CN117619774A - Silicon wafer collecting method - Google Patents

Abstract

The invention provides a silicon wafer collecting method, which comprises the following steps: conveying the silicon wafer to a blanking station by utilizing a first conveying line; sucking the silicon wafer from the blanking station by using a second conveying line, and conveying the silicon wafer to a wafer collecting station positioned at the side of the first conveying line by using the second conveying line, wherein the conveying direction of the second conveying line is perpendicular to the conveying direction of the first conveying line; and sucking the silicon wafer conveyed to the wafer collecting station by the second conveying line by using the first sucking disc component capable of lifting, and lowering the silicon wafer into a material box positioned below the wafer collecting station by using the first sucking disc component. Through the cooperation of the first conveying line, the second conveying line and the first sucker assembly, the silicon wafer collecting method can automatically collect the silicon wafers to be collected into the material box. The first sucker group is utilized to absorb the silicon wafer from the second conveying line and to lower the silicon wafer into the material box below the receiving station, so that the receiving efficiency can be effectively improved.

Description

Silicon wafer collecting method

Technical Field

The invention relates to the field of battery production, in particular to a silicon wafer collecting method.

Background

Before the silicon wafer is manufactured into the battery piece, the detection of the silicon wafer is firstly required to be completed, and then the classified collection of the silicon wafer is implemented according to the detection result.

The existing silicon wafer collecting mode is that the silicon wafer is reversed to the auxiliary conveying belts at the two sides by the reversing device, and the silicon wafer is conveyed into the material box through the auxiliary conveying belts to complete collecting. However, in the film collecting mode, the lifting of the reversing device may affect the conveying of the subsequent silicon wafers, so that the film collecting efficiency is reduced.

Disclosure of Invention

In order to solve the technical problems, the invention provides a silicon wafer collecting method, which adopts the following technical scheme:

a silicon wafer collecting method comprises the following steps:

conveying the silicon wafer to a blanking station by utilizing a first conveying line;

sucking the silicon wafer from the blanking station by using a second conveying line, and conveying the silicon wafer to a wafer collecting station positioned at the side of the first conveying line by using the second conveying line, wherein the conveying direction of the second conveying line is perpendicular to the conveying direction of the first conveying line;

and sucking the silicon wafer conveyed to the wafer collecting station by the second conveying line by using the first sucking disc component capable of lifting, and lowering the silicon wafer into a material box positioned below the wafer collecting station by using the first sucking disc component.

Through the cooperation of the first conveying line, the second conveying line and the first sucker assembly, the silicon wafer collecting method can automatically collect the silicon wafers to be collected into the material box, no clamping exists in the whole collecting process, and the silicon wafers can be continuously adsorbed by the second conveying line and discharged into the material box. In addition, when the second conveying line conveys the silicon wafer to the wafer collecting station, the first sucker group is utilized to suck the silicon wafer from the second conveying line and put the silicon wafer into the material box below the wafer collecting station, so that the problem of inertial movement of the silicon wafer in the blanking process can be effectively solved, and the silicon wafer can be ensured to smoothly enter the material box.

In some embodiments, the first chuck assembly is configured to blow down, and lowering the silicon wafer into a cassette located below the wafer receiving station using the first chuck assembly comprises: controlling the first sucker assembly to descend so that the silicon wafer sucked by the first sucker assembly is separated from the second conveying line and descends to a position close to a falling position of the material box; and controlling the first sucker assembly to release the silicon wafer and blow air towards the silicon wafer so that the silicon wafer falls into the material box.

The first suction cup assembly is configured to be capable of lifting in a vertical direction and capable of blowing downward. When the first sucker assembly descends, the silicon wafer can be adsorbed and pushed away from the second conveying line, in the process, under the adsorption of the first sucker assembly, when the silicon wafer is pushed away from the second conveying line, the speed of the silicon wafer in the direction of the second conveying line is instantaneously decelerated to zero, the silicon wafer can be rapidly and effectively decelerated along the second conveying line, and the situation that the silicon wafer cannot fall into a material box normally due to the influence of the speed is avoided; in addition, when the silicon wafer descends to the wafer falling position, the silicon wafer is blown towards the silicon wafer, so that the silicon wafer can overcome the influence of self gravity, the silicon wafer can be quickly pushed into the material box, and the wafer collecting efficiency is further improved.

In some embodiments, the second conveyor line comprises a first conveyor belt and a second conveyor belt arranged side by side, the first suction cup assembly comprises a first suction section arranged between the first conveyor belt and the second conveyor belt, and/or a second suction section arranged outside the first conveyor belt and the second conveyor belt; utilize liftable first sucking disc subassembly to absorb the silicon chip of being carried to receipts piece station department by the second transfer chain to utilize first sucking disc subassembly to descend the silicon chip to receive in the magazine of piece station below, include: controlling the first suction part and/or the second suction part to descend, so that the first suction part and/or the second suction part sucks the silicon wafer conveyed to the wafer collecting station by the first conveying belt and the second conveying belt, and drives the silicon wafer to descend to a wafer falling position close to the material box; and controlling the first suction part and/or the second suction part to release the silicon wafer and blow the silicon wafer to the silicon wafer so that the silicon wafer falls into the material box.

Through the cooperation of first conveyer belt and second conveyer belt, realized the stable absorption and the transportation to the silicon chip. The first sucking disc component is arranged to comprise a first sucking part arranged between the first conveying belt and the second conveying belt and/or a second sucking part arranged outside the first conveying belt and the second conveying belt, so that the first sucking disc component can smoothly extend downwards out of the first conveying belt and the second conveying belt to adsorb and push down the silicon wafer. In particular, when the first sucking disc component is arranged to comprise a first sucking part and a second sucking part, the sucking area of the first sucking disc component to the silicon wafer can be effectively increased, and the sucking stability of the first sucking disc component to the silicon wafer is ensured.

In some embodiments, the second conveyor line includes at least a pick-up section and a first delivery section, the pick-up section being disposed above the first conveyor line, the first delivery section being disposed on a first side of the first conveyor line, a feed end of the first delivery section being proximate to a first end of the pick-up section; the second transfer chain is utilized to draw the silicon chip from unloading station department to utilize the second transfer chain to carry the silicon chip to be located the receipts piece station of first transfer chain avris includes: sucking the silicon wafer from the blanking station by utilizing a pick-up subsection; conveying the silicon wafer to a feeding end of a first conveying part by utilizing a pick-up part, so that the first conveying part absorbs the silicon wafer; and conveying the silicon wafer to a first wafer collecting station positioned at the first side of the first conveying line by utilizing the first conveying subsection.

The second conveying line is arranged to comprise a pick-up subsection and a first conveying subsection, wherein the pick-up subsection is arranged above the first conveying line and is used for picking up silicon wafers from the first conveying line and transferring the picked silicon wafers to the second conveying line, and the second conveying line is used for conveying the silicon wafers to the position located at the first wafer collecting station. Due to the arrangement of the pick-up subsection and the first conveying subsection, when the distance requirements of the first film collecting station and the first conveying line are different, the length of the first conveying subsection is only required to be correspondingly adjusted, and the pick-up subsection is not required to be adjusted, so that the applicability of the film collecting method can be further improved.

In some embodiments, the second conveyor line further comprises a second conveyor section disposed on a second side of the first conveyor line, the feed end of the second conveyor section being proximate to the second end of the pick-up section; utilize the second transfer chain to follow unloading station and draw the silicon chip to utilize the second transfer chain to carry the silicon chip to be located the receipts piece station of first transfer chain avris still includes: conveying the silicon wafer to a feeding end of a second conveying part by utilizing the pick-up part, so that the second conveying part absorbs the silicon wafer; and conveying the silicon wafer to a second wafer collecting station positioned at the second side of the first conveying line by using a second conveying subsection.

Through setting up the second and carry the subsection for the second transfer chain can receive the piece to both sides with the silicon chip on the first transfer chain, makes the silicon chip receive in the magazine that is located first receipts piece station, second receipts piece station department.

In some embodiments, the wafer collecting method further comprises, before the second conveying line is used to suck the wafer from the blanking station: and controlling the second conveying line to descend towards the first conveying line and/or controlling the first conveying line to ascend towards the second conveying line so that the silicon wafer conveyed to the blanking station by the first conveying line is close to the second conveying line.

Before the second transfer chain absorbs the silicon chip from unloading station department, control second transfer chain decline towards first transfer chain to/or control first transfer chain rises towards the second transfer chain, can both reduce the distance between second transfer chain and the first transfer chain from the mode, make the second transfer chain can be close to the silicon chip more, reduce the adsorption stroke of second transfer chain, improved the adsorption efficiency of second transfer chain to the adsorption effect, the adsorption efficiency of silicon chip, thereby further improve receipts piece efficiency.

In some embodiments, the method further comprises, prior to drawing the silicon wafer from the blanking station using the second transfer line; and the silicon wafer jacking assembly is utilized to jack up the silicon wafer conveyed to the blanking station by the first conveying line, so that the silicon wafer is close to the second conveying line.

Before the second transfer chain absorbs the silicon chip from unloading station department, utilize the silicon chip jacking subassembly to upwards jack up the silicon chip on the first transfer chain, can reduce the distance between silicon chip and the second transfer chain, make the silicon chip can be more close the second transfer chain, improve the adsorption efficiency of second transfer chain to the silicon chip to further improve a receipts efficiency.

In some embodiments, the silicon wafer jacking assembly is a blowing assembly, and the lifting up of the silicon wafer conveyed to the blanking station by the first conveying line by using the silicon wafer jacking mechanism includes: and controlling the blowing assembly to blow upwards to lift the silicon wafer conveyed to the blanking station by the first conveying line upwards.

The realization mode of a silicon wafer jacking assembly is provided, the silicon wafer is blown up from the first conveying line by upward blowing, the distance between the silicon wafer and the second conveying line is shortened, the second conveying line can more conveniently and rapidly adsorb the silicon wafer, and therefore the wafer collecting efficiency is further improved.

In some embodiments, before the second transfer line is used to draw the silicon wafer from the blanking station, the method further comprises; and the second sucker assembly is utilized to suck up the silicon wafer conveyed to the blanking station by the first conveying line, so that the silicon wafer is close to the second conveying line.

Before the second transfer chain absorbs the silicon chip from unloading station department, utilize the second sucking disc subassembly can assist the second transfer chain upwards to absorb the silicon chip on the first transfer chain for the silicon chip can be adsorbed to the second transfer chain fast on, and continue the backward transport via the second transfer chain, improve receipts piece efficiency. In some embodiments, the second chuck assembly is configured to be liftable, and the second chuck assembly is utilized to upwardly suck the silicon wafer transported by the first transport line to the blanking station, such that the silicon wafer is adjacent to the second transport line comprising: controlling the second sucker assembly to descend, so that the second sucker assembly sucks the silicon wafer conveyed to the blanking station by the first conveying line; and controlling the second sucker assembly to rise so that the silicon wafer is separated from the first conveying line and is close to the second conveying line.

Through setting the second sucking disc subassembly to liftable, when adsorbing the silicon chip on the first conveying line, can make the second sucking disc subassembly descend earlier, be close the silicon chip fast and adsorb the silicon chip from the first conveying line, transfer the silicon chip to the second conveying line in-process that rises, continue to carry the silicon chip by the second conveying line. Transfer between the transfer chain is carried out to the silicon chip to the lift of utilizing the second sucking disc subassembly, can improve adsorption efficiency, can realize better adsorption efficiency again, can increase receipts piece efficiency.

In some embodiments, the silicon wafer collecting method further comprises: and stopping the silicon wafer by using a stopping baffle plate so that the silicon wafer falls into the material box, wherein the stopping baffle plate is arranged at the rear side edge of the material box.

Through the stop baffle, the silicon wafer is blocked when the silicon wafer is received, so that the silicon wafer can fall into the material box within an allowable error, and the uniformity of the silicon wafer in the material box after the silicon wafer is received is ensured.

Drawings

FIG. 1 is a general flow chart of a method for collecting silicon wafers in one embodiment of the invention;

FIG. 2 is a flowchart showing steps in a method for collecting a silicon wafer according to an embodiment of the present invention;

FIG. 3 is a flowchart showing steps in a method for collecting a silicon wafer according to an embodiment of the present invention;

FIG. 4 is a flowchart illustrating steps in a method for collecting a silicon wafer according to an embodiment of the present invention;

FIG. 5 is a flowchart showing steps in a method for collecting a silicon wafer according to an embodiment of the present invention;

FIG. 6 is a general flow chart of a method for collecting silicon wafers according to another embodiment of the present invention;

FIG. 7 is a schematic view of a first conveyor line, a second conveyor line, and a first chuck assembly according to an embodiment of the invention;

FIG. 8 is a schematic view of a second conveyor line and first chuck assembly in accordance with an embodiment of the invention;

FIG. 9 is a schematic view of a first conveyor line, a second conveyor line and a first chuck assembly according to another embodiment of the invention;

FIG. 10 is a schematic diagram showing the operation of the second conveyor line to pick up a silicon wafer in one embodiment of the present invention;

FIG. 11 is a schematic diagram showing the operation of the second conveyor line for picking up silicon wafers according to another embodiment of the present invention;

FIG. 12 is a schematic diagram showing the picking up of a silicon wafer by the second conveyor line according to still another embodiment of the present invention;

FIG. 13 is a schematic diagram showing the operation of a second conveyor line for picking up silicon wafers in accordance with yet another embodiment of the present invention;

FIG. 14 is an exploded view of the overall process of the wafer handling method of the present invention in one embodiment.

The following reference numerals are included in fig. 1 to 14:

a first conveyor line 1;

a second conveyor line 2:

pick-up section 21;

a first conveying section 22;

a second conveying section 23;

a first suction cup assembly 3;

a first suction section 31;

a second suction subsection 32;

a magazine 4;

a silicon wafer jacking assembly 5;

a second suction cup assembly 6;

and a stop plate 7.

Detailed Description

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.

The main problems of the existing silicon wafer collecting mode are as follows: when the discharging conveying line releases the silicon chip, the silicon chip continues to move forwards under the action of inertia, so that the silicon chip is difficult to accurately fall into the material box along the vertical direction, and even the silicon chip collides with the wall of the material box or falls out of the material box.

In view of the above, the invention provides a silicon wafer collecting method, which can effectively solve the problem of inertial motion of a silicon wafer in the blanking process and ensure that the silicon wafer smoothly enters a material box. The silicon wafer reclaiming method of the present invention will be exemplarily described by way of examples.

Fig. 1 is a flowchart of a silicon wafer collecting method according to an embodiment of the present invention, where the silicon wafer collecting method includes:

and 100, conveying the silicon wafer to a blanking station by using a first conveying line.

The first conveyor line here may be a main conveyor line of the silicon wafer production apparatus for outputting the sorted silicon wafers from the silicon wafer inspection apparatus (or for outputting the produced silicon wafers from the silicon wafer production apparatus) and for conveying them back to the blanking station. Optionally, the first conveying line comprises two conveying belts arranged side by side, and the silicon wafer is borne on the two conveying belts and is conveyed backwards under the drive of the conveying belts until being conveyed to the blanking station.

As known to those skilled in the art, before the silicon wafer is fabricated into a battery sheet, it is necessary to perform inspection on the silicon wafer and classify the silicon wafer according to the inspection result, and different kinds of silicon wafers are used to prepare different kinds of batteries. In order to reduce the workload of detecting and sorting the subsequent silicon wafers, generally, in the process of outputting the silicon wafers by the first conveying line, the silicon wafers can be sorted and collected into corresponding material boxes positioned at the side of the first conveying line according to the types of the silicon wafers.

In order to implement sorting and collecting the silicon wafers, optionally, a plurality of blanking stations are arranged on a conveying path of the first conveying line, and each blanking station is correspondingly used for completing collecting at least one corresponding type of silicon wafers.

And 300, sucking the silicon wafer from the blanking station by using a second conveying line, and conveying the silicon wafer to a wafer collecting station positioned at the side of the first conveying line by using the second conveying line, wherein the conveying direction of the second conveying line is perpendicular to the conveying direction of the first conveying line. In the prior art, a reversing belt reversing mode is utilized, and each time the reversing belt is required to be higher than the conveying surface of the first conveying line by lifting the reversing belt so as to realize the reversing and final sheet collecting of the silicon wafers. Each time of lifting and resetting of the reversing belt needs time, and in the lifting and resetting process, the conveying of the next silicon wafer on the first conveying line is affected, interference clamping is caused, and the wafer collecting efficiency is greatly affected. This application is at whole receipts piece in-process, utilizes the second transfer chain can adsorb the silicon chip from unloading station continuously and carry to receiving the piece station, at this in-process, can not appear any interference, can overcome the extravagant time of current switching-over receipts piece in-process entirely, has improved receipts piece efficiency greatly.

The second conveying line is a conveying line with adsorption performance, at least part of the second conveying line is positioned right above the blanking station, and the discharging end of the second conveying line extends to a sheet collecting station positioned at the side of the first conveying line. When the first conveying line conveys the silicon wafer to the blanking station, the second conveying line absorbs the silicon wafer, so that the silicon wafer is adsorbed on the lower surface of the second conveying line, and then the second conveying line conveys the silicon wafer to the wafer collecting station.

Alternatively, as shown in fig. 8, the second conveying line 2 includes a first conveying belt and a second conveying belt that are disposed side by side, and adsorption holes are disposed on both the first conveying belt and the second conveying belt. The two side parts of the silicon wafer are respectively adsorbed on the first conveyor belt and the second conveyor belt, and the middle part of the silicon wafer is exposed between the first conveyor belt and the second conveyor belt. After the first conveying belt and the second conveying belt adsorb the silicon wafers, the silicon wafers are conveyed towards the wafer collecting station.

Through all setting up the absorption hole on first conveyer belt and second conveyer belt, realize that second transfer chain 2 carries the absorption of silicon chip, this kind of design is simple, the cost is controllable, can accomplish the transfer of silicon chip from first transfer chain to second transfer chain fast, realizes the high-efficient receipts piece of silicon chip.

Alternatively, as shown in fig. 7, the second conveying line 2 is of a segmented structure, which includes a pick-up section 21 and a first conveying section 22, wherein the pick-up section 21 is disposed above the first conveying line 1, the first conveying section 22 is disposed at a first side of the first conveying line 1, and a feeding end of the first conveying section 22 is close to a first end of the pick-up section 21. In this case, as shown in fig. 2, step 300 includes the following sub-steps:

and a substep 301, sucking the silicon wafer from the blanking station by utilizing a pick-up subsection.

In the substep 302, the silicon wafer is transported to the feeding end of the first transporting section by using the pick-up section, so that the first transporting section sucks the silicon wafer.

In a substep 302, the silicon wafer is transported to a first wafer receiving station located at a first side of the first transport line by using a first transport section.

Because the distance between the first film collecting station and the first conveying line 1 may be adjusted according to the area limitation in different workshops, the length of the first conveying part 22 can be adaptively adjusted by adopting the mode of sectionally arranging the pickup part 21 and the first conveying part 22, for example, the first conveying part 22 with a corresponding length is replaced, and the film collecting of the silicon wafer can be completed without adjusting the pickup part 21. The silicon wafer on the first conveying line is conveyed in a sectional type, so that the silicon wafer collecting method can be more flexibly adapted to different scenes.

Optionally, as shown in fig. 9, the second conveyor line 2 further comprises a second conveyor section 23, the second conveyor section 23 being arranged at the second side of the first conveyor line 1, the feeding end of the second conveyor section 23 being adjacent to the second end of the pick-up section 21. In this case, as shown in fig. 3, the step 300 further includes the following sub-steps:

in a substep 302', the silicon wafer is transported to the feed end of the second transport section by means of the pick-up section, so that the second transport section sucks the silicon wafer.

Substep 303', transporting the silicon wafer using the second transport section to a second wafer receiving station located on a second side of the second transport line.

By additionally arranging the second conveying subsection 23, the second conveying line 2 can collect the silicon wafers on the first conveying line 1 towards two sides, so that the silicon wafers can be collected into the material box 4 positioned at the first collecting station and also can be collected into the material box 4 positioned at the second collecting station. Of course, in this case, the transport direction of the pick-up section 21 is bi-directional, which can transport the picked-up silicon wafer both in a first direction to the first transport section 22 and in a second direction opposite to the first direction to the second transport section 23.

Under the cooperation of pick-up subsection 21, first transport subsection 22 and second transport subsection 23, can receive the piece to the both sides of first transfer chain in a flexible way, when the magazine of first transfer chain one side is received full piece, can last to the magazine receipts piece of opposite side, avoid changing the magazine and lead to receiving the piece interruption, can further improve receipts piece efficiency.

Step 400, sucking the silicon wafer conveyed to the wafer collecting station by the second conveying line by using the first sucking disc component capable of lifting, and lowering the silicon wafer into a material box positioned below the wafer collecting station by using the first sucking disc component.

As shown in fig. 7, the first suction cup assembly 3 is installed above the film collecting station through a lifting bracket, the suction surface of the first suction cup assembly 3 is located at the lower end of the first suction cup assembly 3, and the lifting bracket is used for driving the first suction cup assembly 3 to lift in the vertical direction.

In the initial state, the suction surface of the first suction cup assembly 3 is slightly higher than or flush with the lower surface of the second conveying line 2. When the second conveying line 2 conveys the silicon wafer to the wafer collecting station, the lifting support drives the first sucker assembly 3 to descend, the first sucker assembly 3 adsorbs the silicon wafer and pushes the silicon wafer down to a wafer falling position close to the material box 4, and then the first sucker assembly 3 releases the silicon wafer so that the silicon wafer falls into the material box 4.

It can be seen that when the silicon wafer is conveyed to the position above the wafer falling position by the second conveying line 2, the silicon wafer is absorbed by the first sucker assembly 3 and pushed down to the wafer falling position by the first sucker assembly 3. Under the absorption of the first sucker component 3, when the silicon wafer is pushed away from the second conveying line 2, the speed of the silicon wafer in the direction of the second conveying line 2 is instantaneously decelerated to zero, so that the movement of the silicon wafer along the second conveying line 2 can be quickly and effectively slowed down, the situation that the silicon wafer cannot normally fall into a material box due to the influence of the speed is avoided, and the silicon wafer is ensured to smoothly enter the material box 4.

As shown in fig. 9, when the second conveyor line 2 is provided in a segmented structure including the pick-up section 21, the first conveyor section 22 and the third conveyor section 23, each of the first conveyor section 22 and the third conveyor section 23 is provided with one of the first suction cup assemblies 3.

Optionally, the first chuck assembly 3 is configured to blow downwards, for example, a high-pressure air tap with a downward blowing port is arranged on the first chuck assembly 3. In this case, as shown in fig. 4, the step 400 of lowering the silicon wafer into the magazine located below the wafer receiving station by using the first chuck assembly specifically includes the following sub-steps:

and a substep 401 of controlling the first sucker assembly to descend so that the silicon wafer sucked by the first sucker assembly is separated from the second conveying line and descends to a position close to the falling position of the material box.

Step 402, controlling the first sucker assembly to release the silicon wafer and blowing air towards the silicon wafer so that the silicon wafer falls into the material box.

When the first sucker component 3 releases the silicon wafer for feeding, the silicon wafer is blown towards the silicon wafer, so that the silicon wafer can overcome the influence of gravity of the silicon wafer, the time for the silicon wafer to enter the material box is accelerated, and the wafer collecting efficiency is further improved.

As shown in fig. 8, the second conveyor line 2 includes a first conveyor belt and a second conveyor belt arranged side by side.

In order to enable the first sucker assembly 3 to smoothly extend downwards from the first conveyor belt and the second conveyor belt when descending, so as to absorb and push down the silicon wafer. Optionally, the first suction cup assembly 3 comprises a first suction subsection 31 arranged between the first conveyor belt and the second conveyor belt, and/or a second suction subsection 32 arranged outside the first conveyor belt and the second conveyor belt. The first suction section 31 and the second suction section 32 are each configured to be able to blow down.

As shown in fig. 5, step 400 includes the sub-steps of:

in the substep 401', the first suction part and/or the second suction part are controlled to descend, so that the first suction part and/or the second suction part sucks the silicon wafer conveyed to the wafer receiving station by the first conveying belt and the second conveying belt, and drives the silicon wafer to descend to a wafer falling position close to the material box.

Substep 402' controls the first suction sub-section and/or the second suction sub-section to release the silicon wafer and blow the gas towards the silicon wafer so that the silicon wafer falls into the cassette.

In order to reduce the cost of the suction cup assembly, only the first suction part 31 or only the second suction part 32 may be provided, wherein the first suction part 31 sucks the middle part of the silicon wafer exposed from the first conveyor belt and the second conveyor belt, and the second suction part 32 sucks the side parts of the silicon wafer extending from the first conveyor belt and the second conveyor belt from two sides.

Of course, if the first suction part 31 and the second suction part 32 are simultaneously arranged, the suction area of the first suction cup assembly 3 to the silicon wafer can be effectively increased, so that the suction stability of the first suction cup assembly 3 to the silicon wafer is improved.

In actual operation, the silicon wafer can be flexibly selected according to different wafer collecting conditions, for example, when the silicon wafer to be collected is a small-sized silicon wafer, a half silicon wafer, a third silicon wafer and other wafer bodies, the adsorption of the silicon wafer can be completed by using the first suction subsection 31; when the silicon wafers to be collected are large-size silicon wafers, any one of the three modes can be selected by combining the distance between the first conveying belt and the second conveying belt, so that the silicon wafers are adsorbed.

The first chuck assembly 3 generally adopts an electromagnetic adsorption or vacuum adsorption mode. In order to prevent the first chuck assembly 3 from being failed in adsorption or delayed in pushing down, the silicon wafer pushed away from the second conveying line 2 cannot fall into the material box 4. Optionally, as shown in fig. 7, before the silicon wafer falls into the magazine, the silicon wafer is stopped, and a stopper plate 7 is provided at the rear edge of the magazine 4. The stop plate 7 can block and stop the silicon wafer, so that the silicon wafer can fall into the material box 4 even if the first sucker assembly 3 fails in adsorption or pushes down to delay.

Because there is a certain interval between the second conveyor line 2 and the first conveyor line 1, the second conveyor line 2 only depends on its own adsorption force, and a large negative pressure may be required to pick up silicon wafers from the first conveyor line 1. In order to solve this problem, the present invention adopts the following several alternative solutions.

The first solution is:

as shown in fig. 10, the first conveyor line 1 and/or the second conveyor line 2 are provided to be liftable.

For this solution, as shown in fig. 6, between step 100 and step 300 further includes:

step 200a, controlling the second conveying line to descend towards the first conveying line and/or controlling the first conveying line to ascend towards the second conveying line, so that the silicon wafer conveyed to the blanking station by the first conveying line is close to the second conveying line.

Therefore, the distance between the second conveying line and the first conveying line can be reduced from different modes, the second conveying line can be closer to the silicon wafer, the adsorption stroke of the second conveying line is reduced, the adsorption effect and adsorption efficiency of the second conveying line on the silicon wafer are improved, and the film collecting efficiency is further improved. Of course, if the second conveyor line 2 is provided in a segmented configuration as described above, it is only necessary to provide the pick-up section 21 to be liftable.

The second solution is:

as shown in fig. 11, a jacking assembly 5 is provided below the first conveyor line 1.

For this solution, as shown in fig. 6, between step 100 and step 300 further includes:

and 200b, lifting the silicon wafer conveyed to the blanking station by the first conveying line upwards by utilizing the silicon wafer lifting assembly, so that the silicon wafer is close to the second conveying line.

Therefore, the distance between the silicon chip and the second conveying line can be reduced, the silicon chip can be more close to the second conveying line, the adsorption effect and adsorption efficiency of the second conveying line on the silicon chip are improved, and the chip collecting efficiency is further improved.

Optionally, the silicon wafer jacking component 5 is an air blowing component, and the air blowing component is controlled to blow upwards, so that the silicon wafer conveyed to the blanking station by the first conveying line 1 can be jacked upwards.

So, blow up the silicon chip from first transfer chain, reduce the distance between silicon chip and the second transfer chain, make the second transfer chain can more convenient quick realization to the absorption of silicon chip to further improve a receipts efficiency.

Third solution:

as shown in fig. 12, a second suction cup assembly 6 is disposed on the second conveying line, and the second suction cup assembly 6 is located above the blanking station.

For this solution, as shown in fig. 6, between step 100 and step 300 further includes:

and 200c, utilizing the second sucker assembly to upwards suck the silicon wafer conveyed to the blanking station by the first conveying line, so that the silicon wafer is close to the second conveying line.

Utilize the second sucking disc subassembly can assist the second transfer chain upwards to absorb the silicon chip on the first transfer chain for the silicon chip can be adsorbed to the second on the transfer chain fast, and continue the backward transport via the second transfer chain, improve receipts piece efficiency. Alternatively, as shown in fig. 13, the second suction cup assembly 6 is provided to be liftable. In the initial state, the adsorption surface at the lower end of the second sucker assembly 6 is in an avoidance high position. When the first conveying line 1 conveys the silicon wafer to the blanking station, the second sucker assembly 6 descends and adsorbs the silicon wafer. The second chuck assembly 6 is then raised to rest so that the wafer is moved towards and finally sucked by the second conveyor line 3.

Transfer between the transfer chain is carried out to the silicon chip to the lift of utilizing second sucking disc subassembly 6, can improve adsorption efficiency, can realize better adsorption efficiency again, can increase receipts piece efficiency.

When the first conveyor line 1 is arranged to comprise two conveyor belts arranged side by side. The second suction cup assembly 6 may also be of a split construction similar to the first suction cup assembly 3 described above, i.e. the second suction cup assembly 6 comprises a first suction section arranged in the middle of the two conveyor belts and/or a second suction section arranged outside the two conveyor belts. Therefore, when the second sucker assembly 6 descends, the second sucker assembly can downwards extend out of the lower surface of the first conveying line 1, so that the suction of the silicon wafer can be implemented.

In order to make the implementation process of the silicon wafer collecting method of the present invention more clearly understood by those skilled in the art, hereinafter, a detailed implementation process of the silicon wafer collecting method according to an embodiment of the present invention will be described with reference to fig. 14:

first, as shown in fig. 14 (a), the silicon wafer 100 is transported to a blanking station by the first transport line 1.

Next, as shown in fig. 14 (b), the second chuck assembly 6 descends and adsorbs the silicon wafer 100, and then drives the silicon wafer 100 to ascend, so that the pick-up section 21 of the second transfer line adsorbs the silicon wafer 100.

Next, as shown in fig. 14 (c), the pickup section 21 of the second transfer line transfers the silicon wafer 100 toward the first transfer section 22 of the second transfer line until the silicon wafer 100 is sucked by the first transfer section 22.

Next, as shown in fig. 14 (d), the second transfer line transfers the silicon wafer back to the wafer receiving station.

Next, as shown in fig. 14 (e), the first chuck assembly 3 descends and adsorbs the silicon wafer 100, and then pushes the silicon wafer 100 downward away from the first transporting section 22 until the silicon wafer 100 descends to a wafer-dropping position near the magazine 4.

Finally, as shown in fig. 14 (f) to 14 (g), the first chuck assembly 3 releases the silicon wafer 100 and blows the silicon wafer 100 downward, so that the silicon wafer 100 falls into the magazine 4 in the vertical direction.

The invention has been described above in sufficient detail with a certain degree of particularity. It will be appreciated by those of ordinary skill in the art that the descriptions of the embodiments are merely exemplary and that all changes that come within the true spirit and scope of the invention are desired to be protected. The scope of the invention is indicated by the appended claims rather than by the foregoing description of the embodiments. Moreover, the embodiments mentioned in this application are not limited to single implementations, and some embodiments can also be implemented in combination.

Claims (11)

1. The silicon wafer collecting method is characterized by comprising the following steps of:

conveying the silicon wafer to a blanking station by utilizing a first conveying line;

sucking the silicon wafer from the blanking station by using a second conveying line, and conveying the silicon wafer to a wafer collecting station positioned at the side of the first conveying line by using the second conveying line, wherein the conveying direction of the second conveying line is perpendicular to the conveying direction of the first conveying line;

and sucking the silicon wafer conveyed to the wafer collecting station by the second conveying line by using a first sucking disc component capable of lifting, and lowering the silicon wafer into a material box positioned below the wafer collecting station by using the first sucking disc component.

2. The method of claim 1, wherein the first chuck assembly is configured to blow down, and wherein lowering the silicon wafer into a cassette located below the wafer receiving station with the first chuck assembly comprises:

controlling the first sucker assembly to descend so that the silicon wafer sucked by the first sucker assembly is separated from the second conveying line and descends to a position close to a falling piece position of the material box;

and controlling the first sucker assembly to release the silicon wafer and blow air towards the silicon wafer so as to enable the silicon wafer to fall into the material box.

3. A silicon wafer collecting method according to claim 1, wherein the second conveying line comprises a first conveying belt and a second conveying belt which are arranged side by side, the first sucker assembly comprises a first suction subsection arranged between the first conveying belt and the second conveying belt, and/or a second suction subsection arranged outside the first conveying belt and the second conveying belt;

the first sucking disc subassembly that utilizes the liftable is absorbed by the second transfer chain is carried to receive the silicon chip of piece station department, and utilize first sucking disc subassembly will the silicon chip is transferred to receive in the magazine of piece station below, include:

controlling the first suction part and/or the second suction part to descend, so that the first suction part and/or the second suction part sucks the silicon wafer conveyed to the wafer collecting station by the first conveying belt and the second conveying belt, and driving the silicon wafer to descend to a wafer falling position close to the material box;

and controlling the first suction part and/or the second suction part to release the silicon wafer and blow the silicon wafer to the silicon wafer so that the silicon wafer falls into the material box.

4. The method of claim 1, wherein the second conveyor line comprises at least a pick-up section and a first conveyor section, the pick-up section being disposed above the first conveyor line, the first conveyor section being disposed on a first side of the first conveyor line, a feed end of the first conveyor section being proximate to a first end of the pick-up section;

the second conveying line is used for sucking the silicon wafer from the blanking station, and the second conveying line is used for conveying the silicon wafer to the wafer collecting station positioned at the side of the first conveying line, and the process comprises the following steps:

sucking a silicon wafer from the blanking station by utilizing the pick-up subsection;

conveying the silicon wafer to a feeding end of the first conveying subsection by utilizing the pick-up subsection, so that the first conveying subsection absorbs the silicon wafer;

and conveying the silicon wafer to a first wafer collecting station positioned at the first side of the first conveying line by utilizing the first conveying subsection.

5. The method of collecting silicon wafers as set forth in claim 4 wherein said second conveyor line further comprises a second conveyor section disposed on a second side of said first conveyor line, a feed end of said second conveyor section being adjacent to a second end of said pick-up section;

the second conveying line is used for sucking the silicon wafer from the blanking station, and the second conveying line is used for conveying the silicon wafer to the wafer collecting station positioned at the side of the first conveying line, and the method further comprises the following steps:

conveying the silicon wafer to a feeding end of the second conveying subsection by utilizing the pick-up subsection, so that the second conveying subsection absorbs the silicon wafer;

and conveying the silicon wafer to a second wafer collecting station positioned at the second side of the first conveying line by utilizing the second conveying subsection.

6. The method of claim 1, wherein prior to the drawing the silicon wafer from the blanking station by the second conveyor line, the method further comprises:

and controlling the second conveying line to descend towards the first conveying line and/or controlling the first conveying line to ascend towards the second conveying line, so that the silicon wafer conveyed to the blanking station by the first conveying line is close to the second conveying line.

7. The method of collecting silicon wafers according to claim 1, wherein before the second transfer line is used to suck the silicon wafers from the blanking station, the method further comprises;

and (3) upwards jacking the silicon wafer conveyed to the blanking station by the first conveying line by utilizing the silicon wafer jacking assembly, so that the silicon wafer is close to the second conveying line.

8. The method of claim 7, wherein the silicon wafer lifting assembly is a blowing assembly, and the lifting up the silicon wafer conveyed to the blanking station by the first conveying line by using a silicon wafer lifting mechanism comprises:

and controlling the air blowing assembly to blow upwards so as to lift up the silicon wafer conveyed to the blanking station by the first conveying line.

9. The method of collecting silicon wafers according to claim 1, wherein the method further comprises, before the second transfer line is used to suck the silicon wafers from the blanking station;

and the second sucker assembly is utilized to suck up the silicon wafer conveyed to the blanking station by the first conveying line, so that the silicon wafer is close to the second conveying line.

10. The method of collecting silicon wafers as set forth in claim 9 wherein the second chuck assembly is configured to be liftable, the sucking up the silicon wafers transported by the first transport line to the blanking station with the second chuck assembly, bringing the silicon wafers close to the second transport line includes:

controlling the second sucker assembly to descend, so that the second sucker assembly sucks the silicon wafer conveyed to the blanking station by the first conveying line;

and controlling the second sucker assembly to rise so that the silicon wafer is separated from the first conveying line and is close to the second conveying line.

11. The method for collecting silicon wafers according to claim 1, further comprising:

and stopping the silicon wafer by using a stopping baffle plate so that the silicon wafer falls into the material box, wherein the stopping baffle plate is arranged at the rear side edge of the material box.