CN117626204A - Magnet assembly adjusting jig of semiconductor coating equipment - Google Patents
Magnet assembly adjusting jig of semiconductor coating equipment Download PDFInfo
- Publication number
- CN117626204A CN117626204A CN202311701114.4A CN202311701114A CN117626204A CN 117626204 A CN117626204 A CN 117626204A CN 202311701114 A CN202311701114 A CN 202311701114A CN 117626204 A CN117626204 A CN 117626204A
- Authority
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- China
- Prior art keywords
- worm
- cover plate
- lower cover
- magnet
- semiconductor coating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000000576 coating method Methods 0.000 title claims abstract description 26
- 239000011248 coating agent Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 description 10
- 230000033001 locomotion Effects 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a magnet assembly adjusting jig of semiconductor coating equipment, which comprises a counterweight assembly adjusting module, a worm gear module and a magnet position adjusting module; the semiconductor coating equipment comprises an upper cover plate and a lower cover plate, the magnet is positioned on the lower cover plate, the counterweight assembly adjusting module comprises a counterweight block, a first slide bar and a first worm, and the counterweight block slides on the first slide bar through the first worm; the magnet position adjusting module comprises a connecting block and a second worm, and the connecting block is in threaded fit with the second worm; the worm gear module drives the first worm and the second worm to rotate so as to respectively adjust the positions of the balancing weight and the lower cover plate; the connecting block is positioned on the upper cover plate and penetrates through the lower cover plate to be connected with the second worm, and the first worm and the second worm are respectively provided with a first supporting frame.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a magnet assembly adjusting jig of semiconductor coating equipment.
Background
Magnet assemblies on Physical Vapor Deposition (PVD) equipment are important modules for forming sputtering magnetic fields and controlling the sputtering direction of target particles. In the magnetron sputtering coating process, the magnet assembly is often disposed on the back of the target. The magnet is generally made of neodymium iron boron magnets with high coercive force, and the magnetic strength of the surface can reach 5000Gs.
Under different technological conditions, the magnet inside needs to be finely adjusted so as to obtain different magnetic fields, sometimes multiple times of adjustment are needed, the original magnet is in a closed space, each time the magnet is detached, the labor and the effort are wasted, and a scheme which can finely adjust the magnet without disassembling coating equipment is designed according to the requirements of the aspect.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a magnet assembly adjusting jig of semiconductor coating equipment, which aims at solving the problem that the magnetic field is difficult to adjust according to different process conditions in the prior art, and designs a jig convenient for adjusting the position of a magnet.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a magnet assembly adjusting jig of semiconductor coating equipment comprises a counterweight assembly adjusting module, a worm gear module and a magnet position adjusting module; the semiconductor coating equipment comprises an upper cover plate and a lower cover plate, the magnet is positioned on the lower cover plate, the counterweight assembly adjusting module comprises a counterweight block, a first slide bar and a first worm, and the counterweight block slides on the first slide bar through the first worm; the magnet position adjusting module comprises a connecting block and a second worm, and the connecting block is in threaded fit with the second worm; the worm gear module drives the first worm and the second worm to rotate so as to respectively adjust the positions of the balancing weight and the lower cover plate; the connecting block is located on the upper cover plate and penetrates through the lower cover plate to be connected with the second worm, and a gap is reserved between the connecting block and the lower cover plate.
As a further scheme of the invention, the magnet position adjusting module further comprises a second sliding rod, the connecting block comprises a first connecting block and a second connecting block, and the second sliding rod is positioned on the lower cover plate and is in sliding connection with the first connecting block.
As a further scheme of the invention, two ends of the second connecting block are respectively provided with a first connecting block, and two ends of the balancing weight are respectively provided with a first sliding rod.
As a further scheme of the invention, the first worm and the second worm are respectively provided with a first supporting frame.
As a further scheme of the invention, the worm gear module comprises a pull rod, and a first worm gear and a second worm gear which are arranged on the pull rod at intervals, wherein the first worm gear is matched with the first worm, and the second worm gear is matched with the second worm.
As a further scheme of the invention, the lower end of the pull rod is movably connected with a fixing device, and the upper end of the pull rod is movably connected with a rotating structure.
As a further scheme of the invention, the upper end of the pull rod is provided with a clamping structure, and the rotating structure is clamped with the clamping structure.
As a further scheme of the invention, the lower end of the fixing device is provided with a locking device which is locked with the lower end of the pull rod.
As a further scheme of the invention, two ends of the second sliding rod are respectively provided with a second supporting frame.
As a further scheme of the invention, a plurality of magnets are arranged around the lower cover plate, the magnets are provided with groove-shaped structures with two open ends, and the two open ends are distributed along the circumferential direction of the lower cover plate.
The invention has the following beneficial effects:
the invention solves the problems that the position of the counterweight component is unsuitable and can have great influence on the stability of the magnet, and different magnetic field processes can be generated due to different magnet positions, in the prior art, equipment is required to be removed, the counterweight block is reinstalled and the magnet position is regulated, so that the working strength is greatly increased, and a large amount of time is wasted. At present, 4 kinds of magnets can be generally configured according to different machines, each magnet needs to be debugged, and the time is quite precious in the semiconductor industry;
the invention relates to a balancing weight adjusting mode: the balancing weight is driven to slide on the first sliding rod through the cooperation of the first worm wheel and the first worm, so that the balancing weight is adjusted.
The cover plate of the semiconductor coating equipment is innovatively divided into the upper cover plate and the lower cover plate, and the magnet position adjusting module is combined with the upper cover plate and the lower cover plate through the innovative design, so that the magnet position can be adjusted conveniently and quickly, and trouble and labor are saved.
The position of the magnet is adjusted by adjusting the relative positions of the upper cover plate and the lower cover plate, so that different magnetic fields are obtained in the coating equipment, and the position of the lower cover plate is mainly adjusted. The worm gear and worm self-locking function is utilized, the conical gear can be utilized to rotate the screw at right angles, and the effect of the invention can be achieved through the cooperation of the sliding block and the sliding rod and the integrated design.
In order to more clearly illustrate the structural features and efficacy of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic view of a part of a magnet assembly adjusting jig of a semiconductor coating apparatus according to the present invention.
Fig. 2 is a schematic partial structure of the weight assembly adjusting module according to the present invention.
Fig. 3 is a partially exploded view of a magnet assembly adjusting jig of a semiconductor coating apparatus according to the present invention.
Fig. 4 is a schematic structural view of the upper and lower cover plates according to the present invention.
Fig. 5 and fig. 6 are schematic views of different directions of a semiconductor film plating apparatus according to the present invention.
Fig. 7-9 are partial enlarged schematic views of fig. 1, 2, and 3, respectively.
Description of the embodiments
The invention will be further described in the following clear and complete description with reference to the figures and the associated knowledge, it being evident that the described applications are only some, but not all embodiments of the invention.
In the prior art, if the magnet assembly of the semiconductor coating equipment is regulated, different positions are required to be regulated according to different processes, and the regulation can not be necessarily regulated to the required position once, so that the regulation difficulty is increased; and after changing different magnets, the device needs to be disassembled for adjustment, so that a great deal of time and labor are wasted.
According to the problems, the invention provides a magnet assembly adjusting jig of semiconductor coating equipment, which comprises a counterweight assembly adjusting module, a worm gear module and a magnet position adjusting module; the counterweight component adjusting module comprises a counterweight 1, a first slide bar 2 and a first worm 3, and referring to the figure 1, the counterweight 1 slides on the first slide bar 2 through the first worm 3, so that the position of the counterweight 1 is adjusted; the magnet position adjusting module comprises a connecting block and a second worm 4, and the connecting block is in threaded fit with the second worm 4; the worm gear module drives the first worm 3 and the second worm 4 to rotate so as to respectively adjust the positions of the balancing weight 1 and the lower cover plate 8; the semiconductor film plating equipment comprises an upper cover plate 7 and a lower cover plate 8, wherein a connecting block is positioned on the upper cover plate 7 and penetrates through the lower cover plate 8 to be connected with the second worm 4, a gap is formed between the connecting block and the lower cover plate 8, in particular a gap is formed between the connecting block and two sides or the periphery of the opening end of the lower cover plate 8, so that the position of the lower cover plate can be adjusted conveniently; referring to fig. 1, the connecting block is first fixed with the upper cover 7, then passes through the lower cover 8 and is connected with the second worm 4, when the second worm 4 is rotated, the second worm 4 pushes the lower cover to move through a supporting structure on one side, so that the adjustment of the position of the magnet is realized, and the adjustment is fine adjustment.
Referring to fig. 1, 2 and 4, the working process of the present invention is as follows: under the condition that a magnetic field needs to be changed, in actual operation, firstly, the position of the balancing weight 1 is adjusted, specifically, the worm gear module drives the first worm 3 to rotate, so that the balancing weight 1 slides on the first slide bar 2, and can slide back and forth according to different rotation directions, and therefore the position adjustment of the balancing weight 1 is completed; then adjust the position of magnet, specifically worm wheel module drives second worm 4 and rotates, promotes the motion of apron 8 down, in this embodiment, the connecting block is fixed on upper cover plate 7 and passes apron 8 down and be connected with second worm 4 down, owing to have the clearance between connecting block and the apron 8 down to can promote the motion of apron 8 down, realize the slip between upper cover plate 7 and the apron 8 down, thereby realize the regulation to the magnet position, it is to be said here that there is bearing structure second worm 4 one side, promote the motion of apron 8 down through bearing structure, also can promote through other modes simultaneously. The invention can realize the portable adjustment of the position of the magnet and the position of the balancing weight in the condition of needing different magnetic field processes, does not need to disassemble equipment for adjustment, and saves a great amount of time.
Referring to fig. 1, the magnet position adjusting module further includes a second slide bar 9, the connection block includes a first connection block 10 and a second connection block 11, the second slide bar 9 is located on the lower cover plate 8 and slidably connected with the first connection block 10, and the second connection block 11 is connected with the second worm 4. The embodiment is a preferred embodiment of the invention, the adjusting process is more stable and smooth, the lower cover plate 8 is pushed to move by the second worm 4 in a specific process, and the first connecting block 10 is driven to slide on the second slide rod 9 at the same time, and the design of the structure mainly has two advantages: the invention is characterized in that the upper cover plate 7 and the lower cover plate 8 can be stably connected, and the position adjustment between the upper cover plate 7 and the lower cover plate 8 can be smoother, so that the magnet position adjustment is more portable, the design of the upper cover plate 7 and the lower cover plate 8 is innovatively introduced, the portable adjustment can be realized, a plurality of magnets 5 are further preferably arranged around the lower cover plate 8, and the magnets are provided with groove-shaped structures 6 with two open ends.
The two ends of the second connecting block 11 are respectively provided with a first connecting block 10, and the two ends of the balancing weight 1 are respectively provided with a first sliding rod 2, so that the balancing weight 1 can conveniently slide on the first sliding rod 2 under the action of the first worm 3.
Referring to fig. 3, the first worm 3 and the second worm 4 are provided with a first supporting frame 13, respectively, and in some embodiments the first supporting frame 13 is provided with a bearing structure for rotation and support of the first worm 3 and the second worm 4, and providing a supporting pushing force in case of rotation of the second worm 4; other support structures are also possible, as long as rotation and support are satisfied. More specifically the first worm 3, the second worm 4 can be rotated with less resistance by means of the bearing arrangement, while the movement of the lower cover plate 8 is pushed by the first support frame 13 during the position adjustment of the magnets.
In the present invention, referring to fig. 2 and 3, the worm wheel module includes a pull rod 14, and a first worm wheel 15 and a second worm wheel 16 disposed on the pull rod 14 at intervals, wherein the first worm wheel 15 is engaged with the first worm 3, and the second worm wheel 16 is engaged with the second worm 4. The invention realizes the position adjustment by utilizing the self-locking function of the worm and the gear.
In the invention, the lower end of the pull rod 14 is movably connected with a fixing device 17, a three-dimensional structure with two sides and an upper end opening can be used, the upper end is movably connected with a rotating structure 18, and further preferably, the upper end of the pull rod 14 is also provided with a clamping structure 19, and the rotating structure 18 is clamped with the clamping structure 19. Referring to fig. 3, the rotating structure 18 is placed in the engaging structure 19 when the adjustment is performed, and the limiting structures on both sides of the rotating structure 18 are engaged with the engaging grooves of the engaging structure 19.
Further preferably, the lower end of the fixing device 17 is provided with a locking device locked with the lower end of the pull rod, in some embodiments, the locking device is implemented by locking with a screw, the lower end of the pull rod is provided with a threaded hole, in the case of an initial state, the threaded hole at the lower end of the pull rod is locked with the screw outside the lower end of the fixing device 17, if adjustment is needed, the screw is unscrewed first, the rotating structure 18 is put into the clamping structure 19, as described in the above, the position of the balancing weight is adjusted first, the pull rod 14 is pulled up, so that the first worm wheel 15 is matched with the first worm 3, and the balancing weight is adjusted by rotating the first worm wheel 15; after the balancing weight is adjusted, the pull rod 14 is pressed down, so that the second worm wheel 16 is matched with the second worm 4, and the position of the magnet is adjusted; in the present invention, it is to be noted that in the initial state, the second worm wheel 16 is engaged with the second worm 4, and the locked position of the tie rod 14 as described above is the initial position. The first worm wheel 15 and the second worm wheel 16 are symmetrically arranged as shown in fig. 3, and the design manner can facilitate the adjustment of two worms, and can facilitate the fixation of the pull rod 14, so that the stability of the equipment in the semiconductor equipment is also important to the influence on the process performance.
In the invention, the two ends of the second sliding rod 9 are respectively provided with a second supporting frame 12 for supporting and facilitating the sliding of the connecting block.
As described above, the lower cover plate 8 is provided with a plurality of magnets 5 around, the magnets are provided with slot-like structures 6 with two open ends, the two open ends are distributed along the circumferential direction of the lower cover plate, and by adopting the magnets and the distribution mode of the shape, higher magnetic field intensity can be obtained, and a magnetic field distribution with a balanced and consistent center and edge is obtained.
In some embodiments of the present invention, referring to fig. 5 and 6, the upper end of the rotating structure 18 extends to the upper end of the semiconductor coating apparatus, the rotating structure 18 is placed when adjustment is required, then the positions of the balancing weight and the magnet are adjusted, and the rotating structure 18 is taken out after the adjustment is completed, further preferably, a rotating part is arranged at the upper end of the rotating structure 18, so that the operation is convenient, the lower whole is driven to rotate by the rotating structure 18 (rotating rod), the rotating rod is removed after the operation, and a part of the lower half space is left on the upper surface of the target. The magnet assembly adjusting jig provided by the invention avoids the process of completely removing the magnet assembly from the equipment to adjust and then returning, can realize direct adjustment without the complicated process of removing the magnet assembly, saves trouble and labor, is convenient to adjust, can shorten the work completed in the previous two hours to be completed in 10 minutes, has an unobvious effect of saving time in one debugging, but can realize the ideal effect by multiple times of debugging.
The technical principle of the present invention has been described above in connection with specific embodiments, but is only the preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. Other embodiments of the invention will occur to those skilled in the art without the exercise of inventive effort and are intended to fall within the scope of the invention.
Claims (10)
1. The magnet assembly adjusting jig of the semiconductor coating equipment is characterized by comprising a counterweight assembly adjusting module, a worm gear module and a magnet position adjusting module; the semiconductor coating equipment comprises an upper cover plate and a lower cover plate, the magnet is positioned on the lower cover plate, the counterweight assembly adjusting module comprises a counterweight block, a first slide bar and a first worm, and the counterweight block slides on the first slide bar through the first worm; the magnet position adjusting module comprises a connecting block and a second worm, and the connecting block is in threaded fit with the second worm; the worm gear module drives the first worm and the second worm to rotate so as to respectively adjust the positions of the balancing weight and the lower cover plate; the connecting block is located on the upper cover plate and penetrates through the lower cover plate to be connected with the second worm, a gap is reserved between the connecting block and the lower cover plate, and the first worm and the second worm are respectively provided with a first supporting frame.
2. The tool of claim 1, wherein the magnet position adjustment module further comprises a second slide bar, the connection block comprising a first connection block and a second connection block, the second slide bar being located on the lower cover plate and slidably coupled to the first connection block.
3. The magnet assembly adjusting jig of a semiconductor coating apparatus according to claim 2, wherein two ends of the second connecting block are respectively provided with a first connecting block.
4. The magnet assembly adjusting jig of a semiconductor coating apparatus according to claim 1, wherein the two ends of the weight are respectively provided with a first slide bar.
5. The jig for adjusting a magnet assembly of a semiconductor coating apparatus according to claim 1, wherein the worm wheel module comprises a pull rod, and a first worm wheel and a second worm wheel which are arranged on the pull rod at intervals, wherein the first worm wheel is matched with the first worm, and the second worm wheel is matched with the second worm.
6. The jig for adjusting a magnet assembly of a semiconductor coating apparatus according to claim 5, wherein the lower end of the pull rod is movably connected with a fixing device, and the upper end is movably connected with a rotating structure.
7. The tool of claim 6, wherein a locking structure is provided at an upper end of the pull rod, and the rotating structure is locked with the locking structure.
8. The jig for adjusting a magnet assembly of a semiconductor coating apparatus according to claim 6, wherein the lower end of the fixing means is provided with a locking means locked with the lower end of the pull rod.
9. The magnet assembly adjusting jig of the semiconductor coating equipment according to claim 2, wherein two ends of the second sliding rod are respectively provided with a second supporting frame.
10. The jig for adjusting a magnet assembly of a semiconductor coating apparatus according to claim 1, wherein a plurality of magnets are provided around the lower cover plate, the magnets are provided with groove-like structures having both ends open, and both open ends are distributed along a circumferential direction of the lower cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311701114.4A CN117626204B (en) | 2023-12-12 | 2023-12-12 | Magnet assembly adjusting jig of semiconductor coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311701114.4A CN117626204B (en) | 2023-12-12 | 2023-12-12 | Magnet assembly adjusting jig of semiconductor coating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117626204A true CN117626204A (en) | 2024-03-01 |
| CN117626204B CN117626204B (en) | 2024-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311701114.4A Active CN117626204B (en) | 2023-12-12 | 2023-12-12 | Magnet assembly adjusting jig of semiconductor coating equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN117626204B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118516643A (en) * | 2024-05-29 | 2024-08-20 | 江苏兴启航新材料科技有限公司 | High-pressure magnetron sputtering equipment for silicon dioxide film |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100984784B1 (en) * | 2010-05-10 | 2010-10-04 | 한국기전(주) | Torque adjust apparatus for cable winding machine |
| CN113667951A (en) * | 2021-08-23 | 2021-11-19 | 杭州朗为科技有限公司 | Rotating cathode with adjustable end insulating magnetic field |
| CN115326620A (en) * | 2022-08-19 | 2022-11-11 | 胡秋兰 | Bearing fretting wear testing machine |
-
2023
- 2023-12-12 CN CN202311701114.4A patent/CN117626204B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100984784B1 (en) * | 2010-05-10 | 2010-10-04 | 한국기전(주) | Torque adjust apparatus for cable winding machine |
| CN113667951A (en) * | 2021-08-23 | 2021-11-19 | 杭州朗为科技有限公司 | Rotating cathode with adjustable end insulating magnetic field |
| CN115326620A (en) * | 2022-08-19 | 2022-11-11 | 胡秋兰 | Bearing fretting wear testing machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118516643A (en) * | 2024-05-29 | 2024-08-20 | 江苏兴启航新材料科技有限公司 | High-pressure magnetron sputtering equipment for silicon dioxide film |
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| CN117626204B (en) | 2024-07-23 |
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