 4-3 are respectively arranged at two sides of the plastic film layer 4-1 along the thickness direction, and the thermocouple strings can provide micro-voltage, so that the voltage difference (the principle of which is shown in figure 3) at two sides of the measuring layer 4 along the thickness direction and the temperature T at one side of the measuring layer 4 close to a pipeline can be acquired through a measurement and control instrument Measuring layer 4 pipe side The temperature difference delta T of the two sides of the measuring layer 4 along the thickness direction can be obtained by back-pushing through the relation of the thermocouple voltage and the temperature 1 Then according to the formulaThe heat flux density q of the current measuring layer 4 can be calculated 1 Wherein k is 1 Represents the thermal conductivity of the measuring layer 4, delta x 1 Indicating the thickness of the measurement layer 4. Neglecting the heat transfer resistance of the high heat conductivity flexible supporting layer 2, the heat transfer processThe heat flow starts from the flexible electric heating layer 3, passes through the measuring layer 4, passes through the wall surface of the pipeline and is transmitted to the fluid in the pipeline, and then passes through the heat flow density q of the measuring layer 4 1 Equal to the heat flux density q across the wall of the pipe 2 The method comprises the steps of carrying out a first treatment on the surface of the And the temperature of the inner wall of the pipeline is equal to the temperature T of the fluid in the pipeline Fluid in pipeline The heat flux density is thus transferred to the fluid through the pipe wall by: />ThenThereby calculating the temperature of the fluid in the pipeline, wherein R Pipeline Represents the thermal resistance, k, of the wall surface of the pipeline Pipeline Represent the heat conductivity coefficient of the wall surface of the pipeline, delta x Pipeline Indicating the thickness of the pipe wall. Therefore, the temperature measuring device reduces the dimension of the three-dimensional heat transfer process into the one-dimensional heat transfer process through the surface heat transfer, has a one-dimensional form structure, is in an active heating mode, has good environmental adaptability, and has simple and reliable whole measuring process. Meanwhile, the flexible electric heating layer 3, the measuring layer 4 and the monitoring instrument 8 are matched, the temperature of the fluid in the pipe is calculated according to the data back-pushing of the dynamic process based on the Fourier heat conduction law, the measuring response speed is greatly improved, and the measuring precision is also greatly improved compared with a patch thermocouple outside the pipe. In addition, the temperature measuring device adopts a non-invasive measuring mode, does not need to damage a solid pipeline, and has no interference and no pollution.
The X direction is the longitudinal direction of the temperature measuring device, and the Y direction is the thickness direction of the temperature measuring device.
According to some embodiments of the invention, the flexible thermal insulation structure layer 1 comprises a plastic braid and a thermal insulation material, the thermal insulation material being attached to the plastic braid. The plastic braid is a main body structure of the flexible thermal insulation structure layer 1, and the material thereof is not particularly limited as long as it has high strength and toughness, and can make the flexible thermal insulation structure layer 1 a main stress structure of the temperature measuring device. The heat insulating material is not particularly limited, and may be, for example, an insulating aerogel having extremely low thermal conductivity and being approximately heat-insulating, so that heat generated in the flexible electric heating layer 3 can be prevented from being dissipated from the side of the flexible heat insulating structure layer 1.
In the embodiment of the present invention, the high thermal conductivity flexible support layer 2 is a high thermal conductivity flexible support layer, and the thermal resistance thereof is small and almost negligible. According to still other embodiments of the present invention, the thermal conductivity of the high thermal conductivity flexible support layer 2 may be 4000W/(m) 2 C) A. The invention relates to a method for producing a fibre-reinforced plastic composite As some specific examples, the high thermal conductivity flexible support layer 2 comprises graphene, which may have a thermal conductivity of up to 4000W/(m) 2 C)。
According to further embodiments of the invention, the flexible electric heating layer 3 comprises a plastic substrate layer and an electrically conductive film layer with a heating circuit, which is arranged on the plastic substrate layer, whereby the measuring and control instrument periodically supplies the flexible electric heating layer 3 with heat flow of known magnitude via the second power supply line 9 and the first power supply line 5 according to measurement needs, in order to supply the temperature measuring device with heat flow via the flexible electric heating layer 3. As some specific examples, the material of the plastic base layer may be polyimide PI.
According to further embodiments of the present invention, the measuring layer 4 comprises a plastic film layer 4-1, a first thermocouple string 4-2 and a second thermocouple string 4-3, wherein the first thermocouple string 4-2 and the second thermocouple string 4-3 are respectively arranged at two sides of the plastic film layer 4-1 along the thickness direction, and the thermocouple strings can provide micro-voltages, so that the voltage difference at two sides of the measuring layer 4 along the thickness direction can be collected through a measurement and control instrument, and the principle is shown in fig. 3. And/or the side of the measuring layer 4 remote from the flexible heat insulating structure layer 1 is provided with a thermocouple for measuring the temperature of the side of the measuring layer 4 remote from the flexible heat insulating structure layer 1 (i.e. the temperature T of the side of the measuring layer 4 close to the pipeline Measuring layer 4 pipe side ). As some specific examples, the material of the plastic film layer 4-1 may be polyimide PI.
Since the flexible electric heating layer 3 and the measuring layer 4 are buried in the high thermal conductivity flexible supporting layer 2, the thickness of the flexible electric heating layer 3 and the measuring layer 4 is smaller than the thickness of the high thermal conductivity flexible supporting layer 2. According to some embodiments of the invention, the thickness of the high thermal conductivity flexible support layer 2 is not more than 0.5mm; and/or the thickness of the flexible electrical heating layer 3 is not greater than 0.25mm; and/or the thickness of the measuring layer 4 is not more than 0.2mm.
In the embodiment of the present invention, referring to fig. 1 and 2, the temperature measuring device further includes a fixing structure 11 (such as a waistband head, a schoolbag strap buckle, etc.), the fixing structure 11 is disposed on one side of the temperature measuring module near the monitoring instrument 8, one end of the flexible thermal insulation structure layer 1 is fixed on the buckle, the other end can be inserted into the buckle, the buckle and the flexible thermal insulation layer have self-locking performance, and a release mechanism is disposed on a side of the buckle, and the temperature measuring device can be released from the buckle structure by manually triggering the release mechanism.
In the embodiment of the invention, the temperature measuring device comprises a plurality of temperature measuring modules, the temperature measuring modules are sequentially arranged along the length direction of the temperature measuring device, and the gaps 7 are arranged between the high-heat-conductivity flexible supporting layers 2 in the adjacent temperature measuring modules, so that the temperature measuring device can be conveniently and tightly attached to the wall surface of the pipeline when measuring the temperature of fluid in the pipeline. The number of temperature measurement modules is not particularly limited, and as some specific examples, the number of temperature measurement modules may be 4 to 15, preferably 8 to 12.
In a second aspect of the present invention, the present invention provides a method for measuring the temperature of a fluid in a pipe using the temperature measuring device described in the above embodiments. According to an embodiment of the present invention, the method includes:
s100: surrounding the temperature measuring device on the pipeline along the circumferential direction of the pipeline
In this step, the temperature measuring device is wound around the pipe 12 in the circumferential direction of the pipe 12, and the high thermal conductivity flexible support layer 2 is attached to the outer wall of the pipe with the fluid 13 therein.
According to some embodiments of the present invention, the surface of the pipe may be cleaned in advance, and then the temperature measuring device is looped around the pipe 12 in the circumferential direction of the pipe, and the end of the temperature measuring device remote from the measurement and control instrument is passed through the fixing structure so as to be fixed.
S200: providing heat flow to a temperature measuring device by means of a flexible electrical heating layer
In this step, the measurement and control instrument periodically supplies power to the flexible electric heating layer 3 via the second power supply line 9 and the first power supply line 5 according to the measurement needs, so as to provide heat flow to the temperature measuring device via the flexible electric heating layer 3.
S300: collecting the voltage difference of the two sides of the measuring layer along the thickness direction and the temperature of one side of the measuring layer close to the pipeline
In this step, referring to fig. 3, since the thermocouple string of the measurement layer 4 can provide a micro voltage, the voltage difference of both sides of the measurement layer 4 in the thickness direction can be collected by the measurement and control instrument. Because the thermocouple is arranged on the side of the measuring layer 4 far away from the flexible heat insulation structure layer 1, the temperature T of the measuring layer 4 on the side close to the pipeline can be acquired through a measurement and control instrument Measuring layer 4 pipe side
S400: according to the voltage difference of the two sides of the measuring layer along the thickness direction, calculating the heat flux density of the current measuring layer
In this step, the heat flux density q of the current measurement layer 4 is calculated from the voltage difference across the measurement layer 4 in the thickness direction 1 . Specifically:
according to the voltage difference of the two sides of the measuring layer 4 along the thickness direction, calculating the temperature difference delta T of the two sides of the measuring layer 4 along the thickness direction 1 Then according to the formulaThermal conductivity k at the measurement layer 4 1 Measuring the temperature difference delta T of the layer 4 on both sides in the thickness direction 1 Measuring the thickness delta x of the layer 4 1 On the premise of known, the heat flux density q of the current measuring layer 4 can be calculated 1 Wherein k is 1 Represents the thermal conductivity of the measuring layer 4, delta x 1 Indicating the thickness of the measurement layer 4.
Measurement principle: from the law of thermal conduction it is known that: heat flux density across an infinite plate = plate material thermal conductivity x plate temperature difference across plate/(plate thickness = plate temperature difference/(plate thermal resistance).
S500: according to heat flux q 1 And T Measuring layer 4 pipe side Calculating the temperature T of the fluid in the pipeline Fluid in pipeline
Specifically, assuming that the heat transfer resistance of the flexible supporting layer 2 with high heat conductivity is neglected, the heat transfer process can be simplified, and the heat flow starts from the flexible electric heating layer 3, passes through the measuring layer 4, passes through the wall surface of the pipeline, and is conducted to the fluid in the pipeline, and then passes through the heat flow density q of the measuring layer 4 1 Equal to the heat flux density q across the wall of the pipe 2 The method comprises the steps of carrying out a first treatment on the surface of the And the temperature of the inner wall of the pipeline is equal to the temperature T of the fluid in the pipeline Fluid in pipeline The process of heat flux density transfer to the fluid through the pipe wall can be simplified as:
then->Thereby at T Measuring layer 4 pipe side Heat flux q 2 The thickness delta x of the wall surface of the pipeline Pipeline Coefficient of thermal conductivity k of pipe wall Pipeline Under known conditions, the temperature T of the fluid in the pipeline can be calculated Fluid in pipeline Wherein R is Pipeline Represents the thermal resistance, k, of the wall surface of the pipeline Pipeline Represent the heat conductivity coefficient of the wall surface of the pipeline, delta x Pipeline Indicating the thickness of the pipe wall.
According to the method for measuring the temperature of the fluid in the pipeline, disclosed by the embodiment of the invention, the three-dimensional heat transfer process is reduced to be a one-dimensional heat transfer process through surface heat transfer, and the active heating mode is good in environmental adaptability, and the whole measuring process is simple and reliable. Meanwhile, the method is matched with the flexible electric heating layer 3, the measuring layer 4 and the monitoring instrument 8, and based on the Fourier heat conduction law, the temperature of the surface of the pipeline is calculated according to the data of the dynamic process by measuring the temperature of the surface of the pipeline under certain heat pulse, so that the measuring response speed is greatly improved, and the measuring precision is also greatly improved compared with a patch thermocouple outside the pipeline. In addition, the method adopts a non-invasive measurement mode, does not need to damage a solid pipeline, and has no interference and pollution.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.

Claims (10)

1. A temperature measurement device, comprising:
the temperature measuring device comprises at least two temperature measuring modules, wherein the at least two temperature measuring modules are sequentially arranged along the length direction of the temperature measuring device, each temperature measuring module comprises a flexible heat insulation structural layer, a high heat conductivity flexible supporting layer, a flexible electric heating layer and a measuring layer, the high heat conductivity flexible supporting layer is arranged on one side of the flexible heat insulation structural layer along the thickness direction, the flexible electric heating layer and the measuring layer are both arranged in the high heat conductivity flexible supporting layer, and both extend along the length direction of the high heat conductivity flexible supporting layer, and the flexible electric heating layer is arranged between the measuring layer and the flexible heat insulation structural layer; the flexible heat insulation structure layers in the adjacent temperature measurement modules are directly connected, gaps are arranged between the flexible supporting layers with high heat conductivity in the adjacent temperature measurement modules, the flexible electric heating layers in the adjacent temperature measurement modules are connected through first power supply lines, and the measuring layers in the adjacent temperature measurement modules are connected through first signal lines;
the monitoring instrument is arranged at one end of the temperature measuring device in the length direction, the monitoring instrument is connected with the flexible electric heating layer in the temperature measuring module adjacent to the monitoring instrument through a second power supply line, and the monitoring instrument is connected with the measuring layer in the temperature measuring module adjacent to the monitoring instrument through a second signal line.
2. The temperature measurement device of claim 1, wherein the flexible thermally insulating structural layer comprises a woven plastic layer and a thermally insulating material attached to the woven plastic layer.
3. The temperature measurement device of claim 1, wherein the high thermal conductivity flexible support layer has a thermal conductivity of 4000W/(m) 2 C);
And/or, the high thermal conductivity flexible support layer comprises graphene.
4. The temperature measurement device of claim 1, wherein the flexible electrical heating layer comprises a plastic substrate layer and a conductive film layer having a heating circuit disposed on the plastic substrate layer.
5. The temperature measurement device according to claim 1, wherein the measurement layer includes a plastic film layer, a first thermocouple string and a second thermocouple string, the first thermocouple string and the second thermocouple string being provided on both sides of the plastic film layer in a thickness direction, respectively;
and/or a thermocouple is arranged on one side of the measuring layer far away from the flexible heat insulation structure layer and used for measuring the temperature of one side of the measuring layer far away from the flexible heat insulation structure layer.
6. The temperature measurement device of any one of claims 1-5, wherein the high thermal conductivity flexible support layer has a thickness of no more than 0.5mm;
and/or the thickness of the flexible electrical heating layer is not greater than 0.25mm;
and/or the thickness of the measuring layer is not more than 0.2mm.
7. The temperature measurement device of any one of claims 1-5, further comprising a fixed structure disposed on a side of the temperature measurement module proximate the monitoring instrument;
and/or the number of the temperature measuring modules is 4-15, preferably 8-12.
8. A method of measuring the temperature of a fluid in a pipe using the temperature measuring device of any one of claims 1-7, comprising:
(1) Surrounding a temperature measuring device on a pipeline along the circumferential direction of the pipeline, wherein the high-heat-conductivity flexible supporting layer is attached to the outer wall of the pipeline, and the pipeline is provided with fluid;
(2) According to the measurement requirement, the measurement and control instrument periodically supplies power to the flexible electric heating layer through the second power supply line and the first power supply line so as to provide heat flow for the temperature measurement device through the flexible electric heating layer;
(3) Collecting the voltage difference of the two sides of the measuring layer along the thickness direction and the temperature T of one side of the measuring layer close to the pipeline by the measuring and controlling instrument Measuring layer pipeline side
(4) According to the voltage difference of the two sides of the measuring layer along the thickness direction, calculating the current heat flow density q of the measuring layer 1
(5) According to the heat flow density q 1 And T Measuring layer pipeline side Calculating the temperature T of the fluid in the pipeline Fluid in pipeline
9. The method of claim 8, wherein step (4) comprises:
calculating the temperature difference delta T of the measuring layer along the thickness direction according to the voltage difference of the measuring layer along the thickness direction 1 Then according to the formulaCalculating the heat flux density q of the current measuring layer 1 Wherein k is 1 Represent the thermal conductivity of the measuring layer, delta x 1 Representing the thickness of the measurement layer.
10. The method of claim 8, wherein step (5) comprises:
if the heat transfer resistance of the high-heat-conductivity flexible supporting layer is neglected, the heat transfer process is that heat flow starts from the flexible electric heating layer, passes through the measuring layer, passes through the wall surface of the pipeline, is conducted to the fluid in the pipeline, and then passes through the heat flow density q of the measuring layer 1 Equal to the heat flux q through the wall of the pipeline 2 The method comprises the steps of carrying out a first treatment on the surface of the And the temperature of the inner wall of the pipeline is equal to the temperature T of the fluid in the pipeline Fluid in pipeline The heat flux density is thus transferred to the fluid through the pipe wall by:
then->Wherein R is Pipeline Represents the thermal resistance, k, of the wall surface of the pipeline Pipeline Represents the heat conductivity coefficient of the wall surface of the pipeline, delta x Pipeline Representing the thickness of the wall of the pipe;
and/or in the step (1), cleaning the surface of the pipeline in advance, then surrounding the temperature measuring device on the pipeline along the circumferential direction of the pipeline, and enabling one end of the temperature measuring device, which is far away from the measurement and control instrument, to pass through a fixing structure so as to be fixed.
CN202311581615.3A 2023-11-23 2023-11-23 Temperature measuring device and measuring method Pending CN117629440A (en)

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Application Number Priority Date Filing Date Title
CN202311581615.3A CN117629440A (en) 2023-11-23 2023-11-23 Temperature measuring device and measuring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311581615.3A CN117629440A (en) 2023-11-23 2023-11-23 Temperature measuring device and measuring method

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Publication Number Publication Date
CN117629440A true CN117629440A (en) 2024-03-01

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